A surface mount capacitor and its manufacturing process

Abstract

This invention discloses a surface-mount capacitor and its manufacturing process. The surface-mount capacitor includes: an upper shell, a lower shell, a first capacitor body, a second capacitor body, a first metal lead, and a second metal lead. The upper shell and the lower shell are connected to form a sealed chamber. The top surfaces of the first capacitor body and the second capacitor body are connected in series via a metal sheet. The bottom of the lower shell has a first through hole and a second through hole. One end of the first metal lead is welded to the bottom surface of the first capacitor body, and the other end of the first metal lead passes through the first through hole and extends to the outside of the sealed chamber. One end of the second metal lead is welded to the bottom surface of the second capacitor body, and the other end of the second metal lead passes through the second through hole and extends to the outside of the sealed chamber. The surface-mount capacitor and its manufacturing process of this invention optimize the welding steps and reduce the difficulty of lead bending.

Description

Technical Field

[0001] This invention relates to the field of capacitor technology, and in particular to a surface mount capacitor and its manufacturing process. Background Technology

[0002] like Figure 1 The diagram shows the structure of a conventional surface mount capacitor 10. The surface mount capacitor 10 includes a package housing 11 and two capacitor bodies 12 connected in series inside the package housing 11. Metal leads 13, which are soldered to the two capacitor bodies 12 respectively, extend from the side of the package housing 11 to the bottom surface.

[0003] In the actual welding process, the tops of the two capacitor bodies 12 are connected in series (welded) together by metal sheets 14, and the bottoms of the two capacitor bodies 12 are welded together by metal leads 13. Since the structures of the metal sheets 14 and the two metal leads 13 are not the same, during welding, it is necessary to find the corresponding structures and directions and weld different structures at different positions on the capacitor bodies 12, which makes the welding process very complicated.

[0004] In addition, the metal pins 13 extend from the side of the package housing 11 to the bottom surface. The metal pins 13 need to be bent in a complex manner, which is quite difficult. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide a surface mount capacitor and its manufacturing process, optimize the soldering steps, and reduce the difficulty of lead bending.

[0006] The objective of this invention is achieved through the following technical solution: A surface mount capacitor includes: an upper housing, a lower housing, a first capacitor body, a second capacitor body, a first metal lead, and a second metal lead; The upper housing and the lower housing are connected to form a sealed chamber, and the top surface of the first capacitor body and the top surface of the second capacitor body are connected in series by a metal sheet. The bottom of the lower housing is provided with a first through hole and a second through hole; One end of the first metal pin is welded to the bottom surface of the first capacitor body, and the other end of the first metal pin passes through the first through hole and extends to the outside of the sealed chamber; one end of the second metal pin is welded to the bottom surface of the second capacitor body, and the other end of the second metal pin passes through the second through hole and extends to the outside of the sealed chamber.

[0007] In one embodiment, the bottom outer wall of the lower housing is provided with a first receiving groove and a second receiving groove, the portion of the first metal pin located outside the sealed chamber is bent and received in the first receiving groove, and the portion of the second metal pin located outside the sealed chamber is bent and received in the second receiving groove.

[0008] In one embodiment, the first metal pin is interference-fitted through the first through hole, and the second metal pin is interference-fitted through the second through hole.

[0009] In one embodiment, the first metal pin is spaced through the first through hole, and the gap between the first metal pin and the first through hole is filled with sealant; the second metal pin is spaced through the second through hole, and the gap between the second metal pin and the second through hole is filled with sealant.

[0010] In one embodiment, the upper housing is an epoxy resin housing, and the lower housing is an epoxy resin housing.

[0011] A manufacturing process for a surface mount capacitor, used to obtain the aforementioned surface mount capacitor, includes the following steps: Step 1: Obtain: upper shell, lower shell, first capacitor body, second capacitor body, and two metal sheets with identical structures; Step 2: Weld the two ends of one metal sheet to the top surface of the first capacitor body and the top surface of the second capacitor body respectively, and weld the two ends of the other metal sheet to the bottom surface of the first capacitor body and the bottom surface of the second capacitor body respectively. Step 3: Cut the metal sheet between the bottom surface of the first capacitor body and the bottom surface of the second capacitor body to obtain the first metal pin and the second metal pin. Step 4: Bend the first metal pin and the second metal pin for the first time, and then pass the first metal pin and the second metal pin through the first through hole and the second through hole of the lower housing, respectively. Step 5: Connect the upper shell and the lower shell to form a sealed chamber.

[0012] In one embodiment, the method further includes step six: bending the portion of the first metal pin outside the sealed chamber for the second time and receiving it in the first receiving groove, and bending the portion of the second metal pin outside the sealed chamber for the second time and receiving it in the second receiving groove.

[0013] The surface mount capacitor and its manufacturing process of the present invention optimize the soldering steps and reduce the difficulty of bending the leads. Attached Figure Description

[0014] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a structural diagram of a traditional surface mount capacitor; Figure 2 This is a structural diagram (a) of a surface-mount capacitor according to an embodiment of the present invention. Figure 3 This is a structural diagram (II) of a surface-mount capacitor according to an embodiment of the present invention. Figure 4 for Figure 2 A cross-sectional view of the surface-mount capacitor shown; Figure 5 for Figure 2 The structural diagram of the lower shell shown is (I). Figure 6 for Figure 2 The structural diagram of the lower shell shown is (II); Figure 7 A schematic diagram showing the process of welding metal sheets to the top and bottom surfaces of the first and second capacitor bodies to obtain a semi-finished assembly. Figure 8 To Figure 7 The diagram shows the cutting and bending of the semi-finished components. Detailed Implementation

[0016] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0017] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0018] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0019] Please refer to the following: Figure 2 , Figure 3 and Figure 4 This invention discloses a surface-mount capacitor 20, which includes: an upper housing 100, a lower housing 200, a first capacitor body 300, a second capacitor body 400, a first metal lead 500, and a second metal lead 600. In this embodiment, the upper housing 100 and the lower housing 200 are both epoxy resin housings.

[0020] like Figure 4 As shown, the upper housing 100 and the lower housing 200 are connected to form a sealed chamber 101, and the top surface of the first capacitor body 300 and the top surface of the second capacitor body 400 are connected in series through a metal sheet 700.

[0021] like Figure 5 and Figure 6 As shown, the bottom of the lower housing 200 is provided with a first through hole 210 and a second through hole 220.

[0022] like Figure 4 As shown, one end of the first metal pin 500 is welded to the bottom surface of the first capacitor body 300, and the other end of the first metal pin 500 passes through the first through hole 210 and extends to the outside of the sealed chamber 101; one end of the second metal pin 600 is welded to the bottom surface of the second capacitor body 400, and the other end of the second metal pin 600 passes through the second through hole 220 and extends to the outside of the sealed chamber 101.

[0023] like Figure 5 As shown, further, the bottom outer wall of the lower housing 200 is provided with a first receiving groove 230 and a second receiving groove 240. The portion of the first metal lead 500 located outside the sealed chamber 101 is bent and received in the first receiving groove 230, and the portion of the second metal lead 600 located outside the sealed chamber 101 is bent and received in the second receiving groove 240. It can be understood that by providing the first receiving groove 230 and the second receiving groove 240 on the bottom outer wall of the lower housing 200, the leads exposed outside the sealed chamber 101 can be bent and received therein, facilitating subsequent SMT (Surface Mount Technology).

[0024] In one embodiment, a first metal pin 500 is interference-fitted through a first through hole 210, and a second metal pin 600 is interference-fitted through a second through hole 220. It can be understood that the interference fit allows for a tighter fit between the metal pins and the through holes, better sealing the sealed chamber 101 and improving airtightness.

[0025] In another embodiment, a first metal pin 500 is disposed in a clearance fit through a first through hole 210, and the gap between the first metal pin 500 and the first through hole 210 is filled with sealant; a second metal pin 600 is disposed in a clearance fit through a second through hole 220, and the gap between the second metal pin 600 and the second through hole 220 is filled with sealant. It can be understood that, due to the clearance fit, a gap is created between the metal pin and the through hole. To improve the airtightness of the sealed chamber 101, this gap can be filled by applying sealant.

[0026] The present invention also discloses a manufacturing process for a surface-mount capacitor, for obtaining the above-mentioned surface-mount capacitor 20, comprising the following steps: Step 1: Obtain: upper shell 100, lower shell 200, first capacitor body 300, second capacitor body 400, and two metal sheets 700 with the same structure; Step 2: Weld the two ends of one metal sheet 700 to the top surface of the first capacitor body 300 and the top surface of the second capacitor body 400 respectively, and weld the two ends of the other metal sheet 700 to the bottom surface of the first capacitor body 300 and the bottom surface of the second capacitor body 400 respectively. Step 3: Cut the metal sheet 700 between the bottom surface of the first capacitor body 300 and the bottom surface of the second capacitor body 400 to obtain the first metal pin 500 and the second metal pin 600. Step 4: Bend the first metal pin 500 and the second metal pin 600 for the first time. After the first bend, the first metal pin 500 and the second metal pin 600 are respectively inserted into the first through hole 210 and the second through hole 220 of the lower housing 200. Step 5: Connect the upper housing 100 and the lower housing 200 to form a sealed chamber 101; Step 6: Bend the portion of the first metal pin 500 outside the sealed chamber 101 for the second time and house it in the first receiving groove 230; bend the portion of the second metal pin 600 outside the sealed chamber 101 for the second time and house it in the second receiving groove 240.

[0027] like Figure 7As shown, the first capacitor body 300 and the second capacitor body 400 are non-polarized capacitors, and their top and bottom surfaces are not polarized. Since the structures of the two metal sheets 700 are identical, there is no need to distinguish between the front and back sides or the structural orientation during soldering. Figure 1 Compared to the conventional chip capacitor 10 shown, soldering becomes much simpler.

[0028] like Figure 7 and Figure 8 As shown, metal sheets 700 are welded to the top and bottom surfaces of the first capacitor body 300 and the second capacitor body 400 respectively. Mass production of welding will result in a number of semi-finished components. The semi-finished components have complete symmetry. The number of semi-finished components are arranged in an array in a fixture. One of the metal sheets 700 is cut by laser cutting. After being cut, the metal sheet 700 is divided into two parts, thereby obtaining the first metal pin 500 and the second metal pin 600.

[0029] In this invention, the bottom of the lower housing 200 is provided with a first through hole 210 and a second through hole 220. The first metal pin 500 and the second metal pin 600 are bent, and the bent first metal pin 500 and the second metal pin 600 are directly led out from the first through hole 210 and the second through hole 220 and reach the bottom of the housing, without the need for... Figure 1 Unlike conventional surface-mount capacitors 10, which require multiple complex bends to reach the bottom of the housing, the first metal lead 500 and the second metal lead 600 of this invention extend directly from the first through-hole 210 and the second through-hole 220 to the bottom of the housing, resulting in a shorter path and less material consumption.

[0030] like Figure 4 As shown, by opening the first receiving groove 230 and the second receiving groove 240, the portion of the first metal pin 500 located outside the sealed chamber 101 is received in the first receiving groove 230, and the portion of the second metal pin 600 located outside the sealed chamber 101 is received in the second receiving groove 240. As a result, the bottom of the entire capacitor is flatter, and the capacitor can be more stably soldered onto the circuit board during the SMT process.

[0031] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A surface-mount capacitor, characterized in that, include: Upper housing, lower housing, first capacitor body, second capacitor body, first metal pin, second metal pin; The upper housing and the lower housing are connected to form a sealed chamber, and the top surface of the first capacitor body and the top surface of the second capacitor body are connected in series by a metal sheet. The bottom of the lower housing is provided with a first through hole and a second through hole; One end of the first metal pin is welded to the bottom surface of the first capacitor body, and the other end of the first metal pin passes through the first through hole and extends to the outside of the sealed chamber; one end of the second metal pin is welded to the bottom surface of the second capacitor body, and the other end of the second metal pin passes through the second through hole and extends to the outside of the sealed chamber.

2. The surface mount capacitor according to claim 1, characterized in that, The bottom outer wall of the lower housing is provided with a first receiving groove and a second receiving groove. The portion of the first metal pin located outside the sealed chamber is bent and received in the first receiving groove, and the portion of the second metal pin located outside the sealed chamber is bent and received in the second receiving groove.

3. The surface mount capacitor according to claim 1, characterized in that, The first metal pin is interference-fitted through the first through hole, and the second metal pin is interference-fitted through the second through hole.

4. The surface mount capacitor according to claim 1, characterized in that, The first metal pin is disposed in the first through hole with a clearance fit, and the gap between the first metal pin and the first through hole is filled with sealant; the second metal pin is disposed in the second through hole with a clearance fit, and the gap between the second metal pin and the second through hole is filled with sealant.

5. The surface mount capacitor according to claim 1, characterized in that, The upper shell is an epoxy resin shell, and the lower shell is an epoxy resin shell.

6. A manufacturing process for surface-mount capacitors, characterized in that, The method for obtaining the surface-mount capacitor according to any one of claims 1 to 5 comprises the following steps: Step 1: Obtain: upper shell, lower shell, first capacitor body, second capacitor body, and two metal sheets with identical structures; Step 2: Weld the two ends of one metal sheet to the top surface of the first capacitor body and the top surface of the second capacitor body respectively, and weld the two ends of the other metal sheet to the bottom surface of the first capacitor body and the bottom surface of the second capacitor body respectively. Step 3: Cut the metal sheet between the bottom surface of the first capacitor body and the bottom surface of the second capacitor body to obtain the first metal pin and the second metal pin. Step 4: Bend the first metal pin and the second metal pin for the first time, and then pass the first metal pin and the second metal pin through the first through hole and the second through hole of the lower housing, respectively. Step 5: Connect the upper shell and the lower shell to form a sealed chamber.

7. The surface mount capacitor according to claim 6, characterized in that, It also includes step six, bending the portion of the first metal pin outside the sealed chamber a second time and housing it in the first receiving groove, and bending the portion of the second metal pin outside the sealed chamber a second time and housing it in the second receiving groove.

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