A quick detection device and method for flatness and position of a MOS surface of a heat sink

Abstract

The application provides a kind of quick detection device and method of radiator MOS surface flatness and position degree, including rack, X-axis movement module, Z-axis movement module, Y-axis movement module, detection platform rotation module, positioning tool, compression cylinder, 3D profile scanner, computer host computer and three-color lamp.Positioning tool is equipped with reference positioning surface, reference elastic taper positioning pin and position degree evaluation reference surface, tool and rotation module are realized quick change by positioning pin and positioning sleeve cooperation.Detection, X-axis movement module moves product to detection position, Z-axis and Y-axis movement module moves scanner to detection position above, rotation module rotates 90° and reverse 180° in turn, scanner scans two sides of product MOS surface and reference surface synchronously and returns data, host computer calculates position degree and flatness according to scanning data, and compares with preset standard value, and determination result is output through three-color lamp.The application greatly improves the efficiency of detecting single product, and is simple to operate, quick to change, and data traceable.

Description

Technical Field

[0001] This invention belongs to the field of precision dimension testing technology for heat sinks, specifically relating to a rapid testing device and method for the flatness and position of the MOS surface of a heat sink. Background Technology

[0002] In the machining and manufacturing industry, the geometric dimension inspection of radiators is a crucial step in ensuring radiator quality. Position tolerance and flatness are important geometric tolerance items in the GD&T (Geometric Dimensioning and Tolerance) system, directly affecting the assembly performance of the radiator. As the manufacturing industry's quality requirements for radiators continue to increase, full inspection before shipment has become a basic requirement for more and more customers.

[0003] Currently, the industry commonly uses coordinate measuring machines (CMMs) to measure the position and flatness of the MOS surfaces on both sides of a heatsink. The basic operating procedure is as follows: the heatsink is fixed on the CMM, coordinate data of the measured surface is collected point by point using a contact probe, and then the position and flatness values ​​are calculated by software.

[0004] However, this existing technology has the following obvious drawbacks:

[0005] (1) Extremely low detection efficiency: The coordinate measuring machine adopts a point-to-point contact acquisition method. Approximately 140 measurement points need to be taken on one side of the MOS surface of a single heat sink. Each measurement point takes about 2 seconds. It takes about 9 minutes to take all the MOS surfaces on both sides. In addition, the manual operation of the coordinate measuring machine to establish the coordinate system, find the reference, and the idle running time of the coordinate measuring machine, it takes 12-15 minutes to measure one heat sink, which cannot meet the production rhythm requirements of batch full inspection.

[0006] (2) Inability to achieve full inspection: Due to the limitation of testing efficiency, enterprises can only adopt the sampling inspection method, which poses a risk of non-conforming products being released, making it difficult to meet the customer's requirement for full inspection before delivery.

[0007] (3) High requirements for operators: Coordinate measurement requires professional technicians to program and operate, and the model change and debugging are complicated, which requires a high level of technical skills from the personnel.

[0008] (4) High equipment cost and complex maintenance: The coordinate measuring machine is expensive and requires a constant temperature and humidity measurement environment, resulting in high maintenance costs. Summary of the Invention

[0009] In view of the problems of low detection efficiency, inability to meet full inspection requirements, complex operation and high equipment cost of the above-mentioned existing technologies, the present invention provides a rapid detection device and method for the flatness and position of the MOS surface of a heat sink.

[0010] This invention addresses the shortcomings of existing coordinate measuring machines (CMMs) which are inefficient and unable to meet full inspection requirements. It provides a rapid detection device and method for the flatness and position of the MOS surface of a heat sink. This solution can reduce the inspection time for a single component from 12-15 minutes to 50-60 seconds, enabling full inspection and shipment of heat sinks. It also reduces the technical requirements for operators and supports rapid changeover between different heat sink models.

[0011] The present invention achieves the above-mentioned technical objectives through the following technical means.

[0012] A rapid detection device for the flatness and position of a heat sink MOS surface includes a frame, an X-axis moving module, a detection platform rotating module, a Z-axis moving module, a Y-axis moving module, a positioning fixture, a clamping cylinder, a 3D contour scanner, a host computer, and a tri-color light.

[0013] The X-axis moving module is mounted on the frame;

[0014] The Z-axis moving module is mounted on the frame, and the Y-axis moving module is mounted on the Z-axis moving module;

[0015] The rotating module of the detection platform is mounted on the X-axis moving module and can move along the X-axis direction under the drive of the X-axis moving module.

[0016] The positioning fixture is mounted on the rotating module of the testing platform and is used to position the heat sink under test. The upper surface of the positioning fixture is provided with a reference positioning surface A, which is used to mate with the reference surface A of the heat sink under test. The positioning fixture also has upwardly protruding reference elastic tapered positioning pins B and C, which are located on opposite sides of the reference positioning surface A and are used to mate with the reference holes B and C of the heat sink under test for positioning. The positioning fixture also has a positional accuracy evaluation reference surface, which is located in the edge area of ​​the positioning fixture and is set at a predetermined angle to the reference positioning surface A.

[0017] The clamping cylinder is mounted on the frame and is used to press and clamp the A reference surface of the radiator under test against the A reference positioning surface.

[0018] The 3D contour scanner is mounted on the Y-axis moving module and can move up and down along the Z-axis direction under the drive of the Z-axis moving module and move along the Y-axis direction under the drive of the Y-axis moving module. The scanning direction of the 3D contour scanner is towards the location of the positioning fixture and is used to scan the MOS surface and the position evaluation reference surface of the heat sink under test.

[0019] The host computer is communicatively connected to the X-axis moving module, Z-axis moving module, Y-axis moving module, detection platform rotation module, clamping cylinder, and 3D contour scanner. It sends control commands to these modules to control their movement along predetermined trajectories and to control the clamping cylinder to press or release. The host computer is also communicatively connected to the 3D contour scanner, sending scan trigger signals and receiving scan data from the scanner. Based on the received scan data, the host computer calculates position and flatness. Furthermore, it compares the calculated position and flatness with preset standard values ​​and generates pass / fail indication signals based on the comparison results.

[0020] The tri-color light is installed on the top of the frame and is connected to the host computer for outputting detection result judgment indications.

[0021] The above solution also includes a start button and an emergency stop button; the start button and the emergency stop button are respectively installed on the front side of the rack, and the start button and the emergency stop button are respectively connected to the host computer; the start button is used to trigger the automatic operation of the equipment, and the emergency stop button is used to stop the equipment in an emergency.

[0022] In the above scheme, a positioning sleeve is provided at the bottom of the positioning fixture, and a positioning pin is correspondingly provided on the rotating module of the detection platform. The positioning pin cooperates with the positioning sleeve to achieve precise positioning of the positioning fixture and the rotating module of the detection platform.

[0023] In the above scheme, the 3D contour scanner is a laser triangulation contour scanner with a Z-axis height repeatability of ≤1μm, an XY plane repeatability of ≤3μm, a laser output power of 10mW, and a fastest scanning cycle of ≤0.2 seconds / frame snapshot.

[0024] The above solution also includes a buzzer; the buzzer is installed on the rack and is communicatively connected to the host computer, used to receive alarm control signals output by the host computer and emit an audible alarm.

[0025] A detection method using a rapid detection device for the planarity and position of the MOS surface of the heat sink includes the following steps:

[0026] S1. Manual loading: The heat sink to be tested is manually placed onto the positioning fixture;

[0027] S2, Pressing with clamping cylinder: The clamping cylinder is activated to press the A reference surface of the heat sink under test against the A reference positioning surface of the positioning fixture. At the same time, the B reference elastic tapered positioning pin and the C reference elastic tapered positioning pin are inserted into the B reference hole and C reference hole of the heat sink under test to achieve precise positioning.

[0028] S3. Movement and Rotation: The X-axis movement module moves the heat sink under test to the detection position, the Z-axis movement module and the Y-axis movement module drive the 3D contour scanner to move above the detection position, and at the same time the detection platform rotation module drives the positioning fixture and the heat sink under test to rotate 90° so that the first MOS surface faces the 3D contour scanner.

[0029] S4. Scan the first MOS surface: The 3D contour scanner scans the first MOS surface, obtains the height data of the surface, and transmits the obtained height data back to the computer host computer.

[0030] S5. Reverse rotation: The detection platform rotation module drives the positioning fixture and the heat sink under test to rotate 180° in the opposite direction, so that the second MOS surface faces the 3D contour scanner.

[0031] S6. Scan the second MOS surface: The 3D contour scanner scans the second MOS surface, obtains the height data of the surface, and transmits the obtained height data back to the computer host computer.

[0032] S7. Reset and release: After the test is completed, the X-axis moving module, Z-axis moving module, Y-axis moving module and the test platform rotating module return to the starting position, and the clamping cylinder is released;

[0033] S8. Automatic Judgment and Output: The host computer automatically calculates the position and flatness based on the returned scan data, and compares the calculated position and flatness with the preset standard values ​​respectively. If they are qualified, a green light control signal is output to the tri-color light; if they are not qualified, a red light control signal is output to the tri-color light and the buzzer alarm is activated.

[0034] S9. Manual unloading: The tested radiator is manually removed to complete the test.

[0035] In the above scheme, in steps S4 and S6, the 3D contour scanner scans all measurement points on the MOS surface to obtain the height data H1~H of each measurement point. nIn step S8, the method for calculating the position degree is as follows: taking the theoretical reference plane formed by the 3D contour scanner scanning the position degree evaluation reference plane as the reference plane height H0, and taking the point with the largest height difference relative to the reference plane among all measurement points on the MOS surface, the position degree = 2 × Max(|H1–H0|,|H2–H0|,...,|H n –H0|).

[0036] In the above scheme, in steps S4 and S6, the 3D contour scanner scans all measurement points on the MOS surface to obtain the height data of each measurement point; in step S8, the flatness is calculated as follows: Flatness = H max -H min H max H is the height of the highest point among all measurement points on the MOS surface. min The height is the lowest point among all measurement points on the MOS surface.

[0037] Compared with the prior art, the beneficial effects of the present invention are:

[0038] 1. This invention uses an X-axis moving module to automatically move the heatsink under test to the detection position, while the Z-axis and Y-axis moving modules move the 3D contour scanner to the top of the detection position. The detection platform rotation module automatically rotates and switches between the two MOS surfaces, achieving continuous automatic scanning of both MOS surfaces. Compared to point-to-point contact measurement using a three-coordinate measuring machine, the single-piece inspection time is significantly reduced to 50-60 seconds, meeting the production rhythm requirements for batch full inspection. The 3D contour scanner synchronously scans the MOS surface and the position evaluation reference surface, calculating position and flatness by acquiring height difference data. Non-contact scanning effectively avoids the force deformation errors that may occur with contact measurement, ensuring accurate and reliable measurement data. Automatic operation control of the equipment is achieved via a computer. After being triggered by the start button, the equipment automatically completes the detection, calculation, and judgment according to a predetermined program. Ordinary employees can operate the equipment after simple training, without the need for specialized technicians. The detection results are visually displayed through different colored lights: green for qualified and red for unqualified. On-site operators can obtain the judgment results without checking the computer.

[0039] 2. This invention is equipped with an emergency stop button, which can immediately stop the equipment in case of abnormal operation or emergency, ensuring operational safety.

[0040] 3. This invention uses a buzzer to sound an alarm when a product is defective, providing an auditory warning to the operator and preventing them from missing defective products due to their eyes not being focused on the tri-color light, thus ensuring that defective products are detected and handled in a timely manner.

[0041] 4. The positioning fixture of the present invention is provided with a positioning sleeve at the bottom and a corresponding positioning pin is provided on the rotating module of the detection platform. The positioning pin and the positioning sleeve cooperate to achieve rapid and accurate positioning of the fixture. The positioning accuracy can be guaranteed without recalibration after different fixtures are replaced.

[0042] 5. The 3D contour scanner used in this invention is a laser triangulation contour scanner, with a Z-axis height repeatability of ≤1μm and an XY plane repeatability of ≤3μm, which can ensure the measurement accuracy of position and flatness; the fastest scanning cycle is ≤0.2 seconds / frame snapshot, providing hardware guarantee for achieving rapid detection.

[0043] 6. The detection method of this invention automatically controls the clamping cylinder to clamp the material after manual loading, the X-axis moving module to transfer the material, the Z-axis moving module and the Y-axis moving module to drive the scanner to position the material, the detection platform rotating module to switch rotation, the 3D contour scanner to scan, the data to be transmitted back and calculated and judged, and the three-color light to output the results, forming a complete automated detection closed loop process. The detection time for a single piece is only 50-60 seconds, realizing efficient automated detection of the position and flatness of the MOS surface of the heat sink.

[0044] 7. This invention uses the theoretical reference plane formed by the position evaluation reference plane of the 3D contour scanner as the reference plane height H0, scans all measurement points on the MOS surface, and selects the point with the largest height difference relative to the reference plane, according to the position degree = 2×Max(|H1–H0|,|H2–H0|,...,|H n –H0|) calculation, all scan points participate in the evaluation to ensure the accuracy and reliability of the calculation results.

[0045] 8. This invention uses a 3D contour scanner to scan all measurement points on the MOS surface, and selects the highest point H among all measurement points. max With the lowest point H min Flatness = H max -H min The calculation involves all scan points in the evaluation to ensure the accuracy and reliability of the flatness calculation results. Attached Figure Description

[0046] Figure 1 This is a schematic diagram of the overall structure of a rapid detection device for the flatness and position of a heat sink MOS surface according to an embodiment of the present invention.

[0047] Figure 2 This is a schematic diagram of a positioning tooling structure according to an embodiment of the present invention.

[0048] Figure 3 This is a schematic diagram illustrating the engagement of the positioning fixture and positioning sleeve according to an embodiment of the present invention. Figure 1 .

[0049] Figure 4This is a schematic diagram illustrating the engagement of the positioning fixture and positioning sleeve according to an embodiment of the present invention. Figure 2 .

[0050] Figure 5 This is a schematic diagram of a heat sink under test according to an embodiment of the present invention, wherein... Figure 5 (A) is the test image. Figure 5 (B) is a bottom view.

[0051] Figure 6 This is a schematic diagram of a rapid detection process for the flatness and position of the heat sink MOS surface according to an embodiment of the present invention.

[0052] In the diagram, 100. Frame; 110. X-axis moving module; 111. Z-axis moving module; 112. Y-axis moving module; 120. Detection platform rotation module; 200. Positioning fixture; 211. A-datum positioning surface; 212. B-datum elastic taper positioning pin; 213. C-datum elastic taper positioning pin; 214. Position evaluation datum surface; 215. Positioning sleeve; 300. 3D contour scanner; 310. Clamping cylinder; 400. Host computer; 410. Positioning pin; 420. Tri-color light; 500. MOS surface; 600. Heat sink under test; 700. Emergency stop button; 800. Start button. Detailed Implementation

[0053] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0054] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "front," "rear," "left," "right," "upper," "lower," "axial," "radial," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0055] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0056] Figure 1-5 The image shows a preferred embodiment of the rapid detection device for the flatness and position of the heat sink MOS surface according to the present invention. The rapid detection device for the flatness and position of the heat sink MOS surface includes a frame 100, an X-axis moving module 110, a Z-axis moving module 111, a Y-axis moving module 112, a detection platform rotation module 120, a positioning fixture 200, a clamping cylinder 310, a 3D contour scanner 300, a host computer 400, a tri-color light 420, and a buzzer.

[0057] The X-axis moving module 110 is mounted on the frame 100 and is used to move the heat sink 600 under test from the upper and lower material positions to the detection position below the 3D contour scanner.

[0058] The Z-axis moving module 111 is mounted on the frame 100, and the Y-axis moving module 112 is mounted on the Z-axis moving module 111;

[0059] The detection platform rotation module 120 is mounted on the X-axis moving module 110 and can move along the X-axis direction under the drive of the X-axis moving module 110. It is used to drive the tooling and the heat sink under test 600 to rotate, so as to realize the switching measurement of the MOS surfaces on both sides of the heat sink.

[0060] like Figure 2 As shown, the positioning fixture 200 is mounted on the rotating module 120 of the testing platform and is used to position the heat sink 600 under test. The upper surface of the positioning fixture 200 is provided with an A-reference positioning surface 211, which is used to mate with the A-reference surface of the heat sink 600 under test. The positioning fixture 200 is also provided with upwardly protruding B-reference elastic tapered positioning pins 212 and C-reference elastic tapered positioning pins 213, which are located on opposite sides of the A-reference positioning surface 211 and are used to engage with the B-reference holes and C-reference holes of the heat sink 600 under test for positioning. The positioning fixture 200 is also provided with a positional evaluation reference surface 214, which is located in the edge region of the positioning fixture 200 and is set at a predetermined angle to the A-reference positioning surface 211.

[0061] The clamping cylinder 310 is mounted on the frame 100 and is used to press the A reference surface of the radiator under test 600 against the A reference positioning surface 211.

[0062] The 3D contour scanner 300 is mounted on the Y-axis moving module 112 and can move up and down along the Z-axis direction under the drive of the Z-axis moving module 111 and move along the Y-axis direction under the drive of the Y-axis moving module 112. The scanning direction of the 3D contour scanner 300 is towards the position of the positioning fixture 200, and is used to scan the MOS surface 500 of the heat sink 600 under test and the position evaluation reference surface 214 to obtain height difference data.

[0063] The host computer 400 is communicatively connected to the X-axis moving module 110, Z-axis moving module 111, Y-axis moving module 112, detection platform rotation module 120, clamping cylinder 310, and 3D contour scanner 300, respectively. It sends control commands to the X-axis moving module 110, Z-axis moving module 111, Y-axis moving module 112, detection platform rotation module 120, and clamping cylinder 310 to control these components. The computer 400 moves along a predetermined trajectory and controls the clamping cylinder 310 to clamp or release; the computer host computer 400 is also communicatively connected to the 3D contour scanner 300, sending a scan trigger signal to the 3D contour scanner 300 and receiving the scan data returned by the 3D contour scanner 300; the computer host computer 400 calculates the position and flatness based on the received scan data; the computer host computer 400 is also used to compare the calculated position and flatness with preset standard values ​​respectively, and generate a qualified or unqualified judgment indication signal based on the comparison result;

[0064] The tri-color light 420 and buzzer are installed on the top of the frame 100. The tri-color light 420 is communicatively connected to the host computer 400 and is used to output the test result judgment indication. A green light indicates a qualified result, and a red light and buzzer alarm indicate a failed result. This invention combines the tri-color light 420 and the buzzer to simultaneously trigger a light warning and an audible alarm when a test fails, forming a dual visual and auditory alarm mechanism. Even in noisy environments or when the operator's line of sight is temporarily off the equipment, abnormal information can be obtained through at least one of sound or light, effectively reducing the risk of defective products being released.

[0065] The rapid detection device for the flatness and position of the MOSFET surface of the heat sink also includes a start button 800 and an emergency stop button 700. The start button 800 and the emergency stop button 700 are respectively installed on the front side of the frame 100 and are respectively connected to the host computer 400. The start button 800 is used to trigger the automatic operation of the equipment after manual loading is completed and to start the detection process. The emergency stop button 700 is used to immediately cut off the power of the equipment and stop the movement of all modules in case of abnormal operation or emergency, so as to ensure operational safety.

[0066] Such as 3 and Figure 4 As shown, a positioning sleeve 215 is provided at the bottom of the positioning fixture 200, and a positioning pin 410 is correspondingly provided on the rotating module 120 of the detection platform. The positioning pin 410 cooperates with the positioning sleeve 215 to achieve precise positioning of the positioning fixture 200 and the rotating module 120 of the detection platform, enabling quick replacement of different heat sink fixtures without the need for equipment recalibration. In this embodiment, the positioning pin 410 and the positioning sleeve 215 adopt an H7 / g6 fit tolerance. The fixtures for different models of heat sinks all use the same positioning sleeve specification. When changing the fixture, the fixture is placed on the rotating module, and quick and accurate positioning is achieved through the cooperation of the positioning pin 410 and the positioning sleeve 215, without the need for equipment recalibration.

[0067] In this embodiment, the positioning fixture 200 is custom-designed based on the A, B, and C references of the heat sink under test. The main body of the fixture is made of metal materials (such as aluminum alloy or steel).

[0068] A reference positioning surface 211: machined into a precision plane that matches the A reference of the heat sink, with a surface roughness Ra≤0.8μm;

[0069] B-reference elastic tapered positioning pin 212: adopts a spring-loaded tapered pin structure, and the tapered fit ensures positioning accuracy while facilitating the removal and placement of the heat sink;

[0070] C-reference elastic tapered positioning pin 213: The structure is the same as that of B-reference, and together with B-reference, it realizes the anti-over-positioning and precise positioning of the radiator;

[0071] Position evaluation reference surface 214: A precision plane is machined at a fixed position on the tooling to serve as a reference surface for 3D contour scanning.

[0072] In this embodiment, the pressure of the clamping cylinder 310 is adjusted according to the material and size of the radiator, so that the radiator does not deform and the positioning is reliable; the rotation accuracy of the detection platform rotating module 120 is within ±0.01°.

[0073] In this embodiment, the 3D contour scanner 300 is a laser triangulation contour scanner with a Z-axis height repeatability of ≤1μm, an XY plane repeatability of ≤3μm, a linearity of ±0.055%FS in the standard area and ±0.03%FS in the high-precision area, a laser output power of 10mW, and a fastest scanning cycle of ≤0.2 seconds / frame snapshot.

[0074] The computer host computer 400 receives scanning data in real time, scans all measurement points on the MOS surface 500 of the heat sink, and automatically completes the calculation and judgment according to the calculation formula of position and flatness. The position tolerance standard is implemented in accordance with the product drawing requirements.

[0075] In this embodiment, a host computer 400 is used to communicate and control the X-axis movement module 110, Z-axis movement module 111, Y-axis movement module 112, detection platform rotation module 120, and clamping cylinder 310 via a PLC or motion control card. The host computer 400 includes a device control module, a parameter setting module, a data acquisition module, a data processing and calculation module, a judgment and output module, a data storage and management module, and a communication interface module.

[0076] The equipment control module is used to provide manual / automatic operation control functions for the equipment. In automatic mode, it controls the X-axis moving module 110, Z-axis moving module 111, Y-axis moving module 112, detection platform rotation module 120 and clamping cylinder 310 to move in sequence according to a predetermined program.

[0077] The parameter setting module is used to set the detection parameters, including the heat sink model, position tolerance standard, and flatness tolerance standard, etc.

[0078] The data acquisition module is used to communicate with the 3D contour scanner 300, send scan trigger signals and receive the returned scan data;

[0079] The data processing and calculation module is used to automatically calculate the position and flatness of the MOS surface 500 of the heat sink based on the scan data received by the data acquisition module.

[0080] The judgment and output module is used to compare the calculated position and flatness with the corresponding tolerance standards preset in the parameter setting module, and output a light control signal to the tri-color lamp 420 and an alarm control signal to the buzzer according to the comparison results.

[0081] The data storage and management module is used to store the test data, including the radiator QR code number, test time, measured position value, measured flatness value and judgment result, and provides test data statistics function;

[0082] The communication interface module is used to provide a data communication interface with the MES system. It adopts the TCP transmission control protocol and transmits data including the radiator QR code number, detection time, measured values ​​of position and flatness, and judgment results.

[0083] Position detection principle:

[0084] The 3D contour scanner 300 simultaneously scans the MOS surface 500 of the heat sink and the position evaluation reference surface 214 on the positioning fixture. Here, H0 (reference surface height) is the theoretical reference plane formed by the 3D contour scanner scanning the position evaluation reference surface 214 of the fixture; H1~H n This involves measuring the height data of all points on the MOS surface 500 of the scanned heatsink. During evaluation, the point with the largest (or smallest) height difference relative to the reference surface among all measured points on the MOS surface is used for positional accuracy calculation. According to GD&T's definition and interpretation of positional accuracy, positional accuracy = maximum difference between the measured surface and the theoretical surface × 2.

[0085] Formula: Position degree = 2 × Max(|H1–H0|,|H2–H0|,...,|H n –H0|)

[0086] Where H0 is the height of the reference plane, and H1~H n The height of each measurement point on the surface being measured is given.

[0087] Flatness testing principle:

[0088] The MOS surface 500 of the heat sink is scanned using a 3D contour scanner 300 to obtain the height data of the entire surface. Flatness is the height difference between the highest and lowest points on the surface.

[0089] Formula: Flatness = H max -H min .

[0090] like Figure 6 As shown, a detection method using a rapid detection device for the flatness and position of the MOS surface of the heat sink includes the following steps:

[0091] S1. Manual loading: The radiator to be tested 600 is manually placed onto the positioning fixture 200;

[0092] S2, Pressing with clamping cylinder: The clamping cylinder 310 is activated, pressing the A reference surface of the radiator under test 600 against the A reference positioning surface 211 of the positioning fixture 200. At the same time, the B reference elastic tapered positioning pin 212 and the C reference elastic tapered positioning pin 213 are inserted into the B reference hole and C reference hole of the radiator under test 600 to achieve precise positioning.

[0093] S3. Movement and Rotation: The X-axis movement module 110 moves the heat sink 600 under test to the detection position. The Z-axis movement module 111 and the Y-axis movement module 112 drive the 3D contour scanner 300 to move above the detection position. At the same time, the detection platform rotation module 120 drives the positioning fixture 200 and the heat sink 600 under test to rotate 90°, so that the first MOS surface 500 faces the 3D contour scanner 300.

[0094] S4. Scan the first MOS surface: The host computer 400 sends a scan trigger signal to the 3D contour scanner 300, the 3D contour scanner 300 scans the first MOS surface 500, obtains the height data of the surface, and sends the obtained height data back to the host computer 400.

[0095] S5. Reverse rotation: The detection platform rotation module 120 drives the positioning fixture 200 and the heat sink under test 600 to rotate 180° in the opposite direction, so that the second MOS surface 500 faces the 3D contour scanner 300.

[0096] S6. Scan the second MOS surface: The host computer 400 sends a scan trigger signal to the 3D contour scanner 300, the 3D contour scanner 300 scans the second MOS surface 500, obtains the height data of the surface, and sends the obtained height data back to the host computer 400.

[0097] S7. Reset and release: After the test is completed, the X-axis moving module 110, the Z-axis moving module 111, the Y-axis moving module 112 and the test platform rotating module 120 return to the starting position, and the clamping cylinder 310 is released.

[0098] S8. Automatic Judgment and Output: The host computer 400 automatically calculates the position and flatness based on the returned scan data, and compares the calculated position and flatness with the preset standard values ​​respectively. If they are qualified, it outputs a green light control signal to the tri-color light 420. If they are not qualified, it outputs a red light control signal to the tri-color light 420 and starts the buzzer alarm.

[0099] S9. Manual unloading: The tested radiator 600 is manually removed to complete the test.

[0100] In the above scheme, in steps S4 and S6, the 3D contour scanner 300 scans all measurement points of the MOS surface 500 to obtain the height data H1~H of each measurement point. nIn step S8, the method for calculating the position degree is as follows: taking the theoretical reference plane formed by the 3D contour scanner 300 scanning the position degree evaluation reference plane 214 as the reference plane height H0, and taking the point with the largest height difference relative to the reference plane among all measurement points on the MOS surface 500, the position degree = 2 × Max(|H1–H0|,|H2–H0|,...,|H n –H0|).

[0101] In the above scheme, in steps S4 and S6, the 3D contour scanner 300 scans all measurement points of the MOS surface 500 to obtain the height data of each measurement point; in step S8, the flatness is calculated as follows: Flatness = H max -H min H max H is the height of the highest point among all measurement points on the MOS surface 500. min The height is the lowest point among all measurement points on the MOS surface 500.

[0102] Compared with existing coordinate measuring machine (CMM) technology, this invention significantly improves inspection efficiency: CMM measurement of a single heat sink requires 12-15 minutes (approximately 140 points are taken on one side of the MOS surface, each point takes about 2 seconds, totaling over 9 minutes for both sides, plus manual operation and idle time), while this invention reduces the single-piece inspection time to 50-60 seconds, increasing efficiency by approximately 15 times, meeting the requirements for batch full inspection; high efficiency ensures that every heat sink can be inspected, effectively reducing the risk of defective products leaving the site; ordinary employees can operate the system after simple training, without the need for professional technicians; the tooling adopts a precise positioning design with positioning pins 410 and positioning sleeves 215, eliminating the need for readjustment during model changes, significantly reducing changeover time; the computer host computer 400 controls the system, supports complex formula calculations, can communicate with the MES system, and enables data traceability; non-contact 3D scanning effectively avoids the force deformation errors that may occur with contact measurements, ensuring accurate and reliable measurement data.

[0103] The positioning fixture of this invention is equipped with an A-reference positioning surface 211, B / C-reference elastic tapered positioning pins 212 and 213, and a position evaluation reference surface 214. The fixture and the rotating module cooperate with the positioning pins 410 and the positioning sleeve 215 to achieve rapid changeover. During inspection, the X-axis moving module 110 moves the product to the inspection position, the Z-axis moving module 111 and the Y-axis moving module 112 move the scanner above the inspection position, and the rotating module rotates 90° and then 180° in the opposite direction in sequence. The scanner synchronously scans the MOS surfaces 500 on both sides of the product and the reference surface and transmits the data back. The host computer calculates the position and flatness based on the scan data and compares it with the preset standard values. The judgment result is output through the three-color light 420 and the buzzer. This invention significantly improves the efficiency of inspecting a single product, and is simple to operate, quick to change over, and provides traceable data.

[0104] It should be understood that although this specification is described according to various embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0105] The detailed descriptions listed above are merely specific illustrations of feasible embodiments of the present invention and are not intended to limit the scope of protection of the present invention. All equivalent embodiments or modifications made without departing from the spirit of the present invention should be included within the scope of protection of the present invention.

Claims

1. A rapid detection device for the flatness and positional accuracy of a heat sink MOS surface, characterized in that, It includes a frame (100), an X-axis moving module (110), a Z-axis moving module (111), a Y-axis moving module (112), a detection platform rotating module (120), a positioning fixture (200), a clamping cylinder (310), a 3D contour scanner (300), a computer host computer (400), and a three-color light (420). The X-axis moving module (110) is mounted on the frame (100); The Z-axis moving module (111) is mounted on the frame (100), and the Y-axis moving module (112) is mounted on the Z-axis moving module (111); The rotating module (120) of the detection platform is mounted on the X-axis moving module (110) and can move along the X-axis direction under the drive of the X-axis moving module (110); The positioning fixture (200) is installed on the rotating module (120) of the testing platform and is used to position the heat sink (600) under test. The upper surface of the positioning fixture (200) is provided with an A reference positioning surface (211), which is used to fit against the A reference surface of the heat sink (600) under test. The positioning fixture (200) is also provided with an upwardly protruding B reference elastic tapered positioning pin (212) and a C reference elastic tapered positioning pin (213). The quasi-elastic tapered positioning pin (212) and the C-reference elastic tapered positioning pin (213) are located on opposite sides of the A-reference positioning surface (211) and are used to cooperate with the B-reference hole and C-reference hole of the heat sink (600) under test for positioning; the positioning fixture (200) is also provided with a position evaluation reference surface (214), which is located in the edge area of ​​the positioning fixture (200) and is set at a predetermined angle with the A-reference positioning surface (211); The clamping cylinder (310) is mounted on the frame (100) and is used to press the A reference surface of the radiator under test (600) against the A reference positioning surface (211). The 3D contour scanner (300) is mounted on the Y-axis moving module (112) and can move up and down along the Z-axis direction under the drive of the Z-axis moving module (111) and along the Y-axis direction under the drive of the Y-axis moving module (112). The scanning direction of the 3D contour scanner (300) is towards the location of the positioning fixture (200) and is used to scan the MOS surface (500) and the position evaluation reference surface (214) of the heat sink (600) under test. The host computer (400) is communicatively connected to the X-axis moving module (110), Z-axis moving module (111), Y-axis moving module (112), detection platform rotation module (120), clamping cylinder (310), and 3D contour scanner (300), respectively, and sends control commands to the X-axis moving module (110), Z-axis moving module (111), Y-axis moving module (112), detection platform rotation module (120), and clamping cylinder (310) to control the X-axis moving module (110), Z-axis moving module (111), Y-axis moving module (112), and detection platform rotation module (300). 120) Moves along a predetermined trajectory and controls the clamping cylinder (310) to clamp or release; the host computer (400) is also connected to the 3D contour scanner (300) to send a scan trigger signal to the 3D contour scanner (300) and receive the scan data returned by the 3D contour scanner (300); the host computer (400) calculates the position and flatness according to the received scan data; the host computer (400) is also used to compare the calculated position and flatness with preset standard values ​​respectively, and generate a qualified or unqualified judgment indication signal according to the comparison result; The tri-color light (420) is installed on the top of the frame (100) and is connected to the host computer (400) for outputting detection result judgment indication.

2. The rapid detection device for the flatness and position of the MOS surface of a heat sink according to claim 1, characterized in that, It also includes a start button (800) and an emergency stop button (700); The start button (800) and the emergency stop button (700) are respectively installed on the front side of the rack (100), and the start button (800) and the emergency stop button (700) are respectively connected to the host computer (400); the start button (800) is used to trigger the automatic operation of the equipment, and the emergency stop button (700) is used to stop the equipment in an emergency.

3. The rapid detection device for the flatness and position of the MOS surface of a heat sink according to claim 1, characterized in that, The bottom of the positioning fixture (200) is provided with a positioning sleeve (215), and the rotating module (120) of the detection platform is provided with a corresponding positioning pin (410). The positioning pin (410) and the positioning sleeve (215) cooperate to achieve precise positioning of the positioning fixture (200) and the rotating module (120) of the detection platform.

4. The rapid detection device for the flatness and position of the MOS surface of a heat sink according to claim 1, characterized in that, The 3D contour scanner (300) is a laser triangulation contour scanner with a Z-axis height repeatability of ≤1μm, an XY plane repeatability of ≤3μm, a laser output power of 10mW, and a fastest scanning cycle of ≤0.2 seconds / frame snapshot.

5. The rapid detection device for the flatness and position of the MOS surface of a heat sink according to claim 1, characterized in that, It also includes a buzzer; the buzzer is installed on the rack (100) and is connected to the host computer (400) for receiving alarm control signals output by the host computer (400) and emitting an audible alarm.

6. A method for detecting the flatness and position of a heat sink MOS surface using a rapid detection device according to any one of claims 1 to 5, characterized in that, Includes the following steps: S1. Manual loading: The radiator to be tested (600) is manually placed onto the positioning fixture (200); S2, Pressing with a pressing cylinder: The pressing cylinder (310) is activated to press the A reference surface of the radiator under test (600) against the A reference positioning surface (211) of the positioning fixture (200). At the same time, the B reference elastic tapered positioning pin (212) and the C reference elastic tapered positioning pin (213) are inserted into the B reference hole and C reference hole of the radiator under test (600) to achieve precise positioning. S3. Movement and Rotation: The X-axis movement module (110) moves the heat sink (600) under test to the detection position. The Z-axis movement module (111) and the Y-axis movement module (112) drive the 3D contour scanner (300) to move above the detection position. At the same time, the detection platform rotation module (120) drives the positioning fixture (200) and the heat sink (600) under test to rotate 90°, so that the first MOS surface (500) faces the 3D contour scanner (300). S4. Scan the first MOS surface: The 3D contour scanner (300) scans the first MOS surface (500), obtains the height data of the surface, and transmits the obtained height data back to the computer host computer (400). S5, Reverse Rotation: The detection platform rotation module (120) drives the positioning fixture (200) and the heat sink under test (600) to rotate 180° in the opposite direction, so that the second MOS surface (500) faces the 3D contour scanner (300). S6. Scan the second MOS surface: The 3D contour scanner (300) scans the second MOS surface (500), obtains the height data of the surface, and transmits the obtained height data back to the computer host computer (400). S7. Reset and release: After the test is completed, the X-axis moving module (110), Z-axis moving module (111), Y-axis moving module (112) and test platform rotating module (120) return to the starting position, and the clamping cylinder (310) is released; S8. Automatic Judgment and Output: The host computer (400) automatically calculates the position and flatness according to the returned scan data, and compares the calculated position and flatness with the preset standard values ​​respectively. If they are qualified, it outputs a green light control signal to the tri-color light (420). If they are not qualified, it outputs a red light control signal to the tri-color light (420) and starts the buzzer alarm. S9. Manual unloading: The tested radiator (600) is manually removed to complete the test.

7. The detection method of the rapid detection device for the flatness and positional accuracy of the MOSFET surface of a heat sink according to claim 6, characterized in that, In steps S4 and S6, the 3D contour scanner (300) scans all measurement points on the MOS surface (500) to obtain the height data H1~H of each measurement point. n In step S8, the position degree is calculated as follows: taking the theoretical reference plane formed by the 3D contour scanner (300) scanning the position degree evaluation reference plane (214) as the reference plane height H0, the point with the largest height difference relative to the reference plane among all measurement points on the MOS plane (500) is selected for calculation. Position degree = 2 × Max(|H1 – H0|, |H2 – H0|, ..., |H n – H0|).

8. The detection method of the rapid detection device for the flatness and position of the MOS surface of the heat sink according to claim 6, characterized in that, In steps S4 and S6, the 3D contour scanner (300) scans all measurement points on the MOS surface (500) to obtain the height data of each measurement point; in step S8, the flatness is calculated as follows: flatness = H max - H min H max H is the height of the highest point among all measurement points on the MOS surface (500). min The height is the lowest point among all the measurement points on the MOS surface (500).

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