Tooling assembly and method of use thereof

Abstract

The application provides a tooling assembly and a method thereof. The tooling assembly is used for limiting a combination unit, and the tooling assembly comprises at least two assembly states. The first assembly state is used for receiving the combination unit and transporting to a wire bonding station. In the first assembly state, the carrier and the constraint part are stacked along a first direction, the through slot and the accommodating slot are one-to-one corresponding, the guide part is used for guiding the combination unit to pass through the through slot one-to-one and fall into the accommodating slot, and the top surface of the carrier is not higher than the top surface of the base. The second assembly state is configured to replace the constraint part of the first assembly state with a pressing part in the wire bonding station, so that the carrier and the pressing part clamp the combination unit for wire bonding. The window and the through slot are one-to-one corresponding, and the chip and part of the base of the combination unit in the corresponding through slot are exposed. The carrier of the tooling assembly is matched with different parts to obtain multiple assembly states, which are correspondingly matched with multiple manufacturing processes, and the development, management or maintenance cost of the jig can be reduced.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and more specifically, to a tooling assembly and its method of use. Background Technology

[0002] In the semiconductor device manufacturing process, chips and substrates need to be packaged. Manufacturing stations include chip mounting stations and wire bonding stations. The chip mounting station physically fixes the chip and substrate together to form a combined unit (COS, Chip on Submount). The wire bonding station electrically solders the chip's pads to the substrate's pins.

[0003] Generally, after the chip placement station finishes placing the chip, the assembly unit is discharged into the waffle box and needs to be transported to the wire bonding station. The assembly unit is manually clamped from the waffle box to the wire bonding fixture by tweezers and sent into the wire bonding machine for wire bonding.

[0004] However, multiple fixtures (such as waffle boxes, wire bonding clamps, etc.) imply multiple management and maintenance costs, resulting in extremely high fixture costs. Moreover, manual handling of assembly units easily increases the risk of damage and contamination. When there are many assembly units, they need to be placed on the wire bonding clamp in a predetermined order, which leads to low efficiency of manual handling and unloading, increased risk of disordered ordering, and low production capacity. Summary of the Invention

[0005] This application addresses the shortcomings of existing methods by proposing a tooling component and its usage method to solve technical problems such as extremely high fixture costs, damage to assembly units, increased risk of contamination, low efficiency, increased risk of sequence disorder, low production capacity, or extremely high fixture costs in related technologies.

[0006] In a first aspect, embodiments of this application provide a tooling assembly for limiting an assembly unit, the assembly unit including a chip and a base fixedly connected, comprising: The carrier has at least one receiving groove on one side; The constraint member has at least one through slot extending along its thickness direction, the through slot including a guide portion; A press-fitting member having at least one window extending through its thickness; The opening area of ​​the through slot is not less than the opening area of ​​the receiving slot, and the opening area of ​​the window is less than the opening area of ​​the receiving slot. The tooling assembly includes at least two assembly states; the first assembly state is used to receive the assembly unit and transport it to the wire bonding station; in the first assembly state, the carrier and the constraint are stacked along the first direction, the through slot and the receiving slot correspond one-to-one, the guide is used to guide the assembly unit to pass through the through slot and fall into the receiving slot one-to-one, and the top surface of the carrier is not higher than the top surface of the base. The second assembly configuration involves replacing the constraint component of the first assembly configuration with a pressing component at the wire bonding station, so that the carrier and the pressing component clamp the combined unit for wire bonding; the window corresponds one-to-one with the through slot, exposing the chip and part of the base of the combined unit in the corresponding through slot.

[0007] In some embodiments, the press-fit layer has a pressing protrusion at the edge of the window; When the constraint is replaced with a pressing component, the pressing component is placed above the constraint, so that multiple pressing protrusions abut against multiple bases one by one, and the bottom surface of the pressing component is spaced apart from the top surface of the constraint; the constraint is moved up to contact the pressing component, the contacting constraint and pressing component are removed at the same time, and then the pressing component is placed above the carrier to clamp the assembly unit.

[0008] In some embodiments, the tooling assembly further includes a tray and a cover; The tray surface has a groove; in the first assembly state, the carrier and the constraint are both accommodated in the groove; the tooling assembly also includes a third assembly state for the combined unit after the welding line is turned over; in the third assembly state, the carrier and the clamping component hold the combined unit after the welding line is turned over in the groove, and the edge of the cover plate overlaps the edge of the tray.

[0009] In some embodiments, the carrier includes: a carrier body and a magnetic element, the magnetic element being magnetically connected to the pressing element; The magnetic component is adjustablely connected to the carrier body along the first direction, and the magnetic component is in contact with the pressing component or has a designed spacing.

[0010] In some embodiments, the carrier body has a mounting hole; the magnetic element is connected to the bottom of the mounting hole by an elastic element; when the magnetic element provides magnetic attraction to the pressing element, the maximum thickness of the magnetic element protruding from the carrier body does not exceed the thickness of the base protruding from the carrier body; at least one of the inner peripheral wall of the mounting hole and the outer peripheral wall of the magnetic element has a guide groove extending in a first direction, and the other has a guide protrusion, and the guide groove and the guide protrusion are slidably connected. When the guide groove is set on the inner peripheral wall of the mounting hole, the end facing the pressing part is closed; when the guide groove is set on the outer peripheral wall of the magnetic part, the end away from the pressing part is closed. And / or, when the magnetic component adsorbs the pressure component, the elastic component is in a stretched state.

[0011] In some embodiments, the inner peripheral wall of the mounting hole of the carrier body is threadedly connected to the outer peripheral wall of the magnetic component, and the axis of the threaded connection is parallel to the first direction.

[0012] In some embodiments, at least one of the following is also included: Along the second direction, the window includes a first area, a middle area, and a second area; the dimensions of the first area, the middle area, and the second area increase sequentially along the third direction, so that the dimensions of the exposed assembly unit increase sequentially along the third direction, and so that the second area exposes the identification characters of the base; the second direction intersects the third direction and is perpendicular to the first direction. In the first assembly state, the top surface of the constraint component is not lower than the top surface of the chip; The through groove includes a groove wall and an internal space. Along the thickness direction of the constraint member, the groove wall is at least partially inclined to form a guide portion, such that the opening area of ​​the through groove at the end away from the carrier is larger than the opening area at the end closer to the carrier.

[0013] In some embodiments, at least one of the following is also included: In the first assembly state, the top surface of the tray is higher than the constraint member; the side wall at the opening of the groove has a first inclined surface that slopes outward from the groove, and the outer peripheral wall of the constraint member has a second inclined surface that slopes inward from the groove. The middle region of the carrier is thicker than the edge region of the carrier; on a plane perpendicular to the first direction, the constraint member and the pressing member have the same dimensions and correspond to the middle region of the carrier along the first direction. The outer perimeter of the tray has a stepped structure, and the edge of the cover plate overlaps the stepped structure.

[0014] Secondly, embodiments of this application provide a method of using any of the tooling components provided in the first aspect above, comprising: The stacked carriers and constraints are placed at the unloading point of the chip bonding station to receive the assembly units, so that the fixed assembly units pass through the through slots of the constraints and fall into the receiving slots. The carriers and constraints that have received the assembly units are taken out and transported to the wire bonding station. The constraint is replaced with a press-fit component, and the carrier and press-fit component clamp the assembly unit inside for wire bonding.

[0015] In some embodiments, the stacked carriers and constraints are placed at the placement station unloading area to receive the assembly unit, including: The carrier and constraint components are stacked in the groove of the tray and placed at the unloading point of the patch station; In addition, the constraint members are replaced with clamping members, and the carrier and clamping members clamp the assembly unit inside for wire bonding, including: The pressing component is placed above the constraint component, and the pressing protrusion of the pressing component abuts against multiple bases one by one. The bottom surface of the pressing component and the top surface of the constraint component are spaced apart. Move the constraint upwards to make it contact the pressing component, remove the contacting constraint and pressing component at the same time, then place the pressing component above the carrier and fix it to the carrier, clamp the assembly unit, remove the fixed carrier and pressing component from the tray, put them into the spring clip, and send them to the wire bonding station for wire bonding.

[0016] The beneficial effects of the technical solutions provided in this application include: (1) By matching the carrier of the tooling component with different parts, multiple assembly states can be obtained, which can be adapted to various manufacturing processes, thereby reducing the development, management or maintenance costs of the fixture.

[0017] (2) The tooling components are assembled with the constraint parts and the pressing parts to obtain two different assembly states. The combined unit is always supported on the carrier and does not need to be manually clamped and moved. This can reduce the risk of damage and contamination of the combined unit, and can also fundamentally eliminate the risk of sequence disorder and improve production capacity.

[0018] Additional aspects and advantages of this application will be set forth in the middle section of the description which follows, and these will become apparent from the description or may be learned by practice of this application. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments of the present invention will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is one of the structural schematic diagrams of a tooling assembly in a first assembly state provided in an embodiment of this application; Figure 2 This is the second schematic diagram of a tooling assembly in a first assembly state, provided as an embodiment of this application. Figure 3 for Figure 2 A magnified view of a portion of point A in the middle; Figure 4 A third schematic diagram of a tooling assembly in a first assembly state, provided as an embodiment of this application; Figure 5 This is one of the structural schematic diagrams of a tooling assembly in a second assembly state provided in an embodiment of this application; Figure 6 This is a second schematic diagram of a tooling assembly in a second assembly state, provided as an embodiment of this application. Figure 7 for Figure 6 A magnified view of a portion of point B in the middle; Figure 8 This is a schematic diagram of a tooling assembly in a third assembly state, provided in an embodiment of this application. Figure 9A schematic diagram of the structure of a carrier for a tooling assembly provided in an embodiment of this application; Figure 10 for Figure 9 A schematic diagram of a cross section at the midline CC'; Figure 11 for Figure 9 Another cross-sectional diagram at the midline CC'; Figure 12 A schematic diagram of the structure of a constraint member of a tooling assembly provided in an embodiment of this application; Figure 13 This is a schematic diagram of the structure of a pressing component of a tooling assembly provided in an embodiment of this application; Figure 14 A flowchart illustrating a method of using a tooling component provided in an embodiment of this application; Figure 15 This is a schematic diagram of a tooling assembly provided in this application, in which a pressing member is disposed above a constraint member.

[0021] Figure label: 10-Carrier; 11-Accommodation groove; 101-Carrier body; 12-Magnetic component; 13-Mounting hole; 14-Elastic component; 15-Guide groove; 16-Guide protrusion; 17-Limiting post; 20-Constraint; 21-Through groove; 210-Guide part; 22-First limiting hole; 23-Second inclined surface; 30 - Press-fit component; 31 - Window; 311 - First area; 312 - Middle area; 313 - Second area; 32 - Second limiting hole; 33 - Press-fit protrusion; 40 - Tray; 41 - Groove; 411 - First slope; 42 - Stepped structure; 50 - Cover plate; 60 - Combination unit; 61 - Chip; 62 - Base; 620 - Identification character. Detailed Implementation

[0022] The embodiments of this application are described below with reference to the accompanying drawings. It should be understood that the embodiments described below with reference to the accompanying drawings are exemplary descriptions for explaining the technical solutions of the embodiments of this application, and do not constitute a limitation on the technical solutions of the embodiments of this application.

[0023] Those skilled in the art will understand that, unless specifically stated otherwise, the terms "described" and "the" as used herein may also include plural forms. It should be further understood that the term "comprising" as used in this application's specification means the presence of the stated features, integers, steps, operations, elements, and / or components, but does not exclude other features, information, data, steps, operations, elements, components, and / or combinations thereof supported by this art. It should be understood that when we say an element is "connected" to another element, the element may be directly connected to the other element, or it may mean that the element and the other element are connected through an intermediate element. The term "and / or" as used herein refers to at least one of the items defined by the term; for example, "A and / or B" can be implemented as "A," or as "B," or as "A and B."

[0024] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0025] This application provides a tooling assembly for limiting a combination unit 60, the combination unit 60 including a chip 61 and a base 62 fixedly connected; please refer to Figures 1-7 , Figures 1-4 The tooling assembly in the first assembly state is shown. Figures 5-7 The tooling assembly in the second assembly state is shown. The tooling assembly includes: carrier 10, constraint member 20, and clamping member 30.

[0026] The carrier 10 has at least one receiving groove 11 on one side. The constraint member 20 has at least one through groove 21 extending along its thickness direction, the through groove 21 including a guide portion 210. The pressing member 30 has at least one window 31 extending along its thickness direction. The opening area of ​​the through groove 21 is not less than the opening area of ​​the receiving groove 11, and the opening area of ​​the window 31 is less than the opening area of ​​the receiving groove 11.

[0027] The tooling assembly includes at least two assembly states; the first assembly state is used to receive the assembly unit 60 and transport it to the bonding station; in the first assembly state, the carrier 10 and the constraint member 20 are stacked along a first direction, the through slot 21 corresponds one-to-one with the receiving slot 11, the guide part 210 is used to guide the assembly unit 60 to pass through the through slot 21 one-to-one and fall into the receiving slot 11, and the top surface of the carrier 10 is not higher than the top surface of the base 62.

[0028] The second assembly configuration is obtained by replacing the constraint 20 of the first assembly configuration with the pressure member 30 at the wire bonding station, so that the carrier 10 and the pressure member 30 clamp the combined unit 60 for wire bonding; the window 31 corresponds one-to-one with the through slot 21, exposing the chip 61 and part of the base 62 of the combined unit 60 in the corresponding through slot 21.

[0029] It should be noted that, in this embodiment, the tooling component in the first assembly state can receive the fixed assembly unit 60 at the chip placement station and carry the assembly unit 60 throughout the process of transporting it from the chip placement station to the wire bonding station; the tooling component in the second assembly state can clamp the assembly unit 60 at the wire bonding station and send it into the wire bonding machine together, serving as a fixing device for the assembly unit 60, which facilitates the wire bonding operation of the assembly unit 60.

[0030] In this embodiment, (1) by combining the carrier 10 of the tooling assembly with different parts, multiple assembly states can be obtained, which correspond to and adapt to multiple manufacturing processes, thereby reducing the development, management or maintenance costs of the fixture.

[0031] Specifically, during the chip mounting process, if the carrier 10 is too shallow, the assembly unit 60 may pop out. However, during the wire bonding process, the top surface of the base 62 needs to be no lower than the surface of the carrier 10 to facilitate clamping the assembly unit 60 for wire bonding. Therefore, in this embodiment, the constraint member 20 in the chip mounting station prevents the assembly unit 60 from popping out. In the wire bonding process, the pressing member 30 replaces the constraint member 20 to clamp and fix the base 62 of the assembly unit 60. That is, only the corresponding constraint member 20 or pressing member 30 needs to be replaced for the carrier 10; there is no need to configure separate fixtures for both the chip mounting and wire bonding processes, thus reducing the development, management, and maintenance costs of fixtures.

[0032] (2) The carrier 10 of the tooling component is assembled with the constraint 20 and the pressing component 30 to obtain two different assembly states. The combined unit 60 is always supported on the carrier 10, and there is no need for manual clamping and movement. This can reduce the risk of damage and contamination of the combined unit 60, and can also fundamentally eliminate the risk of sequence disorder and improve production capacity.

[0033] Specifically, in the first assembly state, the carrier 10 cooperates with the constraint 20 to be responsible for the unloading and holding task in the chip mounting process. The constraint 20 has a certain thickness, and the through groove 21 of the constraint 20 has a guide part 210, which can guide the falling assembly unit 60 into the receiving groove 11 of the carrier 10, reduce the possibility of the assembly unit 60 jumping out, improve the unloading success rate, and can also act as a waffle box to restrict the position of the assembly unit 60 during the transportation to the bonding station.

[0034] In the second assembly state, the carrier 10 cooperates with the pressing member 30. The window 31 of the pressing member 30 is smaller than the opening area of ​​the assembly unit 60, allowing the assembly unit 60 to be pressed onto the carrier 10. This is used to hold the assembly unit 60 during the wire bonding process. The window 31 exposes the chip 61 and presses down on the base 62, ensuring the stability of the base 62 while avoiding damage to the chip 61. Therefore, the relative position of the assembly unit 60 and the receiving groove 11 of the carrier 10 remains unchanged, reducing the possibility of the assembly unit 60 being misaligned due to manual handling and improving production capacity.

[0035] It should be noted that in the embodiments of this application, multiple components of the tooling assembly are stacked along their respective thickness directions. That is, in the assembled state, the thickness directions of each component are the same. For example, in the first assembled state, the thickness directions of the carrier 10 and the constraint member 20 are the same, and in the second assembled state, the thickness directions of the carrier 10 and the pressing member 30 are the same. For ease of description, the first direction is used to refer to the stacking direction.

[0036] It should be noted that in the second assembly state, the carrier 10 cooperates with the pressing component 30 to clamp the base 62 of the assembly unit 60, exposing the chip 61.

[0037] It should be noted that the terms "top surface", "top end", "bottom surface", and "bottom end" used in the embodiments of this application refer to the tooling assembly in its upright position, with the upward-facing side being the "top surface", the side facing the direction being the "top end", the side facing the direction being the "bottom surface", and the downward-facing side being the "bottom end". These terms will not be repeated hereafter.

[0038] Considering that the receiving groove 11 of the carrier 10 is relatively shallow, and the top surface of the carrier 10 is not higher than the top surface of the base 62, it is necessary to ensure that subsequent wire bonding can proceed normally. Therefore, during the process of replacing the constraint member 20 with the pressing member 30, the base 62 may be pulled away from the receiving groove 11. Therefore, in some embodiments, please refer to... Figure 15 The pressing member 30 has a pressing protrusion 33 on one side of the window 31 at the edge; when the constraint member 20 is replaced with the pressing member 30, the pressing member 30 is set above the constraint member 20, so that multiple pressing protrusions 33 abut against multiple bases 62 one by one, and the bottom surface of the pressing member 30 and the top surface of the constraint member 20 are spaced apart by h; the constraint member 20 is moved up to contact the pressing member 30, the contacting constraint member 20 and the pressing member 30 are taken out at the same time, and then the pressing member 30 is set above the carrier 10 to clamp the assembly unit 60.

[0039] In this embodiment, during the process of replacing the constraint member 20 with the pressing member 30, the pressing member 30 can be first placed on the constraint member 20 so that the pressing protrusion 33 contacts the base 62 and provides a pre-pressing force to the combined unit 60. At this time, the combined unit 60 is limited in the circumferential direction by the receiving groove 11 and in the vertical direction by the bottom carrier 10 and the top pressing protrusion 33, ensuring the stability of the base 62 in the carrier 10. The pressing protrusion 33 can increase the positive pressure between the base 62 and the bottom surface of the receiving groove 11, thereby increasing the friction between the base 62 and the bottom surface of the receiving groove 11.

[0040] Next, the pressing member 30 is fixed in place. Since the pressing protrusion 33 corresponds to the area of ​​the through groove 21 in the vertical direction, the constraint member 20 can be moved upward within the interval h so that the top surface of the constraint member 20 contacts the bottom surface of the pressing member 30. This ensures that during the separation of the constraint member 20 from the carrier 10, the pressing protrusion 33 of the pressing member 30 always presses the base 62, ensuring that the base 62 does not shift.

[0041] Then, the pressing member 30 and the restraint member 20 are removed simultaneously with the pressing member facing upwards. The base 62 will remain in the receiving groove 11, which can prevent the base 62 from falling out of the receiving groove 11. This further reduces the labor cost of repositioning the base 62 that has fallen out into the corresponding receiving groove 11, and ensures that the base 62 is always contained in the receiving groove 11 between the chip placement station and the wire bonding station.

[0042] Finally, the pressing member 30 is placed on top of the carrier 10, so that the carrier 10 and the pressing member 30 clamp the assembly unit 60, thus completing the replacement operation of the constraint member 20 and the pressing member 30.

[0043] Therefore, in this embodiment, the constraint member 20 and the pressing member 30, while respectively constraining and pressing the assembly unit 60, can also cooperate with each other, supporting each other functionally and possessing overall integrity. During the process of replacing the constraint member 20 with the pressing member 30, the pressing protrusion 33 and the unique operation method (first setting the pressing member 30 above the constraint member 20, then moving the constraint member 20 up to contact the pressing member 30, and then removing the constraint member 20 and the pressing member 30 at the same time) can prevent the assembly unit 60 from detaching from the receiving groove 11, further ensuring that the assembly unit 60 is always supported on the carrier 10 without the need for manual clamping and movement, reducing the risk of damage and contamination to the assembly unit 60, and fundamentally eliminating the risk of sequence disorder, thereby improving production capacity.

[0044] It should be noted that the carrier 10 and the clamping unit 30 clamping assembly 60 is actually the carrier 10 and the clamping unit 30 clamping the base 62, exposing the chip 61 for wire bonding. The clamping protrusion 33 exists only on one side of the clamping unit 30. Therefore, when the carrier 10 and the clamping unit 30 are fixed to each other, if the side with the clamping protrusion 33 is opposite to the carrier 10, the carrier 10 and the clamping unit 30 can be connected by the magnetic element 12 protruding from the surface of the carrier 10 in a later embodiment, so that the carrier 10 and the clamping unit 30 are relatively fixed. If the side with the clamping protrusion 33 is opposite to the carrier 10, the side of the clamping unit 30 without the clamping protrusion 33 directly presses down multiple bases 62 at the same time, and the conventional magnetic element 12 can be used to attract and fix the clamping unit 30 and the carrier 10.

[0045] It should be noted that if the top surface of the constraint member 20 is higher than the base 62, the pressing protrusion 33 is located within the through groove 21 and abuts against the base 62. If the top surface of the constraint member 20 is not higher than the base 62, the pressing protrusion 33 is not located within the through groove 21.

[0046] Alternatively, please refer to Figure 1 and Figure 5 The carrier 10 has a protruding limiting post 17, and the constraint member 20 has a first limiting hole 22. When the carrier 10 and the constraint member 20 are stacked, the limiting post 17 can be inserted into the first limiting hole 22 to prevent the carrier 10 and the constraint member 20 from shifting relative to each other.

[0047] Alternatively, please refer to Figure 9 On a plane parallel to the carrier 10, the corners of the receiving groove 11 are rounded to prevent sharp corners from damaging the assembly unit 60. The opposite edges of the receiving groove 11 also have outwardly flared protrusions, which facilitates the use of tweezers to grasp the two sides of the assembly unit 60 when it is removed. The bottom of the receiving groove 11 has a negative pressure through hole to adsorb the assembly unit 60.

[0048] Alternatively, please refer to Figure 12 On a plane parallel to the constraint member 20, the corners of the through groove 21 are rounded, corresponding to the corners of the receiving groove 11, which can prevent sharp corners from damaging the assembly unit 60. One edge of the through groove 21 has an outwardly flared protrusion area to avoid the light-emitting cavity of the assembly unit 60 and protect the assembly unit 60.

[0049] Optionally, the carrier 10 has notches on both sides. When the constraint member 20 is stacked with the carrier 10, or when the pressing member 30 is stacked with the carrier 10, the side edges of the constraint member 20 or the pressing member 30 are located above the notches, so that the workers have enough space to clamp the side edges of the constraint member 20 or the pressing member 30, increasing the contact area with the constraint member 20 or the pressing member 30, and making it easier to remove.

[0050] Alternatively, please refer to Figure 13 The pressing component 30 has a second limiting hole 32. When the carrier 10 and the pressing component 30 are stacked, the limiting post 17 can be inserted into the second limiting hole 32 to prevent the carrier 10 and the pressing component 30 from shifting relative to each other.

[0051] Considering that after wire bonding is completed at the wire bonding station, the wires need to be transferred to other stations for subsequent manufacturing processes, please refer to... Figures 1-8 In some embodiments, the tooling assembly further includes a tray 40 and a cover plate 50.

[0052] The surface of the tray 40 has a groove 41; in the first assembly state, the carrier 10 and the constraint 20 are both accommodated in the groove 41; the tooling assembly also includes a third assembly state for handling the combined unit 60 after welding; in the third assembly state, the carrier 10 and the pressure member 30 clamp the combined unit 60 after welding and place it in the groove 41, and the edge of the cover plate 50 overlaps the edge of the tray 40.

[0053] In this embodiment, the tooling assembly includes five components: carrier 10, constraint 20, pressing component 30, tray 40, and cover plate 50. By combining these five components, the tooling assembly can have a first assembly state, a second assembly state, and a third assembly state, each playing a different role, thereby further improving the utilization rate of the tooling assembly and reducing the development, management, or maintenance costs of the fixture.

[0054] Specifically, refer to Figure 1 The tooling assembly in the first assembly state includes a carrier 10, a constraint 20, and a tray 40, which can receive the fixed assembly unit 60 at the placement station and continuously support the assembly unit 60 during transportation from the placement station to the wire bonding station; Reference Figure 5 The tooling assembly in the second assembly state includes a carrier 10 and a clamping component 30, which can clamp the assembly unit 60 at the wire bonding station, serving as a fixing device for the assembly unit 60 and facilitating wire bonding operations on the assembly unit 60; Reference Figure 8 The tooling components in the third assembly state include a carrier 10, a pressing component 30, a tray 40, and a cover plate 50. After the wire bonding is completed, the carrier 10 and the pressing component 30 clamp the assembly unit 60 together and place it in the tray 40. The cover plate 50 is then placed on top, and the assembly is transferred to the next station for further operations.

[0055] Therefore, the pallet 40 in this embodiment can be utilized during the transportation process from the placement station to the wire bonding station and during the post-wire bonding station turnover process, thereby improving the utilization rate of the pallet 40 and reducing the overall cost of the tooling components.

[0056] In some embodiments, due to equipment design and production line planning, the space dimensions of the chip mounter unloading area in the same production line are fixed. In this embodiment, a tray 40 matching the dimensions of the chip mounter unloading area is used to adapt to the fixed unloading space. Therefore, the tooling assembly of this application can adapt to various chip mounters and multiple production lines by using trays 40 of different sizes without changing the dimensions of the carrier 10 and the constraint 20 themselves, thus improving the versatility of the tooling assembly in this embodiment.

[0057] In some embodiments, please refer to Figure 4In the first assembly state, the top surface of the tray 40 is higher than the constraint member 20; the side wall at the opening of the groove 41 has a first inclined surface 411 that is inclined outward from the groove 41, and the outer peripheral wall of the constraint member 20 has a second inclined surface 23 that is inclined inward from the groove 41.

[0058] In this embodiment, the top surface of the tray 40 is higher than the constraint member 20, ensuring the stability of the constraint member 20 during transportation. The sidewall at the opening of the groove 41 is the sidewall near the top when the tray 40 is upright. The first inclined surface 411 faces the interior space of the groove 41, and the second inclined surface 23 faces the first inclined surface 411, allowing the constraint member 20 to fall into the groove 41 along the first inclined surface 411. The first inclined surface 411 acts as a guide. The second inclined surface 23 has the opposite inclination direction to the first inclined surface 411, making the first inclined surface 411 and the second inclined surface 23 in line contact, reducing friction, and the center of gravity of the constraint member 20 is further away from the second inclined surface 23, facilitating the automatic centering of the constraint member 20 within the tray 40.

[0059] In some embodiments, the central region of the carrier 10 is thicker than the edge region of the carrier 10; on a plane perpendicular to the first direction, the constraint member 20 and the pressing member 30 are the same size and correspond to the central region of the carrier 10 along the first direction.

[0060] In this embodiment, the functional structures of the carrier 10 (such as the receiving groove 11, the limiting post 17, etc.) are all located in the central region of the carrier 10, so the central region is thicker to ensure sufficient strength. The edge region of the carrier 10 is thinner, which can be used to adapt to grooves 41 of different sizes, and can also achieve the effect of reducing material and weight.

[0061] In some embodiments, please refer to Figure 8 In the third assembly state, the outer periphery of the tray 40 has a stepped structure 42, and the edge of the cover plate 50 overlaps the stepped structure 42.

[0062] In this embodiment, the tray 40 and the cover plate 50 are mutually limited by the stepped structure 42, and the overlap is located on the outer periphery of the tray 40, which can prevent the cover plate 50 from contacting the carrier 10 and the pressing member 30 placed inside the tray 40, and avoid mutual interference during movement.

[0063] Furthermore, there is a gap between the assembly unit 60 and the cover plate 50 to prevent the cover plate 50 from contacting the assembly unit 60 and thus damaging the assembly unit 60.

[0064] In some embodiments, reference is made to Figure 9 The carrier 10 includes a carrier body 101 and a magnetic component 12, which is magnetically connected to the pressing component 30.

[0065] The magnetic component 12 is adjustablely connected to the carrier body 101 along the first direction, and the magnetic component 12 is in contact with the pressing component 30 or has a designed spacing.

[0066] In this embodiment, the carrier body 101 maintains a relatively stable positional relationship with the pressing member 30 through the magnetic element 12, providing a reliable clamping force for the combined unit 60. The magnetic element 12 has a strong magnetic force, so when the carrier body 101 and the pressing member 30 are stacked, the magnetic element 12 can attract the pressing member 30, come into contact with the pressing member 30, and clamp the combined unit 60 inside.

[0067] Considering that the base 62 of the combined unit 60 may be higher than the surface of the carrier body 101, a strong magnet can be used. The strong adsorption can be guaranteed even when the distance between the magnetic component 12 and the pressing component 30 is within the designed distance range. In other words, the designed distance is within the range that the strong magnet can adsorb. Within the designed distance range, the carrier body 101 and the pressing component 30 can be adsorbed and fixed in the air by the strong magnet.

[0068] Optionally, the base 62 of the combination unit 60 may be about 0.09 mm higher than the surface of the carrier body 101, with a design spacing of no more than 0.09 mm, so that the strong magnet can achieve the effect of adsorption without air contact.

[0069] A protrusion can be designed on the surface of the pressing member 30 facing the carrier body 101, so that the protrusion of the pressing member 30 can compensate for the thickness of the assembly unit 60 protruding from the carrier body 101, thereby contacting the magnetic member 12. However, the scheme of modifying the pressing member 30 has poor universality. Therefore, this application also provides the following two embodiments: Firstly, please refer to Figure 11 In some embodiments, the inner peripheral wall of the mounting hole 13 of the carrier body 101 is threadedly connected to the outer peripheral wall of the magnetic component 12, and the axis of the threaded connection is parallel to the first direction.

[0070] In this embodiment, by using a threaded connection, the thickness of the magnetic component 12 protruding from the top surface of the carrier body 101 is controlled, so that the magnetic component 12 can adapt to different spacings between the carrier body 101 and the pressing component 30, thereby improving the universality of the tooling assembly in the second state.

[0071] Secondly, please refer to Figure 10 In some embodiments, the carrier body 101 has a mounting hole 13; the magnetic element 12 is connected to the bottom of the mounting hole 13 by an elastic element 14; when the magnetic element 12 provides magnetic attraction to the pressing element 30, the maximum thickness of the magnetic element 12 protruding from the carrier body 101 does not exceed the thickness of the base 62 protruding from the carrier body 101.

[0072] In this embodiment, the thickness of the magnetic component 12 protruding from the top surface of the carrier body 101 is controlled by the elastic component 14, so that the magnetic component 12 can adapt to different spacings between the carrier body 101 and the pressing component 30, thereby improving the universality of the tooling assembly in the second state.

[0073] Specifically, the magnetic component 12 has an elastic component 14 at its bottom. When the pressing component 30 is pressed onto the magnetic component 12, the magnetic component 12 can adaptively protrude from the carrier 10 under the action of the spring, attracting the pressing component 30. Furthermore, by controlling the maximum protrusion thickness of the magnetic component 12, the maximum thickness of the magnetic component 12 protruding from the carrier body 101 does not exceed the thickness of the base 62 protruding from the carrier body 101. This ensures that while the magnetic component 12 and the pressing component 30 maintain an adsorption state, the base 62 also maintains good clamping ability, preventing the base 62 from moving between the carrier body 101 and the pressing component 30.

[0074] This application also provides the following two different implementations for the previous embodiment employing the elastic element 14.

[0075] In some embodiments, at least one of the inner peripheral wall of the mounting hole 13 and the outer peripheral wall of the magnetic component 12 has a guide groove 15 extending along a first direction, and the other has a guide protrusion 16, with the guide groove 15 and the guide protrusion 16 slidably connected. When the guide groove 15 is provided on the inner peripheral wall of the mounting hole 13, the end facing the pressing member 30 is closed; when the guide groove 15 is provided on the outer peripheral wall of the magnetic component 12, the end away from the pressing member 30 is closed.

[0076] This embodiment includes two cases, the first case is as follows: Figure 10 As shown, the first case includes: the inner peripheral wall of the mounting hole 13 has a guide groove 15, and the outer peripheral wall of the magnetic component 12 has a guide protrusion 16. The guide groove 15 and the guide protrusion 16 are slidably connected. The end of the guide groove 15 facing the pressing component 30 is closed, that is, the top of the guide groove 15 is closed in the upright state, providing the magnetic component 12 with the maximum protrusion thickness protruding from the top surface of the carrier body 101, preventing the magnetic component 12 from protruding too much and causing the pressing component 30 to shift relative to the carrier body 101, resulting in unstable clamping. The second case includes: the inner peripheral wall of the mounting hole 13 has a guide protrusion 16, and the outer peripheral wall of the magnetic component 12 has a guide groove 15. The guide groove 15 and the guide protrusion 16 are slidably connected. The end of the guide groove 15 away from the pressing component 30 is closed, that is, the bottom end of the guide groove 15 is closed, providing the magnetic component 12 with the maximum protrusion thickness protruding from the top surface of the carrier body 101, preventing the magnetic component 12 from protruding too much and causing the pressing component 30 to shift relative to the carrier body 101, resulting in unstable clamping.

[0077] Secondly, in some embodiments, when the magnetic component 12 adsorbs the pressing component 30, the elastic component 14 is in a stretched state.

[0078] In this embodiment, the elastic member 14 is in a stretched state. By controlling the fixed maximum extension length of the elastic member 14, under the constraint of the elastic member 14, the maximum thickness of the magnetic member 12 protruding from the carrier body 101 does not exceed the thickness of the base 62 protruding from the carrier body 101. This ensures that the magnetic member 12 and the pressing member 30 maintain an adsorption state while also maintaining good clamping ability on the base 62, preventing the base 62 from moving between the carrier 10 and the base 62.

[0079] This application also provides the following embodiments for the window 31 of the pressing member 30: Considering that the base 62 itself has an identification character 620, which serves as the production batch number of the base 62 for easy recording, but the identification character 620 is covered by the pressure piece 30, it is necessary to remove the pressure piece 30 to view the character when recording, which is rather cumbersome. Therefore, please refer to... Figure 7 In some embodiments, along the second direction, the window 31 includes a first region 311, a middle region 312, and a second region 313; the dimensions of the first region 311, the middle region 312, and the second region 313 increase sequentially along the third direction, so that the dimensions of the exposed assembly unit 60 increase sequentially along the third direction, and the second region 313 exposes the identification character 620 of the base 62; the second direction intersects the third direction and is perpendicular to the first direction.

[0080] In other words, in this embodiment, the size of the window 31 is variable, and the opening area of ​​the window 31 increases sequentially. The opening area of ​​the second region 313 is the largest, which can expose the identification character 620 of the base 62. Considering that the area of ​​the window 31 may decrease due to the increase in the area of ​​the pressing, resulting in poor pressing stability, the area of ​​the first region 311 is smaller, which can increase the contact area between the pressing member 30 and the base 62 and ensure pressing stability.

[0081] Optionally, the first direction is parallel to the thickness direction of the pressing member 30, and in the plane direction of the pressing member 30, the second direction is the length direction of the pressing member 30, and the third direction is the thickness direction of the pressing member 30.

[0082] In some embodiments, in the first assembly state, the top surface of the constraint member 20 is not lower than the top surface of the chip 61.

[0083] In this embodiment, when the assembly unit 60 passes through the constraint member 20 and falls into the receiving groove 11 of the carrier 10, the higher constraint member 20 can play a blocking and limiting role, further preventing the assembly unit 60 from jumping out of the carrier 10 and improving the success rate of material unloading.

[0084] In some embodiments, such as Figures 2-3As shown, the through groove 21 includes a groove wall and a groove space. Along the thickness direction of the constraint member 20, the groove wall is at least partially inclined to form a guide portion 210, so that the opening area of ​​the through groove 21 away from the carrier 10 is larger than the opening area of ​​the end closer to the carrier 10.

[0085] In this embodiment, the through groove 21 is similar to a trumpet shape with inclined sidewalls, so that the combined unit 60 falls into the receiving groove 11 of the carrier 10 under the action of gravity and guided by the inclined sidewalls, thereby improving the success rate of material feeding.

[0086] Based on the same inventive concept, this application also provides a method for using the tooling component as provided in any of the foregoing embodiments, the flowchart of which is shown below. Figure 14 As shown, the method includes steps S101 to S102: S101: Place the stacked carrier 10 and constraint 20 at the unloading point of the chip mounting station to receive the assembly unit 60, so that the fixed assembly unit 60 passes through the through slot 21 of the constraint 20 and falls into the receiving slot 11. Take out the carrier 10 and constraint 20 containing the assembly unit 60 and transport them to the wire bonding station.

[0087] S102: Replace the constraint 20 with the clamping member 30. The carrier 10 and the clamping member 30 clamp the combined unit 60 inside for wire bonding.

[0088] This embodiment uses the tooling components provided in any of the preceding embodiments, and their technical principles and effects are similar, so they will not be described again here. In this embodiment, the tooling components are assembled into a first assembly state and placed at the material unloading point of the pick-and-place machine to receive the assembly unit 60. Then, the constraint member 20 is replaced with the pressing member 30, so that the tooling components are in a second assembly state, clamping the assembly unit 60, and performing wire bonding operations on the assembly unit 60.

[0089] In some embodiments, step S101 above, which involves placing the stacked carrier 10 and constraint member 20 at the placement station unloading area receiving assembly unit 60, includes the following steps: The carrier 10 and the constraint 20 are stacked in the groove 41 of the tray 40 and placed at the unloading point of the patch station.

[0090] Furthermore, in step S102 above, the constraint member 20 is replaced with the clamping member 30, and the carrier 10 and the clamping member 30 clamp the assembly unit 60 for wire bonding, including the following steps: The pressing member 30 is positioned above the constraint member 20, such that the multiple pressing protrusions 33 of the pressing member 30 abut against the multiple bases 62 in a one-to-one correspondence, and the bottom surface of the pressing member 30 and the top surface of the constraint member 20 are spaced apart by h.

[0091] Move the constraint member 20 upward so that it contacts the pressing member 30, remove the contacting constraint member 20 and pressing member 30 at the same time, then place the pressing member 30 above the carrier 10 and fix it to the carrier 10, clamp the assembly unit 60, remove the fixed carrier 10 and pressing member 30 from the tray 40, put them into the spring clip, and send them to the wire bonding station for wire bonding.

[0092] In this embodiment, a tray 40 is used at the bonding station to carry the carrier 10 and the constraint member 20 for receiving the assembly unit 60 and transporting it to the wire bonding station. Upon arrival at the wire bonding station, the constraint member 20 is first replaced with a pressing member 30 in the tray 40 to ensure a stable connection between the pressing member 30 and the carrier 10. Then, the fixed carrier 10 and pressing member 30 are removed, placed in a clip, and sent to the wire bonding station for wire bonding.

[0093] Furthermore, during the process of replacing the constraint member 20 with the pressing member 30, the pressing member 30 can first be placed above the constraint member 20, so that the pressing protrusion 33 and the base 62 abut against each other one by one, providing a pre-pressurizing force to the combined unit 60. Then, the constraint member 20 is moved up so that the top surface of the constraint member 20 contacts the bottom surface of the pressing member 30. Then, the pressing member 30 and the constraint member 20 are taken out simultaneously with the pressing member facing upwards, and the base 62 will remain in the receiving groove 11. Finally, the pressing member 30 is placed above the carrier 10 so that the carrier 10 and the pressing member 30 clamp the combined unit 60, completing the replacement operation of the constraint member 20 and the pressing member 30.

[0094] The above-mentioned step of placing the pressing member 30 above the carrier 10 may further include: placing the side of the pressing member 30 with the pressing protrusion 33 facing the carrier 10, and adsorbing and fixing it with the protruding magnetic member 12; or, placing the side of the pressing member 30 with the pressing protrusion 33 facing away from the carrier 10, that is, the side of the pressing member 30 without the pressing protrusion 33 is flat, and pressing the side of the pressing member 30 without the pressing protrusion 33 above the multiple bases 62, and adsorbing and fixing it with the magnetic member 12. These two placement methods can respectively adapt to the protruding magnetic member 12 and the non-protruding magnetic member 12, further improving the flexibility and adaptability of this application. Those skilled in the art will understand that the spring clip is a tool used in the wire bonding machine by the wire bonding station. After the tooling assembly clamps the assembly unit 60, the spring clip is placed in it, and then the whole assembly is placed into the wire bonding machine for wire bonding.

[0095] It should be noted that the assembly unit 60 includes two types: a verification product and an order product. When manufacturing a verification product, one magazine holds only one tooling component in the second assembly state. When manufacturing an order product, one magazine can hold multiple tooling components in the second assembly state.

[0096] The method of this application also includes: when manufacturing order products, after the wire bonding is completed, the tooling assembly is placed in the magazine and transported to the next station; when manufacturing verification products, after the wire bonding is completed, the tooling assembly is placed in the tray 40, the cover plate 50 is closed, and it is transported to the next station.

[0097] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of their technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A tooling assembly for limiting an assembly unit (60), the assembly unit (60) comprising a chip (61) and a base (62) fixedly connected, characterized in that, include: The carrier (10) has at least one receiving groove (11) on one side; The constraint member (20) has at least one through groove (21) extending through its thickness direction, the through groove (21) including a guide portion (210). The press-fitting member (30) has at least one window (31) extending through its thickness direction. The opening area of ​​the through groove (21) is not less than the opening area of ​​the receiving groove (11), and the opening area of ​​the window (31) is less than the opening area of ​​the receiving groove (11). The tooling assembly includes at least two assembly states; The first assembly state is used to receive the combined unit (60) and transport it to the bonding station; in the first assembly state, the carrier (10) and the constraint member (20) are stacked along the first direction, the through slot (21) corresponds one-to-one with the receiving slot (11), the guide part (210) is used to guide the combined unit (60) to pass through the through slot (21) one-to-one and fall into the receiving slot (11), and the top surface of the carrier (10) is not higher than the top surface of the base (62); The second assembly configuration is to replace the constraint (20) of the first assembly configuration with the pressing member (30) at the wire bonding station, so that the carrier (10) and the pressing member (30) clamp the combined unit (60) for wire bonding; the window (31) corresponds one-to-one with the through slot (21), exposing the chip (61) and part of the base (62) of the combined unit (60) in the corresponding through slot (21).

2. The tooling assembly according to claim 1, characterized in that, The pressing member (30) has a pressing protrusion (33) on one side at the edge of the window (31); When the constraint member (20) is replaced with the pressing member (30), the pressing member (30) is positioned above the constraint member (20), such that the plurality of pressing protrusions (33) abut against the plurality of bases (62) one by one, and the bottom surface of the pressing member (30) is spaced from the top surface of the constraint member (20); the constraint member (20) is moved up to contact the pressing member (30), the contacting constraint member (20) and the pressing member (30) are removed at the same time, and the pressing member (30) is then positioned above the carrier (10) to clamp the combined unit (60).

3. The tooling assembly according to claim 1, characterized in that, The tooling assembly also includes: a tray (40) and a cover plate (50); The tray (40) has a groove (41) on its surface; in the first assembly state, the carrier (10) and the constraint member (20) are both accommodated in the groove (41); the tooling assembly also includes a third assembly state for handling the combined unit (60) after welding; in the third assembly state, the carrier (10) and the pressing member (30) clamp the combined unit (60) after welding and place it in the groove (41), and the edge of the cover plate (50) overlaps the edge of the tray (40).

4. The tooling assembly according to claim 1, characterized in that, The carrier (10) includes: a carrier body (101) and a magnetic component (12), wherein the magnetic component (12) is magnetically connected to the pressing component (30); The magnetic component (12) is adjustablely connected to the carrier body (101) along the first direction, and the magnetic component (12) is in contact with the pressing component (30) or has a designed spacing.

5. The tooling assembly according to claim 4, characterized in that, The carrier body (101) has a mounting hole (13); the magnetic element (12) is connected to the bottom of the mounting hole (13) by an elastic element (14); when the magnetic element (12) provides magnetic attraction to the pressing element (30), the maximum thickness of the magnetic element (12) protruding from the carrier body (101) does not exceed the thickness of the base (62) protruding from the carrier body (101); At least one of the inner peripheral wall of the mounting hole (13) and the outer peripheral wall of the magnetic component (12) has a guide groove (15) extending along the first direction, and the other has a guide protrusion (16), wherein the guide groove (15) and the guide protrusion (16) are slidably connected. When the guide groove (15) is disposed on the inner peripheral wall of the mounting hole (13), the end facing the pressing member (30) is closed; when the guide groove (15) is disposed on the outer peripheral wall of the magnetic member (12), the end away from the pressing member (30) is closed. And / or, when the magnetic element (12) adsorbs the pressing element (30), the elastic element (14) is in a stretched state.

6. The tooling assembly according to claim 4, characterized in that, The inner peripheral wall of the mounting hole (13) of the carrier body (101) is threadedly connected to the outer peripheral wall of the magnetic component (12), and the axis of the threaded connection is parallel to the first direction.

7. The tooling assembly according to claim 1, characterized in that, It also includes at least one of the following: Along the second direction, the window (31) includes a first region (311), a middle region (312), and a second region (313); the dimensions of the first region (311), the middle region (312), and the second region (313) increase sequentially along the third direction, so that the dimensions of the exposed assembly unit increase sequentially along the third direction, and so that the second region (313) exposes the identification character (620) of the base (62); the second direction intersects with the third direction and is perpendicular to the first direction; In the first assembly state, the top surface of the constraint member (20) is not lower than the top surface of the chip (61); The through groove (21) includes a groove wall and a groove space. Along the thickness direction of the constraint member (20), the groove wall is at least partially inclined to form the guide portion (210), so that the opening area of ​​the through groove (21) away from the carrier (10) is larger than the opening area close to the carrier (10).

8. The tooling assembly according to claim 3, characterized in that, It also includes at least one of the following: In the first assembly state, the top surface of the tray (40) is higher than the constraint member (20); the side wall at the opening of the groove (41) has a first inclined surface (411) that is inclined outward from the groove (41), and the outer peripheral wall of the constraint member (20) has a second inclined surface (23) that is inclined inward from the groove (41). The middle region of the carrier (10) is thicker than the edge region of the carrier (10); on a plane perpendicular to the first direction, the constraint member (20) and the pressing member (30) have the same size and correspond to the middle region of the carrier (10) along the first direction. The outer periphery of the tray (40) has a stepped structure (42), and the edge of the cover plate overlaps the stepped structure (42).

9. A method of using a tooling assembly as described in any one of claims 1-8, characterized in that, include: The stacked carrier (10) and constraint (20) are placed at the unloading point of the chip bonding station to receive the assembly unit (60), so that the fixed assembly unit (60) passes through the through slot (21) of the constraint (20) and falls into the receiving slot (11). The carrier (10) and constraint (20) receiving the assembly unit (60) are taken out and transported to the wire bonding station. The constraint member (20) is replaced with a pressing member (30), and the carrier (10) and the pressing member (30) clamp the combined unit (60) inside for wire bonding.

10. The method of use according to claim 9, characterized in that, The stacked carrier (10) and constraint (20) are placed at the unloading point of the patch station to receive and assemble the unit (60), including: The carrier (10) and the constraint (20) are stacked in the groove (41) of the tray (40) and placed at the unloading point of the patch station; And, replacing the constraint member (20) with a clamping member (30), wherein the carrier (10) and the clamping member (30) clamp the assembly unit (60) for wire bonding, including: The pressing member (30) is placed above the constraint member (20), such that the pressing protrusion (33) of the pressing member (30) abuts against the plurality of bases (62) one by one, and the bottom surface of the pressing member (30) is spaced from the top surface of the constraint member (20). Move the constraint member (20) upward so that it contacts the pressing member (30), remove the contacting constraint member (20) and the pressing member (30) at the same time, then place the pressing member (30) above the carrier (10) and fix it to the carrier (10), clamp the assembly unit (60), remove the fixed carrier (10) and the pressing member (30) from the tray (40), put them into the spring clip, and send them to the wire bonding station for wire bonding.

Images