Wafer processing polishing wheel surface topography dressing apparatus and control method and device

Abstract

The application relates to the technical field of automation, and particularly provides a wafer processing polishing wheel surface morphology grinding equipment and a control method and device thereof. The method comprises the following steps: obtaining a polishing wheel target morphology, determining a Z-axis interpolation distance based on the polishing wheel target morphology; obtaining a grinding tool assembly height value; obtaining a polishing wheel radius, a polishing wheel X-axis direction maximum interpolation stroke and a polishing wheel driving mechanism levelness error; determining a grinding starting Z-axis position according to the grinding tool assembly height value, and controlling the polishing wheel to be linked to perform surface interpolation grinding in the Z-axis and X-axis directions based on the Z-axis interpolation distance, the polishing wheel radius, the polishing wheel X-axis direction maximum interpolation stroke and the polishing wheel driving mechanism levelness error. The application can realize effective grinding control on the polishing wheel surface morphology, and makes the polishing wheel restore the target surface morphology.

Description

Technical Field

[0001] This application relates to the field of automation technology, and in particular to a wafer processing polishing wheel surface morphology grinding equipment and its control method, apparatus, computer equipment, storage medium and computer program product. Background Technology

[0002] In the wafer mechanical polishing process, the polishing wheel is in continuous high-speed frictional contact with the wafer and micro abrasives for a long time. Gradually, phenomena such as surface glazing, micropore blockage, abrasive embedding, surface unevenness deformation, and surface roughness reduction will appear on the wheel surface. This will lead to a decrease in the cutting ability and leveling performance of the polishing wheel, affecting the wafer polishing efficiency, surface finish, and batch processing consistency.

[0003] To maintain the performance of polishing wheels, traditional processes typically employ diamond dressing mechanisms to scrape, level, and comb the surface of the polishing wheel to remove aged surface layers, unclog pores, and restore surface morphology. However, this dressing process lacks effective identification and control of the polishing wheel's surface morphology. The timing, amount, and parameters of dressing are difficult to match with the actual morphology of the wheel surface, resulting in poor dressing effects. The consistency and stability of the wheel surface morphology after dressing are poor, and the standard flatness and micro-roughness of the polishing wheel cannot be effectively restored.

[0004] Therefore, traditional techniques cannot effectively control the surface morphology of the polishing wheel, resulting in poor polishing effects and making it difficult to ensure the continuity of the wafer mechanical polishing process and the consistency of product quality. Summary of the Invention

[0005] Therefore, it is necessary to provide an effective wafer processing polishing wheel surface morphology grinding equipment and its control method, device, computer equipment, computer-readable storage medium and computer program product to address the above-mentioned technical problems.

[0006] In a first aspect, this application provides a method for controlling the surface morphology of a wafer processing polishing wheel. The method includes:

[0007] The target shape of the polishing wheel is obtained, and the Z-axis interpolation distance is determined based on the target shape of the polishing wheel; the polishing wheel is used for wafer processing.

[0008] Obtain the height measurement value of the sharpening assembly;

[0009] Obtain the radius of the polishing wheel, the maximum interpolation stroke of the polishing wheel in the X-axis direction, and the horizontality error of the polishing wheel drive mechanism;

[0010] The starting Z-axis position for grinding is determined based on the height measurement of the grinding assembly. Based on the Z-axis interpolation distance, the radius of the polishing wheel, the maximum interpolation stroke of the polishing wheel in the X-axis direction, and the horizontality error of the polishing wheel drive mechanism, the polishing wheel is controlled to perform surface interpolation grinding in conjunction along the Z-axis and X-axis directions.

[0011] In one embodiment, obtaining the height measurement value of the sharpening assembly includes:

[0012] The center of the polishing wheel is controlled to move toward the grinding assembly along the Z-axis.

[0013] Obtain the pressure value between the polishing wheel and the grinding tool assembly;

[0014] When the pressure value reaches the preset surface pressure threshold, the current Z-axis position of the polishing wheel is used as the height measurement value of the grinding assembly.

[0015] In one embodiment, obtaining the levelness error of the polishing wheel drive mechanism includes:

[0016] Determine the reference surface of the grinding assembly, which is the upper surface of the platform used to support the grinding table in the grinding assembly;

[0017] When the polishing wheel drive mechanism is at the X-axis origin, the first distance between the center point of the polishing wheel and the reference surface of the grinding assembly is obtained.

[0018] When the polishing wheel drive mechanism is at the positive limit position of the X-axis, obtain the second distance between the center point of the polishing wheel and the reference surface of the grinding assembly;

[0019] The levelness error of the polishing wheel drive mechanism is determined based on the difference between the first distance and the second distance.

[0020] In one embodiment, the starting Z-axis position for grinding is determined based on the height measurement of the grinding assembly, and the surface interpolation grinding is controlled to be performed in conjunction with the polishing wheel along the Z-axis and X-axis directions based on the Z-axis interpolation distance, the radius of the polishing wheel, the maximum interpolation stroke of the polishing wheel in the X-axis direction, and the levelness error of the polishing wheel drive mechanism.

[0021] Determine the starting Z-axis position for grinding based on the height measurement of the grinding assembly;

[0022] Determine the X-axis interpolation distance based on the radius of the polishing wheel;

[0023] The Z-axis interpolation target position is determined based on the Z-axis interpolation distance, X-axis interpolation distance, maximum interpolation stroke of the polishing wheel in the X-axis direction, and the horizontality error of the polishing wheel drive mechanism.

[0024] Obtain the X-axis interpolation speed and determine the Z-axis interpolation speed based on the X-axis interpolation speed;

[0025] The polishing wheel is controlled to move along the X-axis and Z-axis in conjunction with the X-axis interpolation speed and the Z-axis interpolation speed, and then moves to the Z-axis interpolation target position to perform surface interpolation and grinding.

[0026] In one embodiment, determining the Z-axis interpolation target position based on the Z-axis interpolation distance, X-axis interpolation distance, maximum interpolation stroke in the X-axis direction, and the levelness error of the polishing wheel drive mechanism includes:

[0027] Determine the current Z-axis and X-axis positions of the polishing wheel;

[0028] Starting from the position where the center of the polishing wheel is aligned with the grinding head of the grinding assembly, move the X-axis interpolation distance along the X-axis direction, and determine the position reached as the X-axis interpolation target position;

[0029] Calculate the difference between the target position for X-axis interpolation and the current position on the X-axis;

[0030] Divide the difference by the maximum interpolation travel in the X-axis direction to obtain the ratio;

[0031] Calculate the product of the Z-axis interpolation distance and the ratio, and subtract the product from the current Z-axis position to obtain the initial Z-axis interpolation target position;

[0032] The initial Z-axis interpolation target position is obtained by compensating for the horizontality error of the polishing wheel drive mechanism.

[0033] In one embodiment, obtaining the X-axis interpolation speed and determining the Z-axis interpolation speed based on the X-axis interpolation speed includes:

[0034] Obtain the X-axis interpolation speed;

[0035] Determine the Z-axis interpolation speed based on the X-axis interpolation speed, Z-axis interpolation distance, and X-axis interpolation distance.

[0036] In one embodiment, acquiring the target shape of the polishing wheel and determining the Z-axis interpolation distance based on the target shape of the polishing wheel includes:

[0037] Obtain the target morphology of the polishing wheel;

[0038] Based on the target morphology of the polishing wheel, determine the difference between the edge height and the center height of the polishing wheel;

[0039] The Z-axis interpolation distance is determined based on the difference between the edge height and the center height of the polishing wheel.

[0040] Secondly, this application also provides a device for controlling the surface morphology of a wafer processing polishing wheel. The device includes:

[0041] The first parameter acquisition module is used to acquire the target shape of the polishing wheel and determine the Z-axis interpolation distance based on the target shape of the polishing wheel; the polishing wheel is used for wafer processing.

[0042] The height measurement module is used to obtain the height measurement value of the grinding assembly;

[0043] The second parameter acquisition module is used to acquire the polishing wheel radius, the maximum interpolation stroke of the polishing wheel in the X-axis direction, and the horizontality error of the polishing wheel drive mechanism.

[0044] The interpolation and grinding control module is used to determine the starting Z-axis position of grinding based on the height measurement value of the grinding assembly, and to control the polishing wheel to perform surface interpolation and grinding in conjunction with the Z-axis and X-axis directions based on the Z-axis interpolation distance, the radius of the polishing wheel, the maximum interpolation stroke of the polishing wheel in the X-axis direction, and the horizontality error of the polishing wheel drive mechanism.

[0045] Thirdly, this application also provides a computer device. The computer device includes a memory and a processor, the memory storing a computer program, and the processor executing the computer program to perform the following steps:

[0046] The target shape of the polishing wheel is obtained, and the Z-axis interpolation distance is determined based on the target shape of the polishing wheel; the polishing wheel is used for wafer processing.

[0047] Obtain the height measurement value of the sharpening assembly;

[0048] Obtain the radius of the polishing wheel, the maximum interpolation stroke of the polishing wheel in the X-axis direction, and the horizontality error of the polishing wheel drive mechanism;

[0049] The starting Z-axis position for grinding is determined based on the height measurement of the grinding assembly. Based on the Z-axis interpolation distance, the radius of the polishing wheel, the maximum interpolation stroke of the polishing wheel in the X-axis direction, and the horizontality error of the polishing wheel drive mechanism, the polishing wheel is controlled to perform surface interpolation grinding in conjunction along the Z-axis and X-axis directions.

[0050] Fourthly, this application also provides a computer-readable storage medium. The computer-readable storage medium stores a computer program thereon, which, when executed by a processor, performs the following steps:

[0051] The target shape of the polishing wheel is obtained, and the Z-axis interpolation distance is determined based on the target shape of the polishing wheel; the polishing wheel is used for wafer processing.

[0052] Obtain the height measurement value of the sharpening assembly;

[0053] Obtain the radius of the polishing wheel, the maximum interpolation stroke of the polishing wheel in the X-axis direction, and the horizontality error of the polishing wheel drive mechanism;

[0054] The starting Z-axis position for grinding is determined based on the height measurement of the grinding assembly. Based on the Z-axis interpolation distance, the radius of the polishing wheel, the maximum interpolation stroke of the polishing wheel in the X-axis direction, and the horizontality error of the polishing wheel drive mechanism, the polishing wheel is controlled to perform surface interpolation grinding in conjunction along the Z-axis and X-axis directions.

[0055] Fifthly, this application also provides a computer program product. The computer program product includes a computer program that, when executed by a processor, performs the following steps:

[0056] The target shape of the polishing wheel is obtained, and the Z-axis interpolation distance is determined based on the target shape of the polishing wheel; the polishing wheel is used for wafer processing.

[0057] Obtain the height measurement value of the sharpening assembly;

[0058] Obtain the radius of the polishing wheel, the maximum interpolation stroke of the polishing wheel in the X-axis direction, and the horizontality error of the polishing wheel drive mechanism;

[0059] The starting Z-axis position for grinding is determined based on the height measurement of the grinding assembly. Based on the Z-axis interpolation distance, the radius of the polishing wheel, the maximum interpolation stroke of the polishing wheel in the X-axis direction, and the horizontality error of the polishing wheel drive mechanism, the polishing wheel is controlled to perform surface interpolation grinding in conjunction along the Z-axis and X-axis directions.

[0060] Sixthly, this application also provides a wafer processing polishing wheel surface morphology grinding device, including a controller, which uses the above-described method to control the wafer processing polishing wheel surface morphology grinding.

[0061] The aforementioned wafer processing polishing wheel surface morphology refining equipment and its control method, device, computer equipment, storage medium, and computer program products, by acquiring the Z-axis interpolation distance corresponding to the target morphology, enable the Z-axis downward pressure during the refining process to quantitatively match the required surface morphology; simultaneously, they acquire the height measurement value of the grinding tool assembly, providing an accurate starting height reference for refining. Based on this, the polishing wheel radius, the maximum interpolation stroke of the polishing wheel in the X-axis direction, and the levelness error of the polishing wheel drive mechanism are further acquired. The polishing wheel radius and the maximum interpolation stroke in the X-axis direction jointly define the range and proportional relationship of the interpolation movement, while the levelness error reflects the Z-axis height deviation caused by the drive mechanism during X-axis movement. During refining control, the starting Z-axis position for refining is determined based on the height measurement value of the grinding tool assembly, and the polishing wheel is controlled to perform surface interpolation refining along the Z-axis and X-axis directions based on the above parameters. This allows the refining trajectory to dynamically adjust the Z-axis target position according to the X-axis position, compensating for height changes caused by levelness error and avoiding distortion of the refining morphology due to uneven guide rails. Therefore, this application can achieve effective grinding control of the surface morphology of the polishing wheel, so that the polishing wheel can restore the target surface morphology. Attached Figure Description

[0062] Figure 1 This is an application environment diagram of a wafer processing polishing wheel surface morphology grinding control method in one embodiment;

[0063] Figure 2 This is a schematic flowchart of a method for controlling the surface morphology of a wafer processing polishing wheel in one embodiment;

[0064] Figure 3 This is a schematic flowchart of a method for controlling the surface morphology of a wafer processing polishing wheel in another embodiment;

[0065] Figure 4 This is a structural block diagram of a wafer processing polishing wheel surface morphology grinding control device in one embodiment;

[0066] Figure 5 This is an internal structural diagram of a computer device in one embodiment. Detailed Implementation

[0067] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0068] The wafer processing polishing wheel surface morphology control method provided in this application embodiment can be applied to, for example... Figure 1 In the application environment shown, the host computer 120 is connected to the polishing wheel drive mechanism 140. The polishing wheel drive mechanism 140 drives the polishing wheel 180 to move in the X and Z axes, adjusting the relative position between the polishing wheel 180 and the grinding assembly 160 to perform surface morphology grinding on the polishing wheel 180. The grinding assembly 160 may specifically include a grinding table 162 and a grinding head 164. Specifically, the host computer 120 acquires the target morphology of the polishing wheel and determines the Z-axis interpolation distance based on the target morphology; acquires the height measurement value of the grinding assembly; acquires the radius of the polishing wheel, the maximum interpolation stroke of the polishing wheel in the X-axis direction, and the levelness error of the polishing wheel drive mechanism; determines the starting Z-axis position for grinding based on the height measurement value of the grinding assembly, and controls the polishing wheel drive mechanism 140 to drive the polishing wheel to perform surface interpolation grinding along the Z and X axes based on the Z-axis interpolation distance, the radius of the polishing wheel, the maximum interpolation stroke of the polishing wheel in the X-axis direction, and the levelness error of the polishing wheel drive mechanism.

[0069] In one embodiment, such as Figure 2 As shown, a method for controlling the surface morphology of a wafer processing polishing wheel is provided, which is applied to... Figure 1 Taking the host computer 120 as an example, the explanation includes the following steps:

[0070] S200: Obtain the target shape of the polishing wheel and determine the Z-axis interpolation distance based on the target shape of the polishing wheel; the polishing wheel is used for wafer processing.

[0071] The target morphology of a polishing wheel refers to the desired macroscopic geometric shape of the working surface after grinding, such as a plane, an equilateral triangular pyramid, an inverted triangular pyramid, an arc surface, or other asymmetric curved surfaces. The Z-axis interpolation distance characterizes the amount of Z-axis variation required for the polishing wheel surface relative to a reference height at different X-axis positions. Specifically, the operator can input the target morphology parameters via a host computer, which then calculates the Z-axis interpolation distance based on a preset morphology model. For example, when the target morphology is a plane, the Z-axis interpolation distance can be set to zero or a constant value; when the target morphology is an equilateral triangular pyramid, the Z-axis interpolation distance can increase linearly with the distance from the X-axis to the polishing wheel center, resulting in greater edge removal than the central area; when the target morphology is an inverted triangular pyramid, the trend is reversed.

[0072] S400: Obtain the height measurement value of the sharpening assembly.

[0073] The grinding assembly includes a grinding table and a grinding head mounted on it. The height measurement of the grinding assembly is used to characterize the reference position of the polishing wheel in the Z-axis direction when the surface of the polishing wheel contacts the grinding head. This height measurement serves as the reference for determining the starting Z-axis position of the grinding process and directly affects the accurate application of the grinding removal amount in each stage. Specifically, to obtain the height measurement of the grinding assembly, the X-axis of the polishing wheel drive mechanism can be controlled to move, aligning the center of the polishing wheel with the grinding head. Then, the Z-axis is controlled to slowly lower the polishing wheel until its surface contacts the grinding head. The contact state can be detected by a pressure sensor. When the detected pressure value reaches a preset surface pressure threshold, the current Z-axis coordinate is recorded as the height measurement value of the grinding assembly. The preset surface pressure threshold can be set according to the polishing wheel material, the hardness of the grinding head, and the required height measurement accuracy. For example, it can be set to a lower pressure to avoid deformation of the polishing wheel while ensuring reliable contact.

[0074] S600: Obtains the radius of the polishing wheel, the maximum interpolation stroke of the polishing wheel in the X-axis direction, and the horizontality error of the polishing wheel drive mechanism.

[0075] The polishing wheel radius is the circumference radius of the polishing wheel's working surface, and its size directly determines the radial span of the X-axis interpolation motion. The maximum interpolation stroke of the polishing wheel in the X-axis direction refers to the maximum range within which the X-axis drive mechanism moves the polishing wheel along the X-axis. This range typically corresponds to the distance between the X-axis origin and the positive limit position, and is used to normalize the current X-axis position, thereby proportionally determining the Z-axis interpolation target position. The levelness error of the polishing wheel drive mechanism characterizes the installation deviation of the X-axis guide rail in the vertical direction; that is, the change in the height of its center point due to the guide rail being non-ideally level when the polishing wheel moves along the X-axis.

[0076] The levelness error of the polishing wheel drive mechanism can be obtained by measuring the distance between the center point of the polishing wheel and the reference surface of the grinding assembly at the X-axis origin and the positive limit position, respectively, and using the difference between the two distances as the levelness error; alternatively, an error curve can be fitted through multi-point measurements. Furthermore, if the drive mechanism itself has position feedback and height calibration functions, the corresponding data can be automatically read by the host computer. After obtaining the above parameters, the host computer can compensate for the Z-axis target position in subsequent interpolation movements, reducing the impact of guide rail installation deviations on the grinding morphology.

[0077] S800: Determines the starting Z-axis position for grinding based on the height measurement of the grinding assembly, and controls the polishing wheel to perform surface interpolation grinding in conjunction with the Z-axis and X-axis directions based on the Z-axis interpolation distance, polishing wheel radius, maximum interpolation stroke of the polishing wheel in the X-axis direction, and the horizontality error of the polishing wheel drive mechanism.

[0078] The host computer first determines the starting Z-axis position for grinding based on the height measurement of the grinding assembly. Specifically, the starting position can be determined by combining the height of the grinding head relative to the height measurement reference and the current amount of material removed during grinding. For example, based on the height measurement, subtracting the height of the grinding head and adding the initial amount of material removed during grinding yields the initial Z-axis descent position. Subsequently, the host computer controls the X-axis and Z-axis to move in tandem, causing the grinding head to scrape and trim the working surface radially along the polishing wheel. During this linkage, the host computer determines the Z-axis interpolation target position based on the current X-axis position, the radius of the polishing wheel, the maximum interpolation stroke in the X-axis direction, and the Z-axis interpolation distance. For example, when the X-axis moves from the center of the polishing wheel to the edge, the Z-axis target position can change proportionally with the X-axis position, resulting in different amounts of material removed at different radial positions, thus shaping the target morphology. Simultaneously, the host computer compensates for the Z-axis target position based on the levelness error of the polishing wheel drive mechanism, offsetting the additional height changes caused by the non-levelness of the guide rail, ensuring that the actual grinding trajectory is consistent with the target trajectory.

[0079] In this embodiment, the linkage between the X-axis and Z-axis can be achieved using absolute positioning. The host computer pre-acquires the target position coordinates of the X-axis and Z-axis, and then controls the X-axis and Z-axis to move to the corresponding positions. In other embodiments, speed feedforward or interpolation cycle control methods can also be used. Within each control cycle, the target position of the Z-axis is dynamically calculated based on the current actual position of the X-axis, and the Z-axis movement of the polishing wheel (drive mechanism) is adjusted in real time to achieve continuous surface grinding. Through the above steps, the surface morphology grinding process of the polishing wheel can be effectively controlled, restoring the surface cutting capability and leveling performance of the polishing wheel, and ensuring the consistency of wafer processing quality.

[0080] The aforementioned wafer processing polishing wheel surface morphology refining control method obtains the Z-axis interpolation distance corresponding to the target morphology, enabling the Z-axis downward pressure during refining to quantitatively match the required surface morphology. Simultaneously, it obtains the height measurement value of the grinding tool assembly, providing an accurate starting height reference for refining. Based on this, it further obtains the polishing wheel radius, the maximum interpolation stroke of the polishing wheel in the X-axis direction, and the levelness error of the polishing wheel drive mechanism. The polishing wheel radius and the maximum X-axis interpolation stroke together define the range and proportional relationship of the interpolation movement, while the levelness error reflects the Z-axis height deviation caused by the drive mechanism during X-axis movement. During refining control, the starting Z-axis position for refining is determined based on the height measurement value of the grinding tool assembly, and the polishing wheel is controlled to perform surface interpolation refining along the Z-axis and X-axis directions based on the above parameters. This allows the refining trajectory to dynamically adjust the Z-axis target position according to the X-axis position, compensating for height changes caused by levelness error and avoiding morphology distortion due to uneven guide rails. Therefore, this application can achieve effective refining control of the polishing wheel surface morphology, restoring the polishing wheel to the target surface morphology.

[0081] In one embodiment, obtaining the height measurement value of the sharpening assembly includes:

[0082] Step 2-1: Control the center of the polishing wheel to move towards the grinding tool assembly along the Z-axis.

[0083] The grinding assembly includes a grinding table and a grinding head mounted on the grinding table. The grinding table supports the grinding head. The polishing wheel's center moves along the Z-axis, meaning that the Z-axis drive mechanism moves the polishing wheel vertically towards the grinding assembly, bringing its surface into contact with the grinding head. Here, "the center of the polishing wheel" defines the relative position between the polishing wheel and the grinding assembly. During height measurement, the polishing wheel's center is aligned with the grinding head to ensure the contact point is within the effective working area of ​​the grinding head, preventing distortion of the height measurement results due to eccentric contact. In practical applications, the X-axis movement can first align the polishing wheel's center with the grinding head horizontally, and then the host computer controls the Z-axis drive mechanism to lower the polishing wheel. The descent process can employ segmented speed control; for example, approaching the grinding assembly at a higher speed first, then slowly approaching at a lower speed, to improve height measurement accuracy and avoid impact.

[0084] Step 2-2: Obtain the pressure value between the polishing wheel and the grinding tool assembly.

[0085] The pressure value can be obtained through a pressure sensor installed on the grinding assembly or the polishing wheel support mechanism. This pressure value is used to characterize whether effective contact has occurred between the polishing wheel and the grinding head, and the actual magnitude of the contact force. During the height measurement process, the host computer reads the pressure sensor signal in real time to determine the contact status. The pressure sensor can be installed on the support structure of the grinding assembly, or between the Z-axis drive mechanism and the polishing wheel, as long as it can sense the contact force between the polishing wheel and the grinding head.

[0086] Steps 2-3: When the pressure value reaches the preset surface pressure threshold, the Z-axis position of the current polishing wheel is used as the height measurement value of the grinding assembly.

[0087] The preset surface pressure threshold is the pressure value used to determine whether the polishing wheel and the grinding head have reached effective contact. This threshold should be preset according to the polishing wheel material, the grinding head hardness, and the required height measurement accuracy. This ensures reliable contact between the polishing wheel and the grinding head while avoiding excessive contact deformation that could affect the accuracy of height measurement. When the host computer detects that the pressure value has reached this threshold, it immediately controls the Z-axis to stop descending and records the coordinate value of the polishing wheel in the Z-axis direction at this time. This coordinate value is the height measurement value of the grinding assembly. This height measurement value can serve as the basis for subsequently determining the starting Z-axis position for grinding.

[0088] In practical applications, the height measurement process may include drying the grinding assembly beforehand. For example, a blowing mechanism can be used to clean the surface of the grinding table and grinding head to remove residual liquid and prevent abnormal pressure detection or damage to the polishing wheel due to moisture absorption. During the height measurement process, if the pressure value increases abnormally or exceeds the safety threshold, the host computer can immediately stop the descent and output an alarm signal to protect the polishing wheel and grinding head. Furthermore, the height measurement value of the grinding assembly can be converted with the height measurement data of the wafer processing station's platform to obtain the height difference between the grinding assembly and each processing station, which is used for position compensation in subsequent automated polishing processes.

[0089] In one embodiment, obtaining the levelness error of the polishing wheel drive mechanism includes:

[0090] Step 3-1: Determine the reference surface of the grinding assembly. The reference surface of the grinding assembly is the upper surface of the platform used to support the grinding table in the grinding assembly.

[0091] The grinding assembly includes a grinding table and a grinding head mounted on the grinding table. The grinding table is supported by a platform, the upper surface of which serves as the mounting reference surface for the grinding assembly. This reference surface provides a uniform and stable reference plane for measuring the height of the center point of the polishing wheel. Since the upper surface of the platform is typically precision-machined, it possesses high flatness and positional stability. Using it as the reference surface ensures the comparability of multiple measurement results and avoids introducing additional errors due to inconsistent measurement references.

[0092] Step 3-2: Obtain the first distance between the center point of the polishing wheel and the reference surface of the grinding assembly when the polishing wheel drive mechanism is at the X-axis origin position.

[0093] The polishing wheel drive mechanism can move the polishing wheel horizontally along the X-axis. When the drive mechanism is at the X-axis origin, the polishing wheel is at the beginning of its X-axis stroke. At this time, the distance between the center point of the polishing wheel and the reference surface of the grinding assembly is obtained; this distance is the height value in the Z-axis direction. This distance can be obtained manually using measuring tools and inputting the value into a host computer, or it can be read by an automatic measuring device such as a laser rangefinder or a contact displacement sensor connected to the host computer.

[0094] Step 3-3: Obtain the second distance between the center point of the polishing wheel and the reference surface of the grinding assembly when the polishing wheel drive mechanism is at the positive limit position of the X-axis.

[0095] Similar to step 3-2, when the drive mechanism moves the polishing wheel to the positive limit position of the X-axis, the polishing wheel is at the end of its X-axis stroke. At this time, the height value of the center point of the polishing wheel relative to the reference surface of the same grinding assembly is obtained and recorded as the second distance. The measurement of the first distance and the second distance should ensure that the same reference surface and the same measurement method are used to eliminate the influence of differences in the reference surface or measurement system on the results.

[0096] Steps 3-4: Determine the levelness error of the polishing wheel drive mechanism based on the difference between the first distance and the second distance.

[0097] Since the first distance and the second distance are the height values ​​of the polishing wheel's center point relative to the same reference plane at the X-axis origin and positive limit positions, respectively, the difference between them reflects the change in height of the center point in the Z-axis direction after the polishing wheel has moved a full stroke along the X-axis. If the X-axis guide rail of the polishing wheel drive mechanism is installed absolutely horizontally, the center height of the polishing wheel at different positions on the X-axis should remain constant, and the difference between the first distance and the second distance should be zero. If the difference is not zero, it indicates that the X-axis guide rail has a Z-axis tilt or undulation, i.e., a levelness error. The host computer can directly store this difference as a levelness error for compensation of the Z-axis target position during subsequent interpolation and grinding processes.

[0098] In one embodiment, such as Figure 3 As shown, the starting Z-axis position for grinding is determined based on the height measurement of the grinding assembly. Then, based on the Z-axis interpolation distance, polishing wheel radius, maximum interpolation stroke of the polishing wheel in the X-axis direction, and the horizontality error of the polishing wheel drive mechanism, the polishing wheel is controlled to perform surface interpolation grinding along the Z-axis and X-axis directions.

[0099] S810: Determine the starting Z-axis position for grinding based on the height measurement of the grinding assembly.

[0100] The height measurement of the grinding assembly is the Z-axis coordinate recorded when the polishing wheel surface contacts the grinding head, representing the contact reference between the polishing wheel and the grinding head. The initial Z-axis position for regrinding refers to the initial height position that the polishing wheel needs to reach when interpolation regrinding begins. Based on the height measurement of the grinding assembly, the host computer, combined with parameters such as the amount of material removed during regrinding and the height of the grinding head relative to the height reference, determines the initial Z-axis position for regrinding, ensuring a suitable initial cutting depth between the polishing wheel and the grinding head at the start of regrinding. Specifically, the host computer can directly use the height measurement of the grinding assembly as the reference origin for the initial Z-axis position for regrinding, and calculate the additional displacement required for the Z-axis to descend based on the amount of material removed during the regrinding, thus obtaining the initial Z-axis position for regrinding.

[0101] S820: Determine the X-axis interpolation distance based on the radius of the polishing wheel.

[0102] The X-axis interpolation distance refers to the displacement that the X-axis needs to travel during the interpolation motion, which defines the range of action of the interpolation motion in the radial direction of the polishing wheel. The radius of the polishing wheel directly determines the radial distance from the center to the edge of the polishing wheel. Therefore, the host computer uses the radius of the polishing wheel as the X-axis interpolation distance to ensure that the interpolation motion can cover the main radial area of ​​the polishing wheel's working surface.

[0103] S830: Determine the Z-axis interpolation target position based on the Z-axis interpolation distance, X-axis interpolation distance, maximum interpolation stroke of the polishing wheel in the X-axis direction, and the horizontality error of the polishing wheel drive mechanism.

[0104] The Z-axis interpolation target position refers to the target height that the Z-axis should reach when the X-axis moves to a certain position. It determines the removal depth of the polishing wheel surface at that radial position. The Z-axis interpolation distance corresponds to the total change in the Z-direction required by the target morphology. The X-axis interpolation distance and the maximum interpolation stroke of the polishing wheel in the X-axis direction are used together to determine the proportional relationship between the current X-axis position and the interpolation movement range. The levelness error of the polishing wheel drive mechanism is used to correct the Z-direction height deviation caused by the non-ideal levelness of the X-axis guideway.

[0105] Specifically, the host computer can calculate the X-axis position ratio based on the difference between the current X-axis position and the target X-axis interpolation position, combined with the maximum interpolation stroke of the polishing wheel in the X-axis direction; then multiply this ratio by the Z-axis interpolation distance to obtain the Z-axis change corresponding to the current X-axis position; finally, add this Z-axis change to the current Z-axis position and introduce levelness error compensation to obtain the target Z-axis interpolation position.

[0106] In one embodiment, determining the Z-axis interpolation target position based on the Z-axis interpolation distance, X-axis interpolation distance, maximum interpolation stroke in the X-axis direction, and the levelness error of the polishing wheel drive mechanism includes: determining the current Z-axis position and X-axis position of the polishing wheel; taking the position where the center of the polishing wheel is aligned with the grinding head of the grinding assembly as the starting point, moving the X-axis interpolation distance along the X-axis direction, and determining the reached position as the X-axis interpolation target position; calculating the difference between the X-axis interpolation target position and the current X-axis position; dividing the difference by the maximum interpolation stroke in the X-axis direction to obtain a ratio; calculating the product of the Z-axis interpolation distance and the ratio, and subtracting the product from the current Z-axis position to obtain the initial Z-axis interpolation target position; and compensating the initial Z-axis interpolation target position according to the levelness error of the polishing wheel drive mechanism to obtain the final Z-axis interpolation target position.

[0107] The Z-axis interpolation target position can be determined by the following relationship: Z-axis interpolation target position = Z-axis current position - Z-axis interpolation distance × (X-axis interpolation target position - X-axis current position) / maximum interpolation stroke of polishing wheel in the X-axis direction, and then compensation is made according to the levelness error.

[0108] S840: Obtain the X-axis interpolation speed and determine the Z-axis interpolation speed based on the X-axis interpolation speed.

[0109] The X-axis interpolation speed is the movement speed of the X-axis during the interpolation process, which can be preset by the host computer according to the grinding process requirements. The Z-axis interpolation speed must be matched with the X-axis interpolation speed to ensure that the Z-axis completes the corresponding interpolation displacement at the same time as the X-axis completes the interpolation distance, so that the actual grinding trajectory is consistent with the target morphology.

[0110] In one embodiment, obtaining the X-axis interpolation speed and determining the Z-axis interpolation speed based on the X-axis interpolation speed includes: obtaining the X-axis interpolation speed; and determining the Z-axis interpolation speed based on the X-axis interpolation speed, the Z-axis interpolation distance, and the X-axis interpolation distance.

[0111] Specifically, after the host computer obtains the set X-axis interpolation speed, it calculates the Z-axis interpolation speed based on the ratio of the Z-axis interpolation distance to the X-axis interpolation distance, combined with the X-axis interpolation speed. For example, it can be determined according to the following relationship: Z-axis interpolation speed = Z-axis interpolation distance / (X-axis interpolation distance / X-axis interpolation speed). Thus, when the X-axis movement speed is faster, the Z-axis speed increases accordingly; when the X-axis interpolation distance is larger or the Z-axis interpolation distance is smaller, the Z-axis speed decreases accordingly. In another embodiment, the host computer can also adopt a discrete interpolation cycle control method, calculating the corresponding Z-axis displacement increment based on the actual X-axis displacement increment within each interpolation cycle and converting it into a Z-axis speed command, thereby achieving real-time control of the linkage trajectory.

[0112] S850: Controls the polishing wheel to move along the X-axis and Z-axis at the X-axis interpolation speed and Z-axis interpolation speed, and moves to the Z-axis interpolation target position for surface interpolation and grinding.

[0113] The host computer generates motion control commands for the X and Z axes based on the determined Z-axis interpolation target position, X-axis interpolation speed, and Z-axis interpolation speed, controlling the polishing wheel to move simultaneously along the X and Z axes. As the X-axis drives the polishing wheel radially, the Z-axis synchronously adjusts the height of the polishing wheel, allowing the grinding head to scrape and trim the surface of the polishing wheel according to the target trajectory. Because the speed and position of the X and Z axes have been matched according to the target morphology and levelness error, the coordinated motion enables the polishing wheel surface to form the desired morphological change radially.

[0114] In one embodiment, acquiring the target shape of the polishing wheel and determining the Z-axis interpolation distance based on the target shape of the polishing wheel includes:

[0115] Step 1-1: Obtain the target morphology of the polishing wheel.

[0116] The target morphology of a polishing wheel refers to the desired surface geometry of the polishing wheel's working surface after grinding. This target morphology can be a planar surface, a centrally convex surface, a centrally concave surface, a conical surface, or other custom curved surfaces. The host computer can receive the target morphology type and corresponding parameters input by the operator through the user interface, or it can retrieve target morphology data matching the current wafer processing requirements from a preset process library.

[0117] Step 1-2: Based on the target shape of the polishing wheel, determine the difference between the edge height and the center height of the polishing wheel.

[0118] The difference between the edge height and center height of the polishing wheel is used to characterize the radial height variation of the target morphology. The edge height refers to the height of the outermost edge of the polishing wheel's working surface relative to a reference plane, while the center height refers to the height of the center of the polishing wheel's working surface relative to the same reference plane. When the target morphology is centrally convex, the center height is higher than the edge height; when the target morphology is centrally concave, the center height is lower than the edge height; when the target morphology is planar, the two heights are equal, and the difference is zero.

[0119] Steps 1-3: Determine the Z-axis interpolation distance based on the difference between the edge height and center height of the polishing wheel.

[0120] The Z-axis interpolation distance is the total Z-axis change required to achieve the target shape. The difference between the edge height and center height of the polishing wheel reflects the height difference from the center to the edge, and this difference directly determines the amount of height change required in the Z-axis during interpolation. Therefore, the host computer can directly use this difference as the Z-axis interpolation distance, or multiply it by a coefficient related to the geometry of the polishing wheel to obtain the Z-axis interpolation distance.

[0121] It should be understood that although the steps in the flowcharts of the above embodiments are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the above embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0122] Based on the same inventive concept, this application also provides a wafer processing polishing wheel surface morphology grinding control device for implementing the above-described wafer processing polishing wheel surface morphology grinding control method. The solution provided by this device is similar to the solution described in the above method; therefore, the specific limitations of one or more wafer processing polishing wheel surface morphology grinding control device embodiments provided below can be found in the above-described limitations of the wafer processing polishing wheel surface morphology grinding control method, and will not be repeated here.

[0123] In one embodiment, such as Figure 4 As shown, a wafer processing polishing wheel surface morphology grinding control device is provided, comprising:

[0124] The first parameter acquisition module 200 is used to acquire the target shape of the polishing wheel and determine the Z-axis interpolation distance based on the target shape of the polishing wheel; the polishing wheel is used for wafer processing.

[0125] The height measurement module 400 is used to obtain the height measurement value of the grinding assembly.

[0126] The second parameter acquisition module 600 is used to acquire the polishing wheel radius, the maximum interpolation stroke of the polishing wheel in the X-axis direction, and the horizontality error of the polishing wheel drive mechanism.

[0127] The interpolation and grinding control module 800 is used to determine the starting Z-axis position of grinding based on the height measurement value of the grinding assembly, and to control the polishing wheel to perform surface interpolation and grinding in conjunction along the Z-axis and X-axis directions based on the Z-axis interpolation distance, the radius of the polishing wheel, the maximum interpolation stroke of the polishing wheel in the X-axis direction, and the horizontality error of the polishing wheel drive mechanism.

[0128] In one embodiment, the height measurement module 400 is also used to control the center of the polishing wheel to move toward the grinding assembly along the Z-axis; to obtain the pressure value between the polishing wheel and the grinding assembly; and when the pressure value reaches a preset surface pressure threshold, to take the current Z-axis position of the polishing wheel as the height measurement value of the grinding assembly.

[0129] In one embodiment, the second parameter acquisition module 600 is further configured to determine the reference surface of the grinding assembly, which is the upper surface of the platform used to support the grinding table in the grinding assembly; acquire a first distance between the center point of the polishing wheel and the reference surface of the grinding assembly when the polishing wheel drive mechanism is at the X-axis origin position; acquire a second distance between the center point of the polishing wheel and the reference surface of the grinding assembly when the polishing wheel drive mechanism is at the positive limit position of the X-axis; and determine the levelness error of the polishing wheel drive mechanism based on the difference between the first distance and the second distance.

[0130] In one embodiment, the interpolation and grinding control module 800 is further configured to determine the starting Z-axis position for grinding based on the height measurement value of the grinding assembly; determine the X-axis interpolation distance based on the radius of the polishing wheel; determine the Z-axis interpolation target position based on the Z-axis interpolation distance, the X-axis interpolation distance, the maximum interpolation stroke of the polishing wheel in the X-axis direction, and the horizontality error of the polishing wheel drive mechanism; acquire the X-axis interpolation speed and determine the Z-axis interpolation speed based on the X-axis interpolation speed; control the polishing wheel to move along the X-axis and Z-axis in conjunction with the X-axis interpolation speed and the Z-axis interpolation speed, and move to the Z-axis interpolation target position for surface interpolation and grinding.

[0131] In one embodiment, the interpolation and grinding control module 800 is further configured to determine the current Z-axis and X-axis positions of the polishing wheel; starting from the position where the center of the polishing wheel is aligned with the grinding head of the grinding assembly, move the X-axis interpolation distance along the X-axis direction, and determine the reached position as the X-axis interpolation target position; calculate the difference between the X-axis interpolation target position and the current X-axis position; divide the difference by the maximum interpolation stroke in the X-axis direction to obtain the ratio; calculate the product of the Z-axis interpolation distance and the ratio, and subtract the product result from the current Z-axis position to obtain the initial Z-axis interpolation target position; compensate the initial Z-axis interpolation target position according to the horizontality error of the polishing wheel drive mechanism to obtain the final Z-axis interpolation target position.

[0132] In one embodiment, the interpolation and grinding control module 800 is further configured to acquire the X-axis interpolation speed and determine the Z-axis interpolation speed based on the X-axis interpolation speed, the Z-axis interpolation distance, and the X-axis interpolation distance.

[0133] In one embodiment, the first parameter acquisition module 200 is further configured to acquire the target shape of the polishing wheel; determine the difference between the edge height and the center height of the polishing wheel based on the target shape of the polishing wheel; and determine the Z-axis interpolation distance based on the difference between the edge height and the center height of the polishing wheel.

[0134] Each module in the aforementioned wafer processing polishing wheel surface morphology grinding control device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in the processor of a computer device in hardware form or independent of it, or stored in the memory of a computer device in software form, so that the processor can call and execute the corresponding operations of each module.

[0135] This application also provides a wafer processing polishing wheel surface morphology grinding device, including a controller, which uses the above method to control the wafer processing polishing wheel surface morphology grinding.

[0136] In one embodiment, a computer device is provided, which may be a terminal, and its internal structure diagram may be as follows: Figure 5 As shown, the computer device includes a processor, memory, communication interface, display screen, and input devices connected via a system bus. The processor provides computing and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system and computer programs. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage media. The communication interface is used for wired or wireless communication with external terminals; wireless communication can be achieved through Wi-Fi, mobile cellular networks, NFC (Near Field Communication), or other technologies. When executed by the processor, the computer program implements a method for controlling the surface morphology grinding of a wafer processing polishing wheel. The display screen can be an LCD screen or an e-ink display screen. The input devices can be a touch layer covering the display screen, buttons, a trackball, or a touchpad mounted on the computer device casing, or an external keyboard, touchpad, or mouse.

[0137] Those skilled in the art will understand that Figure 5 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0138] In one embodiment, a computer device is provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the above-described method for controlling the surface morphology of a wafer processing polishing wheel.

[0139] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon, which, when executed by a processor, implements the above-described method for controlling the surface morphology of a wafer processing polishing wheel.

[0140] In one embodiment, a computer program product is provided, including a computer program that, when executed by a processor, implements the above-described wafer processing polishing wheel surface morphology grinding control method.

[0141] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium. When executed, the computer program can include the processes of the embodiments of the above methods. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, etc., and are not limited to these.

[0142] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0143] The above embodiments are merely illustrative of several implementation methods of this application, and their descriptions are relatively specific and detailed. However, they should not be construed as limiting the scope of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A method for controlling the surface morphology of a wafer processing polishing wheel, characterized in that, The method includes: The target shape of the polishing wheel is acquired, and the Z-axis interpolation distance is determined based on the target shape of the polishing wheel; the polishing wheel is used for wafer processing. Obtain the height measurement value of the sharpening assembly; Obtain the radius of the polishing wheel, the maximum interpolation stroke of the polishing wheel in the X-axis direction, and the horizontality error of the polishing wheel drive mechanism; The starting Z-axis position for grinding is determined based on the height measurement of the grinding assembly. Based on the Z-axis interpolation distance, the radius of the polishing wheel, the maximum interpolation stroke of the polishing wheel in the X-axis direction, and the horizontality error of the polishing wheel drive mechanism, the polishing wheel is controlled to perform surface interpolation grinding in conjunction along the Z-axis and X-axis directions.

2. The method according to claim 1, characterized in that, The process of obtaining the height measurement value of the sharpening assembly includes: Control the center of the polishing wheel to move toward the grinding assembly along the Z-axis; Obtain the pressure value between the polishing wheel and the grinding assembly; When the pressure value reaches the preset surface pressure threshold, the current Z-axis position of the polishing wheel is used as the height measurement value of the grinding assembly.

3. The method according to claim 1, characterized in that, The levelness error of the polishing wheel drive mechanism includes: Determine the reference surface of the grinding assembly, which is the upper surface of the platform used to support the grinding table in the grinding assembly; When the polishing wheel drive mechanism is at the X-axis origin position, the first distance between the center point of the polishing wheel and the reference surface of the grinding assembly is obtained. The second distance between the center point of the polishing wheel and the reference surface of the grinding assembly is obtained when the polishing wheel drive mechanism is at the positive limit position of the X-axis. The levelness error of the polishing wheel drive mechanism is determined based on the difference between the first distance and the second distance.

4. The method according to claim 1, characterized in that, The step of determining the starting Z-axis position for grinding based on the height measurement of the grinding assembly, and controlling the polishing wheel to perform surface interpolation grinding in conjunction with the Z-axis and X-axis directions based on the Z-axis interpolation distance, the radius of the polishing wheel, the maximum interpolation stroke of the polishing wheel in the X-axis direction, and the levelness error of the polishing wheel drive mechanism, includes: The starting Z-axis position for grinding is determined based on the height measurement value of the grinding assembly. Determine the X-axis interpolation distance based on the radius of the polishing wheel; The Z-axis interpolation target position is determined based on the Z-axis interpolation distance, the X-axis interpolation distance, the maximum interpolation stroke of the polishing wheel in the X-axis direction, and the horizontality error of the polishing wheel drive mechanism. Obtain the X-axis interpolation speed and determine the Z-axis interpolation speed based on the X-axis interpolation speed; The polishing wheel is controlled to move along the X-axis and Z-axis in conjunction with the X-axis interpolation speed and the Z-axis interpolation speed, and moves to the Z-axis interpolation target position to perform surface interpolation and polishing.

5. The method according to claim 4, characterized in that, The step of determining the Z-axis interpolation target position based on the Z-axis interpolation distance, the X-axis interpolation distance, the maximum interpolation stroke in the X-axis direction, and the horizontality error of the polishing wheel drive mechanism includes: Determine the current Z-axis and X-axis positions of the polishing wheel; Starting from the position where the center of the polishing wheel is aligned with the grinding head of the grinding assembly, move the X-axis interpolation distance along the X-axis direction, and determine the reached position as the X-axis interpolation target position; Calculate the difference between the target position of the X-axis interpolation and the current position of the X-axis; Divide the difference by the maximum interpolation stroke in the X-axis direction to obtain the ratio; Calculate the product of the Z-axis interpolation distance and the ratio, and subtract the product from the current Z-axis position to obtain the initial Z-axis interpolation target position; The initial Z-axis interpolation target position is compensated based on the horizontality error of the polishing wheel drive mechanism to obtain the Z-axis interpolation target position.

6. The method according to claim 4, characterized in that, The step of obtaining the X-axis interpolation speed and determining the Z-axis interpolation speed based on the X-axis interpolation speed includes: Obtain the X-axis interpolation speed; The Z-axis interpolation speed is determined based on the X-axis interpolation speed, the Z-axis interpolation distance, and the X-axis interpolation distance.

7. The method according to claim 1, characterized in that, The step of acquiring the target shape of the polishing wheel and determining the Z-axis interpolation distance based on the target shape of the polishing wheel includes: Obtain the target morphology of the polishing wheel; Based on the target morphology of the polishing wheel, the difference between the edge height and the center height of the polishing wheel is determined; The Z-axis interpolation distance is determined based on the difference between the edge height and the center height of the polishing wheel.

8. A device for controlling the surface morphology of a wafer processing polishing wheel, characterized in that, The device includes: The first parameter acquisition module is used to acquire the target shape of the polishing wheel and determine the Z-axis interpolation distance based on the target shape of the polishing wheel; the polishing wheel is used for wafer processing. The height measurement module is used to obtain the height measurement value of the grinding assembly; The second parameter acquisition module is used to acquire the polishing wheel radius, the maximum interpolation stroke of the polishing wheel in the X-axis direction, and the horizontality error of the polishing wheel drive mechanism. The interpolation and grinding control module is used to determine the starting Z-axis position of grinding based on the height measurement value of the grinding assembly, and to control the polishing wheel to perform surface interpolation and grinding in conjunction along the Z-axis and X-axis directions based on the Z-axis interpolation distance, the radius of the polishing wheel, the maximum interpolation stroke of the polishing wheel in the X-axis direction, and the horizontality error of the polishing wheel drive mechanism.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 7.

10. A wafer processing polishing wheel surface morphology grinding device, characterized in that, The device includes a controller that performs wafer processing polishing wheel surface morphology control using the method described in any one of claims 1 to 7.

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