Microtome and double row cutting method

Abstract

The application provides a slicing machine and a double-row cutting method. A bearing device is assembled on a main body, and the bearing device has a connecting area configured to connect a workpiece. An overflow device is assembled on the main body, and the overflow device includes a first overflow element configured to overflow liquid towards the workpiece. A cutting device is assembled on the main body, and the cutting device includes a cutting net. The connecting area of the bearing device faces the cutting net. The connecting area of the bearing device can face and be directed towards the cutting net, so that the workpiece fixed on the connecting area can be in contact with the cutting net to perform a cutting operation. In this process, by setting the first overflow element and using the first overflow element to overflow liquid to the workpiece, the flow of the overflowed liquid is more moderate compared to the traditional direct spraying method, which can reduce the impact on the cutting net and avoid vibration.

Description

Technical Field

[0001] This application relates to the field of photovoltaic technology, and in particular to slicing machines and double-row cutting methods. Background Technology

[0002] Half-cell photovoltaic cells offer significant advantages and improved performance under shading conditions, which is crucial for increasing the overall power generation of building-integrated photovoltaics (BIPV) systems that are easily affected by other building obstructions. While half-cell cells increase power generation, their system design is similar to that of full-cell modules, without increasing installation costs, thus ensuring a lower LCOE (Levelized Cost of Energy).

[0003] Solar photovoltaic cells are the core component of solar cell modules. In solar cell production, there are two common types: full-cell cells and half-cell cells. A full-cell cell is made entirely of a single crystalline silicon cell; its manufacturing process is relatively simple, and therefore its price is relatively low. A half-cell cell is made by cutting a single crystalline silicon cell in half and then connecting the two halves to form the cell.

[0004] In actual testing, laser cutting of full-cell solar cells at the cell end results in an efficiency loss of over 0.05% compared to machining half-bars directly to the cell end. Currently, heterojunction solar cells are mostly used for heterojunction applications; however, half-cell cutting leads to approximately 40% capacity loss. Therefore, a double-row vertical cutting solution is an effective way to address this capacity loss.

[0005] When cutting crystal rods using a double-row vertical cutting scheme, coolant needs to be applied to address the problem of insufficient cooling of the steel wires caused by the absence of cutting fluid in the middle. However, the existing coolant spraying method is difficult to control the liquid flow position, which not only fails to achieve the desired cooling effect on the cutting mesh, but also causes collisions with the cutting mesh during the liquid flow descent, resulting in vibration of the cutting mesh and interference with the cutting process, causing abnormalities such as silicon wafer line marks and TTV. Summary of the Invention

[0006] Therefore, it is necessary to provide a slicer and a double-row cutting method to address the aforementioned technical problems.

[0007] This application provides a slicer, the slicer comprising:

[0008] Main body;

[0009] A support device, which is assembled to the main body, has a connection area configured for connecting a workpiece to be processed.

[0010] An overflow device is mounted on the main body, and the overflow device includes at least a first overflow element configured to overflow liquid toward the workpiece.

[0011] A cutting device, which is assembled on the main body, includes a cutting mesh, and the connecting area of ​​the supporting device faces the cutting mesh.

[0012] In one embodiment, the first overflow component is movably assembled relative to the main body; and / or,

[0013] The distance between the first overflow component and the surface of the cutting mesh is kept within 10mm.

[0014] In one embodiment, the first overflow element includes:

[0015] A first liquid container, wherein the first liquid container has a first liquid cavity inside;

[0016] A partition structure is provided in the first liquid chamber, and the opening of the first liquid chamber is divided into at least two overflow ports by the partition structure, each of the overflow ports being configured to overflow liquid in a different direction.

[0017] In one embodiment, the cross-sectional area of ​​the first liquid-containing cavity gradually decreases along the direction from the bottom to the opening of the first liquid-containing cavity; and / or,

[0018] The first liquid container is connected to an infusion line communicating with the first liquid container cavity. The infusion line is equipped with a flow control device configured to control the flow velocity of the liquid flowing through the infusion line; and / or,

[0019] At least one of the first liquid container and the separating structure is provided with a guiding structure, the guiding structure being configured to guide the liquid flowing out from the different overflow ports in different directions; and / or,

[0020] The partition structure is configured as a partition plate, which is mounted perpendicularly to the opening of the first liquid chamber, and at least a portion of the partition plate is higher than the opening of the first liquid chamber.

[0021] In one embodiment, the first liquid container is provided with a first buffer structure, the first buffer structure being configured to mitigate the impact force of the liquid flowing out of the overflow port; and / or,

[0022] The guide structure is configured as a guide plate, which is perpendicular to the partition plate.

[0023] In one embodiment, the partition plate is located at the center of the opening of the first liquid chamber, and the opening of the first liquid chamber is divided into a first overflow port and a second overflow port by the partition structure. A portion of the partition plate is located inside the first liquid chamber, and another portion is located outside the first liquid chamber.

[0024] The guide plate is located on the outer side of the partition plate, and the center of the guide plate is connected to the partition plate. The two sides of the guide plate are configured to guide the liquid flowing out of the first overflow port and the second overflow port in two opposite directions.

[0025] The first buffer structure is configured as a buffer plate, and the buffer plate is provided in the flow path of the liquid flowing out of at least one of the first overflow port and the second overflow port.

[0026] In one embodiment, the connection area is provided with a clearance space configured to accommodate the first overflow component.

[0027] In one embodiment, the connection area of ​​the bearing device has a groove, configured to form the clearance space; or...

[0028] The connecting area of ​​the bearing device is provided with at least a first protrusion and a second protrusion, and the gap between the first protrusion and the second protrusion is configured to form the clearance space; or...

[0029] The width of the clearance space is greater than the width of the first overflow component.

[0030] In one embodiment, the overflow device includes at least one second overflow member, wherein the first overflow member is configured to overflow liquid between two workpieces to be processed, and the second overflow member is configured to overflow liquid on the outside of the workpieces to be processed.

[0031] In one embodiment, the slicer includes:

[0032] A suspension device is mounted on the main body and connected to the first overflow component, used to control the movement of the first overflow component relative to at least one of the main body and the cutting mesh.

[0033] In one embodiment, the cutting device includes:

[0034] A support mechanism, wherein the cutting mesh is assembled into the support mechanism.

[0035] This application provides a double-row cutting method suitable for crystal rod cutting, the double-row cutting method including at least the following steps:

[0036] Two crystal rods are simultaneously cut using the cutting mesh of the cutting device;

[0037] Coolant is applied gently between the two crystal rods by overflow, ensuring that the coolant overflows and flows to the cutting mesh and the two crystal rods within a height range of 10 mm above the cutting mesh.

[0038] In one embodiment, two crystal rods are simultaneously cut using the cutting mesh of the cutting device, and an overflow device is used to apply overflow coolant between the two crystal rods.

[0039] During the cutting process, the position of the overflow device is adjusted synchronously as the cutting mesh deforms.

[0040] In the aforementioned slicing machine and double-row cutting method, the connecting area of ​​the supporting device can face and be directed towards the cutting mesh, allowing the workpiece fixed in the connecting area to contact the cutting mesh for cutting. During this process, by providing a first overflow component and applying liquid to the workpiece via overflow, the flow of the overflowing liquid is gentler compared to the traditional method of directly spraying liquid onto the workpiece. This reduces the impact on the cutting mesh and prevents vibration. Attached Figure Description

[0041] Figure 1 This is a three-dimensional structural diagram of a slicer provided in one embodiment of this application.

[0042] Figure 2 For example Figure 1 The diagram shows the planar structure of the slicer in its first working state.

[0043] Figure 3 For example Figure 1 The diagram shows the planar structure of the slicer in its second working state.

[0044] Figure 4 For example Figure 1 The diagram shows the planar structure of the slicer in its third working state.

[0045] Figure 5 This is a three-dimensional structural diagram of a support device provided in one embodiment of this application.

[0046] Figure 6 For example Figure 5 The diagram shows a planar structural schematic of the load-bearing device.

[0047] Figure 7 This is a three-dimensional structural diagram of a first overflow component provided in one embodiment of this application.

[0048] Figure 8 For example Figure 7 The diagram shows a planar structure of the first overflow component.

[0049] Icon labels:

[0050] 100. Parts to be processed;

[0051] 1000, Load-bearing device; 2000, Overflow device; 3000, Cutting device;

[0052] 1010, Connecting area; 1020, Leaving space; 1100, First protrusion; 1200, Second protrusion;

[0053] 2100, First overflow component; 2200, First liquid container; 2210, First liquid container cavity; 2220, Overflow port; 2300, Separation structure; 2400, Guiding structure; 2500, First buffer structure; 2600, Second overflow component; 2700, Second liquid container; 2800, Second liquid container cavity; 2900, Second buffer structure;

[0054] 3100, Cutting mesh; 3200, Supporting mechanism. Detailed Implementation

[0055] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0056] See Figures 1 to 4 As shown, this application provides a slicer, which includes a main body (not shown), a support device 1000, an overflow device 2000, and a cutting device 3000. The support device 1000 is assembled into the main body, and see also... Figure 5 and Figure 6 As shown, the carrier 1000 has a connection region 1010 configured to connect a workpiece 100. An overflow device 2000 is mounted to the main body and includes at least a first overflow member 2100 configured to overflow liquid toward the workpiece 100. A cutting device 3000 is mounted to the main body and includes a cutting mesh 3100, with the connection region 1010 of the carrier 100 facing the cutting mesh 3100.

[0057] Therefore, the key design points of the aforementioned slicer lie in the structural improvements to the traditional support device 1000 and overflow device 2000, as well as the coordinated operation between the support device 1000 and the overflow device 2000. For example... Figure 1 As shown, the slicing machine includes a main body serving as a mounting base. A support device 1000 is mounted to the main body and has a connection area 1010 specifically designed to hold the workpiece 100, such as a crystal ingot. An overflow device 2000 is also mounted to the main body and includes at least a first overflow element 2100 designed to apply liquid, such as coolant or cutting fluid, towards the workpiece 100 in an overflow manner. A cutting device 3000 is mounted to the main body, and its main component is a cutting mesh 3100.

[0058] like Figures 2 to 4 As shown, in the assembled state, the connecting area 1010 of the support device 1000 can face and be oriented towards the cutting mesh 3100, so that the workpiece 100 fixed to the connecting area 1010 can contact the cutting mesh 3100, thereby allowing it to be processed according to the... Figure 2 , Figures 3 to 4 The cutting operation is carried out by changing the state of the cutting mesh. In this process, by setting the first overflow member 2100 and applying liquid to the workpiece 100 in an overflow manner using the first overflow member 2100, the flow of the overflowing liquid is more gentle than the traditional method of directly spraying liquid onto the workpiece 100, which can reduce the impact on the cutting mesh 3100 and avoid vibration.

[0059] Meanwhile, by orienting the connection area 1010 of the bearing device 1000 toward the cutting mesh 3100, the spatial relationship between the workpiece 100, the overflow device 2000 and the cutting mesh 3100 can be ensured to be reasonable, and the coolant can be provided stably and evenly, thereby solving the cooling problem in double-row cutting.

[0060] To further optimize cooling and adapt to dynamic changes during the cutting process, the assembly method of the first overflow component 2100 and its relative position to the cutting mesh 3100 can be defined. For example, the first overflow component 2100 can be movably assembled relative to the main body. In this case, during the cutting process, the position of the first overflow component 2100 is not fixed, but can adaptively and synchronously move with the deformation (bowing) of the cutting mesh 3100, thereby always maintaining the optimal overflow position. For example, this optimal overflow position can be set such that the distance between the first overflow component 2100 and the mesh surface of the cutting mesh 3100 is kept within 10mm. Controlling the distance between the first overflow component 2100 and the cutting mesh 3100 within 10mm ensures that the overflowing liquid contacts the cutting mesh 3100 within a very short distance, thereby minimizing the impact force generated by the liquid's acceleration due to gravity during its fall. At the same time, this also allows the liquid to reach the cutting area more accurately, avoiding obstruction by other structures or splash loss.

[0061] Therefore, the first overflow component 2100 can be movably assembled, and the distance between the first overflow component 2100 and the mesh surface of the cutting mesh 3100 can always be kept within 10 mm. This allows for dynamic adjustment of the position of the first overflow component 2100, while ensuring that an ideal and extremely close overflow distance is maintained during the adjustment process, thereby achieving the best cooling effect and the weakest impact.

[0062] like Figure 7 and Figure 8 As shown, the first overflow component 2100 may include at least a first liquid container 2200 and a partition structure 2300. The first liquid container 2200 has a first liquid cavity 2210 inside. The partition structure 2300 is disposed within the first liquid container 2200, and the opening of the first liquid cavity 2210 is divided into at least two overflow ports 2220 by the partition structure 2300. Each overflow port 2220 is configured to overflow liquid in a different direction. For example, when the first overflow component 2100 is used between two crystal rods, the partition structure 2300 can divide the opening into two overflow ports 2220, one on the left and one on the right, each facing the direction of one of the two crystal rods. Alternatively, when the first overflow component 2100 is used between three crystal rods, the partition structure 2300 can divide the opening into three overflow ports 2220, each facing the direction of one of the three crystal rods. And so on, without further elaboration.

[0063] As can be seen from the above, the combination of the first liquid chamber 2210 and the partition structure 2300 allows liquid to enter the first liquid chamber 2210 from the bottom or side of the first liquid chamber 2200. When the liquid level rises above the lowest point of the partition structure 2300, the liquid will overflow smoothly from each overflow port 2220. Since the overflow is carried out by the gravity of the liquid itself, the flow rate and velocity of the liquid flowing out from each overflow port 2220 are relatively uniform, and there is no jet impact. Thus, the coolant can be evenly distributed between adjacent workpieces 100 to be processed.

[0064] In one embodiment, the cross-sectional area of ​​the first liquid-containing cavity 2210 can gradually decrease along the direction from the bottom to the opening of the cavity. For example, the first liquid-containing cavity 2210 can be designed as a cone or frustum shape that is narrower at the top and wider at the bottom. This gradual structural design ensures that, with a constant liquid inflow velocity, the rising speed of the liquid level in the first liquid-containing cavity 2210 gradually becomes more gradual, thereby making the liquid overflow from the overflow port 2220 more stable and uniform, avoiding turbulent or fluctuating overflow.

[0065] The first liquid container 2200 is connected to a delivery pipeline communicating with the first liquid chamber. The delivery pipeline is equipped with a flow control device configured to control the flow rate of the liquid flowing through the pipeline. This flow control device can be a manual valve or a solenoid proportional valve, etc., used to precisely control the flow rate of the liquid flowing through the delivery pipeline. By adjusting the input flow rate through the flow control device, the overflow rate and total amount can be controlled, thereby dynamically adjusting the coolant supply according to different stages of the cutting process (such as entry, rapid cutting, and retraction) or changes in the bow size, achieving refined process control.

[0066] At least one of the first liquid container 2200 and the partition structure 2300 is provided with a guiding structure 2400, which is configured to guide the liquid flowing out from different overflow ports 2220 in different directions. The guiding structure 2400 can guide the direction of the liquid flowing out from the different overflow ports 2220, allowing the overflowing liquid to flow more precisely to a predetermined target area. For example, the guiding structure 2400 can be a downwardly extending plate structure or a groove structure, guiding the overflowing liquid to a position closer to the side of the crystal rod. The guiding structure 2400 can be configured as a guiding plate, which can be vertically arranged relative to the partition plate. For example, the guiding plate can be vertically connected to the upper end of the partition structure 2300.

[0067] The partition structure 2300 is configured as a partition plate, which is vertically mounted relative to the opening of the first liquid chamber 2210, and at least a portion of the partition plate is higher than the opening of the first liquid chamber 2210. The vertically mounted partition plate most effectively separates the opening of the first liquid chamber 2210, while the portion of the partition plate above the opening ensures that no lateral liquid flow occurs between the two overflow ports 2220 before the liquid level reaches a certain height, thus guaranteeing the synchronicity of overflow initiation and the balance of flow rate on both sides.

[0068] To buffer the impact of overflowing liquid, in one embodiment, the first liquid container 2200 may be provided with a first buffer structure 2500, which is configured to mitigate the impact of liquid flowing out of the overflow port 2220. For example, the first buffer structure 2500 may be a plate or a mesh structure. When the liquid overflows, it first impacts the first buffer structure 2500, where the kinetic energy is absorbed and dispersed. Then, the liquid flows towards the target in a gentler and more dispersed manner, such as flowing down the surface of the first buffer structure 2500, thereby reducing or even eliminating the direct impact on the cutting mesh 3100.

[0069] In one embodiment, a partition plate is located at the center of the opening of the first liquid-containing cavity 2210. The opening of the first liquid-containing cavity 2210 is divided into a first overflow port and a second overflow port by a partition structure 2300. A portion of the partition plate is located inside the first liquid-containing cavity, and another portion is located outside the first liquid-containing cavity 2210. A guide plate is located on the side of the partition plate that is outside. The center of the guide plate is connected to the partition plate, and both sides of the guide plate are configured to guide the liquid flowing out of the first overflow port and the second overflow port in two opposite directions. A first buffer structure 2500 is configured as a buffer plate, and the buffer plate is provided in the flow path of the liquid flowing out of at least one of the first overflow port and the second overflow port.

[0070] In the above embodiments, such as Figure 7 and Figure 8 As shown, a partition plate is vertically installed at the center of the opening of the first liquid-containing cavity 2210, dividing the opening into a first overflow port and a second overflow port that are symmetrically arranged on the left and right sides. A part of the partition plate extends downward into the interior of the first liquid-containing cavity 2210 to stabilize and guide the internal liquid flow, while the other part extends upward to the exterior of the first liquid-containing cavity 2210.

[0071] The guide plate is installed on the outer side of the partition plate. For example, the center of the guide plate is vertically connected to the top of the partition plate, and the two sides of the guide plate are inclined or extended to the left and right respectively, thereby guiding the liquid flowing out of the first overflow port and the second overflow port in two opposite directions. The buffer structure can be one or more buffer plates, which are provided in the liquid flow path of at least one overflow port 2220. For example, a vertical or horizontal buffer plate can be provided on the outside of each overflow port 2220 and below the guide plate. After the liquid flows out of the overflow port 2220, it first falls or hits the buffer plate and then flows to the workpiece 100 to be processed.

[0072] Continue reading Figure 5 and Figure 6 As shown, in one embodiment, the connection region 1010 may be provided with a clearance space 1020, which is configured to accommodate the first overflow member 2100. For example, the connection region 1010 of the support device 1000 may have a groove configured to form the clearance space 1020, or the connection region 1010 of the support device 1000 may have at least a first protrusion 1100 and a second protrusion 1200, and the gap between the first protrusion 1100 and the second protrusion 1200 is configured to form the clearance space 1020. The width of the clearance space 1020 may be greater than the width of the first overflow member 2100.

[0073] In the above embodiment, the connection area 1010 of the support device 1000 has a clearance space 1020, which serves to accommodate at least a portion of the first overflow member 2100. For example, see... Figures 1 to 4 As shown, in double-row cutting, two crystal rods are installed side by side, and the gap between the two crystal rods is very limited. If the first overflow member 2100 is to extend between the two crystal rods to overflow, there must be space for it to extend.

[0074] Therefore, by pre-reserving a groove or cavity on the carrier device 1000 (such as a crystal tray) for the first overflow member 2100 to form a clearance space 1020, interference between the first overflow member 2100 and the carrier device 1000 can be avoided, allowing it to be smoothly positioned and overflowing between the two workpieces 100 to be processed. Figure 4 As shown.

[0075] As can be seen from the above, the aforementioned clearance space 1020 can be constructed in various ways. For example, a groove can be directly formed in the connection area 1010 of the support device 1000 (i.e., the surface used to bond the crystal rod), and the position and size of the groove correspond to the first overflow member 2100. Alternatively, instead of directly forming a groove, at least two protrusions can be provided in the connection area 1010, such as the first protrusion 1100 and the second protrusion 1200 mentioned above. The gap between the first protrusion 1100 and the second protrusion 1200 can then form the required clearance space 1020. The crystal rod is then bonded to the first protrusion 1100 and the second protrusion 1200.

[0076] In order to ensure that the first overflow member 2100 can smoothly enter and exit the clearance space 1020 without contact friction, the width of the clearance space 1020 should be greater than the width of the first overflow member 2100.

[0077] In order to provide comprehensive and three-dimensional cooling to the cutting area, in addition to the first overflow member 2100, the overflow device 2000 may also include at least one second overflow member 2600 in one embodiment, wherein the first overflow member 2100 is configured to overflow liquid between two workpieces 100 to be processed, and the second overflow member 2600 is configured to overflow liquid on the outside of the workpieces 100 to be processed.

[0078] Among them, such as Figure 1 As shown, the second overflow component 2600 may also include a second liquid container 2700 and a second liquid chamber 2800, and the second liquid container 2700 is provided with a second buffer structure 2900. The second liquid chamber 2800 has the same function as the first liquid chamber 2210, which can be used to contain coolant and apply coolant by overflow. The second buffer structure 2900 also has the same function as the first buffer structure 2500. When the liquid overflows, it first impacts the first buffer structure 2500, and the kinetic energy is absorbed and dispersed. Then the liquid flows towards the target in a gentler and more dispersed manner, thereby reducing or even eliminating the direct impact on the cutting mesh 3100.

[0079] The first overflow component 2100 and the second overflow component 2600 have different functions. The first overflow component 2100 is specifically used to overflow in the gap between two workpieces 100, providing coolant to the opposite sides of adjacent crystal rods. The second overflow component 2600 is configured to overflow on the outside of the workpiece 100, that is, to provide coolant to the outer side of the outermost crystal rod. Thus, by the coordinated operation of the inner first overflow component 2100 and the outer second overflow component 2600, a uniform and continuous coolant coating layer can be formed throughout the cutting area, ensuring that each crystal rod and each cut surface receives sufficient lubrication, cooling, and chip removal.

[0080] To achieve precise control over the position of the first overflow component 2100, in one embodiment, the slicing machine may include a suspension device mounted on the main body and connected to the first overflow component 2100, for controlling the movement of the first overflow component 2100 relative to at least one of the main body and the cutting mesh 3100. This movement may be vertical lifting to accommodate the arcing deformation of the cutting mesh 3100 caused by force during cutting. Alternatively, it may be horizontal movement to align to different positions.

[0081] The suspension device can be a screw slide module driven by a motor, or a linkage mechanism driven by a cylinder or hydraulic cylinder. Through the suspension device, the first overflow component 2100 can maintain an optimal and constant relative distance with the cutting mesh 3100 during the cutting process, thereby ensuring the consistency of the cooling effect.

[0082] Continue reading Figure 1 As shown, in one embodiment, the cutting device 3000 may include a support mechanism 3200, to which the cutting mesh 3100 is mounted. The support mechanism 3200 typically includes components such as guide rollers and main rollers for tensioning and guiding the cutting mesh 3100, providing stable support and precise drive for the cutting mesh 3100, ensuring that the cutting mesh 3100 can complete the cutting of the crystal rod during high-speed movement.

[0083] This application provides a support device 1000, which has a connection region 1010 configured to connect a workpiece 100 to be processed. The connection region 1010 includes a clearance space 1020 configured to accommodate a first overflow component 2100. Therefore, the support device 1000 is primarily designed to match the aforementioned overflow device 2000. By pre-setting the clearance space 1020 on the support device 1000, the first overflow component 2100 can be easily inserted into the gap between the two crystal rods during double-row cutting without structural interference with the support device 1000 itself. This provides the necessary structural basis for achieving precise overflow cooling inside the crystal rods.

[0084] This application provides an overflow device 2000, which includes at least a first overflow member 2100. The first overflow member 2100 includes a first liquid container 2200 and a partition structure 2300. The first liquid container 2200 has a first liquid cavity 2210 inside. The partition structure 2300 is disposed in the first liquid container 2200. The opening of the first liquid cavity 2210 is divided into at least two overflow ports 2220 by the partition structure 2300. Each overflow port 2220 is configured to overflow liquid in a different direction. The first overflow member 2100 is configured to overflow liquid between adjacent workpieces 100 to be processed. This overflow device 2000 can use gravity to evenly and gently distribute the coolant to two opposite directions, for example, the right side of the left crystal bar and the left side of the right crystal bar, thereby effectively solving the problem of insufficient cooling in the middle area during double-row cutting. Furthermore, since it is an overflow rather than a spray, it will not cause harmful impact on the cutting mesh 3100.

[0085] This application provides a double-row cutting method suitable for crystal rod cutting. The double-row cutting method includes at least the following steps: simultaneously cutting two crystal rods using the cutting mesh 3100 of the cutting device 3000; gently applying coolant between the two crystal rods by overflow, and ensuring that the coolant overflows and flows to the cutting mesh 3100 and the two crystal rods within a height range of 10 mm above the cutting mesh 3100.

[0086] The aforementioned double-row cutting method includes at least two core steps. First, the cutting mesh 3100 of the cutting device 3000 simultaneously cuts two crystal rods. This achieves double-row vertical cutting, improving production efficiency. Second, coolant is applied between the two crystal rods via overflow, ensuring that the coolant overflows within a height range of no more than 10mm above the surface of the cutting mesh 3100, for example, at intervals of 1mm, 2mm, 3mm, 4mm, 5mm, 6mm, 7mm, 8mm, 9mm, and 10mm, before flowing to the cutting mesh 3100 and the two crystal rods.

[0087] Therefore, the above method allows for the gentle application of coolant and precise height control. High-pressure jetting is avoided, reducing impact on the cutting mesh. At a height within 10mm above the cutting mesh 3100, the coolant travels from the overflow port 2220 to the cutting mesh 3100 with minimal distance, ensuring near-zero velocity difference in contact with the cutting mesh 3100. This avoids impact while efficiently carrying the coolant into the cutting kerf, achieving optimal cooling, lubrication, and chip removal.

[0088] To maintain optimal cooling throughout the cutting process, in one embodiment, the cutting mesh 3100 of the cutting device 3000 can simultaneously cut two crystal rods, and an overflow coolant can be applied between the two crystal rods using an overflow device 2000. During the cutting process, the position of the overflow device 2000 is adjusted synchronously as the cutting mesh 3100 deforms. That is, as the cutting mesh 3100 simultaneously cuts two crystal rods and the overflow coolant is applied between the two crystal rods using the overflow device 2000, the position of the overflow device 2000 needs to be adjusted synchronously as the deformation (i.e., bowing) of the cutting mesh 3100 due to stress gradually increases.

[0089] Typically, when the bow of the cut wire mesh 3100 increases, the arc apex of the cut wire mesh 3100 will move downwards, such as... Figure 2 and Figure 3 As can be seen from the state comparison, in order to maintain a constant distance of less than 10mm between the overflow port 2220 and the mesh surface, it is necessary to control the overflow device 2000, that is, the aforementioned first overflow component 2100 also moves downwards accordingly. Through this dynamic adjustment, it can be ensured that the coolant application point is always in the optimal position throughout the entire cutting process, guaranteeing the stability and consistency of the cooling effect.

[0090] In one embodiment, the cutting process includes at least two stages; in the first stage, the degree of deformation of the cutting mesh 3100 gradually increases with a first degree of change, and at this time the overflow device 2000 is adjusted to move synchronously relative to the cutting mesh 3100; in the second stage, the degree of deformation of the cutting mesh 3100 gradually increases with a second degree of change, and at this time the overflow device 2000 is kept in its original position; wherein, the first degree of change is greater than the second degree of change.

[0091] Therefore, in the first stage, such as the initial cutting stage and the rapid cutting stage, the deformation degree (bore) of the cutting mesh 3100 changes rapidly, and its change can be represented by a first degree of change. In the first stage, the overflow device 2000 is adjusted to move synchronously with the cutting mesh 3100, that is, to move with the deformation peak of the cutting mesh 3100. In the second stage, such as the finishing or exiting stage of the cutting, the deformation degree of the cutting mesh 3100 has stabilized, and its change can be represented by a smaller second degree of change. In the second stage, since the bow essentially no longer changes, the overflow device 2000 can remain in its original position.

[0092] Therefore, the phased control strategy can provide precise follow-up cooling when the bow line changes drastically, and simplify the control logic during the stable phase, avoiding unnecessary frequent movements. This improves the stability and reliability of the system while ensuring the cooling effect.

[0093] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0094] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A slicer, characterized in that, The slicer includes: Main body; A support device, which is assembled to the main body, has a connection area configured for connecting a workpiece to be processed. An overflow device is mounted on the main body, and the overflow device includes at least a first overflow element configured to overflow liquid toward the workpiece. A cutting device, which is assembled on the main body, includes a cutting mesh, and the connecting area of ​​the supporting device faces the cutting mesh.

2. The slicer according to claim 1, characterized in that, The first overflow component is movably assembled relative to the main body; and / or, The distance between the first overflow component and the surface of the cutting mesh is kept within 10mm.

3. The slicer according to claim 1, characterized in that, The first overflow component includes: A first liquid container, wherein the first liquid container has a first liquid cavity inside; A partition structure is provided in the first liquid chamber, and the opening of the first liquid chamber is divided into at least two overflow ports by the partition structure, each of the overflow ports being configured to overflow liquid in a different direction.

4. The slicer according to claim 3, characterized in that, Along the direction from the bottom to the opening of the first liquid-containing cavity, the cross-sectional area of ​​the first liquid-containing cavity gradually decreases; and / or, The first liquid container is connected to an infusion line communicating with the first liquid container cavity. The infusion line is equipped with a flow control device, which is configured to control the flow rate of the liquid flowing through the infusion line. And / or, At least one of the first liquid container and the partition structure is provided with a guiding structure, which is configured to guide the liquid flowing out from the different overflow ports in different directions; And / or, The partition structure is configured as a partition plate, which is mounted perpendicularly to the opening of the first liquid chamber, and at least a portion of the partition plate is higher than the opening of the first liquid chamber.

5. The slicer according to claim 4, characterized in that, The first liquid container is provided with a first buffer structure, which is configured to mitigate the impact force of the liquid flowing out of the overflow port; and / or, The guide structure is configured as a guide plate, which is perpendicular to the partition plate.

6. The slicer according to claim 5, characterized in that, The partition plate is located at the center of the opening of the first liquid chamber. The opening of the first liquid chamber is divided into a first overflow port and a second overflow port by the partition structure. A part of the partition plate is located inside the first liquid chamber, and another part is located outside the first liquid chamber. The guide plate is located on the outer side of the partition plate, and the center of the guide plate is connected to the partition plate. The two sides of the guide plate are configured to guide the liquid flowing out of the first overflow port and the second overflow port in two opposite directions. The first buffer structure is configured as a buffer plate, and the buffer plate is provided in the flow path of the liquid flowing out of at least one of the first overflow port and the second overflow port.

7. The slicer according to claim 1, characterized in that, The connection area is provided with a clearance space, which is configured to accommodate the first overflow component.

8. The slicer according to claim 7, characterized in that, The connecting area of ​​the bearing device has a groove, configured to form the clearance space; or... The connection area of ​​the bearing device is provided with at least a first protrusion and a second protrusion, and the gap between the first protrusion and the second protrusion is configured to form the clearance space. or, The width of the clearance space is greater than the width of the first overflow component.

9. The slicer according to claim 1, characterized in that, The overflow device includes at least one second overflow member, wherein the first overflow member is configured to overflow liquid between two workpieces to be processed, and the second overflow member is configured to overflow liquid on the outside of the workpieces to be processed.

10. The slicer according to claim 1, characterized in that, The slicer includes: A suspension device is mounted on the main body and connected to the first overflow component, used to control the movement of the first overflow component relative to at least one of the main body and the cutting mesh.

11. The slicer according to claim 1, characterized in that, The cutting device includes: A support mechanism, wherein the cutting mesh is assembled into the support mechanism.

12. A double-row cutting method based on the slicer according to any one of claims 1-11, characterized in that, The double-row cutting method includes at least the following steps: Two crystal rods are simultaneously cut using the cutting mesh of a cutting device; Coolant is applied gently between the two crystal rods by overflow, ensuring that the coolant overflows and flows to the cutting mesh and the two crystal rods within a height range of 10 mm above the cutting mesh.

13. The double-row cutting method according to claim 12, characterized in that, Two crystal rods are cut simultaneously using the cutting mesh of the cutting device, and an overflow device is used to apply overflow coolant between the two crystal rods; During the cutting process, the position of the overflow device is adjusted synchronously as the cutting mesh deforms.

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