New energy automobile vehicle-grade power management chip testing device

Abstract

The new energy automobile vehicle-grade power management chip testing device provided by the application relates to the chip testing field. The new energy automobile vehicle-grade power management chip testing device comprises a base, a three-axis suction disc mechanism, a chip correction mechanism and a chip testing mechanism. The three-axis suction disc mechanism can drive the vehicle-grade power management chip to be transferred in the front-back direction, the left-right direction and the up-down direction. The upper correction position is pressed on the upper side of the vehicle-grade power management chip in a swinging manner, and the lower correction position drives the pins of the vehicle-grade power management chip to be pressed on the upper correction position in a lifting manner for correction. The new energy automobile vehicle-grade power management chip testing device synchronously corrects the relative positions of the vehicle-grade power management chip and the pins of the vehicle-grade power management chip, facilitates the accurate access of the pins of the vehicle-grade power management chip to the groove position of the chip testing when the chip is used as a reference for transfer, and also facilitates automatic feeding in the chip testing process.

Description

Technical Field

[0001] This application relates to the field of chip testing technology, and more specifically, to a testing device for automotive-grade power management chips for new energy vehicles. Background Technology

[0002] With the rapid development of the new energy vehicle industry, automotive-grade power management chips, as core components of the vehicle power system, directly determine the reliability of key functions such as vehicle power distribution, battery charging and discharging control, and the stability of power supply to vehicle electrical appliances. The power supply, grounding, control and status monitoring, power output and regulation, protection, and loop stabilization of automotive-grade power management chips are all connected via pins. When testing automotive-grade power management chips, it is necessary to simulate the voltage, current, and other conditions in the actual working environment by connecting the pins to the chip test socket, allowing for comprehensive and accurate testing and analysis of the chip.

[0003] In related technologies, the connection of automotive-grade power management chips for new energy vehicles to the chip test socket requires pressing the chip pins into slots pre-set according to pin spacing and arrangement. However, if the pins of the automotive-grade power management chip are deformed during transportation, it is difficult to align the chip pins with the chip test slots. Manually straightening the pins is too slow, and the existing chip pin alignment mechanism is also easily affected by the deformed pins during pin alignment, causing the chip to be supported by the pins. Therefore, while alignment can make all pins consistent, the relative position of the chip and its pins is not easy to adjust. If the relative position of the chip and its pins changes due to pin alignment, the stability of the chip is not easy to maintain after the pins are connected to the chip test socket, which can easily affect subsequent testing processes. Furthermore, if an automated mechanism is used to transfer the chip by gripping it, the position of its pins is also prone to deviation from the chip test slots because the chip is the reference, making alignment difficult. Summary of the Invention

[0004] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes a testing device for automotive-grade power management chips for new energy vehicles. The testing device simultaneously corrects the relative positions of the automotive-grade power management chip and its pins, facilitating accurate connection of the chip pins to the chip testing slots during chip-based transport and also facilitating automatic feeding during the chip testing process.

[0005] The new energy vehicle-grade power management chip testing device according to the embodiments of this application includes: a base, a three-axis suction cup mechanism, a chip calibration mechanism, and a chip testing mechanism.

[0006] The three-axis suction cup mechanism is located on the rear side of the base. This mechanism can move the automotive-grade power management chip in front-back, left-right, and up-down directions. The chip calibration mechanism is located on the front side of the base. This mechanism consists of an upper calibration position and a lower calibration position. The upper calibration position presses against the upper side of the automotive-grade power management chip by swinging, while the lower calibration position moves upwards to press the pins of the automotive-grade power management chip against the upper calibration position for calibration. The chip testing mechanism is located on the front side of the base, to the right of the chip calibration mechanism. The three-axis suction cup mechanism can transfer the automotive-grade power management chip from the chip calibration mechanism to the chip testing mechanism. The chip testing mechanism presses the pins of the automotive-grade power management chip into the pin slots on the chip testing mechanism.

[0007] According to some embodiments of this application, the three-axis suction cup mechanism includes left and right electric slide rails, front and rear electric slide rails, upper and lower electric slide rails, and an elastic suction cup structure. The left and right electric slide rails are arranged laterally on the rear side of the base in the left and right directions. The front and rear electric slide rails are arranged longitudinally on the sliders of the left and right electric slide rails in the front and rear directions. The sliders of the upper and lower electric slide rails are fixed on the sliders of the front and rear electric slide rails. The upper and lower electric slide rails are arranged vertically. The elastic suction cup structure is disposed at the bottom end of the upper and lower electric slide rails.

[0008] According to some embodiments of this application, the elastic suction cup structure includes a bridge-shaped base, a support plate, and elastic suction cup components. The bridge-shaped base is fixedly connected to the bottom end of the upper and lower electric slide rails, and the support plate is fixedly connected to the lower side of the bridge-shaped base. The support plate is provided with oval holes at equal intervals, and the upper end of the elastic suction cup components is respectively installed in the oval holes.

[0009] According to some embodiments of this application, the elastic suction cup component includes a suction cup, a guide rod, a compression spring, and a fixing seat. The nut of the fixing seat fixes the fixing seat in an oblong hole. The guide rod is fixedly connected to the top of the suction cup and slides through the fixing seat. The compression spring is sleeved on the guide rod, and the two ends of the compression spring respectively press against the suction cup and the fixing seat.

[0010] According to some embodiments of this application, the chip calibration mechanism includes a mounting box, a lower calibration structure, a guide rail, a swing seat structure, a first drive rod, an upper calibration structure, a series rod, and a calibration chip placement seat. The guide rail is disposed on the lower side of the mounting surface of the mounting box. Multiple lower calibration structures are arranged at equal intervals from left to right. The four corners of each lower calibration structure are slidably connected to the guide rail. The swing seat structure is rotatably connected to the multiple lower calibration structures. The upper side of each lower calibration structure can pass through the mounting surface. The fixed ends of the first drive rods are evenly spaced on the swing seat structure, and the first drive rods are respectively located on the lower... On both sides of the calibration structure, multiple upper calibration structures are provided, arranged at equal intervals from left to right. Each upper calibration structure is hinged to the upper side of the mounting surface of the mounting box. The series rod passes through the multiple upper calibration structures in sequence. The movable end of the first drive rod is rotatably sleeved on the series rod. The calibration chip placement seats are equally spaced on the upper side of the mounting surface of the mounting box. The automotive-grade power management chip falls into the calibration chip placement seat. After the upper calibration structure closes, it presses the automotive-grade power management chip into the calibration chip placement seat. The upper calibration structure and the lower calibration structure close each other to calibrate the pins of the automotive-grade power management chip.

[0011] According to some embodiments of this application, the lower correction structure includes a lower pressing plate, a first sleeve seat, and a lower correction plate. The lower pressing plate has sliding holes at its four corners, through which the guide rail passes. The first sleeve seat is fixedly connected to the lower side of the lower pressing plate and is rotatably sleeved on the swing seat structure. The lower correction plate is disposed on the upper side of the lower pressing plate, and a correction groove is formed at the top of the lower correction plate. The correction groove is consistent with the pin arrangement of the automotive-grade power management chip.

[0012] According to some embodiments of this application, the swing seat structure includes an end seat, a connecting seat, and a connecting rod. The first drive rods located at the left and right ends of the mounting box are mounted on the end seats, and the remaining first drive rods are mounted on the connecting seats. The end seats and the connecting seats, as well as adjacent connecting seats, are connected by the connecting rods. The lower correction structure is rotatably sleeved on the connecting rods. The output end of the first drive rod passes through the mounting surface of the mounting box and is rotatably sleeved on the connecting rod.

[0013] According to some embodiments of this application, the upper correction structure includes an upper pressing plate, a hinge, an upper correction plate, a pressing block, and a third sleeve seat. The upper pressing plate is hinged to the upper side of the mounting surface of the mounting box via the hinge. The upper correction plate is disposed inside the upper pressing plate. A correction block is disposed at the bottom end of the upper correction plate. The correction block is aligned with the pin arrangement of the automotive-grade power management chip. The correction block presses the pins of the automotive-grade power management chip into the lower correction structure for correction. The pressing block is fixed inside the upper pressing plate and presses against the upper side of the automotive-grade power management chip. The third sleeve seat is fixedly connected to the outer side of the upper pressing plate, and the connecting rod passes through the third sleeve seat.

[0014] According to some embodiments of this application, the hinge includes a first hinge seat, a second hinge seat, a hinge shaft, and a limiting plate. The first hinge seat is fixedly connected to the inner side of the upper pressing plate, and the second hinge seat is fixedly connected to the upper side of the mounting surface of the mounting box. The first hinge seat is hinged to the second hinge seat through the hinge shaft. The limiting plate is disposed on the outer side of the second hinge seat. When the upper pressing plate is flipped to a vertical position, the limiting plate can block the upper pressing plate.

[0015] According to some embodiments of this application, the chip testing mechanism includes a support box, a chip testing socket, a swing pressing base plate, a mounting frame, an access pressing point, and a second drive rod. The chip testing socket is arranged from left to right on the support surface of the support box. The swing pressing base plate is hinged to the chip testing socket. The automotive-grade power management chip can fall into the testing slot of the chip testing socket, and the pins of the automotive-grade power management chip fall into the pin slots. The mounting frame is fixedly connected to the inner side of the swing pressing base plate. The access pressing point is set on the mounting frame. The access pressing point is aligned with the pins of the automotive-grade power management chip, and the access pressing point can press the pins of the automotive-grade power management chip into the pin slots.

[0016] According to some embodiments of this application, the new energy vehicle automotive-grade power management chip testing device further includes a chip storage mechanism. The chip storage mechanism includes a lifting box and chip pre-placement seats. The chip pre-placement seats are evenly spaced from left to right on the upper surface of the lifting box, and the automotive-grade power management chip is pre-placed in the chip pre-placement seats. The chip pre-placement seats are the same as the calibration chip placement seats, and the spacing between adjacent chip pre-placement seats, the spacing between adjacent calibration chip placement seats, and the spacing between the test slots of adjacent chip test seats are the same.

[0017] The beneficial effects of this application are: the chip calibration mechanism is used for precise pin calibration of automotive-grade power management chips. For automotive-grade power management chips with pin deformation greater than one pin position, pre-calibration is performed first (pre-calibration can be performed when the operator places the automotive-grade power management chip, and since precise calibration is not required, the operator's pre-calibration work is faster). A three-axis suction cup mechanism is used to transfer the automotive-grade power management chip into the chip calibration mechanism. The upper calibration position of the chip calibration mechanism swings and falls, limiting the automotive-grade power management chip. The upper and lower calibration positions of the chip calibration mechanism are mutually closed, and the pins of the automotive-grade power management chip... By using mutually closed upper and lower calibration positions for clamping and calibration, and with the automotive-grade power management chip stabilized by the upper calibration position of the chip calibration mechanism, the relative positions of the automotive-grade power management chip and its pins are synchronously calibrated. This facilitates subsequent transfer of the calibrated automotive-grade power management chip to the chip testing mechanism using a three-axis chuck mechanism with the chip as a reference. This ensures that the pins of the automotive-grade power management chip are accurately connected to the pin slots on the chip testing mechanism, facilitating automatic feeding during the chip testing process. Subsequently, the chip testing mechanism clamps the pins of the automotive-grade power management chip to reduce the occurrence of chip testing failures due to poor pin contact.

[0018] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a three-dimensional structural schematic diagram of a test device for a new energy vehicle-grade power management chip according to an embodiment of this application; Figure 2 This is a three-dimensional structural diagram of the three-axis suction cup mechanism and the base according to an embodiment of this application; Figure 3 According to the embodiments of this application Figure 2 An enlarged 3D structural diagram at point A in the middle; Figure 4 This is a three-dimensional structural schematic diagram of the elastic suction cup component according to an embodiment of this application; Figure 5 This is an exploded view of the chip calibration mechanism mounting position according to an embodiment of this application; Figure 6 This is a three-dimensional structural schematic diagram of the lower correction structure according to an embodiment of this application; Figure 7 This is a three-dimensional structural diagram of the swing seat structure and the first drive rod according to an embodiment of this application; Figure 8 This is a three-dimensional structural diagram of the connection between the upper correction structure and the mounting box according to an embodiment of this application; Figure 9 This is a three-dimensional structural diagram of the closed state of the upper correction structure according to an embodiment of this application; Figure 10 This is a three-dimensional structural schematic diagram of a chip testing mechanism according to an embodiment of this application; Figure 11 According to the embodiments of this application Figure 10 Enlarged 3D structural diagram at point B; Figure 12 This is a three-dimensional structural diagram of a chip storage mechanism according to an embodiment of this application.

[0021] Icons: 100-Base; 200-Three-axis suction cup mechanism; 210-Left and right electric slide rails; 220-Front and rear electric slide rails; 230-Upper and lower electric slide rails; 240-Elastic suction cup structure; 241-Bridge type seat; 242-Support plate; 243-Elastic suction cup component; 2431-Suction cup; 2432-Guide rod; 2433-Compression spring; 2434-Fixed seat; 300-Chip calibration mechanism; 310-Mounting box; 311-Box body; 312-First transition groove; 313-Second transition groove; 320-Lower calibration structure; 321-Lower pressing plate; 322-Sliding hole; 323-First sleeve seat; 324-Lower calibration plate; 325-Calibration groove; 330-Guide rail; 340-Swing seat structure; 341-End seat; 342-Connecting seat; 343-Connecting rod; 3 50-First drive rod; 351-Telescopic push rod; 352-Second sleeve seat; 360-Upper correction structure; 361-Upper pressing plate; 362-Hinge; 3621-First hinge seat; 3622-Second hinge seat; 3623-Hinge shaft; 3624-Limiting plate; 363-Upper correction plate; 364-Correction block; 365-Pressing block; 366-Third sleeve seat; 367-Reinforcing plate; 370-Series rod; 380-Correction chip placement seat; 390-Limiting seat; 400-Chip testing mechanism; 410-Support box; 420-Chip testing seat; 430-Swing pressing seat plate; 440-Mounting frame; 450-Connection pressing point; 460-Second drive rod; 470-Limiting frame; 500-Chip storage mechanism; 510-Lifting box; 520-Chip pre-placement seat. Detailed Implementation

[0022] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, not all of them. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0024] The following description, with reference to the accompanying drawings, describes a test apparatus for a new energy vehicle-grade power management chip according to an embodiment of this application.

[0025] Please see Figures 1 to 12 The new energy vehicle-grade power management chip testing device according to the embodiments of this application includes: a base 100, a three-axis suction cup mechanism 200, a chip calibration mechanism 300, and a chip testing mechanism 400.

[0026] Please see Figure 1A three-axis suction cup mechanism 200 is located at the rear of the base 100. The three-axis suction cup mechanism 200 can move the automotive-grade power management chip in the front-back, left-right, and up-down directions. A chip calibration mechanism 300 is located at the front of the base 100. The chip calibration mechanism 300 is divided into an upper calibration position and a lower calibration position. The upper calibration position presses against the upper side of the automotive-grade power management chip by swinging, and the lower calibration position moves upward to move the pins of the automotive-grade power management chip onto the upper calibration position for calibration. A chip testing mechanism 400 is located at the front of the base 100 and is located to the right of the chip calibration mechanism 300. The three-axis suction cup mechanism 200 can transfer the automotive-grade power management chip from the chip calibration mechanism 300 to the chip testing mechanism 400. The chip testing mechanism 400 presses the pins of the automotive-grade power management chip into the pin slots on the chip testing mechanism 400. The chip calibration mechanism 300 is used for precise pin calibration of automotive-grade power management chips. For automotive-grade power management chips with pin deformation greater than one pin position, pre-calibration is performed first (pre-calibration can be performed when the operator places the automotive-grade power management chip, and since precise calibration is not required, the operator's pre-calibration work is faster). The three-axis suction cup mechanism 200 is used to transfer the automotive-grade power management chip into the chip calibration mechanism 300. The upper calibration position of the chip calibration mechanism 300 swings down, and the upper calibration position of the chip calibration mechanism 300 limits the automotive-grade power management chip. The upper and lower calibration positions of the chip calibration mechanism 300 are mutually closed, and the pins of the automotive-grade power management chip are connected through phase... The upper and lower calibration positions are mutually closed and pressed together for calibration. The automotive-grade power management chip is stabilized by the upper calibration position of the chip calibration mechanism 300, so that the relative positions of the automotive-grade power management chip and its pins are synchronously calibrated. This facilitates the subsequent transfer of the calibrated automotive-grade power management chip to the chip testing mechanism 400 using the three-axis chuck mechanism 200 with the chip as the reference. This ensures that the pins of the automotive-grade power management chip are accurately connected to the pin slots on the chip testing mechanism 400, which facilitates automatic feeding in the chip testing process. Subsequently, the chip testing mechanism 400 presses the pins of the automotive-grade power management chip to reduce the occurrence of chip testing failures due to poor pin contact.

[0027] Please see Figures 1 to 2The three-axis suction cup mechanism 200 includes left and right electric slide rails 210, front and rear electric slide rails 220, upper and lower electric slide rails 230, and an elastic suction cup structure 240. The left and right electric slide rails 210 are horizontally arranged at the rear of the base 100. The front and rear electric slide rails 220 are vertically arranged on the sliders of the left and right electric slide rails 210. The sliders of the upper and lower electric slide rails 230 are fixed to the sliders of the front and rear electric slide rails 220. The upper and lower electric slide rails 230 are vertically arranged. The elastic suction cup structure 240 is located at the bottom of the upper and lower electric slide rails 230. The left and right electric slide rails 210, front and rear electric slide rails 220, and upper and lower electric slide rails 230 respectively control the elastic suction cup structure 240 to move horizontally, horizontally, and vertically, thereby adsorbing the automotive-grade power management chip.

[0028] Please see Figures 1 to 3 The elastic suction cup structure 240 includes a bridge-shaped base 241, a support plate 242, and elastic suction cup components 243. The bridge-shaped base 241 is fixedly connected to the bottom end of the upper and lower electric slide rails 230, and the support plate 242 is fixedly connected to the lower side of the bridge-shaped base 241. The support plate 242 has equally spaced oval holes, and the upper ends of the elastic suction cup components 243 are respectively installed in the oval holes. The bridge-shaped base 241 is used to connect the support plate 242 and the upper and lower electric slide rails 230. The elastic suction cup components 243 can be adjusted in the left and right directions along the oval holes, so that the elastic suction cup components 243 can accurately adsorb automotive-grade power management chips.

[0029] Please see Figures 1 to 4 The elastic suction cup component 243 includes a suction cup 2431, a guide rod 2432, a compression spring 2433, and a fixing seat 2434. A nut on the fixing seat 2434 secures it within an oblong hole. The guide rod 2432 is fixedly connected to the top of the suction cup 2431 and slides through the fixing seat 2434. The compression spring 2433 is fitted onto the guide rod 2432, with both ends pressing against the suction cup 2431 and the fixing seat 2434 respectively. The fixing seat 2434 consists of a guide screw and a nut. The guide screw passes through the oblong hole, and the nut is screwed onto the guide screw, pressing and fixing the guide screw onto the support plate 242. A guide hole is provided inside the guide screw, through which the guide rod 2432 passes. A limit ring is located at the top of the guide rod 2432. After the suction cup 2431 contacts the automotive-grade power management chip, as the support plate 242 moves downward, the guide rod 2432 slides along the guide hole, and the suction cup 2431 pushes the compression spring 2433 to shorten, increasing the elastic force of the compression spring 2433. This ensures that all suction cups 2431 adhere to the automotive-grade power management chip. This elastic telescopic contact of the suction cup 2431 reduces hard contact between the suction cup 2431 and the automotive-grade power management chip, thereby reducing the possibility of the suction cup 2431 damaging the automotive-grade power management chip.

[0030] Please see Figures 1 to 8The chip calibration mechanism 300 includes a mounting box 310, a lower calibration structure 320, a guide rail 330, a swing seat structure 340, a first drive rod 350, an upper calibration structure 360, a series rod 370, and a calibration chip placement seat 380. The guide rail 330 is located below the mounting surface of the mounting box 310. Multiple lower calibration structures 320 are arranged at equal intervals from left to right, with their four corners slidably connected to the guide rail 330. The swing seat structure 340 is rotatably connected to the multiple lower calibration structures 320, and the upper side of each lower calibration structure 320 can pass through the mounting surface. The fixed ends of the first drive rods 350 are evenly spaced on the swing seat structure 340, and the first drive rods 350 are located on the left and right sides of the lower calibration structure 320, respectively. Multiple upper calibration structures 360 are configured, and the upper calibration structures 360 are arranged at equal intervals from left to right. The upper calibration structures 360 are hinged to the upper side of the mounting surface of the mounting box 310. The series rod 370 passes through the multiple upper calibration structures 360 in sequence. The movable end of the first drive rod 350 is rotatably sleeved on the series rod 370. The calibration chip placement seats 380 are equally spaced on the upper side of the mounting surface of the mounting box 310. The automotive-grade power management chip falls into the calibration chip placement seat 380. The calibration chip placement seat 380 has a placement groove, and the upper periphery of the placement groove has a guide bevel. After the upper calibration structure 360 ​​closes, it presses the automotive-grade power management chip into the calibration chip placement seat 380. The upper calibration structure 360 ​​and the lower calibration structure 320 close each other to calibrate the pins of the automotive-grade power management chip.The three-axis suction cup mechanism 200 transfers the automotive-grade power management chip to the placement slot of the calibration chip placement seat 380. The automotive-grade power management chip is guided by the guide bevel of the placement slot, facilitating its smooth placement and positioning. Subsequently, the first drive rod 350 is activated. Under its own weight and the weight of the first drive rod 350, the lower calibration structure 320 is positioned at the lower end of the guide rail 330. As the movable end of the first drive rod 350 retracts, it pulls the upper calibration structure 360 ​​downward, causing the upper calibration structure 360 ​​to first press down on the automotive-grade power management chip. The automotive-grade power management chip undergoes pre-clamping and positioning. Due to pin deformation exceeding that of a single pin position, the chip is pre-calibrated so that its pins are positioned below the calibration position of the upper calibration structure 360. During this process, the position of the first drive rod 350 automatically adapts as the swing seat structure 340 rotates. As the movable end of the first drive rod 350 continues to retract, the lower calibration structure 320 slides upward along the guide rail 330, closing the upper calibration structure 360 ​​and the lower calibration structure 320 together. The automotive-grade power management chip is gradually calibrated through the mutual clamping of the upper calibration structure 360 ​​and the lower calibration structure 320. When the lower calibration structure 320 presses against the lower side of the mounting surface of the mounting box 310, the positions of the upper calibration structure 360 ​​and the lower calibration structure 320 are fixed to each other, allowing the automotive-grade power management chip to sit flat in the placement slot. This achieves further calibration and positioning of the automotive-grade power management chip. Furthermore, the mutual closure of the upper calibration structure 360 ​​and the lower calibration structure 320 calibrates the pins of the automotive-grade power management chip, ensuring the relative position of the chip and its pins. This facilitates subsequent transport using the three-axis chuck mechanism 200 with the chip as a reference, allowing the calibrated automotive-grade power management chip to be moved. The automotive-grade power management chip is transferred into the chip testing mechanism 400, ensuring its pins are accurately positioned in the pin slots. The lower calibration structure 320, under its own weight and the force of the first drive rod 350, remains in a low position, allowing the upper calibration structure 360 ​​to pre-press and position the chip. This reduces the risk of the lower calibration structure 320 lifting the chip when it rises due to pin deformation, thus minimizing the possibility of the chip detaching from the placement slot. When exposing the calibrated chip, the lower calibration structure 320 and the first drive rod 350 slide downwards away from the chip and its pins under gravity. Then, the first drive rod 350 pushes the upper calibration structure 360 ​​upwards, exposing the calibrated chip and facilitating subsequent transfer by the three-axis suction cup mechanism 200.

[0031] Please see Figures 1 to 6The lower calibration structure 320 includes a lower pressing plate 321, a first sleeve seat 323, and a lower calibration plate 324. The lower pressing plate 321 has sliding holes 322 at its four corners, through which a guide rail 330 passes. The first sleeve seat 323 is fixedly connected to the lower side of the lower pressing plate 321 and rotatably sleeved onto the swing seat structure 340. The lower calibration plate 324 is positioned on the upper side of the lower pressing plate 321, and a calibration groove 325 is formed at its top. The calibration groove 325 is aligned with the pin arrangement of the automotive-grade power management chip. During pin calibration of the automotive-grade power management chip, the calibration position of the upper calibration structure 360 ​​presses against the pin, and the calibration groove 325 guides and aligns the pin, enabling precise pin calibration of the automotive-grade power management chip.

[0032] Please see Figures 1 to 7 The swing seat structure 340 includes an end seat 341, a connecting seat 342, and a connecting rod 343. First drive rods 350 located at the left and right ends of the mounting box 310 are mounted on the end seat 341, and the remaining first drive rods 350 are mounted on the connecting seats 342. The end seat 341 and the connecting seats 342, as well as adjacent connecting seats 342, are connected by the connecting rods 343. The lower correction structure 320 is rotatably sleeved on the connecting rods 343. The output end of the first drive rod 350 passes through the mounting surface of the mounting box 310 and is rotatably sleeved on the series rod 370. The first sleeve seat 323 is rotatably connected to the connecting rod 343. As the upper correction structure 360 ​​swings down, the first drive rods 350 adapt to the swing of the upper correction structure 360 ​​through the swing of the end seat 341 and the connecting seat 342.

[0033] Please see Figures 1 to 7 The first drive rod 350 includes a telescopic push rod 351 and a second sleeve seat 352. The second sleeve seat 352 is fixedly connected to the output end of the telescopic push rod 351 and is rotatably sleeved on the connecting rod 370. The telescopic push rod 351 applies force to the connecting rod 370 through the second sleeve seat 352, and the connecting rod 370 drives the upper correction structure 360 ​​to swing downward or upward.

[0034] Please see Figures 1 to 8The upper calibration structure 360 ​​includes an upper pressing plate 361, a hinge 362, an upper calibration plate 363, a pressing block 365, and a third sleeve seat 366. The upper pressing plate 361 is hinged to the upper side of the mounting surface of the mounting box 310 through the hinge 362. The upper calibration plate 363 is disposed inside the upper pressing plate 361. A calibration block 364 is disposed at the bottom of the upper calibration plate 363. The calibration block 364 is aligned with the pin arrangement of the automotive-grade power management chip. The calibration block 364 presses the pins of the automotive-grade power management chip into the lower calibration structure 320 for calibration. The pressing block 365 is fixed inside the upper pressing plate 361 and presses the upper side of the automotive-grade power management chip. The third sleeve seat 366 is fixedly connected to the outer side of the upper pressing plate 361, and the connecting rod 370 passes through the third sleeve seat 366. The connecting rod 370 applies force to the upper pressing plate 361 through the third sleeve seat 366. The upper pressing plate 361 positions the automotive-grade power management chip by pressing with the pressing block 365. When calibrating the pins of the automotive-grade power management chip, the calibration block 364 presses against the pins and guides the pins to be aligned with the calibration slot 325, thus performing precise pin calibration of the automotive-grade power management chip.

[0035] Please see Figures 1 to 8 The upper pressing plate 361 has a reinforcing plate 367 at its front end, and a limiting seat 390 is provided on the mounting box 310. After the upper pressing plate 361 is closed, the reinforcing plate 367 presses against the top of the limiting seat 390. The reinforcing plate 367 enhances the strength of the contact point between the upper pressing plate 361 and the limiting seat 390, while the limiting seat 390 restricts the downward swing angle of the upper pressing plate 361, reducing the risk of the upper pressing plate 361 damaging the automotive-grade power management chip due to excessive downward swing.

[0036] Please see Figures 1 to 8 The mounting box 310 includes a box body 311. A first transition groove 312 and a second transition groove 313 are formed on the mounting surface of the box body 311. The lower correction structure 320 passes through the mounting surface of the box body 311 via the first transition groove 312, and the movable end of the first drive rod 350 passes through the mounting surface of the box body 311 via the second transition groove 313. The first transition groove 312 provides a clearance for the lower correction structure 320 to pass through the mounting surface of the box body 311, reducing interference between the lower correction structure 320 and the mounting surface of the box body 311. The second transition groove 313 provides a clearance for the first drive rod 350 to pass through the mounting surface of the box body 311, reducing interference between the first drive rod 350 and the mounting surface of the box body 311.

[0037] Please see Figures 1 to 9The hinge 362 includes a first hinge seat 3621, a second hinge seat 3622, a hinge shaft 3623, and a limiting plate 3624. The first hinge seat 3621 is fixedly connected to the inner side of the upper pressing plate 361, and the second hinge seat 3622 is fixedly connected to the upper side of the mounting surface of the mounting box 310. The first hinge seat 3621 is hinged to the second hinge seat 3622 via the hinge shaft 3623. The limiting plate 3624 is disposed on the outer side of the second hinge seat 3622. When the upper pressing plate 361 is flipped to a vertical position, the limiting plate 3624 can block the upper pressing plate 361. When the lower pressing plate 321 swings, the first hinge seat 3621 rotates around the second hinge seat 3622 via the hinge shaft 3623. The limiting plate 3624 limits the upward flipping angle of the upper pressing plate 361.

[0038] Please see Figures 1 to 11 The chip testing mechanism 400 includes a support box 410, a chip testing base 420, a swing pressing base plate 430, a mounting frame 440, an access pressing point 450, and a second drive rod 460. The chip testing base 420 is arranged from left to right on the support surface of the support box 410. The swing pressing base plate 430 is hinged to the chip testing base 420. The automotive-grade power management chip can fall into the test slot of the chip testing base 420, and the pins of the automotive-grade power management chip fall into the pin slots. The mounting frame 440 is fixedly connected to the inner side of the swing pressing base plate 430. The access pressing point 450 is set on the mounting frame 440. The access pressing point 450 is consistent with the pin arrangement of the automotive-grade power management chip. The access pressing point 450 can press the pins of the automotive-grade power management chip into the pin slots. The left and right ends of the support surface of the support box 410 are fixedly connected to the limit frame 470. After the swing pressing base plate 430 is closed, the limit frame 470 can block the swing pressing base plate 430. The mounting frame 440 and the access point 450 are made of insulating material to prevent short circuits. Specifically, the chip test socket 420 is used to connect the automotive-grade power management chip to be tested and to test whether the performance and function of the automotive-grade power management chip meet the requirements. The specific model and specifications of the chip test socket 420 need to be selected and determined according to the actual specifications of the device. The specific selection calculation method adopts existing technology in this field, so it will not be described in detail. It should be noted that both the telescopic push rod 351 and the second drive rod 460 are electric push rods. The second drive rod 460 is an electric push rod with both ends hinged by pins.

[0039] Specifically, the three-axis suction cup mechanism 200 transfers the calibrated automotive-grade power management chip to the test slot of the chip test socket 420. Since the automotive-grade power management chip and its pins have been precisely calibrated, the pins of the automotive-grade power management chip fall into the pin slots. Then, the second drive rod 460 is activated, causing the swinging pressure plate 430 to flip and fall, with the contact pressure point 450 pressing down on the pins of the automotive-grade power management chip. This reduces the possibility of poor contact between the automotive-grade power management chip and the chip test socket 420, ensuring test stability. The limit bracket 470 limits the downward angle of the swinging pressure plate 430, reducing excessive pressure on the pins of the automotive-grade power management chip at the contact pressure point 450, which could damage the chip test socket 420. This effectively protects the chip test socket 420 and extends its service life.

[0040] Please see Figures 1 to 12 The new energy vehicle automotive-grade power management chip testing device also includes a chip storage mechanism 500. The chip storage mechanism 500 includes a lifting box 510 and chip pre-placement seats 520. The chip pre-placement seats 520 are evenly spaced from left to right on the upper surface of the lifting box 510, and the automotive-grade power management chips are pre-placed within the chip pre-placement seats 520. The chip pre-placement seats 520 are identical to the calibration chip placement seats 380; the spacing between adjacent chip pre-placement seats 520, the spacing between adjacent calibration chip placement seats 380, and the spacing between the test slots of adjacent chip test seats 420 are the same. The chip pre-placement seats 520 are used to pre-place the automotive-grade power management chips. The lifting box 510 is used to lift the position of the chip pre-placement seat 520, thereby lifting the position of the pre-placed automotive-grade power management chip. The chip pre-placement seat 520 is the same as the calibration chip placement seat 380. The spacing between adjacent chip pre-placement seats 520, the spacing between adjacent calibration chip placement seats 380, and the spacing between the test slots of adjacent chip test seats 420 are the same, which facilitates the three-axis suction cup mechanism 200 to simultaneously pick up multiple automotive-grade power management chips for synchronous testing.

[0041] Specifically, the working principle of this new energy vehicle automotive-grade power management chip testing device is as follows: During use, the automotive-grade power management chip is pre-placed in the chip pre-placement socket 520. For automotive-grade power management chips with pin deformation exceeding one pin position, pre-calibration is performed first. The left-right position of the suction cup 2431 is adjusted via the left-right electric slide rail 210, the up-down electric slide rail 230 adjusts the up-down position of the suction cup 2431, and the front-back electric slide rail 220 adjusts the front-back position of the suction cup 2431. The suction cup 2431 is then transferred to the automotive-grade power management chip within the chip pre-placement socket 520. The upper and lower electric slide rails 230 drive the suction cups 2431 to fall. After the suction cups 2431 contact the automotive-grade power management chip, as the support plate 242 moves down, the guide rod 2432 slides along the guide hole. The suction cups 2431 push the compression spring 2433 to shorten, and the elastic force of the compression spring 2433 increases, so that all the suction cups 2431 can adsorb the automotive-grade power management chip. Through this kind of elastic telescopic suction cup contact, the hard contact between the suction cups 2431 and the automotive-grade power management chip is reduced, thereby reducing the possibility of the suction cups 2431 damaging the automotive-grade power management chip.

[0042] After the suction cup 2431 picks up the automotive-grade power management chip, it transfers the chip to above the calibration chip placement seat 380. The upper and lower electric slide rails 230 then lower the suction cup 2431, transferring the chip into the placement slot of the calibration chip placement seat 380. The chip is guided by the guide bevel of the placement slot, facilitating its smooth placement and positioning. Subsequently, the upper and lower electric slide rails 230 raise the suction cup 2431, activating the first drive rod 350. The lower pressing plate 321, under its own weight and the weight of the first drive rod 350, is positioned at the lower end of the guide rail 330. As the movable end of the first drive rod 350 retracts, the first drive rod 35... 0 pulls the upper pressing plate 361 through the connecting rod 370 and the third sleeve seat 366. The upper pressing plate 361 and the first hinge seat 3621 swing downward around the second hinge seat 3622 through the hinge shaft 3623. The upper pressing plate 361 presses the automotive-grade power management chip through the pressing block 365 for pre-pressing and positioning. Since the automotive-grade power management chip with pin deformation greater than one pin position has been pre-corrected, the pin is located under the correction block 364. During this process, since the first sleeve seat 323 is rotatably connected to the connecting rod 343, as the upper pressing plate 361 swings down, the first driving rod 350 adapts to the swing of the upper pressing plate 361 through the swing of the end seat 341 and the connecting seat 342.

[0043] As the movable end of the first drive rod 350 continues to retract, the lower pressing plate 321 slides upward along the guide rail 330, and the upper correction plate 363 and the lower correction plate 324 close together, causing the correction block 364 to press against the pin and guide the pin alignment in the correction slot 325, gradually performing precise pin alignment of the automotive-grade power management chip. When the lower pressing plate 321 abuts against the lower side of the mounting surface of the mounting box 310, the positions of the upper pressing plate 361 and the lower pressing plate 321 are fixed together. The pressing block 365 presses the automotive-grade power management chip, making the automotive-grade power management chip sit flat and stable in the placement slot, achieving further alignment and positioning of the automotive-grade power management chip, and cooperating with the alignment... Block 364 and calibration slot 325 precisely calibrate the pins of the automotive-grade power management chip, ensuring the relative position of the automotive-grade power management chip and its pins. This facilitates subsequent transport using the three-axis chuck mechanism 200 with the chip as a reference. Furthermore, the lower calibration structure 320 remains in a low position under its own weight and the weight of the first drive rod 350, allowing the upper calibration structure 360 ​​to fall first and pre-press the automotive-grade power management chip for positioning. This reduces the possibility of the lower calibration structure 320 lifting the automotive-grade power management chip when it rises due to pin deformation, thereby reducing the possibility of the automotive-grade power management chip detaching from the placement slot.

[0044] When the corrected automotive-grade power management chip is exposed, the lower pressure plate 321 and the first drive rod 350 slide downwards away from the automotive-grade power management chip and its pins under the action of gravity. Then, the first drive rod 350 pushes the upper pressure plate 361 to flip upwards, exposing the corrected automotive-grade power management chip. This facilitates the subsequent transfer of the automotive-grade power management chip by the three-axis suction cup mechanism 200 and enables automatic feeding in the subsequent chip testing process.

[0045] After the automotive-grade power management chip is exposed, a three-axis suction cup mechanism 200 is used to transfer the automotive-grade power management chip to the chip test socket 420. The front and rear electric slide rails 220 drive the automotive-grade power management chip to move backward first, avoiding the mounting frame 440 and the access pressure point 450. When the automotive-grade power management chip is lower than the mounting frame 440, the front and rear electric slide rails 220 drive the automotive-grade power management chip to move forward and return it to its original position. The calibrated automotive-grade power management chip is placed into the test slot of the chip test socket 420. Since the automotive-grade power management chip and its pins have been precisely calibrated, the pins of the automotive-grade power management chip fall precisely into the pin slots. Then, the second drive rod 460 is activated, which drives the swing pressing plate 430 to flip and fall. The access pressure point 450 presses down on the pins of the automotive-grade power management chip to reduce the occurrence of poor contact between the automotive-grade power management chip and the chip test socket 420, thereby ensuring the stability of the test. The limit bracket 470 limits the downward swing angle of the swinging pressure plate 430, reducing the excessive pressure of the access pressure point 450 on the pins of the automotive-grade power management chip, which could cause the pins of the automotive-grade power management chip to be damaged by the chip test socket 420. This effectively protects the chip test socket 420 and improves its service life. The chip test socket 420 is used to test whether the performance and function of the automotive-grade power management chip meet the requirements.

[0046] The above are merely embodiments of this application and are not intended to limit the scope of protection of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application. It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

Claims

1. A testing device for automotive-grade power management chips for new energy vehicles, characterized in that, include: Base (100); A three-axis suction cup mechanism (200) is provided on the rear side of the base (100). The three-axis suction cup mechanism (200) can drive the automotive-grade power management chip to move in the front-rear, left-right, and up-down directions. A chip calibration mechanism (300) is provided on the front side of the base (100). The chip calibration mechanism (300) is divided into an upper calibration position and a lower calibration position. The upper calibration position is pressed against the upper side of the automotive power management chip by swinging. The lower calibration position drives the pins of the automotive power management chip to press against the upper calibration position for calibration by moving upward. A chip testing mechanism (400) is provided on the front side of the base (100). The chip testing mechanism (400) is located on the right side of the chip calibration mechanism (300). The three-axis suction cup mechanism (200) can transfer the automotive-grade power management chip from the chip calibration mechanism (300) to the chip testing mechanism (400). The chip testing mechanism (400) connects the pins of the automotive-grade power management chip to the pin slots on the chip testing mechanism (400) by pressing.

2. The testing device for automotive-grade power management chips for new energy vehicles according to claim 1, characterized in that, The three-axis suction cup mechanism (200) includes left and right electric slide rails (210), front and rear electric slide rails (220), upper and lower electric slide rails (230) and an elastic suction cup structure (240). The left and right electric slide rails (210) are arranged laterally on the rear side of the base (100) along the left and right directions. The front and rear electric slide rails (220) are arranged longitudinally on the sliders of the left and right electric slide rails (210) along the front and rear directions. The sliders of the upper and lower electric slide rails (230) are fixed on the sliders of the front and rear electric slide rails (220). The upper and lower electric slide rails (230) are arranged vertically. The elastic suction cup structure (240) is located at the bottom end of the upper and lower electric slide rails (230).

3. The testing device for automotive-grade power management chips for new energy vehicles according to claim 2, characterized in that, The elastic suction cup structure (240) includes a bridge-shaped seat (241), a support plate (242), and an elastic suction cup component (243). The bridge-shaped seat (241) is fixedly connected to the bottom end of the upper and lower electric slide rails (230). The support plate (242) is fixedly connected to the lower side of the bridge-shaped seat (241). The support plate (242) has equally spaced oval holes. The upper end of the elastic suction cup component (243) is installed in the oval holes.

4. The testing device for automotive-grade power management chips for new energy vehicles according to claim 3, characterized in that, The elastic suction cup component (243) includes a suction cup (2431), a guide rod (2432), a compression spring (2433), and a fixing seat (2434). The nut of the fixing seat (2434) fixes the fixing seat (2434) in the oval hole. The guide rod (2432) is fixedly connected to the top of the suction cup (2431). The guide rod (2432) slides through the fixing seat (2434). The compression spring (2433) is sleeved on the guide rod (2432). The two ends of the compression spring (2433) press the suction cup (2431) and the fixing seat (2434) respectively.

5. The testing device for automotive-grade power management chips for new energy vehicles according to claim 1, characterized in that, The chip calibration mechanism (300) includes a mounting box (310), a lower calibration structure (320), a guide rail (330), a swing seat structure (340), a first drive rod (350), an upper calibration structure (360), a series rod (370), and a calibration chip placement seat (380). The guide rail (330) is located below the mounting surface of the mounting box (310). Multiple lower calibration structures (320) are arranged at equal intervals from left to right. The four corners of each lower calibration structure (320) are slidably connected to the guide rail (330). The swing seat structure (340) is rotatably connected to the multiple lower calibration structures (320). The upper side of each lower calibration structure (320) can pass through the mounting surface. The fixed ends of the first drive rod (350) are evenly spaced on the swing seat structure (340). Located on the left and right sides of the lower correction structure (320), the upper correction structure (360) is configured in multiple ways, and the multiple upper correction structures (360) are arranged at equal intervals from left to right. The upper correction structure (360) is hinged to the upper side of the mounting surface of the mounting box (310). The series rod (370) passes through the multiple upper correction structures (360) in sequence. The movable end of the first drive rod (350) is rotatably sleeved on the series rod (370). The correction chip placement seat (380) is equally spaced on the upper side of the mounting surface of the mounting box (310). The automotive-grade power management chip falls into the correction chip placement seat (380). After the upper correction structure (360) closes, it presses the automotive-grade power management chip into the correction chip placement seat (380). The upper correction structure (360) and the lower correction structure (320) close each other to correct the pins of the automotive-grade power management chip.

6. The testing device for automotive-grade power management chips for new energy vehicles according to claim 5, characterized in that, The lower correction structure (320) includes a lower pressing plate (321), a first sleeve seat (323), and a lower correction plate (324). The lower pressing plate (321) has sliding holes (322) at its four corners. The guide rail (330) passes through the sliding holes (322). The first sleeve seat (323) is fixedly connected to the lower pressing plate (321) and is rotatably sleeved on the swing seat structure (340). The lower correction plate (324) is disposed on the upper side of the lower pressing plate (321). The lower correction plate (324) has a correction groove (325) at its top. The correction groove (325) is consistent with the pin arrangement of the automotive-grade power management chip.

7. The testing device for automotive-grade power management chips for new energy vehicles according to claim 5, characterized in that, The swing seat structure (340) includes an end seat (341), a connecting seat (342), and a connecting rod (343). The first drive rods (350) located at the left and right ends of the mounting box (310) are mounted on the end seat (341), and the remaining first drive rods (350) are mounted on the connecting seat (342). The end seat (341) and the connecting seat (342) and adjacent connecting seats (342) are connected by the connecting rod (343). The lower correction structure (320) is rotatably sleeved on the connecting rod (343). The output end of the first drive rod (350) passes through the mounting surface of the mounting box (310) and is rotatably sleeved on the connecting rod (370).

8. The testing device for automotive-grade power management chips for new energy vehicles according to claim 5, characterized in that, The upper correction structure (360) includes an upper pressing plate (361), a hinge (362), an upper correction plate (363), a pressing block (365), and a third sleeve seat (366). The upper pressing plate (361) is hinged to the upper side of the mounting surface of the mounting box (310) via the hinge (362). The upper correction plate (363) is disposed inside the upper pressing plate (361). A correction block (364) is disposed at the bottom end of the upper correction plate (363). The pin arrangement is consistent with that of the automotive-grade power management chip. The calibration block (364) presses the pins of the automotive-grade power management chip into the lower calibration structure (320) for calibration. The pressing block (365) is fixed to the inner side of the upper pressing plate (361). The pressing block (365) presses the upper side of the automotive-grade power management chip. The third sleeve seat (366) is fixedly connected to the outer side of the upper pressing plate (361). The connecting rod (370) passes through the third sleeve seat (366).

9. The testing device for automotive-grade power management chips for new energy vehicles according to claim 8, characterized in that, The hinge (362) includes a first hinge seat (3621), a second hinge seat (3622), a hinge shaft (3623), and a limiting plate (3624). The first hinge seat (3621) is fixedly connected to the inner side of the upper pressing plate (361), and the second hinge seat (3622) is fixedly connected to the upper side of the mounting surface of the mounting box (310). The first hinge seat (3621) is hinged to the second hinge seat (3622) through the hinge shaft (3623). The limiting plate (3624) is disposed on the outer side of the second hinge seat (3622). When the upper pressing plate (361) is flipped to a vertical position, the limiting plate (3624) can block the upper pressing plate (361).

10. The testing device for automotive-grade power management chips for new energy vehicles according to claim 1, characterized in that, The chip testing mechanism (400) includes a support box (410), a chip testing socket (420), a swing pressing plate (430), a mounting frame (440), an access pressing point (450), and a second drive rod (460). The chip testing socket (420) is provided with the support surface of the support box (410) from left to right. The swing pressing plate (430) is hinged to the chip testing socket (420). The automotive-grade power management chip can fall into the test slot of the chip testing socket (420). The pins of the power management chip fall into the pin slots. The mounting frame (440) is fixedly connected to the inside of the swing pressing base plate (430). The access pressing point (450) is set on the mounting frame (440). The access pressing point (450) is consistent with the pin arrangement of the automotive power management chip. The access pressing point (450) can press the pins of the automotive power management chip into the pin slots. The two ends of the second drive rod (460) are respectively hinged to the support surfaces of the mounting frame (440) and the support box (410).

Images