Electronic product spare part injection molding equipment

Abstract

The application relates to the field of injection molding equipment, in particular to electronic product spare part injection molding equipment, which comprises a movable mold; an installation ring is arranged in a mold cavity of the movable mold; a thimble is slidably arranged in the installation ring; the electronic product spare part injection molding equipment further comprises a spray head and a gas delivery plate; a groove is arranged on the thimble; the thimble is provided with the spray head for spraying a release agent and the gas delivery plate for spraying air; the spray opening of the spray head and the air outlet are both located in the groove; air sprayed from the air outlet forms an air curtain, the release agent sprayed from the spray head is intercepted and constrained, the release agent is constrained in the mold cavity of the movable mold, the waste caused by the outward overflow of the release agent is reduced to the maximum extent, and the air flow blown to the inner wall of the mold cavity of the movable mold can guide the release agent sprayed by the spray head and make the release agent quickly adhere to the inner wall of the mold cavity of the movable mold.

Description

Technical Field

[0001] This invention relates to the field of injection molding equipment, and more particularly to an injection molding equipment for electronic product parts. Background Technology

[0002] Injection molds are tools used for molding and processing plastic products. They are key equipment in the injection molding process. In the production of electronic product components, injection molds are used to inject molten plastic into the mold cavity, which then cools and solidifies to form plastic products of specific shapes and sizes. In order to promote the concept of energy conservation and environmental protection, recycled plastics are used as raw materials for injection molding. Recycled plastics refer to the process of reprocessing waste plastic products or plastic waste into reusable plastic materials.

[0003] For example, Chinese patent CN120606494A discloses an integrated injection molding and polishing mold for automotive headlight housings and a variable temperature molding process. To address the issue that existing injection molding equipment uses a spraying device to spray the mold cavity from the outside during mold opening, which increases operational steps and leads to low production efficiency, a release agent spray nozzle is added to the ejector pin used for demolding. After the ejector pin pushes out the plastic part, the release agent is sprayed into the cavity through the nozzle on the ejector pin, saving operational steps and improving work efficiency. However, this method still has drawbacks in actual operation: 1. The release agent disperses within the cavity space during spraying, not only reducing its adhesion to the cavity wall but also causing some release agent to drift outwards, resulting in material waste; 2. After spraying the release agent, release agent residue easily remains at the nozzle, affecting the effectiveness of subsequent release agent spraying. Summary of the Invention

[0004] In order to overcome the shortcomings of existing injection molding equipment, such as poor adhesion of release agent to the inner wall of the mold cavity and easy dispersion of release agent when spraying release agent, the present invention provides an injection molding equipment for electronic product parts.

[0005] The technical solution is as follows: an injection molding machine for electronic product parts, including a moving mold, a mounting ring, and an ejector pin; the mounting ring is installed inside the cavity of the moving mold; the ejector pin is slidably installed inside the mounting ring; it also includes a nozzle and an air supply plate; the ejector pin has a groove; the ejector pin is equipped with a nozzle for spraying a release agent and an air supply plate for spraying air; the air supply plate is located between the nozzle and the cavity of the moving mold; the air supply plate has an air outlet; the nozzle and the air outlet of the nozzle are both located in the groove; when one end of the ejector pin moves into the cavity of the moving mold, the air supply plate sprays air to guide and constrain the release agent sprayed by the nozzle.

[0006] Furthermore, the ejector pin has several grooves arranged in a circular array; each groove contains a nozzle; several air delivery plates are arranged in a circular array on the ejector pin; the air outlet of each air delivery plate is located in the corresponding groove.

[0007] Furthermore, the ejector pin is equipped with a plurality of liquid delivery pipes for delivering release agent in a circular array; each liquid delivery pipe is connected to one of the nozzles; the ejector pin is equipped with an air delivery pipe for delivering air; all the air delivery plates are connected to the air delivery pipe.

[0008] Furthermore, a collection ring is installed at the end of the ejector pin away from the moving model cavity, and all the infusion tubes are connected to the collection ring.

[0009] Furthermore, the air supply plate is located on the side of the ejector pin near the moving model cavity.

[0010] Furthermore, the width of the air outlet of the air conveying plate is greater than the width of the nozzle.

[0011] Furthermore, the air conveying plate is provided with a sliding groove, which is located on one side of the air outlet; a lifting plate is slidably disposed in the sliding groove; a through groove is provided on the lifting plate; the air conveying plate is provided with side openings on both sides of the sliding groove, and the side openings are aligned with the nozzle; when the through groove is aligned with the side openings on both sides, the air in the air conveying plate will be ejected from the side openings; when the through groove is misaligned with the side openings on both sides, the lifting plate will block the side openings on both sides.

[0012] Furthermore, the inner surface of the mounting ring is equipped with protruding strips, the number and position of which correspond to the air supply plate; an elastic element connects the lifting plate and the air supply plate; the end of the lifting plate facing the protruding strip is curved; when the protruding strip is aligned with the air supply plate, the protruding strip blocks the air outlet and abuts against the lifting plate, aligning the through groove with the side openings on both sides; when the protruding strip is misaligned with the air supply plate, the lifting plate springs up, causing the through groove to misalign with the side openings on both sides.

[0013] Furthermore, the width of the side opening is smaller than the width of the air delivery channel inside the air delivery plate, and the width of the side opening is adapted to the width of the nozzle.

[0014] Furthermore, the groove of the ejector pin and the mounting ring form a gas flow channel, through which the air ejected from the side port flows outward.

[0015] Beneficial effects: This invention utilizes the air ejected from the air outlet to form an air curtain, which intercepts and confines the release agent sprayed from the nozzle, keeping the release agent within the cavity of the moving mold and minimizing the waste caused by the release agent overflowing outwards; furthermore, the airflow blown towards the inner wall of the moving mold cavity through the air outlet can guide the release agent sprayed from the nozzle, allowing the release agent to quickly adhere to the inner wall of the moving mold cavity.

[0016] This invention utilizes air ejected from the side nozzle to clean the nozzle by blowing away residual mold release agent, ensuring unobstructed flow at the nozzle outlet and preventing mold release agent residue from condensing. Furthermore, the width of the side nozzle is matched with the width of the nozzle, thus maximizing air utilization. Attached Figure Description

[0017] Figure 1 The diagram shown is a three-dimensional structural schematic of the injection molding equipment for electronic product parts of this invention.

[0018] Figure 2 The diagram shown is a three-dimensional structural schematic of the ejector pin of the present invention;

[0019] Figure 3 The diagram shown illustrates the separation of the ejector pin and the gas delivery tube according to the present invention.

[0020] Figure 4 The diagram shown is a three-dimensional structural schematic of the gas delivery plate of the present invention;

[0021] Figure 5 The diagram shown illustrates the separation of the gas delivery plate and the lifting plate of this invention.

[0022] Figure 6 The diagram shows the positions of the ejector pin and the moving mold of the present invention.

[0023] Reference numerals: 1-Moving mold, 2-Mounting ring, 21-Raised strip, 3-Ejector pin, 31-Groove, 4-Nozzle, 5-Infusion tube, 6-Collection ring, 7-Gas tube, 8-Gas plate, 81-Gas outlet, 82-Slide groove, 83-Side opening, 9-Lifting plate, 91-Through groove. Detailed Implementation

[0024] The present invention will now be described in detail with reference to the accompanying drawings.

[0025] Example 1: An injection molding equipment for electronic product components, such as... Figures 1-6As shown, the device includes a moving mold 1, a mounting ring 2, and an ejector pin 3. The mounting ring 2 is detachably installed inside the cavity of the moving mold 1. The ejector pin 3 is slidably installed inside the mounting ring 2 and is fixedly installed on an external bracket. The device also includes a nozzle 4 and an air supply plate 8. A groove 31 is formed on the outer ring surface of the ejector pin 3. The nozzle 4 and the air supply plate 8 are installed on the ejector pin 3. The air supply plate 8 is located between the nozzle 4 and the cavity of the moving mold 1. The air supply plate 8 has an air outlet 81. The nozzle of the nozzle 4 and the air outlet 81 are both located in the groove 31.

[0026] The outer ring surface of the ejector pin 3 has a plurality of grooves 31 arranged in a ring array; each groove 31 is provided with a nozzle 4; the ejector pin 3 is circumferentially arranged with a plurality of air supply plates 8; the air outlet 81 of each air supply plate 8 is located in the corresponding groove 31.

[0027] The ejector pin 3 has several infusion tubes 5 arranged in a circular array around its inner circumference; each infusion tube 5 is connected to a nozzle 4; an air supply tube 7 is installed in the center of the ejector pin 3, and the air supply tube 7 is connected to an external air pump through a flexible tube; all the air supply plates 8 are connected to the air supply tube 7.

[0028] The ejector pin 3 is equipped with a collection ring 6 at the end away from the cavity of the moving mold 1. All the infusion tubes 5 are connected to the collection ring 6. The collection ring 6 is connected to an external mold release agent delivery pump through a hose.

[0029] The air supply plate 8 is located on the side of the ejector pin 3 near the cavity of the moving mold 1.

[0030] The width of the air outlet 81 of the air conveying plate 8 is greater than the width of the nozzle 4.

[0031] Example 2: Based on Example 1, such as Figures 1-6 As shown, the air conveying plate 8 has a sliding groove 82, which is located on one side of the air outlet 81; a lifting plate 9 is slidably arranged in the sliding groove 82; a through groove 91 is provided on the lifting plate 9; and side openings 83 are respectively provided on both sides of the sliding groove 82, which are aligned with the nozzle 4.

[0032] The inner ring surface of the mounting ring 2 is equipped with protrusions 21, the number and position of which correspond to the air supply plate 8; an elastic element, such as a spring rod, is connected between the lifting plate 9 and the air supply plate 8; the end of the lifting plate 9 facing the protrusions 21 is curved.

[0033] The width of the side opening 83 is smaller than the width of the air delivery channel inside the air delivery plate 8, and the width of the side opening 83 is adapted to the width of the nozzle 4.

[0034] The groove 31 of the ejector pin 3 and the mounting ring 2 form a gas flow channel, and the air ejected from the side port 83 flows outward through this gas flow channel.

[0035] The operating principle of this injection molding equipment for electronic product parts is as follows:

[0036] The moving mold 1 is mounted on the drive structure of the peripheral device, such as an electric push rod. The ejector pin 3 is fixedly mounted on the bracket of the peripheral device through the connecting arm. When the injection molding of electronic product parts is completed and demolding is required, the moving mold 1 is moved by the drive structure of the peripheral device, while the ejector pin 3 is fixed. The ejector pin 3 protrudes out of the cavity of the moving mold 1 to eject the plastic part in the cavity. The above content is common knowledge of existing injection molding equipment and will not be elaborated here.

[0037] Among them, such as Figure 6 As shown, before demolding, the end of the ejector pin 3 used to push the plastic part forms a complete plane with the inner wall of the cavity of the moving mold 1. The nozzle 4 and the air delivery plate 8 are both hidden. The air delivery pipe 7 is pre-connected to an external air pump through a hose, and the collecting ring 6 is connected to an external mold release agent delivery pump through a hose. Considering that the ejector pin 3 may stick to the plastic part in the cavity, it needs to be pre-cooled before demolding. Therefore, air is introduced into the air delivery pipe 7 through the external air pump. The air enters the air delivery plate 8 through the air delivery pipe 7. At this time, if... Figure 2 and Figure 4 As shown, the protrusion 21 and the air supply plate 8 are in a relative position, and the protrusion 21 is attached to the end face of the air supply plate 8. The protrusion 21 blocks the air outlet 81 and abuts against the lifting plate 9. The elastic element between the lifting plate 9 and the air supply plate 8 is in a compressed state, so that the through groove 91 is aligned with the side openings 83 on both sides. Therefore, the air entering the air supply plate 8 at this time will flow out into the groove 31 along the path of the side opening 83 on one side, the through groove 91, and the side opening 83 on the other side. In this way, the air flowing along the above path will be used to exchange heat and cool down the ejector pin 3, reduce the adhesion between the ejector pin 3 and the plastic part, and facilitate the subsequent detachment of the plastic part. In addition, the width of the side opening 83 is smaller than the width of the air supply channel in the air supply plate 8, that is, the outflow rate of air is less than the inflow rate of air, which allows the air in the air supply plate 8 to stay for a period of time, thereby increasing the heat exchange time per unit volume of air and increasing the heat exchange rate.

[0038] After the ejector pin 3 has been cooled for a specified time, the moving mold 1 is moved to allow the ejector pin 3 to protrude and push the plastic part. When the ejector pin 3 and the moving mold 1 move relative to each other, the protrusion 21 and the air supply plate 8 are misaligned, allowing the lifting plate 9 to spring up under the elastic action of the elastic element and misalign the through groove 91 with the side openings 83 on both sides. The height of the lifting plate 9 is exactly the height of the arc surface at the end of the lifting plate 9. At this time, the air that has entered the air supply plate 8 is ejected from the air outlet 81. The air supply plate 8 is located on the side of the ejector pin 3 that is close to the cavity of the moving mold 1. Therefore, in the initial stage when the ejector pin 3 protrudes from the moving mold 1, the air supply plate 8 will also protrude from the moving mold 1. Since the ejector pin 3 usually pushes the center part of the plastic part, the air ejected through the air outlet 81 can blow the edge of the plastic part around the ejector pin 3, thereby helping to detach the edge of the plastic part from the moving mold 1. Together with the ejector pin 3, the plastic part can be quickly detached.

[0039] After the ejector pin 3 protrudes from the moving mold 1 to complete the demolding of the plastic part, the nozzle 4 is also exposed in the cavity of the moving mold 1. Then, the external mold release agent delivery pump delivers the mold release agent into the collection ring 6. The mold release agent enters the nozzle 4 through the collection ring 6 and the liquid delivery pipe 5, and is then sprayed into the cavity of the moving mold 1 from the nozzle 4. At this time, the air supply plate 8 is located on the side of the nozzle 4 facing outward, and the width of the air outlet 81 is greater than the width of the nozzle 4. Therefore, the air sprayed from the air outlet 81 can form an air curtain to intercept and constrain the mold release agent sprayed from the nozzle 4, so that the mold release agent is constrained in the cavity of the moving mold 1, minimizing the waste caused by the mold release agent overflowing outward. Furthermore, the air flow blown towards the inner wall of the cavity of the moving mold 1 through the air outlet 81 can guide the mold release agent sprayed by the nozzle 4, allowing the mold release agent to quickly adhere to the inner wall of the cavity of the moving mold 1.

[0040] After demolding and application of release agent, the moving mold 1 is moved back to prepare for the next injection molding operation. The protrusion 21 is aligned with the air supply plate 8 again, blocking the air outlet 81. During the movement of the protrusion 21, it pushes the lifting plate 9 along the end arc surface of the lifting plate 9, causing the lifting plate 9 to retract into the slide groove 82. The elastic element retracts accordingly, and the through groove 91 is realigned with the side openings 83 on both sides. Then, the air entering the air supply plate 8 is ejected from the side openings 83, which are aligned with the nozzle 4. Therefore, the air ejected from the side openings 83 can be used to clean the nozzle 4, removing the release agent remaining on the nozzle 4, ensuring unobstructed flow at the nozzle 4 outlet, and preventing the release agent residue from condensing. The width of the side openings 83 is matched with the width of the nozzle 4, so the utilization rate of air can be maximized, and the nozzle 4 can be cleaned in a concentrated and targeted manner.

[0041] Although the invention has been described with reference to exemplary embodiments, it should be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims should be given the broadest interpretation so as to cover all variations and equivalent structures and functions.

Claims

1. An injection molding machine for electronic product parts, comprising a moving mold (1), a mounting ring (2), and ejector pins (3); the mounting ring (2) is installed inside the cavity of the moving mold (1); the ejector pins (3) are slidably installed inside the mounting ring (2); characterized in that, It also includes a nozzle (4) and an air supply plate (8); a groove (31) is provided on the ejector pin (3); a nozzle (4) for spraying release agent and an air supply plate (8) for spraying air are installed on the ejector pin (3); the air supply plate (8) is located between the nozzle (4) and the cavity of the moving mold (1); the air supply plate (8) has an air outlet (81); the nozzle of the nozzle (4) and the air outlet (81) are both located in the groove (31); when one end of the ejector pin (3) moves into the cavity of the moving mold (1), the air supply plate (8) sprays air to guide the release agent sprayed by the nozzle (4) and constrain the sprayed release agent.

2. The injection molding equipment for electronic product parts according to claim 1, characterized in that, The ejector pin (3) has several grooves (31) arranged in a ring array; each groove (31) is provided with a nozzle (4); several air conveying plates (8) are arranged in a ring array on the ejector pin (3); the air outlet (81) of each air conveying plate (8) is located in the corresponding groove (31).

3. The injection molding equipment for electronic product components according to claim 1, characterized in that, The ejector pin (3) is equipped with a ring array of several liquid delivery pipes (5) for delivering release agent; each liquid delivery pipe (5) is connected to a nozzle (4); the ejector pin (3) is equipped with an air delivery pipe (7) for delivering air; all the air delivery plates (8) are connected to the air delivery pipe (7).

4. The injection molding equipment for electronic product parts according to claim 3, characterized in that, The ejector pin (3) is equipped with a collection ring (6) at one end away from the cavity of the moving mold (1), and all the infusion tubes (5) are connected to the collection ring (6).

5. The injection molding equipment for electronic product parts according to claim 2, characterized in that, The air supply plate (8) is located on the side of the ejector pin (3) near the cavity of the moving mold (1).

6. The injection molding equipment for electronic product parts according to claim 2, characterized in that, The width of the air outlet (81) of the air conveying plate (8) is greater than the width of the nozzle (4).

7. The injection molding equipment for electronic product components according to claim 2, characterized in that, The air conveying plate (8) is provided with a sliding groove (82), which is located on one side of the air outlet (81); a lifting plate (9) is slidably provided in the sliding groove (82); a through groove (91) is provided on the lifting plate (9); the air conveying plate (8) is provided with side openings (83) on both sides of the sliding groove (82), and the side openings (83) are aligned with the nozzle (4); when the through groove (91) is aligned with the side openings (83) on both sides, the air in the air conveying plate (8) will be ejected from the side openings (83); when the through groove (91) is misaligned with the side openings (83) on both sides, the lifting plate (9) will block the side openings (83) on both sides.

8. The injection molding equipment for electronic product components according to claim 7, characterized in that, The inner ring surface of the mounting ring (2) is equipped with a protrusion (21), the number and position of which correspond to the air supply plate (8); the lifting plate (9) is connected to the air supply plate (8) by an elastic element; the end of the lifting plate (9) facing the protrusion (21) is curved; when the protrusion (21) is opposite to the air supply plate (8), the protrusion (21) blocks the air outlet (81) and abuts against the lifting plate (9), so that the through groove (91) is aligned with the side openings (83) on both sides; when the protrusion (21) is misaligned with the air supply plate (8), the lifting plate (9) springs up and the through groove (91) is misaligned with the side openings (83) on both sides.

9. An injection molding equipment for electronic product parts according to claim 8, characterized in that, The width of the side opening (83) is smaller than the width of the air delivery channel inside the air delivery plate (8), and the width of the side opening (83) is adapted to the width of the nozzle (4).

10. An injection molding equipment for electronic product components according to claim 9, characterized in that, The groove (31) of the ejector pin (3) and the mounting ring (2) form a gas flow channel, and the air ejected from the side port (83) flows outward through the gas flow channel.

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