Method for manufacturing display panel, display panel and display device

Abstract

The application discloses a display panel preparation method, a display panel and a display device. The display panel comprises a substrate, an isolation structure, a light-emitting device layer and a first encapsulation layer. The light-emitting device layer comprises first light-emitting units and second light-emitting units with different light-emitting colors. The first encapsulation layer comprises first encapsulation units and second encapsulation units. The first encapsulation units comprise first covering parts and first extension parts. The first covering parts are located on the side of the first light-emitting units away from the substrate. The first extension parts are located on the side walls of the isolation structure, and the first extension parts are smooth. The second encapsulation units comprise second covering parts and second extension parts. The second covering parts are located on the side of the second light-emitting units away from the substrate. The second extension parts are located on the side walls of the isolation structure. The thickness of the first covering parts is greater than that of the second covering parts. The first light-emitting units of the application are not easily damaged by subsequent etching and other processes.

Description

Technical Field

[0001] This application belongs to the field of display technology, and in particular relates to a method for preparing a display panel, a display panel, and a display device. Background Technology

[0002] Organic light-emitting diode (OLED) and flat panel display devices based on light-emitting diode (LED) technologies are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body and wide range of applications, becoming the mainstream of display devices.

[0003] However, the reliability of current OLED display products needs to be improved. Summary of the Invention

[0004] The purpose of this application is to provide a method for manufacturing a display panel, a display panel, and a display device, which can improve the process reliability of the display panel.

[0005] This application provides a display panel, which includes a substrate, an isolation structure, a light-emitting device layer, and a first encapsulation layer. The isolation structure is disposed on one side of the substrate and forms an isolation opening. The light-emitting device layer includes a first light-emitting unit and a second light-emitting unit with different light-emitting colors. The orthographic projections of the first light-emitting unit and the second light-emitting unit on the substrate are respectively located within the orthographic projections of the isolation opening on the substrate. The first encapsulation layer includes a first encapsulation unit and a second encapsulation unit. The first encapsulation unit includes a first covering portion and a first extension portion. The first covering portion is located on the side of the first light-emitting unit away from the substrate, and the first extension portion is located on the sidewall of the isolation structure. The first extension portion is smooth. The second encapsulation unit includes a second covering portion and a second extension portion. The second covering portion is located on the side of the second light-emitting unit away from the substrate, and the second extension portion is located on the sidewall of the isolation structure. The thickness of the first covering portion is greater than the thickness of the second covering portion.

[0006] In some embodiments, the light-emitting device layer further includes a third light-emitting unit located within an isolation opening, wherein the light-emitting color of the third light-emitting unit is different from the light-emitting colors of the first light-emitting unit and the second light-emitting unit;

[0007] Preferably, the first encapsulation layer further includes a third encapsulation unit, which includes a third covering portion and a third extension portion. The third covering portion is located on the side of the third light-emitting unit away from the substrate, and the third extension portion is located on the sidewall of the isolation structure. The thickness of the second covering portion is greater than the thickness of the third covering portion.

[0008] In some embodiments, the second extension is smooth and the third extension is concave.

[0009] In some embodiments, the third extension is smooth.

[0010] In some embodiments, the first light-emitting unit emits blue light, the second light-emitting unit emits green light, and the third light-emitting unit emits red light; or, the first light-emitting unit emits blue light, the second light-emitting unit emits red light, and the third light-emitting unit emits green light.

[0011] In some embodiments, the second extension is recessed.

[0012] In some embodiments, the first packaging unit includes a first apex portion located on the side of the isolation structure away from the substrate; the second packaging unit includes a second apex portion located on the side of the isolation structure away from the substrate; the thickness of the first apex portion is greater than the thickness of the second apex portion.

[0013] In some embodiments, the display panel further includes a second encapsulation layer disposed on the side of the first encapsulation layer away from the substrate;

[0014] Preferably, the first encapsulation layer comprises an inorganic material, and the second encapsulation layer comprises an organic material;

[0015] Preferably, the display panel further includes a third encapsulation layer, which is disposed on the side of the second encapsulation layer away from the substrate;

[0016] Preferably, the third encapsulation layer comprises an inorganic material.

[0017] In some embodiments, the first packaging unit includes a first apex corner located on the side of the isolation structure away from the substrate, and a first gap is formed between the first apex corner and the top surface of the isolation structure; the second packaging unit includes a second apex corner located on the side of the isolation structure away from the substrate, and a second gap is formed between the second apex corner and the top surface of the isolation structure.

[0018] Preferably, a portion of the second encapsulation layer fills the first gap, a portion of the second encapsulation layer fills the second gap, and the thickness of the portion of the second encapsulation layer filling the first gap is less than the thickness of the portion of the second encapsulation layer filling the second gap.

[0019] In some embodiments, the thickness of the first light-emitting unit is less than the thickness of the second light-emitting unit.

[0020] In some embodiments, the thickness of the first extension is greater than the thickness of the second extension.

[0021] In some embodiments, the isolation structure includes a first isolation portion and a second isolation portion arranged sequentially along a direction away from the substrate, wherein the side of the first isolation portion facing away from the substrate is located within the orthogonal projection of the second isolation portion on the substrate.

[0022] In some embodiments, the first isolation portion includes a first sub-portion and a second sub-portion disposed sequentially along a direction away from the substrate, wherein the orthographic projection of the second sub-portion onto the substrate is located within the orthographic projection of the second isolation portion onto the substrate.

[0023] The first sub-part's orthographic projection onto the substrate is located within the second isolation part's orthographic projection onto the substrate.

[0024] In some embodiments, the display panel further includes a pixel definition layer disposed on a substrate, an isolation structure located on the side of the pixel definition layer facing away from the substrate, the pixel definition layer having a pixel opening, and the isolation opening communicating with the pixel opening.

[0025] Secondly, embodiments of this application also provide a method for manufacturing a display panel, comprising the following steps:

[0026] An isolation structure with multiple isolation openings is fabricated on a substrate;

[0027] A first light-emitting unit is fabricated within an isolation opening; wherein the orthographic projection of the first light-emitting unit on the substrate is located within the orthographic projection of the isolation opening on the substrate;

[0028] A first encapsulation unit is provided on the side of the first light-emitting unit away from the substrate; wherein, the first encapsulation unit includes a first covering part and a first extension part, the first covering part is located on the side of the first light-emitting unit away from the substrate, the first extension part is located on the side wall of the isolation structure, and the first extension part is smooth.

[0029] A second light-emitting unit is fabricated within an isolation opening; wherein the orthographic projection of the second light-emitting unit on the substrate is located within the orthographic projection of the isolation opening on the substrate;

[0030] A second packaging unit is prepared on the side of the second light-emitting unit away from the substrate; wherein the second packaging unit includes a second covering portion and a second extension portion, the second covering portion is located on the side of the first light-emitting unit away from the substrate, and the first extension portion is located on the sidewall of the isolation structure; the thickness of the first covering portion is greater than the thickness of the second covering portion.

[0031] Thirdly, embodiments of this application also provide a display panel, including:

[0032] substrate;

[0033] An isolation structure is disposed on one side of the substrate and encloses an isolation opening;

[0034] The light-emitting device layer includes a first light-emitting unit and a second light-emitting unit with different light-emitting colors. The orthogonal projections of the first light-emitting unit and the second light-emitting unit on the substrate are respectively located within the orthogonal projection of the isolation opening on the substrate.

[0035] The first encapsulation layer includes a first encapsulation unit and a second encapsulation unit. The first encapsulation unit is located on the side of the first light-emitting unit away from the substrate, and the second encapsulation unit is located on the side of the first light-emitting unit away from the substrate. There is a first gap between the first encapsulation unit and the top surface of the isolation structure, and there is a second gap between the second encapsulation unit and the top surface of the isolation structure. The first gap is smaller than the second gap.

[0036] Fourthly, embodiments of this application also provide a display device, including the display panel of any of the above embodiments.

[0037] This application provides a display panel by first preparing a first light-emitting unit and a first encapsulation unit, and then preparing a second light-emitting unit and a second encapsulation unit. Since the first covering part is thicker and the first extension part is smooth and does not collapse or become concave, after the first light-emitting unit is prepared first, the first covering part and the first extension part can better protect the first light-emitting unit, and the first light-emitting unit is not easily damaged by subsequent etching processes. Attached Figure Description

[0038] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0039] Figure 1 A cross-sectional schematic diagram of a display panel provided in some embodiments of this application;

[0040] Figure 2 Top view of a display panel provided in some embodiments of this application;

[0041] Figure 3 This is a partial cross-sectional schematic diagram of a display panel provided in some embodiments of this application;

[0042] Figure 4 A cross-sectional schematic diagram of a display panel provided for other embodiments of this application;

[0043] Figure 5 A cross-sectional schematic diagram of a display panel provided for some embodiments of this application;

[0044] Figure 6 A cross-sectional schematic diagram of a display panel provided in some embodiments of this application;

[0045] Figure 7 A cross-sectional schematic diagram of a display panel provided in some embodiments of this application;

[0046] Figure 8 A flowchart illustrating a method for fabricating a display panel according to some embodiments of this application.

[0047] Explanation of reference numerals in the attached figures:

[0048] 100. Display panel; 10. Substrate; 11. Substrate; 12. Array layer; 20. Isolation structure; 21. Isolation opening; 22. First isolation portion; 221. First sub-portion; 222. Second sub-portion; 23. Second isolation portion; 30a. First light-emitting unit; 30b. Second light-emitting unit; 30c. Third light-emitting unit; 31. First electrode; 32. Light-emitting layer; 33. Second electrode; 41. First encapsulation layer; 411. First encapsulation unit; 41 1a, First covering portion; 411b, First extension portion; 411c, First apex portion; 412, Second encapsulation unit; 412a, Second covering portion; 412b, Second extension portion; 412c, Second apex portion; 413, Third encapsulation unit; 413a, Third covering portion; 413b, Third extension portion; 42, Second encapsulation layer; 43, Third encapsulation layer; 50, Pixel definition layer; 51, Pixel opening; 61, First gap; 62, Second gap. Detailed Implementation

[0049] The embodiments of this application will be described in further detail below with reference to the accompanying drawings and examples. The detailed description of the following embodiments and the accompanying drawings are used to illustrate the principles of this application by way of example, but should not be used to limit the scope of this application, that is, this application is not limited to the described embodiments.

[0050] In the description of this application, it should be noted that, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationships, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," and "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. "Vertical" is not vertical in the strict sense, but within the allowable tolerance range. "Parallel" is not parallel in the strict sense, but within the allowable tolerance range.

[0051] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0052] The directional terms used in the following description refer to the directions shown in the figures and are not intended to limit the specific structure of this application. It should also be noted in the description of this application that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0053] In some display panels, the presence of an isolation structure eliminates the need for a precision mask during the deposition of the light-emitting layer. However, when fabricating light-emitting units of different colors, it is necessary to first deposit light-emitting units of a specific color across the entire surface of the display panel. Then, etching is performed on the isolation openings in the display panel used to set other colored light-emitting units to remove the light-emitting and encapsulating materials of these other colored light-emitting units. This process is repeated for different colored light-emitting units to form different colored light-emitting units. However, after the first colored light-emitting unit is fabricated, the corresponding encapsulation unit is generally thin, which can easily create a recess on the sidewall of the isolation structure, resulting in very little encapsulation material at this location. Consequently, the first colored light-emitting unit is easily damaged when subsequent colored light-emitting units are fabricated.

[0054] This application provides a display panel, which may be an organic light-emitting diode (OLED) display panel, or other types of display panels, such as micro light-emitting diode (Micro-LED) or quantum light-emitting diode (QLED) display panels.

[0055] Please refer to the following: Figures 1-3The first aspect of this application provides a display panel 100, which includes a substrate 10, an isolation structure 20, a light-emitting device layer, and a first encapsulation layer 41. The isolation structure 20 is disposed on one side of the substrate 10 and forms an isolation opening 21. The light-emitting device layer includes a first light-emitting unit 30a and a second light-emitting unit 30b with different light-emitting colors. The orthographic projections of the first light-emitting unit 30a and the second light-emitting unit 30b on the substrate 10 are respectively located within the orthographic projections of the isolation opening 21 on the substrate 10. The first encapsulation layer 41 includes a first encapsulation unit 411 and a second encapsulation unit 412. Unit 411 includes a first covering portion 411a and a first extension portion 411b. The first covering portion 411a is located on the side of the first light-emitting unit 30a away from the substrate 10, and the first extension portion 411b is located on the side wall of the isolation structure 20. The first extension portion 411b is smooth. The second encapsulation unit 412 includes a second covering portion 412a and a second extension portion 412b. The second covering portion 412a is located on the side of the second light-emitting unit 30b away from the substrate 10, and the second extension portion 412b is located on the side wall of the isolation structure 20. The thickness of the first covering portion 411a is greater than the thickness of the second covering portion 412a.

[0056] The substrate 10 includes a substrate 11 and an array layer 12 disposed on the substrate 11. The substrate 11 can be a rigid substrate made of materials such as glass or plastic, or a flexible substrate made of materials such as polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate, polyimide (PI), polycarbonate (PC), or cellulose acetate propionate (CAP). The array layer 12 contains a driving circuit for controlling the light emission of the light-emitting layer 32. The array layer 12 is generally composed of inorganic film layers such as a metal layer, a semiconductor layer (active layer), and an insulating layer. By patterning these inorganic film layers, a driving circuit for controlling the light emission of the light-emitting layer 32 can be formed. There are various ways to implement the specific circuit structure, which will not be elaborated here.

[0057] The display panel 100 may include a plurality of spaced-apart pixel units, each pixel unit including light-emitting units of different colors. For example, each pixel unit may include a first light-emitting unit 30a, a second light-emitting unit 30b, and a third light-emitting unit 30c arranged at intervals. Examples include blue, red, and green light-emitting units. Alternatively, each pixel unit may also have four or more light-emitting units, in addition to the aforementioned three colors, plus light-emitting units of other colors such as white. Each light-emitting unit includes a first electrode 31, a light-emitting layer 32, and a second electrode 33 stacked sequentially. The first electrode 31 is disposed on the substrate 10. The light-emitting layer 32 further includes a light-emitting material layer, a hole transport layer, and an electron transport layer. When the first electrode 31 and the second electrode 33 are energized, electrons and holes migrate from the electron transport layer and the hole transport layer to the light-emitting material layer, respectively, and meet in the light-emitting material layer to form excitons that excite the light-emitting molecules, thereby generating visible light for display purposes. One of the first electrode 31 and the second electrode 33 can serve as the anode of the light-emitting layer 32, and the other as the cathode of the light-emitting layer 32. In this embodiment, the first electrode 31 is used as the anode of the light-emitting layer 32 and the second electrode 33 is used as the cathode of the light-emitting layer 32 for illuminating purposes.

[0058] It should be noted that in some embodiments, the projection of the isolation structure 20 onto the substrate 10 in the top view of the display panel 100 is annular. The presence of the isolation structure 20 allows the light-emitting layers 32 of different light-emitting units to be separated during the fabrication of the display panel 100. Specifically, during the fabrication of the display panel 100, the isolation structure 20 is typically formed first, and then the light-emitting layers 32 are deposited directly without the aid of a precision mask. During this process, due to the presence of the isolation structure 20, some light-emitting material is deposited within the isolation opening 21, and some light-emitting material is deposited on the side of the isolation structure 20 facing away from the substrate 10. This results in discontinuous light-emitting material on different sides of the isolation structure 20 in the direction parallel to the plane of the substrate 10, achieving mutual separation of the light-emitting layers 32 of each light-emitting unit without the need for a precision mask. Since the deposition of the light-emitting layer 32 does not require a precision mask, costs are reduced, and the shadow effect of the light-emitting layer 32 deposited by the precision mask is avoided, which can reduce the spacing between the light-emitting units and thus improve the brightness of the display surface. Furthermore, since the electron transport layer, electron injection layer, hole transport layer, and hole injection layer of the light-emitting layer 32 are all isolated by the isolation structure 20, crosstalk between the light-emitting units can be prevented, thus improving the display effect of the display panel 100. The relevant content of the isolation structure 20 is described in patents with application numbers PCT / CN2023 / 134518, 202310771124.9, 202311499823.9, and 202311616249.0, and is provided for reference.

[0059] The first encapsulation layer 41 is disposed on the side of the second electrode 33 facing away from the substrate 10, and extends to the isolation structure 20. The first encapsulation layer 41 can protect each light-emitting unit from the influence of the external environment (such as air and water), prevent air and moisture from penetrating into the display panel 100, and extend the service life and stability of the light-emitting unit. The first encapsulation layer 41 can also prevent impurities and harmful substances from entering the display panel 100, thereby ensuring the performance and quality of the display panel 100.

[0060] The first encapsulation layer 41 includes a first encapsulation unit 411 and a second encapsulation unit 412. The first encapsulation unit 411 includes a first covering portion 411a and a first extension portion 411b. The first covering portion 411a is located on the side of the first light-emitting unit 30a away from the substrate 10, and the first extension portion 411b is located on the sidewall of the isolation structure 20. The first extension portion 411b is smooth. The second encapsulation unit 412 includes a second covering portion 412a and a second extension portion 412b. The second covering portion 412a is located on the side of the second light-emitting unit 30b away from the substrate 10, and the second extension portion 412b is located on the sidewall of the isolation structure 20. The thickness of the first covering portion 411a is greater than the thickness of the second covering portion 412a.

[0061] The first encapsulation layer 41 includes a first encapsulation unit 411 and a second encapsulation unit 412. The first encapsulation unit 411 includes a first covering portion 411a and a first extension portion 411b. The first covering portion 411a is located on the side of the first light-emitting unit 30a away from the substrate 10, that is, the first covering portion 411a covers the first light-emitting unit 30a. The first covering portion 411a is connected to the first extension portion 411b, which is located on the sidewall of the isolation structure 20 and contacts the sidewall of the isolation structure 20. The second encapsulation unit 412 includes a second covering portion 412a and a second extension portion 412b. The second covering portion 412a is located on the side of the second light-emitting unit 30b away from the substrate 10, that is, the second covering portion 412a covers the second light-emitting unit 30b. The second extension portion 412b is located on the sidewall of the isolation structure 20 and contacts the sidewall of the isolation structure 20.

[0062] Taking a blue first light-emitting unit 30a and a red second light-emitting unit 30b as an example: First, a blue light-emitting unit and a first encapsulation layer 41 are deposited across the entire surface of the display panel 100. Then, the isolation openings 21 of the other color light-emitting units are etched to obtain the first light-emitting unit 30a and the first encapsulation unit 411, removing the light-emitting material and encapsulation material of the other color light-emitting units. The above operation is then repeated for the second light-emitting unit 30b to form the second light-emitting unit 30b and the second encapsulation unit 412.

[0063] Since the thickness of the first covering portion 411a is greater than the thickness of the second covering portion 412a, the first light-emitting unit 30a is less likely to be damaged in the subsequent etching process. Furthermore, the first extension portion 411b is smooth, meaning it will not collapse to form a groove, thus preventing the etching process from damaging the first extension portion 411b and preventing etching solution from entering the first light-emitting unit 30a from the side and damaging it.

[0064] This application provides a display panel 100. By first preparing a first light-emitting unit 30a and a first encapsulation unit 411, and then preparing a second light-emitting unit 30b and a second encapsulation unit 412, the first covering portion 411a has a large thickness and the first extension portion 411b is smooth and does not collapse or become concave. After the first light-emitting unit 30a is prepared first, the first covering portion 411a and the first extension portion 411b can better protect the first light-emitting unit 30a, and the first light-emitting unit 30a is not easily damaged by subsequent etching processes.

[0065] In some embodiments, the light-emitting device layer further includes a third light-emitting unit 30c located within the isolation opening 21, the light emission color of the third light-emitting unit 30c being different from the light emission colors of the first light-emitting unit 30a and the second light-emitting unit 30b.

[0066] In the display panel 100, color presentation relies on combinations of light-emitting units with different emitting colors. When the light-emitting device layer includes a third light-emitting unit 30c located within the isolation opening 21, in addition to the first and second light-emitting units 30a and 30b, and its emitting color is different from the former two, this greatly enriches the color expression capability of the display panel 100. Taking the common (red, green, blue) three-primary-color display principle as an example, if the first light-emitting unit 30a is blue, the second light-emitting unit 30b is red, and the third light-emitting unit 30c is green, these three color light-emitting units can be mixed to produce almost all colors that the human eye can recognize through different brightness combinations.

[0067] Preferably, the first encapsulation layer 41 further includes a third encapsulation unit 413, which includes a third covering portion 413a and a third extension portion 413b. The third covering portion 413a is located on the side of the third light-emitting unit 30c away from the substrate 10, and the third extension portion 413b is located on the sidewall of the isolation structure 20. The thickness of the second covering portion 412a is greater than the thickness of the third covering portion 413a.

[0068] First, a first light-emitting unit 30a and a first encapsulation unit 411 are prepared; then, a second light-emitting unit 30b and a second encapsulation unit 412 are prepared; finally, a third light-emitting unit 30c and a third encapsulation unit 413 are prepared.

[0069] When preparing the third light-emitting unit 30c and the third packaging unit 413, since the thickness of the second covering part 412a is greater than that of the third covering part 413a, that is, the thickness of the second covering part 412a is larger, the second covering part 412a will not be damaged by the etching process, and the etching process will not affect the second light-emitting unit 30b.

[0070] like Figure 4 As shown, in some embodiments, the second extension 412b is smooth and the third extension 413b is concave.

[0071] The second extension 412b is smooth, meaning it will not collapse to form a groove and will be recessed. When preparing the third light-emitting unit 30c and the third packaging unit 413, it can prevent the etching process from damaging the second extension 412b and prevent the etching solution from entering the second light-emitting unit 30b from the side and damaging the second light-emitting unit 30b.

[0072] like Figure 5 As shown, in some embodiments, the third extension 413b is smooth.

[0073] When the third extension 413b of the third packaging unit 413 is also set to a smooth shape, it can prevent other subsequent manufacturing processes from damaging the third extension 413b.

[0074] In some embodiments, the first light-emitting unit 30a emits blue light, the second light-emitting unit 30b emits green or red light, and the third light-emitting unit 30c emits red light. Alternatively, the first light-emitting unit 30a emits blue light, the second light-emitting unit 30b emits red light, and the third light-emitting unit 30c emits green light.

[0075] Since the first light-emitting unit 30a is blue and has the thinnest thickness, the first encapsulation unit 411 can be made the thickest. Since the third light-emitting unit 30c emits red light, the first encapsulation unit 411 can be made the thinnest. This ensures that the first light-emitting unit 30a and the second light-emitting unit 30b are adequately protected while also saving materials.

[0076] like Figure 1 As shown, in some embodiments, the second extension 412b is recessed.

[0077] Since the second light-emitting unit 30b and the second packaging unit 412 are less affected by the etching process than the first light-emitting unit 30a after they are fabricated, the thickness of the second packaging unit 412 can also be thinner. When the packaging material is deposited on the side wall of the isolation structure 20, it will collapse to form a groove, that is, the second extension 412b is concave, which can reduce the cost of using the packaging material.

[0078] In some embodiments, the first packaging unit 411 includes a first apex portion 411c, which is located on the side of the isolation structure 20 away from the substrate 10; the second packaging unit 412 includes a second apex portion 412c, which is located on the side of the isolation structure 20 away from the substrate 10; the thickness of the first apex portion 411c is greater than the thickness of the second apex portion 412c.

[0079] Since the material of the first light-emitting unit 30a is also deposited on the top surface of the isolation structure 20 during the fabrication of the first light-emitting unit 30a, a first apex portion 411c of the first encapsulation unit 411, left after etching, is formed on the isolation structure 20 in order to remove the material of the first light-emitting unit 30a on the isolation structure 20 by etching. Similarly, a second apex portion 412c of the second encapsulation unit 412, left after etching, is formed on the isolation structure 20 in order to remove the material of the second light-emitting unit 30b on the isolation structure 20 by etching.

[0080] When the first packaging unit 411 is fabricated, if the thickness is relatively large, the first extension 411b will not collapse into a concave shape, and the thickness of the first apex 411c will also be relatively large, greater than the thickness of the second apex 412c, which can further reduce the impact of subsequent etching processes on the first light-emitting unit 30a.

[0081] like Figure 6 As shown, in some embodiments, the display panel 100 further includes a second encapsulation layer 42, which is disposed on the side of the first encapsulation layer 41 away from the substrate 10.

[0082] The second encapsulation layer 42 protects the second light-emitting unit 30b from the influence of the external environment (such as air and water), preventing air and moisture from penetrating into the display panel 100 and extending the lifespan and stability of the light-emitting unit. The second encapsulation layer 42 also prevents impurities and harmful substances from entering the display panel 100, thereby ensuring the performance and quality of the display panel 100.

[0083] Preferably, the first encapsulation layer 41 comprises an inorganic material, and the second encapsulation layer 42 comprises an organic material.

[0084] The first encapsulation layer 41 may include materials such as silicon oxide, silicon nitride, or silicon oxynitride, which can provide good mechanical support and encapsulation protection to prevent the display panel 100 from being affected by the environment. At the same time, the first encapsulation layer 41 formed of inorganic materials can also effectively isolate harmful substances such as moisture and oxygen from entering the interior of the display panel 100, thereby improving the service life and stability of the display panel 100.

[0085] The second encapsulation layer 42 is made of organic materials, which have unique flexibility and good adhesion. Compared with inorganic materials, organic materials can better adapt to the slight deformations that the display panel 100 may undergo in different environments, and will not crack due to bending or thermal expansion and contraction of the panel.

[0086] like Figure 7 As shown, preferably, the display panel 100 further includes a third encapsulation layer 43, which is disposed on the side of the second encapsulation layer 42 away from the substrate 10, further improving the encapsulation effect of the display panel 100.

[0087] Preferably, the third encapsulation layer 43 comprises an inorganic material.

[0088] The third encapsulation layer 43 may also include materials such as silicon oxide, silicon nitride, or silicon oxynitride, which can provide good mechanical support and encapsulation protection to prevent the display panel 100 from being affected by the environment. At the same time, the first encapsulation layer 41 formed by inorganic materials can also effectively isolate harmful substances such as moisture and oxygen from entering the interior of the display panel 100, thereby improving the service life and stability of the display panel 100.

[0089] The embodiments of this application utilize a combination of inorganic encapsulation film, organic encapsulation film, and inorganic encapsulation film to better protect each light-emitting unit.

[0090] In some embodiments, the first packaging unit 411 includes a first apex portion 411c, which is located on the side of the isolation structure 20 away from the substrate 10, and a first gap 61 is formed between the first apex portion 411c and the top surface of the isolation structure 20; the second packaging unit 412 includes a second apex portion 412c, which is located on the side of the isolation structure 20 away from the substrate 10, and a second gap 62 is formed between the second apex portion 412c and the top surface of the isolation structure 20.

[0091] Since the material of the first light-emitting unit 30a is also deposited on the top surface of the isolation structure 20 during the fabrication of the first light-emitting unit 30a, a first apex portion 411c of the first encapsulation unit 411, left after etching, is formed on the isolation structure 20 in order to remove the material of the first light-emitting unit 30a on the isolation structure 20 by etching. Similarly, a second apex portion 412c of the second encapsulation unit 412, left after etching, is formed on the isolation structure 20 in order to remove the material of the second light-emitting unit 30b on the isolation structure 20 by etching.

[0092] Since removing the light-emitting material on the isolation structure 20 requires opening a via in the encapsulation material film layer on the isolation structure 20, and then removing the light-emitting material through the via, the first apex 411c and the isolation structure 20 have a first gap 61 and the second apex 412c and the isolation structure 20 have a second gap 62, which reduces the influence of the light-emitting material on the isolation structure 20 on the first light-emitting unit 30a and the second light-emitting unit 30b.

[0093] Preferably, a portion of the second encapsulation layer 42 fills the first gap 61, a portion of the second encapsulation layer 42 fills the second gap 62, and the thickness of the portion of the second encapsulation layer 42 filling the first gap 61 is less than the thickness of the portion of the second encapsulation layer 42 filling the second gap 62.

[0094] After the light-emitting material on the isolation structure 20 is removed, a second encapsulation layer 42 is formed on the first encapsulation layer 41. The material of the second encapsulation layer 42 overflows into the first gap 61 and the second gap 62 to fill them. Since the thickness of the first light-emitting unit 30a is less than the thickness of the second light-emitting unit 30b, that is, the thickness of the material film layer of the first light-emitting unit 30a deposited on the isolation structure 20 is also less than the thickness of the material film layer of the second light-emitting unit 30b deposited on the isolation structure 20, the thickness of the material of the second encapsulation layer 42 filling the first gap 61 is less than the thickness of the material of the second encapsulation layer 42 filling the second gap 62.

[0095] In some embodiments, the thickness of the first light-emitting unit 30a is less than the thickness of the second light-emitting unit 30b.

[0096] The first light-emitting unit 30a can be a blue light-emitting unit, and the second light-emitting unit 30b can be a red or green light-emitting unit. Blue light has a relatively short wavelength, approximately 450-480 nanometers in the visible light range. According to the photon energy formula, the shorter the wavelength, the higher the photon energy. Therefore, a blue light-emitting unit requires higher energy to generate photons. A thinner structure facilitates efficient recombination of electrons and holes over a shorter distance, thereby more effectively converting electrical energy into high-energy blue light, reducing energy loss and heat generation, and improving luminous efficiency.

[0097] Red light has a relatively long wavelength, approximately 620-750 nanometers, and its photon energy is relatively low. To achieve sufficient intensity and brightness of red light emission, more luminescent material is needed to increase the recombination opportunities between electrons and holes, thereby generating a sufficient number of low-energy red photons. A thicker structure can provide more space to accommodate the luminescent material, allowing electrons and holes more opportunities to recombine within the material, ensuring sufficient red light output. The thickness of the green luminescent unit falls between that of the blue and red luminescent units.

[0098] First, a first light-emitting unit 30a with the smallest thickness is prepared and protected by the thickest first encapsulation unit 411. Then, a second light-emitting unit 30b with an even smaller thickness is prepared and paired with a thinner second encapsulation unit 412. This can make the final film thickness more consistent and reduce the impact of subsequent etching on the first light-emitting unit 30a.

[0099] In some embodiments, the thickness of the first extension 411b is greater than the thickness of the second extension 412b.

[0100] When the thickness of the first extension 411b is large, the first extension 411b will not collapse to form a groove and will be recessed, which can prevent the etching process from damaging the first extension 411b and prevent the etching liquid from entering the first light-emitting unit 30a from the side and damaging the first light-emitting unit 30a.

[0101] like Figure 3 As shown in some embodiments, the isolation structure 20 includes a first isolation portion 22 and a second isolation portion 23 arranged sequentially along a direction away from the substrate 10. The side of the first isolation portion 22 facing away from the substrate 10 is located within the orthogonal projection of the second isolation portion 23 on the substrate 10.

[0102] The edge of the second isolation portion 23 extends circumferentially along the first isolation portion 22, and the second electrode 33 is separated by the first isolation portion 22. The first isolation portion 22 is relatively high, and the second isolation portion 23 is relatively wide. The orthographic projection of the first isolation portion 22 onto the substrate 10 is located within the orthographic projection of the second isolation portion 23 onto the substrate 10. In this embodiment, by using a relatively high first isolation portion 22 and a relatively wide second isolation portion 23, compared to an embodiment where the entire isolation structure 20 is set as an inverted trapezoidal structure, the first isolation portion 22 can isolate the second electrode 33 more deeply, while the upper second isolation portion 23 can play a better role in reflection and refraction, resulting in a more vivid and bright display effect.

[0103] The first electrode 31 is electrically connected to the first isolation part 22, and the adjacent second electrode 33 can be electrically connected through the first isolation part 22.

[0104] In some embodiments, the first isolation portion 22 includes a first sub-portion 221 and a second sub-portion 222 arranged sequentially along a direction away from the substrate 10, and the orthographic projection of the second sub-portion 222 onto the substrate 10 is located within the orthographic projection of the second isolation portion 23 onto the substrate 10.

[0105] The first electrode 31 covers the edge of the first sub-part 221, and the second electrode 33 overlaps with the sidewall of the second sub-part 222.

[0106] The materials of the first sub-part 221, the second sub-part 222, and the second isolation part 23 can be different. For example, the first sub-part 221 can be made of molybdenum, the second sub-part 222 can be made of aluminum or copper, and the second isolation part 23 can be made of titanium. The second electrode 33 covers the edge of the first sub-part 221 and is therefore electrically connected to the first sub-part 221. At the same time, the second electrode 33 also overlaps with the sidewall of the second sub-part 222. By providing the first sub-part 221, the electrical connection between the second electrode 33 and the isolation structure 20 can be ensured.

[0107] The first sub-part 221 is projected onto the substrate 10 within the projection of the second isolation part 23 onto the substrate 10.

[0108] Along a direction parallel to the substrate 10, the edge of the second insulating portion 23 may protrude relative to the edge of the first sub-portion 221. Shortening the first sub-portion 221 provides more space for the light-emitting layer 32, thus improving the light-emitting effect.

[0109] like Figure 1 As shown, in some embodiments, the display panel 100 further includes a pixel definition layer 50 disposed on the substrate 10, an isolation structure 20 located on the side of the pixel definition layer 50 away from the substrate 10, the pixel definition layer 50 having a pixel opening 51, and the isolation opening 21 communicating with the pixel opening 51.

[0110] The isolation opening 21 is provided in a one-to-one correspondence with the pixel opening 51, and the orthographic projection of the pixel opening 51 on the substrate 10 is located within the orthographic projection of the isolation opening 21 on the substrate 10. That is to say, an isolation unit is provided between every two adjacent light-emitting layers 32 in the display panel 100, which can prevent mutual interference between adjacent light-emitting units.

[0111] Alternatively, the isolation opening 21 may be correspondingly arranged with at least two pixel openings 51, and the orthographic projections of the at least two pixel openings 51 on the substrate 10 are all located within the orthographic projections of the corresponding isolation opening 21 on the substrate 10. The isolation opening 21 defined by the isolation structure 20 is correspondingly arranged with at least two pixel openings 51, meaning that multiple spaced-apart light-emitting layers 32 are disposed within the isolation opening 21, and no isolation structure 20 is disposed between two adjacent light-emitting layers 32 within this portion of the isolation opening 21. This design allows the density of the isolation structure 20 to be flexibly adjusted according to usage requirements. The size of the isolation opening 21 defined by the isolation structure 20 is larger than the size of the pixel opening 51; this design prevents the isolation structure 20 from blocking the light emitted by the light-emitting layers 32 in the pixel opening 51.

[0112] Preferably, the pixel definition layer 50 includes inorganic materials. For example, inorganic materials such as zinc oxide, indium tin oxide, silicon dioxide, and silicon can be used. The small molecule substances remaining after the film formation process using organic materials are prone to generating impurities, which is reflected in the increased out gas emission value. Inorganic materials have more stable chemical properties. Therefore, the pixel definition layer 50 in this embodiment can improve the stability of the display panel 100.

[0113] like Figure 8 As shown, in a second aspect, embodiments of this application also provide a method for manufacturing a display panel 100, comprising the following steps:

[0114] S10. An isolation structure 20 with multiple isolation openings 21 is prepared on the substrate 10.

[0115] S20. A first light-emitting unit 30a is prepared within the isolation opening 21; wherein the orthographic projection of the first light-emitting unit 30a on the substrate 10 is located within the orthographic projection of the isolation opening 21 on the substrate 10.

[0116] S30. A first packaging unit 411 is provided on the side of the first light-emitting unit 30a away from the substrate 10. The first packaging unit 411 includes a first covering part 411a and a first extension part 411b. The first covering part 411a is located on the side of the first light-emitting unit 30a away from the substrate 10, and the first extension part 411b is located on the side wall of the isolation structure 20. The first extension part 411b is smooth.

[0117] S40. A second light-emitting unit 30b is prepared within the isolation opening 21; wherein the orthographic projection of the second light-emitting unit 30b on the substrate 10 is located within the orthographic projection of the isolation opening 21 on the substrate 10.

[0118] S50. A second packaging unit 412 is prepared on the side of the second light-emitting unit 30b away from the substrate 10. The second packaging unit 412 includes a second covering portion 412a and a second extension portion 412b. The second covering portion 412a is located on the side of the first light-emitting unit 30a away from the substrate 10, and the first extension portion 411b is located on the side wall of the isolation structure 20. The thickness of the first covering portion 411a is greater than the thickness of the second covering portion 412a.

[0119] Thirdly, this application embodiment also provides a display panel 100, including a substrate 10, an isolation structure 20, a light-emitting device layer, and a first encapsulation layer 41; the isolation structure 20 is disposed on one side of the substrate 10 and forms an isolation opening 21; the light-emitting device layer includes a first light-emitting unit 30a and a second light-emitting unit 30b with different light-emitting colors, and the orthographic projections of the first light-emitting unit 30a and the second light-emitting unit 30b on the substrate 10 are respectively located within the orthographic projections of the isolation opening 21 on the substrate 10; the first encapsulation layer 41 includes a first encapsulation unit 411 and a second encapsulation unit 412, the first encapsulation unit 411 is located on the side of the first light-emitting unit 30a away from the substrate 10, the second encapsulation unit 412 is located on the side of the first light-emitting unit 30a away from the substrate 10, a first gap 61 is formed between the first encapsulation unit 411 and the top surface of the isolation structure 20, and a second gap 62 is formed between the second encapsulation unit 412 and the top surface of the isolation structure 20, the first gap 61 being smaller than the second gap 62.

[0120] The first gap 61 is smaller than the second gap 62, meaning the thickness of the first light-emitting unit 30a is smaller than the thickness of the second light-emitting unit 30b. Since the first light-emitting unit 30a with the smallest thickness is prepared first and protected by the thickest first encapsulation unit 411, and then the second light-emitting unit 30b with a smaller thickness is prepared and paired with a thinner second encapsulation unit 412, the final film thickness can be more consistent and the influence of subsequent etching on the first light-emitting unit 30a can be reduced.

[0121] Fourthly, this application also provides a display device, including the display panel 100 of any of the above embodiments. Since this display device employs all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated upon here.

[0122] The structure, materials, and preparation of the isolation structure 20 (also called a partition structure, etc.) are further described in patents PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310707209.0, 202311346196.5, 202311499823.9, 202310731471.9, and 202311091555.7 for reference.

[0123] The display device can be any device with display function, such as mobile devices such as mobile phones, tablets, laptops, handheld computers, in-vehicle electronic devices, wearable devices, ultra-mobile personal computers (UMPCs), netbooks, or personal digital assistants (PDAs), as well as non-mobile devices such as personal computers (PCs), televisions (TVs), ATMs, or self-service machines.

[0124] While the embodiments disclosed in this application are as described above, the content is merely for the purpose of facilitating understanding of this application and is not intended to limit the invention. Any person skilled in the art to which this application pertains may make any modifications and changes in form and detail of the implementation without departing from the spirit and scope disclosed in this application; however, the scope of protection of this application shall still be determined by the scope defined in the appended claims.

[0125] The above description is merely a specific embodiment of this application. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, substitutions for other connection methods described above can be made by referring to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application.

Claims

1. A display panel, characterized in that, include: substrate; An isolation structure is disposed on one side of the substrate and encloses an isolation opening; The light-emitting device layer includes a first light-emitting unit and a second light-emitting unit with different light-emitting colors, wherein the orthogonal projections of the first light-emitting unit and the second light-emitting unit on the substrate are respectively located within the orthogonal projections of the isolation opening on the substrate; The first encapsulation layer includes a first encapsulation unit and a second encapsulation unit. The first encapsulation unit includes a first covering portion and a first extension portion. The first covering portion is located on the side of the first light-emitting unit away from the substrate, and the first extension portion is located on the sidewall of the isolation structure. The first extension portion is smooth. The second encapsulation unit includes a second covering portion and a second extension portion. The second covering portion is located on the side of the second light-emitting unit away from the substrate, and the second extension portion is located on the sidewall of the isolation structure. The thickness of the first covering portion is greater than the thickness of the second covering portion.

2. The display panel according to claim 1, characterized in that, The light-emitting device layer also includes a third light-emitting unit located within the isolation opening, wherein the light-emitting color of the third light-emitting unit is different from the light-emitting colors of the first light-emitting unit and the second light-emitting unit; Preferably, the first encapsulation layer further includes a third encapsulation unit, the third encapsulation unit including a third covering portion and a third extension portion, the third covering portion being located on the side of the third light-emitting unit away from the substrate, the third extension portion being located on the sidewall of the isolation structure, and the thickness of the second covering portion being greater than the thickness of the third covering portion.

3. The display panel according to claim 2, characterized in that, The second extension is smooth, and the third extension is concave.

4. The display panel according to claim 2, characterized in that, The third extension is smooth.

5. The display panel according to claim 2, characterized in that, The first light-emitting unit emits blue light, the second light-emitting unit emits green light, and the third light-emitting unit emits red light; or, the first light-emitting unit emits blue light, the second light-emitting unit emits red light, and the third light-emitting unit emits green light.

6. The display panel according to claim 1, characterized in that, The second extension is concave.

7. The display panel according to claim 1, characterized in that, The first packaging unit includes a first apex portion located on the side of the isolation structure opposite to the substrate; the second packaging unit includes a second apex portion located on the side of the isolation structure opposite to the substrate; the thickness of the first apex portion is greater than the thickness of the second apex portion.

8. The display panel according to claim 1, characterized in that, The display panel further includes a second encapsulation layer, which is disposed on the side of the first encapsulation layer away from the substrate; Preferably, the first encapsulation layer comprises an inorganic material, and the second encapsulation layer comprises an organic material; Preferably, the display panel further includes a third encapsulation layer, which is disposed on the side of the second encapsulation layer opposite to the substrate; Preferably, the third encapsulation layer comprises an inorganic material.

9. The display panel according to claim 8, characterized in that, The first packaging unit includes a first apex corner, which is located on the side of the isolation structure away from the substrate, and a first gap is formed between the first apex corner and the top surface of the isolation structure; the second packaging unit includes a second apex corner, which is located on the side of the isolation structure away from the substrate, and a second gap is formed between the second apex corner and the top surface of the isolation structure. Preferably, a portion of the second encapsulation layer fills the first gap, a portion of the second encapsulation layer fills the second gap, and the thickness of the portion of the second encapsulation layer filling the first gap is less than the thickness of the portion of the second encapsulation layer filling the second gap.

10. The display panel according to claim 1, characterized in that, The thickness of the first light-emitting unit is less than the thickness of the second light-emitting unit.

11. The display panel according to claim 1, characterized in that, The thickness of the first extension is greater than the thickness of the second extension.

12. The display panel according to claim 1, characterized in that, The isolation structure includes a first isolation portion and a second isolation portion arranged sequentially along a direction away from the substrate, wherein the side of the first isolation portion facing away from the substrate is located within the orthogonal projection of the second isolation portion on the substrate.

13. The display panel according to claim 12, characterized in that, The first isolation portion includes a first sub-portion and a second sub-portion arranged sequentially along a direction away from the substrate, wherein the orthographic projection of the second sub-portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate; The orthographic projection of the first sub-part onto the substrate is located within the orthographic projection of the second isolation part onto the substrate.

14. The display panel according to claim 1, characterized in that, The display panel further includes a pixel definition layer disposed on the substrate, the isolation structure is located on the side of the pixel definition layer opposite to the substrate, the pixel definition layer has a pixel opening, and the isolation opening communicates with the pixel opening.

15. A method for manufacturing a display panel, characterized in that, Includes the following steps: An isolation structure with multiple isolation openings is fabricated on the substrate; A first light-emitting unit is fabricated within the isolation opening; wherein the orthographic projection of the first light-emitting unit on the substrate is located within the orthographic projection of the isolation opening on the substrate; A first encapsulation unit is provided on the side of the first light-emitting unit away from the substrate; wherein, the first encapsulation unit includes a first covering part and a first extension part, the first covering part is located on the side of the first light-emitting unit away from the substrate, the first extension part is located on the side wall of the isolation structure, and the first extension part is smooth. A second light-emitting unit is fabricated within the isolation opening; wherein the orthographic projection of the second light-emitting unit on the substrate is located within the orthographic projection of the isolation opening on the substrate; A second packaging unit is prepared on the side of the second light-emitting unit away from the substrate; wherein the second packaging unit includes a second cover portion and a second extension portion, the second cover portion is located on the side of the first light-emitting unit away from the substrate, and the first extension portion is located on the sidewall of the isolation structure; the thickness of the first cover portion is greater than the thickness of the second cover portion.

16. A display panel, characterized in that, include: substrate; An isolation structure is disposed on one side of the substrate and encloses an isolation opening; The light-emitting device layer includes a first light-emitting unit and a second light-emitting unit with different light-emitting colors, wherein the orthogonal projections of the first light-emitting unit and the second light-emitting unit on the substrate are respectively located within the orthogonal projections of the isolation opening on the substrate; The first encapsulation layer includes a first encapsulation unit and a second encapsulation unit. The first encapsulation unit is located on the side of the first light-emitting unit away from the substrate, and the second encapsulation unit is located on the side of the first light-emitting unit away from the substrate. There is a first gap between the first encapsulation unit and the top surface of the isolation structure, and there is a second gap between the second encapsulation unit and the top surface of the isolation structure. The first gap is smaller than the second gap.

17. A display device, characterized in that, Includes the display panel as described in any one of claims 1-14 or claim 16.

Images