Wire harness interface connection device and electronic device

Abstract

The embodiment of the application provides a wire harness interface connecting device and electronic equipment, and belongs to the technical field of electronic equipment. In the wire harness interface connecting device, the interface assembly comprises at least two interface units stacked along the height direction; the mainboard has a first side and a second side, the horizontal height of the first side is lower than that of the second side, so that the mainboard is arranged in a relative height direction, and at least two groups of conversion connectors are sequentially arranged on the mainboard along the height direction; among the at least two interface units, the interface end located at the relatively lower layer is connected to the conversion connector close to the first side through a wire harness, and the interface end located at the relatively upper layer is connected to the conversion connector close to the second side through a wire harness. The wire harness interface connecting device provided by the embodiment of the application optimizes the position of the connecting wire harness of the interface units and the conversion connectors of different layers, effectively reduces the length of a single connecting wire harness, and is beneficial to guaranteeing the integrity of multi-channel signal transmission.

Description

Technical Field

[0001] This application relates to electronic equipment technology, and more particularly to a wire harness interface connection device and electronic equipment. Background Technology

[0002] In communication equipment, to achieve high-density optoelectronic signal access, multiple layers of optical module interface cages are stacked vertically on the front panel of the switch chassis. Each layer of optical module interface cage is connected to the motherboard of the chassis through a wire harness to complete optoelectronic signal processing and data exchange.

[0003] However, as the number of interface layers of optical modules increases and the single-channel rate improves, the height difference between the optical module interface cages at the bottom and top layers becomes larger and larger, forcing the corresponding wire bundles of the optical module interface cages at the higher layers to be significantly longer. The longer wire bundles will generate greater insertion loss and signal distortion during transmission, affecting the overall signal integrity of the system and limiting the development of high-density, high-speed communication equipment. Summary of the Invention

[0004] This application provides a wire harness interface connection device and electronic device to solve the technical problem in the related art where excessively long wire harnesses connecting the high-level optical module interface cage and the motherboard can easily cause insertion loss.

[0005] The wire harness interface connection device provided in this application includes:

[0006] An interface component, the interface component comprising at least two interface units stacked along the height direction, wherein the interface ends of the at least two interface units are arranged facing the same side;

[0007] A motherboard is disposed on the opening side of the interface end. The motherboard has a first side portion close to the interface component and a second side portion away from the interface component. The horizontal height of the first side portion is lower than the horizontal height of the second side portion, so that the motherboard is arranged at an angle in the relative height direction.

[0008] At least two sets of adapter connectors are sequentially disposed on the motherboard along the height direction;

[0009] In at least two of the interface units, the interface end located on the lower layer is connected to the conversion connector near the first side via a wire harness, and the interface end located on the upper layer is connected to the conversion connector near the second side via a wire harness.

[0010] In some possible implementations, the motherboard is provided with a switching chip, and the conversion connector has multiple sets arranged around the circumferential edge of the switching chip, with each set of the conversion connector having at least two arranged in an array along the edge side of the motherboard.

[0011] In some possible implementations, the interface assembly further includes a plurality of stacked input / output boards, each of which has at least one interface unit on each of its opposite sides; the interface units located on the same input / output board are correspondingly connected to a set of conversion connectors on the same edge side via the wiring harness.

[0012] In some possible implementations, among the plurality of interface units, the interface terminal located at the bottom layer is connected to a set of conversion connectors near the first side via a wiring harness, and the interface terminal located at the top layer is connected to a set of conversion connectors near the second side via a wiring harness.

[0013] In some possible implementations, the motherboard has a third side adjacent to the first side and the second side, and a fourth side opposite to the third side;

[0014] In the interface terminal located in the middle layer, the interface terminal near the third side is connected to a set of conversion connectors near the third side via a wire harness, and the interface terminal near the fourth side is connected to a set of conversion connectors near the fourth side via a wire harness.

[0015] In some possible implementations, it also includes:

[0016] The chassis, wherein the interface components and the motherboard are both housed within the chassis;

[0017] A mounting bracket is disposed in the chassis. The mounting bracket has an inclined support plate. The motherboard is connected to the support plate so that the motherboard is at a preset tilt angle.

[0018] In some possible implementations, the mounting bracket includes:

[0019] The support rod has one end connected to the bottom plate of the chassis and the other end hinged to one end of the support plate corresponding to the first side.

[0020] The adjusting rod includes a connecting rod connected to the base plate and a telescopic rod slidably disposed on the connecting rod. The telescopic rod is hinged to one end of the support plate corresponding to the second side. The height of the telescopic rod on the connecting rod is adjustable.

[0021] In some possible implementations, the connecting rod is provided with a plurality of positioning holes spaced apart along its length, and the telescopic rod is provided with a plurality of mating holes spaced apart along its own length. The positioning holes and the mating holes are connected by fasteners that pass through both, so as to fix the telescopic rod on the connecting rod.

[0022] In some possible implementations, the interface unit is an optical module cage in which an optical module is inserted; the plug end of the conversion connector for connecting the wire harness is positioned away from the switching chip.

[0023] On the other hand, embodiments of this application also provide an electronic device, including the wire harness interface connection device as described in any of the preceding claims.

[0024] The wire harness interface connection device and electronic device provided in this application embodiment utilize the height difference between the first and second sides of the motherboard to tilt the motherboard in the relative height direction. The interface end located on the lower side is connected to the conversion connector near the first side. Since the first side is at a lower horizontal height, the height difference between the lower interface end and the corresponding conversion connector is reduced. After the wire harness is led out from the lower interface end, it can reach the corresponding conversion connector without large-angle bending or small-radius turning, effectively avoiding the difficulty of wiring and damage to the cable caused by forced bending.

[0025] In addition, the interface end located on the upper layer is connected to the conversion connector near the second side. Since the second side is raised, the distance between the interface end on the upper layer and the far end of the motherboard is reduced in the horizontal direction, thereby effectively shortening the length of the corresponding wire harness of the upper interface unit. This avoids the insertion loss caused by excessive wire harness length, and makes the wire harnesses of each level more balanced in terms of length, direction and bending layout, which is conducive to improving the consistency of multi-channel signal transmission. Attached Figure Description

[0026] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0027] Figure 1 This is a partial structural schematic diagram of the wire harness interface connection device provided in the embodiments of this application;

[0028] Figure 2 This is a schematic diagram of the motherboard structure of the wire harness interface connection device provided in the embodiments of this application;

[0029] Figure 3 This is a partial structural schematic diagram of the mounting bracket provided in an embodiment of this application.

[0030] Explanation of reference numerals in the attached figures

[0031] 100. Interface component; 110. Interface unit; 111. Interface terminal; 120. Input / output board;

[0032] 200. Motherboard; 210. First side panel; 220. Second side panel; 230. Third side panel; 240. Fourth side panel; 250. Switching chip;

[0033] 300. Adapter connector; 310. Sub-connector;

[0034] 400. Wiring harness; 410. Base plate;

[0035] 500. Chassis; 510. Mounting bracket; 511. Support plate; 512. Support rod; 513. Connecting rod; 514. Telescopic rod; 515. Positioning hole; 516. Mating hole; 517. Fastener.

[0036] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0038] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein.

[0039] In this application, the terms "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0040] Furthermore, the terms "set up," "connect," and "fix" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this disclosure according to the specific circumstances.

[0041] Unless otherwise stated, the term "multiple" means two or more.

[0042] As mentioned in the background section, the architecture of separating the interface components from the motherboard in switching equipment is already a mature application. The interface components typically consist of multiple optical modules stacked along the height direction, while the motherboard is arranged horizontally relative to the chassis base. The motherboard has multiple conversion connectors, and the conversion connectors are electrically connected to each optical module via wiring harnesses.

[0043] However, when the motherboard is horizontally arranged, the interface end located at the top of the interface assembly needs to cross a relatively long distance with the adapter connector at the far end of the motherboard, resulting in a longer cable harness and higher insertion loss in this part of the cable harness. In addition, due to the horizontal placement of the motherboard, there is a height difference between the interface end located at the bottom of the interface assembly and the adapter connector at the near end of the motherboard, requiring the cable harness to make small-radius bends in the vertical direction. This places strict requirements on the bending radius of the cables and makes cable routing difficult.

[0044] Based on the above description, one or more embodiments of this application provide a wire harness interface connection device and an electronic device. In the wire harness interface connection device, by tilting the motherboard, the wire harness length between the upper interface unit and the corresponding conversion connector is effectively shortened, reducing insertion loss. At the same time, the height difference between the lower interface unit and the corresponding conversion connector is shortened, avoiding multiple small-radius bends in the wire harness and improving the overall wire harness routing.

[0045] The following description, in conjunction with the accompanying drawings, illustrates the solutions of the embodiments of this application.

[0046] like Figure 1 As shown, the wire harness interface connection device provided in this application embodiment includes an interface component 100, a motherboard 200, and at least two sets of conversion connectors 300.

[0047] The interface assembly 100 includes at least two interface units 110 stacked along the height direction, and the interface ends 111 of the at least two interface units 110 are arranged facing the same side;

[0048] The motherboard 200 is located on the opening side of the interface end 111. The motherboard 200 has a first side 210 near the interface assembly 100 and a second side 220 away from the interface assembly 100. The horizontal height of the first side 210 is lower than the horizontal height of the second side 220, so that the motherboard 200 is arranged at an angle in the relative height direction. At least two conversion connectors 300 are sequentially arranged on the motherboard 200 along the height direction. Among the at least two interface units 110, the interface end 111 located on the lower layer is connected to the conversion connector 300 near the first side 210 through a wire harness 400, and the interface end 111 located on the upper layer is connected to the conversion connector 300 near the second side 220 through a wire harness 400.

[0049] In this embodiment, the interface unit 110 is an optical module cage. The optical module cage has a receiving cavity for inserting and fixing the optical module. The optical module cage is also provided with an interface end 111 for connecting the wire harness 400 to lead the signal of the optical module to the conversion connector 300. Here, the connection between the optical module cage and the optical module can refer to the relevant technology, which will not be repeated in this embodiment.

[0050] The motherboard 200 is equipped with a switching chip 250, which is used to process the data received and transmitted by the optical modules. The interface end 111 of each optical module cage is connected to the corresponding conversion connector 300 on the motherboard 200 through the wiring harness 400. The signal generated by the optical module is transmitted to the interface end 111 through the internal wiring of the optical module cage, and then transmitted to the conversion connector 300 through the wiring harness 400. It is then gathered to the switching chip 250 through the wiring on the motherboard 200. The switching chip 250 communicates with each conversion connector 300 through the internal wiring of the motherboard 200, thereby completing the centralized switching processing of multiple optical module signals.

[0051] like Figure 2 As shown, in some embodiments, the conversion connector 300 has multiple sets arranged around the circumferential edge of the switching chip 250, and each set of conversion connectors 300 has at least two sub-connectors 310 arranged in an array along the edge side of the motherboard 200.

[0052] Here, by way of example, there are four sets of conversion connectors 300, each set located on the outer side of the circumferential edge of the switching chip 250, and the four sets of conversion connectors 300 collectively define a rectangular area corresponding to the switching chip 250. Each set of conversion connectors 300 includes at least two sub-connectors 310 arranged in an array along the edge side of the motherboard 200, with a gap between the at least two sub-connectors 310 in the same set to facilitate insertion with the wiring harness 400 between the corresponding interface unit 110.

[0053] The conversion connectors 300 are arranged in a rectangular pattern around the switching chip 250. The signal transmission path from each set of conversion connectors 300 to the switching chip 250 is led out from each direction around the switching chip 250. The difference in the length of the wiring path in each direction is more controllable, which helps to ensure the consistency of signal transmission delay and the balance of signal quality between different interface ends 111 and the switching chip 250.

[0054] Furthermore, the interface assembly 100 also includes a plurality of stacked input / output boards 120, each input / output board 120 having at least one interface unit 110 on each of its opposite sides; the interface unit 110 located on the same input / output board 120 is correspondingly connected to a set of conversion connectors 300 on the same edge side.

[0055] Here, the input / output board 120 (IO board) is a hardware interface board used in electronic devices, industrial control systems, or computers to connect external devices to the main control system. The input / output board 120 can be fixed to the base plate 410 of the chassis 500 by a separate board bracket. Each of the two opposite sides of a single input / output board 120 carries an interface unit 110, which is fixed to the board surface of the input / output board 120. All the interface units 110 on a certain input / output board 120 belong to a specific conversion connector 300 on the motherboard 200 in the signal transmission link. This group of conversion connectors 300 is arranged in an array along a certain edge side of the motherboard 200. Each interface unit 110 on the input / output board 120 is connected to the corresponding sub-connector 310 in the group of conversion connectors 300 through a wire harness 400.

[0056] Therefore, the wiring harnesses 400 from the same input / output board 120 are spatially aligned and routed towards the same edge of the motherboard 200. The routing direction of the wiring harnesses 400 is consistent with the arrangement direction of the corresponding conversion connectors 300 on that edge, making the bundled path of the wiring harnesses 400 more organized and facilitating unified binding, fixing, and wiring management. The wiring harnesses 400 from different input / output boards 120 are routed to different edges of the motherboard 200, naturally separating the wiring harnesses 400 and effectively avoiding tangling and cross-interference between wiring harnesses 400 at different levels.

[0057] Furthermore, during assembly or maintenance, since the wiring harnesses 400 from the same input / output board 120 are spatially concentrated on the same edge side of the motherboard 200, independent assembly and disassembly operations can be performed on a single input / output board 120 and its corresponding conversion connector 300 without interference with the wiring harnesses 400 on other input / output boards 120, making assembly and disassembly more convenient.

[0058] It should be noted that the embodiments of this application... Figure 1The wiring harness 400 in the diagram is only for illustrative purposes. In actual operation, the pins of the different interface terminals 111 and the adapter connector 300 should be set accordingly. The two ends of the wiring harness 400 are respectively connected to the interface terminal 111 and the adapter connector 300 through a connector.

[0059] In this embodiment of the application, among the multiple interface units 110, the interface end 111 located at the bottom layer is connected to a set of conversion connectors 300 near the first side 210 via a wire harness 400, and the interface end 111 located at the top layer is connected to a set of conversion connectors 300 near the second side 220 via a wire harness 400.

[0060] Here, the motherboard 200 adopts a rectangular board, therefore it has Figure 2 The first side 210 and the second side 220 are illustrated in the diagram. The third side 230 is adjacent to the first side 210 and the second side 220, and the fourth side 240 is opposite to the third side 230. Among the multiple interface units 110, any intermediate layer interface end 111 located between the bottom layer and the top layer is connected to a set of conversion connectors 300 near the third side 230 or the fourth side 240 via a wire harness 400.

[0061] With the motherboard 200 tilted, the first side 210 is in a lower spatial position, the second side 220 is in a higher spatial position, and the third side 230 and the fourth side 240 gradually rise from the first side 210 to the second side 220, with their horizontal height between the first side 210 and the second side 220.

[0062] The motherboard 200 has multiple sets of conversion connectors 300, including a first conversion connector located near the first side 210, a second conversion connector located near the second side 220, a third conversion connector located near the third side 230, and a fourth conversion connector located near the fourth side 240. Each set of conversion connectors 300 is arranged in an array along the edge of the motherboard 200 to which it is located.

[0063] The interface end 111 of the bottom-level interface unit 110 is connected to the first conversion connector near the first side 210 via a wire harness 400. Since the bottom-level interface unit 110 is at the lowest position, the vertical height difference between its interface end 111 and the first conversion connector is small. After the wire harness 400 is led out from the bottom-level interface end 111, it can run directly towards the first side 210 and connect to the corresponding first conversion connector. The wiring path is short and there are no obvious bends, and the routing of the wire harness 400 is more reasonable.

[0064] The interface end 111 of the top interface unit 110 is connected to the second conversion connector near the second side 220 via a wire harness 400. The top interface unit 110 is in the highest position. Because the second side 220 is raised, the straight-line distance between its interface end 111 and the second conversion connector is shortened, and the length of the wire harness 400 is shortened accordingly.

[0065] Here, in the interface terminal 111 located in the middle layer, the interface terminal 111 near the third side 230 is connected to a set of conversion connectors 300 near the third side 230 via a wire harness 400, and the interface terminal 111 near the fourth side 240 is connected to a set of conversion connectors 300 near the fourth side 240 via a wire harness 400.

[0066] Any intermediate layer interface unit 110 located between the bottom and top layers has its interface end 111 connected via a wiring harness 400 to a set of adapter connectors 300 near the third side 230 or near the fourth side 240. The intermediate layer interface unit 110 is positioned in the middle of the height direction, and the height of its interface end 111 is adapted to the height range corresponding to the third side 230 and the fourth side 240. The wiring harness 400 extending from the intermediate layer interface end 111 can be led out towards the third side 230 and connected to the third adapter connector near the third side 230, or led out towards the fourth side 240 and connected to the fourth adapter connector near the fourth side 240.

[0067] Here, different intermediate layer interface units 110 can be connected to the conversion connectors 300 of the third side 230 or the fourth side 240 respectively according to specific layout requirements or height orientation, so as to realize the sharing of wiring on both sides. For example, when a four-layer input / output board 120 is provided, in the interface end 111 of the interface unit 110 on the second layer input / output board 120, the interface end 111 near the third side 230 is connected to the third conversion connector, and the interface end 111 near the fourth side 240 is connected to the fourth conversion connector. Similarly, in the interface end 111 of the interface unit 110 on the third layer input / output board 120, the interface end 111 near the third side 230 is connected to the third conversion connector, and the interface end 111 near the fourth side 240 is connected to the fourth conversion connector, thereby realizing a layered and partitioned wiring layout.

[0068] Furthermore, since there is also a height difference between the different sub-connectors 310 of the same conversion connector 300, as an alternative implementation, the interface terminal 111 of the interface unit 110 on the upper side of the input / output board 120 on the same layer can be connected to the sub-connector 310 of the third conversion connector at a relatively high position, or to the sub-connector 310 of the fourth conversion connector at a relatively high position. Alternatively, the interface terminal 111 of the interface unit 110 on the lower side of the input / output board 120 on the same layer can be connected to the sub-connector 310 of the third conversion connector at a relatively low position, or to the sub-connector 310 of the fourth conversion connector at a relatively low position.

[0069] Thus, the wiring harness 400 is naturally separated into different edge areas of the motherboard 200 according to the different levels of the interface unit 110. The bottom layer wiring harness 400 goes to the lower side, the top layer wiring harness 400 goes to the higher side, and the middle layer wiring harness 400 goes to both sides. The paths of the wiring harness 400 are independent of each other in space, avoiding the cross-entanglement and accumulation of wiring harnesses 400 at different levels. The overall wiring is neat and orderly, improving the orderliness and assemblability of the wiring inside the wiring harness interface connection device. At the same time, it is also conducive to ensuring the consistency of the signal transmission path between each interface end 111 and the corresponding conversion connector 300.

[0070] like Figure 1 and Figure 3 As shown, in some embodiments, the wire harness interface connection device further includes a chassis 500 and a mounting bracket 510. The interface assembly 100 and the motherboard 200 are both disposed in the chassis 500. The mounting bracket 510 is disposed in the chassis 500 and has an inclined support plate 511. The motherboard 200 is connected to the support plate 511 so that the motherboard 200 is at a preset tilt angle.

[0071] In the above embodiments, the motherboard 200 can be directly tilted at a preset angle by being mounted on the support plate 511, without the need for irregular processing or bending of the motherboard 200 itself, which helps to ensure the structural integrity and flatness of the motherboard 200. The mounting bracket 510 is fixed to the chassis 500, and the motherboard 200 and the mounting bracket 510 can be pre-assembled in a modular manner before being installed as a whole into the chassis 500, making the assembly process more convenient and faster. The support plate 511 provides stable rigid support for the tilt posture, preventing the motherboard 200 from changing its angle due to vibration and impact during use or transportation, ensuring the stability of the tilt angle of the motherboard 200 and the reliability of the connection relationship between each interface end 111 and the corresponding conversion connector 300.

[0072] For example, the mounting bracket 510 includes a support rod 512 and an adjusting rod. One end of the support rod 512 is connected to the base plate 410 of the chassis 500, and the other end is hinged to one end of the support plate 511 corresponding to the first side 210. The adjusting rod includes a connecting rod 513 connected to the base plate 410 and a telescopic rod 514 slidably disposed on the connecting rod 513. The telescopic rod 514 is hinged to one end of the support plate 511 corresponding to the second side 220. The height of the telescopic rod 514 on the connecting rod 513 is adjustable.

[0073] Here, the size of the support plate 511 can be set with reference to the size of the main board 200. The support plate 511 and the main board 200 are connected by screws so that the support plate 511 is arranged parallel to the main board 200. Therefore, the support plate 511 also has four sides corresponding to the first side 210, the second side 220, the third side 230 and the fourth side 240.

[0074] One end of the support rod 512 is fixedly connected to the bottom plate 410 of the chassis 500, and the other end of the support rod 512 is hinged to the side of the first side 210 of the support plate 511. The hinged connection allows the support plate 511 to rotate around the connection point between the support rod 512 and the support plate 511 within a certain angle range. The support rod 512 provides stable vertical support for the side of the first side 210 of the support plate 511, serving as a fulcrum for the tilting posture of the support plate 511.

[0075] Similarly, the telescopic rod 514 and the support plate 511 are hinged to the sides of the corresponding second side 220. When the telescopic rod 514 slides to different positions relative to the connecting rod 513 and is fixed, the side of the corresponding second side 220 of the support plate 511 is raised or lowered, and the support plate 511 rotates around the hinge point of the support rod 512, causing the tilt angle of the support plate 511 to change accordingly. Thus, the tilt angle of the main board 200 can be flexibly set by adjusting the height of the telescopic rod 514.

[0076] During assembly, operators can flexibly adjust the tilt angle of the motherboard 200 according to the stacking height of different interface units 110, the length specifications of the wire harness 400, or the insertion loss optimization requirements, without having to replace the mounting bracket 510. The adjustment operation can be completed simply by changing the fixed position of the telescopic rod 514 on the connecting rod 513, making the adjustment method simple.

[0077] Specifically, the connecting rod 513 is provided with a plurality of positioning holes 515 at intervals along its length, and the telescopic rod 514 is provided with a plurality of mating holes 516 at intervals along its own length. The positioning holes 515 and the mating holes 516 are connected by fasteners 517 through which they pass to fix the telescopic rod 514 on the connecting rod 513.

[0078] After the telescopic rod 514 slides on the connecting rod 513 to the desired height, a positioning hole 515 and a mating hole 516 that are aligned at this point are selected. A fastener 517 is then inserted into both the positioning hole 515 and the mating hole 516. The fastener 517 secures the telescopic rod 514 and the connecting rod 513 in their current position, preventing the telescopic rod 514 from sliding relative to the connecting rod 513. The fastener 517 can be a bolt, pin, or other detachable plug-in fastener.

[0079] When it is necessary to change the tilt angle of the support plate 511, remove the fastener 517 from the positioning hole 515 and the mating hole 516 to release the locking state between the telescopic rod 514 and the connecting rod 513, allowing the telescopic rod 514 to slide freely along the connecting rod 513. Move the telescopic rod 514 to the new target height position, realign the corresponding positioning hole 515 and the mating hole 516, and insert the fastener 517 again to complete the fixation, thus completing the adjustment of the tilt angle.

[0080] It should be noted that in some embodiments, the connecting rod 513 and the telescopic rod 514 can be slidably connected by a slide rail to further improve the connection stability of the connecting rod 513 and the telescopic rod 514; the hinge form between the telescopic rod 514 and the support plate 511, and between the support rod 512 and the support plate 511 can refer to the hinge structure in related technologies, for example, using a pin hinge that passes through both. The support rod 512 and the base plate 410 of the chassis 500, and the connecting rod 513 and the base plate 410 of the chassis 500 can also be directly connected by bolts, as long as the mounting bracket 510 is fixed in the chassis 500.

[0081] For example, the preset tilt angle of the motherboard 200 is in the range of 30°-80°. The preset tilt angle of the motherboard 200 can also be flexibly adjusted for different stacked numbers of interface units 110.

[0082] When the number of input / output boards 120 stacked in the interface assembly 100 is large and the overall height of the interface unit 110 is large, the top interface unit 110 is located at a higher position. In order to shorten the distance between the top interface unit 110 and the conversion connector 300 and reduce the length of the wire harness 400, the second side 220 of the motherboard 200 needs to be raised further, that is, the tilt angle of the motherboard 200 is increased, so that the second side 220 is closer to the top interface end 111.

[0083] When the number of input / output boards 120 stacked in the interface assembly 100 is small and the overall height of the interface unit 110 is small, the top interface unit 110 is positioned low. If the motherboard 200 maintains its original tilt angle, the second side 220 may be raised excessively, resulting in an increased height difference between the conversion connector 300 near the second side 220 and the top interface end 111. This would make the vertical routing of the wire harness 400 steeper. In this case, the tilt angle of the motherboard 200 can be appropriately reduced to lower the height of the second side 220 to match the height of the lowered top interface unit 110, maintaining the smoothness of the wire harness 400 routing. Preferably, the horizontal height of the second side 220 should not be higher than the height of the top interface end 111.

[0084] In some embodiments, the connector end of the adapter 300 for connecting the wire harness 400 is positioned away from the switching chip 250. The connector end on the adapter 300 is an opening on the adapter 300 for inserting the connector of the wire harness 400. On the motherboard 200, the switching chip 250 is fixed to the central area of ​​the motherboard 200 surface, and each set of adapter connectors 300 is arranged around the circumferential edge of the switching chip 250. The connector end of the adapter 300 is opened in a direction away from the switching chip 250, that is, the opening direction of the connector end points towards the outer periphery of the motherboard 200, rather than towards the central area where the switching chip 250 is located.

[0085] The connector 300 is positioned away from the switching chip 250. The cable harness 400 is inserted from the outer periphery of the motherboard 200. The insertion and operation space of the cable harness 400 is located in the area between the periphery of the motherboard 200 and the side wall of the chassis 500. Operators do not need to perform insertion and removal operations above the switching chip 250, thus avoiding interference or accidental damage to the wiring of the switching chip 250 and the central area of ​​the motherboard 200 during operation.

[0086] Furthermore, the outward-facing connector layout ensures that all adapter connectors 300 are inserted towards the outside of the motherboard 200. Each set of wiring harnesses 400 is introduced from different sides of the motherboard 200, and the wiring paths of the harnesses 400 naturally extend outward following the connector orientation. The distribution of the harnesses 400 on the motherboard 200 converges from the periphery towards the center, leading to the switching chip 250, resulting in clear wiring hierarchy. Additionally, the outward-facing connectors prevent the harnesses 400 from crossing above the switching chip 250, providing ample space above the switching chip 250, which is beneficial for subsequent heat dissipation and maintenance.

[0087] Another embodiment of this application provides an electronic device including the wire harness interface connection device as described in any of the above embodiments, which has all the advantages of the wire harness interface connection device as described in any of the above embodiments.

[0088] The technical solutions of this application have been described above with reference to the preferred embodiments shown in the accompanying drawings. However, it is readily understood by those skilled in the art that the scope of protection of this application is obviously not limited to these specific embodiments. The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A wire harness interface connection device, characterized in that, include: An interface component (100) includes at least two interface units (110) stacked along the height direction, with the interface ends (111) of the at least two interface units (110) facing the same side; A motherboard (200) is disposed on the opening side of the interface terminal (111). The motherboard (200) has a first side (210) close to the interface assembly (100) and a second side (220) away from the interface assembly (100). The horizontal height of the first side (210) is lower than the horizontal height of the second side (220) so that the motherboard (200) is arranged at an angle relative to its height. The horizontal height of the second side (220) is not higher than the height of the top interface terminal (111). At least two sets of adapter connectors (300) are sequentially disposed on the motherboard (200) along the height direction; In at least two of the interface units (110), the interface end (111) located on the lower layer is connected to the conversion connector (300) near the first side (210) via a wire harness (400), and the interface end (111) located on the upper layer is connected to the conversion connector (300) near the second side (220) via a wire harness (400). In the plurality of interface units (110), the interface end (111) located at the bottom layer is connected to a set of conversion connectors (300) near the first side (210) via a wire harness (400), and the interface end (111) located at the top layer is connected to a set of conversion connectors (300) near the second side (220) via a wire harness (400). The motherboard (200) has a third side (230) adjacent to the first side (210) and the second side (220), and a fourth side (240) opposite to the third side (230). In the interface terminal (111) located in the middle layer, the interface terminal (111) near the third side (230) is connected to a set of conversion connectors (300) near the third side (230) via a wire harness (400), and the interface terminal (111) near the fourth side (240) is connected to a set of conversion connectors (300) near the fourth side (240) via a wire harness (400).

2. The wire harness interface connection device according to claim 1, characterized in that, The motherboard (200) is provided with a switching chip (250), and the conversion connector (300) has multiple sets arranged around the circumferential edge of the switching chip (250), each set of the conversion connector (300) including at least two sub-connectors (310) arranged in an array along the edge side of the motherboard (200).

3. The wire harness interface connection device according to claim 2, characterized in that, The interface assembly (100) also includes a plurality of stacked input / output boards (120), each of which has at least one interface unit (110) on each of its two opposite sides; the interface unit (110) located on the same input / output board (120) is correspondingly connected to a set of conversion connectors (300) on the same edge side via the wiring harness (400).

4. The wire harness interface connection device according to any one of claims 1 to 3, characterized in that, Also includes: The chassis (500) is provided, and the interface assembly (100) and the motherboard (200) are both located in the chassis (500); Mounting bracket (510) is disposed in the chassis (500). The mounting bracket (510) has an inclined support plate (511). The motherboard (200) is connected to the support plate (511) so that the motherboard (200) is at a preset tilt angle.

5. The wire harness interface connection device according to claim 4, characterized in that, The mounting bracket (510) includes: The support rod (512) is connected at one end to the bottom plate (410) of the chassis (500) and at the other end to the support plate (511) corresponding to the first side (210). The adjusting rod includes a connecting rod (513) connecting the base plate (410) and a telescopic rod (514) slidably disposed on the connecting rod (513). The telescopic rod (514) is hinged to one end of the support plate (511) corresponding to the second side (220). The height of the telescopic rod (514) on the connecting rod (513) is adjustable.

6. The wire harness interface connection device according to claim 5, characterized in that, The connecting rod (513) is provided with a plurality of positioning holes (515) spaced apart along its length, and the telescopic rod (514) is provided with a plurality of mating holes (516) spaced apart along its own length. The positioning holes (515) and the mating holes (516) are connected by fasteners (517) that pass through both of them, so as to fix the telescopic rod (514) on the connecting rod (513).

7. The wire harness interface connection device according to claim 2, characterized in that, The interface unit (110) is an optical module cage, and an optical module is inserted into the interface unit (110); the plug end of the conversion connector (300) for connecting the wire harness (400) is set away from the switching chip (250).

8. An electronic device, characterized in that, Includes the wire harness interface connection device as described in any one of claims 1 to 7.

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