An optical module

Abstract

The optical module provided by the present disclosure comprises: a circuit board provided with a first mounting hole; a mounting seat, the projection of which in the direction of the circuit board covers the first mounting hole; an optical emitting component located in the first mounting hole; the optical emitting component comprises: a light emitting assembly arranged on the mounting seat and close to the edge of the first mounting hole; the light emitting assembly generates a plurality of light signals; an optical coupling assembly arranged on the mounting seat and located on the output light path of the light emitting assembly; the optical coupling assembly comprises: a waveguide part comprising a base body and a coupling waveguide and a plurality of beam combining waveguides located on the base body, one end of the coupling waveguide extending to the end of one end of the base body, the other end of the coupling waveguide connected to one end of the beam combining waveguide, and the other end of the beam combining waveguide extending to the end of the other end of the base body; an optical fiber connecting part located at one end of the waveguide part; the optical fiber connecting part is connected to a first optical fiber, and the end of the optical fiber connecting part is connected to one end of the waveguide part, so that the first optical fiber is optically connected to the coupling waveguide. It is convenient to adapt to the high-speed development demand of the optical module.

Description

Technical Field

[0001] This disclosure relates to the field of optical communication technology, and in particular to an optical module. Background Technology

[0002] With the development of new business and application models such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are the tools for converting between photoelectric signals and signals, and are one of the key components in optical communication equipment. Furthermore, with the evolving needs of optical communication technology, the transmission rate of optical modules is constantly increasing. In some optical modules, high-transmission-rate modules have higher integration density than low-transmission-rate modules, such as using multi-channel optical transceiver technology to achieve the transmission and reception of multi-wavelength optical signals. Summary of the Invention

[0003] Some embodiments provide an optical module that is easy to adapt to the high-speed development of optical modules.

[0004] Some embodiments provide an optical module, including:

[0005] The circuit board has a first mounting hole;

[0006] A mounting base is located on the back of the circuit board; the projection of the mounting base in the direction of the circuit board covers the first mounting hole;

[0007] The light emitting component is located inside the first mounting hole;

[0008] Wherein; the light emitting component includes:

[0009] A light-emitting component is disposed on the mounting base and near the edge of the first mounting hole; the light-emitting component generates multiple light signals.

[0010] An optical coupling component is disposed on the mounting base in the output optical path of the light-emitting component; the optical coupling component includes:

[0011] A waveguide section includes a substrate and a coupling waveguide and a plurality of beam combiners located on the substrate. One end of the coupling waveguide extends to one end of the substrate, and the other end of the coupling waveguide is connected to one end of the beam combiners, which extends to the other end of the substrate.

[0012] An optical fiber connector is located at one end of the waveguide portion; the optical fiber connector is connected to a first optical fiber, and the end of the optical fiber connector is connected to one end of the waveguide portion, so that the first optical fiber is optically connected to the coupling waveguide.

[0013] One of the above technical solutions has the following advantages or beneficial effects: a first mounting hole is formed on the circuit board, and a mounting base is provided on the back of the circuit board. The projection of the mounting base in the direction of the circuit board covers the first mounting hole. The mounting base supports the light emitting component, so that the light emitting component is located within the first mounting hole. The mounting base and the first mounting hole facilitate the installation of the light emitting component within the optical module. The light emitting component includes a light-emitting element and an optical coupling element, and the optical coupling element is located on the output optical path of the light-emitting element. The optical coupling element includes an optical fiber connector and a waveguide element, and the optical fiber connector connects the first optical fiber and the waveguide element. The waveguide element includes a substrate, on which a coupling waveguide and multiple bundled waveguides are disposed. One end of the coupling waveguide extends to one end of the substrate, and the other end of the coupling waveguide connects to one end of the multiple bundled waveguides. The other ends of the multiple bundled waveguides extend to the other end of the substrate. The light-emitting component can generate multiple optical signals, which are transmitted to the end of the substrate and coupled to a combining waveguide. Each optical signal is transmitted along a combining waveguide to a coupling waveguide, and finally coupled to the first optical fiber via the coupling waveguide, thus realizing the output of multiple optical signals to the optical module through a single optical fiber. In this embodiment, an optical coupling component is used to multiplex multiple optical signals into a single optical signal. Some conventional optical emitting components use wavelength division multiplexing (WDM) components to multiplex multiple optical signals into a single optical signal. Compared to WDM components, the optical coupling component eliminates the need for a dual-lens system, reducing the complexity of devices in the emitting optical path, facilitating the assembly of the optical emitting component, and adapting to the high-speed development of optical modules.

[0014] In some embodiments, an optical module is provided, including: a plurality of beam-splitting waveguides are further disposed on the substrate, one end of the beam-splitting waveguides extends to one end of the substrate, and the other end of the beam-splitting waveguides is correspondingly connected to the beam-combining waveguide;

[0015] The light emitting component also includes:

[0016] An optical detection component is disposed on the mounting base; the optical detection component is located near the edge of the first mounting hole, and the optical detection component is located at the edge of one end of the beam splitter waveguide and on the output optical path of the beam splitter waveguide.

[0017] One of the above technical solutions has the following advantages or beneficial effects: Multiple beam-splitting waveguides are further disposed on the substrate, with one end of each beam-splitting waveguide extending to one end of the substrate, and the other end of each beam-splitting waveguide correspondingly connected to a beam-combining waveguide. Each beam-splitting waveguide can split the optical signal transmitted on the corresponding beam-combining waveguide. The optical transmitting component also includes an optical detection component, which is disposed on a mounting base near the edge of the first mounting hole, facilitating the electrical connection of the optical receiving component to the circuit board. The optical detection component is located at the edge of one end of the beam-splitting waveguide and on the output optical path of the beam-splitting waveguide, enabling it to receive the optical signal split and output by the beam-splitting waveguide. The optical signal received by the optical detection component is the optical signal split from the beam-combining waveguide by the beam-splitting waveguide, ensuring that the optical signal received by the optical detection component and the optical signal coupled to the first optical fiber have the same optical path before transmission to the optical coupling component. This allows the optical signal detection to take into account the influence of the optical signal transmission path, improving the accuracy of transmitted optical power monitoring. When the laser in the light-emitting component has no backlight, the detection of optical signals can be easily achieved by setting multiple beam-splitting waveguides on the substrate and setting an optical detection component at one end of the beam-splitting waveguides.

[0018] In some embodiments, an optical module is provided, wherein the optical detection component includes:

[0019] A substrate with pads on its top; the pads extend to the sides of the substrate.

[0020] A photodetector is disposed on the side of the substrate and located at the edge of the pad; the photodetector is electrically connected to the pad and the end of the photodetector faces the beam splitter waveguide;

[0021] The base has a bottom connected to the mounting base and a top support connected to the bottom of the substrate.

[0022] One of the above technical solutions has the following advantages or beneficial effects: The optical detection assembly includes a substrate, a photodetector, and a base. A pad is provided on the top of the substrate, extending to the side of the substrate. The photodetector is located on the side of the substrate and next to the pad, electrically connected to the pad. The substrate is close to the edge of the circuit board, facilitating electrical connection between the photodetector and the circuit board. The end of the photodetector faces the beam splitter waveguide, facilitating the photodetector to receive the optical signal output from the beam splitter waveguide. The bottom of the base is connected to a mounting base, and the top of the base supports and connects to the bottom of the substrate, facilitating assembly connection between the substrate and the mounting base.

[0023] In some embodiments, an optical module is provided, wherein the mounting base includes a first mounting portion and a second mounting portion, one end of the first mounting portion protrudes beyond one end of the second mounting portion, and the other end of the second mounting portion protrudes beyond the other end of the first mounting portion;

[0024] The optical module also includes an optical receiving component, and the circuit board is further provided with a second mounting hole. A partition is provided between the first mounting hole and the second mounting hole, and a circuit is provided on the partition.

[0025] The projection of the first mounting part in the direction of the circuit board covers the first mounting hole, and the projection of the second mounting part in the direction of the circuit board covers the second mounting hole.

[0026] One of the above technical solutions has the following advantages or beneficial effects: The mounting base includes a first mounting part and a second mounting part, and a second mounting hole is also provided on the circuit board. The first mounting part supports and connects the light emitting component, so that the light emitting component is located in the first mounting hole; the second mounting part supports and connects the light receiving component, so that the light receiving component is located in the second mounting hole. The light emitting component is mounted on the mounting base, so that the devices in the light emitting component are located on the same structural component, which facilitates ensuring the stability of the emitted optical path. The light receiving component is mounted on the mounting base, so that the devices in the light receiving component are located on the same structural component, which facilitates ensuring the stability of the received optical path. The light emitting component and the light receiving component share the mounting base, while using independent mounting bases for the light emitting component and the light receiving component respectively, which facilitates reducing the size of the mounting base. One end of the first mounting part protrudes from one end of the second mounting part, and the other end of the second mounting part protrudes from the other end of the first mounting part, which facilitates the misalignment of the devices in the light emitting component and the devices in the light receiving component. A partition is provided between the second mounting hole and the first mounting hole. Circuitry is provided on the partition, which facilitates providing sufficient circuit boards to ensure the circuit layout requirements in the optical module.

[0027] In some embodiments, an optical module is provided, wherein a first support platform and a second support platform are formed on the top of the first mounting portion, and a gap is provided between the first support platform and the second support platform;

[0028] The first support platform supports and connects the light-emitting component, and the second support platform supports and connects the optical coupling component.

[0029] One of the above technical solutions has the following advantages or beneficial effects: A first support platform and a second support platform are formed on the top of the first mounting portion. The first support platform supports and connects the light-emitting component, and the second support platform supports the optical coupling component, facilitating the adjustment of the relative height between the light-emitting component and the optical coupling component using the first and second support platforms. Furthermore, when the light-emitting component, the optical coupling component, and the mounting base are bonded with adhesive, the first and second support platforms facilitate control over the amount of adhesive used, thereby facilitating the control of the stability of the emitted light path.

[0030] In some embodiments, an optical module is provided, wherein the optical emitting component further includes:

[0031] A transmitting base is disposed on the first support platform and supports the light-emitting component;

[0032] A collimating lens group is disposed on the emitting base and located in the output optical path of the light-emitting component;

[0033] An isolator assembly is mounted on the second support platform, located on the side of the other end of the waveguide section.

[0034] One of the above technical solutions has the following advantages or beneficial effects: The light emitting component also includes an emitting base, and the light-emitting component is mounted on the emitting base. A mounting base is connected to the emitting base, facilitating the assembly and connection of the light-emitting component and the mounting base. A collimating lens group is also provided on the emitting base. The collimating lens group is located on the output optical path of the light-emitting component and is used to collimate the light signal generated by the light-emitting component, ensuring the stability of the optical path from the light-emitting component to the optical coupling component. An isolator group is also provided on the second support platform. The isolator group is located on the side of the other end of the waveguide. The light signal collimated by the collimating lens group is transmitted to the isolator group, and then transmitted to the optical coupling component after passing through the isolator group. The isolator group is used to pass the light signal incident from one side of the isolator group and isolate the light signal incident from the other side of the isolator group, reducing the light signal reflected back from the other end of the optical coupling component from returning to the incident optical path on the side of the isolator group.

[0035] In some embodiments, an optical module is provided in which the other end of the optical fiber connector has a first inclined surface, the first inclined surface is connected to the waveguide, and the inclination angle of the first inclined surface is 2-10°.

[0036] The other end of the waveguide has a second inclined surface, the inclination angle of which is 2-10°.

[0037] One of the above technical solutions has the following advantages or beneficial effects: A first inclined surface is formed at the other end of the optical fiber connector. This first inclined surface allows the end of the first optical fiber to be tilted, which helps reduce the reflection of the optical signal from the end face of the first optical fiber back into the coupling waveguide during the coupling transmission from the coupling waveguide to the first optical fiber. A second inclined surface is formed at the other end of the waveguide. This second inclined surface allows the end of the other end of the combining waveguide to be tilted, which helps reduce the reflection of the optical signal from the end of the combining waveguide into the incident optical path.

[0038] In some embodiments, an optical module is provided in which a third support platform and a fourth support platform are formed on the top of the second mounting portion, and there is a gap between the third support platform and the fourth support platform;

[0039] The optical receiving component includes an optical receiving assembly and a beam splitter assembly; the optical receiving assembly is disposed on the third support platform, and the beam splitter assembly is disposed on the fourth support platform; one end of the beam splitter assembly is connected to a second optical fiber, and the other end of the beam splitter assembly is located above the optical receiving assembly.

[0040] One of the above technical solutions has the following advantages or beneficial effects: a third support platform and a fourth support platform are formed on the second mounting part. The third support platform supports the connected optical receiving component, and the fourth support platform supports the beam splitting component, facilitating the adjustment of the relative height between the optical receiving component and the beam splitting component using the third and fourth support platforms. Furthermore, when the optical receiving component and the beam splitting component are bonded to the mounting base with adhesive, the third and fourth support platforms facilitate control over the amount of adhesive used during bonding, thereby ensuring the stability of the receiving optical path.

[0041] In some embodiments, an optical module is provided, wherein a first recess and a second recess are further formed on the circuit board;

[0042] The first recess is located at one end of the first mounting hole, and the first recess avoids the first optical fiber; the second recess is located at one end of the second mounting hole, and the second recess avoids the second optical fiber.

[0043] One of the above technical solutions has the following advantages or beneficial effects: a first recess is formed at one end of the first mounting hole to avoid the first optical fiber, thereby reducing the risk of damage to the first optical fiber caused by excessive bending. A second recess is formed at one end of the second mounting hole to avoid the second optical fiber, thereby reducing the risk of damage to the second optical fiber caused by excessive bending.

[0044] Some embodiments provide an optical module, including:

[0045] The circuit board has a first mounting hole and a second mounting hole, and a partition is formed between the first mounting hole and the second mounting hole.

[0046] The mounting base is located on the back of the circuit board; the projection of the mounting base in the direction of the circuit board covers the first mounting hole and the second mounting hole;

[0047] The light emitting component is located inside the first mounting hole;

[0048] The optical receiving component is located inside the second mounting hole;

[0049] Wherein; the light emitting component includes:

[0050] A light-emitting component is disposed on the mounting base and near the edge of the first mounting hole; the light-emitting component generates multiple light signals.

[0051] An optical coupling component is disposed on the mounting base in the output optical path of the light-emitting component; the optical coupling component includes:

[0052] A waveguide section includes a substrate and a coupling waveguide and a plurality of beam combiners located on the substrate. One end of the coupling waveguide extends to one end of the substrate, and the other end of the coupling waveguide is connected to one end of the beam combiners, which extends to the other end of the substrate.

[0053] An optical fiber connector is located at one end of the waveguide portion; the optical fiber connector is connected to a first optical fiber, and the end of the optical fiber connector is connected to one end of the waveguide portion, so that the first optical fiber is optically connected to the coupling waveguide.

[0054] One of the above technical solutions has the following advantages or beneficial effects: A first mounting hole and a second mounting hole are provided on the circuit board, and a mounting base is provided on the back of the circuit board. The projection of the mounting base in the circuit board direction covers the first mounting hole and the second mounting hole. The mounting base supports and connects the optical emitting component and the optical receiving component, placing the optical emitting component within the first mounting hole and the optical receiving component within the second mounting hole. The mounting base, the first mounting hole, and the second mounting hole facilitate the installation of the optical emitting component and the optical receiving component within the optical module. The optical emitting component includes a light-emitting element and an optical coupling element, with the optical coupling element located on the output optical path of the light-emitting component. The optical coupling element includes an optical fiber connector and a waveguide, with the optical fiber connector connecting the first optical fiber and the waveguide. The waveguide includes a substrate, on which a coupling waveguide and multiple bundled waveguides are disposed. One end of the coupling waveguide extends to one end of the substrate, and the other end of the coupling waveguide connects to one end of the multiple bundled waveguides, which extend to the other end of the substrate. The light-emitting component can generate multiple optical signals, which are transmitted to the end of the substrate and coupled to a combining waveguide. Each optical signal is transmitted along a combining waveguide to a coupling waveguide, and finally coupled to the first optical fiber via the coupling waveguide, thus realizing the output of multiple optical signals to the optical module through a single optical fiber. In this embodiment, an optical coupling component is used to multiplex multiple optical signals into a single optical signal. Some conventional optical emitting components use wavelength division multiplexing (WDM) components to multiplex multiple optical signals into a single optical signal. Compared to WDM components, the optical coupling component eliminates the need for a dual-lens system, reducing the complexity of devices in the emitting optical path, facilitating the assembly of the optical emitting component, and adapting to the high-speed development of optical modules. Attached Figure Description

[0055] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are merely drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. Furthermore, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0056] Figure 1 This is a partial architecture diagram of an optical communication system according to some embodiments;

[0057] Figure 2 This is a partial structural diagram of a host computer according to some embodiments;

[0058] Figure 3 This is a structural diagram of an optical module according to some embodiments;

[0059] Figure 4 An exploded view of an optical module according to some embodiments;

[0060] Figure 5 This is an internal structural diagram of an optical module according to some embodiments;

[0061] Figure 6A This is a schematic diagram of the assembly of an optical emitting component, an optical receiving component, and a circuit board according to some embodiments;

[0062] Figure 6B This is an exploded internal view of an optical module according to some embodiments;

[0063] Figure 7A This is an assembly diagram of an optical emitting component and an optical receiving component according to some embodiments;

[0064] Figure 7B This is an exploded schematic diagram of an optical emitting component and an optical receiving component according to some embodiments;

[0065] Figure 8A This is a structural diagram of a mounting base according to some embodiments;

[0066] Figure 8B A cross-sectional view of the use of a mounting base according to some embodiments. Figure 1 ;

[0067] Figure 8C A cross-sectional view of the use of a mounting base according to some embodiments. Figure 2 ;

[0068] Figure 8D A cross-sectional view of the use of a mounting base according to some embodiments. Figure 3;

[0069] Figure 8E A cross-sectional view of the use of a mounting base according to some embodiments. Figure 4 ;

[0070] Figure 8F A cross-sectional view of the use of a mounting base according to some embodiments. Figure 5 ;

[0071] Figure 9 This is a partial schematic diagram of the internal structure of an optical module according to some embodiments;

[0072] Figure 10A The structure of an optical coupling component according to some embodiments Figure 1 ;

[0073] Figure 10B Structure of an optical coupling component according to some embodiments Figure 2 ;

[0074] Figure 10C This is a partial schematic diagram of an optical coupling component according to some embodiments;

[0075] Figure 11 This is a partial structural schematic diagram of a light emitting component according to some embodiments;

[0076] Figure 12A Structure of a laser according to some embodiments Figure 1 ;

[0077] Figure 12B Structure of a laser according to some embodiments Figure 2 . Detailed Implementation

[0078] The embodiments of this disclosure will now be described clearly and in detail with reference to the accompanying drawings. However, the described embodiments are merely some, and not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0079] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and inclusive, meaning "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or indicating an upper limit on the number; the term "multiple" means two or more; the term "connection" should be interpreted broadly, for example, "connection" can be a fixed connection, a detachable connection, or an integral part, and can be a direct connection or an indirect connection through an intermediate medium; the use of the terms "applicable to" or "configured to" implies open and inclusive language, which does not exclude applicability to or configuration to devices performing additional tasks or steps; descriptions such as "parallel," "perpendicular," "identical," "consistent," and "aligned" are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges arising in practice, and differences based on the same design concept but due to manufacturing reasons.

[0080] In optical communication technology, to establish information transmission between information processing devices, information needs to be loaded onto light, and the propagation of light is used to transmit the information. Here, the light carrying the information is called an optical signal. When optical signals are transmitted in information transmission equipment, optical power loss can be reduced, thus enabling high-speed, long-distance, and low-cost information transmission. Information processing devices can recognize and process electrical signals. Information processing devices typically include optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., while information transmission equipment typically includes optical fibers and optical waveguides.

[0081] An optical module enables the conversion between optical and electrical signals between information processing and transmission devices. For example, at least one of the optical signal input or output ports of the optical module is connected to an optical fiber, and at least one of the electrical signal input or output ports is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts it into a first electrical signal and transmits it to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts it into a second optical signal and transmits it back to the optical fiber. Since multiple information processing devices can transmit information via electrical signals, at least one of the devices needs to be directly connected to the optical module, rather than all devices. Here, the information processing device directly connected to the optical module is referred to as the host computer of the optical module. Furthermore, the optical signal input or output port of the optical module can be referred to as an optical port, and the electrical signal input or output port can be referred to as an electrical port.

[0082] Figure 1 This is a partial structural diagram of an optical communication system according to some embodiments of the present disclosure. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0083] One end of optical fiber 101 extends toward the remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. The optical signal can undergo total internal reflection in optical fiber 101, and the propagation of the optical signal in the direction of total internal reflection can almost maintain the original optical power. The optical signal undergoes multiple total internal reflections in optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to optical module 200, or to transmit the optical signal from optical module 200 to remote information processing device 1000, thereby realizing long-distance, low-power loss information transmission.

[0084] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0085] The host computer 100 includes a generally rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 so that the host computer 100 and the optical module 200 can establish a one-way or two-way electrical signal connection.

[0086] The host computer 100 also includes an external power interface that can connect to an electrical signal network. For example, this external power interface includes a Universal Serial Bus (USB) interface or a network cable interface 104, which is configured to connect a network cable 103 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, thereby establishing an electrical signal connection between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. This second electrical signal from the host computer 100 is transmitted to the optical module 200, which converts the second electrical signal into a second optical signal and transmits it to the optical fiber 101. The second optical signal is then transmitted in the optical fiber 101 to the remote information processing device 1000. Alternatively, a first optical signal from the remote information processing device 1000 propagates through the optical fiber 101 and is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal and transmits it to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that an optical module is a tool for converting optical signals to electrical signals. During the conversion process, the information itself does not change, but the encoding and decoding methods can change.

[0087] In addition to optical network terminals, the host computer 100 also includes optical line terminals (OLTs), optical network equipment (ONTs), or data center servers.

[0088] Figure 2 This is a partial structural diagram of a host computer according to some embodiments of the present disclosure. To clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. For example... Figure 2 As shown, the host computer 100 also includes a PCB circuit board 105 disposed within the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has fins and other protruding structures to increase the heat dissipation area.

[0089] The optical module 200 is inserted into the cage 106 of the host computer 100, where it is secured. Heat generated by the optical module 200 is conducted to the cage 106 and then dissipated through the heat sink 107. After insertion into the cage 106, the optical module 200's electrical port connects to the electrical connector inside the cage 106, establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0090] Figure 3 This is a structural diagram of an optical module according to some embodiments of the present disclosure. Figure 4 This is an exploded view of an optical module according to some embodiments of the present disclosure. Figure 3 and Figure 4 As shown, the optical module 200 includes a shell, a circuit board 300 disposed within the shell, a light emitting component 400, and a light receiving component 500. However, this disclosure is not limited thereto; in some embodiments, the optical module 200 includes one of the light emitting component 400 and the light receiving component 500.

[0091] The housing includes an upper housing 201 and a lower housing 202, with the upper housing 201 covering the lower housing 202 to form the aforementioned housing having two openings 203 and 204; the outer contour of the housing is generally square.

[0092] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower housing 202 to form the aforementioned housing.

[0093] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to realize that the upper housing 201 covers the lower housing 202.

[0094] The direction of the line connecting the two openings 203 and 204 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 203 is located at the end of the optical module 200. Figure 3 The opening 204 is located at the end of the optical module 200 (left end). Figure 3(The right end). Alternatively, opening 203 is located at the end of optical module 200, while opening 204 is located on the side of optical module 200. Opening 203 is an electrical port, from which the end of circuit board 300 extends and is inserted into the electrical connector of host computer 100; opening 204 is an optical port, configured to connect to external optical fiber 101 so that optical fiber 101 connects optical emitting component 400 and optical receiving component 500 in optical module 200.

[0095] The assembly method using an upper housing 201 and a lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, etc., into the aforementioned housings. The upper housing 201 and the lower housing 202 can encapsulate and protect these devices. Furthermore, the assembly of the circuit board 300, the light emitting component 400, and the light receiving component 500 facilitates the deployment of positioning components, heat dissipation components, and electromagnetic shielding components for these devices, which is beneficial for automated production.

[0096] In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0097] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to establish a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0098] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a locking component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the locking component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the locking component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the fixation between the optical module 200 and the host computer, thereby allowing the optical module 200 to be pulled out of the cage 106.

[0099] Circuit board 300 includes circuit traces, electronic components, and chips. The circuit traces connect the electronic components and chips according to the circuit design to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0100] Circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also perform a load-bearing function. For example, the rigid circuit board can stably support the aforementioned electronic components and chips. The rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0101] The circuit board 300 also includes gold fingers formed on its end surfaces, each gold finger consisting of a plurality of independent pins. The circuit board 300 is inserted into a cage 106 and is electrically connected to an electrical connector within the cage 106 by the gold fingers. The gold fingers may be located only on one side of the surface of the circuit board 300 (e.g., ...). Figure 4 The upper surface shown can also be positioned on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thus adapting to applications with high pin count requirements. The gold fingers are configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards.

[0102] The light emitting component 400 is used to receive electrical signals transmitted from the circuit board 300, so that the light emitting component 400 generates light signals; the light receiving component 500 is used to receive light signals input from outside the optical module and convert them into electrical signals. At least one of the light emitting component 400 or the light receiving component 500 is located on the side of the circuit board 300 away from the gold fingers.

[0103] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0104] In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 may be directly disposed on the circuit board 300. For example, at least one of the light emitting component 400 or the light receiving component 500 may be disposed on the surface of the circuit board 300 or the side of the circuit board 300.

[0105] In some embodiments, the optical module 200 further includes a first fiber optic adapter 205 and a second fiber optic adapter 206. The optical transmitting component 400 is connected to the first fiber optic adapter 205 via a first optical fiber 207, and the optical receiving component 500 is connected to the second fiber optic adapter 206 via a second optical fiber 208.

[0106] Figure 5 This is an internal structural diagram of an optical module according to some embodiments. Figure 5 As shown, in some embodiments, the circuit board 300 has mounting holes, and the light emitting component 400 and the light receiving component 500 can be located within the mounting holes. The light emitting component 400 is located on the side of the light receiving component 500.

[0107] Figure 6A This is a schematic diagram of the assembly of a light emitting component, a light receiving component, and a circuit board according to some embodiments. Figure 6B This is an exploded internal view of an optical module according to some embodiments. Figure 6A and Figure 6B As shown, in some embodiments, the circuit board 300 has a first mounting hole 310 and a second mounting hole 320. A light emitting component 400 is disposed in the first mounting hole 310, and a light receiving component 500 is disposed in the second mounting hole 320.

[0108] In some embodiments, the second mounting hole 320 is located on the side of the first mounting hole 310, and a partition 330 is formed between the second mounting hole 320 and the first mounting hole 310, on which circuit traces can be routed. Exemplarily, the partition 330 extends along the length direction of the circuit board 300.

[0109] In some embodiments, the length direction of the first mounting hole 310 is parallel to the length direction of the circuit board 300.

[0110] In some embodiments, the length direction of the second mounting hole 320 is parallel to the length direction of the circuit board 300.

[0111] Figure 7A This is an assembly diagram of a light emitting component and a light receiving component according to some embodiments. Figure 7BThis is an exploded view of a light emitting component and a light receiving component according to some embodiments. Figure 7A and Figure 7B As shown, in some embodiments, the optical module 200 further includes a mounting base 700, the top of which supports and connects the light emitting component 400 and the light receiving component 500. Exemplarily, the top of one side of the mounting base 700 supports and connects the light emitting component 400, such that the light emitting component 400 is located within a first mounting hole 310; the top of the other side of the mounting base 700 supports and connects the light receiving component 500, such that the light receiving component 500 is located within a second mounting hole 320.

[0112] In some embodiments, the top edge of the mounting base 700 contacts the surface of the connecting circuit board 300. Exemplarily, the front side of the circuit board 300 faces the cover plate 2011, the back side of the circuit board 300 faces the base plate 2021, the top of the mounting base 700 facilitates contact with the back side of the connecting circuit board 300, and the bottom of the mounting base 700 contacts the connecting base plate 2021, facilitating the rapid transfer of heat generated by the light emitting component 400 and the light receiving component 500 to the housing of the optical module.

[0113] In some embodiments, the light emitting component 400 may include a light-emitting element 410. The light-emitting element 410 is used to generate light signals. The light-emitting element 410 may include multiple lasers, enabling it to generate multiple light signals. Exemplarily, the light-emitting element 410 may include four or eight lasers, etc., with one laser outputting one light signal. Of course, in some embodiments, one laser may generate multiple light signals, such as two, three, or four light signals. The light-emitting element 410 may be mounted on the mounting base 700.

[0114] In some embodiments, the light-emitting component 410 may generate a first light signal, a second light signal, a third light signal, and a fourth light signal.

[0115] In some embodiments, the light-emitting component 410 is located near the edge of the mounting base 700, and the light-emitting component 410 is located at the edge of the first mounting hole 310, which facilitates the light-emitting component 410 to be wired to the circuit board 300.

[0116] In some embodiments, the light emitting component 400 may include a collimating lens group 420 located in the output optical path of the light-emitting component 410. The collimating lens group 420 is used to collimate the optical signal generated by the light-emitting component 410. The collimating lens group 420 includes a plurality of collimating lenses, which are correspondingly disposed in the output optical path of the laser. Exemplarily, the collimating lens group 420 may include four collimating lenses or eight collimating lenses, etc. The collimating lens group 420 may be disposed on the mounting base 700.

[0117] In some embodiments, the light emitting component 400 may include an isolator group 430 located in the output optical path of the light emitting component 410. The isolator group 430 is used to pass light signals incident from one side of the isolator group 430 and isolate light signals incident from the other side of the isolator group 430. The isolator group 430 includes a plurality of isolators, which may be correspondingly arranged in the output optical path of the collimating lens. Exemplarily, the isolator group 430 may include 4 isolators or 8 isolators, etc.

[0118] In some embodiments, the light emitting component 400 may include an optical coupling component 440 located in the output optical path of the light-emitting component 410. One end of the optical coupling component 440 is connected to the first optical fiber 207, and the other end of the optical coupling component 440 is close to the light-emitting component 410. The optical coupling component 440 includes a beam combiner waveguide, one end of which is optically coupled to the first optical fiber 207, and the other end of which is used to couple the optical signal generated by the light-emitting component 410. Exemplarily, the optical coupling component 440 can combine four optical signals generated by the light-emitting component 410 into one beam and couple it to the first optical fiber 207. Exemplarily, the other end of the optical coupling component 440 is close to the isolator group 430, and the optical signal passing through the isolator group 430 is coupled to the optical coupling component 440. Exemplarily, the beam combiner waveguide may be made of silicon.

[0119] In some embodiments, the light emitting component 400 may include an emitting base 450, with the light-emitting component 410 and the collimating lens group 420 located on the emitting base 450. The bottom of the emitting base 450 is connected to the mounting base 700, and the emitting base 450 facilitates the mounting of the light-emitting component 410 and the collimating lens group 420 on the mounting base 700.

[0120] In some embodiments, the light emitting component 400 may include a light detection component 460, which is located at one end of the light coupling component 440. The light detection component 460 is used to detect the light power intensity, etc., of the light signal output by the light emitting component 400. Exemplarily, the light detection component 460 is located near the edge of the mounting base 700 and at the edge of the first mounting hole 310, facilitating electrical connection between the light detection component 460 and the circuit board 300. The light detection component 460 is located in the forward light direction of the light emitting component 410 and can receive the forward light from the light emitting component 410 to detect the light signal output by the light emitting component 400. By detecting the light signal in the forward light direction of the light emitting component 410, the light detection component 460 facilitates the consideration of the influence of the optical signal transmission path during light signal detection.

[0121] In some embodiments, the laser in the light-emitting component 410 can generate backlight. This can be achieved by placing a backlight detector on the backlight side of the light-emitting component 410, although the backlight detector requires a relatively large assembly space. Instead, placing a light detection component 460 in the forward light direction of the light-emitting component 410 not only allows the light signal detection to take into account the influence of the light signal transmission optical path, but also facilitates a reduction in the size of the light detection component 460, thus reducing the space occupied by the light signal detection within the optical module.

[0122] In some embodiments, the optical coupling component 440 may include a beam-splitting waveguide, one end of which is close to the optical detection component 460, and the other end of which is correspondingly connected to the other end of the beam-combining waveguide. Exemplarily, the beam-splitting waveguide may be made of silicon. The beam-splitting waveguide can transmit a portion of the forward light output from the light-emitting component 410 to the optical detection component 460. The inclusion of a beam-splitting waveguide in the optical coupling component 440 also facilitates adaptation to lasers that cannot generate backlighting.

[0123] In some embodiments, the light receiving component 500 includes a light receiving assembly 510. The light receiving assembly 510 is disposed on the circuit board 300 and is used to convert received optical signals into electrical signals. The light receiving assembly 510 may include multiple light receiving chips, enabling it to receive multiple light signals. For example, the light receiving assembly 510 may include four or eight light receiving chips, etc.

[0124] In some embodiments, the light receiving component 510 may be disposed on the mounting base 700. Exemplarily, the light receiving component 510 is located near the edge of the mounting base 700, and the light receiving component 510 is located at the edge of the second mounting hole 320 to facilitate the electrical connection of the light receiving component 510 to the circuit board 300.

[0125] In some embodiments, the light receiving component 500 may include a TIA 520 located at the edge of the light receiving assembly 510, and the TIA 520 is wire-connected to the light receiving assembly 510. The TIA 520 is located at the edge of the second mounting hole 320, so that the TIA 520 is close to the circuit board 300, which facilitates the wire-connection of the TIA 520 to the circuit board 300.

[0126] In some embodiments, the optical receiving component 500 may include a beam splitter 530 located on the input optical path of the optical receiving component 510. One end of the beam splitter 530 is connected to the second optical fiber 208, and the other end of the beam splitter 530 is located above the optical receiving component 510. The beam splitter 530 can split a single composite light beam into multiple optical signals. For example, the beam splitter 530 can split a single composite light beam into four optical signals, which are reflected by the end face of the beam splitter 530 and transmitted to corresponding photodetectors in the optical receiving component 510. The beam splitter 530 may be mounted on the mounting base 700.

[0127] In some embodiments, the mounting base 700 may be a metal base, and the optical receiving component 510, TIA 520 and beam splitting component 530 are disposed on the mounting base 700, so that the optical receiving component 510, TIA 520 and beam splitting component 530 are located on the same metal structure, which can improve the stability of the receiving optical path.

[0128] Figure 8A This is a structural diagram of a mounting base according to some embodiments. Figure 8B A cross-sectional view of the use of a mounting base according to some embodiments. Figure 1 , Figure 8C A cross-sectional view of the use of a mounting base according to some embodiments. Figure 2 , Figure 8D A cross-sectional view of the use of a mounting base according to some embodiments. Figure 3 , Figure 8E A cross-sectional view of the use of a mounting base according to some embodiments. Figure 4 , Figure 8F A cross-sectional view of the use of a mounting base according to some embodiments. Figure 5 .like Figures 8A-8F As shown, in some embodiments, the mounting base 700 includes a first mounting portion 710 and a second mounting portion 720. The first mounting portion 710 is located on one side of the mounting base 700, and the second mounting portion 720 is located on the other side of the mounting base 700. Exemplarily, the first mounting portion 710 supports and connects to the light emitting component 400, and the second mounting portion 720 supports and connects to the light receiving component 500.

[0129] In some embodiments, the projection of the first mounting hole 310 in the direction of the first mounting portion 710 is located on the first mounting portion 710; the projection of the second mounting hole 320 in the direction of the second mounting portion 720 is located on the second mounting portion 720.

[0130] In some embodiments, one end of the first mounting portion 710 protrudes beyond one end of the second mounting portion 720, and the other end of the second mounting portion 720 protrudes beyond the other end of the first mounting portion 710, such that one end of the first mounting portion 710 is longer than one end of the second mounting portion 720, and the other end of the second mounting portion 720 is longer than the other end of the first mounting portion 710.

[0131] In some embodiments, a first support platform 711 is formed on the top of the first mounting portion 710, and the first support platform 711 is located at the edge of the other end of the first mounting portion 710. The first support platform 711 supports and connects the light-emitting component 410 and the collimating lens group 420, etc. The first support platform 711 facilitates the assembly and connection of the light-emitting component 410 and the collimating lens group 420 to the mounting base 700, and facilitates the adjustment of the relative height of the light-emitting component 410 and the collimating lens group 420 with other devices in the light-emitting component 400. The light-emitting component 410 and the collimating lens group 420 can be bonded to the first support platform 711 with adhesive. By supporting and connecting the light-emitting component 410 and the collimating lens group 420 with the first support platform 711, it is easier to effectively control the amount of adhesive used to bond the light-emitting component 410 and the collimating lens group 420, so as to improve the stability of the emitted light path.

[0132] In some embodiments, a second support platform 712 is formed on the top of the first mounting portion 710. The second support platform 712 is located at the edge of the first support platform 711, and there is a gap between the second support platform 712 and the first support platform 711. The second support platform 712 supports and connects the optical coupling assembly 440 and the isolator group 430, etc. The second support platform 712 facilitates the assembly and connection of the optical coupling assembly 440 and the isolator group 430 to the mounting base 700, and facilitates the adjustment of the relative height of the optical coupling assembly 440 and the isolator group 430 to other devices in the light emitting component 400. The optical coupling assembly 440 and the isolator group 430 can be bonded to the second support platform 712 with adhesive. By supporting and connecting the optical coupling assembly 440 and the isolator group 430 with the second support platform 712, it is easier to effectively control the amount of adhesive used to bond the optical coupling assembly 440 and the isolator group 430, so as to improve the stability of the emitted light path.

[0133] In some embodiments, a third support platform 721 is formed on the top of the second mounting portion 720, and the third support platform 721 is located at the edge of the other end of the second mounting portion 720. The third support platform 721 supports the connected light detection assembly 460, etc. The third support platform 721 facilitates the connection of the light detection assembly 460, etc., to the mounting base 700, and facilitates the adjustment of the relative height of the light detection assembly 460, etc., and other devices in the light receiving component 500.

[0134] In some embodiments, a fourth support platform 722 is formed on the top of the second mounting portion 720. The fourth support platform 722 is located at the edge of the third support platform 721, and there is a gap between the fourth support platform 722 and the third support platform 721. The fourth support platform 722 supports and connects the beam splitter assembly 530. The fourth support platform 722 facilitates the connection of the beam splitter assembly 530 and the like to the mounting base 700, and facilitates the adjustment of the relative height of the beam splitter assembly 530 and the like to other components in the light receiving component 500. The beam splitter assembly 530 can be bonded to the fourth support platform 722 with adhesive. By supporting and connecting the beam splitter assembly 530 with the fourth support platform 722, it is easier to effectively control the amount of adhesive used to bond the beam splitter assembly 530, thereby improving the stability of the receiving optical path.

[0135] In some embodiments, a first recess 340 is formed at one end of the first mounting hole 310. The first recess 340 is located at the edge of one end of the first mounting hole 310. The end of the first recess 340 communicates with the first mounting hole 310. The first recess 340 can avoid the first optical fiber 207, so as to reduce the risk of damage to the first optical fiber 207 due to excessive bending. Exemplarily, one end of the first mounting portion 710 can extend to the edge of the end of the first recess 340.

[0136] In some embodiments, a second recess 350 is formed at one end of the second mounting hole 320. The second recess 350 is located at the edge of one end of the second mounting hole 320, and the end of the second recess 350 communicates with the second mounting hole 320. The second recess 350 can avoid the second optical fiber 208, so as to reduce the risk of damage to the second optical fiber 208 due to excessive bending. Exemplarily, one end of the second mounting portion 720 can extend to the edge of the end of the second recess 350.

[0137] Figure 9 This is a partial schematic diagram of the internal structure of an optical module according to some embodiments. Figure 9 As shown, in some embodiments, the optical detection component 460 includes a photodetector 461, with the light-receiving surface of the photodetector 461 facing the end face of the optical coupling component 440, such that the photodetector 461 is located at the output end of the beam-splitting waveguide. A portion of the optical signal coupled to the beam-combining waveguide is split and transmitted to the beam-splitting waveguide. The optical signal output from the beam-splitting waveguide can be transmitted to the photodetector 461, allowing the photodetector 461 to receive the optical signal output from the beam-splitting waveguide to detect the optical power of the optical signal generated by the light-emitting component 410. Exemplarily, the optical detection component 460 includes multiple photodetectors 461, which can monitor the optical power of multiple beams of optical signals.

[0138] In some embodiments, the light detection assembly 460 may include a substrate 462. A photodetector 461 is disposed on the side of the substrate 462. A pad 4621 is disposed on the top of the substrate 462, extending from the top of the substrate 462 toward the side of the substrate 462, with the pad 4621 extending to the edge of the photodetector 461. The pad 4621 being disposed on the top of the substrate 462 and extending to the side of the substrate 462 facilitates wire bonding of the photodetector 461 to the pad 4621 and electrical connection of the photodetector 461 to the circuit board 300 via the pad 4621.

[0139] In some embodiments, the photodetector 460 may include a base 463, with a mounting base 700 connected to the bottom of the base 463 and the bottom of the connecting substrate 462 supported at the top of the base 463. The base 463 facilitates adjustment of the height of the photodetector 461, allowing the optical signal output from the beam splitter waveguide to be transmitted to the photodetector 461.

[0140] Figure 10A Structure of an optical coupling component according to some embodiments Figure 1 , Figure 10B Structure of an optical coupling component according to some embodiments Figure 2 , Figure 10C This is a partial schematic diagram of an optical coupling assembly according to some embodiments. Figures 10A-10C As shown, in some embodiments, the optical coupling assembly 440 includes an optical fiber connector 441 and a waveguide 442. The optical fiber connector 441 connects the first optical fiber 207 and the waveguide 442, such that the end of the first optical fiber 207 extends to the end of the waveguide 442.

[0141] In some embodiments, the waveguide portion 442 includes a substrate 4420, one end of which is connected to the optical fiber connector 441, and the other end of which is close to the light-emitting component 410. Exemplarily, the other end of the substrate 4420 is close to the isolator group 430. Exemplarily, the substrate 4420 may be made of silicon dioxide, which has a lower refractive index than silicon, facilitating the confinement of optical signals within waveguides such as beam combiners and beam splitters.

[0142] In some embodiments, one end of the substrate 4420 can be connected to the other end of the optical fiber connector 441 by a matching adhesive, so that the fiber core end face of the first optical fiber 207 and the end face of one end of the coupling waveguide 4421 are filled with matching adhesive, which facilitates the improvement of the coupling efficiency of the optical signal from the coupling waveguide 4421 to the first optical fiber 207.

[0143] In some embodiments, a coupling waveguide 4421 is formed on the substrate 4420, and the coupling waveguide 4421 is located at one end of the substrate 4420. One end of the coupling waveguide 4421 is optically connected to the first optical fiber 207, and the coupling waveguide 4421 extends from one end of the substrate 4420 to the other end of the substrate 4420. The beam combiner waveguide may be made of silicon.

[0144] In some embodiments, a first beam combiner waveguide 4422 is formed on the substrate 4420. One end of the first beam combiner waveguide 4422 is optically connected to the other end of the coupling waveguide 4421, and the first beam combiner waveguide 4422 extends to the other end of the substrate 4420, such that the other end of the first beam combiner waveguide 4422 is located at the other end of the substrate 4420. A first optical signal is transmitted to the other end of the first beam combiner waveguide 4422 and coupled to the first beam combiner waveguide 4422, then transmitted through the first beam combiner waveguide 4422 to the coupling waveguide 4421, and then coupled through the coupling waveguide 4421 to the first optical fiber 207. Exemplarily, the first beam combiner waveguide 4422 is located near the edge of the substrate 4420. The first beam combiner waveguide 4422 may be made of silicon.

[0145] In some embodiments, a second beam combiner 4423 is formed on the substrate 4420. One end of the second beam combiner 4423 is optically connected to the other end of the coupling waveguide 4421. The first beam combiner 4422 extends from the second beam combiner 4423 to the other end of the substrate 4420, such that the other end of the second beam combiner 4423 is located at the other end of the substrate 4420. A second optical signal is transmitted to the other end of the second beam combiner 4423 and coupled to the second beam combiner 4423, then transmitted through the second beam combiner 4423 to the coupling waveguide 4421, and then coupled through the coupling waveguide 4421 to the first optical fiber 207. Exemplarily, the second beam combiner 4423 is located on the side of the first beam combiner 4422. The second beam combiner 4423 may be made of silicon.

[0146] In some embodiments, a third beam combiner waveguide 4424 is formed on the substrate 4420. One end of the third beam combiner waveguide 4424 is optically connected to the other end of the coupling waveguide 4421, and the third beam combiner waveguide 4424 extends to the other end of the substrate 4420, such that the other end of the third beam combiner waveguide 4424 is located at the other end of the substrate 4420. A third optical signal is transmitted to the other end of the third beam combiner waveguide 4424 and coupled to the third beam combiner waveguide 4424, then transmitted through the third beam combiner waveguide 4424 to the coupling waveguide 4421, and then coupled through the coupling waveguide 4421 to the first optical fiber 207. Exemplarily, the third beam combiner waveguide 4424 is located on the side of the second beam combiner waveguide 4423. The third beam combiner waveguide 4424 may be made of silicon.

[0147] In some embodiments, a fourth beam combiner waveguide 4425 is formed on the substrate 4420. One end of the fourth beam combiner waveguide 4425 is optically connected to the other end of the coupling waveguide 4421, and the fourth beam combiner waveguide 4425 extends to the other end of the substrate 4420, such that the other end of the fourth beam combiner waveguide 4425 is located at the other end of the substrate 4420. A fourth optical signal is transmitted to the other end of the fourth beam combiner waveguide 4425 and coupled to the fourth beam combiner waveguide 4425, then transmitted through the fourth beam combiner waveguide 4425 to the coupling waveguide 4421, and then coupled through the coupling waveguide 4421 to the first optical fiber 207. Exemplarily, the fourth beam combiner waveguide 4425 is located on the side of the third beam combiner waveguide 4424. The fourth beam combiner waveguide 4425 may be made of silicon.

[0148] In some embodiments, the first beam combiner waveguide 4422 and the second beam combiner waveguide 4423 are located within the substrate 4420. Exemplarily, a waveguide layer is formed on a silicon dioxide substrate, and the waveguide layer is etched to form the first beam combiner waveguide 4422 and the second beam combiner waveguide 4423, etc. A silicon dioxide layer continues to grow over the substrate and the first beam combiner waveguide 4422 and the second beam combiner waveguide 4423, etc., and this silicon dioxide layer and the silicon dioxide substrate form the substrate 4420.

[0149] In some embodiments, the other ends of the first beam combiner 4422, the second beam combiner 4423, the third beam combiner 4424, and the fourth beam combiner 4425 are arranged side by side at the other end of the substrate 4420.

[0150] In some embodiments, the light-emitting component 410 generates four optical signals, which are correspondingly coupled to the other ends of the first combining waveguide 4422, the second combining waveguide 4423, the third combining waveguide 4424, and the fourth combining waveguide 4425. These signals are then transmitted through the first combining waveguide 4422, the second combining waveguide 4423, the third combining waveguide 4424, and the fourth combining waveguide 4425 to the coupling waveguide 4421, and finally coupled to the first optical fiber 207 via the coupling waveguide 4421. Thus, the four optical signals generated by the light-emitting component 410 can be combined into one beam through the waveguide portion 442 and coupled to the first optical fiber 207, allowing the four optical signals generated by the light-emitting component 410 to be output through a single optical fiber.

[0151] In some embodiments, a first beam-splitting waveguide 4426 is further formed on the substrate 4420. One end of the first beam-splitting waveguide 4426 is located at one end of the substrate 4420, and the other end of the first beam-splitting waveguide 4426 is connected to a first beam-combining waveguide 4422. The first beam-splitting waveguide 4426 is used to split the optical signal coupled to the first beam-combining waveguide 4422. Exemplarily, the first beam-splitting waveguide 4426 can split a portion of the first optical signal coupled to the first beam-combining waveguide 4422 and transmit it to the optical detection component 460. For example, the first beam-splitting waveguide 4426 can split 2-10% of the first optical signal coupled to the first beam-combining waveguide 4422.

[0152] In some embodiments, one end of the first beam splitter waveguide 4426 is located on one side of the coupling waveguide 4421, and the first beam splitter waveguide 4426 spans the second beam combiner waveguide 4423, the third beam combiner waveguide 4424 and the fourth beam combiner waveguide 4425 and does not intersect with the second beam combiner waveguide 4423, the third beam combiner waveguide 4424 and the fourth beam combiner waveguide 4425.

[0153] In some embodiments, a second beam-splitting waveguide 4427 is further formed on the substrate 4420. One end of the second beam-splitting waveguide 4427 is located at one end of the substrate 4420, and the other end of the second beam-splitting waveguide 4427 is connected to the second beam-combining waveguide 4423. The second beam-splitting waveguide 4427 is used to split the optical signal coupled to the second beam-combining waveguide 4423. Exemplarily, the second beam-splitting waveguide 4427 can split a portion of the second optical signal coupled to the second beam-combining waveguide 4423 and transmit it to the photodetector 460. For example, the second beam-splitting waveguide 4427 can split 2-10% of the second optical signal coupled to the second beam-combining waveguide 4423.

[0154] In some embodiments, one end of the second beam splitter waveguide 4427 is located on the side of the first beam splitter waveguide 4426 away from the coupling waveguide 4421, and the second beam splitter waveguide 4427 crosses the third beam combiner waveguide 4424 and the fourth beam combiner waveguide 4425 and does not intersect with the third beam combiner waveguide 4424 and the fourth beam combiner waveguide 4425.

[0155] In some embodiments, a third beam-splitting waveguide 4428 is further formed on the substrate 4420. One end of the third beam-splitting waveguide 4428 is located at one end of the substrate 4420, and the other end of the third beam-splitting waveguide 4428 is connected to the third beam-combining waveguide 4424. The third beam-splitting waveguide 4428 is used to split the optical signal coupled to the third beam-combining waveguide 4424. Exemplarily, the third beam-splitting waveguide 4428 can split a portion of the third optical signal coupled to the third beam-combining waveguide 4424 and transmit it to the optical detection component 460. For example, the third beam-splitting waveguide 4428 can split 2-10% of the third optical signal coupled to the third beam-combining waveguide 4424.

[0156] In some embodiments, one end of the third beam splitter waveguide 4428 is located on the side of the second beam splitter waveguide 4427 away from the coupling waveguide 4421, and the third beam splitter waveguide 4428 crosses the fourth beam combiner waveguide 4425 and does not intersect with the fourth beam combiner waveguide 4425.

[0157] In some embodiments, a fourth beam-splitting waveguide 4429 is further formed on the substrate 4420. One end of the fourth beam-splitting waveguide 4429 is located at one end of the substrate 4420, and the other end of the fourth beam-splitting waveguide 4429 is connected to the fourth beam-combining waveguide 4425. The fourth beam-splitting waveguide 4429 is used to split the optical signal coupled to the fourth beam-combining waveguide 4425. Exemplarily, the fourth beam-splitting waveguide 4429 can split a portion of the fourth optical signal coupled to the fourth beam-combining waveguide 4425 and transmit it to the optical detection component 460. For example, the fourth beam-splitting waveguide 4429 can split 2-10% of the third optical signal coupled to the fourth beam-combining waveguide 4425.

[0158] In some embodiments, one end of the fourth beam splitter waveguide 4429 is located on the side of the third beam splitter waveguide 4428 away from the coupling waveguide 4421.

[0159] In some embodiments, the other end of the optical fiber connector 441 forms a first inclined surface 4411. The first inclined surface 4411 is used to tilt the end of the first optical fiber 207, which helps to reduce the reflection of the optical signal from the end face of the first optical fiber 207 back into the coupling waveguide 4421 during the coupling transmission from the coupling waveguide 4421 to the first optical fiber 207. For example, the tilt angle of the first inclined surface 4411 is 2-10°, such as 4°, 6° or 8°.

[0160] In some embodiments, a second inclined surface 442a is formed at the other end of the waveguide portion 442. The second inclined surface 442a is used to tilt the ends of the first beam combiner waveguide 4422, the second beam combiner waveguide 4423, the third beam combiner waveguide 4424, and the fourth beam combiner waveguide 4425, thereby reducing the reflection of optical signals from the ends of the beam combiner waveguides into the incident optical path. For example, the tilt angle of the second inclined surface 442a is 2-10°, such as 4°, 6°, or 8°.

[0161] Figure 11 This is a partial structural schematic diagram of a light emitting component according to some embodiments. Figure 11 This illustrates an optical path for transmitting optical signals in an optical emitting component. For example... Figure 11As shown, in some embodiments, the light emitting component 400 generates four light signals, which are transmitted to the collimating lenses of the collimating lens group 420. After being collimated by the corresponding collimating lenses, the signals are transmitted to the isolator group 430, pass through the isolators in the isolator group 430, and then to the end of the optical coupling component 440 and coupled to the waveguide section 442. The signals are then transmitted to the coupling waveguide 4421 via the first combining waveguide 4422, the second combining waveguide 4423, the third combining waveguide 4424, and the fourth combining waveguide 4425 of the waveguide section 442, and finally coupled to the first optical fiber 207 via the coupling waveguide 4421.

[0162] During transmission, a portion of the optical signal coupled to the first beam combiner waveguide 4422 is transmitted to the optical detection component 460 via the first beam splitter waveguide 4426, enabling the optical detection component 460 to detect the optical power intensity of the optical signal coupled to the first beam combiner waveguide 4422. Similarly, during transmission, a portion of the optical signal coupled to the second beam combiner waveguide 4423 is transmitted to the optical detection component 460 via the second beam splitter waveguide 4427, enabling the optical detection component 460 to detect the optical power intensity of the optical signal coupled to the second beam combiner waveguide 4423. Likewise, during transmission, a portion of the optical signal coupled to the third beam combiner waveguide 4424 is transmitted to the optical detection component 460 via the third beam splitter waveguide 4428, enabling the optical detection component 460 to detect the optical power intensity of the optical signal coupled to the third beam combiner waveguide 4424. During transmission, a portion of the optical signal coupled to the fourth beam combiner waveguide 4425 is transmitted to the optical detection component 460 via the fourth beam splitter waveguide 4429, enabling the optical detection component 460 to detect the optical power intensity of the optical signal coupled to the fourth beam combiner waveguide 4425. Thus, through the beam combiner waveguide in the waveguide section 442, the optical signal received by the optical detection component 460 and the optical signal coupled to the first optical fiber 207 share the same optical path before being transmitted to the optical coupling component 440, facilitating improved accuracy in monitoring transmitted optical power.

[0163] Figure 12A Structure of a laser according to some embodiments Figure 1 , Figure 12B Structure of a laser according to some embodiments Figure 2 , Figure 12A and Figure 12B The laser shown does not output backlight. For example... Figure 12A and Figure 12B As shown, in some embodiments, the laser 900 may be an on-chip integrated edge-emitting four-channel optical signal.

[0164] In some embodiments, the laser 900 integrates an on-chip light-emitting region, an electro-absorption modulation region, and an end-face coupler to achieve optical signal array output and low-loss coupling with the optical coupling component 440 to improve the transmission rate.

[0165] In some embodiments, the laser 900 includes a light-emitting region. The light-emitting region emits a beam of light that does not carry information from both ends of the active region.

[0166] In some embodiments, the laser 900 integrates a beam splitter to split a beam of light emitted from the light-emitting region, thereby emitting multiple beams. An electro-absorption modulation region is located on the transmission path of the corresponding light to modulate its signal. Taking the laser 900 emitting four beams as an example, the laser 900 includes a first beam splitter and a second beam splitter. The first beam splitter splits the light emitted from one end of the active region, and the second beam splitter splits the light emitted from the other end of the active region, generating four beams. The first beam splitter and the second beam splitter can each be a 1×2 multimode interference coupler.

[0167] In some embodiments, the laser 900 includes multiple electro-absorption modulation regions. The multiple beams generated by beam splitting are transmitted through a transmission waveguide and modulated by the electro-absorption modulation regions on their respective optical paths to emit multi-channel optical signals. For example, if the laser 900 emits four optical signals, then the laser 900 includes a light-emitting region and four electro-absorption modulation regions.

[0168] In some embodiments, the output end face of the laser 900 is integrated with multiple end face couplers to perform mode conversion, converting the small light spot output by the laser 900 into a large light spot to match the mode spot of the optical coupling component 440, thereby achieving relatively low-loss coupling between the laser 900 and optical fibers of different sizes.

[0169] The following example illustrates the use of a laser 900 emitting four optical signals.

[0170] In some embodiments, the laser 900 may include a light-emitting region 910. The light-emitting region 910 emits a beam of light without carrying information from each end of the active region. One end of the light-emitting region 910 emits a first beam, and the other end emits a second beam. Neither the first beam nor the second beam carries information. If the end emitting the first beam is defined as the first end of the light-emitting region 910, and the end emitting the second beam is defined as the second end of the light-emitting region 910, then the light-emitting region 910 includes a first end and a second end, with the first end emitting the first beam and the second end emitting the second beam.

[0171] In some embodiments, the second beam is guided to the same propagation direction as the first beam. For example, the propagation direction of the second beam is guided from the second end to the first end so that the second beam's propagation direction is aligned with that of the first beam.

[0172] In some embodiments, the laser 900 may include a first beam splitter 920. The first beam splitter 920 is located in the transmission optical path of the first beam, and the first beam is fed into the first beam splitter 920, where it is split into a first beam splitter and a second beam splitter. The first beam splitter is output from a first output end of the first beam splitter 920, and the second beam splitter is output from a second output end of the first beam splitter 920.

[0173] In some embodiments, the laser 900 may include a second beam splitter 930. The second beam splitter 930 and the first beam splitter 920 are located on the same side of the light-emitting region. Exemplarily, the second beam splitter 930 and the first beam splitter 920 are located on the same side as the first end. The second beam splitter 930 is located in the transmission optical path of the second beam, and the second beam is fed into the second beam splitter 930, where it is split into a third beam and a fourth beam. The third beam is output from the first output end of the second beam splitter 930, and the fourth beam is output from the second output end of the second beam splitter 930. Thus, there are four beams to be modulated in the output optical path of the light-emitting region 910.

[0174] In some embodiments, the laser 900 may include a first electro-absorption modulation region 940. The first electro-absorption modulation region 940 is optically connected to the first output end of the first beam splitter 920 to receive the first beam split. The first electro-absorption modulation region 940 is located in the transmission optical path of the first beam split to modulate the signal of the first beam split, thereby generating a first optical signal.

[0175] In some embodiments, the laser 900 may include a second electro-absorption modulation region 950. The second electro-absorption modulation region 950 is optically connected to the second output end of the first beam splitter 920 to receive the second beam split. The second electro-absorption modulation region 950 is located in the transmission optical path of the second beam split to modulate the signal of the second beam split, thereby generating a second optical signal.

[0176] In some embodiments, the laser 900 may include a third electroabsorption modulation region 960. The third electroabsorption modulation region 960 is optically connected to the first output end of the second beam splitter 930 to receive the third beam. The third electroabsorption modulation region 960 is located in the transmission optical path of the third beam to modulate the signal of the third beam, thereby generating a third optical signal.

[0177] In some embodiments, the laser 900 may include a fourth electro-absorption modulation region 970. The fourth electro-absorption modulation region 970 is optically connected to the second output end of the second beam splitter 930 to receive the fourth beam. The fourth electro-absorption modulation region 970 is located on the transmission optical path of the fourth beam to modulate the signal of the fourth beam, generating a fourth optical signal. Thus, the laser 900 modulates and generates four optical signals, realizing an optical signal array output, improving chip integration, and increasing transmission rate.

[0178] In some embodiments, the first electroabsorption modulation region and the second electroabsorption modulation region 950 may be located on one side of the light-emitting region 910, and the third electroabsorption modulation region 960 and the fourth electroabsorption modulation region 970 may be located on the other side of the light-emitting region 910. The reasonable distribution of multiple electroabsorption modulation regions is beneficial for chip miniaturization.

[0179] In some embodiments, the first end of the light-emitting region 910 is optically connected to the first beam splitter 920, and the second end of the light-emitting region 910 is optically connected to the second beam splitter 930. The two light-emitting ends of the first beam splitter 920 are optically connected to the first electro-absorption modulation region 940 and the second electro-absorption modulation region 950, respectively, and the two light-emitting ends of the second beam splitter 930 are optically connected to the third electro-absorption modulation region 960 and the fourth electro-absorption modulation region 970, respectively.

[0180] In some embodiments, the light-emitting region 910 is connected to transmission waveguides between the first beam splitter 920 and the second beam splitter 930, respectively. A transmission waveguide is connected between the first light-emitting end of the first beam splitter 920 and the light-incident end of the first electro-absorption modulation region 940, and a transmission waveguide is connected between the second light-emitting end and the light-incident end of the second electro-absorption modulation region 950. A transmission waveguide is connected between the first light-emitting end of the second beam splitter 930 and the light-incident end of the third electro-absorption modulation region 960, and a transmission waveguide is connected between the second light-emitting end and the light-incident end of the fourth electro-absorption modulation region 970.

[0181] In some embodiments, a first transmission waveguide 981 is connected between the first end of the light-emitting region 910 and the first beam splitter 920 to guide the first light beam into the first beam splitter 920 for beam splitting. The first transmission waveguide 981 can be a straight waveguide.

[0182] In some embodiments, a second transmission waveguide 982 is connected between the second end of the light-emitting region 910 and the second beam splitter 930 to allow the second light beam to be fed into the second beam splitter 930 for beam splitting.

[0183] In some embodiments, the second transmission waveguide 982 is a bent waveguide, which includes a first bending region 9821, with straight waveguides connected to both ends of the first bending region 9821. The first bending region 9821 bends from the second end of the light-emitting region 910 toward the first end of the light-emitting region 910, turning the optical path and thus reflecting the second beam back to the first end of the light-emitting region 910. In this way, the first beam splitter 920 and the second beam splitter 930 can be located on the same side of the light-emitting region 910, which is beneficial for chip miniaturization.

[0184] In some embodiments, the first output end of the first beam splitter 920 is optically connected to the input end of the first electroabsorption modulation region 940. A third transmission waveguide 983 is connected between the first output end of the first beam splitter 920 and the input end of the first electroabsorption modulation region 940. The third transmission waveguide 983 includes a second bending region 9831, which bends the transmission direction of the first beam splitter. Straight waveguides are connected to both ends of the second bending region 9831.

[0185] In some embodiments, the second output end of the first beam splitter 920 is optically connected to the input end of the second electro-absorption modulation region 950. A fourth transmission waveguide 984 is connected between the second output end of the first beam splitter 920 and the input end of the second electro-absorption modulation region 950. The fourth transmission waveguide 984 includes a third bending region 9841, which bends the transmission direction of the second beam splitter. Straight waveguides are connected to both ends of the third bending region 9841.

[0186] In some embodiments, the first output end of the second beam splitter 930 is optically connected to the input end of the third electroabsorption modulation region 960. A fifth transmission waveguide 985 is connected between the first output end of the second beam splitter 930 and the input end of the third electroabsorption modulation region 960. The fifth transmission waveguide 985 includes a fourth bending region 9851, which bends the transmission direction of the third beam splitter. Straight waveguides are connected to both ends of the fourth bending region 9851.

[0187] In some embodiments, the second output end of the second beam splitter 930 is optically connected to the input end of the fourth electro-absorption modulation region 970. A sixth transmission waveguide 986 is connected between the second output end of the second beam splitter 930 and the input end of the fourth electro-absorption modulation region 970. The sixth transmission waveguide 986 includes a fifth bending region 9861, which bends the transmission direction of the fourth beam splitter. Straight waveguides are connected to both ends of the fifth bending region 9861.

[0188] In some embodiments, the second bending region 9831 and the third bending region 9841 bend toward the same side, guiding the first beam splitter and the second beam splitter to the same side.

[0189] In some embodiments, the fourth bending region 9851 and the fifth bending region 9861 bend toward the same side, guiding the third beam splitter and the fourth beam splitter to the same side.

[0190] In some embodiments, the second bending region 9831 and the third bending region 9841 bend along the two output ends of the first beam splitter 920 toward the first side, and the fourth bending region 9851 and the fifth bending region 9861 bend along the two output ends of the second beam splitter 930 toward the second side opposite to the first side. In this way, the first beam splitter and the second beam splitter are guided to the first side, and the third beam splitter and the fourth beam splitter are guided to the second side, so as to reasonably deploy the optical path and facilitate the miniaturization of the highly integrated laser chip.

[0191] In some embodiments, the second bending region 9831 and the third bending region 9841 are bent toward the first side, respectively, guiding the first beam splitter and the second beam splitter to one side of the light-emitting region 910 for transmission. The first electroabsorption modulation region 940 and the second electroabsorption modulation region 950 are located on one side of the light-emitting region 910.

[0192] In some embodiments, the fourth bending region 9851 and the fifth bending region 9861 are bent toward the second side, respectively, guiding the third and fourth beam splitters to the other side of the light-emitting region 910 for transmission. The third electro-absorption modulation region 960 and the fourth electro-absorption modulation region 970 are located on the other side of the light-emitting region 910. The reasonable arrangement of the four electro-absorption modulation regions is beneficial for chip miniaturization.

[0193] In some embodiments, as the integration density of optical modules increases, it is necessary to further reduce the power consumption of the laser 900 to meet overall power consumption requirements. The laser 900 employs a differential drive mode to effectively reduce power consumption. The differential drive modulation signals enter the electroabsorption modulation region separately; these two differential signals have the same amplitude and frequency but opposite phase. Compared to single-ended drive chips, differential drive offers advantages such as stronger noise immunity, longer transmission distance, and lower power consumption.

[0194] In some embodiments, the first electroabsorption modulation region 940 includes a first electrode portion and a second electrode portion. The first electrode portion can be a P-plane electrode, and the second electrode portion can be an N-plane electrode. The first electrode portion and the second electrode portion are arranged in a coplanar electrode configuration to reduce the parasitic capacitance between the electrodes of the modulation region.

[0195] In some embodiments, the light-emitting region 910 shares a substrate with each electroabsorption modulation region. The substrate is a semi-insulating substrate to prevent the drive modulation signal connected to the electroabsorption modulation region from being interfered with by the light-emitting region 910, thus ensuring smooth differential driving.

[0196] In some embodiments, since the substrate is a semi-insulating substrate, the N-type electrode in the light-emitting region 910 and the second electrode portion of the first electroabsorption modulation region 940 cannot be disposed on the back side of the substrate 911. Therefore, the N-type electrode and the P electrode in the light-emitting region 910 are coplanar electrodes. The first electrode portion and the second electrode portion in the first electroabsorption modulation region 940 are also coplanar electrodes.

[0197] In some embodiments, the first electroabsorption modulation region 940 may include a first radio frequency electrode RF+. The first radio frequency electrode RF+ is electrically connected to the first electrode portion and inputs a first differential drive modulation signal to the first electroabsorption modulation region 940.

[0198] In some embodiments, the first electroabsorption modulation region 940 may include a second radio frequency electrode RF-. The first radio frequency electrode RF+ and the second radio frequency electrode RF- constitute a differential drive electrode. The second radio frequency electrode RF- is electrically connected to the second electrode portion to input a second differential drive modulation signal to the first electroabsorption modulation region 940. The second differential drive modulation signal and the first differential drive modulation signal constitute a differential pair.

[0199] In some embodiments, the first electroabsorption modulation region 940 may include a first DC electrode DC+. The first DC electrode DC+ is electrically connected to the first electrode portion to input a first differential reverse bias voltage to the first electroabsorption modulation region 940.

[0200] In some embodiments, the first electroabsorption modulation region 940 may include a second DC electrode DC-. The first DC electrode DC+ and the second DC electrode DC- constitute a differential reverse bias electrode. The second DC electrode DC- is electrically connected to the second electrode portion to input a second differential reverse bias voltage to the first electroabsorption modulation region 940. The second differential reverse bias voltage and the first differential reverse bias voltage form a differential pair.

[0201] In some embodiments, when the first electroabsorption modulation region 940 is operational, a first differential driving modulation signal and a second differential driving modulation signal with opposite phases are simultaneously applied to the first electrode portion and the second electrode portion, forming a differential driving mode. Based on the electro-optic modulation effect, light entering the active region of the first electroabsorption modulation region 940 is modulated by the differential driving modulation signal to generate an optical signal carrying information. Signal modulation is performed using a coplanar electrode differential driving method, thereby reducing power consumption.

[0202] In some embodiments, the first radio frequency electrode RF+ is electrically connected to the first electrode portion. The second radio frequency electrode RF- is electrically connected to the second electrode portion.

[0203] In some embodiments, if the first DC electrode DC+ is electrically connected to the first radio frequency electrode RF+, then the first DC electrode DC+ is electrically connected to the first electrode portion.

[0204] In some embodiments, if the second DC electrode DC- is electrically connected to the second radio frequency electrode RF-, then the second DC electrode DC- is electrically connected to the second electrode portion.

[0205] In some embodiments, the differential driving mode of the second electroabsorption modulation region 950, the third electroabsorption modulation region 960, and the fourth electroabsorption modulation region 970 is the same as that of the first electroabsorption modulation region 940, and will not be elaborated further.

[0206] In some embodiments, the first electroabsorption modulation region 940 and the second electroabsorption modulation region 950 are offset and disposed on one side of the light-emitting region 910 to deploy their respective differential driving electrodes and differential reverse bias electrodes.

[0207] In some embodiments, the third electroabsorption modulation region 960 and the fourth electroabsorption modulation region 970 are offset and disposed on the other side of the light-emitting region 910 to deploy their respective differential driving electrodes and differential reverse bias electrodes.

[0208] In some embodiments, the laser 900 outputs multiple optical signals. The first optical signal is output from the emitting end of the first electroabsorption modulation region 940, the second optical signal is output from the emitting end of the second electroabsorption modulation region 950, the third optical signal is output from the emitting end of the third electroabsorption modulation region 960, and the fourth optical signal is output from the emitting end of the fourth electroabsorption modulation region 970. The laser 900 has four emitting ports on its emitting end face, meaning the four emitting ports are located on the same side. Therefore, each optical signal generated by modulation is output along the same side of the laser 900, and coupled to the optical coupling component 440 along the same side, realizing multi-channel optical array output.

[0209] In some embodiments, there is a mismatch in the optical field pattern size between the laser 900 and the optical coupling component 440, resulting in coupling loss between them. For example, the output spot size of the laser 900 is smaller than the coupling spot size of the optical coupling component 440.

[0210] In some embodiments, multiple couplers may be provided between the laser 900 and the optical coupling assembly 440 to achieve mode switching. In some embodiments, multiple couplers may be integrated inside the laser 900 to achieve mode switching.

[0211] In some embodiments, an end-face coupler is provided on the output optical path of each electro-absorption modulation region to perform mode conversion, thereby amplifying the optical signal spot size output by the electro-absorption modulation region, thereby increasing the coupling efficiency with the optical coupling component 440, reducing coupling loss, and realizing relatively low-loss coupling between the laser chip and optical fibers of different sizes. Thus, there is no need to set a separate converging lens between the laser 900 and the optical coupling component 440, and the laser 900 and the optical coupling component 440 can be directly end-face coupled.

[0212] In some embodiments, the laser 900 integrates various end-face couplers, enabling low-loss coupling with optical fibers of different diameters in waveguides with relatively wide and short waveguide tips.

[0213] In some embodiments, a first coupler 987 may be provided on the output optical path of the first electroabsorption modulation region 940 to perform mode conversion on the first optical signal, thereby achieving low-loss coupling between the first optical signal and the optical coupling component 440. One end of the first coupler 987 is optically connected to the first electroabsorption modulation region 940, and the other end of the first coupler 987 is optically connected to the optical coupling component 440.

[0214] In some embodiments, a second coupler 988 may be provided on the output optical path of the second electroabsorption modulation region 950 to perform mode conversion on the second optical signal, thereby achieving low-loss coupling between the second optical signal and the optical coupling component 440. One end of the second coupler 988 is optically connected to the second electroabsorption modulation region 950, and the other end of the second coupler 988 is optically connected to the optical coupling component 440.

[0215] In some embodiments, a third coupler 989 may be provided on the output optical path of the third electroabsorption modulation region 960 to perform mode conversion on the third optical signal, thereby achieving low-loss coupling between the third optical signal and the optical coupling component 440. One end of the third coupler 989 is optically connected to the third electroabsorption modulation region 960, and the other end of the third coupler 989 is optically connected to the optical coupling component 440.

[0216] In some embodiments, a fourth coupler 989a may be provided on the output optical path of the fourth electroabsorption modulation region 970 to perform mode conversion on the fourth optical signal, thereby achieving low-loss coupling between the fourth optical signal and the optical coupling component 440. One end of the fourth coupler 989a is optically connected to the fourth electroabsorption modulation region 970, and the other end of the fourth coupler 989a is optically connected to the optical coupling component 440.

[0217] In some embodiments, the optical coupling component 440 is provided with a beam-splitting waveguide, which facilitates the detection of optical signals generated by the laser 900 without backlight.

[0218] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. An optical module, characterized in that, include: The circuit board has a first mounting hole; The mounting bracket is located on the back of the circuit board; The projection of the mounting base in the direction of the circuit board covers the first mounting hole; The light emitting component is located inside the first mounting hole; in ； The light emitting component includes: A light-emitting component is disposed on the mounting base and near the edge of the first mounting hole; the light-emitting component generates multiple light signals. An optical coupling component is disposed on the mounting base and located in the output optical path of the light-emitting component; the optical coupling component includes: A waveguide section includes a substrate and a coupling waveguide and a plurality of beam combiners located on the substrate; one end of the coupling waveguide extends to one end of the substrate, the other end of the coupling waveguide is connected to one end of the beam combiners, and the other end of the beam combiners extends to the other end of the substrate. An optical fiber connector is located at one end of the waveguide section, connecting to the first optical fiber, and its end is connected to one end of the waveguide section, so that the first optical fiber is optically connected to the coupling waveguide.

2. The optical module according to claim 1, characterized in that, Multiple beam splitting waveguides are also provided on the substrate. One end of each beam splitting waveguide extends to one end of the substrate, and the other end of each beam splitting waveguide is connected to the beam combining waveguide. The light emitting component also includes: An optical detection component is disposed on the mounting base; the optical detection component is located near the edge of the first mounting hole, and the optical detection component is located at the edge of one end of the beam splitter waveguide and on the output optical path of the beam splitter waveguide.

3. The optical module according to claim 2, characterized in that, The optical detection component includes: A substrate with pads on its top; the pads extend to the sides of the substrate. A photodetector is disposed on the side of the substrate and located at the edge of the pad; the photodetector is electrically connected to the pad, and the end of the photodetector faces the waveguide portion. The base has a bottom connected to the mounting base and a top support connected to the bottom of the substrate.

4. The optical module according to claim 1, characterized in that, The mounting base includes a first mounting part and a second mounting part, one end of the first mounting part protrudes from one end of the second mounting part, and the other end of the second mounting part protrudes from the other end of the first mounting part. The optical module also includes an optical receiving component, and the circuit board is provided with a second mounting hole. A partition is provided between the first mounting hole and the second mounting hole, and the partition is provided with a circuit. The projection of the first mounting part in the direction of the circuit board covers the first mounting hole, and the projection of the second mounting part in the direction of the circuit board covers the second mounting hole.

5. The optical module according to claim 4, characterized in that, The top of the first mounting part is formed with a first support platform and a second support platform, and there is a gap between the first support platform and the second support platform. The first support platform supports and connects the light-emitting component, and the second support platform supports and connects the optical coupling component.

6. The optical module according to claim 5, characterized in that, The light emitting component also includes: A transmitting base is disposed on the first support platform and supports the light-emitting component; A collimating lens group is disposed on the emitting base and located in the output optical path of the light-emitting component; An isolator assembly is mounted on the second support platform, located on the side of the other end of the waveguide section.

7. The optical module according to claim 1, characterized in that, The other end of the optical fiber connector has a first inclined surface, which is connected to the waveguide. The inclination angle of the first inclined surface is 2-10°. The other end of the waveguide has a second inclined surface, the inclination angle of which is 2-10°.

8. The optical module according to claim 5, characterized in that, The top of the second mounting part has a third support platform and a fourth support platform, and there is a gap between the third support platform and the fourth support platform; The optical receiving component includes an optical receiving assembly and a beam splitter assembly; the optical receiving assembly is disposed on the third support platform, and the beam splitter assembly is disposed on the fourth support platform; one end of the beam splitter assembly is connected to a second optical fiber, and the other end of the beam splitter assembly is located above the optical receiving assembly.

9. The optical module according to claim 6, characterized in that, The circuit board also has a first recess and a second recess. The first recess is located at one end of the first mounting hole, and the first recess avoids the first optical fiber; the second recess is located at one end of the second mounting hole, and the second recess avoids the second optical fiber.

10. An optical module, characterized in that, include: The circuit board has a first mounting hole and a second mounting hole, and a partition is formed between the first mounting hole and the second mounting hole. The mounting base is located on the back of the circuit board; the projection of the mounting base in the direction of the circuit board covers the first mounting hole and the second mounting hole; The light emitting component is located inside the first mounting hole; The optical receiving component is located inside the second mounting hole; in ； The light emitting component includes: A light-emitting component is disposed on the mounting base and near the edge of the first mounting hole; the light-emitting component generates multiple light signals. An optical coupling component is disposed on the mounting base in the output optical path of the light-emitting component; the optical coupling component includes: A waveguide section includes a substrate and a coupling waveguide and a plurality of beam combiners located on the substrate. One end of the coupling waveguide extends to one end of the substrate, and the other end of the coupling waveguide is connected to one end of the beam combiners, which extends to the other end of the substrate. An optical fiber connector is located at one end of the waveguide portion; the optical fiber connector is connected to a first optical fiber, and the end of the optical fiber connector is connected to one end of the waveguide portion, so that the first optical fiber is optically connected to the coupling waveguide.

Images