server

Abstract

The present application relates to a kind of servers, it includes a housing, a mainboard component, a graphic card component and a manifold group.The housing includes a bottom plate and two side plates.Two side plates are vertically arranged on the opposite sides of bottom plate.The bottom plate and two side plates jointly form a containing space.The mainboard component is located in the containing space.The graphic card component is located in the containing space.The graphic card component is electrically connected to the mainboard component.The manifold group is between the mainboard component and the bottom plate.The manifold group is arranged on the side of graphic card component close to the mainboard component.The manifold group is connected to the mainboard component and the graphic card component.The distance between the mainboard component and the bottom plate is greater than the distance between the graphic card component and the bottom plate.

Description

Technical Field

[0001] This invention relates to a server, and more particularly to a server with a manifold. Background Technology

[0002] Generally, servers are equipped with multiple fans to dissipate heat from the electronic components inside. As the heat generated by these components gradually increases, existing air-cooling systems are no longer efficient enough. Therefore, servers typically use a combination of air-cooling and water-cooling systems to improve heat dissipation efficiency.

[0003] However, to simultaneously dissipate heat from electronic components located in different parts of the server, the server typically requires multiple manifolds to connect various water cooling lines, thus occupying excessive space within the server. Therefore, how to further improve heat dissipation efficiency without taking up too much space within the server is the problem that researchers want to solve. Summary of the Invention

[0004] This invention provides a server that further improves heat dissipation efficiency while minimizing the space occupied by the manifold within the server.

[0005] An embodiment of the present invention discloses a server comprising a housing, a motherboard assembly, a graphics card assembly, and a manifold assembly. The housing includes a base plate and two side plates. The two side plates are vertically disposed on opposite sides of the base plate. The base plate and the two side plates together form an accommodating space. The motherboard assembly is located within the accommodating space. The graphics card assembly is located within the accommodating space. The graphics card assembly is electrically connected to the motherboard assembly. The manifold assembly is located between the motherboard assembly and the base plate. The manifold assembly is disposed on the side of the graphics card assembly closer to the motherboard assembly. The manifold assembly is connected to the motherboard assembly and the graphics card assembly. The distance between the motherboard assembly and the base plate is greater than the distance between the graphics card assembly and the base plate.

[0006] According to the server in the above embodiment, since the manifold assembly is located between the motherboard assembly and the base plate, and is set on the side of the graphics card assembly closer to the motherboard assembly, the manifold assembly can be connected to both the motherboard assembly and the graphics card assembly at the same time. This allows the server to further improve heat dissipation efficiency without the need to set up other manifold assemblies, thereby not occupying too much space in the server.

[0007] The above description of the invention and the following description of the embodiments are used to demonstrate and explain the principles of the invention, and to provide a further explanation of the claims of the invention. Attached Figure Description

[0008] Figure 1 This is a 3D schematic diagram of the server.

[0009] Figure 2 for Figure 1A cross-sectional schematic diagram.

[0010] Figure 3 for Figure 1 A schematic diagram of the top cross-section.

[0011] Figure 4 for Figure 1 A front view diagram.

[0012] Figure 5 for Figure 1 A cross-sectional view of another form.

[0013] Explanation of reference numerals in the attached figures: 10: Server 110: Base Plate 120: Side panel; 200: Mainboard assembly 210: Motherboard; 220: Memory module 230: Processor; 240: Thermal conductive component 300: Graphics card component 310: Graphics card 320: Graphics card liquid cooling connector; 400: Manifold assembly 410: Horizontal piping section; 420: Vertical piping section 430: Manifold liquid cooling connector; 440: Liquid inlet pipe 450: Discharge tube; 500: Exchange plate 600: Adapter card; 700: Power supply 800: Busbar assembly 810: Busbar 820: First distribution board; 830: Second distribution board 840: Support column; 900: Fan 1000: Support frame; 1100: Functional component 1110: Hard disk assembly; 1120: Input / output panel D1, D2: Direction; E1, E2, E3, E4: Side F1: Face; G1, G2: Distance P1: End S1: Storage space Detailed Implementation

[0014] Please see Figure 1 and Figure 2 . Figure 1 This is a 3D schematic diagram of the server. Figure 2 for Figure 1 A cross-sectional schematic diagram.

[0015] The server 10 of this embodiment includes a housing 100, a motherboard assembly 200, a graphics card assembly 300, and a manifold assembly 400. The housing 100 includes a base plate 110 and two side plates 120. The two side plates 120 are vertically disposed on opposite sides of the base plate 110. The base plate 110 and the two side plates 120 together form an accommodating space S1. The motherboard assembly 200 is located in the accommodating space S1. The graphics card assembly 300 is located in the accommodating space S1. The graphics card assembly 300 is electrically connected to the motherboard assembly 200. The manifold assembly 400 is located between the motherboard assembly 200 and the base plate 110. The manifold assembly 400 is disposed on the side E1 of the graphics card assembly 300 closest to the motherboard assembly 200. The manifold assembly 400 is connected to both the motherboard assembly 200 and the graphics card assembly 300. The distance G1 between the motherboard assembly 200 and the base plate 110 is greater than the distance G2 between the graphics card assembly 300 and the base plate 110.

[0016] Please refer to the following: Figure 2 and Figure 3 . Figure 3 for Figure 1 A schematic diagram of the top cross-section.

[0017] In this embodiment, the motherboard assembly 200 may include a motherboard 210, multiple memory modules 220, two processors 230, and two heat-conducting components 240. The multiple memory modules 220 and the two processors 230 are respectively disposed and electrically connected to the motherboard 210, and the two heat-conducting components 240 are thermally coupled to the two processors 230 respectively. In this way, the heat generated by the two processors 230 can be carried away from the two processors 230 by the cooling liquid flowing through the two heat-conducting components 240.

[0018] In this embodiment, the graphics card assembly 300 may include a graphics card 310 and two graphics card liquid cooling connectors 320. The two graphics card liquid cooling connectors 320 are disposed on the graphics card 310. In this way, the heat generated by the graphics card 310 can be carried away from the graphics card 310 by the cooling liquid in the two graphics card liquid cooling connectors 320.

[0019] In this embodiment, the manifold assembly 400 may include a horizontal pipe section 410, two vertical pipe sections 420, and a plurality of manifold liquid cooling connectors 430. The two vertical pipe sections 420 are horizontally arranged side-by-side and connected to opposite ends P1 of the horizontal pipe section 410. The plurality of manifold liquid cooling connectors 430 are disposed on the side F1 of the horizontal pipe section 410 facing away from the base plate 110. Two graphics card liquid cooling connectors 320 may be mounted on the plurality of manifold liquid cooling connectors 430 and connected to each other, and two heat-conducting elements 240 may be connected to the two vertical pipe sections 420. The plurality of manifold liquid cooling connectors 430 may be, for example, but not limited to, blind-plug quick-connect couplings.

[0020] In this embodiment, the manifold assembly 400 may further include a plurality of inlet pipes 440 and a plurality of outlet pipes 450. Each of the plurality of inlet pipes 440 and outlet pipes 450 is connected to two vertical pipe sections 420. The number of each of the plurality of inlet pipes 440 and outlet pipes 450 is, for example, but not limited to, two, and the connectors for connecting the plurality of inlet pipes 440 and outlet pipes 450 to an external heat dissipation device (not shown) may be blind-plug quick-connect couplings or hand-plug quick-connect couplings.

[0021] In this way, the coolant absorbed from the heat generated by the two processors 230 and the graphics card 310 can flow through the two heat-conducting components 240 and the multiple manifold liquid cooling connectors 430 to the two vertical pipe sections 420 and the horizontal pipe section 410 respectively. Then, the coolant can be guided to the heat dissipation device outside the server 10 through the multiple inlet pipes 440 and the multiple outlet pipes 450 for heat dissipation.

[0022] In this embodiment, the server 10 may further include a switching board 500. The switching board 500 may be located between the base plate 110 and the graphics card assembly 300. The switching board 500 may be connected to the manifold assembly 400. In this way, the heat generated by the switching board 500 can be carried away from the switching board 500 by the cooling fluid in the manifold assembly 400. In addition, the switching board 500 may also be electrically connected to multiple graphics card assemblies 300. In this way, the switching board 500 can provide interconnection for multiple graphics card assemblies 300, thereby optimizing the efficiency of data exchange between the multiple graphics card assemblies 300.

[0023] In this embodiment, the server 10 may further include an adapter card 600. The adapter card 600 is electrically connected to the side E2 of the graphics card assembly 300 away from the base plate 110 and to the motherboard assembly 200. The number of adapter cards 600 corresponds to the number of graphics card assemblies 300. In this way, the adapter cards 600 and the motherboard assembly 200 can be located at similar horizontal positions, minimizing the signal line length between them and thus minimizing signal loss between the graphics card assembly 300 and the motherboard assembly 200.

[0024] In this embodiment, the server 10 may further include a plurality of power supplies 700 and a bus assembly 800. The plurality of power supplies 700 may be located between the base plate 110 and the motherboard assembly 200. The bus assembly 800 may include a bus 810, a plurality of first power distribution boards 820, a second power distribution board 830, and a plurality of support pillars 840. The bus 810 is located between the base plate 110 and the motherboard assembly 200, and between the manifold assembly 400 and the plurality of power supplies 700. The plurality of first power distribution boards 820 are electrically connected to the bus 810 and the plurality of power supplies 700. The number of the plurality of first power distribution boards 820 may be, for example, but is not limited to, two. The second power distribution board 830 is electrically connected to the side E3 of the bus 810 away from the plurality of first power distribution boards 820, and is electrically connected to the motherboard assembly 200 and the graphics card assembly 300. The plurality of support pillars 840 are disposed between the plurality of first power distribution boards 820.

[0025] In this way, the power generated by the multiple power supplies 700 can be effectively distributed to the motherboard assembly 200 and the graphics card assembly 300 via the bus assembly 800 without the need for additional cables, thereby reducing the loss that may be caused by cable transmission and making the connection between the bus assembly 800 and the motherboard assembly 200 and the graphics card assembly 300 more stable.

[0026] The number of power supplies 700 is, for example, but not limited to, six. In other embodiments, the power supplies 700 may also be electrically connected directly to the motherboard assembly 200 and the graphics card assembly 300 without going through the bus assembly 800.

[0027] In this embodiment, the server 10 may further include a plurality of fans 900. The plurality of fans 900 are located in the accommodating space S1. The plurality of fans 900 are positioned on the side E4 of the motherboard assembly 200 away from the graphics card assembly 300, and generate a cooling airflow flowing in the direction D1. In this way, the server 10 can increase its additional air-cooling efficiency through the plurality of fans 900. The number of the plurality of fans 900 is, for example, but not limited to, five.

[0028] Please see Figure 4 and Figure 5 . Figure 4 for Figure 1 A front view diagram. Figure 5 for Figure 1 A cross-sectional view of another form.

[0029] In this embodiment, the server 10 may further include a support frame 1000 and a functional component 1100. The support frame 1000 is rotatably located on the side of the accommodating space S1 away from the base plate 110. The functional component 1100 may be disposed on the support frame 1000. In this way, when the support frame 1000 rotates in direction D2, the user can more easily replace the graphics card component 300 located below the support frame 1000.

[0030] In this embodiment, the functional component 1100 may include a plurality of hard disk groups 1110 and an input / output panel 1120. The plurality of hard disk groups 1110 and the input / output panel 1120 are arranged side by side.

[0031] In this embodiment, the number of graphics card components 300 is, for example, sixteen, and the number of multiple hard disk groups 1110 is, for example, six, but it is not limited to this, and the number of graphics card components 300 and multiple hard disk groups 1110 may also be other.

[0032] According to the server in the above embodiment, since the manifold assembly is located between the motherboard assembly and the base plate, and is set on the side of the graphics card assembly closer to the motherboard assembly, the manifold assembly can be connected to both the motherboard assembly and the graphics card assembly at the same time. This allows the server to further improve heat dissipation efficiency without the need to set up other manifold assemblies, thereby not occupying too much space in the server.

[0033] Furthermore, since the coolant absorbed from the heat generated by the two processors and the graphics card can be guided to the outside of the server through the manifold for heat dissipation, the server's heat dissipation efficiency can be further improved.

[0034] Although the present invention has been disclosed above with reference to the foregoing embodiments, it is not intended to limit the present invention. Those skilled in the art can make appropriate modifications and variations without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention should be determined by the appended claims.

Claims

1. A server, characterized in that, include: A housing includes a bottom plate and two side plates, the two side plates being vertically disposed on opposite sides of the bottom plate, and the bottom plate and the two side plates together forming an accommodating space; A motherboard assembly is located within the accommodating space; A graphics card assembly, located within the accommodating space, is electrically connected to the motherboard assembly; and A manifold assembly is located between the motherboard assembly and the base plate. The manifold assembly is disposed on the side of the graphics card assembly closer to the motherboard assembly, and the manifold assembly is connected to the motherboard assembly and the graphics card assembly. The distance between the motherboard assembly and the base plate is greater than the distance between the graphics card assembly and the base plate.

2. The server as described in claim 1, characterized in that, The graphics card assembly includes a graphics card and two graphics card liquid cooling connectors, the two graphics card liquid cooling connectors being disposed on the graphics card, and the manifold assembly including: A horizontal piping section; Two vertical pipe sections, the two vertical pipe sections being horizontally arranged side by side and connected to opposite ends of the horizontal pipe sections; and At least two manifold liquid cooling joints are provided on the side of the horizontal pipe section facing away from the base plate; The two graphics card liquid cooling connectors are installed on the at least two manifold liquid cooling connectors and are interconnected.

3. The server as described in claim 1, characterized in that, The system further includes a switching board located between the base plate and the graphics card assembly, and the switching board is connected to the manifold assembly and electrically connected to the graphics card assembly.

4. The server as described in claim 1, characterized in that, The system further includes an adapter card electrically connected to the side of the graphics card assembly away from the base plate and the motherboard assembly, wherein the number of adapter cards corresponds to the number of graphics card assemblies.

5. The server as described in claim 1, characterized in that, It further includes a plurality of power supplies located between the base plate and the motherboard assembly, and the plurality of power supplies are electrically connected to the motherboard assembly and the graphics card assembly.

6. The server as described in claim 5, characterized in that, The system further includes a bus assembly, the bus assembly comprising: A bus, the bus being located between the base plate and the motherboard assembly, and between the manifold assembly and the plurality of power supplies; At least one first distribution board, the at least one first distribution board being electrically connected to the busbar and the plurality of power supplies; and A second power distribution board is electrically connected to the side of the busbar away from the at least one first power distribution board, and is electrically connected to the motherboard assembly and the graphics card assembly.

7. The server as described in claim 6, characterized in that, The busbar assembly further includes a plurality of support columns, and the number of the at least one first distribution board is two, with the plurality of support columns disposed between the at least one first distribution board.

8. The server as described in claim 1, characterized in that, It further includes a support frame and a functional component, the support frame being rotatably located in the accommodating space, and the functional component being disposed on the support frame.

9. The server as described in claim 8, characterized in that, The functional components include multiple hard disk groups and an input / output panel, wherein the multiple hard disk groups and the input / output panel are arranged side by side.

10. The server as described in claim 1, characterized in that, It further includes a plurality of fans located within the accommodating space, and the plurality of fans are positioned on the side of the motherboard assembly away from the graphics card assembly.

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