A high integration light engine structure

Abstract

The application relates to the technical field of light engines, and discloses a high-integration-degree light engine structure which comprises a substrate, an electric chip, a silicon light chip, a lens structure and a fiber array; the electric chip is arranged on the substrate; the silicon light chip is arranged on the electric chip; the side of the silicon light chip away from the electric chip is provided with a first part and a first microlens, and the first microlens is embedded in the silicon light chip; the lens structure is arranged on the silicon light chip, the side of the lens structure close to the silicon light chip is provided with a second part and a second microlens, and the second microlens is embedded in the lens structure; one of the first part and the second part is a V-shaped groove, and the other is a protrusion; the protrusion is limitedly matched with the V-shaped groove in the plane of the silicon light chip; the first microlens and the second microlens are oppositely arranged; the fiber array is arranged on the lens structure; and the lens structure is further provided with a reflecting surface. Through the embedded alignment of the first microlens and the second microlens, the light path between the silicon light chip and the lens structure is accurately coupled, and the integration degree of the whole light engine structure is improved.

Description

Technical Field

[0001] This invention relates to the field of light engine technology, and in particular to a highly integrated light engine structure. Background Technology

[0002] In optical communication systems, the optical engine is the core module for achieving high-speed, high-density photoelectric signal conversion. With the rapid development of artificial intelligence and data centers, silicon photonics engines have become the mainstream solution. The core of these engines is the silicon photonics chip, which utilizes CMOS technology to highly integrate optical and electronic devices.

[0003] For example, Chinese invention patent CN119644525B discloses a highly integrated silicon photonics module, which includes a carrier frame, a light emitting structure, a silicon photonics component, an optical fiber component, and a housing. The carrier frame includes an upper surface and a lower surface, with the upper surface recessed to form an upper step and the lower surface recessed to form a lower step. The upper and lower steps are spaced apart to form an accommodating space. The light emitting structure includes a PCB board disposed on the lower step and a laser component disposed on the PCB board, with the laser component located in the accommodating space. The silicon photonics component is disposed on the upper step and includes a silicon substrate. An optical waveguide and a microlens are formed on the surface of the silicon substrate. The optical fiber component includes a clamping body and multiple optical fibers arranged side by side. Each optical fiber includes a coupling surface opposite to the microlens. The laser beam emitted by the light emitting component is guided and coupled into the optical fiber through the microlens and the optical waveguide.

[0004] The existing silicon photonics module's carrier frame provides mounting references for the silicon photonics components and light-emitting structure through upper and lower steps, respectively. However, the positioning accuracy of the steps is poor, which cannot meet the requirements for precise coupling of optical signals. Moreover, the carrier frame occupies excessive height space, resulting in a low integration of the entire silicon photonics module. Summary of the Invention

[0005] The technical problem to be solved by the present invention is that the carrier frame of the existing silicon photonics module is positioned by steps, which cannot meet the requirements of precise coupling of optical signals, and the accommodating space of the carrier frame occupies too much height, resulting in a low integration of the entire silicon photonics module.

[0006] To address the aforementioned technical problems, this invention provides a technical solution for a highly integrated optical engine structure: The highly integrated light engine structure includes: substrate; An electrical chip is disposed on the substrate and is electrically connected to the substrate; A silicon photonic chip is disposed on the electrical chip, and the silicon photonic chip is electrically connected to the electrical chip and / or the substrate; a first part and a first microlens are provided on the side of the silicon photonic chip away from the electrical chip, and the first microlens is embedded in the silicon photonic chip; A lens structure is disposed on the silicon photonic chip. The lens structure has a second part and a second microlens on the side close to the silicon photonic chip. The second microlens is embedded in the lens structure. One of the first part and the second part is a V-groove, and the other is a protrusion. The protrusion and the V-groove are matched and positioned within the plane of the silicon photonic chip. The first microlens and the second microlens are vertically opposite each other. An optical fiber array is disposed on the lens structure; the lens structure also has a reflective surface on the side away from the second microlens, forming an optical path from the silicon photonic chip to the first microlens, the second microlens, the reflective surface and the optical fiber array.

[0007] Furthermore, the silicon photonic chip is provided with a first groove on the side away from the electrical chip, the first microlens is disposed in the first groove, and the first part is disposed on the outside of the first groove.

[0008] Furthermore, the lens structure is provided with a second groove on the side near the silicon photonic chip, the second microlens is disposed in the second groove, the second part is disposed on the outside of the second groove, and the second groove and the first groove are connected to form an optical coupling cavity.

[0009] Furthermore, the highly integrated optical engine structure has a length direction and a width direction that are perpendicular to each other; the first part includes a longitudinal V-groove that extends parallel to the length direction; the second part includes a longitudinal protrusion that extends parallel to the length direction and abuts against the groove wall of the longitudinal V-groove. And / or, the first part includes a transverse V-groove extending in a direction parallel to the width; the second part includes a transverse protrusion extending in a direction parallel to the width, the transverse protrusion abutting against the groove wall of the transverse V-groove.

[0010] Furthermore, the longitudinal protrusion includes two opposing inclined sides, the included angle between the two inclined sides matches the opening angle of the longitudinal V-groove, and the edge of the longitudinal protrusion is also provided with a chamfered portion, which is in clearance fit with the bottom of the longitudinal V-groove.

[0011] Furthermore, at least two longitudinal V-grooves are spaced apart in the plane of the silicon photonic chip, and a ridge is formed between two adjacent longitudinal V-grooves; at least two longitudinal protrusions are spaced apart in the plane of the silicon photonic chip, and a groove is formed between two adjacent longitudinal protrusions, and the ridge and the groove are mutually constrained and engaged in the plane of the silicon photonic chip.

[0012] Furthermore, the top of the ridge and the bottom of the groove are fitted with a clearance.

[0013] Furthermore, the silicon photonic chip has a first side surface on the side away from the electrical chip, and the lens structure has a second side surface on the side closer to the silicon photonic chip. The first side surface and the second side surface are connected by adhesive.

[0014] Furthermore, the lens structure is a glass lens, and the lens structure, the second part, and the second microlens are an integral structure. The lens structure has a thinning area on the side near the reflecting surface, and an insertion hole is opened on the side of the lens structure away from the reflecting surface. The fiber array is disposed in the insertion hole and arranged opposite to the reflecting surface.

[0015] Furthermore, the silicon photonics chip also integrates a laser, a PD element, and an MPD element. The laser, the MPD element, and a portion of the first microlens are optically connected, and the PD element is optically connected to another portion of the first microlens.

[0016] Compared with existing technologies, the highly integrated optical engine structure of this invention offers the following advantages: This highly integrated optical engine structure adopts a design consisting of a substrate, an electrical chip, a silicon photonic chip, a lens structure, and a fiber array. The electrical chip is disposed on the substrate, the silicon photonic chip is disposed on the electrical chip, and the lens structure is disposed on the silicon photonic chip. The electrical chip is electrically connected to the substrate, and the silicon photonic chip is electrically connected to the electrical chip and / or the substrate. The electrical chip and the silicon photonic chip are the core chips for realizing photoelectric signal conversion processing and signal transmission. The substrate, electrical chip, silicon photonic chip, and lens structure are sequentially arranged to form a stacked structure, effectively reducing the area occupied on the substrate plane and achieving higher space utilization.

[0017] The silicon photonics chip has a first part and a first microlens on the side furthest from the electrical chip, and a second part and a second microlens on the side of the lens structure closer to the silicon photonics chip. One of the first part and the second part is a protrusion, and the other is a V-groove. The protrusion and the V-groove are positioned and engaged within the plane of the silicon photonics chip. The first part and the second part define the relative position of the silicon photonics chip and the lens structure. The protrusion and the V-groove engage to achieve self-alignment, ensuring precise coupling between the first microlens of the silicon photonics chip and the second microlens of the lens structure. This guarantees the reliability of the silicon photonics chip in emitting and receiving optical signals.

[0018] In addition, the fiber optic array is located within the lens structure, and a reflective surface is also provided on the side of the lens structure away from the second microlens. An optical path is formed sequentially from the silicon photonic chip to the first microlens, the second microlens, the reflective surface, and the fiber optic array. The transmission path is as follows: 1. An optical signal is generated inside the silicon photonic chip and transmitted outwards through the first microlens, the second microlens, and the reflective surface to the fiber optic array. 2. A reception path is as follows: The optical signal inside the fiber optic array is received by the silicon photonic chip via the reflective surface, the second microlens, and the first microlens.

[0019] Because the first microlens is embedded within the silicon photonics chip, and the second microlens is embedded within the lens structure, the lens structure and the silicon photonics chip can be compactly stacked during assembly, eliminating the need for pre-allocated space and enabling alignment of the first and second microlenses. This embedded vertical alignment of the first and second microlenses ensures precise optical path coupling between the silicon photonics chip and the lens structure, further improving the overall integration of the optical engine structure. Attached Figure Description

[0020] Figure 1 This is a three-dimensional schematic diagram of the highly integrated optical engine structure according to an embodiment of the present invention; Figure 2 This is a three-dimensional schematic diagram of the highly integrated optical engine structure (before lens structure assembly) according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of the substrate, the electrical chip, and the silicon photonics chip according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the lens structure and fiber array according to an embodiment of the present invention; Figure 5 This is a cross-sectional schematic diagram of the highly integrated optical engine structure (along the length direction) according to an embodiment of the present invention; Figure 6 This is an internal structure diagram of the silicon photonics chip according to an embodiment of the present invention; In the diagram: 1. Substrate; 2. Electrical chip; 3. Silicon photonic chip; 31. First part; 311. Longitudinal V-groove; 312. Lateral V-groove; 313. Ridge; 32. First microlens; 33. First groove; 34. Optical coupling cavity; 35. First side surface; 36. Laser; 37. PD element; 38. MPD element; 4. Lens structure; 41. Second part; 411. Longitudinal protrusion; 412. Lateral protrusion; 413. Bevel; 414. Chamfered part; 415. Groove; 42. Second microlens; 43. Reflecting surface; 44. Second groove; 45. Second side surface; 46. Thinned area; 5. Fiber array; X, length direction; Y, width direction. Detailed Implementation

[0021] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and are not intended to limit the scope of the invention.

[0022] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise" used to indicate orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0024] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0025] like Figures 1 to 5 As shown, a highly integrated optical engine structure according to an embodiment of the present invention includes: a substrate 1, an electrical chip 2, a silicon photonic chip 3, a lens structure 4, and an optical fiber array 5; the electrical chip 2 is disposed on the substrate 1 and is electrically connected to the substrate 1; the silicon photonic chip 3 is disposed on the electrical chip 2 and is electrically connected to the electrical chip 2 and / or the substrate 1; a first part 31 and a first microlens 32 are provided on the side of the silicon photonic chip 3 away from the electrical chip 2, and the first microlens 32 is embedded in the silicon photonic chip 3.

[0026] Lens structure 4 is disposed on silicon photonic chip 3. On the side of lens structure 4 closest to silicon photonic chip 3, there is a second part 41 and a second microlens 42. The second microlens 42 is embedded in lens structure 4. One of the first part 31 and the second part 41 is a V-groove and the other is a protrusion. The protrusion and the V-groove are matched in a limiting fit within the plane of silicon photonic chip 3. The first microlens 32 and the second microlens 42 are vertically opposite each other. Fiber array 5 is disposed on lens structure 4. On the side of lens structure 4 away from the second microlens 42, there is also a reflective surface 43. An optical path is formed from silicon photonic chip 3 to the first microlens 32, the second microlens 42, the reflective surface 43 and the fiber array 5.

[0027] This highly integrated optical engine structure adopts a design consisting of a substrate 1, an electrical chip 2, a silicon photonic chip 3, a lens structure 4, and a fiber array 5. The electrical chip 2 is mounted on the substrate 1, the silicon photonic chip 3 is mounted on the electrical chip 2, and the lens structure 4 is mounted on the silicon photonic chip 3. The electrical chip 2 is electrically connected to the substrate 1, and the silicon photonic chip 3 is electrically connected to the electrical chip 2 and / or the substrate 1. The electrical chip 2 and the silicon photonic chip 3 are the core chips for realizing photoelectric signal conversion and signal transmission. The substrate 1, electrical chip 2, silicon photonic chip 3, and lens structure 4 are arranged in a stacked structure, which effectively reduces the area occupied on the plane of the substrate 1 and achieves higher space utilization.

[0028] The silicon photonic chip 3 has a first part 31 and a first microlens 32 on the side away from the electrical chip 2, while the lens structure 4 has a second part 41 and a second microlens 42 on the side closer to the silicon photonic chip 3. One of the first part 31 and the second part 41 is a protrusion, and the other is a V-groove. The protrusion and the V-groove are matched and positioned within the plane of the silicon photonic chip 3. The first part 31 and the second part 41 define the relative position of the silicon photonic chip 3 and the lens structure 4. The protrusion and the V-groove provide self-alignment, ensuring precise coupling between the first microlens 32 of the silicon photonic chip 3 and the second microlens 42 of the lens structure 4. This guarantees the reliability of the silicon photonic chip 3 in emitting and receiving optical signals.

[0029] In addition, the fiber array 5 is disposed on the lens structure 4. The lens structure 4 also has a reflective surface 43 on the side away from the second microlens 42. An optical path is formed from the silicon photonic chip 3 to the first microlens 32, the second microlens 42, the reflective surface 43, and the fiber array 5. The transmission path is as follows: an optical signal is generated inside the silicon photonic chip 3 and transmitted outward through the first microlens 32, the second microlens 42, and the reflective surface 43 to the fiber array 5. The reception path is as follows: the optical signal inside the fiber array 5 is received by the silicon photonic chip 3 through the reflective surface 43, the second microlens 42, and the first microlens 32.

[0030] Since the first microlens 32 is embedded within the silicon photonics chip 3, and the second microlens 42 is embedded within the lens structure 4, the lens structure 4 and the silicon photonics chip 3 can be compactly stacked during assembly, eliminating the need for pre-reserved space and enabling alignment of the first microlens 32 and the second microlens 42. This embedded vertical alignment of the first microlens 32 and the second microlens 42 ensures precise optical path coupling between the silicon photonics chip 3 and the lens structure 4, further improving the integration of the entire optical engine structure.

[0031] In this embodiment, as Figure 2 , Figure 3As shown, the silicon photonics chip 3 has a first groove 33 on the side away from the electrical chip 2, a first microlens 32 is disposed in the first groove 33, and a first part 31 is disposed on the outside of the first groove 33. Figure 4 As shown, the lens structure 4 is provided with a second groove 44 on the side near the silicon photonic chip 3, the second microlens 42 is provided in the second groove 44, the second part 41 is provided on the outside of the second groove 44, and the second groove 44 and the first groove 33 are connected to form an optical coupling cavity 34.

[0032] Specifically, the height of the first microlens 32 is equal to the depth of the first groove 33, and the height of the second microlens 42 is equal to the depth of the second groove 44. When the lens structure 4 and the silicon photonics chip 3 are stacked, the vertical gap between the microlenses is eliminated, ensuring that the height of the entire optical engine structure can be compressed. Furthermore, this ensures reliable housing of the first microlens 32 and the second microlens 42, preventing interference between the microlenses and the optical path from affecting the self-alignment accuracy. The optical coupling cavity 34 encloses the microlenses and the optical path in an independent space, preventing moisture and dust from affecting the optical coupling accuracy and ensuring the long-term stability of the optical engine structure.

[0033] As a further preferred option, such as Figure 3 , Figure 4 As shown, the highly integrated optical engine structure has a length direction X and a width direction Y that are perpendicular to each other; the first part 31 includes a longitudinal V-groove 311, which extends parallel to the length direction X; the second part 41 includes a longitudinal protrusion 411, which extends parallel to the length direction X, and the longitudinal protrusion 411 abuts against the groove wall of the longitudinal V-groove 311.

[0034] Furthermore, the first part 31 includes a transverse V-groove 312 extending parallel to the width direction Y; the second part 41 includes a transverse protrusion 412 extending parallel to the width direction Y, and the transverse protrusion 412 abutting against the groove wall of the transverse V-groove 312. The longitudinal protrusion 411 abuts against the longitudinal V-groove 311 to limit the movement in the width direction Y, and the transverse protrusion 412 abuts against the transverse V-groove 312 to limit the movement in the length direction X. The combination of these two perpendicularly oriented limiting mechanisms ensures the coupling and assembly accuracy of the lens structure 4 and the silicon photonic chip 3.

[0035] In some embodiments of this application, the longitudinal protrusion 411 includes two opposing inclined sides 413, the included angle between the two inclined sides 413 matching the opening angle of the longitudinal V-groove 311. The edge of the longitudinal protrusion 411 is also provided with a chamfered portion 414, which is in clearance fit with the bottom of the longitudinal V-groove 311. Correspondingly, the edge of the transverse protrusion 412 is also provided with a chamfered portion, which is in clearance fit with the bottom of the transverse V-groove 312. By using the inclined sides of the protrusion to abut and the chamfered portion to leave a gap, the risk of interference between the edge of the protrusion and the bottom of the V-groove is eliminated, further improving the self-alignment and optical coupling accuracy.

[0036] As a further preferred option, such as Figure 3 As shown, at least two longitudinal V-grooves 311 are spaced apart in the plane of the silicon photonic chip 3, and a ridge 313 is formed between two adjacent longitudinal V-grooves 311; as Figure 4 As shown, at least two longitudinal protrusions 411 are spaced apart in the plane of the silicon photonic chip 3, and a groove 415 is formed between two adjacent longitudinal protrusions 411. The ridge 313 and the groove 415 are positioned and engaged within the plane of the silicon photonic chip 3. Furthermore, the top of the ridge 313 and the bottom of the groove 415 are fitted with a clearance. The ridge 313 and the groove 415 serve as auxiliary structures for the protrusions and V-grooves, increasing the contact area and thus ensuring the stability of self-alignment.

[0037] In this embodiment, the silicon photonics chip 3 has a first side surface 35 on the side away from the electrical chip 2, and the lens structure 4 has a second side surface 45 on the side closer to the silicon photonics chip 3. The first side surface 35 and the second side surface 45 are connected by adhesive. It should be noted that during assembly, a gap can be left between the first side surface 35 and the second side surface 45, with a height dimension ≤300μm. The adhesive connection ensures the reliability of the lens structure 4 installation and prevents the self-alignment accuracy from being affected by direct contact between the first side surface 35 and the second side surface 45.

[0038] Furthermore, the lens structure 4 is a glass lens, and the lens structure 4, the second part 41, and the second microlens 42 are integrated into one unit. A thinning region 46 is provided on the side of the lens structure 4 closest to the reflecting surface 43, and an insertion hole is provided on the side of the lens structure 4 furthest from the reflecting surface 43. The fiber array 5 is located in the insertion hole and arranged opposite to the reflecting surface 43. The thinning region 46 on the lens structure 4 further reduces the local height of the lens structure 4, thereby meeting the requirement for compact installation of the optical engine structure.

[0039] like Figure 6As shown, the silicon photonic chip 3 also integrates a laser 36, a PD element 37, and an MPD element 38. The laser 36, MPD element 38, and part of the first microlens 32 are optically connected, and the PD element 37 is optically connected to part of the first microlens 32. The MPD element 38 is used to monitor and adjust the optical power output by the laser 36. The laser 36, PD element 37, and MPD element 38 are all integrated within the silicon photonic chip 3, thereby achieving the goal of compactly stacking the lens structure 4 and the silicon photonic chip 3.

[0040] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present invention, and these improvements and substitutions should also be considered within the scope of protection of the present invention.

Claims

1. A highly integrated optical engine structure, characterized in that, include: substrate(1); An electrical chip (2) is disposed on the substrate (1) and the electrical chip (2) is electrically connected to the substrate (1); A silicon photonic chip (3) is disposed on the electrical chip (2), and the silicon photonic chip (3) is electrically connected to the electrical chip (2) and / or the substrate (1); a first part (31) and a first microlens (32) are provided on the side of the silicon photonic chip (3) away from the electrical chip (2), and the first microlens (32) is embedded in the silicon photonic chip (3); A lens structure (4) is disposed on the silicon photonic chip (3). The lens structure (4) has a second part (41) and a second microlens (42) on the side close to the silicon photonic chip (3). The second microlens (42) is embedded in the lens structure (4). One of the first part (31) and the second part (41) is a V-groove and the other is a protrusion. The protrusion and the V-groove are matched in a limiting fit within the plane of the silicon photonic chip (3). The first microlens (32) and the second microlens (42) are vertically opposite each other. An optical fiber array (5) is disposed on the lens structure (4); a reflective surface (43) is also provided on the side of the lens structure (4) away from the second microlens (42), forming an optical path from the silicon photonic chip (3) to the first microlens (32), the second microlens (42), the reflective surface (43) and the optical fiber array (5).

2. The highly integrated optical engine structure according to claim 1, characterized in that, The silicon photonic chip (3) is provided with a first groove (33) on the side away from the electrical chip (2), the first microlens (32) is provided in the first groove (33), and the first part (31) is provided on the outside of the first groove (33).

3. The highly integrated optical engine structure according to claim 2, characterized in that, The lens structure (4) is provided with a second groove (44) on the side near the silicon photonic chip (3). The second microlens (42) is provided in the second groove (44), and the second part (41) is provided on the outside of the second groove (44). The second groove (44) and the first groove (33) are connected to form an optical coupling cavity (34).

4. The highly integrated optical engine structure according to any one of claims 1 to 3, characterized in that, The highly integrated optical engine structure has a length direction (X) and a width direction (Y) that are perpendicular to each other; the first part (31) includes a longitudinal V-groove (311) that extends parallel to the length direction (X); the second part (41) includes a longitudinal protrusion (411) that extends parallel to the length direction (X) and abuts against the groove wall of the longitudinal V-groove (311); And / or, the first part (31) includes a transverse V-groove (312) extending in a direction parallel to the width (Y); the second part (41) includes a transverse protrusion (412) extending in a direction parallel to the width (Y), the transverse protrusion (412) abutting against the groove wall of the transverse V-groove (312).

5. The highly integrated optical engine structure according to claim 4, characterized in that, The longitudinal protrusion (411) includes two oppositely arranged inclined sides (413), the included angle between the two inclined sides (413) matches the opening angle of the longitudinal V-groove (311), and the edge of the longitudinal protrusion (411) is also provided with a chamfer (414), the chamfer (414) and the bottom of the longitudinal V-groove (311) are in clearance fit.

6. The highly integrated optical engine structure according to claim 5, characterized in that, At least two longitudinal V-grooves (311) are spaced apart in the plane of the silicon photonic chip (3), and a ridge (313) is formed between two adjacent longitudinal V-grooves (311); at least two longitudinal protrusions (411) are spaced apart in the plane of the silicon photonic chip (3), and a groove (415) is formed between two adjacent longitudinal protrusions (411), and the ridge (313) and the groove (415) are positioned and engaged in the plane of the silicon photonic chip (3).

7. The highly integrated optical engine structure according to claim 6, characterized in that, The top of the ridge (313) and the bottom of the groove (415) are fitted with a clearance.

8. The highly integrated optical engine structure according to any one of claims 1 to 3, characterized in that, The silicon photonic chip (3) has a first side surface (35) on the side away from the electrical chip (2), and the lens structure (4) has a second side surface (45) on the side close to the silicon photonic chip (3). The first side surface (35) and the second side surface (45) are connected by adhesive.

9. The highly integrated optical engine structure according to any one of claims 1 to 3, characterized in that, The lens structure (4) is a glass lens. The lens structure (4), the second part (41) and the second microlens (42) are an integral structure. The lens structure (4) has a thinning area (46) on the side close to the reflective surface (43). The lens structure (4) has an insertion hole on the side away from the reflective surface (43). The fiber array (5) is located in the insertion hole and is arranged opposite to the reflective surface (43).

10. The highly integrated optical engine structure according to any one of claims 1 to 3, characterized in that, The silicon photonic chip (3) also integrates a laser (36), a PD element (37) and an MPD element (38). The laser (36), the MPD element (38) and a portion of the first microlens (32) are optically connected, and the PD element (37) is optically connected to another portion of the first microlens (32).

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