Dither injection circuit for chip high-speed interface, dither injection method, chip and test system thereof
By designing a combination of multi-level buffer units and switching elements inside the chip, a low-cost and easily integrated jitter injection circuit is realized, which solves the problems of high cost and limited flexibility in existing jitter tolerance testing, improves testing efficiency and reliability, and is suitable for fine stress testing of high-speed chip interfaces.
Patent Information
- Application Number
- CN202610963732.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-06-30
- Publication Date
- 2026-08-04
- Estimated Expiration
- 2046-06-30
AI Technical Summary
In existing technologies, jitter tolerance testing of high-speed chip interface systems relies on external equipment, which is costly and has limited flexibility and accuracy. It is difficult to achieve on-chip self-testing and large-scale mass production testing, and it lacks a programmable jitter injection structure, which cannot meet the needs of refined stress testing.
Design a simple on-chip controllable jitter injection circuit. By combining multi-level buffer units and switching elements, a synchronous control signal is generated by the control unit to switch the on and off combinations of the switching elements, thereby realizing multi-level programmable jitter adjustment and forming clock signal edge time distributions with different jitter amplitudes.
It achieves low-cost, easy-to-integrate jitter injection, can precisely adjust the jitter amplitude, adapt to flexible configurations for different testing scenarios, improves testing efficiency and reliability, reduces dependence on external instruments, and is suitable for large-scale mass production testing.