A polishing apparatus

Abstract

The application relates to the technical field of semiconductor processing, and discloses a polishing device. A positioning device of the polishing device is used for positioning a wafer; a material table device is used for carrying the wafer and driving the wafer to ascend and descend; a first rotating bearing assembly of the polishing device is used for carrying and driving a polishing pad to rotate; two pickup assemblies of a rotating device are symmetrically connected below two ends of a cross beam; a rotating driving assembly is connected to the middle part of the cross beam and is used for driving the cross beam to rotate, so that the two pickup assemblies move between the upper side of the polishing device and the upper side of the material table device; the pickup assembly located on the upper side of the material table device can exchange the wafer with the material table device; the pickup assembly located on the upper side of the polishing device can polish the wafer in cooperation with the polishing device; a cleaning device is used for cleaning the wafer; a mechanical arm is used for moving the wafer between a feeding material box and the positioning device, between the positioning device and the material table device, between the material table device and the cleaning device, and between the cleaning device and a discharging material box.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and more particularly to a polishing apparatus. Background Technology

[0002] In the entire semiconductor manufacturing process, CMP (Chemical-Mechanical Polishing) machines are mainly used for single-sided planar polishing of semiconductor wafers such as silicon wafers and silicon carbide. CMP polishing machines work by using the chemical components in the polishing slurry to create a slight chemical reaction with the wafer surface material, softening it. Subsequently, pressure is applied to the polishing head, causing relative motion with the polishing pad. Through mechanical friction, the reactants are physically removed, achieving the purpose of leveling.

[0003] Currently, most mainstream CMP polishing machines in the industry adopt a single-station serial operation mode. Wafers need to complete the entire process of loading, polishing, and unloading in sequence. The polishing process occupies the core station of the equipment throughout the entire process. During the polishing process, the equipment is in a waiting state until the polishing is completed before the next process can be carried out, resulting in low production efficiency.

[0004] Therefore, there is an urgent need for a polishing device to solve the aforementioned problems. Summary of the Invention

[0005] Based on the above, the purpose of this invention is to provide a polishing device that realizes wafer positioning, polishing and cleaning; the two pick-up components of the indexing device can work simultaneously, improving production efficiency.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A polishing apparatus, comprising: The feed box and the discharge box are used to hold unpolished wafers and polished wafers, respectively. A positioning device for positioning a wafer; A material platform device, which is used to support the wafer and drive the wafer to move up and down; The polishing apparatus includes a first rotating support component and a polishing pad, wherein the first rotating support component is used to support and drive the polishing pad to rotate; The indexing device includes a crossbeam, a rotary drive assembly, and two pick-up assemblies. The two pick-up assemblies are symmetrically connected below both ends of the crossbeam. The rotary drive assembly is driven and connected to the middle of the crossbeam and is used to drive the crossbeam to rotate, so that the two pick-up assemblies can move between the top of the polishing device and the top of the material table device, respectively. The pick-up assembly located above the material table device can exchange wafers with the material table device, and the pick-up assembly located above the polishing device can cooperate with the polishing device to polish the wafer. A cleaning device for cleaning the wafer; A robotic arm for moving the wafer between the feed hopper and the positioning device, between the positioning device and the feed platform device, between the feed platform device and the cleaning device, and between the cleaning device and the discharge hopper.

[0007] As a preferred technical solution for a polishing device, the rotary drive assembly includes a support plate, a bearing seat, a column, a turntable, and a first rotary drive component. The bearing seat is mounted on the support plate, the column passes through and is rotatably connected to the bearing seat, the top end of the column is connected to the middle of the crossbeam, the bottom end of the column is connected to the turntable, and the first rotary drive component is driven and connected to the turntable.

[0008] As a preferred technical solution for a polishing device, the rotary drive assembly further includes a limiting cylinder and a positioning pin. The limiting cylinder is connected to the lower part of the support plate, and limiting holes are provided on both sides of the turntable. The limiting cylinder is driven to the positioning pin. When the two picking components are respectively above the polishing device and above the material table device, the limiting cylinder can drive the positioning pin to pass through the limiting hole.

[0009] As a preferred technical solution for a polishing device, the pickup assembly includes a first rotary drive and an airbag polishing head. The first rotary drive is connected to the crossbeam, and the lower part of the first rotary drive is connected to the airbag polishing head and is used to drive the airbag polishing head to rotate.

[0010] As a preferred technical solution for a polishing device, the pickup assembly further includes a base and a first driving member. The base is slidably connected to the crossbeam along the length direction of the crossbeam, and the first driving member is driven to be connected to the base and used to drive the base to reciprocate along the length direction of the crossbeam.

[0011] As a preferred technical solution for a polishing device, the pickup assembly further includes two slide rails and multiple sliders. The two slide rails extend along the length direction of the crossbeam and are spaced apart above the crossbeam along the width direction of the crossbeam. The multiple sliders are connected to the bottom of the base and are slidably connected to the two slide rails respectively.

[0012] As a preferred technical solution for polishing equipment, the positioning device includes a fixed plate, support columns, multiple positioning rods, and a second driving component. The multiple support columns are disposed on the fixed plate and are used to support the wafer. The fixed plate is provided with multiple guide holes spaced apart circumferentially along the positioning axis. The guide holes extend radially along the positioning axis. The positioning rods correspond one-to-one with the guide holes, and the positioning rods are slidably connected to the guide holes. The second driving component is driven and connected to the multiple positioning rods and is used to drive the multiple positioning rods to synchronously approach or move away from the positioning axis. The multiple positioning rods can synchronously abut against the edge of the wafer located on the support columns.

[0013] As a preferred technical solution for a polishing device, the second driving component includes a second driving member, a driving disk, and multiple connecting rods. The multiple connecting rods are arranged at intervals along the circumference of the driving disk. One end of each connecting rod is rotatably connected to the driving disk, and the other end is rotatably connected to the positioning rod.

[0014] As a preferred technical solution for polishing equipment, the material stage device includes a third driving component, a support stage, and multiple limiting posts. The top of each limiting post is conical. Multiple limiting posts are arranged above the support stage. The wafer can be embedded between the multiple limiting posts. The third driving component is driven and connected to the support stage and is used to drive the support stage to rise and fall.

[0015] As a preferred technical solution for polishing equipment, the material table device, the polishing device, and the rotation device are in two sets.

[0016] The beneficial effects of this invention are as follows: This invention provides a polishing device. During processing, a robotic arm picks up a wafer from the feed hopper and moves it to a positioning device. The positioning device positions the wafer, and then the robotic arm picks up the positioned wafer and places it on a feed platform. The feed platform drives the wafer to rise so that a pick-up component located above the feed platform can pick up the wafer. Then, the rotation drive component of the indexing device drives the crossbeam to rotate so that the pick-up component that picks up the wafer rotates to above the polishing device. The pick-up component works with the polishing device to polish the wafer. After polishing, the rotation drive component drives the crossbeam to rotate so that the polished wafer rotates to above the feed platform. The pick-up component places the wafer on the feed platform, and the robotic arm picks up the wafer from the feed platform and moves it into a cleaning device. The cleaning device cleans the wafer, and finally, the robotic arm picks up the wafer from the cleaning device and moves it into the discharge hopper, completing the wafer polishing process. This invention achieves wafer positioning, polishing, and cleaning on the one hand; on the other hand, the two pick-up components of the transposition device can work simultaneously, with one pick-up component cooperating with the polishing device to polish the wafer, and the other pick-up component cooperating with the material table device to load and unload the wafer, thereby improving production efficiency. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of the present invention and these drawings without creative effort.

[0018] Figure 1 This is a front view of the polishing equipment provided in a specific embodiment of the present invention; Figure 2 This is a top view of the polishing equipment provided in a specific embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of the transposition device provided in a specific embodiment of the present invention; Figure 4 This is one of the structural schematic diagrams of the positioning device provided in a specific embodiment of the present invention; Figure 5 This is a second schematic diagram of the positioning device provided in a specific embodiment of the present invention; Figure 6 This is a schematic diagram of the material platform device provided in a specific embodiment of the present invention; Figure 7 This is a schematic diagram of the polishing device provided in a specific embodiment of the present invention.

[0019] The markings in the image are as follows: 10. Wafers; 1. Feed box; 2. Discharge box; 3. Positioning device; 31. Fixing plate; 311. Guide hole; 32. Support column; 33. Positioning rod; 34. Second driving component; 341. Second driving element; 342. Drive disc; 343. Connecting rod; 4. Material platform device; 41. Third drive component; 42. Support platform; 43. Limiting column; 5. Polishing device; 51. First rotating bearing assembly; 511. Second rotating drive component; 5111. Lower disc shaft; 5112. Second servo motor; 5113. Second driving pulley; 5114. Second driven pulley; 5115. Second belt; 5116. Rotary joint; 512. Lower polishing disc; 52. Polishing pad; 6. Indexing device; 61. Crossbeam; 62. Rotary drive assembly; 621. Support plate; 622. Bearing seat; 623. Column; 624. Turntable; 6241. Limiting hole; 625. Cylinder seat; 626. First rotary drive component; 6261. First servo motor; 6262. First driving pulley; 6263. First driven pulley; 6264. First belt; 627. Limiting cylinder; 63. Pickup assembly; 631. First rotary drive component; 632. Airbag polishing head; 633. Base; 634. First drive component; 635. Slide rail; 636. Slider; 7. Robotic arm; 8. Liquid supply assembly; 9. Dresser. Detailed Implementation

[0020] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0021] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0022] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0023] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0024] like Figures 1-3 As shown, this embodiment provides a polishing device, which includes a feed box 1, an output box 2, a positioning device 3, a table device 4, a polishing device 5, and a rotation device 6. The feed box 1 is used to hold unpolished wafers 10, and the output box 2 is used to hold polished wafers 10. The positioning device 3 is used to position the wafers 10. The table device 4 is used to support the wafers 10 and drive them to move up and down. The polishing device 5 includes a first rotating support component 51 and a polishing pad 52. The first rotating support component 51 is used to support and drive the polishing pad 52 to rotate. The rotation device 6 includes a crossbeam 61, a rotating drive component 62, and two pick-up components 63, which are symmetrically connected. Below both ends of the crossbeam 61, a rotary drive assembly 62 is connected to the middle of the crossbeam 61 and is used to drive the crossbeam 61 to rotate, so that the two pick-up assemblies 63 can move between the polishing device 5 and the material table device 4 respectively. The pick-up assembly 63 located above the material table device 4 can exchange wafers 10 with the material table device 4. The pick-up assembly 63 located above the polishing device 5 can cooperate with the polishing device 5 to polish the wafers 10. The cleaning device is used to clean the wafers 10. The robot arm 7 is used to move the wafers 10 between the feed box 1 and the positioning device 3, between the positioning device 3 and the material table device 4, between the material table device 4 and the cleaning device, and between the cleaning device and the discharge box 2.

[0025] During processing, the robotic arm 7 picks up the wafer 10 from the feed hopper 1 and moves it to the positioning device 3. The positioning device 3 positions the wafer 10. Then, the robotic arm 7 picks up the positioned wafer 10 and places it on the feed table device 4. The feed table device 4 drives the wafer 10 to rise so that the pick-up component 63 located above the feed table device 4 can pick up the wafer 10. Then, the rotation drive component 62 of the indexing device 6 drives the crossbeam 61 to rotate so that the pick-up component 63 picking up the wafer 10 rotates to above the polishing device 5. The pick-up component 63, in conjunction with the polishing device 5, polishes the wafer 10. After polishing, the rotation drive component 62 drives the crossbeam 61 to rotate, so that the polished wafer 10 rotates to the top of the material table device 4. The pick-up component 63 places the wafer 10 onto the material table device 4, and the robot arm 7 picks up the wafer 10 from the material table device 4 and moves it into the cleaning device. The cleaning device cleans the wafer 10, and finally, the robot arm 7 picks up the wafer 10 from the cleaning device and moves it into the discharge box 2, completing the wafer 10 polishing process. This invention achieves the positioning, polishing, and cleaning of the wafer 10. On the other hand, the two pick-up components 63 of the indexing device 6 can work simultaneously. One pick-up component 63, in conjunction with the polishing device 5, polishes the wafer 10, while the other pick-up component 63 performs loading and unloading with the material table device 4, improving production efficiency.

[0026] Furthermore, the rotary drive assembly 62 includes a support plate 621, a bearing housing 622, a column 623, a turntable 624, and a first rotary drive component 626. The bearing housing 622 is mounted on the support plate 621. The column 623 passes through and is rotatably connected to the bearing housing 622. The top end of the column 623 is connected to the middle of the crossbeam 61, and the bottom end of the column 623 is connected to the turntable 624. The first rotary drive component 626 is driven and connected to the turntable 624. The column 623 is rotatably connected to the bearing housing 622 via a bearing, improving rotational reliability. When the first rotary drive component 626 drives the turntable 624 to rotate, the rotation causes the column 623 and the crossbeam 61 to rotate, thereby adjusting the positions of the two pickup components 63.

[0027] In this embodiment, the first rotary drive component 626 includes a first servo motor 6261, a first drive pulley 6262, a first driven pulley 6263, and a first belt 6264. The first servo motor 6261 is connected to the first drive pulley 6262. The first drive pulley 6262 is connected to the first driven pulley 6263 via the first belt 6264. The first driven pulley 6263 is connected to the turntable 624. The first servo motor 6261 drives the first drive pulley 6262 to rotate. The first drive pulley 6262 drives the first driven pulley 6263 to rotate via the first belt 6264. The first driven pulley 6263 drives the turntable 624 and the column 623 to rotate.

[0028] Preferably, the rotary drive assembly 62 further includes a limiting cylinder 627 and a positioning pin. The limiting cylinder 627 is connected to the lower part of the support plate 621. Limiting holes 6241 are provided on both sides of the turntable 624. The limiting cylinder 627 is driven by the positioning pin. When the two pickup assemblies 63 are respectively above the polishing device 5 and the material table device 4, the limiting cylinder 627 can drive the positioning pin to pass through the limiting hole 6241. When the two pickup assemblies 63 rotate to the upper part of the polishing device 5 and the upper part of the material table device 4, the limiting cylinder 627 drives the positioning pin to extend, and the positioning pin passes through the limiting hole 6241. At this time, the turntable 624 cannot rotate, and the crossbeam 61 remains in a fixed position to prevent the indexing device 6 from shaking during processing. When it is necessary to adjust the position of the pickup assembly 63, the limiting cylinder 627 drives the positioning pin to retract, and the turntable 624 can continue to rotate. In this embodiment, the rotary drive assembly 62 further includes a cylinder seat 625, which is connected to the support plate 621, and a limiting cylinder 627 is connected to the cylinder seat 625.

[0029] Furthermore, the pickup assembly 63 includes a first rotary drive 631 and an airbag polishing head 632. The first rotary drive 631 is connected to the crossbeam 61, and its lower part is driven to connect to the airbag polishing head 632 for driving the airbag polishing head 632 to rotate. Above the material stage device 4, the airbag polishing head 632 can adsorb the wafer 10. On the polishing device 5, the airbag polishing head 632, carrying the wafer 10, is pressed onto the polishing pad 52. The first rotary drive 631 drives the airbag polishing head 632 carrying the wafer 10 to rotate, and the first rotary support assembly 51 drives the polishing pad 52 to rotate. Under the combined action of the polishing fluid, rotational motion, and pressure, the wafer 10 undergoes chemical mechanical polishing. It should be noted that the first rotary drive 631 can be a rotary motor, and the airbag polishing head 632 is existing technology; its specific structure and working principle will not be described in detail here.

[0030] Preferably, the pickup assembly 63 further includes a base 633 and a first driving member 634. The base 633 is slidably connected to the crossbeam 61 along its length. The first driving member 634 drives the base 633 to reciprocate along the length of the crossbeam 61. During polishing, the first driving member 634 drives the base 633 and the pickup assembly 63 to reciprocate in the horizontal direction. The first rotational driving member 631 drives the airbag polishing head 632 to rotate. The airbag polishing head 632 can not only rotate but also move horizontally, oscillating back and forth during polishing. This allows the wafer 10 to obtain a more complex motion trajectory, improving the polishing effect. In this embodiment, the first driving member 634 can be a lead screw drive module. Lead screw drive modules are existing technology, and their specific structure and working principle will not be described in detail here.

[0031] Preferably, the pickup assembly 63 further includes two slide rails 635 and multiple sliders 636. The two slide rails 635 extend along the length direction of the crossbeam 61 and are spaced apart above the crossbeam 61 along the width direction of the crossbeam 61. The multiple sliders 636 are connected to the bottom of the base 633 and are slidably connected to the two slide rails 635 respectively, so that the base 633 is slidably connected to the crossbeam 61.

[0032] In this embodiment, the material platform device 4, polishing device 5, and indexing device 6 are arranged in two sets. These two sets of material platform devices 4, polishing devices 5, and indexing devices 6 can function as parallel processing units or as serial processing units. When one unit fails, the other unit can continue operating normally. Alternatively, the number of units activated can be flexibly arranged according to production capacity requirements to ensure production efficiency. When used as serial units, different processing techniques and auxiliary materials can be employed to meet different processing needs.

[0033] Furthermore, such as Figure 4 and Figure 5 As shown, the positioning device 3 includes a fixed plate 31, support columns 32, multiple positioning rods 33, and a second driving component 34. The multiple support columns 32 are disposed on the fixed plate 31 and are used to support the wafer 10. The fixed plate 31 is provided with multiple guide holes 311 at intervals along the circumference of the positioning axis. The guide holes 311 extend radially along the positioning axis. The positioning rods 33 correspond one-to-one with the guide holes 311, and the positioning rods 33 are slidably connected to the guide holes 311. The second driving component 34 is driven and connected to the multiple positioning rods 33 and is used to drive the multiple positioning rods 33 to move synchronously closer to or away from the positioning axis. The multiple positioning rods 33 can synchronously abut against the edge of the wafer 10 located on the support column 32. In this embodiment, the second driving component 341 can be a motor. After the support column 32 carries the wafer 10, the second driving component 34 drives multiple positioning rods 33 to synchronously approach the positioning axis along the guide hole 311 until all positioning rods 33 abut against the edge of the wafer 10 located on the support column 32. At this time, the center of the wafer 10 coincides with the positioning axis, and the wafer 10 is aligned. The second driving component 34 then drives multiple positioning rods 33 to synchronously move away from the positioning axis along the guide hole 311.

[0034] In this embodiment, the second driving component 34 includes a second driving member 341, a driving disk 342, and multiple connecting rods 343. The multiple connecting rods 343 are spaced apart circumferentially along the driving disk 342. One end of each connecting rod 343 is rotatably connected to the driving disk 342, and the other end is rotatably connected to the positioning rod 33. When the second driving member 341 drives the driving disk 342 to rotate, the connecting rods 343 drive the positioning rods 33 to slide within the guide hole 311, thereby clamping or releasing the wafer 10. The multiple positioning rods 33 move inward or open simultaneously under the drive of the second driving member 341, which can achieve precise positioning of the wafer 10 and ensure the accuracy of subsequent gripping by the robotic arm 7.

[0035] Furthermore, such as Figure 6 As shown, the material stage device 4 includes a third drive unit 41, a support platform 42, and multiple limiting posts 43. Multiple limiting posts 43 are arranged above the support platform 42, with the top of each post 43 being conical. The wafer 10 can be embedded between the multiple limiting posts 43. The third drive unit 41 is driven and connected to the support platform 42 and is used to drive the support platform 42 to rise and fall. When placing the wafer 10, the conical shape guides the wafer 10, making it easier to embed between the multiple limiting posts 43. The three limiting posts 43 prevent the wafer 10 from shifting, ensuring that the airbag polishing head 632 can correctly pick up the wafer. The support platform 42 has a lifting function; driven by the third drive unit 41, the support platform 42, the wafer 10, and the limiting posts 43 can be raised, sending the wafer 10 below the airbag polishing head 632 for easy wafer pickup. The third drive unit 41 can be a cylinder.

[0036] Furthermore, the first rotating bearing assembly 51 includes a second rotating drive component 511 and a lower throwing plate 512. The second rotating drive component 511 can drive the lower throwing plate 512 to rotate. The second rotating drive component 511 includes a lower plate shaft 5111, a second servo motor 5112, a second driving pulley 5113, a second driven pulley 5114, and a second belt 5115. The lower plate shaft 5111 is connected below the lower throwing plate 512. The second servo motor 5112 is connected to the second driving pulley 5113. The second driving pulley 5113 is connected to the second driven pulley 5114 via the second belt 5115. The second driven pulley 5114 is connected to the lower plate shaft 5111. The second servo motor 5112 drives the second driving pulley 5113 to rotate. The second driving pulley 5113 drives the second driven pulley 5114 to rotate via the second belt 5115. The second driven pulley 5114 drives the lower plate shaft 5111 and the lower throwing plate 512 to rotate. Preferably, the lower end of the lower plate shaft 5111 is provided with a rotary joint 5116, through which cooling water can be introduced into the lower throwing plate 512 to achieve cooling of the lower throwing plate 512.

[0037] In this embodiment, as Figure 2 and Figure 7 As shown, the polishing apparatus 5 also includes a liquid supply assembly 8 and a dresser 9. The liquid supply assembly 8 sprays polishing liquid onto the surface of the polishing pad 52. Under the combined action of the polishing liquid, rotational motion, and pressure, the wafer 10 undergoes chemical mechanical polishing. The dresser 9 can correct the polishing pad 52 during processing. The liquid supply assembly 8 and the dresser 9 are existing technologies and will not be described in detail here.

[0038] like Figures 1-7 As shown in the figure, this embodiment also provides the working principle of the polishing equipment, as detailed below: The robotic arm 7 picks up the wafer 10 from the feed hopper 11 and places it on the positioning device 3. The positioning device 3 positions the wafer 10. The robotic arm 7 then picks up the positioned wafer 10 and places it on the liftable support platform 42. The airbag polishing head 632 moves to directly above the support platform 42. The third drive unit 41 drives the support platform 42 to rise, sending the wafer 10 below the airbag polishing head 632. The airbag polishing head 632 picks up the wafer 10. The rotation drive assembly 62 drives the crossbeam 61 to achieve a 180° rotation. The airbag polishing head 632 then picks up the wafer 10. After attaching the wafer 10, it is rotated 180° above the polishing pad 52. The airbag polishing head 632, carrying the wafer 10, presses it onto the lower polishing disk 512 on which the polishing pad 52 is attached. The second rotation drive component 511 drives the lower polishing disk 512 to rotate. The airbag polishing head 632 presses on the lower polishing disk 512 with a certain pressure while rotating. The liquid supply component 8 sprays polishing liquid onto the surface of the lower polishing disk 512. Under the combined action of polishing liquid, rotational motion and pressure, the wafer 10 is chemically and mechanically polished. The dresser 9 corrects the polishing pad 52. During the polishing process, the airbag polishing head 632 at the other end of the crossbeam 61 moves to the top of the material table device 4 to complete the loading action. After processing, the airbag polishing head 632 lifts up with the wafer 10 and rotates 180° to the top of the material table device 4. The support platform 42 rises to the airbag polishing head 632, and the airbag polishing head 632 breaks the vacuum to release the wafer 10. The wafer 10 falls onto the support platform 42, completing the unloading. The airbag polishing head 632 at the other end of the crossbeam 61 then carries the wafer 10 for processing. After being placed on the carrier platform 42, the robot arm 7 picks up the wafer 10 and puts it into the cleaning device. The wafer 10 is cleaned and spun dry in the cleaning device. The robot arm 7 then picks up the wafer 10 and places it into the discharge box 2, completing the entire process of the wafer 10 from the feeding box 1 to processing and back to the discharge box 2. There can be multiple robots 7, and they can also move on the linear track to ensure their picking and placing actions at the feeding box 1, positioning device 3, material platform device 4, cleaning device and discharge box 2.

[0039] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A polishing device, characterized in that, include: The feed box (1) and the discharge box (2) are used to hold unpolished wafers (10) and the discharge box (2) is used to hold polished wafers (10). Positioning device (3), the positioning device (3) is used to position the wafer (10); A material platform device (4) is used to carry the wafer (10) and drive the wafer (10) to move up and down; The polishing device (5) includes a first rotating support assembly (51) and a polishing pad (52). The first rotating support assembly (51) is used to support and drive the polishing pad (52) to rotate. The indexing device (6) includes a crossbeam (61), a rotation drive assembly (62), and two pick-up assemblies (63). The two pick-up assemblies (63) are symmetrically connected to the lower ends of the crossbeam (61). The rotation drive assembly (62) is connected to the middle of the crossbeam (61) and is used to drive the crossbeam (61) to rotate so that the two pick-up assemblies (63) can move between the upper part of the polishing device (5) and the upper part of the material table device (4). The pick-up assembly (63) located above the material table device (4) can exchange the wafer (10) with the material table device (4). The pick-up assembly (63) located above the polishing device (5) can cooperate with the polishing device (5) to polish the wafer (10). A cleaning device for cleaning the wafer (10). A robotic arm (7) is used to move the wafer (10) between the feed box (1) and the positioning device (3), between the positioning device (3) and the material platform device (4), between the material platform device (4) and the cleaning device, and between the cleaning device and the discharge box (2).

2. The polishing equipment according to claim 1, characterized in that, The rotary drive assembly (62) includes a support plate (621), a bearing seat (622), a column (623), a turntable (624), and a first rotary drive component (626). The bearing seat (622) is mounted on the support plate (621). The column (623) passes through and is rotatably connected to the bearing seat (622). The top end of the column (623) is connected to the middle of the crossbeam (61), and the bottom end of the column (623) is connected to the turntable (624). The first rotary drive component (626) is driven and connected to the turntable (624).

3. The polishing equipment according to claim 2, characterized in that, The rotary drive assembly (62) further includes a limiting cylinder (627) and a positioning pin. The limiting cylinder (627) is connected to the lower part of the support plate (621). Limiting holes (6241) are provided on both sides of the turntable (624). The limiting cylinder (627) is driven to be connected to the positioning pin. When the two picking assemblies (63) are respectively above the polishing device (5) and above the material table device (4), the limiting cylinder (627) can drive the positioning pin to pass through the limiting hole (6241).

4. The polishing equipment according to claim 1, characterized in that, The pickup assembly (63) includes a first rotary drive (631) and an airbag polishing head (632). The first rotary drive (631) is connected to the crossbeam (61), and the lower part of the first rotary drive (631) is connected to the airbag polishing head (632) and is used to drive the airbag polishing head (632) to rotate.

5. The polishing equipment according to claim 4, characterized in that, The pickup assembly (63) further includes a base (633) and a first drive member (634). The base (633) is slidably connected to the crossbeam (61) along the length direction of the crossbeam (61). The first drive member (634) is connected to the base (633) and is used to drive the base (633) to reciprocate along the length direction of the crossbeam (61).

6. The polishing equipment according to claim 5, characterized in that, The pickup assembly (63) further includes two slide rails (635) and multiple sliders (636). The two slide rails (635) extend along the length direction of the crossbeam (61) and are spaced apart above the crossbeam (61) along the width direction of the crossbeam (61). The multiple sliders (636) are connected to the bottom of the base (633) and are slidably connected to the two slide rails (635) respectively.

7. The polishing equipment according to claim 1, characterized in that, The positioning device (3) includes a fixed plate (31), support columns (32), a second driving component (34), and multiple positioning rods (33). The multiple support columns (32) are disposed on the fixed plate (31) and are used to support the wafer (10). The fixed plate (31) is provided with multiple guide holes (311) circumferentially spaced along the positioning axis. The guide holes (311) extend radially along the positioning axis. The positioning rods (33) correspond one-to-one with the guide holes (311), and the positioning rods (33) are slidably connected to the guide holes (311). The second driving component (34) is driven and connected to the multiple positioning rods (33) and is used to drive the multiple positioning rods (33) to move synchronously closer to or away from the positioning axis. The multiple positioning rods (33) can synchronously abut against the edge of the wafer (10) located on the support column (32).

8. The polishing equipment according to claim 7, characterized in that, The second driving component (34) includes a second driving member (341), a driving disk (342) and a plurality of connecting rods (343). The plurality of connecting rods (343) are arranged at intervals along the circumference of the driving disk (342). One end of the connecting rod (343) is rotatably connected to the driving disk (342), and the other end is rotatably connected to the positioning rod (33).

9. The polishing equipment according to claim 1, characterized in that, The material platform device (4) includes a third driving member (41), a support platform (42) and multiple limiting posts (43). The top of the limiting post (43) is conical. Multiple limiting posts (43) are provided above the support platform (42). The wafer (10) can be embedded between the multiple limiting posts (43). The third driving member (41) is driven and connected to the support platform (42) and is used to drive the support platform (42) to rise and fall.

10. The polishing apparatus according to any one of claims 1-9, characterized in that, The material platform device (4), the polishing device (5), and the indexing device (6) are two sets.

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