A semiconductor chip automatic test system and method

Abstract

The application discloses a kind of semiconductor chip automatic test system and method, it is related to chip detection technical field, including: pedestal, rotatably arranged with rotating seat on it;Multiple connecting seats are distributed along the circumference of the rotating seat at intervals, the connecting seat is fixed on the rotating seat, and each connecting seat is mounted with an adsorption assembly;Multiple temperature control components are arranged on the pedestal and correspond to the adsorption assembly;Feeding and discharging assembly is arranged on the pedestal, and is configured to provide chips to the adsorption assembly or remove the chips from the adsorption assembly, the present application is arranged with multiple connecting seats distributed along the circumference at intervals on rotating seat, and the adsorption assembly is mounted on each connecting seat, while multiple temperature control components corresponding to the adsorption assembly are arranged on the pedestal, to realize simultaneous testing of multiple regions and multiple temperature fields.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, and more specifically to an automated testing system and method for semiconductor chips. Background Technology

[0002] Semiconductor chips undergo rigorous electrical performance testing before leaving the factory to ensure they meet design specifications under various operating temperatures. With continuous advancements in semiconductor manufacturing processes, chip integration and complexity are increasing, placing higher demands on the accuracy, efficiency, and reliability of testing. Especially in applications such as automotive-grade chips and industrial control chips, chips require electrical performance testing under extreme temperature conditions (e.g., -40°C to +150°C) to verify their operational stability in harsh environments.

[0003] Existing semiconductor chip testing systems typically employ a single-station testing approach, where chips are sequentially loaded, temperature-controlled, tested for electrical performance, and unloaded at a fixed testing station. This approach has several drawbacks: First, the single-station serial testing mode results in low testing efficiency, failing to meet the rapid testing requirements of high-volume products. Second, when the same chip needs to be tested multiple times under different temperature conditions, the temperature control device must complete heating or cooling before the next test can begin, leading to long temperature switching times and further reducing testing efficiency. Third, during testing, the chip is usually constantly held in place by a suction cup, with the top surface of the chip obscured. This prevents the temperature-controlled gas from acting evenly on both the top and bottom surfaces of the chip, resulting in poor temperature control on the top surface and affecting the accuracy and consistency of test results. Fourth, the contact pressure between the chip and the testing socket is uncontrollable, easily leading to poor contact or chip displacement during testing, resulting in unreliable test results.

[0004] Therefore, it is necessary to provide an automated testing system and method for semiconductor chips to solve the above problems. Summary of the Invention

[0005] To address the aforementioned problems, the present invention provides the following technical solution: an automated semiconductor chip testing system, comprising: a base on which a rotating platform is rotatably mounted; a plurality of connecting seats spaced apart circumferentially along the rotating platform, the connecting seats being fixed to the rotating platform, and each of the connecting seats having an adsorption component mounted thereon; a plurality of temperature control components disposed on the base and corresponding to the adsorption components; and a loading / unloading component disposed on the base and configured to provide chips to the adsorption components or remove chips from the adsorption components.

[0006] Preferably, the adsorption assembly includes: an attachment plate fixed to the connecting seat; a telescopic arm fixed to the attachment plate and having a telescopic end, wherein a suction cup assembly is fixed to the telescopic end; and an adsorber fixed to the attachment plate and configured to provide negative pressure to the suction cup assembly.

[0007] Preferably, the suction cup assembly includes: a suction cup body fixed to the telescopic end of the telescopic arm, the bottom of the suction cup body having a receiving groove for receiving a release disk; a sealing gasket fixed to the bottom of the suction cup body; a magnetic block embedded in the suction cup body and configured to magnetically attract the release disk; an adsorption chamber in the middle of the suction cup body, a plurality of first connecting holes between the adsorption chamber and the receiving groove, a plurality of second connecting holes corresponding to the first connecting holes on the release disk, and the bottom of the release disk being configured to attract the chip under negative pressure.

[0008] Preferably, the temperature control assembly includes: a temperature control chamber fixed to the base, the top of which has an opening corresponding to the release plate; a telescopic device fixed in the temperature control chamber, the telescopic device having a height adjustment end; a mounting plate fixed to the height adjustment end, the mounting plate being connected to a detection seat via an elastic element, the detection seat being configured to electrically connect to the chip for detection; and the temperature control chamber being configured to allow external temperature-controlled gas to be introduced for temperature control.

[0009] Preferably, the detection seat is configured to block the opening.

[0010] Preferably, the mounting plate is provided with two symmetrically distributed pressing arms, which are configured to press the chip onto the detection socket.

[0011] Preferably, the system also includes a positioning component, which comprises: a stop fixed to the rotating base, a slide connected to one side of the stop by a spring, the rotating base having a through guide groove, the slide passing through the guide groove and slidingly engaging with the guide groove; and a telescopic cylinder fixed to the base, the output end of the telescopic cylinder having a locking seat fixed thereon, the locking seat being groove-shaped and configured to accommodate the slide.

[0012] Preferably, the loading and unloading assembly includes: a position adjustment mechanism having an adjustment end; a first feeding arm and a second feeding arm, both fixed to the adjustment end.

[0013] This invention also provides an automated testing method for semiconductor chips, comprising the following steps: Step 1, providing the chip to the adsorption component via the loading and unloading assembly, so that the adsorption component adsorbs the chip; Step 2, rotating the rotating base to move the adsorption component to a position corresponding to the temperature control component; Step 3, driving the adsorption component toward the temperature control component, so that the chip enters the temperature control component; Step 4, performing temperature control and electrical performance testing on the chip via the temperature control component; Step 5, after testing, driving the adsorption component away from the temperature control component; Step 6, rotating the rotating base to move the adsorption component to the position of the loading and unloading assembly; and removing the chip from the adsorption component via the loading and unloading assembly.

[0014] Compared with the prior art, the present invention provides an automated testing system and method for semiconductor chips, which has the following advantages: First, this invention achieves simultaneous testing in multiple regions and multiple temperature fields by setting multiple connecting seats distributed circumferentially on the rotating base and installing adsorption components on each connecting seat, while setting multiple temperature control components corresponding to the adsorption components on the base. Furthermore, multiple adsorption components can simultaneously adsorb multiple chips, and the rotation of the rotating base sequentially sends each chip to different temperature control components for testing, which greatly improves the testing efficiency. Each temperature control component can be set with different temperature parameters, thereby realizing rapid switching testing of chips under different temperature fields.

[0015] Secondly, this invention utilizes the cooperation between the release plate and the magnetic block in the suction cup assembly. When the suction cup assembly is aligned with the opening of the temperature control chamber, the telescopic device drives the detection seat to move upward and contact the chip. At this time, the magnetic block is de-energized and releases the release plate, allowing the chip to detach from the suction cup body. Subsequently, the telescopic device resets and brings the chip into the temperature control chamber. In this way, the top of the chip is no longer blocked by the suction cup body, and the temperature control gas can act simultaneously from both the upper and lower surfaces of the chip, significantly improving the uniformity of temperature control and the accuracy of test results.

[0016] Third, by setting two symmetrically distributed pressing arms on the mounting plate, the present invention can stably press the chip onto the test socket, effectively preventing the chip from shifting or shaking during the test, ensuring a reliable electrical connection between the chip and the test socket, and avoiding test misjudgment caused by poor contact. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the main structure of an automated testing system for semiconductor chips. Figure 2 A three-dimensional structural diagram of an automated testing system for semiconductor chips; Figure 3This is a top view schematic diagram of an automated testing system for semiconductor chips. Figure 4 This is a three-dimensional structural diagram of the loading and unloading assembly in this invention; Figure 5 This is a three-dimensional structural diagram of the adsorption component in this invention; Figure 6 This is a three-dimensional structural diagram of the positioning component in this invention; Figure 7 This is a cross-sectional view of the temperature control component in this invention; Figure 8 This is a cross-sectional view of the suction cup assembly in this invention; In the diagram: 1. Base; 2. Rotary seat; 3. Connecting seat; 4. Adsorption assembly; 5. Temperature control assembly; 6. Loading and unloading assembly; 7. Positioning assembly; 8. Chip; 61. Position adjustment mechanism; 62. Adjustment end; 63. First feeding arm; 64. Second feeding arm; 21. Stop; 22. Slide seat; 41. Attachment plate; 42. Adsorber; 43. Telescopic arm; 44. Suction cup assembly; 71. Telescopic cylinder; 72. Locking seat; 441. Suction cup body; 442. Adsorption chamber; 443. Release plate; 444. First connecting hole; 445. Magnetic block; 446. Sealing gasket; 447. Second connecting hole; 51. Temperature control chamber; 52. Telescopic device; 53. Mounting plate; 54. Pressing arm; 55. Elastic element; 56. Detection seat. Detailed Implementation

[0018] In the embodiments of the present invention, please refer to Figures 1-8 An automated testing system for semiconductor chips is provided, comprising: a base 1 on which a rotating seat 2 is rotatably disposed; a plurality of connecting seats 3 spaced apart circumferentially along the rotating seat 2, the connecting seats 3 being fixed to the rotating seat 2, and each of the connecting seats 3 being mounted with an adsorption component 4; a plurality of temperature control components 5 disposed on the base 1 and corresponding to the adsorption components 4; and a loading / unloading component 6 disposed on the base 1 and configured to provide chips 8 to or remove chips 8 from the adsorption components 4.

[0019] The base 1 can be made of metal materials, such as aluminum alloy or stainless steel, to ensure sufficient structural strength and dimensional stability. The rotating seat 2 is rotatably mounted on the base 1 and can be rotatably connected to the base 1 through rotating mating pairs such as bearings and bushings. The rotation of the rotating seat 2 can be achieved by a motor, pneumatic motor or other suitable driving device. The setting of the rotating seat 2 enables each adsorption component 4 to rotate between different workstations, realizing multi-workstation flow testing of the chip 8.

[0020] During operation, the loading / unloading assembly 6 provides the chip 8 to the adsorption assembly 4. After the adsorption assembly 4 adsorbs the chip 8, the rotating seat 2 rotates, moving the adsorption assembly 4 with the adsorbed chip 8 to a position corresponding to the temperature control assembly 5. The adsorption assembly 4 moves toward the temperature control assembly 5, allowing the chip 8 to enter the temperature control assembly 5 for temperature control and electrical performance testing. After the test is completed, the adsorption assembly 4 moves away from the temperature control assembly 5, and the rotating seat 2 rotates again to send the adsorption assembly 4 to the loading / unloading assembly 6, where the loading / unloading assembly 6 removes the chip 8 from the adsorption assembly 4. The entire process is highly automated, and multiple stations can work in parallel, significantly improving testing efficiency.

[0021] In this embodiment, the adsorption assembly 4 includes: an attachment plate 41, which is fixed to the connecting seat 3; a telescopic arm 43, which is fixed to the attachment plate 41 and has a telescopic end, wherein a suction cup assembly 44 is fixed to the telescopic end; and an adsorber 42, which is fixed to the attachment plate 41 and configured to provide negative pressure to the suction cup assembly 44.

[0022] The telescopic arm 43 can be any one of a pneumatic telescopic cylinder, a hydraulic telescopic cylinder, an electric push rod, or other suitable linear drive device. The adsorber 42 is fixed to the attachment plate 41 and is configured to provide negative pressure to the suction cup assembly 44. The adsorber 42 can be a vacuum pump, a vacuum generator, or other device capable of generating negative pressure. The adsorber 42 is connected to the suction cup assembly 44 through a pipeline. When the adsorber 42 is working, a negative pressure is generated at the bottom of the suction cup assembly 44, thereby adsorbing the chip 8. When the adsorber 42 stops working, the negative pressure disappears, and the chip 8 can be released.

[0023] In this embodiment, the suction cup assembly 44 includes: a suction cup body 441, which is fixed to the telescopic end of the telescopic arm 43, and a receiving groove is provided at the bottom of the suction cup body 441 for receiving the release disk 443; a sealing gasket 446, which is fixed to the bottom of the suction cup body 441; a magnetic block 445, which is embedded in the suction cup body 441 and configured to magnetically attract the release disk 443; an adsorption chamber 442 is provided in the middle of the suction cup body 441, and a plurality of first connecting holes 444 are provided between the adsorption chamber 442 and the receiving groove; a plurality of second connecting holes 447 corresponding to the first connecting holes 444 are provided on the release disk 443; and the bottom of the release disk 443 is configured to attract the chip 8 under negative pressure.

[0024] Among them, the magnetic block 445 can be an electromagnet, which generates a magnetic force to attract and release the detachment disk 443 when energized, and releases the detachment disk 443 when the power is off.

[0025] It should also be explained that, in order to improve detection efficiency, multiple chips 8 can be simultaneously adsorbed at the lower part of the release disk 443. Therefore, the design of the release disk 443 being configured to be detachable from the suction cup body 441 is beneficial to the subsequent pressing control of multiple chips 8 by pressing the release disk 443. Furthermore, since the release disk 443 is provided with a second connecting hole 447, the gas in the temperature control chamber 51 can act on the upper surface of the chip 8 through the second connecting hole 447.

[0026] In this embodiment, the temperature control component 5 includes: a temperature control chamber 51, which is fixed on the base 1, and the top of the temperature control chamber 51 has an opening corresponding to the release plate 443; a telescopic device 52, which is fixed in the temperature control chamber 51, and the telescopic device 52 has a height adjustment end; a mounting plate 53, which is fixed to the height adjustment end, and the mounting plate 53 is connected to a detection seat 56 through an elastic element 55, the detection seat 56 being configured to electrically connect to the chip 8 for detection; the temperature control chamber 51 is configured to allow external temperature control gas to be introduced for temperature control.

[0027] The telescopic element 52 can be any one of a hydraulic telescopic cylinder, a pneumatic telescopic cylinder, an electric push rod, or other suitable linear drive device. The elastic element 55 provides elastic buffer when the detection seat 56 contacts the chip 8 to avoid damage to the chip 8 caused by hard collision. The elastic element 55 can be a spring, a rubber elastomer, or other components with elastic reset function.

[0028] When the detection seat 56 moves upward to contact the chip 8, the elastic element 55 is compressed, generating appropriate contact pressure to ensure a reliable electrical connection between the chip 8 and the detection seat 56, while avoiding excessive pressure that could damage the chip 8.

[0029] The test socket 56 is configured to electrically connect to the chip 8 for testing. The test socket 56 is provided with probes or contact terminals corresponding to the pins of the chip 8. When the chip 8 is attracted to the test socket 56, the probes contact the pins of the chip 8 to realize electrical performance testing.

[0030] During operation, when the suction cup assembly 44 is aligned with the opening of the temperature control chamber 51, the telescopic device 52 drives the detection seat 56 to move upward. The detection seat 56 contacts the chip 8 through the opening. At this time, the magnetic suction block 445 is de-energized and releases the release plate 443. The chip 8, together with the release plate 443, detaches from the suction cup body 441. Subsequently, the telescopic device 52 resets and brings the chip 8 into the temperature control chamber 51. The temperature control chamber 51 is circulated with temperature control gas to control the temperature of the chip 8. At the same time, the detection seat 56 performs electrical performance testing on the chip 8. Since the chip 8 has detached from the suction cup body 441, its top is no longer blocked, and the temperature control gas can act on both the upper and lower surfaces of the chip 8 simultaneously, resulting in more uniform and effective temperature control.

[0031] In this embodiment, the detection seat 56 is configured to block the opening. The detection seat 56 can block the opening during the upward movement, thereby forming a relatively closed temperature control space inside the temperature control chamber 51. The closed space can effectively prevent the leakage of temperature control gas. That is to say, the detection seat 56 can block the opening from the bottom, while the suction cup body 441 can block the opening from the top.

[0032] In this embodiment, the mounting plate 53 is provided with two symmetrically distributed pressing arms 54, which are configured to press the chip 8 onto the detection seat 56.

[0033] The symmetrically distributed pressing arms 54 can provide uniform pressing force from both sides of the release plate 443, avoiding the chip 8 from tilting or uneven force due to unilateral pressing. In addition, the pressing force provided by the pressing arms 54 can effectively prevent the chip 8 from shifting or shaking during the test, ensuring a reliable electrical connection between the chip 8 and the detection seat 56, avoiding test misjudgment due to poor contact. The pressing force of the pressing arms 54 is buffered by the elastic action of the elastic element 55, which will not put too much pressure on the chip 8 and protect the chip 8 from damage.

[0034] Furthermore, it also includes a positioning component 7, which includes: a stop 21, which is fixed on the rotating base 2, and a slide 22 is connected to one side of the stop 21 by a spring. The rotating base 2 has a through guide groove, and the slide 22 passes through the guide groove and slides in cooperation with the guide groove; a telescopic cylinder 71, which is fixed on the base 1, and a locking seat 72 is fixed to the output end of the telescopic cylinder 71. The locking seat 72 is groove-shaped and configured to accommodate the slide 22.

[0035] When the rotary table 2 rotates, the slide 22 protrudes outward under the action of the spring, and the telescopic cylinder 71 is in the initial state, without interfering with the rotational movement of the rotary table 2. When the rotary table 2 rotates to the target position, the telescopic cylinder 71 drives the locking seat 72 to retract, and the groove of the locking seat 72 cooperates with the slide 22, placing the slide 22 in the groove, thereby locking the rotary table 2 in the target position.

[0036] In this embodiment, the loading and unloading assembly 6 includes: a position adjustment mechanism 61, the position adjustment mechanism 61 having an adjustment end 62; a first feeding arm 63 and a second feeding arm 64, both fixed to the adjustment end 62.

[0037] This embodiment also provides an automated testing method for semiconductor chips, including the following steps: Step 1: The chip 8 is provided to the adsorption component 4 by the loading and unloading component 6, so that the adsorption component 4 adsorbs the chip 8; Step 2: Rotate the rotating base 2 to move the adsorption component 4 to the position corresponding to the temperature control component 5; Step 3: Drive the adsorption component 4 toward the temperature control component 5, so that the chip 8 enters the temperature control component 5; Step 4: The temperature control component 5 is used to control the temperature and perform electrical performance testing on the chip 8. Specifically, temperature control gas is introduced into the temperature control chamber 51 to heat or cool the chip 8. Since the chip 8 has detached from the suction cup body 441, its top is no longer blocked, and the temperature control gas can act on both the upper and lower surfaces of the chip 8 simultaneously, resulting in more uniform and effective temperature control. Simultaneously, the pressing arm 54 presses the chip 8 stably onto the detection seat 56, ensuring a reliable electrical connection between the chip 8 and the detection seat 56. The detection seat 56 then performs electrical performance testing on the chip 8. Step 5: After the test is completed, drive the adsorption component 4 to move away from the temperature control component 5; Step 6: Rotate the rotating base 2 to bring the adsorption component 4 to the position of the loading and unloading component 6; remove the chip 8 from the adsorption component 4 through the loading and unloading component 6.

[0038] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. An automated testing system for semiconductor chips, characterized in that, include: A base (1) on which a rotating seat (2) is rotatably mounted; Multiple connecting seats (3) are distributed circumferentially along the rotating seat (2). The connecting seats (3) are fixed on the rotating seat (2). Each connecting seat (3) is equipped with an adsorption component (4). Multiple temperature control components (5) are disposed on the base (1) and correspond to the adsorption component (4); The loading and unloading assembly (6), which is disposed on the base (1), is configured to provide the chip (8) to the adsorption assembly (4) or remove the chip (8) from the adsorption assembly (4).

2. The automated semiconductor chip testing system according to claim 1, characterized in that, The adsorption component (4) includes: An attachment plate (41) is fixed to the connecting seat (3); Telescopic arm (43), which is fixed to the attachment plate (41) and has a telescopic end, wherein a suction cup assembly (44) is fixed to the telescopic end. The suction unit (42), which is fixed to the attachment plate (41), is configured to provide negative pressure to the suction cup assembly (44).

3. The automated semiconductor chip testing system according to claim 2, characterized in that, The suction cup assembly (44) includes: The suction cup body (441) is fixed to the telescopic end of the telescopic arm (43). The bottom of the suction cup body (441) is provided with a receiving groove for receiving the release plate (443). A sealing gasket (446) is fixed to the bottom of the suction cup body (441); A magnetic block (445), which is embedded in the suction cup body (441), is configured to magnetically attract the release plate (443). The suction cup body (441) has an adsorption chamber (442) in the middle, and a plurality of first connecting holes (444) are provided between the adsorption chamber (442) and the receiving groove. The release plate (443) has a plurality of second connecting holes (447) corresponding to the first connecting holes (444). The bottom of the release plate (443) is configured to adsorb the chip (8) under negative pressure.

4. The automated semiconductor chip testing system according to claim 3, characterized in that, The temperature control component (5) includes: Temperature control chamber (51) is fixed on the base (1), and the top of the temperature control chamber (51) has an opening corresponding to the release plate (443); The telescopic device (52) is fixed in the temperature control chamber (51) and has a height adjustment end; Mounting plate (53), which is fixed to the height adjustment end, is connected to a detection seat (56) via an elastic element (55), and the detection seat (56) is configured to electrically connect to the chip (8) for detection; The temperature control chamber (51) is configured to allow external temperature-controlled gas to be introduced for temperature control.

5. The automated testing system for semiconductor chips according to claim 4, characterized in that, The detection seat (56) is configured to block the opening.

6. The automated semiconductor chip testing system according to claim 4, characterized in that, The mounting plate (53) is provided with two symmetrically distributed pressing arms (54), which are configured to press the chip (8) onto the detection seat (56).

7. The automated semiconductor chip testing system according to claim 1, characterized in that, It also includes a positioning component (7), which includes: A stop (21) is fixed on the rotating seat (2). A slide (22) is connected to one side of the stop (21) by a spring. A through guide groove is provided on the rotating seat (2). The slide (22) passes through the guide groove and slides in cooperation with the guide groove. A telescopic cylinder (71) is fixed on the base (1), and a locking seat (72) is fixed at the output end of the telescopic cylinder (71). The locking seat (72) is groove-shaped and configured to accommodate the slide (22).

8. The automated semiconductor chip testing system according to claim 1, characterized in that, The loading and unloading assembly (6) includes: A position adjustment mechanism (61) having an adjustment end (62); The first feeding arm (63) and the second feeding arm (64) are both fixed to the adjustment end (62).

9. An automated testing method for semiconductor chips, applied to the automated testing system for semiconductor chips as described in any one of claims 1-9, characterized in that, Includes the following steps: Step 1: The chip (8) is provided to the adsorption component (4) through the loading and unloading component (6) so that the adsorption component (4) adsorbs the chip (8). Step 2: Rotate the rotating base (2) to move the adsorption component (4) to the position corresponding to the temperature control component (5); Step 3: Drive the adsorption component (4) toward the temperature control component (5) so that the chip (8) enters the temperature control component (5); Step 4: Temperature control and electrical performance testing of the chip (8) are performed using the temperature control component (5); Step 5: After the test is completed, drive the adsorption component (4) to move away from the temperature control component (5); Step 6: Rotate the turntable (2) to bring the adsorption component (4) to the position of the loading and unloading component (6); remove the chip (8) from the adsorption component (4) through the loading and unloading component (6).

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