A stress relief cavity opening structure for hermetic packaging of rectangular connectors

Abstract

The application discloses a stress release cavity opening structure for air-tight packaging of a rectangular connector and relates to the technical field of microelectronic packaging. The stress release cavity opening structure comprises a cavity body, at least one mounting hole for mounting the rectangular connector is arranged on one side wall of the cavity body, the rectangular connector comprises a metal shell, a glass body arranged at one end of the metal shell and a pin inserted into the glass body, a welding area is arranged in the mounting hole along the wall thickness direction of the cavity body and is welded with the end of the metal shell away from the glass body, the metal shell corresponding to the glass body in the radial direction is a stress release area, a limiting structure for limiting the displacement of the metal shell is arranged in the mounting hole or the cavity body, and a welding ring placing groove for placing a welding ring is arranged on the side of the mounting hole away from the glass body. The application actively constructs a stress release structure through the design of a non-welding area, directly blocks the direct transmission of welding stress to the glass body in a physical path, and shows that the maximum residual stress of the glass body is reduced by more than 29% through finite element simulation.

Description

Technical Field

[0001] This invention relates to the field of microelectronic packaging technology, and more specifically to the field of stress relief cavity opening structure technology for hermetic packaging of rectangular connectors. Background Technology

[0002] Microwave components are core modules for signal transmission, reception, and processing in electronic systems such as radar and communications. Their internal circuitry is highly sensitive to moisture, dust, and electromagnetic interference. Therefore, microwave components typically require hermetic encapsulation to ensure long-term reliability in product applications.

[0003] With the increasing integration of electronic products, electronic components are continuously developing towards miniaturization, lightweighting, high heat dissipation, and high strength. Rectangular connectors, as the interface for signal transmission between components and external circuits, can improve the density and efficiency of low-frequency signal interconnection while reducing product size. Connectors typically consist of pins, a glass body, and a metal shell. The glass body is formed by powder sintering and has a thermal expansion coefficient of approximately 5-6 ppm / ℃. To ensure thermal stress matching within the connector itself, the metal pins and shell are generally made of materials such as Kovar alloy (thermal expansion coefficient 5.1 ppm / ℃) or stainless steel. In engineering applications, hermetic sealing cavities mainly use lightweight, high-strength materials such as aluminum alloy, aluminum-silicon alloy, and magnesium alloy. Taking aluminum alloy as an example, its thermal expansion coefficient is approximately 23 ppm / ℃, and its density is 2.7 g / cm³, possessing excellent thermal conductivity, machinability, and structural rigidity, meeting requirements for packaging strength.

[0004] When a rectangular connector is soldered to a cavity, the difference in thermal expansion coefficients between the two materials results in a significantly greater deformation of the cavity than that of the connector during temperature changes, leading to substantial thermal stress concentration at the joint. As a brittle material, the glass body is difficult to release stress through plastic deformation. Therefore, the interface between the glass body and the metal shell after soldering becomes the weakest point of the joint, causing connector leakage and failure, and affecting the hermetic sealing reliability of the assembly.

[0005] To mitigate thermal mismatch issues, existing technologies commonly employ external auxiliary solutions such as adding transition layers, gradient materials, and composite sleeves. Patent CN110783751A discloses a stress relief structure to improve the reliability of hermetic welding of multi-core connectors. It changes the stiffness of the welding part of the cavity joint by setting an elastic transition zone with grooves between the multi-core connector and the aluminum alloy cavity, thus solving the problem of thermal mismatch between the multi-core connector and the cavity. However, this solution increases the complexity of the manufacturing process and the size of the product.

[0006] The patent with publication number CN114744438A discloses a gradient material box packaging structure. By setting an adjustment body with a transition coefficient of thermal expansion in the rectangular connector packaging area of ​​the box in an integral molding manner, thermal matching between the rectangular connector and the box body is achieved. However, the box is large in size, has high processing cost, and complex manufacturing process.

[0007] Patent CN112072375A discloses a novel micro-rectangular multi-core connector and its manufacturing method. This connector solves the thermal mismatch problem between the aluminum housing and the connector by brazing a metal shell with a transition coefficient of thermal expansion to the outside of the hermetically sealed socket (including pins, glass body and adapter board). However, when the connector is welded to the aluminum housing at high temperature, there is a risk of remelting and leakage of the internal weld seam. At the same time, this solution increases the size of the connector, which has certain limitations in high-density integrated packaging applications.

[0008] Patent CN114161021A discloses a sealing welding structure and welding method for a gas-tight micro-rectangular electrical connector. By setting a metal sleeve between the aluminum alloy housing and the micro-rectangular electrical connector, the thermal expansion coefficient of the metal sleeve is located between the thermal expansion coefficients of the aluminum alloy housing and the micro-rectangular electrical connector, thereby achieving gas-tight packaging. However, this solution requires the simultaneous welding of two weld seams, which is relatively complex and costly.

[0009] In summary, existing solutions all rely on external auxiliary structures / materials to address the thermal mismatch between the two. No solutions have been found that address the issue from the perspective of optimizing the cavity opening structure to construct an integrated structural mechanism that blocks stress transmission and maintains airtightness. Therefore, it is impossible to alleviate welding stress without increasing volume or process complexity. Summary of the Invention

[0010] The purpose of this invention is to address the technical problems in existing rectangular connector hermetic assemblies, such as severe thermal mismatch between the metal shell and the cavity, easy cracking and leakage of the glass body, and the increased complexity and volume caused by external transition structures. This invention provides a stress-relieving cavity opening structure for rectangular connector hermetic assemblies. Through adaptive design of the welded and non-welded areas, the welding stress transmission path is blocked and released, significantly reducing residual stress and stress concentration in the glass body. While maintaining miniaturization, lightweight design, and low cost, this greatly improves the long-term reliability of the hermetic assembly.

[0011] To achieve the above objectives, the present invention specifically adopts the following technical solution: This invention provides a stress relief cavity opening structure for hermetically sealed mounting of a rectangular connector, comprising a cavity body, wherein at least one mounting hole for mounting a rectangular connector is provided on one side wall of the cavity body, the rectangular connector comprising a metal shell, a glass body disposed at one end of the metal shell, and a pin inserted into the glass body, a welding area for welding to the end of the metal shell away from the glass body is provided in the mounting hole along the wall thickness direction of the cavity body, the metal shell corresponding to the glass body radially is a stress relief area, a limiting structure for limiting the displacement of the metal shell is provided in the mounting hole or the cavity body, and a welding ring placement groove for placing a welding ring is provided in the mounting hole on the side away from the glass body.

[0012] In one embodiment, after the rectangular connector is installed into the mounting hole, the metal shell portion corresponding to the glass body extends out of the mounting hole and is located inside the cavity body. This portion is a stress relief area, which is a non-welded area.

[0013] In one embodiment, the coefficient of thermal expansion of the metal shell material of the rectangular connector is α1, the coefficient of thermal expansion of the cavity body material is α2, and the relative compatibility of the coefficients of thermal expansion is... α = |α1 - α2|.

[0014] When the metal shell of the rectangular connector is soldered to the cavity body under low thermal mismatch conditions, i.e., 5ppm / ℃≤ When α≤15ppm / ℃; the difference in thermal deformation is moderate and the stress level is not high, stress release and weld strength need to be considered simultaneously. The length of the non-welded area is T, the glass body length of the rectangular connector is t, and the dimensional constraint condition of the non-welded area is T≥t, which satisfies the basic stress isolation requirements; Under the premise of ensuring airtightness, the welding width of the welding area is W, the minimum length of the airtight weld is W0, and the size constraint of the welding area is W≥W0, which meets the basic airtightness requirements.

[0015] In one embodiment, the limiting structure is a positioning boss located at the bottom of the cavity body.

[0016] In one embodiment, after the rectangular connector is installed into the mounting hole, the metal shell is located inside the mounting hole. An inwardly recessed annular groove is provided on the side of the mounting hole corresponding to the glass body. There is a gap between the metal shell area corresponding to the glass body and the annular groove. The metal shell area corresponding to the glass body is a stress relief area, which is a non-welding area. The remaining areas of the metal shell are welding areas.

[0017] In one embodiment, the coefficient of thermal expansion of the metal shell material of the rectangular connector is α1, the coefficient of thermal expansion of the cavity body material is α2, and the relative compatibility of the coefficients of thermal expansion is... α = |α1 - α2|.

[0018] When the metal shell of a rectangular connector is soldered to the cavity body under high-temperature mismatch, i.e. When α≥15ppm / ℃, the thermal deformation varies greatly and the stress level is high, requiring enhanced stress release.

[0019] When the connector and cavity are soldered under high thermal mismatch conditions ( (α≥15ppm / ℃), large differences in thermal deformation, high stress level, requiring enhanced stress release effect; The length of the non-welded area is T, the length of the glass body of the rectangular connector is t, and the size constraint of the non-welded area is T≥1.25t, which meets the basic stress isolation requirements, ensures that the glass body is entirely within the non-welded area, and avoids edge stress penetration. In one embodiment, under the premise of ensuring airtightness, the welding width of the welding area is W, the minimum length of the airtight weld is W0, and the size constraint of the welding area is W≥1.2W0, so that the weld still has sufficient load-bearing area and airtight reliability under high stress.

[0020] In one embodiment, the metal casing is made of Kovar alloy or stainless steel.

[0021] In one embodiment, the cavity body is made of aluminum alloy, silicon-aluminum alloy, or magnesium alloy.

[0022] In one embodiment, the cavity body is provided with multiple mounting holes, each mounting hole engaging with a corresponding rectangular connector.

[0023] The beneficial effects of this invention are as follows: 1. Stress Interception and Release: The non-welding area is designed to block the direct transmission of welding stress to the glass body through physical pathways, thereby releasing welding stress. Finite element simulation shows that the maximum residual stress of the glass body is reduced by more than 29%, and the stress concentration phenomenon is significantly alleviated, thus inhibiting glass body cracking and gas leakage from the root cause.

[0024] 2. Miniaturization of microwave components without additional structures: Without using transition materials or adding adapters, stress relief is achieved solely through optimization of the cavity body opening, maintaining the minimum package size and meeting the requirements of high-density integration and miniaturized electronic systems.

[0025] 3. By constructing non-welding areas, the volume of the welding area is significantly reduced, and the amount of weld rings used is halved. Furthermore, the elimination of complex machining and multiple welding processes greatly reduces manufacturing costs and improves production consistency and yield.

[0026] 4. The non-welded area can form a continuous and stable airtight weld, which meets the encapsulation leakage rate requirements specified in GJB548C-2021 method 1014.3, and the long-term reliability is greatly improved.

[0027] 5. The lengths of the non-welded area and the welded area are adaptively adjusted according to the degree of thermal mismatch (Δα value) to achieve the optimal balance between stress release effect and weld strength, and it has wide material compatibility. Attached Figure Description

[0028] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the structure of Example 1.

[0030] Figure 2 for Figure 1 A magnified view of a portion of the image.

[0031] Figure 3 This is a schematic diagram of the structure of Example 2.

[0032] Figure 4 for Figure 3 A magnified view of a portion of the image.

[0033] Figure 5 This is a schematic diagram comparing the residual stress distribution of the glass body in the finite element model between the traditional welded structure and the welded structure of the present invention.

[0034] Figure 6 This is a schematic diagram of the structure of a hermetically sealed welded rectangular connector in traditional packaging.

[0035] Reference numerals: 1. Rectangular connector; 2. Cavity body; 3. Solder ring placement groove; 4. Positioning boss; 5. Annular groove. Detailed Implementation

[0036] To make the technical problems, technical solutions, and technical effects of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0037] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0038] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0039] In the description of the embodiments of the present invention, it should be noted that the terms "inner", "outer", "upper", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the present invention.

[0040] This invention provides a stress relief cavity opening structure for hermetically sealed mounting of a rectangular connector, comprising a cavity body 2, wherein at least one mounting hole for mounting a rectangular connector 1 is provided on one side wall of the cavity body 2. The rectangular connector 1 includes a metal shell, a glass body disposed at one end of the metal shell, and a pin inserted into the glass body. A welding area is provided in the mounting hole along the wall thickness direction of the cavity body 2, which is welded to the end of the metal shell away from the glass body. The metal shell corresponding to the glass body radially is a stress relief area. A limiting structure for limiting the displacement of the metal shell is provided in the mounting hole or the cavity body 2. A welding ring placement groove 3 for placing a welding ring is provided in the mounting hole on the side away from the glass body.

[0041] In one embodiment, after the rectangular connector 1 is installed into the mounting hole, the metal shell portion corresponding to the glass body extends out of the mounting hole and is located inside the cavity body 2. This portion is a stress relief area, which is a non-welding area.

[0042] In one embodiment, the coefficient of thermal expansion of the metal shell material of the rectangular connector 1 is α1, the coefficient of thermal expansion of the cavity body 2 material is α2, and the relative compatibility of the coefficients of thermal expansion is Δα=|α1-α2|.

[0043] When the metal shell of the rectangular connector 1 is welded to the cavity body 2 under low thermal mismatch conditions, i.e. 5ppm / ℃≤Δα≤15ppm / ℃; the thermal deformation difference is moderate and the stress level is not high, so stress release and weld strength need to be taken into account. The length of the non-welded area is T, the glass body length of the rectangular connector 1 is t, and the size constraint of the non-welded area is T≥t, which satisfies the basic stress isolation requirements. Under the premise of ensuring airtightness, the welding width of the welding area is W, the minimum length of the airtight weld is W0, and the size constraint of the welding area is W≥W0, which meets the basic airtightness requirements.

[0044] In one embodiment, the limiting structure is a positioning boss 4 located at the bottom of the cavity body 2.

[0045] In one embodiment, after the rectangular connector 1 is installed into the mounting hole, the metal shell is located inside the mounting hole. An inwardly recessed annular groove 5 is provided on the side of the mounting hole corresponding to the glass body. There is a gap between the metal shell area corresponding to the glass body and the annular groove 5. The metal shell area corresponding to the glass body is a stress relief area, which is a non-welding area. The remaining areas of the metal shell are welding areas.

[0046] In one embodiment, the coefficient of thermal expansion of the metal shell material of the rectangular connector 1 is α1, the coefficient of thermal expansion of the cavity body 2 material is α2, and the relative compatibility of the coefficients of thermal expansion is Δα=|α1-α2|.

[0047] When the metal shell of the rectangular connector 1 is welded to the cavity body 2 under high thermal mismatch conditions, i.e., Δα≥15ppm / ℃, the thermal deformation difference is large and the stress level is high, so it is necessary to strengthen the stress release effect.

[0048] When the connector and cavity are soldered under high thermal mismatch (Δα≥15ppm / ℃), the thermal deformation difference is large and the stress level is high, so it is necessary to strengthen the stress release effect. The length of the non-welded area is T, the length of the glass body of the rectangular connector 1 is t, and the size constraint of the non-welded area is T≥1.25t, which meets the basic stress isolation requirements, ensures that the glass body is entirely within the non-welded area, and avoids edge stress penetration. In one embodiment, under the premise of ensuring airtightness, the welding width of the welding area is W, the minimum length of the airtight weld is W0, and the size constraint of the welding area is W≥1.2W0, so that the weld still has sufficient load-bearing area and airtight reliability under high stress.

[0049] In one embodiment, the metal casing is made of Kovar alloy or stainless steel.

[0050] In one embodiment, the cavity body 2 is made of aluminum alloy, silicon-aluminum alloy, or magnesium alloy.

[0051] In one embodiment, the cavity body 2 is provided with a plurality of mounting holes, each mounting hole being engaged with a corresponding rectangular connector 1.

[0052] Example 1 like Figure 1 and Figure 2 As shown, this embodiment provides a stress relief cavity opening structure for hermetically sealed mounting of a rectangular connector, including a cavity body 2. At least one mounting hole for mounting a rectangular connector 1 is provided on one side wall of the cavity body 2. The rectangular connector 1 includes a metal shell, a glass body disposed at one end of the metal shell, and a pin inserted into the glass body. A welding area is provided in the mounting hole along the wall thickness direction of the cavity body 2, which is welded to the end of the metal shell away from the glass body. The metal shell corresponding to the glass body radially is a stress relief area. A limiting structure for limiting the displacement of the metal shell is provided in the mounting hole or the cavity body 2. A welding ring placement groove 3 for placing a welding ring is provided in the mounting hole on the side away from the glass body.

[0053] After the rectangular connector 1 is installed into the mounting hole, the metal shell portion corresponding to the glass body extends out of the mounting hole and is located inside the cavity body 2. This portion is the stress relief area, which is a non-welded area.

[0054] The soldering area is only retained in the non-glass body area of ​​rectangular connector 1.

[0055] The connector shell is made of Kovar alloy with a coefficient of thermal expansion of 23ppm / ℃; the cavity body 2 is made of silicon-aluminum alloy with a coefficient of thermal expansion of 11ppm / ℃, and the relative compatibility of the coefficient of thermal expansion is Δα=12ppm / ℃.

[0056] The connector and cavity body 2 are welded under low thermal mismatch conditions, with moderate thermal deformation differences and low stress levels. Stress release and weld strength must be considered simultaneously. The length of the non-welded area is T, and the glass body length t of the rectangular connector 1 is 3mm. The dimensional constraint of the non-welded area is T≥t, i.e., T≥3mm, which meets the basic stress isolation requirements.

[0057] While ensuring airtightness, optimize the welding area. The length of the welding area is W, and the minimum length of the airtight weld, W0, is 1.0 mm. W ≥ W0, that is, W ≥ 1.0 mm.

[0058] To achieve precise positioning of the welding ring and prevent welding misalignment, a welding ring placement groove 3 is provided on the outside of the mounting hole.

[0059] In order to achieve axial positioning of the connector and reduce welding deviation, a positioning boss 4 that mates with the rectangular connector 1 is provided at the bottom of the cavity.

[0060] The rectangular connector 1 is positioned within the mounting hole of the cavity body 2 using the positioning boss 4, and a solder ring is placed in the solder ring placement groove 3. The rectangular connector 1 and the cavity body 2 are hermetically sealed using vacuum reflow soldering. This packaging structure has passed a temperature shock test under the following conditions: low temperature -65℃, high temperature 150℃, holding time 30 min, transition time not exceeding 5 min, and 200 temperature shock cycles. The leak rate of the tested product meets the packaging leak rate requirements specified in GJB548C-2021 Method 1014.3.

[0061] Example 2 like Figure 3 and Figure 4 As shown, this embodiment provides a stress relief cavity opening structure suitable for hermetic assembly of a rectangular connector 1. It is mainly suitable for welding a rectangular connector 1 with a boss to a cavity body 2. The specific structure is as follows: It includes a cavity body 2 and a mounting hole located on the side of the cavity body 2. The inner wall profile of the mounting hole has a variable cross-section feature in the thickness direction. Specifically, the mounting hole has a circumferential continuous annular groove 5 in the axial region corresponding to the glass body, forming an annular groove 5 type stress relief structure.

[0062] When the rectangular connector 1 is inserted into the mounting hole, a non-welded isolation area is formed between the outer area of ​​the glass body and the cavity; the soldering area is only retained in the area of ​​the connector that is not in the glass body.

[0063] The connector shell is made of Kovar alloy with a coefficient of thermal expansion of 23ppm / ℃; the cavity body 2 is made of 6063 aluminum alloy with a coefficient of thermal expansion of 5.1ppm / ℃, and the relative compatibility of the coefficient of thermal expansion is Δα=17.9ppm / ℃.

[0064] The rectangular connector 1 and the cavity body 2 are welded under conditions of high thermal mismatch, resulting in significant differences in thermal deformation and high stress levels, necessitating enhanced stress relief. The length of the non-welded area is T, and the glass body length of the rectangular connector 1 is t, which is 2.7 mm. The dimensional constraint for the non-welded area is T ≥ 1.25t, i.e., T ≥ 3.375 mm, ensuring that the entire glass body is within the non-welded area to prevent edge stress penetration.

[0065] To ensure that the weld still has sufficient load-bearing area and airtight reliability under high stress, the length of the welding area is W, the minimum length of the airtight weld W0 is 1.0 mm, W≥1.2W0, that is, W≥1.2 mm.

[0066] To achieve precise positioning of the welding ring and prevent welding misalignment, a welding ring placement groove 3 is provided on the outside of the mounting hole.

[0067] The rectangular connector 1 is positioned within the cavity mounting hole via a top boss on its housing, and a solder ring is placed in the solder ring placement slot 3. Vacuum reflow soldering is used to achieve a hermetic seal between the two components. This packaging structure passed a temperature shock test under the following conditions: low temperature -65℃, high temperature 150℃, holding time 30 min, transition time not exceeding 5 min, and 200 temperature shock cycles. The leak rate of the tested product met the packaging leak rate requirements specified in GJB548C-2021 Method 1014.3.

[0068] Example 3 This embodiment constructs two sets of finite element models of the welded structure between the aluminum alloy cavity body 2 and the rectangular connector 1. The opening methods of the cavity body 2 are the traditional packaging structure and the structure of Embodiment 1, respectively. During the simulation process, the same cooling conditions, boundary conditions, and material parameters are set to ensure the comparability of the simulation results.

[0069] Comparing the residual stress of the vitreous body simulated by the two sets of models, such as Figure 5 As shown, the maximum residual stress of the glass in the traditional packaging structure model is 205 MPa, and stress concentration occurs at the interface with the insert. In the structure of Example 1, the maximum residual stress of the glass is 144 MPa, which is 29.76% lower than that of the traditional packaging structure, and the stress concentration phenomenon on the glass is alleviated.

Claims

1. A stress relief cavity opening structure for hermetically sealed mounting of a rectangular connector, comprising a cavity body, wherein at least one mounting hole for mounting a rectangular connector is provided on one side wall of the cavity body, the rectangular connector comprising a metal shell, a glass body disposed at one end of the metal shell, and a pin inserted into the glass body, characterized in that, A welding area is provided in the mounting hole along the wall thickness direction of the cavity body, which is welded to the end of the metal shell away from the glass body. The metal shell corresponding to the glass body in the radial direction is a stress relief area, which is a non-welding area. A limiting structure for limiting the displacement of the metal shell is provided in the mounting hole or the cavity body. A welding ring placement groove for placing a welding ring is provided in the mounting hole on the side away from the glass body.

2. The stress relief cavity opening structure for hermetic assembly of a rectangular connector according to claim 1, characterized in that, After the rectangular connector is installed into the mounting hole, the metal shell portion corresponding to the glass body extends out of the mounting hole and is located inside the cavity body. This portion is a stress relief area, which is a non-welding area.

3. The stress relief cavity opening structure for hermetic assembly of a rectangular connector according to claim 1, characterized in that, After the rectangular connector is installed into the mounting hole, the metal shell is located inside the mounting hole. An inwardly recessed annular groove is provided on the side of the mounting hole corresponding to the glass body. There is a gap between the metal shell area corresponding to the glass body and the annular groove. The metal shell area corresponding to the glass body is a stress relief area, which is a non-welding area. The remaining areas of the metal shell are welding areas.

4. A stress relief cavity opening structure for hermetic sealing of a rectangular connector according to any one of claims 1 to 3, characterized in that, The coefficient of thermal expansion of the metal shell material of the rectangular connector is α1, and the coefficient of thermal expansion of the cavity body material is α2. The relative compatibility of the coefficients of thermal expansion is... α = |α1 - α2|; When the metal shell of the rectangular connector is welded to the cavity body under low thermal mismatch conditions, i.e., 5ppm / ℃≤ When α ≤ 15 ppm / ℃; The length of the non-welded area is T, the length of the glass body of the rectangular connector is t, and the size constraint condition of the non-welded area is T≥t, which satisfies the basic stress isolation requirements. Under the premise of ensuring airtightness, the welding width of the welding area is W, the minimum length of the airtight weld is W0, and the size constraint of the welding area is W≥W0, which meets the basic airtightness requirements.

5. The stress relief cavity opening structure for hermetic assembly of a rectangular connector according to claim 2, characterized in that, The limiting structure is a positioning boss located at the bottom of the cavity body.

6. A stress relief cavity opening structure for hermetic mounting of a rectangular connector according to any one of claims 1 to 3, characterized in that, The coefficient of thermal expansion of the metal shell material of the rectangular connector is α1, and the coefficient of thermal expansion of the cavity body material is α2. The relative compatibility of the coefficients of thermal expansion is... α = |α1 - α2|; When the metal shell of the rectangular connector is welded to the cavity body under high-temperature mismatch, i.e. When α≥15ppm / ℃, there are large differences in thermal deformation and high stress levels, requiring enhanced stress release effects. When the connector and cavity are soldered under high-temperature mismatch conditions; The length of the non-welded area is T, the length of the glass body of the rectangular connector is t, and the size constraint of the non-welded area is T≥1.25t, which satisfies the basic stress isolation requirements.

7. The stress relief cavity opening structure for hermetic assembly of a rectangular connector according to claim 6, characterized in that, Under the premise of ensuring airtightness, the welding width of the welding area is W, the minimum length of the airtight weld is W0, and the size constraint of the welding area is W≥1.2W0.

8. The stress relief cavity opening structure for hermetic assembly of a rectangular connector according to claim 1, characterized in that, The metal casing is made of Kovar alloy or stainless steel.

9. The stress relief cavity opening structure for hermetic assembly of a rectangular connector according to claim 1, characterized in that, The cavity body is made of aluminum alloy, silicon-aluminum alloy or magnesium alloy.

10. The stress relief cavity opening structure for hermetic sealing of a rectangular connector according to claim 1, characterized in that, The cavity body is provided with multiple mounting holes, each of which mates with the corresponding rectangular connector.

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