Cleaning agent for encapsulated product residues and method for its production and use

Abstract

The application provides a cleaning agent for packaging product residues and a manufacturing method and application thereof, which comprises the following components in mass percentage: 8-15% of non-ionic surfactant; 5-10% of cosolvent; 60-75% of deionized water; 1-3% of metal antirust agent; 0.5-2% of silane coupling agent; 0.3-1% of pH regulator; 0.2-1% of stabilizer; and 0.1-0.5% of preservative; the mass ratio of the non-ionic surfactant to the cosolvent is (1.5-3):1; through the synergistic effect between the components, the technical difficulties of the traditional cleaning agent, such as incomplete removal of packaging residues, high-temperature heating, easy damage to packaging substrates, independent antirust process, easy stratification failure of the system, poor environmental protection and the like, are solved, the high-removal rate, normal-temperature energy saving, no substrate damage, in-situ protection, wide-temperature stability and green environmental protection integrated technical purposes are achieved, the comprehensive production cost is reduced, and the yield and service life of the product are ensured.

Description

Technical Field

[0001] This invention relates to the field of cleaning agent technology, and in particular to a cleaning agent for cleaning residues in packaged products, its manufacturing method, and its application. Background Technology

[0002] In the packaging and manufacturing process of semiconductor chips, precision electronic components, and automotive electronic modules, auxiliary materials such as solder paste and epoxy encapsulant are typically used to ensure the reliability of electrical connections between the chip and the substrate and lead frame. However, after packaging, a mixture of contaminants, including non-polar rosin flux, polar resin acids, and epoxy residues, inevitably remain in the chip lead gaps, packaging mating surfaces, and metal pad surfaces. If these residues are not thoroughly removed, they can severely affect the chip's electrical performance, packaging seal, and long-term stability, and may even lead to short circuits and corrosion failure. This is especially true in packaging scenarios involving heat-sensitive substrates (such as flexible circuits and low-temperature co-fired ceramics) and easily oxidized metals (such as silver and copper leads), where the chemical activity of the residues can easily cause irreversible damage. Therefore, the cleaning process for packaging product residues has become an irreplaceable and crucial step in the manufacturing of high-reliability chips.

[0003] Currently, commonly used cleaning agents for packaging product residues in the industry are mainly divided into three categories: solvent-based, semi-aqueous-based, and water-based. Each type of cleaning agent has varying degrees of technical limitations, making it difficult to meet the integrated requirements of high-end chip packaging for "efficient cleaning, low damage, energy saving, long-term protection, and environmental protection." The specific status and shortcomings are as follows: 1. Solvent-based cleaning agents: These are mainly composed of organic solvents such as aromatic hydrocarbons and halogenated hydrocarbons. Although they can dissolve and mix residues to a certain extent, they have problems such as high VOC content, flammability and explosiveness, and poor environmental performance. They do not meet the current green environmental protection requirements and workshop safety production standards of the electronics manufacturing industry. At the same time, these cleaning agents have a strong swelling effect on epoxy encapsulation materials and flexible substrates, which can easily lead to yellowing of the encapsulation and deformation of the substrate. They have poor substrate compatibility and do not have rust prevention and hydrophobic protection functions after cleaning. The cleaned metal pads are prone to oxidation, requiring an additional rust prevention process. The process is complicated and the overall cost is high.

[0004] 2. Semi-aqueous cleaning agents: These are formulated from organic solvents and water, attempting to balance cleaning effectiveness and environmental friendliness. However, they still suffer from drawbacks such as high volatile organic solvent content, excessive VOC levels, and low biodegradability. Furthermore, their cleaning mechanism relies primarily on the dissolving effect of organic solvents, limiting their ability to simultaneously remove mixed non-polar and polar residues. The residue removal rate is typically only 75-85%, requiring multiple cleaning cycles to meet standards, resulting in low production efficiency. In addition, these cleaning agents also require operation at high temperatures of 50-70°C, leading to high energy consumption. High temperatures can also exacerbate substrate damage, making it impossible to achieve simultaneous cleaning and protection.

[0005] 3. Water-based cleaning agents: These are primarily water-based, formulated with surfactants, co-solvents, and other components. They offer advantages such as being environmentally friendly and non-flammable / non-explosive, representing the current industry trend. However, existing water-based cleaning agents still suffer from core technological shortcomings that are difficult to overcome. (1) Incomplete removal of encapsulation residues: Existing water-based cleaning agents cannot form a stable nano-microemulsion system. They have high surface tension and are difficult to penetrate into small areas such as chip pin gaps and encapsulation blind holes. Furthermore, they lack the ability to simultaneously solubilize non-polar rosin and polar resin acids, resulting in polar removal blind zones. The residue removal rate is low, making it impossible to achieve the standard with one cleaning. Multiple cleanings are required, which seriously affects production efficiency. (2) High energy consumption and poor substrate compatibility: According to the industry standard "Technical Requirements for Cleaning Agents for Electronic Industry" (SJ / T11630-2016) and "Research Progress of Cleaning Agents for Electronic Packaging" (Journal of Chemical Industry and Engineering, 2020, 71(5):2234-2245), the residual removal rate of traditional solvent-based cleaning agents is usually 75-85%, and they need to be operated at a high temperature of 50-70℃, resulting in high energy consumption. High temperature environment can easily cause epoxy encapsulation to yellow, swell, cross-link and degrade, and flexible substrate to thermally deform and drift in size, which cannot meet the cleaning needs of high temperature sensitive precision chips. (3) Disconnection between cleaning and protection: Most existing water-based cleaning agents only have a single cleaning function. After cleaning, they have no in-situ protection capability. The cleaned metal substrate is easily oxidized, and the chip surface is easily adsorbed with water vapor and dust, causing secondary pollution. It is necessary to set up an additional independent anti-rust immersion and hydrophobic coating / baking process. The process is complicated, the equipment and labor costs increase, and the independent protection process is prone to secondary damage to the substrate or poor bonding of the protective layer. (4) Poor system stability: Existing water-based cleaning agents lack a scientific stability control mechanism, which makes microemulsion droplets easy to aggregate, flocculate, and separate, and the synergistic effect of surfactants and cosolvents is easy to fail; at the same time, the protective components are prone to self-aggregate and gel in the cleaning liquid in advance, generating particulate impurities, which not only affect the cleaning effect, but may also cause secondary pollution on the chip surface. Moreover, the performance of the cleaning agent fluctuates greatly during storage and use in a wide temperature range, which cannot meet the needs of industrial continuous production. (5) Poor protection effect and short cycle: Existing water-based cleaning agents with simple rust prevention function mostly adhere to the metal surface through physical adsorption. The bonding force is weak and easy to fall off, and it cannot form a dense rust prevention protective layer. The metal corrosion control effect is poor. Moreover, there is no synergistic hydrophobic protection design, the ability to resist secondary pollution is weak, the protection period is short, and it is difficult to meet the protection needs of chip cleaning for temporary storage, transfer and warehousing.

[0006] Furthermore, some water-based cleaning agents attempt to lower the cleaning temperature to below 40°C, but the removal rate of mixed residues drops to 65-70%, and the emulsion separates after 1-2 months of storage, failing to achieve integrated cleaning and protection. Therefore, in existing technologies, whether solvent-based, semi-aqueous-based, or water-based, cleaning agents have not achieved a synergistic unity of "high-efficiency cleaning, room-temperature energy saving, in-situ long-term protection, system stability, and environmental safety." They either sacrifice cleaning effect for low-temperature cleaning, sacrifice substrate compatibility for high removal rate, or add process steps to achieve protective functions, resulting in high overall production costs and failing to meet the precision manufacturing requirements of high-end chip packaging.

[0007] In summary, given the existing technical shortcomings of cleaning agents for packaging product residues, such as incomplete removal of packaging residues, high energy consumption, poor substrate compatibility, disconnect between cleaning and protection, poor system stability, insufficient environmental friendliness, and high overall cost, there is an urgent need to develop a cleaning agent for packaging product residues to solve these problems. Summary of the Invention

[0008] To address the aforementioned technical problems, the present invention aims to provide a cleaning agent for packaging product residues, its manufacturing method, and its application. Through the synergistic effect between its components, the invention solves the technical pain points of traditional cleaning agents, such as incomplete removal of packaging residues, the need for high-temperature heating, easy damage to packaging substrates, the need for independent rust prevention and delamination processes, easy system delamination and failure, and poor environmental performance. It achieves the integrated technical objectives of high cleanliness, low energy consumption, no substrate damage, long-lasting protection, simplified process, and green environmental protection, which not only reduces the overall production cost but also ensures the product yield and service life.

[0009] To achieve the above objectives, the present invention adopts the following technical solution: On one hand, the present invention provides a cleaning agent for residues in packaged products, comprising the following components by weight percentage: Nonionic surfactants 8-15%; 5-10% co-solvent; Deionized water 60-75%; Metal rust inhibitor 1-3%; Silane coupling agent 0.5-2%; pH adjuster 0.3-1%; Stabilizer 0.2-1%; Preservative 0.1-0.5%; The mass ratio of the nonionic surfactant to the cosolvent is (1.5-3):1.

[0010] The purpose of this invention is to provide a cleaning agent for packaging product residues, its manufacturing method, and its application. Through the synergistic effect between the components, it solves the technical pain points of traditional cleaning agents, such as incomplete removal of packaging residues, the need for high-temperature heating, easy damage to packaging substrates, the need for independent rust prevention and delamination processes, easy delamination and failure of the system, and poor environmental performance. It achieves the integrated technical goal of high cleanliness, low energy consumption, no substrate damage, long-lasting protection, simplified process, and green environmental protection. It not only reduces the overall production cost, but also ensures the yield and service life of the product.

[0011] In some embodiments, the nonionic surfactant includes at least one of: fatty alcohol polyoxyethylene-polyoxypropylene ether EO / PO block copolymer, cocoyl glucoside, or polyoxyethylene sorbitan fatty acid ester.

[0012] In some embodiments, the co-solvent includes ethylene glycol tert-butyl ether or propylene glycol methyl ether.

[0013] In some embodiments, the metal rust inhibitor includes benzimidazole derivatives or methylbenzotriazole.

[0014] In some embodiments, the silane coupling agent includes methyltriethoxysilane or vinyltriethoxysilane.

[0015] In some embodiments, the pH adjuster is triethanolamine.

[0016] On the other hand, the present invention provides a method for manufacturing a cleaning agent for packaging product residues, comprising the following steps: S1 Oil Phase Premix: Mix nonionic surfactant with cosolvent, heat to 30-35℃ and stir to form a homogeneous oil phase premix; S2 Emulsion Phase Inversion: Maintain the temperature at 30-35℃, add deionized water droplets to the oil phase premix and increase the stirring rate to complete the phase inversion and obtain a crude emulsion; S3 Homogenization and Refinement: The crude emulsion is homogenized under high pressure to obtain a uniform nano-emulsion base material; S4 Additive Integration: After cooling the nanoemulsion base material, add pH adjuster, metal rust inhibitor, silane coupling agent, stabilizer and preservative in sequence, stir and mix and adjust pH to the target range; S5 maturation quality control: After the system is allowed to stand and mature, the finished product is obtained.

[0017] In some embodiments, in step S1, the stirring rate is 300-400 r / min and the stirring time is 20-25 min; In step S2, the stirring rate is 600-800 r / min, and the stirring time is 30-40 min; In step S3, the high-pressure homogenization pressure is 30-35 MPa, and the homogenization is repeated 2-3 times. In step S4, the cooling temperature is 25-30℃, the stirring rate is 400-500 r / min, and the stirring time is 25-30 min; In step S5, the curing temperature is 25°C and the curing time is 12-16 hours.

[0018] In another aspect, the present invention provides an application of the cleaning agent for packaging product residues as described in any of the preceding claims in the cleaning of chip packaging residues.

[0019] In some implementations, residues in semiconductor chip packaging products, precision electronic component packaging products, or automotive electronic module packaging products are cleaned using a cleaning agent for packaging product residues at a cleaning temperature of 25-35°C.

[0020] This invention provides a cleaning agent for residues in packaged products, its manufacturing method, and its application, which have the following beneficial effects: 1) This invention provides a cleaning agent for packaging product residues, its manufacturing method, and its application. Through the synergistic effect between the components, it solves the technical pain points of traditional cleaning agents, such as incomplete removal of packaging residues, the need for high-temperature heating, easy damage to packaging substrates, the need for independent rust prevention and delamination processes, easy delamination failure of the system, and poor environmental performance. It achieves the integrated technical goals of high removal rate, energy saving at room temperature, no substrate damage, in-situ protection, wide temperature stability, and green environmental protection. It not only reduces the overall production cost, but also ensures the yield and service life of the product.

[0021] 2) This invention provides a cleaning agent for residues in packaged products, its manufacturing method, and its application. The technical solution for the cleaning agent for residues in packaged products in this application constructs a multifunctional integrated nano-microemulsion system through the compounding of components including nonionic surfactants, co-solvents, metal rust inhibitors, silane coupling agents, pH adjusters, stabilizers, and preservatives; the limitation of the mass ratio of nonionic surfactants to co-solvents (1.5-3):1; and the adjustment of the pH value of the system by the pH adjuster. Relying on five core technical mechanisms—simultaneous solubilization of microemulsions, low-temperature penetration and exfoliation, synergistic in-situ film formation and interfacial bonding, integrated cleaning and protection, and microemulsion stability control—it synergistically achieves the comprehensive technical objectives of high removal rate, energy saving at room temperature, no substrate damage, in-situ protection, wide temperature stability, and environmental friendliness. Its complete synergistic mechanism is as follows: Nonionic surfactants and cosolvents are compounded at a mass ratio of (1.5-3):1 to spontaneously form 50-120nm nano-microemulsion droplets. This particle size satisfies the requirement of the gradient polar structure of the micelle core-fence layer for synchronous solubilization of microemulsions, enabling the partitioned synchronous encapsulation and solubilization of nonpolar rosin, polar resin acids, and epoxy residues. It also matches the low surface tension (25-28mN / m) of low-temperature penetration and stripping, allowing it to penetrate into micron-level dead corners such as chip pin gaps, blind vias, and bump bottoms through capillary action. The synergistic structure of the two components achieves thorough cleaning without dead corners, ensuring "penetration and solubilization wherever needed." The nonionic surfactants maintain an intact micelle structure and optimal interfacial activity at room temperature (20-35℃). Combined with the swelling and interfacial adhesion disruption of residues by the cosolvent at room temperature, contaminant stripping and solubilization can be completed without heating (traditional cleaning agents require heating to 50-70℃). The solubilized micelle structure provides a low surface tension system for low-temperature penetration, while the mild environment of low-temperature penetration avoids high-temperature demulsification of micelles and attenuation of solubilization capacity, forming a continuous synergistic process of penetration-peeling-solubilization at room temperature. This bidirectional synergy increases the removal rate of mixed residues to ≥98%, which is 13-23% higher than that of traditional cleaning agents (75-85%). It eliminates the need for multiple cleanings, achieving the target in a single cleaning, and improving production efficiency by more than 60%. At the same time, it enables room temperature operation throughout the process, reducing cleaning energy consumption by more than 50% compared to traditional processes. It fundamentally avoids yellowing and swelling of epoxy encapsulation and thermal deformation of flexible substrates, achieving efficient cleaning and substrate compatibility, as well as energy saving and consumption reduction, rather than sacrificing energy consumption and substrate safety by simply improving cleaning efficiency. Simultaneous microemulsion solubilization and low-temperature penetration stripping thoroughly remove, solubilize, and disperse contaminants on the substrate surface, forming clean and activated metal pads, silicon substrates, and epoxy encapsulation surfaces. This provides an interference-free reaction interface for the coordination adsorption of metal rust inhibitors and the hydrolysis and condensation of silane coupling agents. Without efficient pre-cleaning mechanisms, protective components will compete with residual contaminants for adsorption sites, resulting in uneven film formation, poor adhesion, and a significant reduction in protective effectiveness. The synergy between the clean substrate interface and in-situ film formation ensures a continuous, dense, and firmly bonded composite protective layer. Within the framework of the synergistic mechanism of in-situ film formation and interfacial bonding, the metal rust inhibitor preferentially forms coordination bonds with the metal surface through heterocyclic nitrogen atoms, constructing a monomolecular rust-preventive underlayer. The silane coupling agent hydrolyzes in an environment where the pH is adjusted to 6.0-7.5, connecting the inorganic substrate and the rust-preventive film with Si-O-Si and Si-OM covalent bonds to form a hydrophobic surface layer. The components are differentiated by adsorption sites and the film-forming sequence is complementary, with no interfacial competitive adsorption or film layer interference. The inner layer inhibits electrochemical corrosion, while the outer layer blocks water vapor and dust, achieving a synergistic effect of rust prevention and hydrophobicity. The synchronous coupling of the above-mentioned cleaning and film-forming processes directly supports the implementation of the integrated cleaning and protection mechanism: the four functions of cleaning and decontamination, metal rust prevention, surface hydrophobicity, and resistance to secondary pollution are integrated in a single step, eliminating the need for separate rust-proofing immersion and hydrophobic coating baking processes. This cross-mechanism synergy enables the simultaneous in-situ generation of a rust-proof and hydrophobic composite layer during cleaning. After wet heat aging, there are no visible oxidation spots, the metal mass loss rate is ≤0.004%, the surface hydrophobic angle is ≥102°, and the effective period of resistance to secondary pollution is ≥3 months. At the same time, multiple post-processing processes are eliminated, reducing the overall production cost by 30%, achieving multiple benefits of "high cleanliness + long protection cycle + low cost". No single cleaning or single protection formula can achieve this combined effect at the same time. The pH adjuster regulates the pH to a neutral-to-weak-alkaline range, while the stabilizer's steric hindrance inhibits microemulsion droplet aggregation, flocculation, and phase separation, maintaining a stable particle size of 50-120 nm and a surface tension of 25-28 mN / m. This ensures the long-term stability of the core cleaning capabilities of the microemulsion, including simultaneous solubilization and low-temperature penetration and stripping. The wide-temperature-range structure of the nonionic surfactant synergistically works with the stabilizer to prevent cloud point turbidity and component segregation in the 0-45℃ environment, avoiding a decrease in cleaning efficiency and an increase in dead-angle residue due to system failure. The neutral-to-weak-alkaline pH range ensures the stability of the microemulsion. The rust inhibitor exhibits consistent coordination adsorption activity, while the silane coupling agent is controlled to hydrolyze only on the substrate surface, preventing premature self-aggregation and gelation of particulate impurities in the cleaning solution. The synergistic effect of stabilizers and pH adjusters avoids premature failure of protective components and film defects, ensuring the uniformity and long-term effectiveness of the integrated in-situ film formation and protection mechanism. It maintains a uniform microemulsion state, free from stratification, precipitation, and component failure, ensuring consistent cleaning and film formation performance across batches and long-term stability. This addresses the industry pain points of traditional microemulsion cleaning agents, such as easy stratification, easy self-aggregation of coupling agents, and large performance fluctuations.

[0022] This solution uses deionized water as the continuous phase, combined with low-volatility co-solvents and biodegradable nonionic surfactants to construct a pure aqueous system. The aqueous continuous phase provides a safe and stable reaction medium for microemulsion formation, penetration solubilization, and in-situ film formation, without interfering with micellar structure, interfacial bonding, or system stability. The core cleaning and protective performance is not limited by the aqueous system. It contains no highly volatile organic solvents or toxic components such as halogenated hydrocarbons / aromatic hydrocarbons. Combined with biodegradable surfactants and alcohol ether structures, it achieves high cleaning efficiency and long-lasting protection while meeting environmental protection standards of VOC content ≤10g / L and total biodegradability ≥85%. The non-flammable and non-explosive characteristics of the aqueous system, combined with the process mechanism of room temperature cleaning and integrated procedures, further reduce production safety risks and achieve simultaneous optimization of core performance, process economy, and environmental safety, rather than sacrificing performance for environmental compliance. It achieves a comprehensive technical effect of ≥95.3% mixed residue removal rate, more than 50% energy saving and consumption reduction at room temperature, long-lasting in-situ composite protection, wide temperature stability without delamination, and ultra-low VOC and high degradation. It fully solves the multiple technical defects of traditional chip packaging cleaning agents and has significant technical advantages and industrial application value.

[0023] 3) This invention provides a cleaning agent for residues in packaged products, its manufacturing method, and its application. This cleaning agent for residues in packaged products utilizes precise component compounding and proportioning design, relying on five core technology mechanisms: simultaneous solubilization of microemulsions, low-temperature penetration and exfoliation, synergistic in-situ film formation and interfacial bonding, integrated cleaning and protection, and microemulsion stability control. This achieves comprehensive synergistic effects among components, effectively inhibiting microemulsion structure decay and component activity decline during recycling, ensuring that all performance indicators meet standards after 30 days of cycling. It also meets the core requirements of continuous industrial production. The specific mechanism is as follows: The formulation of nonionic surfactants and cosolvents at a ratio of (1.5-3):1 is the core prerequisite for forming uniform nano-microemulsions. This ratio can precisely control the HLB value of the system, enabling the hydrophobic PO segments and hydrophilic EO segments of the nonionic surfactants to form a stable "core-fence layer-continuous phase" microemulsion structure with the cosolvent and deionized water, thereby preventing droplet aggregation and stratification caused by imbalance in the ratio during the recycling process. Within 30 days of cycling, this formulation maintained the integrity of the microemulsion structure without component segregation, ensuring stable particle size. The pH adjuster in the system precisely controlled the overall pH to a neutral-to-weak-alkaline range of 6.0-7.5. This range ensures that the micelle structure of the nonionic surfactant remains intact and does not hydrolyze, while also inhibiting premature self-polymerization and gelation of the silane coupling agent in the cleaning solution, preventing microemulsion droplet adhesion and increased particle size due to self-polymerization products. Simultaneously, this pH environment enhances the activity of the stabilizer, providing a mild system environment for microemulsion structural stability. No significant pH fluctuations were observed within 30 days of cycling, further consolidating microemulsion stability. Stabilizers (such as polyethylene glycol 400) can insert into the palisade layer of the microemulsion droplets, forming a steric barrier and weakening the liquid's resistance. The van der Waals attraction between droplets effectively inhibits the aggregation and flocculation of microemulsion droplets during repeated use (such as spraying, stirring, and temperature fluctuations). Simultaneously, the stabilizer forms hydrogen bonds with the EO segments of the nonionic surfactant, enhancing the rigidity of the micelle structure and preventing micelle rupture and demulsification caused by cyclic shear forces. The preservative inhibits microbial growth within the system during circulation, preventing the formation of flocculent matter and impurities from microbial metabolites, and preventing the aggregation of microemulsion droplets by impurity adsorption. Deionized water serves as the continuous phase, free from interference by metal ions and inorganic impurities, avoiding microemulsion structure damage caused by impurities. This ensures no stratification or demulsification after 30 days of circulation, with the microemulsion droplet size remaining stable at 50-120 nm, meeting the requirements for micro-gap penetration during cleaning. This application system uses deionized water as the absolute continuous phase, eliminating highly volatile organic solvents such as aromatic hydrocarbons and halogenated hydrocarbons, thus reducing VOC emissions at the source. Compared with traditional solvent-based and semi-aqueous cleaning agents, this solution does not rely on volatile solvents for solubilization and decontamination, completely avoiding the VOC exceeding the standard caused by the volatilization of volatile solvents. The nonionic surfactants and cosolvents are all low-volatility, high-boiling-point components with extremely low volatility. They are also encapsulated in micelles in the microemulsion structure, making them less likely to volatilize from the aqueous phase during recycling, further reducing VOC release. At the same time, the components have excellent compatibility, with no component decomposition or volatilization within 30 days of cycling, ensuring a VOC content of ≤10g / L and meeting the VOC emission standards for industrial workshops. In this application, the gradient polar structure of the micelle core-gate layer remains intact, enabling it to continuously perform "regional solubilization"—the hydrophobic regions of the core adsorb non-polar rosin residues, while the gate layer combines with polar resin acids and epoxy residues, and the co-solvent simultaneously exerts a swelling and softening effect, synergistically achieving efficient solubilization of mixed residues. During cycling, the pH adjuster maintains the system's pH stability, preventing the activity of nonionic surfactants and co-solvents from decaying; the stabilizer inhibits microemulsion droplet aggregation, ensuring its dynamic surface tension remains stable at 25-28 mN / m, allowing it to continuously penetrate into tiny areas such as chip pin gaps and package blind vias, leaving no dead corners; the addition of preservatives inhibits microbial growth, preventing the generation of particulate impurities from microbial metabolites, preventing impurities from adsorbing onto the chip surface or clogging microemulsion droplets, ensuring no secondary pollution during cleaning, and further maintaining a high removal rate. Even after 30 days of cycling, the solubilization capacity and penetration rate of the microemulsion still meet the decontamination requirements, ensuring a stable mixed residue removal rate of ≥92.1%, far exceeding the removal rate after cycling with traditional cleaning agents (usually below 70%). The metal rust inhibitor in this application can form coordination chemical bonds with the copper pin surface through heterocyclic N atoms, generating a dense monomolecular rust inhibitor film in situ. This effectively blocks water and oxygen from contacting the copper surface and inhibits electrochemical oxidation reactions. Within 30 days of cycling, the system pH remains stable, the rust inhibitor activity does not decrease, and the microemulsion structure remains intact, ensuring that the rust inhibitor continues to adsorb and form a film on the copper pin surface. This avoids film peeling and failure during cycling, ultimately controlling the oxidation rate of metal (such as copper, silver, and copper-tin alloy) pins to ≤0.3%, which is far lower than the industry standard and meets the rust prevention requirements for long-term chip storage and use. The silane coupling agent in this application can be controlled to hydrolyze under mild pH conditions to generate silanol groups (-Si-OH), which form Si-O-Si and Si-OM covalent bonds with the hydroxyl groups on the surface of metal (such as copper, silver, and copper-tin alloy) leads and epoxy encapsulation substrates. Its organic hydrophobic chains are arranged outward in an orderly manner to form a continuous and dense hydrophobic coating. Within 30 days of cycling, the silane coupling agent does not prematurely self-polymerize and fail, and can continue to form a film on the substrate surface after cleaning. The hydrophobic coating is covalently bonded to the substrate, with high bonding strength and is not easy to fall off, ensuring that the surface hydrophobic angle is stable at 105°, effectively blocking the adsorption of water vapor and dust, and avoiding secondary pollution. The rust inhibitor and silane coupling agent in this application have complementary film-forming sequences and no competitive adsorption, forming a composite protective layer of "rust-preventive underlayer + hydrophobic surface layer". The dual-layer structure synergistically enhances the long-term protective effect. At the same time, the microemulsion system is stable during the cycle and no impurities interfere with the film formation, further ensuring that the protective performance does not decay and meeting the long-term protection requirements after cyclic cleaning. The overall system is synergistically adapted for continuous industrial use. Attached Figure Description

[0024] Figure 1 The present invention provides a flowchart of a method for manufacturing a cleaning agent for residues in packaged products. Detailed Implementation

[0025] The technical solution of the present invention will be clearly and completely described below with reference to specific embodiments. However, those skilled in the art will understand that the embodiments described below are some embodiments of the present invention, but not all embodiments, and are only used to illustrate the present invention, and should not be regarded as limiting the scope of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Where specific conditions are not specified in the embodiments, conventional conditions or conditions recommended by the manufacturer shall be followed. Where the manufacturers of reagents or instruments are not specified, they are all conventional products that can be purchased commercially.

[0026] On one hand, the present invention provides a cleaning agent for residues in packaged products, comprising the following components by weight percentage: Nonionic surfactants 8-15%; 5-10% co-solvent; Deionized water 60-75%; Metal rust inhibitor 1-3%; Silane coupling agent 0.5-2%; pH adjuster 0.3-1%; Stabilizer 0.2-1%; Preservative 0.1-0.5%; The mass ratio of the nonionic surfactant to the cosolvent is (1.5-3):1.

[0027] The purpose of this invention is to provide a cleaning agent for packaging product residues, its manufacturing method, and its application. Through the synergistic effect between the components, it solves the technical pain points of traditional cleaning agents, such as incomplete removal of packaging residues, the need for high-temperature heating, easy damage to packaging substrates, the need for independent rust prevention and delamination processes, easy delamination and failure of the system, and poor environmental performance. It achieves the integrated technical goals of high removal rate, energy saving at room temperature, no substrate damage, in-situ protection, wide temperature stability, and green environmental protection. It not only reduces the overall production cost, but also ensures the yield and service life of the product.

[0028] Preferably, the nonionic surfactant has an HLB value of 14-16 and a critical micelle concentration of 0.03-0.08 g / L. Preferably, the VOC content of the co-solvent is ≤10g / L, and the boiling point is preferably 152-156℃; Preferably, the conductivity of the deionized water is ≤10μS / cm.

[0029] Preferably, the nonionic surfactant comprises at least one of: fatty alcohol polyoxyethylene-polyoxypropylene ether EO / PO block copolymer, cocoyl glucoside, or polyoxyethylene sorbitan fatty acid ester.

[0030] Preferably, the co-solvent includes ethylene glycol tert-butyl ether or propylene glycol methyl ether.

[0031] Preferably, the metal rust inhibitor comprises: benzimidazole derivatives or methylbenzotriazole.

[0032] Preferably, the silane coupling agent comprises methyltriethoxysilane or vinyltriethoxysilane.

[0033] Preferably, the pH adjuster is triethanolamine, and the pH adjuster is used to adjust the pH value of the system to 6.0-7.5.

[0034] The stabilizer is polyethylene glycol; The preservative is isothiazolinone.

[0035] On the other hand, such as Figure 1 As shown, the present invention provides a method for manufacturing a cleaning agent for packaging product residues, comprising the following steps: S1 Oil Phase Premix: Mix nonionic surfactant with cosolvent, heat to 30-35℃ and stir to form a homogeneous oil phase premix; S2 Emulsion Phase Inversion: Maintain the temperature at 30-35℃, add deionized water droplets to the oil phase premix and increase the stirring rate to complete the phase inversion and obtain a crude emulsion; S3 Homogenization and Refinement: The crude emulsion is homogenized under high pressure to obtain a uniform nano-emulsion base material; S4 Additive Integration: After cooling the nanoemulsion base material, add pH adjuster, metal rust inhibitor, silane coupling agent, stabilizer and preservative in sequence, stir and mix and adjust pH to the target range; S5 maturation quality control: After the system is allowed to stand and mature, the finished product is obtained.

[0036] Preferably, in step S1, the stirring rate is 300-400 r / min, and the stirring time is 20-25 min; In step S2, the stirring rate is 600-800 r / min, and the stirring time is 30-40 min; In step S3, the high-pressure homogenization pressure is 30-35 MPa, and the homogenization is repeated 2-3 times. In step S4, the cooling temperature is 25-30℃, the stirring rate is 400-500 r / min, and the stirring time is 25-30 min; In step S5, the curing temperature is 25°C and the curing time is 12-16 hours.

[0037] In another aspect, the present invention provides an application of the cleaning agent for packaging product residues as described in any of the preceding claims in the cleaning of chip packaging residues.

[0038] Preferably, at a cleaning temperature of 25-35℃, a cleaning agent for packaging product residues is used to clean the residues of semiconductor chip packaging products, precision electronic component packaging products, or automotive electronic module packaging products. The cleaning includes at least one of ultrasonic-assisted cleaning, spray cleaning, or immersion cleaning. After cleaning, the substrate is ultrasonically rinsed with deionized water for 1-2 minutes (power 50-80W), and then dried at 40-50℃ for 3-5 minutes to ensure that there is no cleaning agent residue on the substrate surface, thus achieving the dual goals of efficient cleaning and substrate protection at room temperature.

[0039] The ultrasonic-assisted cleaning includes the following steps: diluting the residue of the packaging product provided by the present invention with a cleaning agent at a mass concentration of 15-25% in deionized water, and performing ultrasonic-assisted cleaning on the residue of semiconductor chip packaging products, precision electronic component packaging products, or automotive electronic module packaging products, wherein the cleaning temperature is 25-30℃, the ultrasonic power is 80-120W, the ultrasonic time is 3-8min, and the cleaning process is maintained with continuous circulation and stirring (rotation speed 150-200r / min). The spray cleaning includes the following steps: diluting the residue of the packaging product provided by the present invention with a cleaning agent at a mass concentration of 20-30% in deionized water, and spray cleaning the residue of semiconductor chip packaging products, precision electronic component packaging products or automotive electronic module packaging products, wherein the spray pressure is 0.2-0.4MPa, the cleaning temperature is 28-35℃, the cleaning time is 5-10min, and the spray angle is 45° to ensure coverage of the chip surface and pin gaps; The soaking and cleaning process includes the following steps: diluting the residue of the packaging product provided by the present invention with a cleaning agent at a mass concentration of 18-22% in deionized water, and soaking and cleaning the residue of semiconductor chip packaging products, precision electronic component packaging products or automotive electronic module packaging products, wherein the soaking temperature is 20-25℃, the soaking time is 10-15min, and the mixture is stirred once every 3min during the soaking process (rotation speed 100r / min). The ultrasonic-spray composite cleaning includes the following steps: diluting the cleaning agent for packaging product residues provided by the present invention at a mass concentration of 20-25% in deionized water, and performing ultrasonic-spray composite cleaning on the residues of semiconductor chip packaging products, precision electronic component packaging products, or automotive electronic module packaging products. The ultrasonic cleaning temperature is 25-30℃, the ultrasonic power is 100-150W, the ultrasonic time is 3-8min, and the ultrasonic cleaning process is maintained with continuous circulation and stirring (speed 150-200r / min). The spray pressure is 0.3-0.5MPa, the spray cleaning temperature is 28-35℃, the spray cleaning time is 5-10min, and the spray angle is 45° to ensure coverage of the chip surface and pin gaps.

[0040] Example 1 This invention provides a method for manufacturing a cleaning agent for residues in packaged products, comprising the following steps: S1 Oil Phase Premix: 12% by mass of fatty alcohol polyoxyethylene-polyoxypropylene ether EO / PO block copolymer (specifically lauryl alcohol polyoxyethylene-polyoxypropylene ether, model L61) and 8% by mass of ethylene glycol tert-butyl ether are mixed, heated to 32°C and stirred for 22 min at a stirring rate of 350 r / min to form a homogeneous oil phase premix. S2 Emulsion Phase Inversion: Maintain the temperature at 32℃, add 70% by mass of deionized water to the oil phase premix and increase the stirring speed to 700 r / min, stir for 35 min, and the phase inversion is completed to obtain a crude emulsion; S3 Homogenization and Refinement: The crude emulsion is subjected to two cycles of homogenization under a high pressure of 32MPa to obtain a uniform nano-emulsion base material. S4 additive integration: After cooling the nanoemulsion base material to 28℃, add 0.6% by mass of triethanolamine, 2% by mass of benzimidazole derivative (specifically 2-(methoxymethyl)benzimidazole), 1% by mass of methyltriethoxysilane, 0.3% by mass of polyethylene glycol 400 and 0.1% by mass of isothiazolinone in sequence, stir and mix to obtain a mixture, wherein the stirring rate is 450 r / min, the stirring time is 28 min, and the pH value of the mixture is 7.2; S5 maturation quality control: After the system is allowed to stand at 25℃ for 14 hours to mature, the finished product is obtained.

[0041] This invention provides the application of the cleaning agent for packaging product residues as described above in the cleaning of chip packaging residues. At a cleaning temperature of 28°C, the cleaning agent for packaging product residues provided by this invention is diluted in deionized water at a mass concentration of 20% to perform ultrasonic-assisted cleaning on the residues of semiconductor chip packaging products. The cleaning temperature is 28°C, the ultrasonic power is 100W, the ultrasonic time is 5min, and the cleaning process is maintained with continuous circulation and stirring (rotation speed 180r / min). After ultrasonic-assisted cleaning, the residues are ultrasonically rinsed with deionized water for 2min (power 60W), and then dried at 45°C for 4min to ensure that there is no cleaning agent residue on the substrate surface.

[0042] Example 2 This invention provides a method for manufacturing a cleaning agent for residues in packaged products, comprising the following steps: S1 Oil Phase Premix: 15% by mass of fatty alcohol polyoxyethylene-polyoxypropylene ether EO / PO block copolymer (specifically lauryl alcohol polyoxyethylene-polyoxypropylene ether, model L61) and 10% by mass of ethylene glycol tert-butyl ether are mixed, heated to 35°C and stirred for 25 min at a stirring rate of 400 r / min to form a homogeneous oil phase premix. S2 Emulsion Phase Inversion: Maintain the temperature at 35℃, add 71.5% by mass of deionized water droplets to the oil phase premix and increase the stirring speed to 800 r / min, stir for 40 min, and the phase inversion is completed to obtain a crude emulsion; S3 Homogenization and Refinement: The crude emulsion is subjected to cyclic homogenization treatment three times under high pressure of 35MPa to obtain a uniform nano-emulsion base material. S4 additive integration: After cooling the nanoemulsion base material to 30℃, add 0.5% by mass of triethanolamine, 1.5% by mass of benzimidazole derivative (specifically 2-(methoxymethyl)benzimidazole), 0.8% by mass of methyltriethoxysilane, 0.6% by mass of polyethylene glycol 400 and 0.1% by mass of isothiazolinone in sequence, stir and mix to obtain a mixture, wherein the stirring rate is 500 r / min, the stirring time is 30 min, and the pH value of the mixture is 6.8; S5 maturation quality control: After the system is allowed to stand at 25℃ for 16 hours to mature, the finished product is obtained.

[0043] This invention provides the application of the cleaning agent for packaging product residues described above in the cleaning of chip packaging residues. At a cleaning temperature of 32°C, the cleaning agent for packaging product residues provided by this invention is diluted in deionized water at a mass concentration of 25% to spray and clean the residues of semiconductor chip packaging products. The spraying pressure is 0.3 MPa, the cleaning temperature is 32°C, the cleaning time is 8 min, and the spraying angle is 45° to ensure coverage of the chip surface and pin gaps. After ultrasonic-assisted cleaning, the chip is ultrasonically rinsed with deionized water for 2 min (power 60W), and then dried at 45°C for 4 min to ensure that there is no cleaning agent residue on the substrate surface.

[0044] Example 3 This invention provides a method for manufacturing a cleaning agent for residues in packaged products, comprising the following steps: S1 Oil phase premix: 15% by mass of cocoyl glucoside and 7% by mass of propylene glycol methyl ether are mixed, heated to 32°C and stirred for 22 min at a stirring rate of 350 r / min to form a homogeneous oil phase premix. S2 Emulsion Phase Inversion: Maintain the temperature at 32℃, add 73% by mass of deionized water droplets to the oil phase premix and increase the stirring speed to 700 r / min, stir for 35 min, and the phase inversion is completed to obtain a crude emulsion; S3 Homogenization and Refinement: The crude emulsion is subjected to two cycles of homogenization under a high pressure of 32MPa to obtain a uniform nano-emulsion base material. S4 additive integration: After cooling the nanoemulsion base material to 28℃, add 0.7% by mass of triethanolamine, 2% by mass of methylbenzotriazole, 1.5% by mass of vinyltriethoxysilane, 0.6% by mass of polyethylene glycol 400 and 0.2% by mass of isothiazolinone in sequence, stir and mix to obtain a mixture, wherein the stirring rate is 450 r / min, the stirring time is 28 min, and the pH value of the mixture is 7.2; S5 maturation quality control: After the system is allowed to stand at 25℃ for 14 hours to mature, the finished product is obtained.

[0045] This invention provides the application of the cleaning agent for packaging product residues as described above in the cleaning of chip packaging residues. The cleaning agent for packaging product residues provided by this invention is diluted in deionized water at a mass concentration of 20% and used to soak and clean the residues of semiconductor chip packaging products. The soaking temperature is 25°C and the soaking time is 12 minutes. During the soaking process, the mixture is stirred once every 3 minutes (at a speed of 100 r / min).

[0046] Example 4 This invention provides a method for manufacturing a cleaning agent for residues in packaged products, comprising the following steps: S1 Oil Phase Premix: 12% by mass of fatty alcohol polyoxyethylene-polyoxypropylene ether EO / PO block copolymer (specifically lauryl alcohol polyoxyethylene-polyoxypropylene ether, model L61) and 8% by mass of ethylene glycol tert-butyl ether are mixed, heated to 32°C and stirred for 22 min at a stirring rate of 350 r / min to form a homogeneous oil phase premix. S2 Emulsion Phase Inversion: Maintain the temperature at 32℃, add 76% by mass of deionized water droplets to the oil phase premix and increase the stirring speed to 700 r / min, stir for 35 min, and the phase inversion is completed to obtain a crude emulsion; S3 Homogenization and Refinement: The crude emulsion is subjected to two cycles of homogenization under a high pressure of 32MPa to obtain a uniform nano-emulsion base material. S4 additive integration: After cooling the nanoemulsion base material to 28℃, add 0.6% by mass of triethanolamine, 2% by mass of benzimidazole derivative (specifically 2-(methoxymethyl)benzimidazole), 1% by mass of methyltriethoxysilane, 0.3% by mass of polyethylene glycol 400 and 0.1% by mass of isothiazolinone in sequence, stir and mix, and adjust the pH value to 7.2, wherein the stirring rate is 450 r / min and the stirring time is 28 min; S5 maturation quality control: After the system is allowed to stand at 25℃ for 14 hours to mature, the finished product is obtained.

[0047] This invention provides the application of the cleaning agent for packaging product residues as described above in the cleaning of chip packaging residues. The cleaning agent for packaging product residues provided by this invention is diluted in deionized water at a mass concentration of 22% and used to perform ultrasonic-spray composite cleaning on the residues of semiconductor chip packaging products. The ultrasonic cleaning temperature is 30°C, the ultrasonic power is 120W, the ultrasonic time is 3min, and the ultrasonic cleaning process is maintained with continuous circulation and stirring (rotation speed 180r / min). The spray pressure is 0.4MPa, the spray cleaning temperature is 30°C, the spray cleaning time is 5min, and the spray angle is 45° to ensure coverage of the chip surface and pin gaps.

[0048] Example 5 In Example 5, the process simulates an industrial ultrasonic cyclic cleaning environment. The residue of the packaged product obtained in Example 1 of this invention is diluted with a cleaning agent at a mass concentration of 20% in deionized water. The residue of the semiconductor chip packaged product is then subjected to ultrasonic cyclic cleaning. The ultrasonic temperature is 30°C, the ultrasonic power is 100W, the flow rate is 35L / min, and the cycle is continuous for 30 days.

[0049] Comparative Example 1 In Comparative Example 1, 2% benzimidazole derivative and 1% methyltriethoxysilane by mass were removed in step S4. The preparation process, component ratio and application process of the remaining cleaning agents were completely consistent with those in Example 1.

[0050] Comparative Example 2 In Comparative Example 2, the pH value of the system was adjusted to 5.0 in step S4. The preparation process, component ratio, and application process of the cleaning agent were completely consistent with those in Example 1.

[0051] Comparative Example 3 In Comparative Example 3, step S3, the high-pressure homogenization preparation step, is omitted. The preparation process, component ratio, and application process of the remaining cleaning agents are completely consistent with those in Example 1.

[0052] Comparative Example 4 Comparative Example 4 removes 8% by mass of ethylene glycol tert-butyl ether in step S1. The preparation process, component ratio, and application process of the remaining cleaning agents are completely consistent with those of Example 1.

[0053] Comparative Example 5 Comparative Example 5 removes 0.3% by mass of polyethylene glycol 400 in step S4. The preparation process, component ratio, and application process of the remaining cleaning agents are completely consistent with those of Example 1.

[0054] Comparative Example 6 (ratio less than 1.5:1) The difference between Comparative Example 6 and Example 1 is that in step S1, during the oil phase premixing, 12% by mass of the fatty alcohol polyoxyethylene-polyoxypropylene ether EO / PO block copolymer (specifically lauryl alcohol polyoxyethylene-polyoxypropylene ether, model L61) was replaced with 8% by mass of the fatty alcohol polyoxyethylene-polyoxypropylene ether EO / PO block copolymer (specifically lauryl alcohol polyoxyethylene-polyoxypropylene ether, model L61), and 8% by mass of ethylene glycol tert-butyl ether was replaced with 6.67% by mass of ethylene glycol tert-butyl ether, with a mass ratio of 1.2:1. In step S2, the mass percentage of deionized water was adjusted to make the mass percentage of the cleaning agent system 100%. The remaining preparation and application processes were completely consistent with those of Example 1.

[0055] Comparative Example 7 (ratio higher than 3:1) The difference between Comparative Example 7 and Example 1 is that in step S1, during oil phase premixing, 12% by mass of fatty alcohol polyoxyethylene-polyoxypropylene ether EO / PO block copolymer (specifically lauryl alcohol polyoxyethylene-polyoxypropylene ether, model L61) was replaced with 14% by mass of fatty alcohol polyoxyethylene-polyoxypropylene ether EO / PO block copolymer (specifically lauryl alcohol polyoxyethylene-polyoxypropylene ether, model L61), and 8% by mass of ethylene glycol tert-butyl ether was replaced with 4% by mass of ethylene glycol tert-butyl ether, with a mass ratio of 3.5:1. In step S2, the mass percentage of deionized water was adjusted to make the mass percentage of the cleaning agent system 100%. The remaining preparation and application processes were completely consistent with those of Example 1.

[0056] Experimental methods 1. Mixed Residue Removal Rate Test Experimental principle: To simulate the actual residual components of chip packaging, non-polar rosin, polar resin acid, and epoxy residue were mixed in a mass ratio of 1:1:0.5 and uniformly coated on the surface of a standard copper substrate (area 2cm×2cm, initial residual mass m0).

[0057] Experimental procedure: After cleaning according to the corresponding example / comparative example (ultrasound, spray, immersion, etc.), rinse the substrate surface with anhydrous ethanol to remove any residue that has not been removed, dry and weigh (residual mass m1).

[0058] Calculation method: Clearance rate = (m0-m1) / m0×100%.

[0059] 2. VOC content test Test standard: Based on GB / T23984-2009 "Determination of Volatile Organic Compounds (VOC in Can) Content in Low VOC Latex Paints and Varnishes".

[0060] Experimental procedure: Take 10g of sample and place it in a closed distillation apparatus. Distill at 105℃ for 3 hours. Collect the condensate of volatile organic compounds, weigh it and calculate the concentration.

[0061] 3. Biodegradation rate test Test standard: Based on GB / T 27857-2011 "Biodegradability Test of Chemicals - Activated Sludge Method".

[0062] Experimental procedure: The sample was mixed with activated sludge and cultured at 25°C under aerobic conditions for 28 days. The degree of biodegradation was reflected by measuring the COD removal rate.

[0063] 4. Microemulsion droplet size testing Testing instrument: Malvern laser particle size analyzer (Zetasizer Nano ZS).

[0064] Experimental procedure: Dilute the cleaning agent sample 100 times, ultrasonically disperse for 5 minutes, inject into the sample cell, and use dynamic light scattering (DLS) to test the particle size distribution and take the average particle size; this index is not tested for non-emulsion systems (traditional solvent-based cleaning agents).

[0065] 5. Metal Oxidation Rate Test Experimental principle: The weighing method combined with the damp heat aging test is used. The cleaned metal pins (copper, silver or copper-tin alloy) are placed in a damp heat chamber at 40℃ and 90% relative humidity for 3 months for aging.

[0066] Calculation method: Oxidation rate = (mass after aging - initial mass) / initial mass × 100% (mass loss is due to oxidation).

[0067] 6. Surface hydrophobicity angle test Test instrument: Contact angle measuring instrument (JC2000D).

[0068] Experimental procedure: Add 5 μL of deionized water to the surface of the cleaned and dried substrate, measure the contact angle using the seat drop method, and take the average value of 3 different measuring points.

[0069] 7. Substrate compatibility test Experimental steps: Immerse the epoxy resin encapsulant and flexible substrate in cleaning agent (25-35℃, 24h), observe whether the substrate shows yellowing, swelling or deformation, test the tensile strength change of the substrate using a universal testing machine (change rate ≤5% is qualified), and record the substrate condition.

[0070] 8. Cyclic stability test Experimental conditions: The application processes of Examples 1-4 and Comparative Examples 1-7 were continuously cycled for 30 days, while the application process of Example 5 remained unchanged for the same number of consecutive cycle days; Test indicators: Periodically sample and test microemulsion droplet size, mixed residue clearance rate, metal oxidation rate, and hydrophobic angle; observe whether the system separates into layers or breaks down; record the clearance rate and system stability after 30 days of cycling; for non-emulsion systems, only the clearance rate after cycling is tested.

[0071] 9. pH test Testing instrument: Precision pH meter (accuracy 0.01).

[0072] Experimental Procedure: Dilute the cleaning agent sample 50 times and equilibrate it in a constant temperature environment of 25℃ for 10 minutes. Insert the pH meter electrode into the sample and record the pH value after the reading stabilizes. Ensure that the sample pH value meets the test requirements and verify the pH deviation of the control example. The experimental data of Examples 1-5 and Control Examples 1-6 tested using the above experimental methods are shown in Table 1 below: Table 1. Experimental data of Examples 1-5 and Comparative Examples 1-6

[0073] As shown in Table 1, the removal rate of mixed residues in Examples 1-5 all reached over 95%, with Examples 1 and 2 achieving removal rates as high as 99.0%-99.1%. This indicates that the formulation and process of the present invention can efficiently remove mixed residues such as non-polar rosin, polar resin acid, and epoxy residues during chip packaging. The VOC content is controlled at 7.3-9.2 g / L, far lower than traditional cleaning agents, and the biodegradation rate reaches over 95%, meeting environmental protection requirements. The microemulsion droplet size is within the optimal range of 50-120 nm (62-95 nm), and the system exhibits good stability. After 30 days of cycling, there is no stratification or emulsion breakage, and the removal rate remains above 92%, demonstrating long-term usability. The metal oxidation rate is extremely low (0-0.3%), the surface hydrophobic angle reaches 102-112°, and the substrate is in good condition, without damage or deformation, demonstrating excellent metal protection performance and substrate compatibility.

[0074] In Example 3, a component replacement scheme of cocoyl glucoside and propylene glycol methyl ether was adopted. Compared with other examples, the removal rate and biodegradation rate decreased slightly, while the VOC content increased slightly. This indicates that the preferred combination of surfactant and cosolvent of the present invention can further improve the overall performance of the product. Example 4 adopted an ultrasonic-spray composite cleaning process. The removal rate was slightly lower than that of Examples 1-2, but there was no secondary pollution. It is suitable for cleaning needs in different scenarios, proving the flexibility and applicability of the process of the present invention.

[0075] Compared with Example 1, Comparative Example 1 (without protective components) showed basically the same mixed residue removal rate, VOC content, biodegradation rate, and system stability. However, the metal oxidation rate soared from 0.003% to 8.5%, the surface hydrophobic angle decreased from 112° to 65°, the substrate easily adsorbed dust, and the removal rate decreased from 95.2% to 88.2% after 30 days of cycling. This proves that the combination of metal rust inhibitor and silane coupling agent can effectively improve metal protection performance and surface hydrophobicity, and extend the service life of the cleaning agent cycle. It is the key to achieving "cleaning-protection integration".

[0076] Compared with Example 1, Comparative Example 2 (pH=5.0) showed that the mixed residue removal rate decreased from 99.1% to 89.2%, the biodegradation rate decreased from 97% to 88%, the microemulsion droplet size increased from 75nm to 102nm, the system showed slight stratification, the metal oxidation rate increased to 1.2%, the surface hydrophobic angle decreased to 88°, and the epoxy resin encapsulation showed slight whitening. This demonstrates that adjusting the pH range to 6.0-7.5 with a pH adjuster can ensure the controlled hydrolysis of the silane coupling agent, the normal activity of the stabilizer, maintain the stability of the microemulsion system, and avoid damage to the substrate.

[0077] Compared with Example 1, Comparative Example 3 (high-pressure homogenization omitted) showed that the mixed residue removal rate decreased from 99.1% to 87.6%, the microemulsion droplet size increased from 75nm to 195nm, the system experienced severe stratification and demulsification, and the removal rate decreased to 72.3% after 30 days of cycling. Other properties also decreased slightly. This demonstrates that the high-pressure homogenization process can effectively reduce the emulsion droplet size and improve the system stability and cleaning efficiency, and is the core process step for forming a nano-microemulsion system.

[0078] Compared with Example 1, Comparative Example 4 (without co-solvent) showed that the removal rate of mixed residues decreased from 99.1% to 82.5%, the microemulsion droplet size increased from 75nm to 168nm, the system showed slight stratification, the VOC content increased slightly, and the substrate residues were obvious. After 30 days of cycling, the removal rate decreased to 68.7%, which proves that the co-solvent can enhance the solubilization effect of mixed residues, optimize the stability of the microemulsion system, and improve the thoroughness of cleaning.

[0079] Compared with Example 1, Comparative Example 5 (without stabilizer) showed basically the same mixed residue removal rate, VOC content, and biodegradation rate, but the microemulsion droplet size increased from 75nm to 150nm, the system experienced severe stratification and demulsification, the metal oxidation rate increased to 1.2%, the surface hydrophobic angle decreased to 92°, and the removal rate decreased to 68.3% after 30 days of cycling. This demonstrates that polyethylene glycol 400, as a stabilizer, can effectively prevent emulsion droplet aggregation and demulsification, and maintain the long-term stability of the system, which is the key to the long-term use of the cleaning agent.

[0080] Compared to Example 1, Comparative Example 6 (ratio 1.2:1, below the specified range) showed a decrease in the removal rate of mixed residues from 99.1% to 78.3%, and an increase in microemulsion droplet size from 75 nm to 182 nm, far exceeding the optimal range (50-120 nm). The system exhibited severe stratification and demulsification, with the removal rate dropping to 65.1% after 30 days of cycling. The surface hydrophobic angle decreased from 112° to 85°, and the metal oxidation rate increased to 0.8%, indicating significant substrate residue. This was attributed to insufficient nonionic surfactant and excessive co-solvent, leading to an imbalance in the HLB value of the system. This prevented the formation of a stable nano-microemulsion structure, significantly reducing the micelles' simultaneous solubilization and low-temperature penetration capabilities, thus failing to completely remove the mixed residues. Furthermore, the stability of the microemulsion system collapsed, consequently affecting the subsequent in-situ protection effect.

[0081] Compared with Example 1, Comparative Example 7 (ratio 3.5:1, higher than the limit) showed that the mixed residue removal rate decreased from 99.1% to 80.5%, the microemulsion droplet size increased from 75nm to 175nm, and the system also exhibited severe stratification and demulsification. After 30 days of cycling, the removal rate decreased to 66.8%; the surface hydrophobic angle decreased to 87°, the metal oxidation rate increased to 0.7%, and there was a significant amount of substrate residue. This was due to excessive nonionic surfactant and insufficient co-solvent, resulting in an overly dense micelle structure that could not effectively encapsulate solubilized nonpolar residues. Furthermore, the co-solvent's effect on swelling and interfacial adhesion of the residue was weakened. Excessive nonionic surfactant also easily led to emulsion droplet aggregation, damaging the stability of the microemulsion system, ultimately resulting in a significant decrease in cleaning effect and system stability. Therefore, the preferred mass ratio of nonionic surfactant to co-solvent in this application is (1.5-3):1, which is the core prerequisite for forming a stable nano-microemulsion system and achieving efficient cleaning and long-term protection in this invention.

[0082] In summary, this application demonstrates that through the synergistic effect between its components, it addresses the technical pain points of traditional cleaning agents, such as incomplete removal of encapsulation residues, the need for high-temperature heating, easy damage to encapsulation substrates, the need for independent rust prevention and delamination processes, easy system delamination and failure, and poor environmental performance. It achieves the integrated technical objectives of high removal rate, energy saving at room temperature, no substrate damage, in-situ protection, wide temperature stability, and green environmental protection. This not only reduces the overall production cost but also ensures the product yield and service life.

[0083] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A cleaning agent for residues in packaged products, characterized in that, Includes the following components by mass percentage: Nonionic surfactants 8-15%; 5-10% co-solvent; Deionized water 60-75%; Metal rust inhibitor 1-3%; Silane coupling agent 0.5-2%; pH adjuster 0.3-1%; Stabilizer 0.2-1%; Preservative 0.1-0.5%; The mass ratio of the nonionic surfactant to the cosolvent is (1.5-3):

1.

2. The cleaning agent for residues in packaged products according to claim 1, characterized in that, The nonionic surfactant includes at least one of the following: fatty alcohol polyoxyethylene-polyoxypropylene ether EO / PO block copolymer, cocoyl glucoside, and polyoxyethylene sorbitan fatty acid ester.

3. The cleaning agent for residues in packaged products according to claim 1, characterized in that, The co-solvent includes: ethylene glycol tert-butyl ether or propylene glycol methyl ether.

4. The cleaning agent for residues in packaged products according to claim 1, characterized in that, The metal rust inhibitor includes: benzimidazole derivatives or methylbenzotriazole.

5. The cleaning agent for residues in packaged products according to claim 1, characterized in that, The silane coupling agent includes: methyltriethoxysilane or vinyltriethoxysilane.

6. The cleaning agent for residues in packaged products according to claim 1, characterized in that, The pH adjuster is triethanolamine.

7. A method for manufacturing a cleaning agent for residues in packaged products, characterized in that, Manufacturing a cleaning agent for residues in packaged products as described in any one of claims 1-6 comprises the following steps: S1 Oil Phase Premix: Mix nonionic surfactant with cosolvent, heat to 30-35℃ and stir to form a homogeneous oil phase premix; S2 Emulsion Phase Inversion: Maintain the temperature at 30-35℃, add deionized water droplets to the oil phase premix and increase the stirring rate to complete the phase inversion and obtain a crude emulsion; S3 Homogenization and Refinement: The crude emulsion is homogenized under high pressure to obtain a uniform nano-emulsion base material; S4 Additive Integration: After cooling the nanoemulsion base material, add pH adjuster, metal rust inhibitor, silane coupling agent, stabilizer and preservative in sequence, stir and mix and adjust pH to the target range; S5 maturation quality control: After the system is allowed to stand and mature, the finished product is obtained.

8. The method for manufacturing a cleaning agent for residues in packaged products according to claim 7, characterized in that, In step S1, the stirring rate is 300-400 r / min, and the stirring time is 20-25 min; In step S2, the stirring rate is 600-800 r / min, and the stirring time is 30-40 min; In step S3, the high-pressure homogenization pressure is 30-35 MPa, and the homogenization is repeated 2-3 times. In step S4, the cooling temperature is 25-30℃, the stirring rate is 400-500 r / min, and the stirring time is 25-30 min; In step S5, the curing temperature is 25°C and the curing time is 12-16 hours.

9. The application of a cleaning agent for packaging product residues as described in any one of claims 1-6 in the cleaning of packaging product residues.

10. The application according to claim 9, characterized in that, At a cleaning temperature of 25-35℃, use a cleaning agent for packaging product residues to clean the residues of semiconductor chip packaging products, precision electronic component packaging products, or automotive electronic module packaging products.

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