An immersion liquid carbon dioxide cooling system and data center cooling apparatus

Abstract

This invention discloses an immersion liquid carbon dioxide cooling system and a data center cooling device. The system includes an immersion cold plate with a sealed cavity, an artificial intelligence chip assembly disposed within the cavity and fixed to a porous sintered material, a sealed upper cover plate, and an inlet and outlet pipe connecting the cavity. The chip assembly is at least partially immersed in liquid carbon dioxide flowing into the cavity, achieving cooling through boiling heat transfer of the liquid carbon dioxide on the chip surface. A coolant distribution unit manages the flow of liquid carbon dioxide and provides emergency protection. The data center cooling device stacks multiple immersion cold plates from the above system within a cabinet and connects them in parallel to a main distribution unit via manifolds. This invention utilizes the latent heat of phase change and non-conductive properties of liquid carbon dioxide to provide a chip cooling solution with high heat dissipation efficiency, strong adaptability, safety, reliability, and a compact structure, particularly suitable for cooling high-power-density artificial intelligence chips.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology for electronic devices, and more specifically, to an immersion liquid carbon dioxide cooling system and a data center cooling device. Background Technology

[0002] With the rapid development of artificial intelligence technology, the computing power and integration of its core hardware—graphics processing units (GPUs) and central processing units (CPUs)—are constantly improving, leading to a sharp increase in chip power consumption and heat flux density. In hyperscale data centers, how to efficiently and reliably remove the enormous heat generated by these high-performance chips and maintain them at a safe and stable operating temperature has become a key bottleneck restricting the further development of computing power.

[0003] Currently, the cooling solutions commonly used in data centers mainly include air cooling and traditional liquid cooling. Air cooling, limited by the low heat capacity and heat transfer efficiency of air, is insufficient to meet the heat dissipation demands of single-chip thermal power exceeding kilowatts. While traditional single-phase liquid cooling plate technology has seen improvements, its heat transfer capacity remains inadequate for future chips with potentially tens of thousands of watts of ultra-high heat flux density. Furthermore, conventional coolants may present issues such as conductivity, corrosiveness, or environmental friendliness. Therefore, there is an urgent need for a revolutionary cooling technology that boasts extremely high heat exchange efficiency, reliability, safety, and adaptability to the future needs of chip development. Summary of the Invention

[0004] In view of the above-mentioned technical problems in related technologies, the present invention proposes an immersion liquid carbon dioxide cooling system and a data center cooling device, which can overcome the above-mentioned shortcomings of the prior art.

[0005] To achieve the above-mentioned technical objectives, the technical solution of the present invention is implemented as follows: An immersion liquid carbon dioxide cooling system; This immersion liquid carbon dioxide cooling system is used to cool artificial intelligence chips, including an immersion cold plate with a sealed cavity inside. At least one artificial intelligence chip assembly is disposed within the cavity of the immersion cold plate, the artificial intelligence chip assembly including an artificial intelligence chip mounted on a circuit board and a sealed electrical signal connector for electrical signal connection; A porous sintered material is disposed at the bottom of the cavity of the immersion cold plate, and the artificial intelligence chip assembly is fixed on the porous sintered material; The top cover is sealed to the top of the immersion cold plate, enabling the cavity to withstand working pressure; The inlet pipe and outlet pipe are respectively connected to the cavity of the immersion cold plate, and are used to introduce and discharge liquid carbon dioxide into the cavity; A coolant distribution unit, connected to the inlet pipe and the outlet pipe, is used to distribute and manage the flow of liquid carbon dioxide; The artificial intelligence chip is at least partially immersed in liquid carbon dioxide within the cavity and cooled by boiling heat exchange of the liquid carbon dioxide on the chip surface. If the heat dissipation capacity is weak, the artificial intelligence chip can be used to achieve sufficient cooling through direct contact and forced connection with the liquid carbon dioxide on the surface of the artificial intelligence chip via single-phase heat transfer.

[0006] Furthermore, the working pressure range of the liquid carbon dioxide is 2 MPa to 4 MPa, and the working temperature range is 5°C to 10°C. During operation, the boiling heat exchange is nucleation boiling, which keeps the surface temperature of the artificial intelligence chip within a range of 25°C to 30°C above the saturation temperature of the liquid carbon dioxide.

[0007] Furthermore, the cooling system has a self-regulating capability. When the heating power of the artificial intelligence chip increases, the superheat between the chip surface and the saturation temperature of liquid carbon dioxide increases, thereby enhancing the boiling heat transfer intensity. The cooling system can remove a heat flux density of 20 kW / m² to 200 kW / m².

[0008] Furthermore, the inner diameter of the outlet pipe is larger than the inner diameter of the inlet pipe.

[0009] Furthermore, the coolant distribution unit has an emergency protection function. When the system pressure is detected to exceed a preset safety threshold, it can cut off the flow of liquid carbon dioxide to the inlet and outlet pipes and bypass it. The preset safety threshold is 7.4 MPa.

[0010] Furthermore, the artificial intelligence chip is a graphics processing unit (GPU) or a central processing unit (CPU).

[0011] According to another aspect of the present invention, a data center cooling device is provided; The data center cooling unit includes a server rack and the aforementioned immersion liquid carbon dioxide cooling system; wherein, multiple immersion cold plates of the immersion liquid carbon dioxide cooling system are stacked in rows inside the server rack.

[0012] Furthermore, the cabinet is equipped with a main inlet manifold and a main outlet manifold; each coolant distribution unit of the immersion liquid carbon dioxide cooling system in the cabinet is connected in parallel to the main inlet manifold and the main outlet manifold.

[0013] Furthermore, it also includes a main coolant distribution unit for the cabinet, which is used to supply and distribute the main liquid carbon dioxide to the main inlet manifold and the main outlet manifold, and has an emergency bypass function.

[0014] The beneficial effects of this invention are as follows: By directly immersing the artificial intelligence chip in liquid carbon dioxide under specific pressure and temperature conditions, the boiling phase change process of the carbon dioxide directly and efficiently removes the heat from the chip, thereby enabling the system to cope with extremely high heat flux density and have the ability to adaptively adjust the heat dissipation intensity according to the chip's heat generation power. This significantly improves the space utilization efficiency and overall cooling performance of the data center while ensuring the safe and stable operation of the chip, providing a feasible technical path for the heat dissipation of future higher power chips. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the immersion liquid carbon dioxide cooling system according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the rack layout of the data center cooling device according to an embodiment of the present invention; In the diagram: 1-1, Graphics Processing Unit; 1-2, Central Processing Unit; 2-1, First Mounting Plate; 2-2, Second Mounting Plate; 3, Circuit Board; 4, Sealed Electrical Signal Connector; 5, Porous Sintered Material; 6, Top Cover Plate; 7, Immersion Cold Plate; 8, Inlet Pipe; 9, Outlet Pipe; 10, Coolant Distribution Unit in Cabinet; 11, Cabinet; 12, Main Coolant Distribution Unit in Cabinet; 13, Main Inlet Manifold; 14, Main Outlet Manifold. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention are within the scope of protection of the present invention.

[0018] like Figure 1 As shown, an immersion liquid carbon dioxide cooling system according to an embodiment of the present invention is used to cool an artificial intelligence chip, including an immersion cold plate 7, which has a sealed cavity formed inside. At least one artificial intelligence chip assembly is disposed in the cavity of the cold plate 7. The artificial intelligence chip assembly includes an artificial intelligence chip mounted on the circuit board 3 and a sealed electrical signal connector 4 for electrical signal connection. A porous sintered material 5 is disposed at the bottom of the cavity of the immersion cold plate 7, and the artificial intelligence chip assembly is fixed on the porous sintered material 5; The top cover plate 6 is sealed to the top of the immersion cold plate 7, enabling the cavity to withstand working pressure; The inlet pipe 8 and the outlet pipe 9 are respectively connected to the cavity of the immersion cold plate 7, and are used to introduce and discharge liquid carbon dioxide into the cavity; The coolant distribution unit 10 is connected to the inlet pipe 8 and the outlet pipe 9 and is used to distribute and manage the flow of liquid carbon dioxide. The artificial intelligence chip is at least partially immersed in liquid carbon dioxide within the cavity and cooled by boiling heat exchange of the liquid carbon dioxide on the chip surface. If the heat dissipation capacity is weak, the artificial intelligence chip can be used to achieve sufficient cooling through direct contact and forced connection with the liquid carbon dioxide on the surface of the artificial intelligence chip via single-phase heat transfer.

[0019] According to an embodiment of the present invention, an immersion liquid carbon dioxide cooling system is provided. In a specific embodiment, the working pressure of the liquid carbon dioxide is in the range of 2 MPa to 4 MPa, and the working temperature is in the range of 5°C to 10°C. During operation, the boiling heat exchange is nucleation boiling, which keeps the surface temperature of the artificial intelligence chip within a range of 25°C to 30°C above the saturation temperature of the liquid carbon dioxide.

[0020] According to an embodiment of the present invention, an immersion liquid carbon dioxide cooling system has a self-regulating capability in a certain specific embodiment. When the heating power of the artificial intelligence chip increases, the superheat between the chip surface and the saturation temperature of the liquid carbon dioxide increases, thereby enhancing the boiling heat transfer intensity. The cooling system can remove a heat flux density of 20 kW / m² to 200 kW / m².

[0021] According to an embodiment of the present invention, in a specific implementation of an immersion liquid carbon dioxide cooling system, the inner diameter of the outlet pipe 9 is larger than the inner diameter of the inlet pipe 8.

[0022] According to an embodiment of the present invention, in a specific implementation of an immersion liquid carbon dioxide cooling system, the coolant distribution unit 10 has an emergency protection function. When the system pressure is detected to exceed a preset safety threshold, it can cut off the flow of liquid carbon dioxide to the inlet pipe 8 and the outlet pipe 9 and bypass it; the preset safety threshold is 7.4 MPa.

[0023] According to an embodiment of the present invention, in a specific implementation of an immersion liquid carbon dioxide cooling system, the artificial intelligence chip is a graphics processing unit (GPU) or a central processing unit (CPU).

[0024] Secondly, such as Figure 2 As shown, a data center cooling device according to an embodiment of the present invention includes a cabinet 11 and an immersion liquid carbon dioxide cooling system; wherein, a plurality of immersion cold plates 7 of the immersion liquid carbon dioxide cooling system are stacked in rows inside the cabinet 11.

[0025] According to an embodiment of the present invention, a data center cooling device is provided in a certain specific embodiment, wherein the cabinet 11 is provided with a main inlet manifold 13 and a main outlet manifold 14; each coolant distribution unit 10 of the immersion liquid carbon dioxide cooling system in the cabinet 11 is connected in parallel to the main inlet manifold 13 and the main outlet manifold 14.

[0026] According to an embodiment of the present invention, a data center cooling device further includes a main cabinet coolant distribution unit 12 in a specific embodiment. The main cabinet coolant distribution unit 12 is used to supply and distribute main liquid carbon dioxide to the main inlet manifold 13 and the main outlet manifold 14, and has an emergency bypass function.

[0027] To facilitate understanding of the above technical solutions of the present invention, the following detailed description of the above technical solutions of the present invention will be provided through specific embodiments and principles.

[0028] refer to Figure 1 The present invention provides an immersion liquid carbon dioxide cooling system, which mainly includes an immersion cold plate 7, an artificial intelligence chip assembly, a porous sintered material 5, an upper cover plate 6, an inlet pipe 8, an outlet pipe 9, and a coolant distribution unit 10.

[0029] The immersion cold plate 7 has a sealed cavity inside. At least one artificial intelligence chip assembly is disposed within the cavity of the immersion cold plate 7. The artificial intelligence chip assembly includes an artificial intelligence chip (e.g., a graphics processor 1-1 or a central processing unit 1-2) mounted on a circuit board 3 and a sealed electrical signal connector 4 for electrical signal connection. The chip can be fixed to the circuit board 3 by mounting plates 2-1 and 2-2.

[0030] The porous sintered material 5 is disposed at the bottom of the cavity of the immersion cold plate 7, and the artificial intelligence chip assembly is fixed on the porous sintered material 5. Liquid carbon dioxide can permeate the porous sintered material 5 to achieve contact cooling of the back of the chip.

[0031] The upper cover plate 6 is sealed to the top of the submerged cold plate 7 by means of flange connection or welding, so that the cavity can withstand working pressure, for example, up to about 7.4 MPa (critical pressure of carbon dioxide).

[0032] The inlet pipe 8 and outlet pipe 9 are respectively connected to the cavity of the cold plate 7, and are used to introduce and discharge liquid carbon dioxide into the cavity. Specifically, liquid carbon dioxide is introduced into the cavity of the submerged cold plate 7 through a stainless steel inlet pipe (or a related high-strength metal material) 8 with a diameter of d. The inner diameter e of the outlet pipe 9 is larger than the inner diameter d of the inlet pipe 8 to accommodate the gas-liquid two-phase flow generated under high heat dissipation load and reduce the system pressure drop.

[0033] The coolant distribution unit 10 is connected to the inlet pipe 8 and the outlet pipe 9, and is used to distribute and manage the flow of liquid carbon dioxide. The coolant distribution unit 10 also has an emergency protection function: when the system pressure is detected to exceed a preset safety threshold (e.g., 7.4 MPa), it can cut off the flow path to the inlet pipe 8 and the outlet pipe 9 and directly bypass the liquid carbon dioxide.

[0034] During operation, liquid carbon dioxide with specific operating parameters (e.g., temperature approximately 5°C, pressure approximately 4.5 MPa) is introduced into the cavity of the immersion cold plate 7. The artificial intelligence chip is at least partially immersed in the liquid carbon dioxide and cooled through boiling heat transfer (e.g., nucleo-boiling) on ​​the chip surface. If the heat dissipation capacity is weak, the artificial intelligence chip can achieve sufficient cooling through direct contact forced connection (single-phase heat transfer) with the liquid carbon dioxide on the chip surface. In this example operating condition, the chip surface temperature can be maintained at approximately 30°C, the superheat is approximately 25°C, and for a chip with a thermal power of approximately 3 kW, a heat flux density removal of over 20 kW / m² can be achieved.

[0035] The cooling process has a self-regulating characteristic: when the chip's heat output increases, the superheat between its surface and the saturation temperature of liquid carbon dioxide increases on its own, thereby enhancing boiling heat transfer and enabling the system to cope with higher heat flux densities, such as up to 200 kW / m², while ensuring chip safety.

[0036] refer to Figure 2 The present invention also provides a data center cooling device. Multiple immersion cold plates 7 of the aforementioned immersion liquid carbon dioxide cooling system are stacked in rows within a cabinet 11. The coolant distribution unit 10 of each cooling system is connected in parallel to the main inlet manifold 13 and the main outlet manifold 14 within the cabinet 11. The cabinet 11 is also equipped with a main coolant distribution unit 12 for distributing the main liquid carbon dioxide supply to the main inlet manifold 13 and the main outlet manifold 14. This main coolant distribution unit 12 also has an emergency bypass function.

[0037] In summary, by employing the technical solution described above, the artificial intelligence chip is directly immersed in liquid carbon dioxide under specific pressure and temperature conditions. The boiling phase change process of carbon dioxide directly and efficiently removes heat from the chip, enabling the system to cope with extremely high heat flux density and adaptively adjust the heat dissipation intensity based on the chip's heat output. This significantly improves the space utilization efficiency and overall cooling performance of the data center while ensuring the safe and stable operation of the chip, providing a feasible technical path for heat dissipation of future higher-power chips.

[0038] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An immersion liquid carbon dioxide cooling system for cooling an artificial intelligence chip, characterized in that, Including an immersion cold plate (7), which has a sealed cavity inside; At least one artificial intelligence chip assembly is disposed in the cavity of the immersion cold plate (7), the artificial intelligence chip assembly including an artificial intelligence chip mounted on a circuit board (3) and a sealed electrical signal connector (4) for electrical signal connection. A porous sintered material (5) is disposed at the bottom of the cavity of the immersion cold plate (7), and the artificial intelligence chip assembly is fixed on the porous sintered material (5); The top cover plate (6) is sealed to the top of the immersion cold plate (7) so that the cavity can withstand the working pressure; The inlet pipe (8) and outlet pipe (9) are respectively connected to the cavity of the immersion cold plate (7) for introducing and discharging liquid carbon dioxide into and out of the cavity; A coolant distribution unit (10) is connected to the inlet pipe (8) and the outlet pipe (9) for distributing and managing the flow of liquid carbon dioxide; The artificial intelligence chip is at least partially immersed in liquid carbon dioxide within the cavity and cooled by boiling heat exchange of the liquid carbon dioxide on the chip surface. If the heat dissipation capacity is weak, the artificial intelligence chip can be used to achieve sufficient cooling through direct contact and forced connection with the liquid carbon dioxide on the surface of the artificial intelligence chip via single-phase heat transfer.

2. The immersion liquid carbon dioxide cooling system according to claim 1, characterized in that, The working pressure range of the liquid carbon dioxide is 2 MPa to 4 MPa, and the working temperature range is 5°C to 10°C. During operation, the boiling heat exchange is nucleation boiling, which keeps the surface temperature of the artificial intelligence chip within a range of 25°C to 30°C above the saturation temperature of the liquid carbon dioxide.

3. An immersion liquid carbon dioxide cooling system according to claim 1 or 2, characterized in that, The cooling system has self-regulating capabilities. When the heating power of the artificial intelligence chip increases, the superheat between the chip surface and the saturation temperature of liquid carbon dioxide increases, thereby enhancing the boiling heat transfer intensity. The cooling system can remove a heat flux density of 20 kW / m² to 200 kW / m².

4. The immersion liquid carbon dioxide cooling system according to claim 1, characterized in that, The inner diameter of the outlet pipe (9) is larger than the inner diameter of the inlet pipe (8).

5. The immersion liquid carbon dioxide cooling system according to claim 1, characterized in that, The coolant distribution unit (10) has an emergency protection function. When the system pressure is detected to exceed the preset safety threshold, it can cut off the flow of liquid carbon dioxide to the inlet pipe (8) and outlet pipe (9) and bypass it. The preset safety threshold is 7.4 MPa.

6. The immersion liquid carbon dioxide cooling system according to claim 1, characterized in that, The artificial intelligence chip is a graphics processing unit (GPU) or a central processing unit (CPU).

7. A data center cooling device, characterized in that, It includes a cabinet (11) and at least one immersion liquid carbon dioxide cooling system as claimed in any one of claims 1 to 6; wherein, a plurality of immersion cold plates (7) of the immersion liquid carbon dioxide cooling systems are stacked in rows within the cabinet (11).

8. A data center cooling device according to claim 7, characterized in that, The cabinet (11) is provided with a main inlet manifold (13) and a main outlet manifold (14); each coolant distribution unit (10) of the immersion liquid carbon dioxide cooling system in the cabinet (11) is connected in parallel to the main inlet manifold (13) and the main outlet manifold (14).

9. A data center cooling device according to claim 8, characterized in that, It also includes a main coolant distribution unit (12) for cabinets, which is used to supply and distribute the main liquid carbon dioxide to the main inlet manifold (13) and the main outlet manifold (14), and has an emergency bypass function.

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