Glue filling speed and direction control method for high-power laser

Abstract

The application relates to the sealing technical field of high-power laser cooling systems, and provides a glue-filling speed and direction control method for a high-power laser. The method comprises the following steps: performing mechanical assembly and vacuum reflow soldering operation on a crystal heat sink in the high-power laser, and performing glue-filling sealing on water channels on the crystal heat sink; organic silicone sealant is loaded into a glue-filling syringe; for a through-hole type glue-filling position on the crystal heat sink and communicating with the water channels, a glue-filling needle is vertically aligned with the through hole and is inserted into the through hole to a preset depth; when sealant overflows from an outlet above the through hole and completely covers the outlet, the glue-filling needle is slowly removed from the through hole while the glue-filling needle is kept slowly discharging the sealant, until an inlet below the through hole is completely covered by the sealant; for a blind hole type glue-filling position on the crystal heat sink, a stainless steel probe is used to take the sealant from the bottom of the blind hole and coat multiple circles along the thread hole points; the crystal heat sink after the glue-filling is completed is placed at room temperature until the sealant is completely solidified, and air tightness testing is completed.

Description

Technical Field

[0001] This application relates to the field of sealing technology for cooling systems of high-power lasers, and in particular to a method for controlling the potting speed and direction of a high-power laser. Background Technology

[0002] With the continuous improvement of the output power of high-power solid-state lasers, the heat dissipation effect of crystal heat sinks directly determines the working stability and service life of the laser. Crystal heat sinks are usually equipped with water channels for water cooling. After the welding of each stage of the crystal heat sink is completed, the sealing of the water channels at the mechanical connection is a key factor in ensuring the normal operation of the cooling system.

[0003] Currently, the mainstream potting and sealing materials in the industry mainly include silicone, epoxy resin, and polyurethane. Silicone has good elasticity and a wide temperature range, but its adhesion is generally weak and its mechanical strength is low. Epoxy resin has high rigidity and high bonding strength, but poor resistance to thermal shock. Polyurethane has moderate elasticity, good bonding strength, and high temperature resistance, but poor resistance to humid heat. The mainstream sealing processes are mainly divided into two types: dry compression and wet assembly. Dry compression involves completely curing the adhesive on the sealing surface to form a pre-formed rubber ring before mechanical assembly and sealing. Wet assembly involves mechanical assembly immediately before the adhesive has cured, then allowing the adhesive to cure and bond to achieve a seal.

[0004] However, the aforementioned existing technologies have several insurmountable drawbacks when applied to sealing crystal heat sinks in high-power lasers. Firstly, the process sequence of both traditional sealing methods cannot be adapted to the specific processing requirements of crystal heat sinks. The crystal and the heat sink need to be encapsulated in a clean environment using indium foil via vacuum reflow soldering, with a soldering temperature of approximately 170 degrees Celsius. If a dry compression process is used, the pre-formed rubber ring cannot fill and seal the internal water channels and blind holes after the mechanical assembly and welding are completed. If a wet assembly process is used, the sealant is poured in first and then soldered; the high welding temperature causes the sealant to cure prematurely, generating a large amount of volatile pollutants that severely contaminate the crystal end face. Simultaneously, the curing shrinkage of the sealant produces significant stress deformation, leading to a decrease in the crystal's optical performance and directly affecting the subsequent power amplification effect of the laser. Summary of the Invention

[0005] This application provides a method for controlling the potting speed and direction of a high-power laser, aiming to solve the problems of existing technologies being unable to adapt to the special processing requirements of crystal heat sinks when applied to sealing high-power laser crystal heat sinks.

[0006] In a first aspect, embodiments of this application provide a method for controlling the potting speed and direction of a high-power laser, the method comprising: Mechanical assembly and vacuum reflow soldering are performed on the crystal heat sink in the high-power laser. The water channels on the crystal heat sink are sealed with glue. The silicone sealant is loaded into the glue injection syringe and the inside of the syringe is evacuated. For the through-hole type glue filling point on the crystal heat sink that connects to the water channel, select a glue filling needle of preset specification, align the glue filling needle vertically with the through hole and insert it into the through hole to a preset depth, and steadily control the glue dispensing speed according to the principle of low pressure and slow dispensing; when the sealant overflows from the outlet above the through hole and completely covers the outlet, while keeping the glue filling needle dispensing glue slowly, gradually move the glue filling needle out of the through hole until the inlet below the through hole is completely covered by sealant, stop pushing glue and perform a back suction operation; For blind hole-type encapsulation areas on crystal heat sinks, use a stainless steel probe to apply sealant in multiple turns from the bottom of the blind hole along the threaded hole, and apply multiple turns of sealant to the cleaned set screw threads; screw the set screw into the blind hole and repeatedly screw it in and out to ensure that the thread engagement gap is filled with sealant; let the encapsulated crystal heat sink stand at room temperature until the sealant is completely cured, and then complete the airtightness test.

[0007] In some embodiments, the mechanical assembly and vacuum reflow soldering operation of the crystal heat sink in the high-power laser includes: completely wrapping the crystal with indium foil, clamping the wrapped crystal between the upper and middle mechanical components of the crystal heat sink, fastening the upper and middle mechanical components together with screws, and placing the assembled crystal heat sink into a vacuum reflow soldering equipment for soldering, so that the indium foil melts and comes into full contact with the metal surface of the mechanical components, and then cools and solidifies.

[0008] In some embodiments, the process of potting and sealing the water channels on the crystal heat sink includes: after completing the complete cleaning operation of the crystal heat sink, the assembly and fastening operation of mechanical parts, and the vacuum reflow soldering operation, potting and sealing the water channels on the crystal heat sink to avoid the high temperature of welding causing contaminants and stress deformation in the sealant.

[0009] In some embodiments, the step of loading the silicone sealant into a dispensing syringe and performing a vacuum treatment inside the syringe includes: obtaining a preset volume of silicone sealant and loading it into the dispensing syringe; connecting the dispensing syringe to a vacuum device; and performing a vacuum treatment inside the dispensing syringe to remove air bubbles from the sealant.

[0010] In some embodiments, for the through-hole type glue filling point on the crystal heat sink that communicates with the water channel, a glue filling needle of a preset specification is selected, the glue filling needle is vertically aligned with the through hole and inserted into the through hole to a preset depth, and the glue dispensing speed is stably controlled according to the principle of low pressure and slow dispensing, including: for the through-hole type glue filling point on the crystal heat sink that communicates with the water channel, a glue filling needle with an inner diameter of 0.14mm within a first preset deviation range is selected, the glue filling needle is vertically aligned with the through hole and inserted into the through hole to a depth of 1mm within the second preset deviation range, and the glue dispensing speed is stably controlled at (0.5mm / s, 0.6mm / s) according to the principle of low pressure and slow dispensing.

[0011] In some embodiments, when sealant overflows from the outlet above the through hole and completely covers the outlet, while keeping the dispensing needle slowly dispensing sealant, the dispensing needle is gradually moved out of the through hole until the inlet below the through hole is completely covered by sealant. Then, the dispensing needle is stopped and a back suction operation is performed. This includes: when a suitable amount of sealant overflows from the outlet above the through hole and completely covers the entire outlet surface, keeping the dispensing needle slowly dispensing sealant and slowly moving the crystal heat sink upwards, so that the dispensing needle is gradually moved out of the through hole until the inlet below the through hole is completely covered by sealant. Then, the push rod of the dispensing syringe is stopped, and a moderate back suction operation is performed on the dispensing syringe.

[0012] In some embodiments, the method of applying sealant to blind-hole type potting areas on crystal heat sinks by using a stainless steel probe to take sealant and apply it in multiple circles from the bottom of the blind hole along the threaded hole includes: for blind-hole type potting areas on crystal heat sinks, using a stainless steel probe to take an appropriate amount of sealant and applying it evenly in 3 to 4 circles from the bottom of the blind hole along the inner wall of the threaded hole.

[0013] In some embodiments, applying multiple turns of sealant to the cleaned set screw thread includes: cleaning the set screw to remove impurities and oil from its surface, and applying 2 to 3 turns of sealant evenly to the cleaned set screw thread surface using a stainless steel probe.

[0014] In some embodiments, the step of repeatedly screwing the set screw into the blind hole and then screwing it out and in to ensure that the thread engagement gap is filled with sealant includes: slowly screwing the set screw, which has been dotted with sealant, into the blind hole; after it is screwed in, slowly screwing the set screw out and then screwing it back into the blind hole; repeating the above screwing-out and screwing-in operation multiple times to ensure that the thread engagement gap between the set screw and the blind hole is completely filled with sealant.

[0015] In some embodiments, the step of allowing the encapsulated crystal heat sink to stand at room temperature until the sealant is fully cured and then performing an airtightness test includes: placing the encapsulated crystal heat sink in a room temperature environment for 24 hours to allow the sealant to fully cure, and then performing an airtightness test on the water channels of the crystal heat sink after the sealant has fully cured.

[0016] This application completely avoids the adverse effects of high welding temperatures on the sealant by first completing the mechanical assembly and vacuum reflow soldering of the crystal heat sink, and then performing potting and sealing. This process not only prevents contaminants generated during the curing of the sealant from polluting the crystal end face, but also completely eliminates the stress deformation caused by the shrinkage of the cured sealant, thus ensuring the optical performance of the crystal and the power amplification effect of the laser.

[0017] Different precision dispensing methods are employed for the two different structures: through-hole and blind-hole. For through-hole structures, strict control of needle specifications, insertion depth, and dispensing speed ensures full sealant filling without air bubbles or stringing. For blind-hole structures, spot application with a stainless steel probe and repeated screwing in and out of the set screw ensures that the thread engagement gap is completely filled with sealant, eliminating the risk of leakage.

[0018] By vacuuming the syringe containing the sealant before dispensing, air bubbles inside the sealant are removed in advance, reducing the possibility of seal failure from the source. No complex specialized equipment is required; the entire operation can be completed using only standard dispensing syringes, needles, and stainless steel probes, making it low-cost and suitable for large-scale industrial production applications.

[0019] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic flowchart illustrating the steps of a method for controlling the potting speed and direction of a high-power laser according to an embodiment of this application; Figure 2 This is a schematic block diagram of the structure of a high-power laser potting speed and direction control system provided in one embodiment of this application; Figure 3 This is a schematic block diagram of the structure of a computer device provided in an embodiment of this application.

[0022] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0024] The flowchart shown in the attached diagram is for illustrative purposes only and does not necessarily include all content and operations / steps, nor does it necessarily have to be performed in the order described. For example, some operations / steps can be broken down, combined, or partially merged, so the actual execution order may change depending on the actual situation.

[0025] It should be understood that, in order to clearly describe the technical solutions of the embodiments of the present invention, the terms "first" and "second" are used in the embodiments of the present invention to distinguish identical or similar items with essentially the same function and effect. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and the terms "first" and "second" are not necessarily different.

[0026] It should be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0027] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0028] With the continuous improvement of the output power of high-power solid-state lasers, the heat dissipation effect of crystal heat sinks directly determines the working stability and service life of the laser. Crystal heat sinks are usually equipped with water channels for water cooling. After the welding of each stage of the crystal heat sink is completed, the sealing of the water channels at the mechanical connection is a key factor in ensuring the normal operation of the cooling system.

[0029] Currently, the mainstream potting and sealing materials in the industry mainly include silicone, epoxy resin, and polyurethane. Silicone has good elasticity and a wide temperature range, but its adhesion is generally weak and its mechanical strength is low. Epoxy resin has high rigidity and high bonding strength, but poor resistance to thermal shock. Polyurethane has moderate elasticity, good bonding strength, and high temperature resistance, but poor resistance to humid heat. The mainstream sealing processes are mainly divided into two types: dry compression and wet assembly. Dry compression involves completely curing the adhesive on the sealing surface to form a pre-formed rubber ring before mechanical assembly and sealing. Wet assembly involves mechanical assembly immediately before the adhesive has cured, then allowing the adhesive to cure and bond to achieve a seal.

[0030] However, the aforementioned existing technologies have several insurmountable drawbacks when applied to sealing crystal heat sinks in high-power lasers. Firstly, the process sequence of both traditional sealing methods cannot be adapted to the specific processing requirements of crystal heat sinks. The crystal and the heat sink need to be encapsulated in a clean environment using indium foil via vacuum reflow soldering, with a soldering temperature of approximately 170 degrees Celsius. If a dry compression process is used, the pre-formed rubber ring cannot fill and seal the internal water channels and blind holes after the mechanical assembly and welding are completed. If a wet assembly process is used, the sealant is poured in first and then soldered; the high welding temperature causes the sealant to cure prematurely, generating a large amount of volatile pollutants that severely contaminate the crystal end face. Simultaneously, the curing shrinkage of the sealant produces significant stress deformation, leading to a decrease in the crystal's optical performance and directly affecting the subsequent power amplification effect of the laser.

[0031] Secondly, existing potting methods do not differentiate the potting locations for different structures on the crystal heat sink, nor do they precisely control the potting speed, direction, and needle insertion depth. For long, narrow through-hole potting locations connected to water channels, problems such as incomplete sealant filling and numerous residual air bubbles easily occur, leading to seal failure and leakage; at the same time, glue stringing and overflow can easily occur, contaminating the crystal end face. For threaded blind hole potting locations, existing methods struggle to evenly distribute the sealant across the thread engagement gap, easily leading to leakage problems after long-term use.

[0032] To solve the above problem, please refer to Figure 1 This application provides a method for controlling the dispensing speed and direction of a high-power laser, applied to computer equipment. The computer equipment can be deployed on a single server or server cluster. It can also be deployed on handheld terminals, laptops, wearable devices, or robots, etc. The provided method for controlling the dispensing speed and direction of a high-power laser includes steps S101 to S103, detailed below: Step S101. Perform mechanical assembly and vacuum reflow soldering on the crystal heat sink in the high-power laser, and seal the water channels on the crystal heat sink with glue; put the silicone sealant into the glue injection syringe and evacuate the inside of the syringe.

[0033] Specifically, this application provides a method for controlling the dispensing speed and direction of a high-power laser, which can be applied to computer equipment. The computer equipment can be deployed on a single server or server cluster, or on a handheld terminal, laptop, wearable device, or industrial robot. The entire process of this method is automated by controlling automated dispensing equipment, vacuum reflow soldering equipment, and airtightness testing equipment.

[0034] The high-power laser crystal heat sink used in this embodiment is constructed by sequentially stacking an upper mechanical component, a middle mechanical component, and a lower mechanical component. The upper and middle mechanical components are fastened together by multiple screws, forming an internal water channel between their mating surfaces for cooling. The crystal is completely wrapped in indium foil and clamped between the upper and middle mechanical components. A vacuum reflow soldering process achieves a tight heat dissipation connection between the crystal and the heat sink's metal surface. The crystal heat sink has two types of potting areas: the first type is a through-hole formed by the upper and middle mechanical components, directly communicating with the internal water channel; the second type is a blind hole with internal threads within the upper and middle mechanical components themselves, used to seal the water channel machining holes.

[0035] This step includes two sub-steps: the assembly and welding of the crystal heat sink and the pretreatment of the sealant. Specifically, it includes the following steps: Crystal heat sink cleaning and assembly: Use anhydrous ethanol to ultrasonically clean the upper, middle, and lower mechanical components, as well as the crystal to be packaged, to remove surface oil, dust, and metal debris. Dry the components and set aside. Completely wrap the crystal with uniformly thick indium foil, ensuring there are no bubbles or wrinkles between the foil and the crystal surface. Place the wrapped crystal into the crystal mounting slot of the middle mechanical component, aligning it with the locating pins and mounting holes of the upper and middle mechanical components. Use a torque wrench to tighten all connecting screws sequentially to the preset torque, completing the mechanical assembly of the crystal heat sink.

[0036] Vacuum reflow soldering operation: The assembled crystal heat sink is placed into the furnace of the vacuum reflow soldering equipment, the furnace is closed, and a vacuum is drawn to the preset vacuum level. The temperature is increased to 170 degrees Celsius according to the preset temperature profile and held for a preset time to allow the indium foil to completely melt and fully wet the metal surface of the mechanical parts. Then, it is slowly cooled to room temperature according to the preset cooling rate to solidify the molten indium foil, achieving a tight heat dissipation connection between the crystal and the heat sink.

[0037] Sealant Pretreatment: Take 5 ml of K-704 silicone sealant and fill it into a 10 ml disposable syringe. Mount the syringe onto the clamp of a vacuum equipment. Start the vacuum equipment and evacuate the syringe for 5 minutes to remove any air bubbles trapped inside the sealant. After vacuuming, turn off the equipment and remove the syringe for later use.

[0038] Step S102. For the through-hole type glue filling point on the crystal heat sink that is connected to the water channel, select a glue filling needle of preset specification, align the glue filling needle vertically with the through hole and insert it into the through hole to a preset depth, and steadily control the glue dispensing speed according to the principle of low pressure and slow dispensing; when the sealant overflows from the outlet above the through hole and completely covers the outlet, while keeping the glue filling needle dispensing glue slowly, gradually move the glue filling needle out of the through hole until the inlet below the through hole is completely covered by sealant, stop pushing glue and perform a back suction operation.

[0039] Specifically, this step involves sealing the through-hole, which connects to the internal water channel, with adhesive. The steps include: Preparation for dispensing: Install a No. 22 dispensing needle (approximately 0.41 mm inner diameter) onto a pre-treated dispensing syringe. Vertically fix the dispensing syringe to the fixture of the automated dispensing equipment, or have the operator hold the syringe body with one hand and use a tabletop to vertically support the bottom of the syringe's push rod. With the other hand, hold the lower mechanical part of the crystal heat sink and adjust its orientation so that the axis of the through-hole at the dispensing point is completely perpendicular to the axis of the dispensing needle.

[0040] Needle positioning and dispensing: Control the automated dispensing equipment or manually move the crystal heat sink to insert the dispensing needle into the through-hole to a depth of approximately one millimeter from the bottom inlet. Following the principle of low pressure and slow dispensing, slowly push the plunger of the dispensing syringe, steadily controlling the dispensing speed between 0.5 and 0.6 millimeters per second. The time to fill a single through-hole should be controlled to approximately three minutes. During the dispensing process, continuously observe the sealant filling inside the through-hole to ensure that the sealant fills evenly from bottom to top without air bubbles.

[0041] Final sealant application procedure: When a suitable amount of sealant overflows from the upper outlet of the through-hole and completely covers the entire outlet surface, continue slowly dispensing sealant from the dispensing needle while slowly moving the crystal heat sink upwards, gradually removing the dispensing needle from inside the through-hole. When the tip of the dispensing needle is about to leave the lower inlet of the through-hole, stop moving the crystal heat sink and continue dispensing sealant until the lower inlet of the through-hole is completely covered by sealant. At this point, immediately stop pushing the dispensing syringe plunger and perform a moderate back suction operation on the dispensing syringe to prevent sealant from dripping and contaminating the crystal end face.

[0042] Step S103. For the blind-hole type glue injection area on the crystal heat sink, use a stainless steel probe to pick up sealant and apply it in multiple circles along the threaded hole from the bottom of the blind hole, and apply sealant in multiple circles on the cleaned top screw thread; screw the top screw into the blind hole and then repeatedly screw it out and in to ensure that the threaded engagement gap is filled with sealant; let the crystal heat sink after glue injection stand at room temperature until the sealant is completely cured, and complete the airtightness test.

[0043] Specifically, this step performs glue injection and sealing on the glue injection area, i.e., the blind hole with internal threads, and completes the curing of the sealant and the airtightness test. It specifically includes the following steps: Glue injection inside the blind hole: Take a stainless steel probe with a diameter of 0.5 mm, dip the probe in an appropriate amount of K-704 silicone sealant. Insert the probe into the bottom of the blind hole and evenly apply the sealant in 3 to 4 circles along the inner wall of the threaded hole in a spiral upward direction from the bottom of the blind hole, ensuring that the bottom of the blind hole and the inner wall of the thread are evenly covered with sealant.

[0044] Pre-treatment and installation of the top screw: Clean the M2.5 specification top screw with anhydrous ethanol to remove the oil stains and impurities on the surface of the top screw. Use a stainless steel probe to evenly apply 2 to 3 circles of sealant on the external thread surface of the cleaned top screw. Slowly screw the top screw with sealant applied into the blind hole. After screwing it in place, slowly screw the top screw out by one-third of a turn, and then screw it back into the blind hole again. Repeat the above screwing out and in operations three times to ensure that all threaded engagement gaps between the top screw and the blind hole are completely filled with sealant.

[0045] Curing of the sealant and airtightness test: Place the crystal heat sink after all glue injection operations horizontally in a dust-free room temperature environment and let it stand for 24 hours to completely cure the sealant. After the sealant is completely cured, connect the water channel interface of the crystal heat sink to the airtightness test equipment, introduce compressed air with a preset pressure into the water channel, immerse the entire crystal heat sink in water, and observe whether there are bubbles generated. If there are no bubbles generated for 5 consecutive minutes, it is determined that the airtightness is qualified, and the entire glue injection and sealing process is completed.

[0046] The method for controlling the glue injection speed and direction of the high-power laser provided by the embodiment of the present application can be executed by manual operation or by controlling an automated device through a computer device. The computer device can be deployed on a single server or a server cluster, or can be deployed on a handheld terminal, a laptop computer, a wearable device or an industrial robot, and the entire process of this method can be automatically executed by controlling an automated glue injection device, a vacuum reflow soldering device and an airtightness test device.

[0047] The high-power laser crystal heat sink applicable to all embodiments of this application is constructed by sequentially stacking an upper mechanical component, a middle mechanical component, and a lower mechanical component. The upper and middle mechanical components are fastened together by multiple M3 screws, forming an internal water channel between their mating surfaces for cooling. The crystal is completely wrapped with indium foil and clamped between the upper and middle mechanical components, achieving a tight heat dissipation connection between the crystal and the heat sink metal surface through a vacuum reflow soldering process. The crystal heat sink has two types of potting areas: the first type, potting area one, is a through-hole formed by the combination of the upper and middle mechanical components, directly communicating with the internal water channel; the second type, potting area two, is a blind hole with internal threads opened within the upper and middle mechanical components themselves, used to seal the processing holes for the water channel.

[0048] In some embodiments, the mechanical assembly and vacuum reflow soldering operation of the crystal heat sink in the high-power laser includes: completely wrapping the crystal with indium foil, clamping the wrapped crystal between the upper and middle mechanical components of the crystal heat sink, fastening the upper and middle mechanical components together with screws, and placing the assembled crystal heat sink into a vacuum reflow soldering equipment for soldering, so that the indium foil melts and comes into full contact with the metal surface of the mechanical components, and then cools and solidifies.

[0049] This embodiment further defines the technical feature of "mechanical assembly and vacuum reflow soldering of crystal heat sinks in high-power lasers", specifically including the following steps: Crystal pretreatment: Select a high-purity indium foil with a thickness of 0.1 mm and completely wrap the laser crystal to be packaged. During the wrapping process, use dust-free tweezers to gently smooth the surface of the indium foil to ensure that the indium foil is in close contact with all heat dissipation surfaces of the crystal, without bubbles, wrinkles or damage.

[0050] Mechanical component assembly: Precisely place the indium foil-wrapped crystal into the crystal mounting slot of the middle mechanical component, aligning the locating pins and mounting holes of the upper and middle mechanical components. Using a torque wrench, tighten all M3 connecting screws in a diagonal sequence, controlling the tightening torque of each screw between 0.8 Nm and 1.0 Nm to ensure a tight fit between the mating surfaces of the upper and middle mechanical components and uniform force on the crystal.

[0051] Vacuum reflow soldering: The assembled crystal heat sink is placed stably on the platform inside the furnace of the vacuum reflow soldering equipment. The furnace door is closed and the vacuum system is activated to reduce the vacuum level inside the furnace to below 10 Pa. The temperature is increased according to the preset temperature profile: first, the temperature is increased to 120 degrees Celsius at a rate of 10 degrees Celsius per minute and held for 10 minutes to remove adsorbed moisture from the workpiece surface; then, the temperature is increased to 170 degrees Celsius at a rate of 5 degrees Celsius per minute and held for 15 minutes to completely melt the indium foil and fully wet the copper metal surface of the mechanical part; finally, the temperature is slowly cooled to room temperature at a rate of 3 degrees Celsius per minute to uniformly solidify the molten indium foil, achieving a high thermal conductivity connection between the crystal and the heat sink.

[0052] In some embodiments, the process of potting and sealing the water channels on the crystal heat sink includes: after completing the complete cleaning operation of the crystal heat sink, the assembly and fastening operation of mechanical parts, and the vacuum reflow soldering operation, potting and sealing the water channels on the crystal heat sink to avoid the high temperature of welding causing contaminants and stress deformation in the sealant.

[0053] This embodiment further defines the technical feature of "sealing the water channels on the crystal heat sink with glue", specifically including the following steps: Strictly follow the following process sequence: First, thoroughly clean all mechanical parts and crystals to be assembled. Then, assemble and tighten the mechanical parts. Next, perform vacuum reflow soldering. After the vacuum reflow soldering is completed and the crystal heat sink has cooled to room temperature, finally, apply adhesive to seal the water channels on the crystal heat sink.

[0054] This process sequence completely avoids the problem in the traditional process of first applying adhesive and then welding, where the high welding temperature of 170 degrees Celsius causes the sealant to cure prematurely, generating a large amount of volatile organic pollutants that contaminate the crystal end face. At the same time, it completely eliminates the influence of stress deformation caused by sealant curing shrinkage on the optical performance of the crystal, ensuring the subsequent power amplification effect of the laser.

[0055] In some embodiments, the step of loading the silicone sealant into a dispensing syringe and performing a vacuum treatment inside the syringe includes: obtaining a preset volume of silicone sealant and loading it into the dispensing syringe; connecting the dispensing syringe to a vacuum device; and performing a vacuum treatment inside the dispensing syringe to remove air bubbles from the sealant.

[0056] This embodiment further defines the technical feature of "filling the silicone sealant into a dispensing syringe and performing a vacuum treatment inside the syringe", specifically including the following steps: Sealant selection: K-704 type single-component room temperature curing silicone sealant is selected. This sealant has good elasticity, water resistance and high and low temperature resistance, and is suitable for long-term sealing of laser cooling systems.

[0057] Filling procedure: Take 5 ml of K-704 silicone sealant and slowly fill it into a 10 ml disposable polypropylene syringe. Avoid vigorous stirring during filling to prevent air from getting into the sealant.

[0058] Vacuuming: Push the plunger of the dispensing syringe above the sealant level to expel most of the air from the syringe. Then, mount the dispensing syringe onto the special clamp of the vacuum equipment, ensuring a good seal between the syringe and the vacuum equipment. Start the vacuum equipment and evacuate the inside of the dispensing syringe for five minutes, maintaining a vacuum level below 1 kPa to allow any tiny air bubbles trapped inside the sealant to escape. After vacuuming is complete, slowly release the vacuum and remove the dispensing syringe for later use.

[0059] In some embodiments, for the through-hole type glue filling point on the crystal heat sink that communicates with the water channel, a glue filling needle of a preset specification is selected, the glue filling needle is vertically aligned with the through hole and inserted into the through hole to a preset depth, and the glue dispensing speed is stably controlled according to the principle of low pressure and slow dispensing, including: for the through-hole type glue filling point on the crystal heat sink that communicates with the water channel, a glue filling needle with an inner diameter of 0.14mm within a first preset deviation range is selected, the glue filling needle is vertically aligned with the through hole and inserted into the through hole to a depth of 1mm within the second preset deviation range, and the glue dispensing speed is stably controlled at (0.5mm / s, 0.6mm / s) according to the principle of low pressure and slow dispensing.

[0060] This embodiment further defines the technical feature of "selecting a pre-specified dispensing needle for the through-hole type dispensing point on the crystal heat sink that connects to the water channel, vertically aligning the dispensing needle with the through-hole and inserting it into the through-hole to a pre-specified depth, and stably controlling the dispensing speed according to the principle of low pressure and slow dispensing," specifically including the following steps: Selection of dispensing needle: For the through-hole type dispensing area on the crystal heat sink with an inner diameter of approximately one millimeter and a length of approximately sixteen millimeters, a No. 22 stainless steel dispensing needle with an inner diameter of 0.41 millimeters and an allowable deviation of ±0.02 millimeters is selected. This needle specification can ensure smooth flow of sealant while precisely controlling the dispensing volume and direction.

[0061] Needle positioning: Install the selected dispensing needle onto the pre-treated dispensing syringe. Adjust the orientation of the crystal heat sink so that the axis of the through-hole is completely perpendicular to the horizontal plane. Align the dispensing needle vertically with the lower inlet of the through-hole, controlling the depth of the needle insertion into the through-hole to be one millimeter, with an allowable deviation of ±0.1 millimeters.

[0062] Dispensing speed control: Following the principle of low pressure and slow dispensing, slowly and evenly push the plunger of the dispensing syringe to stably control the dispensing speed between 0.5 mm and 0.6 mm per second. The time to fill a single through-hole should be controlled at about three minutes to ensure that the sealant fills the inside of the through-hole slowly and evenly from bottom to top, avoiding air bubbles or sealant splashing that contaminates the crystal end face due to excessive dispensing speed.

[0063] In some embodiments, when sealant overflows from the outlet above the through hole and completely covers the outlet, while keeping the dispensing needle slowly dispensing sealant, the dispensing needle is gradually moved out of the through hole until the inlet below the through hole is completely covered by sealant. Then, the dispensing needle is stopped and a back suction operation is performed. This includes: when a suitable amount of sealant overflows from the outlet above the through hole and completely covers the entire outlet surface, keeping the dispensing needle slowly dispensing sealant and slowly moving the crystal heat sink upwards, so that the dispensing needle is gradually moved out of the through hole until the inlet below the through hole is completely covered by sealant. Then, the push rod of the dispensing syringe is stopped, and a moderate back suction operation is performed on the dispensing syringe.

[0064] This embodiment further defines the technical feature of "when sealant overflows from the outlet above the through hole and completely covers the outlet, while keeping the dispensing needle slowly dispensing sealant, gradually remove the dispensing needle from the through hole until the inlet below the through hole is completely covered by sealant, stop dispensing sealant and perform a back suction operation", specifically including the following steps: During the dispensing process, continuously observe the sealant overflow from the outlet above the through hole. When a suitable amount of sealant is observed to overflow from the outlet above, and the sealant completely covers the entire outlet surface, forming a uniform bulge, continue dispensing the sealant slowly at the original speed.

[0065] The crystal heat sink is slowly moved upwards at a speed of 0.2 to 0.3 millimeters per second, causing the dispensing needle to gradually move downwards relative to the through-hole. Throughout the entire process of the needle moving out, the dispensing of adhesive is kept slow to ensure that the sealant inside the through-hole remains saturated and that air bubbles are not drawn in due to negative pressure generated during the needle's movement.

[0066] When the tip of the dispensing needle is about to leave the lower entrance of the through-hole, stop moving the crystal heat sink and continue dispensing for about one second to completely cover the lower entrance of the through-hole with sealant. At this point, immediately stop pushing the dispensing syringe plunger and quickly perform a moderate back suction operation on the dispensing syringe, controlling the back suction volume to about 0.01 ml, to effectively prevent sealant from dripping and contaminating the crystal end face.

[0067] In some embodiments, the method of applying sealant to blind-hole type potting areas on crystal heat sinks by using a stainless steel probe to take sealant and apply it in multiple circles from the bottom of the blind hole along the threaded hole includes: for blind-hole type potting areas on crystal heat sinks, using a stainless steel probe to take an appropriate amount of sealant and applying it evenly in 3 to 4 circles from the bottom of the blind hole along the inner wall of the threaded hole.

[0068] This embodiment further defines the technical feature of "using a stainless steel probe to apply sealant in multiple circles from the bottom of the blind hole along the threaded hole for blind hole-type potting areas on crystal heat sinks," specifically including the following steps: Tool preparation: Select a medical stainless steel probe with a diameter of 0.5 mm, and grind the tip of the probe into an arc shape to avoid scratching the threads inside the blind hole.

[0069] Dispensing procedure: Using a polished stainless steel probe, apply an appropriate amount of K-704 silicone sealant to the tip, ensuring a uniform layer of sealant adheres to the probe. Slowly insert the probe into the bottom of the blind hole, and starting from the bottom, evenly dispense three to four turns of sealant along the inner wall of the threaded hole in a spiral upward motion. Control the probe's movement speed during the dispensing process to ensure that each thread is evenly covered with sealant, and that there are no blind spots at the bottom of the blind hole.

[0070] In some embodiments, applying multiple turns of sealant to the cleaned set screw thread includes: cleaning the set screw to remove impurities and oil from its surface, and applying 2 to 3 turns of sealant evenly to the cleaned set screw thread surface using a stainless steel probe.

[0071] This embodiment further defines the technical feature of "applying multiple turns of sealant to the cleaned set screw thread", specifically including the following steps: Set screw cleaning: Select an M2.5 stainless steel internal hexagon set screw and immerse it in an ultrasonic cleaner containing anhydrous ethanol for five minutes to remove oil, dust, and metal shavings from the surface. After cleaning, remove the set screw and dry it with dust-free nitrogen gas to ensure that there are no impurities remaining on the surface.

[0072] Applying sealant to the set screw: Using the same stainless steel probe as in Example 6, apply an appropriate amount of K-704 silicone sealant. Starting from the end of the set screw, evenly apply two to three turns of sealant along the thread direction on the cleaned external thread surface of the set screw. During application, avoid applying sealant to the internal hex head of the set screw to prevent interference with subsequent tightening operations.

[0073] In some embodiments, the step of repeatedly screwing the set screw into the blind hole and then screwing it out and in to ensure that the thread engagement gap is filled with sealant includes: slowly screwing the set screw, which has been dotted with sealant, into the blind hole; after it is screwed in, slowly screwing the set screw out and then screwing it back into the blind hole; repeating the above screwing-out and screwing-in operation multiple times to ensure that the thread engagement gap between the set screw and the blind hole is completely filled with sealant.

[0074] This embodiment further defines the technical feature of "screwing the set screw into the blind hole and then repeatedly screwing it in and out to ensure that the thread engagement gap is filled with sealant", specifically including the following steps: Set screw installation: Slowly screw the set screw, which has been dotted with sealant, into the blind hole. During the screwing process, keep the set screw and the blind hole coaxial to avoid misalignment of the threads and scratching the sealant.

[0075] Repeatedly screwing out and screwing in: After the set screw is screwed in place, slowly screw out the set screw by one-third of a turn, and then slowly screw it back into the blind hole and tighten it again. Repeat the above screwing out and screwing in operations three times. Through the reciprocating movement of the set screw, the sealant is evenly squeezed into all the thread engagement gaps between the set screw and the blind hole, ensuring that there is no residual gap, so as to achieve a reliable sealing effect.

[0076] In some embodiments, the crystal heat sink after glue injection is left to stand at room temperature until the sealant is completely cured, and the airtightness test is completed, including: placing the crystal heat sink after glue injection in a room temperature environment and leaving it to stand for 24 hours to completely cure the sealant. After the sealant is completely cured, the water channels of the crystal heat sink are subjected to an airtightness test.

[0077] This embodiment further defines the technical feature of "leaving the crystal heat sink after glue injection to stand at room temperature until the sealant is completely cured and completing the airtightness test", which specifically includes the following steps: Sealant curing: Place all the crystal heat sinks after glue injection operations horizontally in a dust-free and ventilated room temperature environment, with the ambient temperature controlled between twenty and twenty-five degrees Celsius and the relative humidity controlled between forty and sixty percent, and leave them to stand for twenty-four hours to completely cure the K-704 type silicone sealant. During the curing process, avoid vibration and collision of the crystal heat sink to prevent the sealant from shifting and generating gaps.

[0078] Airtightness test: After the sealant is completely cured, connect the water inlet and outlet of the crystal heat sink to the air inlet and outlet of the airtightness test equipment respectively. Pass dry compressed air with a pressure of 0.2 MPa into the water channels of the crystal heat sink and maintain the pressure for five minutes. Immerse the entire crystal heat sink in deionized water at room temperature and observe whether bubbles are generated. If no bubbles are generated for five consecutive minutes, it is determined that the airtightness is qualified; if bubbles are generated, mark the leakage location and re-perform the glue injection and sealing operation.

[0079] In some embodiments, by providing a real-time detection and closed-loop control method for glue injection quality based on machine vision, which specifically includes the following steps: Install high-resolution industrial cameras above and on the side of the automated glue injection equipment respectively, and the cameras are communicatively connected to the computer equipment. Before glue injection starts, the computer equipment collects images of the crystal heat sink through the industrial cameras, identifies the positions of the through-hole glue injection points and blind-hole glue injection points, and automatically adjusts the positions of the glue injection needles and stainless steel probes to achieve precise positioning.

[0080] During the dispensing process at the through-hole type dispensing point, an industrial camera above captures real-time images of sealant overflowing from the outlet above the through-hole. A computer runs a pre-trained semantic segmentation algorithm to segment the sealant area in the image and calculate the percentage of the area covered by sealant on the outlet surface. When the percentage reaches 100%, the computer automatically sends a command to control the automated dispensing equipment to slowly move the crystal heat sink upwards while maintaining the dispensing needle at its original speed.

[0081] A side-mounted industrial camera captures real-time images of the dispensing needle moving out of the through-hole. A computer system runs a target detection algorithm to identify the tip position of the dispensing needle and adjusts the dispensing speed in real-time based on the needle's movement, ensuring the sealant inside the through-hole remains saturated. When the computer detects that the tip of the dispensing needle is about to leave the lower inlet of the through-hole, it automatically sends a command to stop the automated dispensing equipment and initiate a backflow suction operation.

[0082] After the glue dispensing is completed, the computer equipment uses an industrial camera to capture images of the dispensing area and runs a defect detection algorithm to automatically detect defects such as air bubbles, incomplete filling, glue overflow, or stringing. If a defect is detected, the crystal heat sink is automatically marked as a defective product, and the defect type and location are recorded for subsequent rework.

[0083] In some embodiments, a collaborative control method for a multi-station automated dispensing production line is provided, suitable for large-scale production scenarios, and specifically includes the following steps: An automated dispensing production line was constructed, comprising a material loading station, a vacuum reflow soldering station, a cooling station, a through-hole dispensing station, a blind-hole dispensing station, a curing station, and an airtightness testing station. Workpieces are transferred between stations via conveyor belts and industrial robots, and all stations are centrally controlled by a computer.

[0084] The central computer system operates a production scheduling algorithm that dynamically allocates production tasks based on the quantity of crystal heat sinks to be processed and the processing status of each workstation, optimizing the production cycle of the assembly line. When a workstation malfunctions, the central computer system automatically reassigns the workpieces to other backup workstations to prevent production line downtime.

[0085] At the through-hole and blind-hole dispensing stations, the central computer automatically retrieves pre-stored dispensing parameters based on the crystal heat sink model. These parameters include dispensing needle specifications, needle insertion depth, dispensing speed, number of dotting cycles, and number of set screw insertions and removals. Simultaneously, the central computer collects real-time operational data from each dispensing device, including dispensing pressure, needle position, and dispensing volume. Based on this data, it performs real-time fine-tuning of the dispensing parameters to ensure consistent dispensing quality.

[0086] At the curing station, the central computer system collects ambient temperature and humidity data in real time using temperature and humidity sensors, and automatically adjusts the curing time based on this data. When the ambient temperature is below 20 degrees Celsius, the curing time is automatically extended; when the ambient temperature is above 25 degrees Celsius, the curing time is automatically shortened to ensure the sealant is fully cured.

[0087] In some embodiments, by providing a temperature-compensated method for accelerating the curing of sealant, the production cycle can be effectively shortened, specifically including the following steps: A constant temperature heating device and a temperature sensor are installed at the curing station, both of which are connected to a computer. The computer pre-stores the curing time curves of K-704 silicone sealant at different temperatures.

[0088] After the crystalline heat sink, once the sealant has been applied, is transferred to the curing station, the computer system uses a temperature sensor to collect the current ambient temperature. Based on a pre-stored curing time curve, the time required for the sealant to fully cure at the current ambient temperature is calculated.

[0089] If the calculated curing time exceeds the preset production cycle time requirement, the computer equipment will automatically activate the constant temperature heating device to raise the ambient temperature of the curing station to between 35 and 40 degrees Celsius. Within this temperature range, the curing time of K-704 silicone sealant can be shortened to less than eight hours without generating additional stress deformation.

[0090] During the heat curing process, temperature sensors collect temperature data from the curing station in real time and feed it back to the computer. The computer automatically adjusts the output power of the constant-temperature heating device based on the feedback temperature data to ensure the temperature at the curing station remains within the set range. Once the sealant is fully cured, the computer automatically shuts off the constant-temperature heating device and transfers the crystal heat sink to the airtightness testing station.

[0091] In some embodiments, by providing an adaptive potting parameter matching method for crystal heat sinks of different power levels, multiple uses can be achieved with a single device, specifically including the following steps: The computer equipment pre-establishes a database of dispensing parameters. The database stores the optimal dispensing parameters for crystal heat sinks of different power levels and sizes, including the needle specifications, needle insertion depth, and dispensing speed for through-hole dispensing, as well as the number of dotting circles and the number of times the set screw is screwed in and out for blind-hole dispensing.

[0092] An RFID reader is installed at the entrance of the automated dispensing equipment. An RFID tag is affixed to each crystal heat sink. The tag stores information such as the power rating, size specifications, and production batch of the crystal heat sink.

[0093] When the crystal heat sink is transported to the entrance of the automated dispensing equipment, the RFID reader automatically reads the information from the tag and sends it to the computer. Based on the read information, the computer automatically matches the corresponding optimal dispensing parameters from the dispensing parameter database.

[0094] The computer equipment sends the matched dispensing parameters to the automated dispensing equipment. The automated dispensing equipment automatically adjusts its operating status based on the received parameters to complete the dispensing operation for the crystal heat sink. Simultaneously, the computer equipment records the quality inspection results and production data of this dispensing operation into the dispensing parameter database for subsequent optimization and updates of the dispensing parameters.

[0095] Please see Figure 2 As shown, Figure 2 This is a schematic diagram of the structure of a high-power laser potting speed and direction control system 200 provided in this application embodiment. The high-power laser potting speed and direction control system 200 is used to execute the steps of the high-power laser potting speed and direction control methods shown in the above embodiments. The high-power laser potting speed and direction control system 200 can be a single server or a server cluster, or it can be a terminal, such as a handheld terminal, laptop computer, wearable device, or robot.

[0096] like Figure 2 As shown, the dispensing speed and direction control system 200 of the high-power laser includes: The potting and sealing unit 201 is used for mechanical assembly and vacuum reflow soldering of the crystal heat sink in a high-power laser, and for potting and sealing the water channels on the crystal heat sink; the silicone sealant is loaded into the potting syringe and the inside of the syringe is evacuated. The back suction operation unit 202 is used for the through-hole type glue filling point on the crystal heat sink that is connected to the water channel. It selects a glue filling needle of a preset specification, aligns the glue filling needle vertically with the through hole and inserts it into the through hole to a preset depth. It steadily controls the glue dispensing speed according to the principle of low pressure and slow dispensing. When the sealant overflows from the outlet above the through hole and completely covers the outlet, while keeping the glue filling needle dispensing glue slowly, it gradually moves the glue filling needle out of the through hole until the inlet below the through hole is completely covered by sealant. Then, it stops pushing glue and performs a back suction operation. The sealing and curing unit 203 is used for blind hole-type glue filling areas on crystal heat sinks. A stainless steel probe is used to take the sealant and apply it in multiple turns from the bottom of the blind hole along the threaded hole. Multiple turns of sealant are also applied to the cleaned set screw threads. The set screw is screwed into the blind hole and then repeatedly screwed in and out to ensure that the thread engagement gap is filled with sealant. The crystal heat sink with glue filling is left to stand at room temperature until the sealant is completely cured, and an airtightness test is performed.

[0097] In some embodiments, the mechanical assembly and vacuum reflow soldering operation of the crystal heat sink in the high-power laser includes: completely wrapping the crystal with indium foil, clamping the wrapped crystal between the upper and middle mechanical components of the crystal heat sink, fastening the upper and middle mechanical components together with screws, and placing the assembled crystal heat sink into a vacuum reflow soldering equipment for soldering, so that the indium foil melts and comes into full contact with the metal surface of the mechanical components, and then cools and solidifies.

[0098] In some embodiments, the process of potting and sealing the water channels on the crystal heat sink includes: after completing the complete cleaning operation of the crystal heat sink, the assembly and fastening operation of mechanical parts, and the vacuum reflow soldering operation, potting and sealing the water channels on the crystal heat sink to avoid the high temperature of welding causing contaminants and stress deformation in the sealant.

[0099] In some embodiments, the step of loading the silicone sealant into a dispensing syringe and performing a vacuum treatment inside the syringe includes: obtaining a preset volume of silicone sealant and loading it into the dispensing syringe; connecting the dispensing syringe to a vacuum device; and performing a vacuum treatment inside the dispensing syringe to remove air bubbles from the sealant.

[0100] In some embodiments, for the through-hole type glue filling point on the crystal heat sink that communicates with the water channel, a glue filling needle of a preset specification is selected, the glue filling needle is vertically aligned with the through hole and inserted into the through hole to a preset depth, and the glue dispensing speed is stably controlled according to the principle of low pressure and slow dispensing, including: for the through-hole type glue filling point on the crystal heat sink that communicates with the water channel, a glue filling needle with an inner diameter of 0.14mm within a first preset deviation range is selected, the glue filling needle is vertically aligned with the through hole and inserted into the through hole to a depth of 1mm within the second preset deviation range, and the glue dispensing speed is stably controlled at (0.5mm / s, 0.6mm / s) according to the principle of low pressure and slow dispensing.

[0101] In some embodiments, when sealant overflows from the outlet above the through hole and completely covers the outlet, while keeping the dispensing needle slowly dispensing sealant, the dispensing needle is gradually moved out of the through hole until the inlet below the through hole is completely covered by sealant. Then, the dispensing needle is stopped and a back suction operation is performed. This includes: when a suitable amount of sealant overflows from the outlet above the through hole and completely covers the entire outlet surface, keeping the dispensing needle slowly dispensing sealant and slowly moving the crystal heat sink upwards, so that the dispensing needle is gradually moved out of the through hole until the inlet below the through hole is completely covered by sealant. Then, the push rod of the dispensing syringe is stopped, and a moderate back suction operation is performed on the dispensing syringe.

[0102] In some embodiments, the method of applying sealant to blind-hole type potting areas on crystal heat sinks by using a stainless steel probe to take sealant and apply it in multiple circles from the bottom of the blind hole along the threaded hole includes: for blind-hole type potting areas on crystal heat sinks, using a stainless steel probe to take an appropriate amount of sealant and applying it evenly in 3 to 4 circles from the bottom of the blind hole along the inner wall of the threaded hole.

[0103] In some embodiments, applying multiple turns of sealant to the cleaned set screw thread includes: cleaning the set screw to remove impurities and oil from its surface, and applying 2 to 3 turns of sealant evenly to the cleaned set screw thread surface using a stainless steel probe.

[0104] In some embodiments, the step of repeatedly screwing the set screw into the blind hole and then screwing it out and in to ensure that the thread engagement gap is filled with sealant includes: slowly screwing the set screw, which has been dotted with sealant, into the blind hole; after it is screwed in, slowly screwing the set screw out and then screwing it back into the blind hole; repeating the above screwing-out and screwing-in operation multiple times to ensure that the thread engagement gap between the set screw and the blind hole is completely filled with sealant.

[0105] In some embodiments, the step of allowing the encapsulated crystal heat sink to stand at room temperature until the sealant is fully cured and then performing an airtightness test includes: placing the encapsulated crystal heat sink in a room temperature environment for 24 hours to allow the sealant to fully cure, and then performing an airtightness test on the water channels of the crystal heat sink after the sealant has fully cured.

[0106] It should be noted that those skilled in the art will understand that, for the sake of convenience and brevity, the specific working process of the high-power laser's dispensing speed and direction control system and each module described above can be referred to the corresponding content in the various embodiments of the high-power laser's dispensing speed and direction control method, and will not be repeated here.

[0107] The aforementioned method for controlling the dispensing speed and direction of a high-power laser can be implemented as a computer program, which can be used in applications such as... Figure 2 It runs on the device shown.

[0108] Please see Figure 3 , Figure 3 This is a schematic block diagram of the structure of a computer device provided in an embodiment of this application. The computer device includes a processor, a memory, and a network interface connected via a device bus, wherein the memory may include a storage medium and internal memory.

[0109] The storage medium can store operating devices and computer programs. The computer program includes program instructions that, when executed, cause the processor to perform any method for controlling the dispensing speed and direction of a high-power laser.

[0110] The processor provides computing and control capabilities, supporting the operation of the entire computer device.

[0111] The internal memory provides an environment for the execution of computer programs in non-volatile storage media. When executed by a processor, the computer program enables the processor to perform any method for controlling the potting speed and direction of a high-power laser.

[0112] This network interface is used for network communication, such as sending assigned tasks. Those skilled in the art will understand that... Figure 3 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the terminal to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0113] It should be understood that the processor can be a Central Processing Unit (CPU), but it can also be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. Among these, a general-purpose processor can be a microprocessor or any conventional processor.

[0114] In one embodiment, the processor is configured to run a computer program stored in memory to perform the following steps: Mechanical assembly and vacuum reflow soldering are performed on the crystal heat sink in the high-power laser. The water channels on the crystal heat sink are sealed with glue. The silicone sealant is loaded into the glue injection syringe and the inside of the syringe is evacuated. For the through-hole type glue filling point on the crystal heat sink that connects to the water channel, select a glue filling needle of preset specification, align the glue filling needle vertically with the through hole and insert it into the through hole to a preset depth, and steadily control the glue dispensing speed according to the principle of low pressure and slow dispensing; when the sealant overflows from the outlet above the through hole and completely covers the outlet, while keeping the glue filling needle dispensing glue slowly, gradually move the glue filling needle out of the through hole until the inlet below the through hole is completely covered by sealant, stop pushing glue and perform a back suction operation; For blind hole-type encapsulation areas on crystal heat sinks, use a stainless steel probe to apply sealant in multiple turns from the bottom of the blind hole along the threaded hole, and apply multiple turns of sealant to the cleaned set screw threads; screw the set screw into the blind hole and repeatedly screw it in and out to ensure that the thread engagement gap is filled with sealant; let the encapsulated crystal heat sink stand at room temperature until the sealant is completely cured, and then complete the airtightness test.

[0115] In some embodiments, the mechanical assembly and vacuum reflow soldering operation of the crystal heat sink in the high-power laser includes: completely wrapping the crystal with indium foil, clamping the wrapped crystal between the upper and middle mechanical components of the crystal heat sink, fastening the upper and middle mechanical components together with screws, and placing the assembled crystal heat sink into a vacuum reflow soldering equipment for soldering, so that the indium foil melts and comes into full contact with the metal surface of the mechanical components, and then cools and solidifies.

[0116] In some embodiments, the process of potting and sealing the water channels on the crystal heat sink includes: after completing the complete cleaning operation of the crystal heat sink, the assembly and fastening operation of mechanical parts, and the vacuum reflow soldering operation, potting and sealing the water channels on the crystal heat sink to avoid the high temperature of welding causing contaminants and stress deformation in the sealant.

[0117] In some embodiments, the step of loading the silicone sealant into a dispensing syringe and performing a vacuum treatment inside the syringe includes: obtaining a preset volume of silicone sealant and loading it into the dispensing syringe; connecting the dispensing syringe to a vacuum device; and performing a vacuum treatment inside the dispensing syringe to remove air bubbles from the sealant.

[0118] In some embodiments, for the through-hole type glue filling point on the crystal heat sink that communicates with the water channel, a glue filling needle of a preset specification is selected, the glue filling needle is vertically aligned with the through hole and inserted into the through hole to a preset depth, and the glue dispensing speed is stably controlled according to the principle of low pressure and slow dispensing, including: for the through-hole type glue filling point on the crystal heat sink that communicates with the water channel, a glue filling needle with an inner diameter of 0.14mm within a first preset deviation range is selected, the glue filling needle is vertically aligned with the through hole and inserted into the through hole to a depth of 1mm within the second preset deviation range, and the glue dispensing speed is stably controlled at (0.5mm / s, 0.6mm / s) according to the principle of low pressure and slow dispensing.

[0119] In some embodiments, when sealant overflows from the outlet above the through hole and completely covers the outlet, while keeping the dispensing needle slowly dispensing sealant, the dispensing needle is gradually moved out of the through hole until the inlet below the through hole is completely covered by sealant. Then, the dispensing needle is stopped and a back suction operation is performed. This includes: when a suitable amount of sealant overflows from the outlet above the through hole and completely covers the entire outlet surface, keeping the dispensing needle slowly dispensing sealant and slowly moving the crystal heat sink upwards, so that the dispensing needle is gradually moved out of the through hole until the inlet below the through hole is completely covered by sealant. Then, the push rod of the dispensing syringe is stopped, and a moderate back suction operation is performed on the dispensing syringe.

[0120] In some embodiments, the method of applying sealant to blind-hole type potting areas on crystal heat sinks by using a stainless steel probe to take sealant and apply it in multiple circles from the bottom of the blind hole along the threaded hole includes: for blind-hole type potting areas on crystal heat sinks, using a stainless steel probe to take an appropriate amount of sealant and applying it evenly in 3 to 4 circles from the bottom of the blind hole along the inner wall of the threaded hole.

[0121] In some embodiments, applying multiple turns of sealant to the cleaned set screw thread includes: cleaning the set screw to remove impurities and oil from its surface, and applying 2 to 3 turns of sealant evenly to the cleaned set screw thread surface using a stainless steel probe.

[0122] In some embodiments, the step of repeatedly screwing the set screw into the blind hole and then screwing it out and in to ensure that the thread engagement gap is filled with sealant includes: slowly screwing the set screw, which has been dotted with sealant, into the blind hole; after it is screwed in, slowly screwing the set screw out and then screwing it back into the blind hole; repeating the above screwing-out and screwing-in operation multiple times to ensure that the thread engagement gap between the set screw and the blind hole is completely filled with sealant.

[0123] In some embodiments, the step of allowing the encapsulated crystal heat sink to stand at room temperature until the sealant is fully cured and then performing an airtightness test includes: placing the encapsulated crystal heat sink in a room temperature environment for 24 hours to allow the sealant to fully cure, and then performing an airtightness test on the water channels of the crystal heat sink after the sealant has fully cured.

[0124] This application also provides a computer-readable storage medium storing a computer program that, when executed by a processor, causes the processor to implement the steps of the dispensing speed and direction control method for a high-power laser as provided in any embodiment of this application.

[0125] The computer-readable storage medium may be an internal storage unit of the computer device described in the foregoing embodiments, such as the hard disk or memory of the computer device. The computer-readable storage medium may also be an external storage device of the computer device, such as a plug-in hard disk, SmartMedia Card (SMC), Secure Digital (SD) card, or Flash Card equipped on the computer device.

[0126] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A method for controlling the potting speed and direction of a high-power laser, characterized in that, include: Mechanical assembly and vacuum reflow soldering are performed on the crystal heat sink in the high-power laser. The water channels on the crystal heat sink are sealed with glue. The silicone sealant is loaded into the glue injection syringe and the inside of the syringe is evacuated. For the through-hole type glue filling point on the crystal heat sink that connects to the water channel, select a glue filling needle of preset specification, align the glue filling needle vertically with the through hole and insert it into the through hole to a preset depth, and steadily control the glue dispensing speed according to the principle of low pressure and slow dispensing; when the sealant overflows from the outlet above the through hole and completely covers the outlet, while keeping the glue filling needle dispensing glue slowly, gradually move the glue filling needle out of the through hole until the inlet below the through hole is completely covered by sealant, stop pushing glue and perform a back suction operation; For blind hole-type encapsulation areas on crystal heat sinks, use a stainless steel probe to apply sealant in multiple turns from the bottom of the blind hole along the threaded hole, and apply multiple turns of sealant to the cleaned set screw threads; screw the set screw into the blind hole and repeatedly screw it in and out to ensure that the thread engagement gap is filled with sealant; let the encapsulated crystal heat sink stand at room temperature until the sealant is completely cured, and then complete the airtightness test.

2. The method according to claim 1, characterized in that, The mechanical assembly and vacuum reflow soldering operation of the crystal heat sink in the high-power laser includes: The crystal is completely wrapped with indium foil. The wrapped crystal is then clamped between the upper and middle mechanical parts of the crystal heat sink. The upper and middle mechanical parts are fastened together with screws. The assembled crystal heat sink is then placed into a vacuum reflow soldering machine for soldering, so that the indium foil melts and comes into full contact with the metal surface of the mechanical parts before cooling and solidification.

3. The method according to claim 1, characterized in that, The process of sealing the water channels on the crystal heat sink with adhesive includes: After completing the thorough cleaning of the crystal heat sink, the assembly and fastening of mechanical parts, and the vacuum reflow soldering, the water channels on the crystal heat sink are sealed with adhesive to prevent contaminants and stress deformation of the sealant caused by the high temperature of welding.

4. The method according to claim 1, characterized in that, The step of loading the silicone sealant into a dispensing syringe and then performing a vacuum treatment inside the syringe includes: Prepare a preset volume of silicone sealant and fill it into a dispensing syringe. Connect the dispensing syringe to a vacuum pump and vacuum the inside of the syringe to remove air bubbles from the sealant.

5. The method according to claim 1, characterized in that, For the through-hole type glue-filling point on the crystal heat sink that connects to the water channel, a glue-filling needle of a preset specification is selected. The glue-filling needle is vertically aligned with the through-hole and inserted into the through-hole to a preset depth. The glue dispensing speed is stably controlled according to the principle of low pressure and slow dispensing, including: For the through-hole type glue filling point on the crystal heat sink that connects to the water channel, a glue filling needle with an inner diameter of 0.14mm within the first preset deviation range is selected. The glue filling needle is vertically aligned with the through hole and inserted into the through hole to a depth of 1mm within the second preset deviation range. The glue dispensing speed is stably controlled at (0.5mm / s, 0.6mm / s) according to the principle of low pressure and slow dispensing.

6. The method according to claim 1, characterized in that, When sealant overflows from the outlet above the through hole and completely covers the outlet, while slowly dispensing sealant from the dispensing needle, gradually remove the dispensing needle from the through hole until the inlet below the through hole is completely covered by sealant. Then stop dispensing and perform a back suction operation, including: When a suitable amount of sealant overflows from the outlet above the through hole and completely covers the entire outlet surface, keep the dispensing needle dispensing the sealant slowly and slowly move the crystal heat sink upwards so that the dispensing needle gradually moves out of the through hole until the inlet below the through hole is completely covered by sealant. Stop pushing the push rod of the dispensing syringe and perform a moderate back suction operation on the dispensing syringe.

7. The method according to claim 1, characterized in that, For the blind-hole type potting area on the crystal heat sink, a stainless steel probe is used to take sealant and apply it in multiple circles from the bottom of the blind hole along the threaded hole, including: For blind hole-type encapsulation areas on crystal heat sinks, use a stainless steel probe to take an appropriate amount of sealant and apply 3 to 4 circles of sealant evenly along the inner wall of the threaded hole, starting from the bottom of the blind hole.

8. The method according to claim 7, characterized in that, The step of applying multiple turns of sealant to the cleaned set screw threads includes: Clean the set screw to remove impurities and oil from its surface. Use a stainless steel probe to evenly apply 2 to 3 rings of sealant to the cleaned set screw thread surface.

9. The method according to claim 1, characterized in that, The process of repeatedly screwing the set screw into the blind hole and then screwing it in and out to ensure that the thread engagement gap is filled with sealant includes: Slowly screw the set screw, which has been dotted with sealant, into the blind hole. Once it is in place, slowly unscrew the set screw and screw it back into the blind hole. Repeat this screwing-out and screwing-in operation several times to ensure that the thread engagement gap between the set screw and the blind hole is completely filled with sealant.

10. The method according to claim 1, characterized in that, The process of allowing the encapsulated crystal heat sink to stand at room temperature until the sealant is fully cured and then performing an airtightness test includes: After the sealant is applied, the crystal heat sink is placed in a room temperature environment for 24 hours to allow the sealant to fully cure. After the sealant has fully cured, the water channel of the crystal heat sink is tested for air tightness.

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