Wafer testing system and testing method thereof

Abstract

The application discloses a wafer testing system and a testing method thereof. The wafer testing system comprises a wafer loading and unloading device and a wafer aging testing device. The wafer loading and unloading device is used for mounting a wafer in a wafer clamp. The wafer loading and unloading device comprises a wafer loading device and a wafer unloading device. The wafer loading device is used for transferring and adjusting the position of the wafer. The wafer unloading device is used for mounting the wafer after position adjustment in the wafer clamp and outputting the wafer clamp loaded with the wafer. The wafer aging testing device is used for receiving the wafer clamp loaded with the wafer on the wafer loading and unloading device and performing aging testing on the wafer in the wafer clamp. The testing system realizes automatic mounting and detection of the wafer, improves the mounting and detection efficiency of the wafer, and improves the detection precision of the wafer.

Description

Technical Field

[0001] This invention relates to the field of wafer testing equipment technology, and in particular to a wafer testing system and its testing method. Background Technology

[0002] Wafer Level Burn In (WLBI) is a technique used in semiconductor manufacturing to test the aging of chips while they are still in a wafer state. At this stage, the chip has not yet been cut and packaged, but exists in the form of a wafer.

[0003] By subjecting chips to accelerated stress conditions such as high temperature and high voltage for a period of time, chips that are prone to early failure are identified. This is because potential faults may exist in the chip manufacturing process due to material defects, process deviations, or other factors. Aging tests can expose these potentially faulty chips in a short period of time, thereby ensuring higher reliability of the delivered chips.

[0004] In existing technologies, wafer mounting between the lower and upper fixtures is typically done manually. Operators must hold the wafer or use simple tools to manually adjust its position and angle, align it between the fixtures, and then lock it in place. The wafer-carrying fixture is then manually transferred to a wafer aging test device for aging testing. This method is inefficient and ill-suited to the high-efficiency testing requirements of large-scale wafer production, hindering the overall production cycle and increasing labor and time costs. Furthermore, the accuracy of manual operation is susceptible to subjective factors such as operator experience, physical condition, and visual judgment errors, making it difficult to guarantee wafer mounting precision and consequently affecting testing accuracy. Summary of the Invention

[0005] The purpose of this invention is to provide a wafer testing system and its testing method. This testing system realizes automated wafer mounting and testing, which not only improves the efficiency of wafer mounting and testing, but also improves the accuracy of wafer testing.

[0006] The objective of this invention is achieved through the following technical solution: A wafer testing system, comprising: The wafer loading and unloading equipment includes a wafer loading device and a wafer unloading device. The wafer loading device is used to transfer and adjust the position of the wafer, and the wafer unloading device is used to install the position-adjusted wafer into a wafer fixture and output the wafer fixture carrying the wafer. A wafer aging test apparatus is used to receive a wafer jig carrying a wafer from the wafer loading and unloading equipment and to perform aging tests on the wafers in the wafer jig.

[0007] In one embodiment, the wafer loading device includes: Wafer storage facility, used to store wafers; A wafer transfer mechanism for acquiring and transferring target wafers from the wafer storage mechanism, the target wafers including wafers to be aged and / or tested wafers.

[0008] In one embodiment, the wafer loading device further includes: A wafer positioning mechanism is used to receive the wafer to be aged transferred by the wafer transfer mechanism, adjust the position of the wafer to be aged, and transfer the wafer after position adjustment to the lower fixture of the wafer jig; or to transfer the tested wafer from the lower fixture to the wafer transfer mechanism.

[0009] In one embodiment, the wafer positioning mechanism includes a wafer pre-alignment mechanism and / or a wafer fine alignment device; A wafer pre-alignment mechanism is used to receive the wafers transferred by the wafer transfer mechanism and pre-align the wafers, or to receive tested wafers. The wafer precision alignment device is used to receive the wafer to be aged transferred by the wafer transfer mechanism or to obtain the pre-aligned wafer to be aged, to perform precise positioning of the test position of the wafer and the probe position of the wafer fixture, and then to transfer the precision aligned wafer to the lower fixture; or to transfer the tested wafer in the lower fixture to the wafer pre-alignment mechanism.

[0010] In one embodiment, the wafer alignment device includes: Alignment component, used to obtain alignment information between the test position on the wafer and the probe position on the wafer fixture; A wafer adjustment assembly is used to adjust the angle of the wafer according to the alignment information so that the test position corresponds to the probe position. A translation component is used to adjust the position of the wafer in a first plane, and the wafer adjustment component is disposed on the translation component.

[0011] In one embodiment, the wafer adjustment assembly includes a fixing component and an angle adjustment component, the fixing component comprising: Mounting bracket, wherein the mounting bracket is provided with a vertically through mounting groove; A ring frame, which is rotatably disposed within the mounting groove; A plurality of adsorption elements are spaced apart on the annular frame for adsorbing and fixing the wafer onto the annular frame; the angle adjustment component adjusts the angle of the annular frame according to the alignment information.

[0012] In one embodiment, the alignment component includes: A wafer camera, which is positioned above the mounting bracket, is used to acquire test position information on the wafer; A probe camera is moved to a position below the probe of the wafer chuck to acquire the probe position information of the wafer chuck.

[0013] In one embodiment, the wafer feeding device includes: Support structure, used to acquire and support the wafer fixture; The fixture assembly and disassembly device is used to assemble and disassemble the wafer fixture to place the wafer to be aged into the wafer fixture or to remove the tested wafer from the wafer fixture; A clamp receiving mechanism is used to receive the lower clamp and control the separation or combination of the lower clamp and the upper clamp.

[0014] In one embodiment, the clamp disassembly and assembly device includes: Positioning components are used to determine the position of fasteners on the wafer fixture; Fastening components are used to tighten and loosen fasteners on wafer jigs; The second drive mechanism is used to drive the fastening assembly closer to / away from the fastener.

[0015] In one embodiment, the positioning component includes a screw camera mounted on a second drive mechanism, and the fastening component includes a pneumatic screwdriver. The screw camera captures the position and angle of the fastener, and the pneumatic screwdriver adjusts its bit according to the angle of the fastener. The pneumatic screwdriver, driven by the second drive mechanism, tightens or loosens the fastener.

[0016] In one embodiment, the clamp receiving mechanism includes: The positioning table is used to receive the lower clamp; The fourth drive assembly includes a positioning stage mounted on it. The fourth drive assembly is used to drive the positioning stage to rise and fall to control the separation or combination of the lower clamp and the upper clamp.

[0017] In one embodiment, the support structure includes a clamp conveyor and / or a clamp support frame; The fixture conveyor is connected to external testing equipment, and the wafer fixture is placed on the fixture conveyor for automatically conveying the wafer fixture to the positioning component or external testing equipment. The fixture support frame is mounted on the base and is used to support the wafer fixture from the fixture conveyor and / or fixture box.

[0018] In one embodiment, the wafer aging test apparatus includes: The test component is used to receive the wafer fixture and test the wafers inside the wafer fixture; The heating component is positioned opposite the lower clamp of the wafer jig and is used to heat the wafer to be aged within the wafer jig.

[0019] In one embodiment, the test component includes: Support base, used to support wafer fixtures; The adapter board assembly is provided with a plurality of electrical connection positions; The probe assembly has multiple probes for contacting the PCB board of the wafer jig, and is used to connect the adapter board assembly and the wafer jig; Several test boards are provided, each of which is independently mounted on each electrical connection point, and at least one test board is electrically connected to the same probe group through the adapter board group.

[0020] In one embodiment, the adapter plate assembly includes at least one adapter plate and at least one connector, the at least one connector being electrically connected to the same probe group via at least one adapter plate, the connector forming an electrical connection point.

[0021] In one embodiment, the test assembly further includes a first mounting member disposed on a support base, an adapter plate assembly disposed on the first mounting member, a first limiting portion disposed on the lower surface of the first mounting member, and a second limiting portion disposed on the top of the wafer jig for adapting to the first limiting portion, for limiting the wafer jig.

[0022] In one embodiment, the heating assembly includes: An aging heating mechanism is located below the wafer fixture; The first lifting component is used to drive the aging heating mechanism or wafer fixture to lift and lower, so that the aging heating mechanism contacts the lower surface of the wafer fixture and brings the wafer fixture closer to the probe group.

[0023] In one embodiment, the heating assembly includes a second mounting member, and an aging heating mechanism is disposed on the second mounting member. The aging heating mechanism and the wafer fixture are driven to rise and fall by a first lifting member.

[0024] In one embodiment, the aging heating mechanism is provided with a first inlet / outlet gas interface, and the wafer jig is provided with a second inlet / outlet gas interface. When the aging heating mechanism contacts the wafer jig, the first inlet / outlet gas interface and the second inlet / outlet gas interface are connected to evacuate or fill the wafer jig with gas.

[0025] A testing method for a wafer testing system, using the aforementioned wafer testing system, includes the following steps: S1: Control the wafer loading device to adjust the position of the wafer and transfer it to the wafer unloading device, control the wafer unloading device to install the adjusted wafer in the wafer fixture and output the wafer fixture carrying the wafer; S2: Control the wafer aging test device to receive the wafer fixture and perform aging tests on the wafers inside the wafer fixture; S3: Control the wafer aging test device to transfer the wafer fixture carrying the wafer to the wafer unloading device; S4: Control the wafer unloading device to remove the wafer from the wafer fixture.

[0026] Compared with the prior art, the beneficial effects of the present invention include at least the following: This application provides a wafer testing system that, through the coordinated operation of wafer loading / unloading equipment and wafer aging testing device, achieves automated wafer mounting and testing. This wafer testing system not only improves the efficiency of wafer mounting and testing but also enhances the accuracy of wafer testing.

[0027] The wafer loading device of this wafer testing system uses a combination of a wafer storage mechanism, a wafer transfer mechanism, and a wafer positioning mechanism to achieve automated wafer loading, transfer, pre-alignment, and precise positioning, thereby improving the positioning accuracy of the wafers and ensuring the precision of wafer installation.

[0028] The wafer unloading device of this wafer testing system uses a fixture storage mechanism, a fixture disassembly and assembly device, and a fixture receiving mechanism to work together to realize automated loading, disassembly, and receiving of wafer fixtures. In conjunction with the wafer precision alignment device, it realizes automated installation and transfer of wafers and wafer fixtures.

[0029] The wafer aging test device of this wafer testing system sets up several test boards in a plug-in manner with sliding connections, which can realize the installation, maintenance and replacement of any test board. By equipping multiple test boards, the size and cost of a single test board can be reduced. By using one probe group to correspond to multiple test boards, the complexity of the equipment can be reduced and the flexibility of parallel testing can be improved. At the same time, the test components are set above the wafer fixture, that is, the entire test components are located at the top of the testing device. When the test components need to be repaired, there is no need to disassemble other components. Furthermore, the vertically stacked test boards are arranged horizontally and plugged into the adapter board, allowing any test board to be plugged in and unplugged for repair, which facilitates the disassembly and maintenance of the test boards. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the wafer loading and unloading equipment of the wafer testing system according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the wafer storage mechanism, wafer transfer mechanism, and wafer pre-alignment mechanism of the wafer testing system according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the wafer alignment device, fixture storage mechanism, and fixture disassembly / assembly device of the wafer testing system according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the wafer alignment device and fixture receiving mechanism of the wafer testing system according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the wafer alignment device of the wafer testing system according to an embodiment of the present invention; Figure 6 yes Figure 5 A magnified view of a portion of point A in the middle; Figure 7 This is a schematic diagram of the fixture assembly / disassembly device of the wafer testing system according to an embodiment of the present invention; Figure 8 This is a schematic diagram from another perspective of the fixture assembly / disassembly device of the wafer testing system according to an embodiment of the present invention; Figure 9 This is a schematic diagram of the fixture receiving mechanism of the wafer testing system according to an embodiment of the present invention; Figure 10 This is a schematic diagram of the structure of a wafer aging test device in a wafer testing system according to an embodiment of the present invention; Figure 11 This is a schematic diagram of the structure of a wafer aging test device in a wafer testing system according to another embodiment of the present invention; Figure 12 This is a schematic diagram of the structure of a wafer aging test device in a wafer testing system according to another embodiment of the present invention.

[0031] In the diagram: 1. Wafer storage mechanism; 2. Wafer transfer mechanism; 3. Wafer pre-alignment mechanism; 4. Wafer precision alignment device; 5. Fixture storage mechanism; 6. Fixture disassembly and assembly device; 7. Fixture receiving mechanism; 8. Wafer fixture; 9. Wafer aging test device; 11. Wafer loading base; 12. Second lifting assembly; 13. First slot; 21. First drive mechanism; 22. Fork plate; 23. U-shaped groove; 24. Nozzle; 31. Pre-alignment assembly; 32. Receiving assembly; 41. Fixing assembly; 42. Alignment assembly; 43. Angle adjustment assembly; 4 4. Translation component; 45. Adjustment groove; 46. Elastic element; 462. Connecting piece; 461. Spring; 463. Connecting block; 411. Mounting bracket; 412. Ring frame; 413. Adsorption component; 421. Wafer camera; 422. Probe camera; 431. Motor; 432. Screw; 433. Mounting block; 434. Guide post; 435. Guide plate; 436. Guide groove; 441. First translation component; 442. Second translation component; 51. Fixture positioning seat; 52. First lifting component; 53. Second slot; 61. Support structure; 62. Positioning assembly; 63. Fastening assembly; 64. Second drive mechanism; 65. Fixture transfer mechanism; 66. Clamping assembly; 100. Fixture transfer component; 101. Fixture support frame; 621. Screw camera; 631. Mounting base; 632. Pneumatic screwdriver; 001. Screwdriver bit; 002. Air extraction pipe; 641. First drive assembly; 642. Second drive assembly; 643. Third drive assembly; 651. Transmission line; 652. Limiting slide; 653. Guide trimming edge; 661. Gripper cylinder; 662. Clamping plate; 71. Positioning table 72. Fourth drive assembly; 73. Second lifting component; 81. Upper clamp; 82. Lower clamp; 91. Test assembly; 92. Heating assembly; 93. Fixing plate; 94. Limiting frame; 95. Rolling component; 96. Base; 97. Pushing component; 98. Support base; 911. Adapter plate assembly; 912. Probe assembly; 913. Test plate; 914. Test interface; 915. First mounting component; 916. First limiting part; 917. Second limiting part; 921. Aging heating mechanism; 922. First lifting component; 923. Second mounting component. Detailed Implementation

[0032] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided to make the invention more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore repeated descriptions of them will be omitted.

[0033] The terms used to express position and direction in this invention are illustrated with reference to the accompanying drawings, but changes can be made as needed, and all such changes are included within the scope of protection of this invention.

[0034] Reference Figure 1 and Figure 10 This embodiment provides a wafer testing system, including: wafer loading and unloading equipment and wafer aging test device 9.

[0035] The wafer loading and unloading equipment is used to install wafers in wafer fixture 8. The wafer loading and unloading equipment includes a wafer loading device and a wafer unloading device. The wafer loading device is used to transfer and adjust the position of the wafer. The wafer unloading device is used to install the position-adjusted wafer in wafer fixture 8 and output the wafer fixture 8 carrying the wafer.

[0036] The wafer loading device may include a wafer storage mechanism 1, a wafer transfer mechanism 2, and a wafer positioning mechanism. The wafer positioning mechanism may include a wafer pre-alignment mechanism 3 and a wafer precision alignment device 4. The wafer unloading device may include a fixture storage mechanism 5, a fixture disassembly and assembly device 6, and a fixture receiving mechanism 7.

[0037] Whether or not to configure a wafer positioning mechanism can be determined based on requirements: If no wafer positioning mechanism is configured, the wafers obtained by the wafer transfer mechanism 2 are directly transported to the separated lower fixture; If a wafer positioning mechanism is configured, it can also include a separate wafer pre-alignment mechanism 3 or a separate wafer precision alignment device 4 as needed, or it can include both wafer pre-alignment mechanism 3 and wafer precision alignment device 4 simultaneously. When a separate wafer pre-alignment mechanism 3 or a separate wafer precision alignment device 4 is included, the wafer obtained by the wafer transfer mechanism 2 is first transported to the wafer pre-alignment mechanism 3 or the wafer precision alignment device 4. After alignment is completed, it is then transported to the separated lower fixture. Specifically, the wafer can be transported to the lower fixture by the wafer transfer mechanism 2, or the wafer pre-alignment mechanism 3 / wafer precision alignment device 4 can be equipped with a displacement component to transport the wafer to the lower fixture. When both the wafer pre-alignment mechanism 3 and the wafer precision alignment device 4 are included, the wafer transfer mechanism 2 will sequentially pass the obtained wafer through the wafer pre-alignment mechanism 3 and the wafer precision alignment device 4 to complete the pre-alignment and precision alignment work, and finally transport it to the separated lower fixture.

[0038] The wafer aging test apparatus 9 is used to receive the wafer jig 8 containing wafers from the wafer loading and unloading equipment and to perform aging tests on the wafers in the wafer jig 8. The wafer aging test apparatus 9 may include a test component 91 and a heating component 92.

[0039] The wafer fixture 8 generally includes an upper fixture 81 and a lower fixture 82. The lower fixture 82 has a cavity for placing the wafer to be tested. The upper fixture 81 includes a PCB board and a probe. The PCB board is electrically connected to the probe, which is used to connect with the wafer to be tested placed in the lower fixture 82.

[0040] Specifically, multiple wafers are sequentially loaded into the wafer storage mechanism 1. The wafer transfer mechanism 2 picks up the wafers from the wafer storage mechanism 1 and transfers them to the wafer pre-alignment mechanism 3. The wafer pre-alignment mechanism 3 receives, inspects, and pre-aligns the wafers. Simultaneously, multiple empty wafer jigs 8 are sequentially loaded into the jig storage mechanism 5. The jig removal and assembly device 6 removes, positions, inspects, and disassembles the wafer jigs 8 from the jig storage mechanism 5. The jig receiving mechanism 7 receives the lower jig 82 and controls its separation from the upper jig 81. Next, the wafer precision alignment device 4 picks up the wafers from the wafer pre-alignment mechanism 3 and transfers them directly above the jig receiving mechanism 7. During this process, the positions of the wafer and the probes of the upper jig 81 are detected. Based on the obtained position information of the wafer and the probes of the upper jig 81, the wafer is precisely adjusted so that the pinholes of the wafer correspond to the probe positions of the upper jig 81. Then, the clamp receiving mechanism 7 drives the lower clamp 82 to move upward, so that the wafer is placed on the lower clamp 82. At the same time, the wafer alignment device 4 releases the wafer and moves it out. The clamp receiving mechanism 7 drives the lower clamp 82 to move the wafer upward to the bottom of the upper clamp 81, so that the pinhole of the wafer is precisely aligned with the probe of the upper clamp 81, and the lower clamp 82 and the upper clamp 81 combine to form a test cavity. Finally, the clamp disassembly and assembly device 6 tightens multiple screws on the wafer clamp 8 in sequence. After the installation of the wafer clamp 8 and the wafer is completed, the clamp disassembly and assembly device 6 transfers the wafer clamp 8 carrying the wafer to the wafer aging test device 9. The test component 91 and the heating component 92 of the wafer aging test device 9 cooperate to heat and age the target wafer in the wafer clamp 8.

[0041] In the above structure, the wafer loading / unloading equipment and the wafer aging test device 9 work together to achieve automated wafer mounting and testing. This wafer testing system not only improves the efficiency of wafer mounting and testing but also enhances the accuracy of wafer testing.

[0042] The following is a detailed description of each part in conjunction with the accompanying drawings.

[0043] Reference Figure 2 and Figure 3 As a preferred embodiment, the wafer loading device includes: a wafer storage mechanism 1, a wafer transfer mechanism 2, and a wafer positioning mechanism. This wafer loading device, by setting the wafer storage mechanism 1, the wafer transfer mechanism 2, and the wafer positioning mechanism to cooperate with each other, can achieve automated wafer loading, transfer, pre-alignment, and precise positioning, improving the positioning accuracy of the wafers and ensuring the precision of wafer installation.

[0044] A wafer storage mechanism 1 is used to store wafers. The wafer storage mechanism 1 may include a wafer loading stand 11 and a second lifting assembly 12. The wafer loading stand 11 is mounted on the second lifting assembly 12 and has multiple first slots 13 for placing wafers from top to bottom. The second lifting assembly 12 and the wafer loading stand 11 are installed inside a wafer storage chassis. A flip-top is located near the wafer loading stand 11 in the wafer storage chassis. A photoelectric sensor is also installed inside the wafer storage chassis to detect whether a wafer at a corresponding position has been removed. Wafers are placed sequentially from bottom to top on the multiple first slots 13 of the wafer loading stand 11. The second lifting assembly 12 drives the wafer loading stand 11 to move the wafers up and down, coordinating with the wafer transfer mechanism 2 to transfer the wafers. This setup achieves automatic wafer loading and, in conjunction with the wafer transfer mechanism 2, improves wafer transfer efficiency.

[0045] The wafer transfer mechanism 2 is used to acquire and transfer wafers (including wafers to be aged and / or tested wafers) from the wafer storage mechanism 1. The wafer transfer mechanism 2 may include a first drive mechanism 21 and a fork plate 22. The first drive mechanism 21 is preferably a linear module. The fork plate 22 is disposed on the first drive mechanism 21 and has a U-shaped groove 23 and multiple suction nozzles 24 arranged circumferentially along the groove. The suction nozzles 24 are used to pick up the wafers. The first drive mechanism 21 drives the fork plate 22 to extend into the bottom of the wafer in the wafer storage mechanism 1. The multiple suction nozzles 24 on the fork plate 22 pick up the wafer, and then the first drive mechanism 21 drives the fork plate 22 to move the wafer above the wafer pre-alignment mechanism 3. This arrangement achieves automated wafer transfer and pickup, ensuring the stability of the wafer during the transfer process and preventing wafers from falling.

[0046] The wafer positioning mechanism is used to receive the wafer to be aged transferred by the wafer transfer mechanism 2 and adjust the position of the wafer to be aged, and transfer the wafer after position adjustment to the lower fixture of the wafer jig 8; or transfer the tested wafer from the lower fixture to the wafer transfer mechanism 2; the wafer positioning mechanism may include a wafer pre-alignment mechanism 3 and / or a wafer fine alignment device 4.

[0047] Reference Figure 2The wafer pre-alignment mechanism 3 may include a pre-alignment component 31, a receiving component 32, a wafer pre-alignment camera (not shown), and an identification component (not shown). The pre-alignment component 31 is used to rotate the wafer. The receiving component 32 is used to lift and receive the wafer on the wafer transfer mechanism 2. The receiving component 32 is installed in the central cutout position of the pre-alignment component 31. The wafer pre-alignment camera is used to photograph and position the wafer on the pre-alignment component 31; the wafer pre-alignment camera is preferably a CCD camera. The identification component is used to read the barcode on the wafer on the pre-alignment component 31; the identification component is preferably a scanner with integrated OCR image recognition function. When the wafer transfer mechanism 2 moves the wafer above the pre-alignment component 31, the receiving component 32 moves upward through the U-shaped groove 23 of the fork plate 22 to receive the wafer and drive it downward, so that the wafer is positioned on the pre-alignment component 31. The wafer pre-alignment camera takes pictures of the wafer for positioning, obtains the wafer's cut edge position, and calculates the required rotation angle. Then, the pre-alignment component 31 drives the wafer to rotate according to the analysis results, adjusting the wafer's angle and center position. After pre-alignment is completed, the identification component reads the barcode on the wafer, obtains the wafer information, and records the wafer status. This setup realizes automated wafer receiving and pre-alignment, improving alignment efficiency and effectiveness.

[0048] Reference Figures 3-6 In a preferred embodiment, the wafer alignment device 4 includes: a fixing component 41, an alignment component 42 and an angle adjustment component 43, and may also include a translation component 44 and a second controller.

[0049] The fixing component 41 is used to fix the target wafer. The fixing component 41 can fix the wafer by adsorption, pressure or other means. The function of the fixing component 41 includes transferring the wafer from the wafer transfer mechanism 2 or the wafer pre-alignment mechanism 3 or the lower fixture.

[0050] The alignment component 42 is used to obtain the alignment information between the test position of the fixed wafer (referring to the wafer that has been fixed / acquired by the fixing component 41) and the probe position of the wafer fixture 8. The test position of the wafer is, for example, the pad position of the wafer. The alignment component 42 can obtain the alignment information between the test position of the wafer and the probe position of the wafer fixture 8 by taking pictures of the test position of the wafer and the probe position of the wafer fixture 8 respectively.

[0051] The angle adjustment component 43 is used to adjust the angle of the wafer according to the alignment information so that the test position corresponds to the probe position. After the adjustment is completed, the wafer that has been precisely aligned is installed into the wafer fixture 8 along the preset path by the displacement of the translation component 44. This ensures that the test position of the wafer and the probe position of the wafer fixture 8 can be accurately aligned and electrically connected without the need to adjust the wafer angle again.

[0052] The wafer alignment device 4 obtains the alignment information of the test position of the target wafer and the probe position of the wafer fixture 8 through the alignment component 42. Then, according to the alignment information, the angle of the wafer is adjusted by the angle adjustment component 43, thereby achieving precise adjustment and alignment of the wafer and probe positions. This ensures that when the wafer is assembled in the wafer fixture 8, the test position corresponds to the probe position, which helps to improve the accuracy of subsequent test results.

[0053] Reference Figures 4-6 In a preferred embodiment, the wafer alignment device 4 provided in this embodiment further includes a translation component 44. The translation component 44 can be disposed on the base 96 and is used to adjust the position of the target wafer in a first plane. The base 96 is, for example, a worktable for mounting the wafer alignment device 4. Specifically, in this embodiment, the first plane is a horizontal plane. In other embodiments, the first plane can also be an inclined plane or a vertical plane. The translation component 44 includes: a first translation member 441 and a second translation member 442. The first translation member 441 moves along a slide rail disposed on the base 96 and is driven by a driving device disposed on the base 96. The second translation member 442 moves along a slide rail disposed on the first translation member 441 and is driven by a driving device disposed on the first translation member 441. The driving device is, for example, a motor.

[0054] The first translation member 441 is used to adjust the position of the target wafer in the X2 axis direction. The second translation member 442 is disposed on the first translation member 441 and is used to adjust the position of the target wafer in the Y2 axis direction. The fixing component 41 is disposed on the second translation member 442. The fixing component 41 moves with the first translation member 441 and the second translation member 442 in the first plane, thereby adjusting the position of the target wafer in the first plane.

[0055] The X2 axis and Y2 axis are perpendicular to each other in the first plane. With the cooperation of the first translation member 441 and the second translation member 442, the target wafer can be transferred to any coordinate position within the movement range of the two translation members, which is convenient for docking with other devices, such as the upper clamp 81 and the lower clamp 82 of the wafer jig 8. The upper clamp 81 can be moved to the lower part of the upper clamp 81 to obtain the probe position, and the lower clamp 82 can be moved to the upper part of the lower clamp 82 to obtain / place the target wafer.

[0056] Reference Figures 4-6As a preferred embodiment, the wafer alignment device 4 provided in this embodiment further includes a second controller. The second controller is connected to the fixing component 41, the alignment component 42, the angle adjustment component 43, and the translation component 44. It is used to control the operation of the fixing component 41, the alignment component 42, the angle adjustment component 43, and the translation component 44. The second controller controls the translation component 44 to adjust the position of the wafer, and then controls the fixing component 41 to adsorb and fix the wafer. Based on the alignment information of the test position of the wafer and the probe position of the wafer fixture 8 obtained by the alignment component 42, the angle adjustment component 43 is controlled to adjust the angle of the wafer to complete the alignment work.

[0057] Reference Figures 4-6 In a preferred embodiment, the fixing component 41 includes: a mounting bracket 411, a ring bracket 412, and a plurality of adsorption elements 413.

[0058] The mounting bracket 411 has a through mounting groove, such as a circular through hole. The annular frame 412 is annular and rotatably mounted within the mounting groove on the mounting bracket 411. Specifically, the annular frame 412 can be rotatably connected to the mounting bracket 411 via an annular slide rail, allowing the annular frame 412 to rotate within the mounting groove. Several adsorption elements 413 are evenly spaced on the annular frame 412, specifically arranged circumferentially along the annular frame 412, used to adsorb and fix the target wafer onto the fixing assembly 41. For example, the target wafer can be obtained from a robotic arm, a trimming and alignment mechanism, or a lower clamp 82 through adsorption. The adsorption element 413 can be a pneumatic suction nozzle 24, which generates negative pressure by evacuating air to adsorb and fix the wafer.

[0059] Reference Figures 4-6 In a preferred embodiment, the alignment component 42 includes a wafer camera 421 and a probe camera 422. The wafer camera 421 and the probe camera 422 can be small cameras, preferably CCD cameras, to acquire alignment information of the test position of the wafer and the probe position of the wafer fixture 8 in real time.

[0060] The wafer camera 421 is positioned above the mounting bracket 411, specifically by mounting it above the mounting bracket 411 via a bracket. The wafer camera 421 can also be mounted on the base 96 via a bracket. The lens of the wafer camera 421 is set downwards to acquire test position information on the wafer. The probe camera 422 moves to a position below the probe position of the wafer fixture 8 to acquire probe position information on the wafer fixture 8. Specifically, the probe camera 422 can be detachably mounted on one side of the mounting bracket 411, with its lens set upwards.

[0061] Reference Figures 4-6 In a preferred embodiment, the angle adjustment assembly 43 includes: a drive element (which may include a motor 431 and a screw 432), a mounting block 433, a guide post 434, and a guide plate 435.

[0062] The guide plate 435 is provided with a guide groove 436 that is radially opened along the annular frame 412; the mounting block 433 is slidably connected to the mounting frame 411, and the mounting block 433 is translated in a direction perpendicular to the radial direction of the annular frame 412 by a driving member; the guide post 434 is fixedly mounted on the mounting block 433 and movably mounted in the guide groove 436.

[0063] Specifically, the motor 431 is located on one side of the mounting bracket 411, the screw 432 is connected to the output end of the motor 431, the screw 432 passes through the mounting block 433, the mounting block 433 is threadedly connected to the screw 432, and the mounting block 433 is slidably connected to the mounting bracket 411 to limit the mounting block 433. The motor 431 drives the screw 432 to rotate, and under the limiting action that the mounting block 433 can only move along the specified direction, the mounting block 433 can move back and forth along the extension direction of the screw 432.

[0064] A guide plate 435 is disposed on the upper surface of the mounting block 433 and extends along the radial direction of the annular frame 412. A guide groove 436 is provided on the guide plate 435. One end of the guide plate 435 is sleeved on the guide post 434 through the guide groove 436, and the other end is fixedly connected to the annular frame 412 by bolts. When the mounting block 433 moves, the guide plate 435 rotates due to the translation of the guide post 434 in the guide groove 436. The guide groove 436 provides displacement compensation for the movement of the guide plate 435. Furthermore, the guide plate 435 drives the annular frame 412 to rotate a certain angle in the mounting groove of the mounting frame 411, thereby adjusting the angle of the wafer on the annular frame 412 so that the test position corresponds to the probe position.

[0065] The fixing component 41 also includes a displacement detection element (not shown), which can be set on the mounting bracket 411 to detect the displacement value of the mounting block 433 in order to control the rotation angle of the ring frame 412 and achieve precise positioning.

[0066] Reference Figures 4-6 In a preferred embodiment, the mounting bracket 411 is provided with a plurality of adjustment grooves 45 along the circumference of the annular frame 412, and an elastic element 46 connected to the annular frame 412 is provided in the adjustment groove 45.

[0067] The adjusting groove 45 is set at an angle to the radial direction of the annular frame 412, so that the elastic force direction of the elastic element 46 in the adjusting groove 45 intersects with the radial extension direction of the annular frame 412. This facilitates the elastic element 46 applying force to the annular frame 412. The elastic element 46 includes a connecting piece 462 connected to the annular frame 412 in the same radial direction as the annular frame 412, and a spring 461 with its two ends connected to the connecting piece 462 and the adjusting groove 45, respectively. A connecting block 463 connected to the spring 461 can also be slidably disposed in the adjusting groove 45. The connecting block 463 is detachably fixed in the adjusting groove 45 and is used to adjust the elastic force of the spring 461. For example, when the elastic force of the spring 461 decreases, the connecting block 463 can be adjusted a certain distance away from the connecting piece 462 in the adjusting groove 45 and then fixed, so that the spring 461 maintains its elastic force.

[0068] Reference Figure 1 , Figures 3-4 As a preferred embodiment, the wafer unloading device includes: a support structure 61, a fixture storage mechanism 5, a fixture disassembly and assembly device 6, and a fixture receiving mechanism 7.

[0069] The fixture storage mechanism 5 is used to store wafer fixtures 8. The fixture disassembly and assembly device 6 retrieves and transfers wafer fixtures 8 from the fixture storage mechanism 5, and transfers disassembled wafer fixtures 8 to the fixture storage mechanism 5. The fixture storage mechanism 5 of the wafer loading and unloading equipment may include a fixture positioning seat 51 and a first lifting assembly 52. ​​The fixture positioning seat 51 is used to place multiple wafer fixtures 8, and the fixture positioning seat 51 is provided with multiple second slots 53 for placing wafer fixtures 8 from top to bottom. The fixture positioning seat 51 is mounted on the first lifting assembly 52. ​​The wafer fixtures 8 are placed in the multiple second slots 53 of the fixture positioning seat 51 from bottom to top, and the first lifting assembly 52 drives the fixture positioning seat 51 to move the multiple wafer fixtures 8 up and down. This configuration realizes the automated loading and unloading of wafer fixtures 8, and in conjunction with the fixture disassembly and assembly device 6, further improves the loading and unloading efficiency of wafer fixtures 8.

[0070] The fixture assembly / disassembly device 6 is used to retrieve and transfer the wafer fixture 8 from the fixture storage mechanism 5, so as to place the wafer into the wafer fixture 8 and transfer the wafer fixture 8 carrying the wafer to the wafer aging test device 9.

[0071] The clamp receiving mechanism 7 is used to receive the lower clamp 82 on the clamp disassembly and assembly device 6 and control the lower clamp 82 to move up and down.

[0072] Specifically, multiple empty wafer jigs 8 are sequentially loaded into the jig storage mechanism 5. The jig disassembly and assembly device 6 removes, positions, inspects, and disassembles the wafer jigs 8 in the jig storage mechanism 5. The jig receiving mechanism 7 receives the lower jig 82 and controls its separation from the upper jig 81. Next, the wafer alignment device 4 places the precisely aligned wafer onto the lower jig 82. The jig receiving mechanism 7 drives the lower jig 82 to move the wafer upwards to the bottom of the upper jig 81, ensuring that the probe holes of the wafer are precisely aligned with the probes of the upper jig 81, and that the lower jig 82 and the upper jig 81 combine to form a test cavity. Finally, the jig disassembly and assembly device 6 tightens multiple screws sequentially onto the wafer jigs 8. After the installation of the wafer jigs 8 and the wafer is completed, the jig disassembly and assembly device 6 transfers the wafer jigs 8 carrying the wafer into the wafer aging test device 9.

[0073] This wafer unloading device, through the coordinated arrangement of a fixture storage mechanism 5, a fixture disassembly and assembly device 6, and a fixture receiving mechanism 7, achieves automated loading, disassembly, and receiving of wafer fixtures 8. In conjunction with the wafer precision alignment device 4, it enables automated installation and transfer of wafers and wafer fixtures 8.

[0074] Reference Figures 7-8 In a preferred embodiment, the clamp assembly / disassembly device 6 includes a positioning component 62, a fastening component 63, and a second drive mechanism 64. It may also include a first controller for controlling the operation of the support structure 61, the positioning component 62, the fastening component 63, and the second drive mechanism 64.

[0075] The support structure 61 is used to acquire the wafer fixture 8 and support the wafer fixture 8.

[0076] The positioning component 62 is used to obtain the position of the fasteners on the wafer fixture 8.

[0077] Fastening component 63 is used to tighten and loosen fasteners on wafer jig 8.

[0078] The fastening assembly 63 is disposed on the second drive mechanism 64, which is used to drive the fastening assembly 63 to move along at least one of the X1 axis, Y1 axis and Z1 axis directions to approach or move away from the wafer jig 8. The X1 axis, Y1 axis and Z1 axis directions are perpendicular to each other.

[0079] Specifically, the wafer fixture 8 includes an upper fixture 81 and a lower fixture 82 that are detachably connected by fasteners, such as screws. The target wafer to be tested is placed in the lower fixture 82, and the upper fixture 81 and the lower fixture 82 are closed to form a test chamber. The wafer fixture 8 is supported by a support structure 61, and the position of the fasteners (lower refers to the screws) is obtained with the help of the positioning component 62 (specifically, the screw coordinates and the screw nut angle can be obtained). The fastening component 63 disassembles or installs the screws above / below the upper fixture 81, thereby separating the screws of the upper fixture 81 and the lower fixture 82, so that the upper fixture 81 and the lower fixture 82 can be separated.

[0080] In the above structure, the wafer fixture 8 is acquired and supported by a support mechanism. Furthermore, the wafer fixture 8 is automatically disassembled and installed by the cooperation of the second drive mechanism 64, the positioning component 62, and the fastening component 63. This not only improves the efficiency of disassembly and assembly but also improves the accuracy of disassembly, ensuring the quality of wafer fixture 8 disassembly and assembly.

[0081] Reference Figures 7-8 In a preferred embodiment, the support structure 61 includes a clamp transfer member 100 and / or a clamp support frame 101.

[0082] The fixture transfer unit 100 is connected to external testing equipment. The wafer fixture 8 is placed on the fixture transfer unit 100 for automatically transferring the wafer fixture 8 to the positioning component 62 and the fastening component 63, or to the external testing equipment.

[0083] The fixture support frame 101 is mounted on the base 96 and is used to support the wafer fixture 8 from the fixture transfer member 100 and / or the fixture box.

[0084] Specifically, when the support structure 61 only includes the clamping transfer component 100: The fixture conveyor 100 can be a conveyor belt, which is connected to the external testing equipment (aging test device). Specifically, it is used to connect the fixture disassembly and assembly mechanism (positioning component 62, fastening component 63 and second drive mechanism 64) to the aging test device for the transfer of the wafer fixture 8. It can support the acquisition or transport of the wafer fixture 8 in the external testing equipment. The conveyor belt can be used with structures such as robotic arms to pick up / put the wafer fixture 8 from the aging test device.

[0085] At this time, a component that limits the shaking of the lower clamp 82 can be set on the conveyor belt, and the specific component is not limited; the positioning component 62 and the fastening component 63 are opposite to the fastener. If the lower clamp 82 is fixed downward by the screw at the top of the upper clamp 81, the positioning component 62 and the fastening component 63 are located above the conveyor belt.

[0086] When the support structure 61 only includes the clamp support frame 101: The upper clamp 81 of the wafer jig 8 is supported on the jig support frame 101. At this time, the wafer jig 8 can be suspended or the lower clamp 82 is located on a plane such as the substrate. When the wafer jig 8 is suspended, the jig receiving mechanism 7 is located directly below the lower clamp 82. It receives the lower clamp 82 upward and pulls the lower clamp 82 downward to separate it from the upper clamp 81. When the wafer jig 8 is not suspended, the jig receiving mechanism 7 can be located above or below the upper clamp 81. It only needs to lift and lower the support frame to ultimately lift and lower the upper clamp 81 to separate it from the lower clamp 82.

[0087] When the support structure 61 includes the clamp transfer member 100 and the clamp support frame 101: The integrated support structure 61 includes only the clamp transfer component 100 and the support structure 61 includes only the clamp support frame 101, which can exist in two ways; In scenario 1, the conveyor belt extends directly below the fixture support frame 101. As the wafer fixture 8 is driven by the conveyor belt, it enters the fixture support frame 101. With the wafer fixture 8 in a non-suspended state, the fixture receiving mechanism 7 is located above or below the upper fixture 81. It only needs to be able to lift and lower the support frame, and finally lift and lower the upper fixture 81 to separate it from the lower fixture 82. In scenario 2, the conveyor belt does not extend directly below the fixture support frame 101. As the wafer fixture 8 is driven by the conveyor belt, it is moved from the conveyor belt to the fixture support frame 101 (the wafer fixture 8 is completely or mostly detached from the conveyor belt). In conjunction with the setting of the wafer fixture 8 being suspended, the fixture receiving mechanism 7 is located directly below the lower fixture 82. It receives the lower fixture 82 upwards and pulls the lower fixture 82 downwards to separate it from the upper fixture 81.

[0088] The support structure 61 can connect to the fixture transfer component 100 or the fixture support frame 101, and can automatically handle the wafer fixtures 8 coming from external testing equipment or fixture boxes, avoiding manual handling and improving work efficiency.

[0089] Reference Figure 8 In a preferred embodiment, the clamp support frame 101 includes a clamp transfer mechanism 65 and a clamping assembly 66.

[0090] The jig transfer mechanism 65 is used to transfer the wafer jig 8 to below the positioning assembly 62 or the fastening assembly 63.

[0091] The clamping assembly 66 is used to clamp the wafer jig 8 and transfer the wafer jig 8 from the jig transfer member 100 and / or jig box to the jig transfer mechanism 65.

[0092] The jig transfer mechanism 65 is used to transfer the wafer jig 8 to a designated position on the jig support frame 101. The jig transfer mechanism 65 may include two parallel transfer lines 651 or transfer belts extending along the X1 axis. During transfer, each end of the wafer jig 8 is located on one transfer line 651. Limiting grooves 652 are provided on each of the two transfer lines 651 to limit the two ends of the wafer jig 8. Guide trimming edges 653 are provided at the ends of the limiting grooves 652 on the two transfer lines 651. The guide trimming edges 653 are located on one side of the jig transfer member 100 and / or the jig box. When the clamping assembly 66 moves the wafer jig 8 onto the two transfer lines 651 of the jig transfer mechanism 65, the two ends of the wafer jig 8 are located within the limiting grooves 652 under the guidance of the guide trimming edges 653. Two transmission lines 651 drive the wafer jig 8 to move along the limiting slide 652 toward the positioning assembly 62 and the fastening assembly 63. The arrangement of the jig transfer mechanism 65 and the clamping assembly 66 improves the movement efficiency of the wafer jig 8. The arrangement of the limiting slide 652 and the guide tang 653 ensures that the wafer jig 8 does not shift during movement and assembly / disassembly, thereby improving the accuracy of assembly / disassembly.

[0093] The positioning component 62 is used to acquire the position and / or angle of fasteners (screws) on the wafer jig 8. The positioning component 62 may include a screw camera 621 and a light source. The screw camera 621 is used to capture the nut angle of the screws on the wafer jig 8, and the light source is used to provide supplementary lighting for the screw camera 621. The screw camera 621 is preferably a CCD camera. A first controller can control the operation of the screw camera 621 and the light source and acquire the image captured by the screw camera 621, thereby obtaining the nut angle of the screws on the wafer jig 8. When the wafer jig 8 moves to the designated position of the jig transfer mechanism 65, the second drive mechanism 64 drives the screw camera 621 of the positioning component 62 to capture the angle and position of the fasteners on the wafer jig 8. The light source is located directly below the screw camera 621 and provides supplementary lighting for the camera lens of the screw camera 621, ensuring the clarity of the image captured by the screw camera 621. This setup facilitates the acquisition of the position and angle of the screws on the wafer jig 8, thereby improving the accuracy of the fastening component 63's assembly and disassembly.

[0094] The fastening assembly 63 is used to tighten and loosen fasteners (such as screws) on the wafer jig 8. The fastening assembly 63 may include a mounting base 631 and a pneumatic screwdriver 632. The mounting base 631 can be fixed to the second drive mechanism 64, and the pneumatic screwdriver 632 can be fixed to the mounting base 631. The pneumatic screwdriver 632 is mounted on the second drive mechanism 64 via the mounting base 631. The pneumatic screwdriver 632 is used to tighten and loosen screws on the wafer jig 8 and can be controlled by a first controller. The second drive mechanism 64 drives the pneumatic screwdriver 632 to move along the X1, Y1, and Z1 axes, ensuring precise alignment of the pneumatic screwdriver 632 with the screws on the wafer jig 8, thereby ensuring effective tightening and loosening of the screws.

[0095] The positioning component 62 and the fastening component 63 are disposed on the second drive mechanism 64. The second drive mechanism 64 is used to drive the positioning component 62 and the fastening component 63 to move along the X1 axis, Y1 axis and Z1 axis to approach or move away from the wafer jig 8 on the jig transfer mechanism 65. The X1 axis, Y1 axis and Z1 axis are perpendicular to each other.

[0096] Specifically, after the target wafer in the wafer jig 8 has completed the aging test, the wafer jig 8 carrying the target wafer moves along the two transmission lines 651 of the jig transfer mechanism 65 to one side of the positioning component 62 and the fastening component 63. The limiting grooves 652 of the two transmission lines 651 limit and support both ends of the wafer jig 8. The second drive mechanism 64 drives the screw camera 621 of the positioning component 62 along the X1, Y1 and Z1 axes to photograph the screws on the wafer jig 8, thereby obtaining the position and / or angle of the screws on the surface of the wafer jig 8. The light source of the positioning component 62 provides supplementary lighting for the screw camera 621 to ensure the clarity of the image. Based on the screw angle and position information acquired by the positioning component 62, the drive structure drives the fastening component 63 to move along the X1, Y1, and Z1 axes, positioning the pneumatic screwdriver 632 above the screw. The rotation angle of the pneumatic screwdriver 632's bit 001 matches the screw angle. Then, the second drive mechanism 64 drives the pneumatic screwdriver 632 downward, aligning the bit 001 with the screw nut for rotation and disassembly. After each screw is disassembled, the bit 001 of the pneumatic screwdriver 632 resets and adjusts according to the angle of the next screw, ensuring precise alignment between the bit 001 and the nut, effectively preventing screw wear caused by inconsistent angles between the bit 001 and the nut. After the screws are removed in sequence, the clamping receiving mechanism 7 receives and positions the lower clamp 82 of the wafer chuck 8 and controls the lower clamp 82 of the wafer chuck 8 to separate from the upper clamp 81 of the wafer chuck 8. The tested wafer is then unloaded (removed) by a robotic arm or a wafer loading device (e.g., when there is no wafer positioning mechanism, the wafer transfer mechanism 2 can be used to remove the wafer; when there is a wafer positioning mechanism, the wafer can be removed by the wafer positioning mechanism or the wafer transfer mechanism 2). Conversely, the target wafer can be loaded onto the lower clamp 82 of the wafer chuck 8, and then the clamping receiving mechanism 7 controls the lower clamp 82 to rise and engage with the upper clamp 81. Through the cooperation of the positioning component 62 and the fastening component 63, multiple screws are tightened onto the wafer chuck 8, thus achieving the clamping of the target wafer by the wafer chuck 8.

[0097] In the above structure, by setting the fixture conveying mechanism 65 and the clamping component 66 together, the removal efficiency and conveying stability of the wafer fixture 8 are improved. Furthermore, by setting the second driving mechanism 64, the positioning component 62 and the fastening component 63 together, the automatic disassembly and installation of the wafer fixture 8 are realized, which not only improves the disassembly and installation efficiency, but also improves the disassembly accuracy and ensures the disassembly and installation quality of the wafer fixture 8.

[0098] Reference Figure 8In a preferred embodiment, the clamping assembly 66 is used to clamp the wafer jig 8 and transfer the wafer jig 8 to the jig transfer mechanism 65. The second drive mechanism 64 drives the clamping assembly 66 to one side of the jig loading mechanism. The gripper cylinder 661 of the clamping assembly 66 drives two clamping plates 662 to clamp the wafer jig 8. Then, the second drive mechanism 64 drives the clamping assembly 66 to lift the wafer jig 8 onto the jig transfer mechanism 65. Before being transferred, the wafer jig 8 can be located in the wafer jig 8 storage mechanism 5. When the wafer jig 8 reaches the designated position, the gripper cylinder 661 of the clamping assembly 66 drives the two clamping plates 662 to release the wafer jig 8. This arrangement improves the removal efficiency of the wafer jig 8 and ensures the stability of the wafer jig 8 during removal.

[0099] Reference Figure 8 In a preferred embodiment, the clamping and disassembly device 6 further includes a first bracket (not shown). The clamping assembly 66, positioning assembly 62, and fastening assembly 63 are mounted on the first bracket and, via the first bracket, on the second drive mechanism 64. The clamping assembly 66, positioning assembly 62, and fastening assembly 63 are sequentially mounted on the first bracket from left to right, and the first bracket is mounted on the second drive mechanism 64. This arrangement not only improves the stability of the installation of the clamping assembly 66, positioning assembly 62, and fastening assembly 63, but also improves the compactness of the installation and the efficiency of movement.

[0100] Reference Figure 8 In a preferred embodiment, the clamping assembly 66 includes a gripper cylinder 661 and two clamping plates 662. The gripper cylinder 661 drives the two clamping plates 662 to clamp and release the wafer jig 8. A second drive mechanism 64 drives the clamping assembly 66 to move to one side of the wafer jig 8. The gripper cylinder 661 drives the two clamping plates 662 to move relative to each other to clamp the wafer jig 8. When the second drive mechanism 64 drives the clamping assembly 66 to move the wafer jig 8 to a designated position on the jig transfer mechanism 65, the gripper cylinder 661 drives the two clamping plates 662 to move in the opposite direction to release the wafer jig 8. This arrangement facilitates clamping the wafer jig 8 and improves clamping stability.

[0101] Reference Figure 8In a preferred embodiment, the second drive mechanism 64 includes a first drive assembly 641, a second drive assembly 642, and a third drive assembly 643. The first drive assembly 641 drives the clamping assembly 66, the positioning assembly 62, and the fastening assembly 63 to move along the X1 axis. The second drive assembly 642 is disposed on the first drive assembly 641 and drives the clamping assembly 66, the positioning assembly 62, and the fastening assembly 63 to move along the Y1 axis. The third drive assembly 643 is disposed on the second drive assembly 642, and the clamping assembly 66, the positioning assembly 62, and the fastening assembly 63 are disposed on the third drive assembly 643. Specifically, a first bracket is disposed on the third drive assembly 643, and the clamping assembly 66, the positioning assembly 62, and the fastening assembly 63 are disposed on the third drive assembly 643 via the first bracket. The third drive assembly 643 drives the clamping assembly 66, the positioning assembly 62, and the fastening assembly 63 to move along the Z1 axis. This configuration improves the movement efficiency of the clamping assembly 66, positioning assembly 62, and fastening assembly 63 in the X1, Y1, and Z1 axis directions, while ensuring the accuracy of the movement of the three components.

[0102] Reference Figure 8 In a preferred embodiment, the first drive assembly 641 and the second drive assembly 642 are each a first linear module. The third drive assembly 643 includes a first lifting cylinder and may also include a second bracket (not shown). The first lifting cylinder is mounted on the second drive assembly 642 via the second bracket. The clamping assembly 66, the positioning assembly 62, and the fastening assembly 63 are mounted on the first lifting cylinder via the first bracket. The first drive assembly 641 and the second drive assembly 642 are each a first linear module, which further improves the accuracy of movement. The second bracket is mounted on the second drive assembly 642, and the first lifting cylinder is mounted on the second bracket. The first bracket is slidably mounted on the second bracket along the Z1 axis. The first lifting cylinder drives the first bracket to move the clamping assembly 66, the positioning assembly 62, and the fastening assembly 63 along the Z1 axis. The second bracket improves the stability of the first lifting cylinder and the first bracket installation. The first lifting cylinder facilitates driving the first bracket to move the clamping assembly 66, the positioning assembly 62, and the fastening assembly 63 in lifting motion.

[0103] Reference Figure 8 In a preferred embodiment, the fixture assembly / disassembly device 6 further includes a barcode scanner (not shown), which is mounted on a second drive mechanism 64. The second drive mechanism 64 drives the barcode scanner to move along the Y1 axis, and the barcode scanner is used to scan and record the barcode on the wafer fixture 8. When the wafer fixture 8 moves to the designated position of the fixture transfer mechanism 65, the second drive mechanism 64 drives the barcode scanner to move along the Y1 axis to scan and record the barcode or QR code on the wafer fixture 8. This arrangement facilitates the recording of fixture information and subsequent traceability.

[0104] Reference Figure 8 In a preferred embodiment, the pneumatic screwdriver 632 adjusts the screwdriver bit 001 based on the screw rotation angle acquired by the screw camera 621. After the screwdriver bit 001 of the pneumatic screwdriver 632 is precisely aligned with the screw, the screw is tightened or loosened. As the screw moves downward or upward, the retractable screwdriver bit 001 abuts against the screw as it moves up and down. This configuration further improves the fastener assembly and disassembly efficiency.

[0105] Reference Figure 8 In a preferred embodiment, the fastening assembly 63 of the clamping and disassembly device 6 further includes a displacement detector (not shown), which faces the bit 001 and is used to detect the movement height of the bit 001 of the pneumatic screwdriver 632. This displacement detector can detect the descent height of the bit 001 of the pneumatic screwdriver 632, and analyze whether the bit 001 is properly installed by analyzing the descent height, thereby ensuring accurate alignment between the bit 001 of the pneumatic screwdriver 632 and the screw.

[0106] Reference Figure 8 In a preferred embodiment, the pneumatic screwdriver 632 has a cavity at the end of the bit 001 that is adapted to the fastener. An air extraction pipe 002 is provided on the bit 001, with its air inlet connected to the cavity at the end of the bit 001. The air extraction pipe 002 is used to extract air when the bit 001 of the pneumatic screwdriver 632 is fitted onto the fastener, thereby adsorbing the fastener and preventing it from falling off. The air extraction pipe 002 is connected to the bit 001 of the pneumatic screwdriver 632. As the bit 001 is lowered onto the fastener, the air extraction pipe 002 continuously extracts air. The control system determines whether the bit 001 is accurately abutting the surface of the fastener based on the air pressure extracted. After the fastener is removed, the air extraction pipe 002 can adsorb the fastener onto the bit 001 of the pneumatic screwdriver 632, preventing it from falling off. This design not only ensures accurate alignment between the pneumatic screwdriver 632 and the fastener but also achieves the adsorption of the fastener.

[0107] Reference Figure 8 and Figure 9In a preferred embodiment, the fixture assembly / disassembly device 6 further includes a fixture receiving mechanism 7. The fixture receiving mechanism 7 includes a fourth drive assembly 72 and a positioning stage 71 that move along the Z1 axis. The fourth drive assembly 72 drives the positioning stage 71 to move up and down along the Z1 axis to control the movement of the lower fixture 82. The fourth drive assembly 72 drives the positioning stage 71 to move upward, so that the top of the positioning stage 71 abuts against the bottom of the lower fixture 82. After the fasteners on the wafer fixture 8 are removed, the lower fixture 82 is located on the positioning stage 71. The fourth drive assembly 72 drives the positioning stage 71 to move the lower fixture 82 downward, so that the lower fixture 82 disengages from the upper fixture 81. This setup enables the separation of the wafer fixture 8, facilitating the removal or unloading of the tested wafer from the lower fixture 82 by a robotic arm or wafer loading device (e.g., when there is no wafer positioning mechanism, the wafer can be removed by the wafer transfer mechanism 2; when there is a wafer positioning mechanism, the wafer can be removed by either the wafer positioning mechanism or the wafer transfer mechanism 2).

[0108] Reference Figure 8 In a preferred embodiment, the fourth drive component 72 of the fixture assembly / disassembly device 6 is a second linear module or a second lifting cylinder, and the positioning table 71 is provided with a positioning groove for positioning the lower half of the wafer fixture 8 (i.e., the lower fixture 82). The positioning groove facilitates the positioning of the lower half of the wafer fixture 8, ensuring that the lower half of the fixture will not shift or fall off during the up-and-down movement of the positioning table 71 driven by the fourth drive component 72.

[0109] Reference Figures 8-9 In a preferred embodiment, the clamp receiving mechanism 7 may further include a second lifting member 73 disposed at the bottom end of the upper clamp 81. The second lifting member 73 is used to drive the clamp support frame 101 or the upper clamp 81 to rise or fall. This arrangement enables the lifting and lowering movement of the clamp support frame 101 or the upper clamp 81, facilitating the separation of the upper clamp 81 and the lower clamp 82.

[0110] Reference Figures 10-12 In a preferred embodiment, the wafer aging test apparatus 9 includes a test component 91 and a heating component 92.

[0111] The test assembly 91 includes an adapter board assembly 911, at least one probe assembly 912, and several test boards 913.

[0112] The adapter plate assembly 911 is mounted on the support base 98, and the adapter plate assembly 911 has several electrical connection positions.

[0113] At least one probe group 912 has a plurality of probes that contact the PCB board of the wafer jig 8, and at least one probe group 912 is connected to the same adapter board group 911.

[0114] Each test board 913 is independently mounted on each electrical connection point, and at least one test board 913 is electrically connected to the same probe group 912 via an adapter board group 911.

[0115] It is worth noting that the number of probe groups 912 is less than the number of test boards 913, for example... Figure 10 As shown, there are two probe groups 912 and eight test boards 913. Every four test boards 913 correspond to one probe group 912. Multiple probe groups 912 are connected to several test boards 913 through the same adapter board group 911. This avoids the need to separately arrange adapter boards and test boards 913 on the left and right sides of the wafer fixture 8, resulting in a more optimized structural layout and a significant reduction in equipment footprint. Furthermore, each test board 913 is installed independently, allowing for individual installation and removal, which facilitates installation and replacement.

[0116] In a preferred embodiment, the adapter board assembly 911 includes at least one adapter board and at least one connector, wherein the at least one connector is electrically connected to the same probe assembly 912 via the at least one adapter board, and the connector forms an electrical connection point.

[0117] Specifically, the wafer fixture 8 generally includes an upper fixture 81 and a lower fixture 82. The lower fixture 82 has a cavity for placing the wafer under test. The upper fixture 81 includes a PCB board and probes. The PCB board is electrically connected to the probes, and the probes are used to connect with the wafer under test placed in the lower fixture 82. The probe group 912 can be connected to the contacts on the upper or lower surface of the PCB board. The adapter board group 911 can have one, two, or more adapter boards.

[0118] The adapter board assembly 911 has only one adapter board: Reference Figure 10 Contacts are set on the upper surface of the PCB board, and probe group 912 is located above wafer fixture 8. Two probe groups 912 are connected to the same adapter board above, and multiple connectors are set on the adapter board. Alternatively, contacts can be set on the lower surface of the PCB board, and two probe groups 912 are located below the contacts on both sides of the PCB. The bottom ends of the two probe groups 912 are connected to the upper surface of the adapter board, and multiple connectors are set on the lower surface of the adapter board to connect to the test board 913.

[0119] In one example, the electrical connector uses a plug-in method (such as a male-female interface), and several test boards 913 are ultimately plugged into the adapter board assembly 911 through the test interface 914 of the electrical connection position. The connector can also be configured in other forms, such as connecting to the horizontally placed test board 913 via probes, or using an L-shaped connector to adjust the vertical installation to a horizontal installation, or an angled installation at any angle to the horizontal. When the probe assembly 912 is positioned above the wafer fixture 8, the connection between the probe assembly 912 and the wafer fixture 8 is achieved by driving the wafer fixture 8 to rise.

[0120] Adapter board assembly 911 is equipped with two adapter boards, defined as upper adapter board and lower adapter board: Reference Figure 11 The PCB board has contacts on its upper surface, and probe groups 912 are located above the fixture. Two probe groups 912 are respectively connected to two lower adapter boards above (the two lower adapter boards can also be integrated). The two lower adapter boards are then electrically connected to the same upper adapter board. Multiple connectors are located above the upper adapter board. Additionally, such as... Figure 12 Alternatively, contacts can be set on the lower surface of the PCB board, with two probe groups 912 located below the contacts on both sides of the PCB board. The bottom ends of the two probe groups 912 are connected to the upper surfaces of the two lower adapter boards, respectively. Multiple connectors are set on the lower surface of the upper adapter board to connect with the lower adapter board. Of course, the aforementioned upper adapter board for mounting connectors can be set on the lower side of the lower adapter board, which can be set according to requirements and will not be elaborated on here.

[0121] In one example, the electrical connector uses a plug-in method (such as a male-female interface), and several test boards 913 are ultimately plugged into the adapter board assembly 911 through the test interface 914 of the electrical connection position. The connector can also be configured in other forms, such as connecting to the horizontally placed test board 913 via probes, or using an L-shaped connector to adjust the vertical installation to a horizontal installation, or an angled installation at any angle to the horizontal. When the probe assembly 912 is positioned below the wafer fixture 8, the connection between the probe assembly 912 and the wafer fixture 8 is achieved by driving the wafer fixture 8 to descend.

[0122] In a preferred embodiment, the test assembly 91 further includes a limiting assembly, which includes a fixing plate 93 and a limiting frame 94. The fixing plate 93 is disposed on the upper surface of the adapter plate assembly 911. The fixing plate 93 is provided with clearance grooves for the test interface 914 to pass through. There can be multiple clearance grooves, each corresponding to a test interface 914. The fixing plate 93 can reinforce the test interface 914 and improve its stability. The limiting frame 94 is disposed on the fixing plate 93 and can be vertically installed on the fixing plate 93 with bolts for easy disassembly. The limiting frame 94 is provided with a sliding groove for the test plate 913 to pass through vertically. The sliding groove matches the shape of the test plate 913 and is used to limit and support the test plate 913. Figure 10 As shown, the slide is opened vertically, and the test board 913 is inserted into the test interface 914 along the slide downward. This can guide the test board 913 during installation, improve the accuracy of the test board 913 during installation, and improve the stability of the test board 913 after installation.

[0123] In a preferred embodiment, the test assembly 91 further includes a first mounting member 915, which is disposed on the support base 98. The adapter plate assembly 911 is disposed on the first mounting member 915. A first limiting part 916 is provided on the lower surface of the first mounting member 915. A second limiting part 917 is provided on the top of the wafer jig 8 for adapting to the first limiting part 916 and for limiting the wafer jig 8.

[0124] Specifically, the first mounting component 915 is mounted on the support base 98, and the adapter plate assembly 911 is mounted on the first mounting component 915 so that it can be detachably mounted on the support base 98 via the first mounting component 915. The first mounting component 915 and the support base 98 are fixed together by a connector. Specifically, the connector can be fixed by bolts, mechanical clips, etc., for easy disassembly.

[0125] Reference Figure 10 This embodiment provides a wafer aging test device 9, with an adapter board assembly 911 consisting of only one adapter board, including: a support base 98, a test component 91, and a wafer fixture 8.

[0126] The test assembly 91 includes an adapter board assembly 911, at least one probe assembly 912, and several test boards 913. The adapter board assembly 911 is mounted on a support base 98, and a certain accommodating space is formed below the adapter board assembly 911. Several test interfaces 914 are provided on the upper surface of the adapter board assembly 911. Each test board 913 is mounted on the upper surface of the adapter board assembly 911 and connected to one test interface 914. The probe assembly 912 is mounted on the lower surface of the adapter board assembly 911. The test boards 913 are electrically connected to the probe assembly 912 through the adapter board assembly 911. Several test boards 913 are vertically inserted and mounted on the adapter board assembly 911 through the test interfaces 914.

[0127] The wafer fixture 8 is vertically and vertically positioned below the adapter board assembly 911 for placing the wafer to be tested. The wafer fixture 8 is provided with a PCB board for electrical connection with the pads of the wafer to be tested. The probe assembly 912 is used to electrically connect the PCB board of the wafer fixture 8 when the wafer fixture 8 is close to the adapter board assembly 911, so that the test board 913 can perform power-on testing on the wafer.

[0128] This embodiment provides a wafer aging test device 9. By placing the test component 91 above the wafer fixture 8, that is, the entire test component 91 is located at the top of the test device, when repairing the test component 91, there is no need to disassemble other components. Furthermore, the vertically stacked test boards 913 are arranged horizontally and inserted into the adapter board group 911, allowing any test board 913 to be freely inserted and removed for repair, which facilitates the disassembly and maintenance of the test boards 913.

[0129] In a preferred embodiment, a first mounting member 915 is also included. The first mounting member 915 is disposed on the support base 98. The adapter plate assembly 911 is mounted on the first mounting member 915 so that it can be detachably disposed on the support base 98 via the first mounting member 915. The first mounting member 915 and the support base 98 are fixed together by a connector. Specifically, the connector can be fixed by bolts, mechanical buckles, or other means to facilitate disassembly.

[0130] In a preferred embodiment, the wafer aging test apparatus 9 provided in this embodiment further includes a limiting component, which includes a fixing plate 93 and a limiting frame 94.

[0131] A fixing plate 93 is disposed on the upper surface of the adapter plate assembly 911. The fixing plate 93 has clearance grooves for the test interface 914 to pass through. Multiple clearance grooves are provided, each corresponding to a test interface 914. The fixing plate 93 reinforces the test interface 914, improving its stability. A limiting bracket 94 is disposed on the fixing plate 93. The limiting bracket 94 can be vertically installed on the fixing plate 93 with bolts for easy disassembly. The limiting bracket 94 has a sliding groove for the test plate 913 to pass through vertically. The sliding groove matches the shape of the test plate 913, limiting and supporting the test plate 913. It guides the test plate 913 during installation, improving the accuracy of installation and enhancing its stability after installation.

[0132] In a preferred embodiment, the wafer aging test apparatus 9 provided in this embodiment further includes a heating component 92. The heating component 92 heats the bottom of the lower clamp 82 in the wafer fixture 8, and then heats the wafer inside the wafer fixture 8 through heat conduction, thereby testing its aging performance. The heating component 92 includes: a second mounting component 923, an aging heating mechanism 921, and a first lifting component 922. The first lifting component 922 can be a component with telescopic function, such as a hydraulic cylinder or an electric telescopic rod.

[0133] The second mounting member 923 is disposed below the wafer jig 8. The aging heating mechanism 921 is disposed on the second mounting member 923. A first lifting member 922 drives the second mounting member 923 to move up and down, so that the aging heating mechanism 921 contacts the wafer jig 8 and brings the wafer jig 8 closer to the adapter plate assembly 911. Two first lifting members 922 can be provided. The second mounting member 923 has horizontal sections on its left and right sides, with one first lifting member 922 disposed below each horizontal section. The aging heating mechanism 921 is disposed in the recess between the two horizontal sections. Driven by the first lifting members 922, the second mounting member 923 first moves upward so that the horizontal section abuts against the lower surface of the wafer jig 8, and then moves upward together with the wafer jig 8, so that several contacts on the upper surface of the wafer jig 8 are electrically connected to several probes of the probe assembly 912. In other embodiments, if space permits, there may be only one first lifting member 922, disposed below the second mounting member 923 to drive the second mounting member 923 to move up and down.

[0134] In a preferred embodiment, the aging heating mechanism 921 is provided with a first inlet / outlet gas interface, and the wafer jig 8 is provided with a second inlet / outlet gas interface. When the aging heating mechanism 921 contacts the wafer jig 8, the first inlet / outlet gas interface and the second inlet / outlet gas interface are connected to evacuate or fill the wafer jig 8. After evacuating the wafer jig 8, an inert gas, such as nitrogen, can be filled into the wafer jig 8.

[0135] In a preferred embodiment, a first limiting part 916 is provided on the lower surface of the first mounting member 915, and a second limiting part 917 is provided on the top of the wafer jig 8 to adapt to the first limiting part 916 and limit the rising height of the wafer jig 8. Specifically, the first limiting part 916 can be a post, and the second limiting part 917 can be a groove, or the first limiting part 916 can be a groove, and the second limiting part 917 can be a post. When the first limiting part 916 and the second limiting part 917 are engaged, it indicates that the probe group 912 is aligned with several contact points on the upper surface of the wafer jig 8. The first limiting part 916 and the second limiting part 917 cooperate with each other to prevent the wafer jig 8 from being over-connected to the probe group 912 in the test assembly 91, thus protecting the probe group 912 from breakage or damage to the PCB board.

[0136] In a preferred embodiment, the wafer jig 8 is mounted on a support base 98, and the support base 98 is provided with a rolling element 95 for rolling support of the wafer jig 8. When the wafer jig 8 is loaded or unloaded, the rolling element 95 provides rolling support to the wafer jig 8 by pulling out or pushing it onto the support base 98, which facilitates loading or unloading the wafer jig 8. When the rolling element 95 supports the wafer jig 8, the bottom of the wafer jig 8 is higher than the top of the aging heating mechanism 921.

[0137] The support base 98 includes two support platforms spaced apart from each other. Each support platform has an inner step facing the other support platform. The support platforms are generally L-shaped. The adapter plate assembly 911 is disposed on top of the two support platforms. The rolling element 95 is disposed on the step surface of the inner step. The wafer clamp 8 is located between the inner steps of the two support platforms and can limit the movement of the wafer clamp 8. The above structure facilitates the arrangement of the adapter plate assembly 911, the wafer clamp 8, and the heating assembly 92, and has a high space utilization rate.

[0138] In a preferred embodiment, the wafer aging test apparatus 9 provided in this embodiment further includes: a base 96, and a support base 98 disposed on the base 96. The base 96 is used to provide a support platform for the testing work.

[0139] Reference Figure 11 This embodiment provides a wafer aging test device 9 and Figure 10 The wafer aging test apparatus 9 in the embodiment is basically the same as that in the example. Figure 10 The difference between the wafer aging test apparatus 9 in the embodiment is: The adapter board assembly 911 includes two adapter boards, and the two adapter boards are electrically connected to each other through probes / plugs or other means.

[0140] The first limiting part 916 is provided on the lower surface of the first mounting member 915.

[0141] Apart from the structure described above, all other structures in the wafer aging test apparatus 9 of this embodiment are the same as those described above. Figure 10 The wafer aging test device 9 is the same, so it will not be described in detail again.

[0142] The wafer aging test device 9 provided in this embodiment is compared to... Figure 10 The wafer aging test device 9 is suitable for different workspaces.

[0143] Reference Figure 12 This embodiment provides a wafer aging test device 9 and Figure 10 The wafer aging test apparatus 9 in the embodiment is basically the same as that in the example. Figure 10 The difference between the wafer aging test apparatus 9 in the embodiment is: The adapter board assembly 911 includes two adapter boards, and the two adapter boards are electrically connected to each other through probes / plugs or the like. One of the adapter boards is set on the inner step of the support stage and is located below the wafer fixture 8.

[0144] The probe group 912 is located on the adapter plate below the wafer fixture 8.

[0145] The aging heating mechanism 921 is mounted on the base 96, but is not present in this embodiment. Figure 10 In the second mounting member 923 of the wafer aging test apparatus 9 in the embodiment, at least two elastic pillars are provided on the support base 98 along the entry direction of the wafer jig 8, and an L-shaped support platform is installed on the at least two elastic pillars. The rolling element 95 is installed on the L-shaped support platform, and the two sides of the wafer jig 8 are supported by the L-shaped support platform. When the rolling element 95 supports the wafer jig 8, the bottom of the wafer jig 8 is higher than the highest point of the probe group 912 and the first limiting part 916.

[0146] The first mounting component 915 is a hollow structure with a lower opening and a cavity. The wafer jig 8 is located at the lower opening of the first mounting component 915 and can limit the wafer jig 8. A pusher 97 is provided in the cavity of the first mounting component 915. The pusher 97 is installed on the upper surface of the inner wall of the cavity. By pressing down the pusher 97, the wafer jig 8 can be coupled downward to the probe group 912.

[0147] The pusher 97 is positioned above the wafer fixture 8. The pusher 97 can be a component with telescopic function, such as a hydraulic cylinder or an electric telescopic rod.

[0148] The pusher 97 is used to push the wafer jig 8 downward so that the contacts of the PCB board on the wafer jig 8 are coupled with the probe group 912. At the same time, it makes the bottom of the wafer jig 8 contact the aging heating mechanism 921. Specifically, it makes the bottom of the lower jig 82 of the wafer jig 8 contact the aging heating mechanism 921, thereby heating the wafer inside the wafer jig 8.

[0149] Apart from the structure described above, all other structures in the wafer aging test apparatus 9 of this embodiment are the same as those described above. Figure 10 The wafer aging test device 9 is the same, so it will not be described in detail again.

[0150] The wafer aging test device 9 provided in this embodiment couples the PCB board of the wafer fixture 8 with the probe group 912 by pressing down, and is applicable to the wafer fixture 8 when the PCB board is located on the lower surface of the upper fixture 81.

[0151] This embodiment also provides a testing method for a wafer testing system, which uses the above-mentioned wafer testing system and includes the following steps: S1-S5.

[0152] S1: Control the wafer loading device to adjust the position of the wafer and transfer it to the wafer unloading device, control the wafer unloading device to install the adjusted wafer in the wafer fixture 8 and output the wafer fixture 8 carrying the wafer; S2: Control the wafer aging test device 9 to receive the wafer fixture 8 and perform aging tests on the wafers in the wafer fixture 8.

[0153] As a preferred embodiment, the testing method of the wafer testing system also includes: S4: Control the wafer aging test device 9 to transfer the wafer fixture 8 carrying the wafer to the wafer unloading device; S5: Control the wafer unloading device to remove the wafer from the wafer fixture 8.

[0154] This testing method enables automated wafer mounting and inspection, which not only improves the efficiency of wafer mounting and inspection but also enhances the accuracy of wafer inspection.

[0155] It should be noted that the first and second controllers can be any applicable computing device, such as a personal computer, server, programmable logic controller (PLC), microcontroller, etc., or an integration of computer devices. The first and second controllers have functions such as receiving information and sending control commands. They can control connected components to perform corresponding actions via wired or wireless communication to complete the wafer loading and unloading. The first and second controllers can be set up independently or combined into a single control module, which then uniformly executes the corresponding functions of both controllers.

[0156] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the invention without departing from the principles and spirit of the invention, and all such changes should fall within the protection scope of the claims of the present invention.

Claims

1. A wafer testing system, characterized in that, include: The wafer loading and unloading equipment includes a wafer loading device and a wafer unloading device. The wafer loading device is used to transfer and adjust the position of the wafer. The wafer unloading device is used to install the position-adjusted wafer in the wafer fixture (8) and output the wafer fixture (8) carrying the wafer. The wafer aging test device (9) is used to receive the wafer jig (8) carrying the wafer on the wafer loading and unloading equipment and to perform aging tests on the wafer in the wafer jig (8).

2. The wafer testing system as described in claim 1, characterized in that, The wafer loading device includes: A wafer storage mechanism (1) is used to store wafers; A wafer transfer mechanism (2) is used to acquire and transfer target wafers from the wafer storage mechanism (1), the target wafers including wafers to be aged and / or tested wafers.

3. The wafer testing system as described in claim 2, characterized in that, The wafer loading device further includes: The wafer positioning mechanism is used to receive the wafer to be aged transferred by the wafer transfer mechanism (2) and adjust the position of the wafer to be aged, and transfer the wafer after position adjustment to the lower fixture of the wafer jig (8); or transfer the tested wafer from the lower fixture to the wafer transfer mechanism (2).

4. The wafer testing system as described in claim 3, characterized in that, The wafer positioning mechanism includes a wafer pre-alignment mechanism (3) and / or a wafer fine alignment device (4); The wafer pre-alignment mechanism (3) is used to receive the wafer transferred by the wafer transfer mechanism (2) and pre-align the wafer, or to receive the tested wafer; The wafer alignment device (4) is used to receive the wafer to be aged transferred by the wafer transfer mechanism (2) or to obtain the pre-aligned wafer to be aged, to perform precise positioning of the test position of the wafer and the probe position of the wafer fixture (8), and then to transfer the wafer that has completed the precise alignment to the lower fixture. Alternatively, it can be used to transfer a tested wafer in the lower fixture to the wafer pre-alignment mechanism (3).

5. The wafer testing system as described in claim 4, characterized in that, The wafer alignment device (4) includes: Alignment component (42) is used to obtain alignment information between the test position of the wafer and the probe position of the wafer fixture (8); A wafer adjustment assembly is used to adjust the angle of the wafer according to the alignment information so that the test position corresponds to the probe position. Translation component (44) is used to adjust the position of the wafer in the first plane, and the wafer adjustment component is disposed on the translation component (44).

6. The wafer testing system as described in claim 5, characterized in that, The wafer adjustment assembly includes a fixing component (41) and an angle adjustment component (43), wherein the fixing component (41) includes: Mounting bracket (411), wherein the mounting bracket (411) is provided with a vertically penetrating mounting groove; A ring frame (412) is rotatably disposed within the mounting groove; A plurality of adsorption elements (413) are spaced apart on the annular frame (412) for adsorbing and fixing the wafer on the annular frame (412); the angle adjustment component (43) adjusts the angle of the annular frame (412) according to the alignment information.

7. The wafer testing system as described in claim 5, characterized in that, The alignment component (42) includes: A wafer camera (421) is disposed above the mounting bracket (411) and is used to acquire test position information on the wafer; The probe camera (422) moves to a position below the probe of the wafer jig (8) to obtain the probe position information of the wafer jig (8).

8. The wafer testing system as described in claim 1, characterized in that, The wafer unloading device includes: A support structure (61) is used to acquire the wafer jig (8) and support the wafer jig (8); The fixture assembly / disassembly device (6) is used to assemble and disassemble the wafer fixture (8) to place the wafer to be aged into the wafer fixture (8) or to remove the tested wafer from the wafer fixture (8). The clamp receiving mechanism (7) is used to receive the lower clamp (82) and control the separation or combination of the lower clamp (82) and the upper clamp (81).

9. The wafer testing system as described in claim 8, characterized in that, The support structure (61) includes a clamp transfer element and / or a clamp support frame (101). The fixture conveyor is connected to the wafer aging test device (9), and the wafer fixture (8) is placed on the fixture conveyor for automatically conveying the wafer fixture (8) to the wafer aging test device (9). The fixture support frame (101) is mounted on the base and is used to support the wafer fixture (8) from the fixture transfer member and / or fixture box.

10. The wafer testing system according to claim 8, characterized in that, The clamp disassembly and assembly device (6) includes: Positioning component (62) is used to obtain the position of fasteners on wafer fixture (8); Fastening assembly (63) for tightening and loosening fasteners on wafer jig (8); The second drive mechanism (64) is used to drive the fastening assembly (63) closer to / away from the fastener.

11. The wafer testing system according to claim 10, characterized in that, The positioning component (62) includes a screw camera (621) mounted on the second drive mechanism (64), and the fastening component (63) includes a pneumatic screwdriver (632). The screw camera (621) captures the position and angle of the fastener. The pneumatic screwdriver (632) adjusts the screwdriver bit according to the angle of the fastener. The pneumatic screwdriver (632) tightens or loosens the fastener under the drive of the second drive mechanism (64).

12. The wafer testing system according to claim 8, characterized in that, The clamp receiving mechanism (7) includes: Positioning table (71) is used to receive the lower clamp (82); The fourth drive assembly (72) is provided on the positioning stage (71), and the fourth drive assembly (72) is used to drive the positioning stage (71) to rise and fall in order to control the separation or combination of the lower clamp (82) and the upper clamp (81).

13. The wafer testing system as described in claim 1, characterized in that, The wafer aging test apparatus (9) includes: Test component (91) for receiving wafer fixture (8) and testing the wafers in wafer fixture (8); The heating component (92) is positioned opposite to the lower clamp (82) of the wafer jig (8) and is used to heat the wafer to be aged in the wafer jig (8).

14. The wafer testing system as described in claim 13, characterized in that, The test component (91) includes: Support base (98) is used to support wafer fixture (8); The adapter board assembly (911) is provided with a plurality of electrical connection positions; The probe group (912) has multiple probes for contacting the PCB board of the wafer jig (8) and for connecting the adapter board group (911) and the wafer jig (8). Several test boards (913) are independently mounted on each electrical connection point, and at least one test board (913) is electrically connected to the same probe group (912) through the adapter board group (911).

15. The wafer testing system as described in claim 14, characterized in that, The adapter plate assembly (911) includes at least one adapter plate and at least one connector, the at least one connector being electrically connected to the same probe assembly (202) via at least one adapter plate, the connector forming an electrical connection point.

16. The wafer testing system as described in claim 14, characterized in that, The test assembly (91) further includes a first mounting component (915), which is disposed on the support base (98). The adapter plate assembly (911) is disposed on the first mounting component (915). A first limiting part (916) is provided on the lower surface of the first mounting component (915). A second limiting part (917) is provided on the top of the wafer fixture (8) for matching the first limiting part (916) and for limiting the wafer fixture (8).

17. The wafer testing system as described in claim 14, characterized in that, The heating assembly (92) includes: An aging heating mechanism (921) is disposed below the wafer fixture (8); The first lifting component (922) is used to drive the aging heating mechanism (921) or the wafer jig (8) to rise and fall, so that the aging heating mechanism (921) contacts the lower surface of the wafer jig (8) and brings the wafer jig (8) closer to the probe group (912).

18. A wafer testing system as described in claim 17, characterized in that, The heating assembly (92) includes a second mounting component (923), and an aging heating mechanism (921) is disposed on the second mounting component (923). The aging heating mechanism (921) and the wafer fixture (8) are driven to rise and fall by a first lifting component (922).

19. A wafer testing system as described in claim 17, characterized in that, The aging heating mechanism (921) is provided with a first inlet / outlet gas interface, and the wafer fixture (8) is provided with a second inlet / outlet gas interface. When the aging heating mechanism (921) contacts the wafer fixture (8), the first inlet / outlet gas interface and the second inlet / outlet gas interface are connected to evacuate or fill the wafer fixture (8).

20. A testing method for a wafer testing system, employing the wafer testing system according to any one of claims 1-19, characterized in that, Includes the following steps: S1: Control the wafer loading device to adjust the position of the wafer and transfer it to the wafer unloading device, control the wafer unloading device to install the adjusted wafer in the wafer fixture (8) and output the wafer fixture (8) carrying the wafer; S2: Control the wafer aging test device (9) to receive the wafer fixture (8) and perform aging tests on the wafer in the wafer fixture (8); S3: Control the wafer aging test device (9) to transfer the wafer fixture (8) carrying the wafer to the wafer unloading device; S4: Control the wafer unloading device to remove the wafer from the wafer fixture (8).

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