Semiconductor package thermal compression structure based on dynamic thermal compensation

Abstract

The application relates to the technical field of semiconductor packaging and discloses a semiconductor packaging thermal compression structure based on dynamic thermal compensation, which comprises a machine body, a base for adsorbing a substrate is slidably connected to the machine body, and an electric push rod is fixedly connected to the machine body; a lifting plate body is fixedly connected to the telescopic end of the electric push rod, a bonding head for adsorbing a chip is fixedly connected to the lifting plate body, a rotating ring body is rotatably connected to the lifting plate body, a nozzle is rotatably connected to the rotating ring body, and the nozzle has a rotating stroke relative to the rotating ring body in the tangential direction of the rotating ring body. The semiconductor packaging thermal compression structure based on dynamic thermal compensation can effectively solve the problems in the prior art that the surface of the substrate has a height difference, the welding points between the chip and the substrate bear uneven stress, fatigue cracking easily occurs in the stress concentration areas under mechanical vibration, and the electrical connection reliability between the chip and the substrate is reduced.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and more specifically to a semiconductor packaging hot-pressing structure based on dynamic thermal compensation. Background Technology

[0002] Semiconductor packaging is the process of processing tested wafers into individual chips. It encompasses core processes such as dicing, die mounting, bonding, molding, lead trimming, and final product testing. Traditional packaging uses lead frames as carriers and includes through-hole packaging and surface mount packaging. Advanced packaging technologies include wafer-level packaging based on 12-inch wafers, as well as chip thermo-bonding and system-in-package (SISB). In the thermo-bonding process of semiconductors, the substrate is usually fixed to a heated base by vacuum adsorption. The bonding head (carrying the chip) is also heated to the same or slightly higher temperature. The bonding head approaches the substrate with submicron precision, making contact between the chip and the substrate. The bonding head applies a certain pressure to make the bumps and pads make tight contact. Under the action of heating and pressure, the metal atoms on the surface of the bumps gain enough energy to diffuse and form atomic-level metal bonds, achieving electrical and mechanical connections. After bonding is completed, the bonding head and substrate are rapidly cooled to solidify the molten metal bumps and form a stable bonding structure. The vacuum adsorption of the chip by the bonding head is turned off, and the chip is separated from the bonding head, completing the bonding of a single chip.

[0003] Currently, in the thermopress packaging process for semiconductors, a heating base heats the substrate, and a heating bonding head heats the chip. Simultaneously, the bonding head applies pressure to the chip, ensuring tight contact between the chip and the substrate. This results in uneven pressure distribution across the substrate, with the contact area experiencing compression from the chip, while the non-contact areas are not. Under high temperatures, the substrate material expands. The contact area expands less due to the compression, while the unconstrained non-contact area expands more significantly. This difference in expansion between the contact and non-contact areas creates surface unevenness on the substrate. The solder joints between the chip and substrate experience uneven stress, and under mechanical vibration, these stress concentration areas are prone to fatigue cracking, reducing the reliability of the electrical connection between the chip and the substrate. Summary of the Invention

[0004] In view of the above-mentioned shortcomings of the prior art, the present invention provides a semiconductor packaging hot-pressing structure based on dynamic thermal compensation, which can effectively solve the problems in the background art.

[0005] To achieve the above objectives, the present invention provides a semiconductor packaging hot-pressing structure based on dynamic thermal compensation, comprising: a body, on which a base for adsorbing a substrate is slidably connected, and an electric push rod is fixedly connected; a lifting plate is fixedly connected to the telescopic end of the electric push rod, a bonding head for adsorbing a chip is fixedly connected to the lifting plate, a rotating ring is rotatably connected to the lifting plate, and a nozzle is rotatably connected to the rotating ring. The nozzle has a rotational stroke relative to the rotating ring about the tangential direction of the rotating ring. This rotational stroke includes a first stroke covering the non-contact area between the chip and the substrate during the hot-pressing process, and a second stroke covering the contact area between the chip and the substrate after the hot-pressing process is completed.

[0006] Furthermore, a first actuator is rotatably connected to the lifting plate, and a second actuator is rotatably connected to the rotating ring. The first actuator is used to drive the rotating ring to rotate on the lifting plate, and the second actuator is used to drive the nozzle to rotate on the rotating ring.

[0007] Furthermore, the lifting plate body includes an upper lifting plate, a middle lifting plate, and a lower lifting plate. The upper lifting plate is fixedly connected to the telescopic end of the electric push rod. A drive gear is rotatably connected to the middle lifting plate. A rotating block is rotatably connected to the lower lifting plate. The drive gear is fixedly connected to the rotating block. The rotating block is fixedly connected to a rotating ring. A connecting piece is fixedly connected to the rotating ring. An air jet is rotatably connected to the connecting piece. A nozzle is fixedly connected to the air jet.

[0008] A lever is fixedly connected to the jet tube, a lever block is rotatably connected to the lever, a telescopic cylinder is fixedly connected to the rotating ring, a telescopic rod is slidably connected to the telescopic cylinder, a telescopic block is fixedly connected to the telescopic rod, a slot is provided on the telescopic block, and the lever block is slidably connected inside the slot.

[0009] Furthermore, a top wheel is rotatably connected to the telescopic block, and a slide bar is slidably connected to the lower lifting plate. A double slide rail is fixedly connected to the slide bar, and the double slide rail includes an inner slide rail and an outer slide rail. The inner slide rail includes an inner retractable inclined rail and an inner extension inclined rail, and the outer slide rail includes an outer extension inclined rail and an outer retractable inclined rail.

[0010] Furthermore, a fixed ring rail is provided on the lower lifting plate.

[0011] Furthermore, an adjusting slide rail is fixedly connected to the slide bar, an adjusting block is rotatably connected to the lifting plate, an adjusting plate is fixedly connected to the adjusting block, an adjusting wheel is rotatably connected to the adjusting plate, and the adjusting wheel is slidably connected inside the adjusting slide rail.

[0012] Furthermore, a limiting block is rotatably connected to the lifting plate, the limiting block is fixedly connected to the adjusting block, and an adjusting gear is fixedly connected to the limiting block.

[0013] Furthermore, a limiting slide rail is fixedly connected to the lifting middle plate, a slide frame is slidably connected to the limiting slide rail, the slide frame is slidably connected to the limiting block, and a first tooth is fixedly connected to the slide frame.

[0014] Furthermore, a push-pull rod is fixedly connected to the sliding frame, a second tooth is fixedly connected to the push-pull rod, and a spring is fixedly connected between the sliding frame and the lifting middle plate.

[0015] Furthermore, a baffle is fixedly connected to the bottom of the rotating ring, and a telescopic ring is slidably connected inside the baffle.

[0016] The technical solution provided by this invention has the following advantages compared with the prior art: 1. This invention involves setting a nozzle that moves along the edge of the chip-substrate contact area. The nozzle sprays cooling gas onto the edge of the chip-substrate contact area, cooling the substrate area that is not in contact with the chip. This reduces the substrate temperature in the non-contact area, thereby reducing the expansion of the substrate in the non-contact area. In traditional thermoforming packaging, due to uneven pressure distribution on the substrate, the substrate area in contact with the chip expands less due to compression, while the unconstrained non-contact area expands more, resulting in a height difference on the substrate surface. This affects the reliability of the electrical connection between the chip and the substrate. This invention uses a nozzle to spray cooling gas onto the edge of the chip-substrate contact area, cooling the substrate in the non-contact area and reducing the expansion of the substrate in the non-contact area. This effectively reduces the difference in expansion between the contact and non-contact areas, thereby avoiding a height difference on the substrate surface and improving the reliability of the electrical connection between the chip and the substrate.

[0017] 2. This invention uses a lever to rotate the lever, air jet, and nozzle around the axis of the air jet, causing the cooling gas ejected from the nozzle to tilt outwards towards the chip. As the direction of the cooling gas movement gradually tilts, the tilted cooling gas can create stronger airflow disturbance, enhancing convective heat transfer between the substrate surface and the surrounding air. This enhanced convection can accelerate heat transfer, allowing the substrate to cool down faster, improving the cooling efficiency of the non-contact area of ​​the substrate, further reducing the expansion of the non-contact area of ​​the substrate, narrowing the difference in expansion between the contact area and the non-contact area, and further improving the reliability of the electrical connection between the chip and the substrate.

[0018] 3. This invention uses a lever to rotate the air jet and nozzle around the axis of the air jet, causing the cooling gas ejected from the nozzle to tilt towards the center of the chip. As the direction of the cooling gas gradually tilts, the cooling gas rapidly cools the contact area between the chip and the substrate. During the hot pressing process, the chip and the substrate expand due to heat. If the cooling is slow, the different cooling rates between the two will generate large thermal stress at the interface. Rapid cooling allows the chip and the substrate to approach room temperature more quickly, reducing the accumulation of thermal stress caused by the difference in cooling rates, thereby reducing the risk of substrate warping and further improving the reliability of the electrical connection between the chip and the substrate. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present invention; Figure 2 This is a schematic diagram of the base structure in an embodiment of the present invention; Figure 3 This is a schematic diagram of the lifting upper plate structure in an embodiment of the present invention; Figure 4 This is a schematic diagram of the baffle structure in an embodiment of the present invention; Figure 5 This is a schematic diagram of the lifting middle plate in an embodiment of the present invention; Figure 6 This is a schematic diagram of the drive gear in an embodiment of the present invention; Figure 7 This is a schematic diagram of the spring in a compressed state in an embodiment of the present invention; Figure 8 This is a schematic diagram of the structure of the adjusting circular block in an embodiment of the present invention; Figure 9 This is a schematic diagram of the rotating circular block in an embodiment of the present invention; Figure 10 This is a schematic diagram of the inner slide rail in an embodiment of the present invention; Figure 11 This is a schematic diagram of the structure of the inward-retracting inclined rail and the inward-extending inclined rail in an embodiment of the present invention; Figure 12 This is a schematic diagram of the connecting piece in an embodiment of the present invention; Figure 13 This is a schematic diagram of the bonding head structure in an embodiment of the present invention; Figure 14This is a schematic diagram of the structure of the toggle block in an embodiment of the present invention; Figure 15 This is a schematic diagram of the spring in a stretched state in an embodiment of the present invention; Figure 16 This is a schematic diagram of the drive gear in an embodiment of the present invention; Figure 17 This is a schematic diagram of the structure of the adjustment plate in an embodiment of the present invention; Figure 18 This is a schematic diagram of the slider structure in an embodiment of the present invention; Figure 19 This is a schematic diagram of the structure of the outer slide rail in an embodiment of the present invention; Figure 20 This is a schematic diagram of the structure of the extended inclined rail and the retracted inclined rail in an embodiment of the present invention; Figure 21 This is a schematic diagram of the partition structure in an embodiment of the present invention; Figure 22 This is a schematic diagram of the telescopic ring in the extended state in an embodiment of the present invention; Figure 23 This is a schematic diagram of the telescopic ring in the retracted state in an embodiment of the present invention.

[0021] The labels in the diagram represent: 1. Body; 11. Base; 12. Base plate; 13. Electric push rod; 14. Chip; 2. Upper lifting plate; 21. Middle lifting plate; 22. Lower lifting plate; 23. Bonding head; 24. Drive gear; 25. Rotating block; 26. Rotating ring; 27. Connecting piece; 28. Jet tube; 29. ​​Nozzle; 3. Lever; 31. Lever block; 32. Telescopic cylinder; 33. Telescopic rod; 34. Telescopic block; 35. Lever groove; 4. Top wheel; 41. Slide bar; 42. 43. Double slide rail; 44. Inner slide rail; 431. Outer slide rail; 432. Inner retractable inclined rail; 441. Outer extended inclined rail; 442. Outer retractable inclined rail; 5. Fixed ring rail; 6. Adjusting block; 61. Adjusting plate; 62. Adjusting wheel; 63. Adjusting slide rail; 7. Limiting block; 71. Adjusting gear; 72. Limiting slide rail; 73. Slide frame; 74. First tooth; 75. Push-pull rod; 76. Second tooth; 77. Spring; 8. Stop cylinder; 81. Telescopic ring plate; 82. Partition plate. Detailed Implementation

[0022] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0023] Please see Figures 1-23This invention provides a technical solution: a semiconductor packaging hot pressing structure based on dynamic thermal compensation, comprising a body 1, a base 11 for adsorbing a substrate slidably connected to the body 1, and an electric push rod 13 fixedly connected to the body 1; a lifting plate is fixedly connected to the telescopic end of the electric push rod 13, a bonding head 23 for adsorbing a chip is fixedly connected to the lifting plate, a rotating ring 26 is rotatably connected to the lifting plate, and a nozzle 29 is rotatably connected to the rotating ring 26. The nozzle 29 has a rotational stroke relative to the rotating ring 26 about the tangent direction of the rotating ring 26. The rotational stroke includes a first stroke covering the non-contact area between the chip and the substrate during the hot pressing process, and a second stroke covering the contact area between the chip and the substrate after the hot pressing is completed.

[0024] The substrate 12 is fixed to the upper surface of the heating base 11 by vacuum adsorption. The bonding head 23 picks up the chip 14 by vacuum adsorption and heats the chip 14 to an appropriate temperature. Using a high-precision camera system and optical alignment technology, the bumps of the chip 14 are precisely aligned with the pads of the substrate 12, ensuring that the positional error in the XY plane is within the submicron level. By controlling the electric push rod 13, the lifting plate 2 and the bonding head 23 move downward. The bonding head 23 brings the chip 14 at its bottom closer to the substrate 12 with submicron precision. At the same time, pressure changes are monitored. When the chip 14 contacts the substrate 12, the system detects the pressure change and quickly switches the bonding head 23 from pressure-sensitive control to pressure and position joint control mode. In this process, the bonding head 23 is rapidly heated to melt the solder balls. While the solder balls are molten, the bonding head 23 ensures that each pair of bumps can be reliably connected through precise position control and controls the gap height of the chip 14 within a reasonable range. Typically, after detecting that the solder balls have melted, the bonding head 23 will continue to press the chip 14 down by 5μm to 10μm to ensure that all bumps can make full contact and form a reliable connection. The chip 14 is kept in the molten state for a certain period of time to ensure that the solder balls are completely melted and wet the connection points on the chip 14 and the substrate 12. Subsequently, the bonding head 23 is rapidly cooled to below the melting point of the solder balls, causing the solder balls to become a solid phase. The bonding head 23 releases the vacuum adsorption, and the chip 14 separates from the bonding head 23 and is bonded to the substrate 12.

[0025] A first actuator is rotatably connected to the lifting plate, and a second actuator is rotatably connected to the rotating ring 26. The first actuator is used to drive the rotating ring 26 to rotate on the lifting plate, and the second actuator is used to drive the nozzle 29 to rotate on the rotating ring 26.

[0026] The first actuator is a first drive motor, the output shaft of which is fixedly connected to the rotating ring 26. The second actuator is a plurality of second drive motors, the output shaft of which is fixedly connected to a nozzle 29. The plurality of second drive motors are used to drive the plurality of nozzles 29 to rotate on the rotating ring 26.

[0027] During the downward movement of the bonding head 23 and the chip 14, the first actuator drives the rotating ring 26 to rotate continuously around its axis. The rotating ring 26 drives the nozzle 29 at its bottom to rotate around its axis, while the nozzle 29 sprays cooling gas downwards. The flow rate, temperature, and pressure of this cooling gas are determined through multiple tests to ensure that the spraying of the cooling gas does not interfere with the thermal bonding process between the chip 14 and the substrate 12. The second actuator drives the nozzle 29 to reciprocate around the axis of the jet nozzle 28. Figure 19 As shown, the second actuator drives the nozzle 29 to rotate a certain angle away from the bonding head 23 from directly below the jet tube 28 around the axis of the jet tube 28 (during this process, the rotation angle is 30 to 40 degrees, and the nozzle of the nozzle 29 is always facing the non-contact area between the chip 14 and the substrate 12, and the cooling gas sprayed by the nozzle 29 cools the non-contact area between the chip 14 and the substrate 12). After the second actuator drives the nozzle 29 to rotate a certain angle away from the bonding head 23 around the axis of the jet tube 28 (the rotation angle is 30 to 40 degrees), the second actuator drives the nozzle 29 to rotate downward around the axis of the jet tube 28 by a certain angle (during this process, the rotation angle is 30 to 40 degrees, and the nozzle of the nozzle 29 is always facing the non-contact area between the chip 14 and the substrate 12, and the cooling gas sprayed by the nozzle 29 cools the non-contact area between the chip 14 and the substrate 12). In this way, the second actuator drives the nozzle 29 to reciprocate around the axis of the jet tube 28 for the first time. Under the synergistic action of the first and second actuators, the gas ejected from the nozzle 29 covers the non-contact area between the chip 12 and the substrate 14. As the direction of the cooling gas movement gradually tilts, the tilted jet of cooling gas can form a stronger airflow disturbance, enhancing the convective heat transfer between the surface of the substrate 12 and the surrounding air. This enhanced convection can accelerate the heat transfer, allowing the substrate 12 to cool down faster, improving the cooling efficiency of the non-contact area of ​​the substrate 12, further reducing the expansion of the non-contact area of ​​the substrate 12, narrowing the difference in expansion between the contact area and the non-contact area, and further improving the reliability of the electrical connection between the chip 14 and the substrate 12.

[0028] After the thermo-bonding of chip 14 and substrate 12 is completed, the first actuator is controlled to drive the rotating ring 26 to rotate around its axis. The rotating ring 26 drives the nozzle 29 to rotate around its axis. The second actuator is controlled to drive the nozzle 29 to reciprocate around the axis of the jet nozzle 28. Figure 19As shown, the second actuator drives the nozzle 29 to rotate a certain angle from directly below the jet tube 28 around the axis of the jet tube 28 toward the bonding head 23 (during this process, the rotation angle is 30 to 40 degrees, and the nozzle of the nozzle 29 is always facing the contact area between the chip 14 and the substrate 12, and the cooling gas sprayed by the nozzle 29 cools the contact area between the chip 14 and the substrate 12). After the second actuator drives the nozzle 29 to rotate a certain angle around the axis of the jet tube 28 toward the bonding head 23 (the rotation angle is 30 to 40 degrees), the second actuator drives the nozzle 29 to rotate a certain angle downward around the axis of the jet tube 28 (during this process, the rotation angle is 30 to 40 degrees, and the nozzle of the nozzle 29 is always facing the contact area between the chip 14 and the substrate 12, and the cooling gas sprayed by the nozzle 29 cools the contact area between the chip 14 and the substrate 12). In this way, the second actuator drives the nozzle 29 to reciprocate around the axis of the jet tube 28 for the second time. Under the synergistic action of the first and second actuators, the gas ejected from the nozzle 29 covers the contact area between the chip 12 and the substrate 14. As the direction of the cooling gas movement gradually tilts, the cooling gas rapidly cools the contact area between the chip 14 and the substrate 12. During the hot pressing process, the chip 14 and the substrate 12 expand due to heat. If the cooling is slow, the different cooling rates of the two will generate large thermal stress at the interface. Rapid cooling allows the chip 14 and the substrate 12 to approach room temperature more quickly, reducing the accumulation of thermal stress caused by the difference in cooling rates, thereby reducing the risk of warping of the substrate 12 and further improving the reliability of the electrical connection between the chip 14 and the substrate 12.

[0029] To improve cooling efficiency, multiple nozzles 29 are arranged in a ring array on the rotating ring 26. In the above technical solution, each nozzle 29 is equipped with a second actuator to drive it to rotate.

[0030] In another embodiment of the present invention, a single drive motor is used to achieve the rotation of the rotating ring 26 and each nozzle 29, eliminating the need for each nozzle 29 to be coupled with a drive source, thus simplifying the wiring for power and signal transmission of the drive source. Specifically, the lifting plate includes an upper lifting plate 2, a middle lifting plate 21, and a lower lifting plate 22. The upper lifting plate 2 is fixedly connected to the telescopic end of the electric push rod 13. A drive gear 24 is rotatably connected to the middle lifting plate 21, and the drive gear 24 is driven to rotate by the drive motor. A rotating block 25 is rotatably connected to the lower lifting plate 22. The drive gear 24 and the rotating block 25 are fixedly connected. The rotating block 25 is fixedly connected to the rotating ring 26. A connecting piece 27 is fixedly connected to the rotating ring 26, and an air jet 28 is rotatably connected to the connecting piece 27. A nozzle 29 is fixedly connected; a lever 3 is fixedly connected to the jet nozzle 28, and a lever block 31 is rotatably connected to the lever 3; a telescopic cylinder 32 is fixedly connected to the rotating ring 26, and a telescopic rod 33 is slidably connected to the telescopic cylinder 32; a telescopic block 34 is fixedly connected to the telescopic rod 33, and a slot 35 is provided on the telescopic block 34; the lever block 31 is slidably connected inside the slot 35; a top wheel 4 is rotatably connected to the telescopic block 34; a slide bar 41 is slidably connected to the lifting lower plate 22, and a double slide rail 42 is fixedly connected to the slide bar 41, the double slide rail 42 including an inner slide rail 43 and an outer slide rail 42. Slide rail 44; inner slide rail 43 includes inner retractable inclined rail 431 and inner extended inclined rail 432, outer slide rail 44 includes outer extended inclined rail 441 and outer retractable inclined rail 442; fixed ring rail 5 is provided on the lower lifting plate 22; adjustable slide rail 63 is fixedly connected to slide bar 41, adjustable round block 6 is rotatably connected to the middle lifting plate 21, adjustable plate 61 is fixedly connected to the adjustable round block 6, adjustable wheel 62 is rotatably connected to the adjustable plate 61, and the adjustable wheel 62 is slidably connected inside the adjustable slide rail 63; limit block 7 is rotatably connected to the middle lifting plate 21, and the limit block 7 and the adjustable round block 6. Fixed connection: An adjusting gear 71 is fixedly connected to the limiting block 7; a limiting slide rail 72 is fixedly connected to the lifting middle plate 21, and a sliding frame 73 is slidably connected to the limiting slide rail 72. The sliding frame 73 is slidably connected to the limiting block 7, and a first tooth 74 is fixedly connected to the sliding frame 73; a push-pull rod 75 is fixedly connected to the sliding frame 73, and a second tooth 76 is fixedly connected to the push-pull rod 75. A spring 77 is fixedly connected between the sliding frame 73 and the lifting middle plate 21; a stop cylinder 8 is fixedly connected to the bottom of the rotating ring body 26, and a telescopic ring plate 81 is slidably connected inside the stop cylinder 8.

[0031] By controlling the drive gear 24 to rotate counterclockwise on the upper surface of the lifting plate 21, the rotating drive gear 24 continuously pushes its second teeth 76 along the limiting slide rail 72 towards the limiting block 7. At this time, the spring 77 is in a compressed state, and the spring 77 applies a pushing force towards the drive gear 24 to the slide frame 73. Under the elastic force of the spring 77 and the continuous pushing action of the drive gear 24, the inner wall of the slide frame 73 maintains a sliding connection with the limiting block 7. Because the inner wall of the slide frame 73 maintains a sliding connection with the limiting block 7, the adjusting block 6 is limited, and the adjusting block 6 cannot rotate around its own axis. The adjusting plate 61, adjusting wheel 62, adjusting slide rail 63, slide bar 41, and double slide rail 42 are limited to keep the inner slide rail 43 relatively stationary with respect to the fixed ring rail 5. During this process, the rotating drive gear 24 drives the rotating block 25 below it to rotate around the axis of the rotating block 25. The rotating block 25 drives the rotating ring body 26 below it to rotate around the axis of the rotating block 25. The rotating ring body 26 drives the connecting piece 27 to rotate around the axis of the rotating block 25. The connecting piece 27 drives the jet tube 28 and the nozzle 29 to rotate around the axis of the rotating block 25. At the same time, the jet tube 28 sprays cooling gas downward through the nozzle 29. As chip 14 gradually approaches substrate 12, nozzle 29 also moves downwards towards substrate 12. Nozzle 29, rotating around the axis of rotating block 25, moves along the edge of the contact area between chip 14 and substrate 12. Nozzle 29 sprays cooling gas onto the edge of the contact area, cooling the substrate 12 area that is not in contact with chip 14. This reduces the temperature of the substrate 12 in the non-contact area (the non-contact area of ​​substrate 12 refers to the area of ​​substrate 12 that is not in contact with chip 14), thereby reducing the expansion of the substrate 12 in the non-contact area. In traditional thermopress packaging, due to pressure on substrate 1... The uneven distribution of substrate 12 on the substrate causes uneven expansion. The area of ​​substrate 12 in contact with chip 14 expands smaller due to compression, while the unconstrained expansion area expands larger, resulting in a height difference on the surface of substrate 12. This affects the reliability of the electrical connection between chip 14 and substrate 12. In this application, cooling gas is sprayed from nozzle 29 onto the edge of the contact area between chip 14 and substrate 12 to cool the substrate 12 in the non-contact area, reducing the expansion amount of substrate 12 in the non-contact area. This effectively reduces the difference in expansion amount between the contact area and the non-contact area, thereby avoiding a height difference on the surface of substrate 12 and improving the reliability of the electrical connection between chip 14 and substrate 12.

[0032] As described above, as the rotating ring 26 continues to rotate around the axis of the rotating block 25, the rotating ring 26 drives the telescopic cylinder 32 to rotate around the axis of the rotating block 25. The telescopic cylinder 32 drives the telescopic rod 33 inside it to rotate around the axis of the rotating block 25. The telescopic rod 33 drives the telescopic block 34 at one end of it to rotate around the axis of the rotating block 25. The telescopic block 34 drives the top wheel 4 at its top to rotate around the axis of the rotating block 25, causing the top wheel 4 to slide along the inner slide rail 43 and the fixed ring rail 5. As the top wheel 4 slides along the inner retraction inclined rail 431 towards the inner extension inclined rail 432, the top wheel 4 gradually approaches the rotating block 25. As the top wheel 4 slides along the inner extension inclined rail 432 towards the inner retraction inclined rail 431, the top wheel 4 gradually moves away from the rotating block 25. Therefore, as the top wheel 4 rotates counterclockwise around the axis of the rotating block 25, the top wheel 4 drives the telescopic block 34 at its bottom to rotate along the telescopic cylinder 32. The axis reciprocates. As the telescopic block 34 approaches the rotating block 25 along the axis of the telescopic cylinder 32, the telescopic block 34 pushes the lever 31 to rotate around the axis of the jet cylinder 28 through the lever 35. The lever 31 drives the lever 3, the jet cylinder 28 and the nozzle 29 to rotate around the axis of the jet cylinder 28, causing the cooling gas ejected from the nozzle 29 to tilt towards the outside of the chip 14. As the direction of the cooling gas movement gradually tilts, the tilted jet of cooling gas can form a stronger airflow disturbance, enhancing the convective heat transfer between the surface of the substrate 12 and the surrounding air. This enhanced convection can accelerate the heat transfer, allowing the substrate 12 to cool down faster, improving the cooling efficiency of the non-contact area substrate 12, further reducing the expansion of the non-contact area substrate 12, narrowing the difference in expansion between the contact area and the non-contact area, and further improving the reliability of the electrical connection between the chip 14 and the substrate 12.

[0033] As a further embodiment of the present invention, in the above process, such as Figure 22 As shown, by controlling the two telescopic rings 81 to be in an extended state inside the baffle 8, the telescopic rings 81 and the baffle 8 isolate the cooling gas ejected from the nozzle 29. During the hot-press bonding process between the chip 14 and the substrate 12, the cooling gas is prevented from having an adverse effect on the heated chip 14, thereby ensuring the hot-press effect between the chip 14 and the substrate 12.

[0034] As a further embodiment of the present invention, in practical applications, such as Figure 21As shown, during the thermo-bonding process of chip 14, the cooling gas is isolated by the partition 82 and the baffle 8, while the temperature of the outer area of ​​the baffle 8 is prevented from being too high, thus ensuring the normal operation of the overall equipment. By setting the distance between the edge of chip 14 and the bottom edge of the baffle 8 to 1mm to 1.5mm, as the cooling gas continuously cools the non-contact area outside the baffle 8, the expansion of the non-contact area outside the baffle 8 is effectively reduced. Under the action of thermal radiation, the heat of the non-contact area inside the baffle 8 gradually decreases, thereby further reducing the expansion of the non-contact area inside the baffle 8.

[0035] As a further embodiment of the present invention, as described above, after the solder balls are completely melted and wet the connection points on the chip 14 and the substrate 12, when the top wheel 4 rotates counterclockwise along the fixed ring rail 5 to the junction of the fixed ring rail 5 and the inner slide rail 43, the drive gear 24 is controlled to rotate clockwise on the upper surface of the lifting plate 21. The rotating drive gear 24 drives the push-pull rod 75 and the slide frame 73 to slide along the limiting slide rail 72 through the second tooth 76. At this time, the spring 77 is in a stretched state. Furthermore, during the movement of the slide frame 73, the inner wall of the slide frame 73 separates from the limiting block 7, releasing the limitation on the adjusting block 6. Then, the moving slide frame 73 drives the adjusting block 6 through the first tooth 74. The gear 71 rotates 180 degrees around the axis of the adjusting block 6. Then, the inner wall of the sliding frame 73 slides again with the limiting block 7, locking the adjusting block 6 again. During this process, the adjusting gear 71 drives the adjusting block 6 to rotate 180 degrees around its own axis. The adjusting block 6 drives the adjusting plate 61 and the adjusting wheel 62 to rotate 180 degrees around the axis of the adjusting block 6. The adjusting wheel 62 drives the slide bar 41 to slide along the outer surface of the lifting lower plate 22 through the adjusting slide rail 63. The slide bar 41 drives the double slide rail 42 to move, so that the outer slide rail 44 is aligned with the fixed ring rail 5 and remains relatively stationary. As the top wheel 4 rotates clockwise around the rotating block 25, the top wheel 4 moves along the axis of the adjusting plate 62 to move along the axis of the adjusting plate 62. The fixed ring rail 5 and the outer slide rail 44 slide. As the top wheel 4 slides along the extended inclined rail 441 to the retracted inclined rail 442, the top wheel 4 gradually moves away from the rotating block 25. As the top wheel 4 slides along the retracted inclined rail 442 to the extended inclined rail 441, the top wheel 4 gradually moves closer to the rotating block 25. Thus, as the top wheel 4 rotates clockwise around the axis of the rotating block 25, the top wheel 4 drives the telescopic block 34 at its bottom to reciprocate along the axis of the telescopic cylinder 32. As the telescopic block 34 gradually moves away from the rotating block 25 along the axis of the telescopic cylinder 32, the telescopic block 34 pushes the lever 31 to rotate around the axis of the jet tube 28 through the lever groove 35. The lever 31 drives the lever. 3. The jet tube 28 and the nozzle 29 rotate around the axis of the jet tube 28, causing the cooling gas ejected from the nozzle 29 to tilt towards the center of the chip 14. As the direction of the cooling gas movement gradually tilts, the cooling gas rapidly cools the contact area between the chip 14 and the substrate 12. During the hot pressing process, the chip 14 and the substrate 12 expand due to heat. If the cooling is slow, the different cooling rates of the two will generate large thermal stress at the interface. Rapid cooling allows the chip 14 and the substrate 12 to approach room temperature more quickly, reducing the accumulation of thermal stress caused by the difference in cooling rates, thereby reducing the risk of warping of the substrate 12 and further improving the reliability of the electrical connection between the chip 14 and the substrate 12.

[0036] As a further embodiment of the present invention, in the above process, such as Figure 23As shown, by controlling the two telescopic ring plates 81 to be in a retracted state inside the baffle 8, the cooling gas ejected by the nozzle 29 can enter the interior of the baffle 8 and come into contact with the chip 14 and the substrate 12, thereby ensuring the rapid cooling effect of the chip 14 and the substrate 12.

[0037] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. A semiconductor packaging thermo-pressing structure based on dynamic thermal compensation, comprising a body (1), characterized in that: The body (1) is slidably connected to a base (11) for adsorbing substrates, and an electric push rod (13) is fixedly connected to the body (1). A lifting plate is fixedly connected to the telescopic end of the electric push rod (13). A bonding head (23) for adsorbing the chip is fixedly connected to the lifting plate. A rotating ring (26) is rotatably connected to the lifting plate. A nozzle (29) is rotatably connected to the rotating ring (26). The nozzle (29) has a rotational stroke relative to the rotating ring (26) about the tangential direction of the rotating ring (26). The rotational stroke includes a first stroke covering the non-contact area of ​​the chip and the substrate during the hot pressing process of the chip and the substrate, and a second stroke covering the contact area of ​​the chip and the substrate after the hot pressing of the chip and the substrate is completed.

2. The semiconductor packaging hot-pressing structure based on dynamic thermal compensation according to claim 1, characterized in that: The lifting plate is rotatably connected to a first actuator, and the rotating ring (26) is rotatably connected to a second actuator. The first actuator is used to drive the rotating ring (26) to rotate on the lifting plate, and the second actuator is used to drive the nozzle (29) to rotate on the rotating ring (26).

3. The semiconductor packaging hot-pressing structure based on dynamic thermal compensation according to claim 1, characterized in that: The lifting plate body includes an upper lifting plate (2), a middle lifting plate (21), and a lower lifting plate (22). The upper lifting plate (2) is fixedly connected to the telescopic end of the electric push rod (13). A drive gear (24) is rotatably connected to the middle lifting plate (21). A rotating block (25) is rotatably connected to the lower lifting plate (22). The drive gear (24) is fixedly connected to the rotating block (25). The rotating block (25) is fixedly connected to the rotating ring (26). A connecting piece (27) is fixedly connected to the rotating ring (26). An air jet (28) is rotatably connected to the connecting piece (27). A nozzle (29) is fixedly connected to the air jet (28). A lever (3) is fixedly connected to the jet tube (28), a lever block (31) is rotatably connected to the lever (3), a telescopic cylinder (32) is fixedly connected to the rotating ring (26), a telescopic rod (33) is slidably connected to the telescopic cylinder (32), a telescopic block (34) is fixedly connected to the telescopic rod (33), a slot (35) is provided on the telescopic block (34), and the lever block (31) is slidably connected inside the slot (35).

4. The semiconductor packaging hot-pressing structure based on dynamic thermal compensation according to claim 3, characterized in that: The telescopic block (34) is rotatably connected to a top wheel (4), and the lifting lower plate (22) is slidably connected to a slide bar (41). The slide bar (41) is fixedly connected to a double slide rail (42), which includes an inner slide rail (43) and an outer slide rail (44). The inner slide rail (43) includes an inner retractable inclined rail (431) and an inner extended inclined rail (432), and the outer slide rail (44) includes an outer extended inclined rail (441) and an outer retractable inclined rail (442).

5. The semiconductor packaging hot-pressing structure based on dynamic thermal compensation according to claim 3, characterized in that: A fixed ring rail (5) is provided on the lifting lower plate (22).

6. The semiconductor packaging hot-pressing structure based on dynamic thermal compensation according to claim 4, characterized in that: An adjusting slide rail (63) is fixedly connected to the slide bar (41), an adjusting block (6) is rotatably connected to the lifting plate (21), an adjusting plate (61) is fixedly connected to the adjusting block (6), an adjusting wheel (62) is rotatably connected to the adjusting plate (61), and the adjusting wheel (62) is slidably connected inside the adjusting slide rail (63).

7. The semiconductor packaging hot-pressing structure based on dynamic thermal compensation according to claim 6, characterized in that: The lifting plate (21) is rotatably connected to a limiting block (7), the limiting block (7) is fixedly connected to an adjusting block (6), and an adjusting gear (71) is fixedly connected to the limiting block (7).

8. The semiconductor packaging hot-pressing structure based on dynamic thermal compensation according to claim 7, characterized in that: The lifting middle plate (21) is fixedly connected to a limiting slide rail (72), and a sliding frame (73) is slidably connected to the limiting slide rail (72). The sliding frame (73) is slidably connected to the limiting block (7), and a first tooth (74) is fixedly connected to the sliding frame (73).

9. The semiconductor packaging hot-pressing structure based on dynamic thermal compensation according to claim 8, characterized in that: A push-pull rod (75) is fixedly connected to the slide frame (73), a second tooth (76) is fixedly connected to the push-pull rod (75), and a spring (77) is fixedly connected between the slide frame (73) and the lifting middle plate (21).

10. The semiconductor packaging hot-pressing structure based on dynamic thermal compensation according to claim 1, characterized in that: The bottom of the rotating ring (26) is fixedly connected to a baffle (8), and a telescopic ring (81) is slidably connected inside the baffle (8).

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