A manual chip mounter and a manual chip mounting method

Abstract

The application discloses a kind of manual chip mounter and manual patching method, belong to chip mounter technical field.To solve the technical problems of high cost, low precision and complex operation of existing chip mounter, the application provides a kind of manual chip mounter, including base platform, imaging system, display device, first spatial position adjusting device, second spatial position adjusting device and clamping control device, imaging system includes overhead imaging device, side view imaging device and front view imaging device.The application can collect the space posture of the patching picture and the chip to be patched with multiple viewing angles and multiple degrees of freedom precision adjustment, and the operation is simple, with high precision.The application has the advantages of low overall cost, easy maintenance, high precision, simple operation and the like.

Description

Technical Field

[0001] This invention belongs to the field of chip mounter technology, specifically relating to a manual chip mounter and a manual chip mounter method. Background Technology

[0002] With the rapid development of cloud computing, data centers and 5G / 6G communication technologies, optical module products are continuously iterating towards higher speed, higher density, lower power consumption and higher reliability. The channel spacing of their core optical transceiver chips is constantly shrinking, the chip integration density is continuously increasing, and the requirements for chip mounting accuracy have reached the ±3~±5μm level.

[0003] With the current large-scale application of AI technology driving the expansion of optical module production capacity, the demand for high-precision placement machines in the optical module product development stage is growing rapidly. However, existing placement equipment has significant shortcomings in R&D scenarios:

[0004] Firstly, the equipment procurement costs are high. The lowest price for a domestically produced fully automatic high-precision placement machine is approximately 1 million RMB, while the price of an imported fully automatic machine is over 2 million RMB. The market supply of domestically produced high-precision manual placement machines is extremely limited, and the price of imported manual placement machines also reaches 1-2.5 million RMB. Furthermore, the need to stockpile high-value spare parts in the later stages of equipment development further increases the company's equipment investment costs.

[0005] Secondly, labor costs are high. Existing fully automatic and manual placement equipment has a complex structure, requiring professional technicians for debugging, operation, and maintenance, which increases the company's labor costs.

[0006] Third, the time cost is high. The high degree of customization of automatic placement equipment from different manufacturers and the poor interchangeability of parts result in long processing and replacement cycles for parts. In addition, the rapid iteration speed of optical module products means that equipment suppliers need to upgrade and adapt their equipment in sync with the development of new products, which directly lengthens the product development cycle and increases the company's time cost.

[0007] Therefore, developing a manual patching system that is suitable for R&D scenarios, meets accuracy standards, is low-cost, and easy to operate and maintain is a technical problem that the optical communication industry urgently needs to solve. Summary of the Invention

[0008] This invention addresses the shortcomings of existing technologies by providing a manual chip mounter and a chip mounter method.

[0009] To alleviate or partially alleviate the above-mentioned technical problems, the solution of the present invention is as follows:

[0010] On one hand, the present invention provides a manual placement machine, comprising:

[0011] Base platform;

[0012] An imaging system, comprising a gantry, a top-view imaging device, a side-view imaging device, and a front-view imaging device, wherein the gantry is fixedly mounted on the base platform, the top-view imaging device and the side-view imaging device are movably mounted on the top of the gantry in a horizontal direction, and the front-view imaging device is movably mounted on the base platform.

[0013] A first spatial position adjustment device is fixedly mounted on the base platform and is used to adjust the spatial posture of the product to be mounted.

[0014] A second spatial position adjustment device is fixedly mounted on the base platform;

[0015] A clamping control device is fixedly installed on the second spatial position adjustment device.

[0016] In one possible implementation of the present invention, the placement machine further includes a display device, which is fixedly mounted on the base platform; the top-view imaging device, the side-view imaging device, the front-view imaging device, and the clamping control device are respectively signal-connected to the display device.

[0017] In one possible implementation of the present invention, the top-view imaging device includes a first X-axis moving component, a first Y-axis moving component, a first Z-axis moving component, and a top-view camera; the first X-axis moving component is movably disposed on the top of the gantry; the first Y-axis moving component is movably disposed on the first X-axis moving component; the first Z-axis moving component is movably disposed on the first Y-axis moving component; and the top-view camera is fixedly connected to the first Z-axis moving component.

[0018] In one possible implementation of the present invention, the side-view imaging device includes a second X-axis moving component, a second Y-axis moving component, a second Z-axis moving component, a rotation component, an oblique adjustment component, and a side-view camera; the second X-axis moving component is movably disposed on the top of the gantry; the second Y-axis moving component is movably disposed on the second X-axis moving component; the second Z-axis moving component is movably disposed on the second Y-axis moving component; the rotation component is fixedly connected to the second Z-axis moving component; the oblique adjustment component is movably disposed on the rotation component; and the side-view camera is fixedly connected to the oblique adjustment component.

[0019] In one possible implementation of the present invention, the frontal imaging device includes a magnetic base, a vertical support, and a frontal camera; the vertical support is fixedly mounted on the magnetic base; and the frontal camera is mounted on the vertical support with adjustable height.

[0020] In one possible implementation of the present invention, the first spatial position adjustment device includes: a mounting plate fixedly disposed on the base platform; a first pitch angle adjustment platform fixedly disposed on the mounting plate; a second pitch angle adjustment platform fixedly disposed on the first pitch angle adjustment platform; a horizontal rotation angle adjustment platform fixedly disposed on the second pitch angle adjustment platform; and a fixed platform fixedly disposed on the horizontal rotation angle adjustment platform.

[0021] In one possible implementation of the present invention, the second spatial position adjustment device includes: a mounting platform fixedly disposed on the base platform; an X-axis adjustment platform fixedly disposed on the mounting platform; a Y-axis adjustment platform fixedly disposed on the X-axis adjustment platform; a Z-axis adjustment platform fixedly disposed on the Y-axis adjustment platform; a tilt adjustment platform fixedly disposed on the Z-axis adjustment platform; a horizontal pitch angle adjustment platform fixedly disposed on the tilt adjustment platform; a horizontal yaw angle adjustment platform fixedly disposed on the pitch angle adjustment platform; and a fixed base fixedly disposed on the horizontal yaw angle adjustment platform.

[0022] In one possible implementation of the present invention, the second spatial position adjustment device includes a fixed base; the clamping control device includes an actuator and a pair of grippers; the actuator is fixedly mounted on the fixed base; the pair of grippers is fixedly mounted on the actuator via a gripper mounting seat; preferably, the actuator is an electric cylinder.

[0023] In one possible implementation of the present invention, the gripper pair includes two opposing grippers; in the gripping state, the opposing gripping surfaces of the two grippers enclose a funnel-shaped clearance space.

[0024] In one possible implementation of the present invention, the clamping control device includes a control host, which is signal-connected to the display device.

[0025] On the other hand, the present invention also provides a manual patch application method, comprising the following steps:

[0026] S1 System Power-On: Turn on the power to the imaging system, display device and clamping control device to complete equipment initialization;

[0027] S2 Product clamping: Place the product to be mounted on and lock it in place on the fixed platform of the first spatial position adjustment device;

[0028] S3 Imaging Calibration: Adjust the position and focal length of the top-view imaging device, side-view imaging device, and front-view imaging device to ensure that the mounting area of ​​the product to be mounted is clearly imaged on the corresponding display; adjust the magnification of the top-view imaging device and complete the size measurement calibration.

[0029] S4 Reference Line Drawing: Using the mouse in the top-view imaging screen, select reference points on the product to be mounted according to the mounting drawing, and draw the X and Y direction reference positioning outlines of the chip to be mounted;

[0030] S5 Clamping System Initialization: Open the operation interface of the clamping control device, control the actuator to reset to zero, and drive the gripper to open to the preset opening degree;

[0031] S6 Chip Loading: Manually place the chip to be mounted on the plane of the mounting base, adjust the second spatial position adjustment device to move the gripper pair to a position where the chip can be held; control the actuator to drive the gripper pair to close, stably holding the chip to be mounted.

[0032] S7 Alignment Adjustment: Move the clamped chip to directly above the area to be mounted using the second spatial position adjustment device; and manually adjust the second spatial position adjustment device and the first spatial position adjustment device in conjunction with the reference frame in the top-view imaging to align the edge of the chip with the reference frame.

[0033] S8 Mounting and Curing: Adjust the second spatial position adjustment device to drive the chip down until the chip is in contact with the mounting surface of the product to be mounted; after confirming that the chip position is aligned with the reference frame again by top-view imaging, control the actuator to drive the grippers to open and release the chip;

[0034] S9 Reset and Finishing: Adjust the second spatial position adjustment device to drive the gripper to rise and reset, completing a single placement operation.

[0035] The present invention, in some or all embodiments, has the following beneficial technical effects: The present invention can acquire mounting images from multiple perspectives through a three-channel imaging device; it achieves multi-degree-of-freedom precision attitude adjustment between the product to be mounted and the chip through a first spatial position adjustment device and a second spatial position adjustment device; and it uses a pair of grippers with funnel-shaped clearance space to stably hold the chip while reserving an unobstructed imaging field of view. The present invention has low overall cost, modular design, and simple assembly and maintenance. Through manual precision adjustment combined with visual-assisted alignment, the mounting accuracy can reach within ±5μm. It requires no professional operators or complex programming, making it suitable for high-precision chip mounting scenarios in the optical module R&D stage. It effectively solves the technical problems of high procurement cost, slow iteration adaptation, and high operating threshold of existing high-precision pick-and-place machines.

[0036] Furthermore, other beneficial effects of the present invention will be mentioned in the specific embodiments. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of the overall structure of a chip mounter according to one embodiment of the present invention.

[0038] Figure 2 This is a schematic diagram of the structure of a base platform according to one embodiment of the present invention.

[0039] Figure 3 This is a schematic diagram of an imaging system according to one embodiment of the present invention.

[0040] Figure 4 This is a schematic diagram of the structure of a gantry frame according to one embodiment of the present invention.

[0041] Figure 5 This is a schematic diagram of the top-view imaging device according to one embodiment of the present invention.

[0042] Figure 6 This is a schematic diagram of the structure of a side-view imaging device according to one embodiment of the present invention.

[0043] Figure 7 This is a schematic diagram of the structure of an orthographic imaging device according to one embodiment of the present invention.

[0044] Figure 8 This is a schematic diagram of the structure of a first spatial position adjustment device according to an embodiment of the present invention.

[0045] Figure 9 This is a schematic diagram of the structure of a second spatial position adjustment device according to an embodiment of the present invention.

[0046] Figure 10 This is a schematic diagram of the clamping control device according to one embodiment of the present invention.

[0047] Figure 11 This is a schematic diagram of the gripper pair in the gripping state according to one embodiment of the present invention.

[0048] in:

[0049] 1. Base platform;

[0050] 2. Gantry frame; 2.1. First track; 2.2. First moving block; 2.3. Second moving block;

[0051] 3. Top-down imaging device,

[0052] 3.1 First X-axis moving assembly; 3.1.1 First top-view camera mounting base; 3.1.2 Second track; 3.1.3 Third moving block;

[0053] 3.2 First Y-axis moving assembly; 3.2.1 Second top-view camera mounting base; 3.2.2 Third track; 3.2.3 Fourth moving block;

[0054] 3.3 First Z-axis moving assembly; 3.3.1 Fifth moving block; 3.3.2 Top-view camera mounting bracket;

[0055] 3.4. Top-down camera view;

[0056] 4. Side-view imaging device,

[0057] 4.1 Second X-axis moving assembly; 4.1.1 Fifth moving block; 4.1.2 First side-view camera mounting base; 4.1.3 Fourth track;

[0058] 4.2 Second Y-axis moving assembly; 4.2.1 Sixth moving block; 4.2.2 Second side-view camera mounting base; 4.2.3 Fifth track;

[0059] 4.3 Second Z-axis moving assembly; 4.3.1 Seventh moving block; 4.3.2 Third side-view camera mounting bracket.

[0060] 4.4 Rotating Components; 4.4.1 Side-view Camera Rotating Axis; 4.4.2 Fourth Side-view Camera Mount; 4.4.3 Sixth Track

[0061] 4.5, Inclined Adjustment Component; 4.5.1, Eighth Moving Block; 4.5.2, Fifth Side-View Camera Mounting Mount;

[0062] 4.6 Side-view camera;

[0063] 5. Frontal imaging device; 5.1. Magnetic base; 5.1.1. Magnetic base X-axis knob; 5.1.2. Magnetic base Y-axis knob; 5.2. Vertical bracket; 5.3. Frontal camera; 5.4. Frontal camera mounting base.

[0064] 6. First spatial position adjustment device; 6.1 Mounting plate; 6.2 First pitch angle adjustment platform; 6.3 Second pitch angle adjustment platform; 6.4 Horizontal rotation angle adjustment platform; 6.5 Fixed platform;

[0065] 7. Second spatial position adjustment device; 7.1 Mounting platform; 7.2 X-axis adjustment platform; 7.3 Y-axis adjustment platform; 7.4 Z-axis adjustment platform; 7.5 Tilt adjustment platform; 7.6 Horizontal pitch angle adjustment platform; 7.7 Horizontal yaw angle adjustment platform; 7.8 Fixed base;

[0066] 8. Clamping control device; 8.1. Actuator; 8.2. Grip pair; 8.3. Grip mounting base; 8.4. Funnel-shaped clearance space; 8.5. Control host;

[0067] 9. Display device. Detailed Implementation

[0068] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0069] To facilitate a clear description of the technical solutions in the embodiments of the present invention, the terms "first" and "second" are used to distinguish identical or similar items with essentially the same function and effect. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order.

[0070] To address the technical problems existing in the prior art, the present invention provides a manual chip mounter. Figure 1 This is a schematic diagram of the overall structure of a chip mounter according to one embodiment of the present invention, as shown below. Figure 1 As shown, the manual placement machine includes a base platform 1, an imaging system, a first spatial position adjustment device 6, a second spatial position adjustment device 7, and a clamping control device 8.

[0071] Figure 2 This is a schematic diagram of the structure of a base platform according to one embodiment of the present invention.

[0072] like Figure 2 As shown, the base platform 1 is an optical platform or optical breadboard. The surface of the base platform 1 is provided with an array of threaded holes with a spacing of 10mm×10mm and a hole diameter of M6, which are used for flexible installation and position adjustment of various components.

[0073] Figure 3 This is a schematic diagram of an imaging system according to one embodiment of the present invention.

[0074] like Figure 1 and Figure 3 As shown, the imaging system includes a gantry 2, a top-view imaging device 3, a side-view imaging device 4, and a front-view imaging device 5.

[0075] Figure 4 This is a schematic diagram of the structure of a gantry frame according to one embodiment of the present invention.

[0076] like Figure 1 and Figure 4As shown, the gantry 2 can be fixedly installed on the base platform 1 to provide mounting positions for the top-view imaging device 3 and the side-view imaging device 4. The gantry 2 can be fixedly connected to the base platform 1 through a threaded connection structure. A first track 2.1 is fixedly provided at the top of the gantry 2. The first track 2.1 is movably provided with a first moving block 2.2 and a second moving block 2.3 that cooperate with the first track 2.1. Preferably, the first track 2.1 can be a slide rail, a rack and pinion, or a lead screw. Correspondingly, the first moving block 2.2 and the second moving block 2.3 can cooperate with the first track 2.1 through a slider, gear, or nut to form a kinematic pair that can move in the horizontal direction.

[0077] like Figure 1 and Figure 3 As shown, the top-view imaging device 3 and the side-view imaging device 4 are movably mounted on the top of the gantry 4. Specifically, the top-view imaging device 3 can be fixedly mounted on the first moving block 2.2, and the side-view imaging device 4 can be fixedly mounted on the second moving block 2.3, so that the top-view imaging device 3 and the side-view imaging device 4 can be moved and adjusted in the horizontal direction.

[0078] The top-view imaging device 3 is located directly above the product to be patched in the working position, and the top-view imaging device 3 is the main observation device; the side-view imaging device 4 is located to the left or right of the product to be patched in the working position, and the side-view imaging device 4 is the auxiliary observation device.

[0079] The frontal imaging device 5 is freely movable on the base platform 1. The frontal imaging device 5 is located in the direction directly opposite the product to be patched in the working position. The frontal imaging system 5 is an auxiliary observation device.

[0080] The first spatial position adjustment device 6 is fixedly mounted on the base platform 1. The first spatial position adjustment device 6 can control the spatial attitude of the product to be patched through two orthogonal pitch angle adjustment platforms and one horizontal rotation angle adjustment platform, and can fix the product to be patched.

[0081] The second spatial position adjustment device 7 can be fixedly installed on the base platform 1. The second spatial position adjustment device 7 can adjust the spatial position of the chip through three axes: X-axis, Y-axis and Z-axis. That is, the spatial position of the chip relative to the product to be mounted can be adjusted by the horizontal yaw angle adjustment platform, the horizontal tilt angle adjustment platform and the horizontal pitch angle adjustment platform.

[0082] like Figure 1 As shown, the clamping control device 8 can be fixedly installed on the second spatial position adjustment device 7, and the clamping control device 8 can clamp or release the chip to be mounted.

[0083] As an optional embodiment of the present invention, such as Figure 1 As shown, the placement machine also includes a display device 9, which can be fixedly mounted on the base platform 1.

[0084] The top-view imaging device 3, the side-view imaging device 4, and the front-view imaging device 5 are respectively connected to the display device 9 for acquiring images of the mounting area from multiple perspectives and outputting them to the display device 9.

[0085] Figure 5 This is a schematic diagram of the top-view imaging device according to one embodiment of the present invention.

[0086] In one possible implementation of the present invention, such as Figure 5 As shown, the top-view imaging device 3 includes a first X-axis moving component 3.1, a first Y-axis moving component 3.2, a first Z-axis moving component 3.3, and a top-view camera 3.4; the first X-axis moving component 3.1 is movably disposed on the top of the gantry 2; the first Y-axis moving component 3.2 is movably disposed on the first X-axis moving component 3.1; the first Z-axis moving component 3.3 is movably disposed on the first Y-axis moving component 3.2; and the top-view camera 3.4 is fixedly connected to the first Z-axis moving component 3.3.

[0087] In one possible implementation of the present invention, such as Figure 5 As shown, the first X-axis moving assembly 3.1 includes a first top-view camera mounting base 3.1.1, a second track 3.1.2, and a third moving block 3.1.3. The third moving block 3.1.3 is fixedly disposed on the lower end face of the first top-view camera mounting base 3.1.1, and the second track 3.1.2 is fixedly disposed on the upper end of the first top-view camera mounting base 3.1.1. The top-view imaging device 3 can be fixedly mounted on the first moving block 2.2 through the third moving block 3.3.3, thereby realizing the displacement adjustment of the top-view imaging device 3 on the X-axis through the cooperation of the first moving block 2.2 and the first track 2.1.

[0088] In one possible implementation of the present invention, such as Figure 5 As shown, the first Y-axis moving assembly 3.2 includes a second top-view camera mounting base 3.2.1, a third track 3.2.2, and a fourth moving block 3.2.3; the fourth moving block 3.2.3 is fixedly disposed on the lower end face of the second top-view camera mounting base 3.2.1, and the third track 3.2.2 is fixedly disposed on the side of the second top-view camera mounting base 3.2.1.

[0089] The fourth moving block 3.2.3 can move on the second track 3.1.2. Preferably, the second track 3.1.2 can be a slide rail, rack, or lead screw. Correspondingly, the fourth moving block 3.2.3 can cooperate with the first track 2.1 through a slider, gear, or nut to form a kinematic pair that can move in the Y-axis direction, thereby realizing the displacement adjustment of the top-view imaging device 3 on the Y-axis.

[0090] In one possible implementation of the present invention, such as Figure 5 As shown, the first Z-axis moving assembly 3.3 includes a fifth moving block 3.3.1 and a top-view camera mounting bracket 3.3.2; the fifth moving block 3.3.1 is fixedly connected to the top-view camera mounting bracket 3.3.2, which is used for detachably mounting and fixing the top-view camera 3.4; the fifth moving block 3.3.1 can move on the third track 3.2.2. Preferably, the third track 3.2.2 can be a slide rail, rack, or lead screw. Correspondingly, the fifth moving block 3.3.1 can cooperate with the third track 3.2.2 through a slider, gear, or nut to form a kinematic pair that can move in the Z-axis direction, thereby realizing the displacement adjustment of the top-view imaging device 3 on the Z-axis.

[0091] Preferably, the top-view camera 3.4, as a key component of the top-view imaging device, has a color imaging capability of more than 20 million pixels, and has auxiliary drawing and size measurement functions. It can capture images and videos by drawing with a mouse, and project the images onto the display through an HDMI data connection cable.

[0092] Figure 6 This is a schematic diagram of the structure of a side-view imaging device according to one embodiment of the present invention.

[0093] In one possible implementation of the present invention, such as Figure 6 As shown, the side-view imaging device 4 includes a second X-axis moving component 4.1, a second Y-axis moving component 4.2, a second Z-axis moving component 4.3, a rotation component 4.4, an oblique adjustment component 4.5, and a side-view camera 4.6. The second X-axis moving component 4.1 is movably mounted on the top of the gantry 2. The second Y-axis moving component 4.2 is movably mounted on the second X-axis moving component 4.1. The second Z-axis moving component 4.3 is movably mounted on the second Y-axis moving component 4.2. The rotation component 4.4 is fixedly connected to the second Z-axis moving component 4.3. The oblique adjustment component 4.5 is movably mounted on the rotation component 4.4. The side-view camera 4.6 is fixedly connected to the oblique adjustment component 4.5.

[0094] In one possible implementation of the present invention, such as Figure 6As shown, the second X-axis moving assembly 4.1 includes a fifth moving block 4.1.1, a first side-view camera mounting base 4.1.2, and a fourth track 4.1.3. The fifth moving block 4.1.1 is fixedly disposed on the lower end face of the first side-view camera mounting base 4.1.2, and the fourth track 4.1.3 is fixedly disposed on the upper end of the first side-view camera mounting base 4.1.2. The side-view imaging device 4 can be fixedly mounted on the second moving block 2.3 through the fifth moving block 4.1.1, thereby realizing the displacement adjustment of the side-view imaging device 4 on the X-axis through the cooperation of the second moving block 2.3 and the first track 2.1.

[0095] In one possible implementation of the present invention, such as Figure 6 As shown, the second Y-axis moving assembly 4.2 includes a sixth moving block 4.2.1, a second side-view camera mounting base 4.2.2, and a fifth track 4.2.3. The sixth moving block 4.2.1 is fixedly disposed on the lower end face of the second side-view camera mounting base 4.2.2, and the fifth track 4.2.3 is fixedly disposed on the side of the second side-view camera mounting base 4.2.2.

[0096] The sixth moving block 4.2.1 can move on the fourth track 4.1.3. Preferably, the fourth track 4.1.3 can be a slide rail, rack, or lead screw. Correspondingly, the sixth moving block 4.2.1 can cooperate with the fourth track 4.1.3 through a slider, gear, or nut to form a kinematic pair that can move in the Y-axis direction, thereby realizing the displacement adjustment of the side-view imaging device 4 on the Y-axis.

[0097] In one possible implementation of the present invention, such as Figure 6 As shown, the second Z-axis assembly 4.3 includes a seventh moving block 4.3.1 and a third side-view camera mounting base 4.3.2, with the first moving block 4.3.1 fixedly mounted on one end of the third side-view camera mounting base 4.3.2.

[0098] The seventh moving block 4.3.1 can move on 4.2.3 and the fifth track. Preferably, 4.2.3 and the fifth track can be a slide rail, a rack and pinion, or a lead screw. Correspondingly, the seventh moving block 4.3.1 can cooperate with the fifth track 4.2.3 through a slider, gear, or nut to form a kinematic pair that can move in the Z-axis direction, thereby realizing the displacement adjustment of the side-view imaging device 4 on the Z-axis.

[0099] In one possible implementation of the present invention, such as Figure 6As shown, the rotating assembly 4.4 includes a side-view camera rotating platform 4.4.1, a fourth side-view camera mounting base 4.4.2, and a sixth track 4.4.3. One end of the side-view camera rotating platform 4.4.1 is fixedly connected to the third side-view camera mounting base 4.3.2, and the other end of the side-view camera rotating platform 4.4.1 is fixedly connected to the fourth side-view camera mounting base 4.4.2. The sixth track 4.4.3 is fixedly installed on the end face of the fourth side-view camera mounting base 4.4.2 away from the side-view camera rotating platform 4.4.1. The fourth side-view camera mounting base 4.4.2 can rotate relative to the third side-view camera mounting base 4.3.2 through the side-view camera rotating platform 4.4.1, thereby realizing the adjustment of the rotation angle of the side-view imaging device 4.

[0100] In one possible implementation of the present invention, such as Figure 6 As shown, the oblique adjustment assembly 4.5 includes an eighth moving block 4.5.1 and a fifth side-view camera mounting base 4.5.2. The eighth moving block 4.5.1 is fixedly installed at one end of the fifth side-view camera mounting base 4.5.2, and the side-view camera 4.6 is detachably installed on the end face of the fifth side-view camera mounting base 4.5.2 away from the eighth moving block 4.5.1.

[0101] The eighth moving block 4.5.1 can move on 4.4.3 and the sixth track. Preferably, the 4.4.3 and the sixth track can be a slide rail, a rack and pinion, or a lead screw. Correspondingly, the eighth moving block 4.5.1 can cooperate with the 4.4.3 and the sixth track through a slider, a gear, or a nut to form a kinematic pair that can move in the tilt direction, thereby realizing the displacement adjustment of the side-view imaging device 4 in the tilt direction.

[0102] The side-view camera 4.6, as a key component of the side-view imaging device 4, has a color imaging capability of over 20 million pixels, and features auxiliary drawing and size measurement functions. It can capture images and videos by drawing with a mouse, and project the images onto a monitor via an HDMI data cable.

[0103] Figure 7 This is a schematic diagram of the structure of an orthographic imaging device according to one embodiment of the present invention.

[0104] In one possible implementation of the present invention, such as Figure 7As shown, the frontal imaging device 5 includes a magnetic base 5.1, a vertical bracket 5.2, a frontal camera 5.3, and a frontal camera mounting base 5.4. The vertical bracket 5.2 is fixedly mounted on the magnetic base 5.1. One end of the frontal camera mounting base 5.4 is detachably mounted on the vertical bracket 5.2, and the frontal camera 5.3 is detachably mounted on the other end of the frontal camera mounting base 5.4.

[0105] The magnetic base 5.1 can be controlled by the magnetic base switch to maintain its adsorption force on the base platform 1, and the magnetic base X-axis knob 5.1.1 and magnetic base Y-axis knob 5.1.2 can be used to control the minute displacement adjustment of the frontal imaging device 5.

[0106] The front-view camera 5.3, as a key component for front and side imaging, has a color imaging capability of over 20 million pixels, and features auxiliary drawing and size measurement functions. It can capture images and videos by drawing with a mouse, and project the images onto a monitor via an HDMI data cable.

[0107] Figure 8 This is a schematic diagram of the structure of a first spatial position adjustment device according to an embodiment of the present invention.

[0108] In one possible implementation of the present invention, such as Figure 8 As shown, the first spatial position adjustment device 6 includes a mounting plate 6.1, a first pitch angle adjustment platform 6.2, a second pitch angle adjustment platform 6.3, a horizontal rotation angle adjustment platform 6.4, and a fixed platform 6.5.

[0109] The mounting plate 6.1 is fixedly mounted on the base platform 1; the first pitch angle adjustment platform 6.2 is fixedly mounted on the mounting plate 6.1; the second pitch angle adjustment platform 6.3 is fixedly mounted on the first pitch angle adjustment platform 6.2; the horizontal rotation angle adjustment platform 6.4 is fixedly mounted on the second pitch angle adjustment platform 6.3; the fixing platform 6.5 is fixedly mounted on the horizontal rotation angle adjustment platform 6.4; the first spatial position adjustment device 6 controls the spatial position and attitude of the product to be mounted by means of the orthogonal first pitch angle adjustment platform 6.2, second pitch angle adjustment platform 6.3 and horizontal rotation angle adjustment platform 6.4, and fixes the product to be mounted by means of the fixing platform.

[0110] Figure 9 This is a schematic diagram of the structure of a second spatial position adjustment device according to an embodiment of the present invention.

[0111] In one possible implementation of the present invention, such as Figure 9As shown, the second spatial position adjustment device 7 includes a mounting platform 7.1, an X-axis adjustment platform 7.2, a Y-axis adjustment platform 7.3, a Z-axis adjustment platform 7.4, a tilt adjustment platform 7.5, a horizontal pitch angle adjustment platform 7.6, a horizontal sway angle adjustment platform 7.7, and a fixed base 7.8.

[0112] The mounting platform 7.1 is fixedly mounted on the base platform 1; the X-axis adjustment platform 7.2 is fixedly mounted on the mounting platform 7.1; the Y-axis adjustment platform 7.3 is fixedly mounted on the X-axis adjustment platform 7.2; the Z-axis adjustment platform 7.4 is fixedly mounted on the Y-axis adjustment platform 7.3; the tilt adjustment platform 7.5 is fixedly mounted on the Z-axis adjustment platform 7.4; the horizontal pitch angle adjustment platform 7.6 is fixedly mounted on the tilt adjustment platform 7.5; the horizontal sway angle adjustment platform 7.7 is fixedly mounted on the horizontal pitch angle adjustment platform 7.6; the fixed base 7.8 is fixedly mounted on the horizontal sway angle adjustment platform 7.7; and the clamping control device 8 is fixedly mounted on the fixed base 7.8.

[0113] The second spatial position adjustment device 7 adjusts the spatial position of the chip through the X-axis adjustment platform 7.2, the Y-axis adjustment platform 7.3 and the Z-axis adjustment platform 7.4, and adjusts the spatial position of the chip relative to the chip product to be attached through the tilt adjustment platform 7.5, the horizontal pitch angle adjustment platform 7.6 and the horizontal sway angle adjustment platform 7.7.

[0114] Figure 10 This is a schematic diagram of the clamping control device according to one embodiment of the present invention.

[0115] In one possible implementation of the present invention, such as Figure 10 As shown, the clamping control device 8 includes an actuator 8.1, a pair of grippers 8.2, a gripper mounting base 8.3, and a control host 8.5.

[0116] The actuator 8.1 is fixedly mounted on the fixed base 7.8; the gripper pair 8.2 is fixedly mounted on the actuator 8.1 via the gripper mounting base 8.3; preferably, the actuator 8.1 is an electric cylinder; the control host 8.5 is placed on the base platform 1 and connected to the display via an HDMI cable.

[0117] Figure 11 This is a schematic diagram of the gripper pair in the gripping state according to one embodiment of the present invention.

[0118] like Figure 11As shown, the gripper pair 8.2 includes two opposing grippers; the two grippers have symmetrical structures, and the working surface of each gripper is precision polished to ensure clamping flatness; the gripper tips are thinned and heat-treated to enhance rigidity, so that the tips occupy little space when clamping the chip, do not block the space of adjacent channels of the chip, and at the same time avoid bending and deformation of the grippers under force; the grippers have a slender structure as a whole, so that they do not interfere with other parts on the surface of the product to be mounted when clamped.

[0119] Preferably, in the clamping state, the relative clamping surfaces of the two grippers enclose a funnel-shaped clearance space 8.4, thereby stabilizing the chip while reserving an unobstructed imaging field of view for the top-view imaging device 3.

[0120] On the other hand, the present invention also provides a manual patch application method, comprising the following steps:

[0121] S1 System Power On: Turn on the power to the imaging system, display device 9 and clamping control device 8 to complete equipment initialization;

[0122] S2 Product clamping: Place the product to be mounted on and lock it securely on the fixing platform 6.5 of the first spatial position adjustment device 6;

[0123] S3 Imaging Adjustment: Adjust the position and focal length of the top-view imaging device 3, the side-view imaging device 4, and the front-view imaging device 5 to ensure that the mounting area of ​​the product to be mounted is clearly imaged on the corresponding display; adjust the magnification of the top-view imaging device and complete the size measurement calibration.

[0124] S4 Reference Line Drawing: Using the mouse in the top-view imaging screen, select reference points on the product to be mounted according to the mounting drawing, and draw the X and Y direction reference positioning outlines of the chip to be mounted;

[0125] S5 Clamping System Initialization: Open the operation interface of clamping control device 8, control the electric cylinder to reset to zero, and drive the gripper to open to the preset opening degree;

[0126] S6 Chip Loading: Manually place the chip to be mounted on the plane of the fixing base 7.8, adjust the second spatial position adjustment device 7 to move the gripper pair 8.2 to a position where the chip can be held; control the electric cylinder to drive the gripper pair to close, stably holding the chip to be mounted.

[0127] S7 Alignment Adjustment: Move the clamped chip to directly above the area to be mounted using the second spatial position adjustment device 7; and manually adjust the second spatial position adjustment device 7 and the first spatial position adjustment device 6 in conjunction with the reference frame in the top-view imaging to align the edge of the chip with the reference frame.

[0128] S8 Mounting and Curing: Adjust the second spatial position adjustment device 7 to drive the chip down until the chip is in contact with the mounting surface of the product to be mounted; after confirming that the chip position is aligned with the reference frame again by top-view imaging, control the electric cylinder to drive the gripper 8.2 to open and release the chip;

[0129] S9 Reset and Finishing: Adjust the second spatial position adjustment device 7 to drive the gripper 8.2 to rise and reset, completing a single placement operation.

[0130] The present invention, in some or all embodiments, has the following beneficial technical effects: The present invention can acquire mounting images from multiple perspectives through a three-channel imaging device; it achieves multi-degree-of-freedom precision attitude adjustment between the product to be mounted and the chip through a first spatial position adjustment device and a second spatial position adjustment device; and it uses a pair of grippers with funnel-shaped clearance space to stably hold the chip while reserving an unobstructed imaging field of view. The present invention has low overall cost, modular design, and simple assembly and maintenance. Through manual precision adjustment combined with visual-assisted alignment, the mounting accuracy can reach within ±5μm. It requires no professional operators or complex programming, making it suitable for high-precision chip mounting scenarios in the optical module R&D stage. It effectively solves the technical problems of high procurement cost, slow iteration adaptation, and high operating threshold of existing high-precision pick-and-place machines.

[0131] In this invention, some technical means in different types of embodiments are based on the same or similar principles. To avoid redundancy, not all possible technical means or principles are described in every type of embodiment. Those skilled in the art will know that a technical means not mentioned in a certain type of embodiment can also be applied to that type of embodiment. Each type of embodiment of this invention is not limited to the corresponding text.

[0132] To better illustrate the present invention, numerous specific details have been provided in the detailed embodiments described above. Those skilled in the art should understand that the present invention can be practiced even without certain specific details. In some instances, methods, means, components, and circuits well known to those skilled in the art have not been described in detail in order to highlight the main points of the present invention.

[0133] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A manual chip mounter, characterized in that, include: Base platform; An imaging system, comprising a gantry, a top-view imaging device, a side-view imaging device, and a front-view imaging device, wherein the gantry is fixedly mounted on the base platform, the top-view imaging device and the side-view imaging device are movably mounted on the top of the gantry in a horizontal direction, and the front-view imaging device is movably mounted on the base platform. A first spatial position adjustment device is fixedly mounted on the base platform and is used to adjust the spatial posture of the product to be mounted. A second spatial position adjustment device is fixedly mounted on the base platform; A clamping control device is fixedly installed on the second spatial position adjustment device.

2. The placement machine according to claim 1, characterized in that, Also includes: The display device is fixedly mounted on the base platform; The top-view imaging device, the side-view imaging device, the front-view imaging device, and the clamping control device are respectively signal-connected to the display device.

3. The placement machine according to claim 1, characterized in that: The top-view imaging device includes a first X-axis moving component, a first Y-axis moving component, a first Z-axis moving component, and a top-view camera; The first X-axis moving component is movably mounted on the top of the gantry frame; The first Y-axis moving component is movably mounted on the first X-axis moving component; The first Z-axis moving component is movably mounted on the first Y-axis moving component; The top-view camera is fixedly connected to the first Z-axis moving component.

4. The placement machine according to claim 1, characterized in that: The side-view imaging device includes a second X-axis moving component, a second Y-axis moving component, a second Z-axis moving component, a rotation component, an oblique adjustment component, and a side-view camera; The second X-axis moving component is movably mounted on the top of the gantry; The second Y-axis moving component is movably mounted on the second X-axis moving component; The second Z-axis moving component is movably mounted on the second Y-axis moving component; The rotating component is fixedly connected to the second Z-axis moving component; The oblique adjustment component is movably mounted on the rotating component; The side-view camera is fixedly connected to the oblique adjustment component.

5. The placement machine according to claim 1, characterized in that: The frontal imaging device includes a magnetic base, a vertical support, and a frontal camera; The vertical bracket is fixedly installed on the magnetic base; The height-adjustable front-view camera is mounted on the vertical bracket.

6. The placement machine according to claim 1, characterized in that: The first spatial position adjustment device includes, Mounting plate, which is fixedly mounted on the base platform; The first pitch angle adjustment platform is fixedly mounted on the mounting plate; The second pitch angle adjustment platform is fixedly mounted on the first pitch angle adjustment platform; A horizontal rotation angle adjustment platform, wherein the horizontal rotation angle adjustment platform is fixedly mounted on a second pitch angle adjustment platform; A fixed platform is fixedly mounted on the horizontal rotation angle adjustment platform.

7. The placement machine according to claim 1, characterized in that: The second spatial position adjustment device includes, Mounting platform, which is fixedly mounted on the base platform; X-axis adjustment platform, which is fixedly mounted on the mounting platform; The Y-axis adjustment platform is fixedly mounted on the X-axis adjustment platform; Z-axis adjustment platform, which is fixedly mounted on Y-axis adjustment platform; A tilt adjustment platform, which is fixedly mounted on the Z-axis adjustment platform. A horizontal pitch angle adjustment platform, wherein the horizontal pitch angle adjustment platform is fixedly mounted on the tilt adjustment platform; A horizontal sway angle adjustment platform, which is fixedly mounted on the pitch angle adjustment platform. A fixed base is fixedly mounted on the horizontal side swing angle adjustment platform.

8. The placement machine according to claim 1, characterized in that: The second spatial position adjustment device includes a fixed base; The clamping control device includes an actuator and a pair of grippers; The actuator is fixedly mounted on the fixed base; The gripper pair is fixedly mounted on the actuator via a gripper mounting seat.

9. The placement machine according to claim 8, characterized in that: The gripper pair includes two grippers arranged opposite each other; When clamped, the opposing clamping surfaces of the two jaws enclose a funnel-shaped clearance space.

10. A manual placement method using the placement machine according to claim 8 or 9, characterized in that: Includes the following steps: S1 System Power-On: Turn on the power to the imaging system, display device and clamping control device to complete equipment initialization; S2 Product clamping: Place and lock the product to be mounted onto the first spatial position adjustment device; S3 Imaging Calibration: Adjust the position and focal length of the top-view imaging device, side-view imaging device, and front-view imaging device to ensure that the mounting area of ​​the product to be mounted is clearly imaged on the display device; adjust the magnification of the top-view imaging device and complete the size measurement calibration. S4 Reference Line Drawing: Using the mouse in the top-view imaging screen, select reference points on the product to be mounted according to the mounting drawing, and draw the X and Y direction reference positioning outlines of the chip to be mounted; S5 Clamping System Initialization: Open the operation interface of the clamping control device, control the actuator to reset to zero, and drive the gripper to open to the preset opening degree; S6 Chip Loading: Manually place the chip to be mounted on the plane of the mounting base, adjust the second spatial position adjustment device to move the gripper pair to a position where the chip can be held; control the actuator to drive the gripper pair to close, stably holding the chip to be mounted. S7 Alignment Adjustment: Move the clamped chip to directly above the area to be mounted using the second spatial position adjustment device; and manually adjust the second spatial position adjustment device and the first spatial position adjustment device in conjunction with the reference frame in the top-view imaging to align the edge of the chip with the reference frame. S8 Mounting and Curing: Adjust the second spatial position adjustment device to drive the chip down until the chip is in contact with the mounting surface of the product to be mounted; after confirming that the chip position is aligned with the reference frame again by top-view imaging, control the actuator to drive the grippers to open and release the chip; S9 Reset and Finishing: Adjust the second spatial position adjustment device to drive the gripper to rise and reset, completing a single placement operation.

Images