An evaporation system

Abstract

The application belongs to the technical field of coating equipment, and particularly relates to an evaporation system. The evaporation system comprises an evaporation box body, an evaporation cavity and an avoiding cavity are arranged in the evaporation box body, the avoiding cavity is in communication with the evaporation cavity, a first moving assembly is arranged in the evaporation cavity and extends to the avoiding cavity, a second moving assembly is arranged in the evaporation cavity and extends to the avoiding cavity, a first evaporation source is arranged on the first moving assembly, the first moving assembly drives the first evaporation source to move between the evaporation cavity and the avoiding cavity, and a second evaporation source is arranged on the second moving assembly, the second moving assembly drives the second evaporation source to move between the evaporation cavity and the avoiding cavity. The evaporation box body of the application contains multiple evaporation sources, and the evaporation operation can be performed on the workpieces of different materials, so that the evaporation box body does not need to be additionally increased when multiple materials are evaporated in batches, and the evaporation cost is reduced.

Description

Technical Field

[0001] This application relates to the field of coating equipment technology, and more particularly to a vapor deposition system. Background Technology

[0002] When performing vapor deposition, inorganic or metallic materials that require high-temperature evaporation are treated with point-source array evaporation sources, while organic materials that require lower-temperature evaporation are treated with linear evaporation sources.

[0003] To improve the uniformity of film thickness after evaporation, point source array evaporation sources require a larger spacing between the substrate and the evaporation source compared to linear evaporation sources. Since the two types of evaporation sources require different spacings, different types of evaporation sources need to be in independent chambers. Otherwise, the evaporation sources will interfere with each other. Therefore, in related technologies, only one type of evaporation source is set in the chamber of the same evaporation chamber.

[0004] If only one evaporation source is set in the chamber of the same vapor deposition box, then when vapor deposition is performed on multiple materials and two evaporation sources are required, double the number of vapor deposition boxes are needed. This will result in a large number of vapor deposition boxes required and high processing costs when vapor deposition is performed on multiple materials in batches. Summary of the Invention

[0005] This application provides a vapor deposition system to solve the problems of large required vapor deposition chambers and high processing costs when performing batch vapor deposition of multiple materials.

[0006] To achieve the above objectives, this application provides the following technical solution:

[0007] The embodiments of this application provide a vapor deposition system, comprising:

[0008] The vapor deposition chamber is provided with a vapor deposition cavity and a clearance cavity, and the clearance cavity is connected to the vapor deposition cavity;

[0009] A first moving component is disposed within the vapor deposition chamber and extends into the clearance chamber;

[0010] A second moving component is disposed within the vapor deposition chamber and extends into the clearance chamber;

[0011] A first evaporation source is disposed on the first moving component, and the first moving component drives the first evaporation source to move between the evaporation chamber and the clearance chamber.

[0012] The second evaporation source is disposed on the second moving component, and the second moving component drives the second evaporation source to move between the evaporation chamber and the clearance chamber.

[0013] In one possible implementation, the first evaporation source and the second evaporation source are arranged vertically within the vapor deposition chamber.

[0014] In one possible implementation, the first evaporation source is a linear evaporation source, and the second evaporation source is a point source array evaporation source, with the linear evaporation source located above the point source array evaporation source.

[0015] In one possible implementation, the first moving component and / or the second moving component includes a slide rail and a slide plate. The slide rail is fixed to the inner wall of the vapor deposition chamber, and the slide plate is provided with a slider that slides with the slide rail. The first evaporation source and / or the second evaporation source are disposed on the slide plate.

[0016] In one possible implementation, a first isolator is also included, which is disposed inside the vapor deposition chamber;

[0017] The side wall of the vapor deposition chamber is provided with a slot that mates with the first isolation member, and the first isolation member is slidably disposed in the slot;

[0018] The first isolation member has an open state and a closed state. When the first isolation member is in the open state, it slides and is stored to the outside of the side wall, so that the vapor deposition cavity is connected to the clearance cavity.

[0019] When the first isolation member is in a closed state, it slides between the vapor deposition chamber and the clearance chamber to isolate the vapor deposition chamber from the clearance chamber.

[0020] In one possible implementation, a cooling section is provided on the side of the first isolator facing the vapor deposition chamber, and / or a heating section is provided on the side of the first isolator facing the clearance chamber.

[0021] In one possible implementation, a second isolator is also included, which is laterally slidably fitted into the vapor deposition chamber.

[0022] When the second isolator slides into the vapor deposition chamber, the second isolator divides the vapor deposition chamber into a first chamber and a second chamber arranged vertically. The first evaporation source is located in the first chamber, and the second evaporation source is located in the second chamber.

[0023] In one possible implementation, when the slide plate slides along the slide rail to the vapor deposition chamber, the slide plate laterally divides the vapor deposition chamber into a third chamber and a fourth chamber, with the first evaporation source located in the third chamber and the second evaporation source located in the fourth chamber.

[0024] In one possible implementation, a material transfer box is further included, which is connected to the vapor deposition box. The material transfer box has a material transfer cavity inside, which is connected to the vapor deposition cavity. A material transfer device is provided in the material transfer cavity, which is used to transfer the part to be vapor-deposited.

[0025] In one possible implementation, the material conveying device includes a conveyor roller assembly and a drive assembly;

[0026] The conveying roller assembly is arranged horizontally along the length of the material transfer cavity. The driving assembly is driven by the conveying roller assembly. The driving assembly is used to drive the conveying roller assembly to rotate. The conveying roller assembly is used to convey the workpiece to be vapor-deposited.

[0027] This application provides an embodiment of a vapor deposition system, comprising: a vapor deposition chamber containing a vapor deposition cavity and a clearance cavity connected to the vapor deposition cavity; a first moving component disposed within the vapor deposition cavity and extending into the clearance cavity; a second moving component disposed within the vapor deposition cavity and extending into the clearance cavity; a first evaporation source disposed on the first moving component, which drives the first evaporation source to move between the vapor deposition cavity and the clearance cavity; and a second evaporation source disposed on the second moving component, which drives the second evaporation source to move between the vapor deposition cavity and the clearance cavity. This application incorporates a movable first evaporation source and a second evaporation source within the evaporation chamber, dividing the chamber into an evaporation cavity and a clearance cavity. The evaporation source used can be moved into the evaporation cavity for evaporation, while the other evaporation source remains idle in the clearance cavity. When changing to a different material for the workpiece to be evaporated, the incompatible evaporation source is moved into the clearance cavity, and the compatible evaporation source is moved from the clearance cavity to the evaporation cavity to perform the evaporation operation. Since the evaporation chamber contains multiple evaporation sources, it can perform evaporation operations on workpieces of different materials. Therefore, for batch evaporation of multiple materials, no additional evaporation chamber is required, reducing evaporation costs. Attached Figure Description

[0028] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0029] Figure 1 Schematic diagram of the vapor deposition system provided in this embodiment Figure 1 ;

[0030] Figure 2 Schematic diagram of the vapor deposition system provided in this embodiment Figure 2 ;

[0031] Figure 3Schematic diagram of the vapor deposition system provided in this embodiment Figure 3 ;

[0032] Figure 4 Schematic diagram of the vapor deposition system provided in this embodiment Figure 4 ;

[0033] Figure 5 Schematic diagram of the vapor deposition system provided in this embodiment Figure 5 .

[0034] In the attached image:

[0035] 100 - Evaporation chamber; 110 - Evaporation cavity; 111 - First chamber; 112 - Second chamber; 113 - Third chamber; 114 - Fourth chamber; 120 - Clearance chamber; 130 - Side wall;

[0036] 200 - First moving component; 210 - Slide rail; 220 - Slide board;

[0037] 300 - Second moving component;

[0038] 400 - First evaporation source; 410 - Linear evaporation source;

[0039] 500 - Second evaporation source; 510 - Point source array evaporation source;

[0040] 600 - First isolation component;

[0041] 700 - Second isolation piece;

[0042] 800 - Material transfer box; 810 - Material transfer cavity; 820 - Material transfer device; 821 - Conveyor roller assembly;

[0043] 900-Support frame.

[0044] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0045] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0046] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0047] When performing vapor deposition, inorganic or metallic materials that require high-temperature evaporation are treated with point-source array evaporation sources, while organic materials that require lower-temperature evaporation are treated with linear evaporation sources.

[0048] To improve the uniformity of film thickness after evaporation, point source array evaporation sources require a larger spacing between the substrate and the evaporation source compared to linear evaporation sources. Since the two types of evaporation sources require different spacings, different types of evaporation sources need to be placed in independent chambers; otherwise, the evaporation sources will interfere with each other. Therefore, in related technologies, only one type of evaporation source is set in the chamber of the same evaporation chamber.

[0049] When vapor deposition equipment needs to change the vapor deposition material due to changes in device structure or other reasons, which in turn requires a change in the type of evaporation source, the relevant technologies and devices cannot flexibly adapt. For example, if it is necessary to replace the high-temperature vapor deposition material that originally used a point source array method with an organic material that uses a linear evaporation source, the method used in relevant technologies is to replace the entire vapor deposition chamber.

[0050] Therefore, since the chamber of the same vapor deposition box in the relevant technology is only equipped with one evaporation source, when vapor deposition is required for multiple materials and two evaporation sources are needed, double the number of vapor deposition boxes are required. This leads to a large number of vapor deposition boxes and high processing costs when vapor deposition is carried out in batches of multiple materials.

[0051] In view of this, embodiments of this application provide a vapor deposition system, comprising a vapor deposition chamber, wherein the vapor deposition chamber is provided with a vapor deposition cavity and a clearance cavity, the clearance cavity being connected to the vapor deposition cavity; a first moving component, wherein the first moving component is disposed within the vapor deposition cavity and extends into the clearance cavity; a second moving component, wherein the second moving component is disposed within the vapor deposition cavity and extends into the clearance cavity; a first evaporation source, wherein the first evaporation source is disposed on the first moving component, the first moving component driving the first evaporation source to move between the vapor deposition cavity and the clearance cavity; and a second evaporation source, wherein the second evaporation source is disposed on the second moving component, the second moving component driving the second evaporation source to move between the vapor deposition cavity and the clearance cavity. This application incorporates a movable first evaporation source and a second evaporation source within the evaporation chamber, dividing the chamber into an evaporation cavity and a clearance cavity. The evaporation source used can be moved into the evaporation cavity for evaporation, while the other evaporation source remains idle in the clearance cavity. When changing to a different material for the workpiece to be evaporated, the incompatible evaporation source is moved into the clearance cavity, and the compatible evaporation source is moved from the clearance cavity to the evaporation cavity to perform the evaporation operation. Since the evaporation chamber contains multiple evaporation sources, it can perform evaporation operations on workpieces of different materials. Therefore, for batch evaporation of multiple materials, no additional evaporation chamber is required, reducing evaporation costs.

[0052] The following describes an optional technical solution for a vapor deposition system according to this embodiment, with reference to the accompanying drawings.

[0053] like Figure 1 , Figure 2 and Figure 3 As shown, this embodiment provides a vapor deposition system, which includes:

[0054] The vapor deposition chamber 100 has a vapor deposition cavity 110 and a clearance cavity 120 inside, and the clearance cavity 120 is connected to the vapor deposition cavity 110.

[0055] The first moving component 200 is disposed within the vapor deposition chamber 110 and extends into the clearance chamber 120.

[0056] The second moving component 300 is disposed within the vapor deposition chamber 110 and extends into the clearance chamber 120.

[0057] The first evaporation source 400 is disposed on the first moving component 200, and the first moving component 200 drives the first evaporation source 400 to move between the evaporation chamber 110 and the avoidance chamber 120.

[0058] The second evaporation source 500 is disposed on the second moving component 300, and the second moving component 300 drives the second evaporation source 500 to move between the evaporation chamber 110 and the clearance chamber 120.

[0059] The vapor deposition chamber 100 serves as the main body for carrying and sealing the entire vapor deposition system. Its interior is divided into two parts: a vapor deposition chamber 110 and a clearance chamber 120. The vapor deposition chamber 110 is the working area for performing the vapor deposition process, while the clearance chamber 120 provides space for idle evaporation sources. The vapor deposition chamber 110 and the clearance chamber 120 are kept in communication to provide a path for the movement of the evaporation sources.

[0060] The first moving component 200 is arranged transversely between the evaporation chamber 110 and the clearance chamber 120, extending from the interior of the evaporation chamber 110 into the interior of the clearance chamber 120, forming a continuous moving structure. The second moving component 300 adopts the same arrangement as the first moving component 200, also spanning the evaporation chamber 110 and the clearance chamber 120 and extending therein, so that both evaporation sources can switch positions between the two chambers.

[0061] The first evaporation source 400 is fixedly installed on the supporting part of the first moving component 200. The first moving component 200 moves itself to drive the first evaporation source 400 to translate, allowing the first evaporation source 400 to switch between the working position of the vapor deposition chamber 110 and the idle position of the avoidance chamber 120. The second evaporation source 500 is fixedly installed on the supporting part of the second moving component 300. The second moving component 300 moves itself to drive the second evaporation source 500 to translate, allowing the second evaporation source 500 to similarly switch positions between the vapor deposition chamber 110 and the avoidance chamber 120. The two moving components operate independently without interfering with each other, and the position of the corresponding evaporation source can be controlled individually according to the vapor deposition process requirements.

[0062] When the vapor deposition system is working, the corresponding evaporation source is selected to perform the process according to the type of material to be vapor deposited. When the first evaporation source 400 needs to be used for vapor deposition, the first moving component 200 moves the first evaporation source 400 into the vapor deposition chamber 110, while the second moving component 300 moves the second evaporation source 500 into the clearance chamber 120, so that the second evaporation source 500 is idle and does not interfere with the vapor deposition process. When it is necessary to switch to the second evaporation source 500 for vapor deposition, the second moving component 300 moves the second evaporation source 500 into the vapor deposition chamber 110, while the first evaporation source 400 is moved into the clearance chamber 120, realizing a rapid switch of evaporation source type.

[0063] By integrating two independently movable evaporation sources within the same evaporation chamber 100, and coordinating the spatial layout of the evaporation chamber 110 and the clearance chamber 120, different types of evaporation sources can be switched without changing the chambers or disassembling the equipment, meeting the different evaporation requirements of organic and inorganic materials. This structure reduces the number of evaporation chambers 100 used, simplifies the overall equipment layout, lowers the equipment cost and floor space required for multi-material evaporation, shortens process changeover time, and improves production efficiency and equipment versatility.

[0064] Furthermore, it also includes a support frame 900, which is fixedly installed at the bottom of the vapor deposition chamber 100. The support frame 900 is used to provide stable support for the entire vapor deposition system, ensure the stability of the structure during equipment operation, and reserve space for inspection, maintenance, heat dissipation and ventilation.

[0065] See Figure 1 In some embodiments, the first evaporation source 400 and the second evaporation source 500 are arranged vertically within the vapor deposition chamber 110.

[0066] Both the first evaporation source 400 and the second evaporation source 500 are installed in the evaporation chamber 110 area inside the evaporation chamber 100. The first evaporation source 400 is located in the upper space of the evaporation chamber 110, and the second evaporation source 500 is located in the lower space of the evaporation chamber 110. The first evaporation source 400 and the second evaporation source 500 are arranged in layers along the vertical direction. The central axes of the two evaporation sources are parallel to each other and maintain a preset distance in the vertical direction. The working areas of the two evaporation sources do not overlap and can form independent evaporation working spaces inside the evaporation chamber 110.

[0067] By arranging the first evaporation source 400 and the second evaporation source 500 in an upper and lower layered manner, the vertical space inside the vapor deposition chamber 110 can be fully utilized, and the two sets of evaporation sources can avoid occupying each other's space in the horizontal direction, making the internal structure of the vapor deposition chamber 100 more compact.

[0068] Meanwhile, the layered arrangement can accommodate different requirements for the distance between the substrate and the evaporation source, satisfying the respective evaporation process conditions of organic and inorganic materials, and ensuring that both evaporation sources can achieve uniform film deposition when working independently. This layout effectively avoids mutual interference between the two evaporation sources during operation, improves evaporation accuracy and film quality, and achieves compatibility of two different types of evaporation sources within the same evaporation chamber 110.

[0069] See Figure 2 , Figure 3 Furthermore, the first evaporation source 400 is a linear evaporation source 410, and the second evaporation source 500 is a point source array evaporation source 510, with the linear evaporation source 410 located above the point source array evaporation source 510.

[0070] The linear evaporation source 410, serving as the first evaporation source 400, extends horizontally and is used to achieve continuous and uniform vapor deposition of organic materials. The point source array evaporation source 510, serving as the second evaporation source 500, consists of multiple independent evaporation unit arrays and is used to achieve high-temperature vapor deposition of inorganic or metallic materials. Since the point source array method requires a larger distance between the workpiece to be deposited and the evaporation source compared to the linear evaporation source 410, the linear evaporation source 410 is installed in the upper space of the vapor deposition chamber 110, and the point source array evaporation source 510 is installed in the lower space of the vapor deposition chamber 110. The linear evaporation source 410 and the point source array evaporation source 510 are arranged vertically in layers, maintaining sufficient spacing between them, and their working areas are independent of each other, without overlap or interference.

[0071] Arranging the linear evaporation source 410 above and the point source array evaporation source 510 below allows for matching the different process requirements of the substrate-source spacing for the two evaporation sources. The linear evaporation source 410 requires a smaller substrate-source spacing; its placement above allows it to be closer to the workpiece to be evaporated, ensuring uniformity in organic material deposition. The point source array evaporation source 510 requires a larger substrate-source spacing; its placement below satisfies the process requirements for film thickness uniformity. This layered structure allows for the simultaneous compatibility of two different types of evaporation sources within the same deposition chamber 110. Different materials can be deposited without separate chambers, reducing the number of devices, lowering equipment costs, and simultaneously improving the versatility and production efficiency of the deposition system.

[0072] Specifically, Figure 2 The point source array evaporator 510 is located in the evaporation chamber 110, and the linear evaporator 410 is located in the clearance chamber 120. This is the state where the point source array evaporator 510 is performing evaporation, which is the state used for evaporation of inorganic or metallic materials requiring high-temperature evaporation. When evaporating organic materials requiring lower-temperature evaporation, the linear evaporator 410 must be used. Figure 3 As shown, the linear evaporation source 410 is located in the evaporation chamber 110, and the point source array evaporation source 510 is located in the clearance chamber 120. The linear evaporation source 410 can perform evaporation operations normally.

[0073] See also Figure 1 In some embodiments, the first moving component 200 and / or the second moving component 300 include a slide rail 210 and a slide plate 220. The slide rail 210 is fixed on the inner side wall of the vapor deposition chamber 100, and the slide plate 220 is provided with a slider that slides in cooperation with the slide rail 210. The first evaporation source 400 and / or the second evaporation source 500 are disposed on the slide plate 220.

[0074] The first moving component 200 and the second moving component 300 adopt the same structure, both including a slide rail 210, a slider, and a sliding plate 220. The slide rail 210 is fixedly installed horizontally on the inner wall of the vapor deposition chamber 100, extending from the inside of the vapor deposition chamber 110 to the inside of the clearance chamber 120, forming a continuous sliding track. The slider is slidably mounted on the slide rail 210, and the sliding plate 220 is fixedly connected above the slider. The slider drives the sliding plate 220 to move smoothly along the length of the slide rail 210. The first evaporation source 400 is fixedly installed on the sliding plate 220 of the first moving component 200, and the second evaporation source 500 is fixedly installed on the sliding plate 220 of the second moving component 300. During the movement, the sliding plate 220 synchronously drives the corresponding evaporation source to complete the position switching.

[0075] The slide rail 210 and the slider form a stable sliding fit structure, ensuring that the slide plate 220 does not deviate or wobble during movement, thus improving the smoothness of the evaporation source movement. As a load-bearing structure for the evaporation source, the slide plate 220 stably supports the evaporation source's reciprocating movement between the evaporation chamber 110 and the clearance chamber 120, meeting the requirements for rapid switching of the evaporation source. This sliding structure is simple, reliable, and moves smoothly, enabling long-term stable operation in a vacuum environment without easily jamming, and is also easy to assemble and maintain. Through independently set first moving component 200 and second moving component 300, the movement states of the first evaporation source 400 and the second evaporation source 500 can be controlled respectively, achieving independent switching of the two evaporation sources without interference, ensuring the operational stability and process flexibility of the evaporation system.

[0076] See Figure 3 In some other embodiments, a first isolation element 600 is also included, which is disposed within the vapor deposition chamber 100.

[0077] A slot is provided on the side wall 130 of the vapor deposition chamber 100 to cooperate with the first isolation member 600, and the first isolation member 600 is slidably disposed in the slot.

[0078] The first isolation member 600 has an open state and a closed state. When the first isolation member 600 is in the open state, it slides and is stored on the outside of the side wall 130, so that the vapor deposition cavity 110 is connected to the clearance cavity 120.

[0079] When the first isolation member 600 is in the closed state, it slides between the vapor deposition chamber 110 and the clearance chamber 120 to isolate the vapor deposition chamber 110 and the clearance chamber 120.

[0080] The first isolation element 600 is a plate-like structure. It is installed inside the vapor deposition chamber 100 and located at the connection point between the vapor deposition chamber 110 and the clearance chamber 120. A slot is machined on the side wall 130 of the vapor deposition chamber 100 corresponding to the connection point. The shape of the slot matches the shape of the first isolation element 600, and the first isolation element 600 is installed inside the slot in a sliding fit. The first isolation element 600 can reciprocate linearly along the opening direction of the slot, switching between open and closed states during the movement. When the first isolation element 600 is in the open state, it slides outward along the slot and is stored outside the side wall 130, maintaining unobstructed access between the vapor deposition chamber 110 and the clearance chamber 120. When the first isolation element 600 is in the closed state, it slides inward along the slot and extends between the vapor deposition chamber 110 and the clearance chamber 120, completely separating the two chambers.

[0081] The first isolator 600 switches between opening and closing by sliding, which is simple to operate and not prone to failure, and can work stably in a vacuum environment.

[0082] In the open state, the vapor deposition chamber 110 and the clearance chamber 120 remain connected, providing a smooth path for the first evaporation source 400 and the second evaporation source 500 to move between the two chambers, ensuring that the evaporation source can smoothly complete the position switching.

[0083] In the closed state, the first isolator 600 completely separates the evaporation chamber 110 from the clearance chamber 120, physically isolating the idle evaporation source inside the clearance chamber 120 from the working area inside the evaporation chamber 110. This prevents the heat and volatile substances generated by the idle evaporation source from interfering with the ongoing evaporation process, ensuring the stability of the evaporation process and the uniformity of the film layer. The slot structure guides and limits the first isolator 600, preventing it from shifting or jamming during sliding, thus improving the reliability of the isolation action.

[0084] In some embodiments, a cooling section is provided on the side of the first isolation member 600 facing the vapor deposition chamber 110, and / or a heating section is provided on the side of the first isolation member 600 facing the clearance chamber 120.

[0085] The cooling unit is directly installed on the surface of the first isolation member 600 facing the evaporation chamber 110, and is used to regulate the temperature of the internal environment of the evaporation chamber 110. The heating unit is directly installed on the surface of the first isolation member 600 facing the clearance chamber 120, and is used to regulate the temperature of the internal environment of the clearance chamber 120. The cooling unit and the heating unit can be set up separately or simultaneously according to actual process requirements. The cooling unit and the heating unit work independently and do not affect each other.

[0086] The cooling section cools the interior of the vapor deposition chamber 110, absorbing excess heat and preventing excessively high temperatures that could affect the quality of the workpiece and the uniformity of the film. The heating section heats and maintains the interior of the clearance chamber 120, keeping the temperature of the idle evaporation source within the clearance chamber 120 stable and preventing material solidification or abnormal conditions due to temperature drops. By providing cooling and heating sections on both sides of the first isolation member 600, the temperature of the two chambers can be controlled separately while isolating the vapor deposition chamber 110 and the clearance chamber 120, ensuring each chamber maintains its required temperature.

[0087] See Figure 4 In some other embodiments, a second spacer 700 is also included, which is laterally slidably fitted into the vapor deposition chamber 100.

[0088] When the second isolator 700 slides to the vapor deposition chamber 110, the second isolator 700 divides the vapor deposition chamber 110 into a first chamber 111 and a second chamber 112 arranged vertically. The first evaporation source 400 is located in the first chamber 111, and the second evaporation source 500 is located in the second chamber 112.

[0089] The second isolator 700 is a plate-like structure that is slidably mounted inside the vapor deposition chamber 100, allowing it to move linearly within the chamber 100 in a horizontal direction. After sliding into the vapor deposition chamber 110, the second isolator 700 is positioned between the first evaporation source 400 and the second evaporation source 500, vertically dividing the entire vapor deposition chamber 110 into an independent upper space and a lower space. The upper space is the first chamber 111, and the lower space is the second chamber 112. The first evaporation source 400 is confined within the first chamber 111, and the second evaporation source 500 is confined within the second chamber 112. The two evaporation sources are located in independent, enclosed spaces, with their spatial positions not overlapping or interfering with each other.

[0090] The second isolator 700 slides laterally into the working position, quickly dividing the vapor deposition chamber 110 into two independent chambers, a first chamber 111 and a second chamber 112, allowing the first evaporation source 400 and the second evaporation source 500 to operate independently within their respective chambers. This structure effectively avoids problems such as heat interference and mutual contamination from material volatilization between the first evaporation source 400 and the second evaporation source 500 during operation, ensuring that the vapor deposition process parameters corresponding to the two evaporation sources are independent and do not affect each other.

[0091] The upper and lower partition layout can accommodate the different substrate spacing requirements of the linear evaporation source 410 and the second evaporation source 500. The process conditions of the two evaporation sources can be met within the same evaporation chamber 110, improving the integration and process stability of the evaporation system. Dual evaporation source compatible operation can be achieved without adding an independent chamber, reducing the overall equipment cost and space occupation.

[0092] See Figure 5 In some other possible embodiments, when the slide plate 220 slides along the slide rail 210 to the vapor deposition chamber 110, the slide plate 220 divides the vapor deposition chamber 110 laterally into a third chamber 113 and a fourth chamber 114. The first evaporation source 400 is disposed in the third chamber 113 and the second evaporation source 500 is disposed in the fourth chamber 114.

[0093] Supported and guided by the slide rail 210, the slide plate 220 slides horizontally and enters the designated working position inside the vapor deposition chamber 110. After entering the vapor deposition chamber 110, the slide plate 220 spans the entire internal space of the vapor deposition chamber 110 in a horizontal arrangement, completely dividing the vapor deposition chamber 110 into two independent enclosed spaces. The enclosed space above the slide plate 220 is the third chamber 113, and the first evaporation source 400 is fixedly installed on the upper surface of the slide plate 220 and located inside the third chamber 113. The enclosed space below the slide plate 220 is the fourth chamber 114, and the second evaporation source 500 is located inside the fourth chamber 114. The edge of the slide plate 220 fits tightly with the inner wall of the vapor deposition chamber 100, ensuring a stable spatial isolation between the third chamber 113 and the fourth chamber 114, preventing gas crossflow or heat exchange.

[0094] The slide plate 220 not only serves as the supporting structure for the first evaporation source 400, but also functions as a space divider. After the first evaporation source 400 enters the working position of the vapor deposition chamber 110, it automatically divides the chamber into two independent chambers: a third chamber 113 and a fourth chamber 114. The third chamber 113 provides an independent working space for the first evaporation source 400, and the fourth chamber 114 provides an independent working space for the second evaporation source 500. The two evaporation sources operate within their respective chambers, preventing heat interference and cross-contamination from material volatilization. This structure achieves an integrated design of supporting and isolating functions, simplifying the internal structure of the vapor deposition chamber 100, reducing the need for additional isolation components, improving space utilization and equipment reliability, while ensuring that the process parameters of the two evaporation sources are independent, meeting the vapor deposition requirements of different materials.

[0095] See Figure 1In some embodiments, a material transfer box 800 is also included, which is connected to the vapor deposition box 100. The material transfer box 800 is provided with a material transfer cavity 810, which is connected to the vapor deposition cavity 110. A material transfer device 820 is provided in the material transfer cavity 810, which is used to transfer the part to be vapor deposited.

[0096] The material transfer box 800 is fixedly connected to the top of the vapor deposition box 100, maintaining a stable assembly relationship with it. A material transfer cavity 810 is formed inside the material transfer box 800, which is in communication with the vapor deposition cavity 110 inside the vapor deposition box 100. This ensures that the workpiece to be vapor-deposited passes over the top of the vapor deposition cavity 110 during its transfer through the material transfer cavity 810 and is vapor-deposited by it. A material transfer device 820 is installed inside the material transfer cavity 810, arranged along its length, and is used to carry and drive the workpiece to be vapor-deposited to move horizontally, achieving continuous and stable transport of the workpiece.

[0097] The material transfer chamber 800 and the vapor deposition chamber 100 are interconnected, forming a continuous working cavity to ensure that the parts to be vapor-deposited remain in a stable, sealed environment throughout the transfer and vapor deposition process. The material transfer device 820 continuously feeds the parts to be vapor-deposited into the vapor deposition area at the top of the vapor deposition chamber 110, and then sends them out after vapor deposition is completed, realizing automated continuous vapor deposition operations. This structure integrates material transfer functions into the vapor deposition system, eliminating the need for additional transfer equipment, simplifying the overall equipment layout, and improving the continuity and automation of the vapor deposition operation.

[0098] See Figure 1 and Figure 2 Specifically, the material conveying device 820 includes a conveying roller assembly 821 and a drive assembly.

[0099] The conveyor roller assembly 821 is arranged horizontally along the length of the material conveying cavity 810. The drive assembly is in transmission cooperation with the conveyor roller assembly 821. The drive assembly is used to drive the conveyor roller assembly 821 to rotate. The conveyor roller assembly 821 is used to convey the workpiece to be vaporized.

[0100] The conveyor roller assembly 821 consists of multiple parallel rollers arranged horizontally along the length of the material conveying chamber 810, forming a continuous conveying platform. The drive assembly is mounted on the material conveying box 800 and forms a transmission connection with the conveyor roller assembly 821, providing stable power for the rotation of the rollers.

[0101] The drive assembly drives the conveyor roller assembly 821 to rotate at a uniform speed, so that the workpiece to be vaporized passes smoothly through the working area above the vaporization chamber 110, realizing continuous conveying and online vaporization. This not only ensures the stability of the transmission process, but also provides reliable position and speed conditions for uniform film deposition.

[0102] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0103] In the description of this invention, it should be understood that the terms “comprising” and “having” as used herein, and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0104] Unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can be a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features.

[0105] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A vapor deposition system, characterized in that, include: The vapor deposition chamber is provided with a vapor deposition cavity and a clearance cavity, and the clearance cavity is connected to the vapor deposition cavity; A first moving component is disposed within the vapor deposition chamber and extends into the clearance chamber; A second moving component is disposed within the vapor deposition chamber and extends into the clearance chamber; A first evaporation source is disposed on the first moving component, and the first moving component drives the first evaporation source to move between the evaporation chamber and the clearance chamber. The second evaporation source is disposed on the second moving component, and the second moving component drives the second evaporation source to move between the evaporation chamber and the clearance chamber.

2. The vapor deposition system according to claim 1, characterized in that, The first evaporation source and the second evaporation source are arranged vertically within the vapor deposition chamber.

3. The vapor deposition system according to claim 2, characterized in that, The first evaporation source is a linear evaporation source, and the second evaporation source is a point source array evaporation source, with the linear evaporation source located above the point source array evaporation source.

4. The vapor deposition system according to claim 1, characterized in that, The first moving component and / or the second moving component includes a slide rail and a slide plate. The slide rail is fixed on the inner side wall of the vapor deposition chamber, and the slide plate is provided with a slider that slides with the slide rail. The first evaporation source and / or the second evaporation source are disposed on the slide plate.

5. The vapor deposition system according to any one of claims 1 to 4, characterized in that, It also includes a first isolation element, which is disposed inside the vapor deposition chamber; The side wall of the vapor deposition chamber is provided with a slot that mates with the first isolation member, and the first isolation member is slidably disposed in the slot; The first isolation member has an open state and a closed state. When the first isolation member is in the open state, it slides and is stored to the outside of the side wall, so that the vapor deposition cavity is connected to the clearance cavity. When the first isolation member is in a closed state, it slides between the vapor deposition chamber and the clearance chamber to isolate the vapor deposition chamber from the clearance chamber.

6. The vapor deposition system according to claim 5, characterized in that, A cooling section is provided on the side of the first isolation member facing the vapor deposition chamber, and / or a heating section is provided on the side of the first isolation member facing the clearance chamber.

7. The vapor deposition system according to any one of claims 1 to 4, characterized in that, It also includes a second isolation component, which is slidably assembled into the vapor deposition chamber in a transverse direction; When the second isolator slides into the vapor deposition chamber, the second isolator divides the vapor deposition chamber into a first chamber and a second chamber arranged vertically. The first evaporation source is located in the first chamber, and the second evaporation source is located in the second chamber.

8. The vapor deposition system according to claim 4, characterized in that, When the slide plate slides along the slide rail to the vapor deposition chamber, the slide plate divides the vapor deposition chamber laterally into a third chamber and a fourth chamber. The first evaporation source is located in the third chamber, and the second evaporation source is located in the fourth chamber.

9. The vapor deposition system according to any one of claims 1 to 4, characterized in that, It also includes a material transfer box, which is connected to the vapor deposition box. The material transfer box has a material transfer cavity inside, which is connected to the vapor deposition cavity. A material transfer device is installed in the material transfer cavity, which is used to transfer the part to be vapor deposited.

10. The vapor deposition system according to claim 9, characterized in that, The material conveying device includes a conveyor roller assembly and a drive assembly; The conveying roller assembly is arranged horizontally along the length of the material transfer cavity. The driving assembly is driven by the conveying roller assembly. The driving assembly is used to drive the conveying roller assembly to rotate. The conveying roller assembly is used to convey the workpiece to be vapor-deposited.

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