Laser active temperature control packaging structure under high temperature difference environment

Abstract

The application provides a high-temperature-difference environment laser active temperature control packaging structure and relates to the technical field of lasers.The laser active temperature control packaging structure comprises a metal outer shell and a laser.The laser is installed in the metal outer shell, and an outer cover is connected to the outside of the metal outer shell.The outer cover is internally installed with high-transparency glass.An active lock ring is sleeved to the outside of the metal outer shell, and the active lock ring is connected to the outer cover.A temperature-conducting copper pipe is installed to the outside of the metal outer shell, and a semiconductor refrigerating sheet is connected to the outside of the temperature-conducting copper pipe.The heat generated by the laser is conducted to the metal outer shell, the refrigerating surface of the semiconductor refrigerating sheet is cooled to the temperature-conducting copper pipe, the temperature-conducting copper pipe conducts the cold to the metal outer shell, the laser is actively cooled, and the stable temperature control requirement of the laser under the high-temperature-difference environment is met.The existing laser packaging structure is difficult to meet the stable temperature control requirement under the high-temperature-difference severe working condition, and the laser output power is prone to sharp fluctuation.

Description

Technical Field

[0001] This invention relates to the field of laser technology, and in particular to an active temperature control packaging structure for lasers operating under high temperature difference conditions. Background Technology

[0002] A laser is a device that generates coherent light through stimulated emission and has been widely used in industrial processing, medical treatment, communication and scientific research. The core working principle of a laser is based on stimulated emission, which excites atoms or molecules in the gain medium through a pump source, putting them in a high-energy state. When these particles transition back to a low-energy state, they release photons with the same phase, frequency and direction as the incident photons, forming laser output.

[0003] For example, Chinese patent CN118487102B describes a laser packaging structure, including an upper cover and a lower cover. The upper cover is provided with a heat dissipation fin assembly. Gears are rotatably mounted at both ends of the upper cover along its length, and bolts are provided on the gears. Bolt holes that mate with the bolts are provided on the lower cover. Racks that mesh with the gears are provided on both sides of the circumference of the gears. The racks are slidably mounted on the upper cover. A push rod for pushing the rack to slide is provided on the rack. A filler fin assembly is provided on the push rod. The fins of the filler fin assembly and the heat dissipation fin assembly are staggered.

[0004] Current laser packaging structures are ineffective at preventing the intrusion of external moisture, allowing moisture to easily penetrate the interior and affect the normal operation of the laser. Furthermore, when used under harsh conditions with high temperature differences, it is difficult to achieve stable temperature control, which can easily cause drastic fluctuations in the laser's output power, or even cause the laser to completely lose its function and fall into a failure state. Summary of the Invention

[0005] This invention relates to an active temperature control packaging structure for lasers under high temperature difference environments. It solves the problem that existing laser packaging structures are difficult to effectively prevent the intrusion of external moisture, which allows moisture to easily penetrate into the interior, affecting the normal operation of the laser. Furthermore, when used under harsh high temperature difference conditions, it is difficult to achieve stable temperature control, which can easily cause drastic fluctuations in the laser's output power, or even cause the laser to completely lose its function and fall into a failure state.

[0006] In a first aspect, this invention provides an active temperature-controlled packaging structure for a laser under high temperature difference conditions, specifically comprising: a metal outer shell, a laser, high-transparency glass, an outer casing, a movable locking ring, a thermally conductive copper tube, a thermoelectric cooler, a heat sink, a fan, and an outer clamping frame; the laser is installed inside the metal outer shell, the outer casing is connected to the outside of the metal outer shell, and the high-transparency glass is installed inside the outer casing; a movable locking ring is fitted onto the outside of the metal outer shell, and the movable locking ring is connected to the outer casing; a thermally conductive copper tube is installed on the outside of the metal outer shell, a thermoelectric cooler is connected to the outside of the thermally conductive copper tube, and a heat sink is connected to the outside of the thermoelectric cooler; a fan is connected to the outside of the heat sink, and an outer clamping frame is connected to the outside of the fan, the heat sink, and the metal outer shell.

[0007] Furthermore, the metal outer shell has an annular groove at its opening end, in which a rubber sealing ring is embedded. The inner side of the high-transparency glass contacts the rubber sealing ring. After the outer cover is connected to the metal outer shell, the inner side of the high-transparency glass is in close contact with the rubber sealing ring, ensuring the sealing performance of the metal outer shell and preventing external moisture from entering.

[0008] Furthermore, the inner side of the outer cover contacts the outer side of the metal outer shell, a locking block is provided around the outer side of the metal outer shell, and an L-shaped groove is provided around the outer side of the outer cover. The locking block is connected to the L-shaped groove. By cooperating with the L-shaped groove, the outer cover and the metal outer shell are locked together, realizing the quick assembly and disassembly of the outer cover, which facilitates the inspection and replacement of the internal laser.

[0009] Furthermore, the inner side of the movable locking ring slides in contact with the outer side of the metal outer shell, and guide blocks are symmetrically arranged on the outer side of the metal outer shell. Guide grooves are symmetrically arranged on the outer side of the movable locking ring. The guide blocks are slidably connected in the guide grooves, and the guide blocks and guide grooves slide together to guide the movable locking ring.

[0010] Furthermore, the movable locking ring is surrounded by an insert block, which is inserted into the slot of the L-shaped groove. When the locking block moves to the innermost end of the L-shaped groove, the movable locking ring moves, so that the insert block is inserted into the slot of the L-shaped groove, thereby achieving the effect of limiting and fixing the outer cover.

[0011] Furthermore, the outer metal casing is symmetrically provided with positioning grooves, and the movable locking ring is symmetrically provided with screw holes. The screw holes are connected to the positioning grooves, and bolts are threaded into the screw holes. The ends of the bolts are located in the positioning grooves. When the screw holes and positioning grooves are in a connected state, the bolts are tightened so that the ends of the bolts extend into the positioning grooves, thereby achieving the effect of locking and fixing the movable locking ring.

[0012] Furthermore, the outer metal casing is surrounded by temperature control holes, through which a heat-conducting copper tube passes. The cooling surface of the thermoelectric cooler contacts the heat-conducting copper tube, the heating surface of the thermoelectric cooler contacts the heat sink, and the heat sink contacts the fan. The heat emitted by the laser is conducted to the outer metal casing, the cooling surface of the thermoelectric cooler cools the heat-conducting copper tube, and the heat-conducting copper tube conducts the cold energy to the outer metal casing, thus achieving active cooling of the laser. The heating surface of the thermoelectric cooler conducts heat to the heat sink, and the fan releases the heat inside the heat sink into the air.

[0013] Furthermore, the outer metal casing is surrounded by connecting holes, the outer heat sink is surrounded by through holes, the inner fan is surrounded by through holes, the outer clamping frame contacts the fan, and the outer clamping frame is surrounded by screws, which pass through the through holes, through holes, and connecting holes.

[0014] Furthermore, a spring is fitted around the screw, and a nut is threaded onto the end of the screw. One end of the spring contacts the nut, and the other end of the spring contacts the outer metal casing. By tightening the nut, the spring is compressed, applying a thrust to the outer frame, so that the heat sink and the heating surface of the semiconductor cooling chip are in close contact, and the heat-conducting copper tube and the cooling surface of the semiconductor cooling chip are in close contact.

[0015] This invention provides an active temperature-controlled packaging structure for lasers operating under high temperature difference conditions, which has the following beneficial effects: In use, the outer cover and the metal outer shell are snapped together by the cooperation of the locking block and the L-shaped groove, which realizes the quick assembly and disassembly of the outer cover, making it convenient for the internal laser to be inspected and replaced. After the outer cover and the metal outer shell are connected together, the inner side of the high-transparency glass is in close contact with the rubber sealing ring, ensuring the sealing performance of the metal outer shell and preventing the intrusion of external moisture.

[0016] Furthermore, the guide block and guide groove slide together to guide the movable locking ring. When the locking block moves to the innermost end of the L-shaped groove, the movable locking ring moves, allowing the insert block to be inserted into the opening of the L-shaped groove, thus limiting and fixing the outer cover and ensuring the firmness of the connection between the outer cover and the metal outer shell. At this time, the screw hole and the positioning groove are in a connected state. Tightening the bolt allows the bolt end to extend into the positioning groove, achieving a locking and fixing effect on the movable locking ring, further ensuring the firmness of the connection between the outer cover and the metal outer shell. When the laser needs to be repaired later, simply loosen the bolt, the bolt end separates from the positioning groove, releasing the movable locking ring from its limit. Moving the movable locking ring in the opposite direction allows the insert block to separate from the opening of the L-shaped groove, releasing the outer cover from its limit. Then, the outer cover can be rotated in the opposite direction to remove it from the metal outer shell for laser repair and replacement. The operation is convenient and efficient.

[0017] Furthermore, the heat emitted by the laser is conducted to the metal outer casing. The cooling surface of the thermoelectric cooler cools the temperature-conducting copper tube, which then conducts the cooling energy to the metal outer casing, achieving active cooling of the laser. The heating surface of the thermoelectric cooler conducts heat to the heat sink, and a fan releases the heat inside the heat sink into the air, meeting the stable temperature control requirements of the laser under high temperature difference environments. By tightening the nut, the spring is compressed, applying a pushing force to the outer frame, ensuring close contact between the heat sink and the heating surface of the thermoelectric cooler, and close contact between the temperature-conducting copper tube and the cooling surface of the thermoelectric cooler, improving heat transfer efficiency and ensuring fast temperature control response.

[0018] Other advantages, objectives and features of the present invention will become apparent in part from the following description, and in part from those skilled in the art through study and practice of the invention. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings of the embodiments will be briefly described below.

[0020] The accompanying drawings described below are only related to some embodiments of the invention and are not intended to limit the invention.

[0021] In the attached diagram: Figure 1 This paper presents a schematic diagram of the overall axial side structure of the laser active temperature control packaging structure under high temperature difference environment of this application; Figure 2 This paper presents a schematic diagram of the overall axial side structure of the laser active temperature control packaging structure under high temperature difference environment of this application from another angle. Figure 3 This paper shows a schematic diagram of the disassembled structure of the metal outer shell, high-transparency glass, and outer cover of the laser active temperature control packaging structure under high temperature difference environment of this application; Figure 4 This paper shows a schematic diagram of the disassembled structure of the metal outer shell, rubber sealing ring, and movable locking ring of the laser active temperature control packaging structure under high temperature difference environment of this application; Figure 5 This paper shows a schematic diagram of the metal outer shell axial structure of the laser active temperature control packaging structure under high temperature difference environment of this application; Figure 6 This paper shows a schematic diagram of the connection structure of the temperature-conducting copper tube, semiconductor cooling chip, heat sink and fan in the active temperature control packaging structure of the laser under high temperature difference environment of this application. Figure 7 This paper shows a schematic diagram of the disassembled structure of the temperature-conducting copper tube, semiconductor cooling chip, heat sink, and fan of the laser active temperature control packaging structure under high temperature difference environment of this application. Figure 8The diagram shows the outer clamping frame, nut, and spring connection structure of the laser active temperature control packaging structure under high temperature difference environment of this application.

[0022] Figure label: 1. Metal outer casing; 101. Ring groove; 102. Locking block; 103. Guide block; 104. Positioning groove; 105. Temperature control hole; 106. Connecting hole; 2. Laser; 3. Rubber sealing ring; 4. High-transparency glass; 5. Outer cover; 501. L-shaped groove; 6. Movable locking ring; 601. Guide groove; 602. Insert block; 603. Screw hole; 7. Bolt; 8. Temperature-conducting copper tube; 9. Semiconductor cooling chip; 10. Heat sink; 1001. Perforation; 11. Fan; 1101. Through hole; 12. Outer clamping frame; 1201. Screw; 13. Nut; 14. Spring. Detailed Implementation

[0023] Please refer to Figures 1 to 8 This invention proposes an active temperature control packaging structure for a laser under high temperature difference conditions, comprising: a metal outer shell 1, a laser 2, a high-transparency glass 4, an outer cover 5, a movable locking ring 6, a thermally conductive copper tube 8, a semiconductor cooling chip 9, a heat sink 10, a fan 11, and an outer clamping frame 12; the laser 2 is installed inside the metal outer shell 1, and the outer cover 5 is connected to the outside of the metal outer shell 1, with the high-transparency glass 4 installed inside the outer cover 5; the movable locking ring 6 is fitted onto the outside of the metal outer shell 1 and is connected to the outer cover 5; the thermally conductive copper tube 8 is installed on the outside of the metal outer shell 1, and the semiconductor cooling chip 9 is connected to the outside of the thermally conductive copper tube 8, with the heat sink 10 connected to the outside of the semiconductor cooling chip 9; the fan 11 is connected to the outside of the heat sink 10, and the outer clamping frame 12 is connected to the outside of the fan 11, the heat sink 10, and the metal outer shell 1.

[0024] In this embodiment, an annular groove 101 is provided at the opening end of the metal outer shell 1, and a rubber sealing ring 3 is embedded in the annular groove 101. The inner side of the high-transparency glass 4 contacts the rubber sealing ring 3, and the inner side of the outer cover 5 contacts the outer side of the metal outer shell 1. A locking block 102 is provided around the outside of the metal outer shell 1, and an L-shaped groove 501 is provided around the outside of the outer cover 5. The locking block 102 is connected to the L-shaped groove 501. By adopting the above technical solution, the outer cover 5 and the metal outer shell 1 are locked together by the cooperation of the locking block 102 and the L-shaped groove 501, realizing the quick assembly and disassembly of the outer cover 5, which facilitates the inspection and replacement of the internal laser 2. After the outer cover 5 and the metal outer shell 1 are connected together, the inner side of the high-transparency glass 4 is in close contact with the rubber sealing ring 3, ensuring the internal sealing performance of the metal outer shell 1 and preventing external moisture from entering.

[0025] In this embodiment, the inner side of the movable locking ring 6 slides in contact with the outer side of the metal outer shell 1. Guide blocks 103 are symmetrically arranged on the outer side of the metal outer shell 1, and guide grooves 601 are symmetrically arranged on the outer side of the movable locking ring 6. The guide blocks 103 are slidably connected within the guide grooves 601. Insert blocks 602 are arranged around the outer side of the movable locking ring 6, and the insert blocks 602 are inserted into the opening of the L-shaped groove 501. Positioning grooves 104 are symmetrically arranged on the outer side of the metal outer shell 1, and screw holes 603 are symmetrically arranged on the outer side of the movable locking ring 6. The screw holes 603 communicate with the positioning grooves 104, and bolts 7 are threaded into the screw holes 603, with the end of the bolts 7 located within the positioning grooves 104. Using the above technical solution, the guide blocks 103 and guide grooves 601 slide in cooperation, guiding the movable locking ring 6. When the locking block 102 moves to the innermost end of the L-shaped groove 501, the movable locking ring 6 moves. Insert the insert 602 into the slot of the L-shaped groove 501 to limit and fix the outer cover 5, ensuring the firmness of the connection between the outer cover 5 and the metal outer shell 1. At this time, the screw hole 603 is in communication with the positioning groove 104. Tighten the bolt 7 so that the end of the bolt 7 extends into the positioning groove 104, which locks the movable locking ring 6 and further ensures the firmness of the connection between the outer cover 5 and the metal outer shell 1. When the laser 2 needs to be repaired later, simply loosen the bolt 7, the end of the bolt 7 separates from the positioning groove 104, release the limitation of the movable locking ring 6, move the movable locking ring 6 in the opposite direction, so that the insert 602 separates from the slot of the L-shaped groove 501, release the limitation of the outer cover 5, and then rotate the outer cover 5 in the opposite direction to remove the outer cover 5 from the metal outer shell 1 for repair and replacement of the laser 2. The operation is convenient and efficient.

[0026] In this embodiment, a temperature control hole 105 is arranged around the outside of the metal outer shell 1, and a heat-conducting copper tube 8 passes through the temperature control hole 105. The cooling surface of the thermoelectric cooler 9 is in contact with the heat-conducting copper tube 8, the heating surface of the thermoelectric cooler 9 is in contact with the heat sink 10, and the heat sink 10 is in contact with the fan 11. Using the above technical solution, the heat emitted by the laser 2 is conducted to the metal outer shell 1, the cooling surface of the thermoelectric cooler 9 cools the heat-conducting copper tube 8, the heat-conducting copper tube 8 conducts the cold energy to the metal outer shell 1, realizing the active cooling of the laser 2, the heating surface of the thermoelectric cooler 9 conducts the heat to the heat sink 10, and the fan 11 releases the heat inside the heat sink 10 into the air, meeting the stable temperature control requirements of the laser 2 under high temperature difference environment.

[0027] In this embodiment, the outer metal casing 1 is surrounded by connecting holes 106, the outer heat sink 10 is surrounded by through holes 1001, the inner fan 11 is surrounded by through holes 1101, the outer clamping frame 12 contacts the fan 11, and the outer clamping frame 12 is surrounded by screws 1201. The screws 1201 pass through the through holes 1101, through holes 1001, and connecting holes 106. A spring 14 is fitted on the outside of the screw 1201, and a nut 13 is threaded to the end of the screw 1201. One end of the spring 14 contacts the nut 13, and the other end of the spring 14 contacts the outer metal casing 1. By tightening the nut 13, the spring 14 is compressed, which applies a pushing force to the outer clamping frame 12, making the heat sink 10 and the heat-generating surface of the thermoelectric cooler 9 in close contact, and the heat-conducting copper tube 8 and the cooling surface of the thermoelectric cooler 9 in close contact, thereby improving the heat conduction efficiency and ensuring the temperature control response speed.

[0028] The working principle of this embodiment is as follows: The outer cover 5 and the metal outer shell 1 are fastened together by the engagement of the locking block 102 and the L-shaped groove 501, enabling quick assembly and disassembly of the outer cover 5. This facilitates the inspection and replacement of the internal laser 2. After the outer cover 5 and the metal outer shell 1 are connected, the inner side of the high-transparency glass 4 is in close contact with the rubber sealing ring 3, ensuring the internal sealing performance of the metal outer shell 1 and preventing external moisture intrusion. The guide block 103 slides with the guide groove 601 to guide the movement of the movable locking ring 6. When the device moves to the innermost end of the L-shaped groove 501, the movable locking ring 6 is moved so that the insert block 602 is inserted into the groove of the L-shaped groove 501, limiting and fixing the outer cover 5 to ensure the firmness of the connection between the outer cover 5 and the metal outer shell 1; at this time, the screw hole 603 is in communication with the positioning groove 104, and the bolt 7 is tightened so that the end of the bolt 7 extends into the positioning groove 104, which locks and fixes the movable locking ring 6, further ensuring the firmness of the connection between the outer cover 5 and the metal outer shell 1; the heat emitted by the laser 2 is conducted to the metal outer shell 1. The cooling surface of the thermoelectric cooler 9 cools the heat-conducting copper tube 8, which then conducts the cold energy to the metal outer casing 1, achieving active cooling of the laser 2. The heating surface of the thermoelectric cooler 9 conducts heat to the heat sink 10, and the fan 11 releases the heat inside the heat sink 10 into the air, meeting the stable temperature control requirements of the laser 2 under high temperature difference conditions. By tightening the nut 13, the spring 14 is compressed, applying a pushing force to the outer clamp frame 12, making the heat sink 10 and the heating surface of the thermoelectric cooler 9 in close contact, thus improving the heat conduction... The copper tube 8 is in close contact with the cooling surface of the semiconductor cooling chip 9, which improves the heat conduction efficiency and ensures the temperature control response speed. When the laser 2 needs to be repaired later, simply loosen the bolt 7, the end of the bolt 7 separates from the positioning groove 104, release the limit of the movable locking ring 6, move the movable locking ring 6 in the opposite direction, so that the insert 602 separates from the slot of the L-shaped groove 501, release the limit of the outer cover 5, and then rotate the outer cover 5 in the opposite direction to remove the outer cover 5 from the metal outer shell 1 for repair and replacement of the laser 2. The operation is convenient and efficient.

Claims

1. An active temperature control packaging structure for lasers operating under high temperature difference conditions, including: The device comprises a metal outer casing (1), a laser (2), high-transparency glass (4), an outer cover (5), a movable locking ring (6), a thermally conductive copper tube (8), a semiconductor cooling chip (9), a heat sink (10), a fan (11), and an outer clamping frame (12); characterized in that the laser (2) is installed inside the metal outer casing (1), the outer cover (5) is connected to the outside of the metal outer casing (1), and the high-transparency glass (4) is installed inside the outer cover (5); the movable locking ring (6) is fitted on the outside of the metal outer casing (1). Locking ring (6), movable locking ring (6) is connected to outer cover (5); a heat-conducting copper tube (8) is installed on the outside of the metal outer shell (1), a semiconductor cooling chip (9) is connected to the outside of the heat-conducting copper tube (8), and a heat sink (10) is connected to the outside of the semiconductor cooling chip (9); a fan (11) is connected to the outside of the heat sink (10), an outer clamping frame (12) is connected to the outside of the fan (11), and the outer clamping frame (12) is connected to the fan (11), the heat sink (10) and the metal outer shell (1).

2. The active temperature control packaging structure for lasers under high temperature difference environments according to claim 1, characterized in that, The metal outer shell (1) has an annular groove (101) at the shell opening end, and a rubber sealing ring (3) is embedded in the annular groove (101). The inner side of the high-transparency glass (4) is in contact with the rubber sealing ring (3).

3. The active temperature control packaging structure for lasers under high temperature difference environments according to claim 1, characterized in that, The inner side of the outer cover (5) contacts the outer side of the metal outer shell (1). The outer metal outer shell (1) is surrounded by a locking block (102), and the outer cover (5) is surrounded by an L-shaped groove (501). The locking block (102) is connected to the L-shaped groove (501).

4. The active temperature control packaging structure for lasers under high temperature difference environments according to claim 1, characterized in that, The inner side of the movable locking ring (6) is in sliding contact with the outer side of the metal outer shell (1). The outer side of the metal outer shell (1) is symmetrically provided with guide blocks (103), and the outer side of the movable locking ring (6) is symmetrically provided with guide grooves (601). The guide blocks (103) are slidably connected in the guide grooves (601).

5. The active temperature control packaging structure for lasers under high temperature difference environments according to claim 3, characterized in that, The movable locking ring (6) is surrounded by a plug (602), which is inserted into the slot of the L-shaped groove (501).

6. The active temperature control packaging structure for lasers under high temperature difference environments according to claim 1, characterized in that, The metal outer shell (1) is symmetrically provided with positioning grooves (104) on the outside, and the movable locking ring (6) is symmetrically provided with screw holes (603) on the outside. The screw holes (603) are connected to the positioning grooves (104), and the screw holes (603) are threaded with bolts (7). The end of the bolts (7) is located in the positioning grooves (104).

7. The active temperature control packaging structure for lasers under high temperature difference environments according to claim 1, characterized in that, The metal outer shell (1) is surrounded by a temperature control hole (105), and a temperature-conducting copper tube (8) passes through the temperature control hole (105). The cooling surface of the semiconductor cooling chip (9) is in contact with the temperature-conducting copper tube (8), the heating surface of the semiconductor cooling chip (9) is in contact with the heat sink (10), and the heat sink (10) is in contact with the fan (11).

8. The active temperature control packaging structure for lasers under high temperature difference environments according to claim 1, characterized in that, The metal outer casing (1) is surrounded by connecting holes (106), the heat sink (10) is surrounded by through holes (1001), the fan (11) is surrounded by through holes (1101), the outer frame (12) contacts the fan (11), and the outer frame (12) is surrounded by screws (1201), which pass through the through holes (1101), through holes (1001) and connecting holes (106).

9. The active temperature control packaging structure for lasers under high temperature difference environments according to claim 8, characterized in that, The screw (1201) is fitted with a spring (14) on the outside. The end of the screw (1201) is threaded with a nut (13). One end of the spring (14) is in contact with the nut (13), and the other end of the spring (14) is in contact with the metal outer shell (1).

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