Anti-condensation high-voltage switch cabinet and anti-condensation method
Patent Information
- Application Number
- CN202611544100.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-10-08
- Publication Date
- 2026-11-03
AI Technical Summary
Existing high-voltage switchgear is prone to condensation under fluctuating ambient temperature and humidity. Traditional refrigeration devices cause the airflow temperature to drop, posing a risk of secondary condensation, and their dehumidification effect is poor.
By employing a semiconductor cooling chip combined with a switchable air duct structure, and switching between dehumidification and heat dissipation modes, it achieves efficient dehumidification and cooling of the air. The cold and hot ends of the semiconductor cooling chip are used for water vapor condensation and heat dissipation, respectively.
It enables automatic switching of working modes based on the temperature and humidity inside the cabinet, efficiently dehumidifies and prevents condensation, and quickly cools down, thereby improving the safety and stability of the switch cabinet and saving installation space and maintenance costs.
Smart Images
Figure CN123034240A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of high-voltage switchgear technology, specifically to an anti-condensation high-voltage switchgear and an anti-condensation method. Background Technology
[0002] High-voltage switchgear is a core set of complete power distribution equipment in power systems, capable of distributing high-voltage power, controlling circuit switching, and protecting against short-circuit and overload faults. It is widely used in substations, industrial and mining areas, and public building power distribution sites. During operation, switchgear is highly susceptible to condensation due to fluctuations in ambient temperature and humidity, threatening the insulation performance of internal electrical components. Existing technologies employ semiconductor cooling devices inside the switchgear to suppress condensation, causing moisture in the air to condense on the surface of the cooling components and be discharged outwards, thus reducing the air's moisture content. However, this approach has significant drawbacks: while air flows through the cooling components and condenses the moisture, the airflow temperature drops significantly; the low-temperature airflow diffuses into the switchgear body, easily causing a decrease in the surface temperature of components, still posing a risk of inducing localized condensation. Therefore, we propose an anti-condensation high-voltage switchgear. Summary of the Invention
[0003] To solve the above-mentioned technical problems, this application provides an anti-condensation high-voltage switchgear, including a switchgear body and a movable frame slidably disposed on the inner wall of the switchgear body. A thermoelectric cooler is installed in the movable frame, and a circulating fan located at the cold end of the thermoelectric cooler is disposed on the movable frame. An air duct assembly and a driving component are disposed on the switchgear body. The driving component is linked and cooperates with the movable frame and the air duct assembly. The driving component can drive the movable frame to slide, so that the hot end of the thermoelectric cooler switches between a storage position inside the cabinet and a heat dissipation position outside the cabinet. The air duct assembly has two airflow modes: Dehumidification mode: The hot end is stored inside the cabinet, the air duct components form a series air duct, and the circulating fan drives the air inside the cabinet to flow through the cold end and the hot end in turn. Water vapor condenses and precipitates at the cold end, and the airflow is reheated and flows back to the main body of the switch cabinet through the hot end. Heat dissipation mode: The hot end extends to the outside of the switch cabinet body, the air duct component cuts off the airflow channel to the hot end, and the circulating fan drives the air in the cabinet to flow only through the cold end to absorb and dissipate heat.
[0004] In some embodiments, the duct assembly includes a first U-shaped plate fixedly connected to one side of the movable frame, an installation ring being conductively connected to the first U-shaped plate, a circulating fan being assembled inside the installation ring, a second U-shaped plate fixedly connected to the other side of the movable frame, a water collection duct housing fixedly connected to the inner wall of the switch cabinet body, and an L-shaped exhaust pipe fixedly connected to the inner wall of the switch cabinet body. In dehumidification mode, one end of the L-shaped exhaust pipe is connected to the top of the second U-shaped plate, and the water collection duct shell is simultaneously connected to the bottom of the first U-shaped plate and the bottom of the second U-shaped plate, so that the air inside the cabinet can flow through the cold end and the hot end of the semiconductor cooling chip in sequence and then flow back into the main body of the switch cabinet.
[0005] In some embodiments, the driving component includes a guide rod fixedly connected to the inner wall of the switch cabinet body, a sliding sleeve fixedly connected to the first U-shaped plate, the guide rod and the sliding sleeve being slidably connected to realize the movement guidance and limitation of the moving frame, and an electric push rod fixedly connected to the inner wall of the switch cabinet body, the extended end of the electric push rod being fixedly connected to the mounting ring. The main body of the switch cabinet has a through slot, and the second U-shaped plate slides in the through slot; when the electric push rod drives the moving frame to move, it can drive the second U-shaped plate through the through slot and extend to the outside of the main body of the switch cabinet. In the heat dissipation mode, the second U-shaped plate is located outside the main body of the switch cabinet. One end of the L-shaped exhaust pipe is connected to the top of the first U-shaped plate for airflow. The water collection duct shell is only connected to the bottom of the first U-shaped plate for airflow. The air inside the cabinet only flows through the cold end of the semiconductor cooling chip and then flows back to the interior of the switch cabinet.
[0006] In some embodiments, both the cold end and the hot end of the semiconductor cooling chip are equipped with heat dissipation fins. The second U-shaped plate is a split structure, including two L-shaped plates. One end of each L-shaped plate is rotatably connected to a first rotating shaft. The first rotating shaft is fixed to the movable frame. A torsion spring is sleeved on the first rotating shaft, and both ends of the torsion spring are fixedly connected to the first rotating shaft and the L-shaped plate, respectively. In the heat dissipation mode, the two L-shaped plates extend to the outside of the switch cabinet body and remain open. When the electric push rod drives the moving frame to retract the two L-shaped plates inward, the two L-shaped plates are deflected and aligned with each other by the limit block of the side wall of the switch cabinet body through slot, splicing together to form a complete second U-shaped plate. At the same time, the torsion spring is subjected to force to torsion and store energy.
[0007] In some embodiments, a first sealing plate is fixedly connected to one end of the L-shaped exhaust pipe. In dehumidification mode, the first sealing plate closes the top opening of the first U-shaped plate. A second sealing plate is fixedly connected to the bottom end of the first U-shaped plate. In the heat dissipation mode, the second sealing plate seals the passage between the water collection duct housing and the main body of the switch cabinet.
[0008] In some embodiments, a drain pipe is connected to the bottom of the water collection duct housing to discharge the condensate collected inside the housing to the outside.
[0009] A method for preventing condensation in a high-voltage switchgear includes the following steps: S1, Dehumidification mode: An electric push rod drives the moving frame to retract, and the semiconductor cooling chip is completely housed inside the cabinet. The split second U-shaped plate is closed and formed by the through slot; the air duct assembly forms a series air duct, and the air inside the cabinet flows sequentially through the cold end and the hot end of the cooling chip; water vapor condenses at the cold end and is discharged through the drain pipe, and the low-temperature airflow is reheated at the hot end and then flows back to the main body of the switchgear to achieve dehumidification and prevent condensation; S2, Heat dissipation mode: The electric push rod pushes the moving frame to move outward, the hot end of the cooling chip extends outward from the outside of the switch cabinet body, and the two L-shaped plates of the second U-shaped plate open to dissipate heat under the action of the torsion spring; the air duct switches the passage and blocks the hot end side passage, so that the air in the cabinet only flows through the cold end to absorb heat, and dissipates the heat in the cabinet to the outside of the cabinet through the external hot end, so as to achieve the cooling and heat dissipation of the switch cabinet body.
[0010] The present invention has at least the following beneficial effects: This device can automatically switch working modes according to the temperature and humidity inside the cabinet. In dehumidification mode, the air duct structure with condensation at the cold end and reheating at the hot end efficiently removes water and avoids secondary condensation caused by low-temperature airflow. In heat dissipation mode, the hot end is moved outside the cabinet to dissipate heat and quickly reduce the temperature inside the cabinet. The overall structure is simple and compact with strong adaptability to working conditions. It solves the defects of traditional dehumidification equipment, such as single function, easy temperature rise at high temperatures, and poor dehumidification effect, and significantly improves the safety and stability of high-voltage switchgear operation. Attached Figure Description
[0011] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 For the present invention Figure 1 Schematic diagram of partial cross-section structure; Figure 3 This is a schematic diagram of the dehumidification mode structure of the present invention; Figure 4 This is a schematic diagram of the heat dissipation mode structure of the present invention; Figure 5 For the present invention Figure 3 Schematic diagram of partial cross-section structure; Figure 6 For the present invention Figure 5 Another structural diagram; Figure 7 This is a schematic diagram of the movable frame structure of the present invention.
[0012] In the diagram: 1. Switch cabinet body; 2. Moving frame; 3. Semiconductor cooling chip; 4. Circulating fan; 5. Air duct assembly; 6. Drive component; 7. First U-shaped plate; 8. Mounting ring; 9. Second U-shaped plate; 10. Water collection air duct shell; 11. L-shaped exhaust pipe; 12. Guide rod; 13. Sliding sleeve; 14. Electric push rod; 15. Through groove; 16. Heat dissipation fins; 17. L-shaped plate; 18. First rotating shaft; 19. Torsion spring; 20. First sealing plate; 21. Second sealing plate; 22. Drain pipe. Detailed Implementation
[0013] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0014] Please see Figures 1-7 The present invention provides a technical solution: an anti-condensation high voltage switchgear, including a switchgear body 1, and a movable frame 2 slidably disposed on the inner wall of the switchgear body 1, wherein a semiconductor cooling chip 3 is installed in the movable frame 2, wherein the semiconductor cooling chip 3 works by relying on the Peltier effect, and after being powered on, a cold end and a hot end are formed on both sides of the semiconductor cooling chip 3 respectively. The cold end can absorb heat to achieve cooling, and the hot end continuously releases heat to the outside. A circulating fan 4 is installed on the movable frame 2. The circulating fan 4 is located at the cold end of the thermoelectric cooler 3. An air duct assembly 5 and a drive component 6 are installed on the main body 1 of the switch cabinet. The drive component 6 is linked and cooperates with the movable frame 2 and the air duct assembly 5. The drive component 6 can drive the movable frame 2 to slide so that the hot end of the thermoelectric cooler 3 can switch between the storage position inside the cabinet and the heat dissipation position outside the cabinet. Duct assembly 5 has two airflow modes: Dehumidification mode: The hot end is stored in the cabinet, the air duct assembly 5 forms a series air duct, and the circulating fan 4 drives the air in the cabinet to flow through the cold end and the hot end in turn. Water vapor condenses and precipitates at the cold end, and the airflow returns to the main body of the switch cabinet 1 after being reheated at the hot end. Heat dissipation mode: The hot end extends out of the outside of the switch cabinet body 1, the air duct assembly 5 cuts off the airflow channel to the hot end, and the circulating fan 4 drives the air in the cabinet to flow only through the cold end to absorb and dissipate heat.
[0015] In summary, this device adopts a single semiconductor cooling structure combined with a switchable air duct and a linked telescopic heat dissipation structure, integrating the dual functions of dehumidification and anti-condensation and heat dissipation of the main switch cabinet 1, replacing the traditional two independent equipment, effectively saving installation space inside the cabinet, reducing costs and maintenance pressure; This device can automatically switch working modes according to the temperature and humidity inside the cabinet. In dehumidification mode, the air duct structure with condensation at the cold end and reheating at the hot end efficiently removes water and avoids secondary condensation caused by low-temperature airflow. In heat dissipation mode, the hot end is moved outside the cabinet to dissipate heat and quickly reduce the temperature inside the cabinet. The overall structure is simple and compact with strong adaptability to working conditions. It solves the defects of traditional dehumidification equipment, such as single function, easy temperature rise at high temperatures, and poor dehumidification effect, and significantly improves the safety and stability of high-voltage switchgear operation.
[0016] The air duct assembly 5 includes a first U-shaped plate 7 fixedly connected to one side of the movable frame 2, an installation ring 8 being conductively connected to the first U-shaped plate 7, a circulating fan 4 being assembled inside the installation ring 8, a second U-shaped plate 9 fixedly connected to the other side of the movable frame 2, and a water collection air duct shell 10 fixedly connected to the inner wall of the switch cabinet body 1, and an L-shaped exhaust pipe 11 fixedly connected to the inner wall of the switch cabinet body 1. In dehumidification mode, one end of the L-shaped exhaust pipe 11 is connected to the top of the second U-shaped plate 9 for airflow, and the water collection duct housing 10 is simultaneously connected to the bottom of the first U-shaped plate 7 and the bottom of the second U-shaped plate 9 for airflow, so that the air inside the cabinet can flow through the cold end and the hot end of the semiconductor cooling chip 3 in sequence and then flow back to the interior of the switch cabinet body 1.
[0017] The driving component 6 of this device includes a guide rod 12, a sliding sleeve 13, and an electric push rod 14. The guide rod 12 is fixedly connected to the inner wall of the switch cabinet body 1, the sliding sleeve 13 is fixedly connected to the first U-shaped plate 7, and the guide rod 12 and the sliding sleeve 13 are slidably connected to realize the movement guidance and limitation of the moving frame 2. The electric push rod 14 is fixedly connected to the inner wall of the switch cabinet body 1, and the extended end of the electric push rod 14 is fixedly connected to the mounting ring 8. The main body 1 of the switch cabinet has a through groove 15, and the second U-shaped plate 9 slides in the through groove 15; when the electric push rod 14 drives the moving frame 2 to move, it can drive the second U-shaped plate 9 through the through groove 15 and extend to the outside of the main body 1 of the switch cabinet. In the heat dissipation mode, the second U-shaped plate 9 is located outside the main body 1 of the switch cabinet, one end of the L-shaped exhaust pipe 11 is connected to the top of the first U-shaped plate 7 for airflow, and the water collection duct housing 10 is only connected to the bottom of the first U-shaped plate 7 for airflow. The air inside the cabinet only flows through the cold end of the semiconductor cooling chip 3 and then flows back to the interior of the main body 1 of the switch cabinet.
[0018] Both the cold end and the hot end of the semiconductor cooling chip 3 are equipped with heat dissipation fins 16; The second U-shaped plate 9 is a split structure, including two L-shaped plates 17. One end of the L-shaped plate 17 is rotatably connected to a first rotating shaft 18. The first rotating shaft 18 is fixed on the movable frame 2. A torsion spring 19 is sleeved on the first rotating shaft 18. The two ends of the torsion spring 19 are fixedly connected to the first rotating shaft 18 and the L-shaped plate 17, respectively. In the heat dissipation mode, the two L-shaped plates 17 extend to the outside of the switch cabinet body 1 and remain open. When the electric push rod 14 drives the moving frame 2 to retract the two L-shaped plates 17 inward, the two L-shaped plates 17 are deflected and aligned with each other by the limit blocking of the side wall of the through groove 15 of the switch cabinet body 1, splicing together to form a complete second U-shaped plate 9. At the same time, the torsion spring 19 is subjected to torsion and stores energy. When extending outward, the torsion spring 19 releases its elastic force to drive the two L-shaped plates 17 to reopen.
[0019] One end of the L-shaped exhaust pipe 11 is fixedly connected to the first sealing plate 20. In dehumidification mode, the first sealing plate 20 closes the top opening of the first U-shaped plate 7. The bottom end of the first U-shaped plate 7 is fixedly connected to the second sealing plate 21. In the heat dissipation mode, the second sealing plate 21 seals the exposed part of the water collection duct housing 10.
[0020] A drain pipe 22 is connected to the bottom of the water collection duct housing 10 to discharge the condensate water collected inside the housing to the outside.
[0021] When the device is in operation, the thermoelectric cooler 3 is energized, and based on the Peltier effect, its two ends form a cold end and a hot end, respectively. Both the cold end and the hot end have heat exchange efficiency improved by heat dissipation fins 16. The device uses an electric push rod 14 to drive the moving frame 2 to slide along the guide rod 12, thereby switching the position of the hot end of the thermoelectric cooler 3. In conjunction with the opening and closing actions of the air duct assembly 5, the sealing structure, and the split second U-shaped plate 9, the device automatically switches between dehumidification mode and heat dissipation mode. In dehumidification mode, the electric push rod 14 drives the moving frame 2 to retract, and the second U-shaped plate 9 is limited by the through groove 15 to form an integral structure. The first sealing plate 20 seals the top opening of the first U-shaped plate 7. The water collection duct shell 10, the first U-shaped plate 7, and the second U-shaped plate 9 form a complete series air duct. The circulating fan 4 drives the air in the cabinet to flow through the cold end and the hot end in sequence. The water vapor in the air condenses and precipitates at the cold end. The condensed water is collected in the water collection duct shell 10 and discharged outside the cabinet through the drain pipe 22. The cooled airflow is reheated at the hot end and then flows back to the switch cabinet body 1 to achieve dehumidification and prevent condensation. In the heat dissipation mode, the electric push rod 14 pushes the moving frame 2 outward, so that the second U-shaped plate 9 extends out of the through slot 15 of the switch cabinet body 1. The two L-shaped plates 17 automatically open under the elastic force of the torsion spring 19, increasing the heat dissipation area of the hot end to the outside. At the same time, the second sealing plate 21 closes the passage between the water collection air duct shell 10 and the switch cabinet body 1. The fan only drives the air inside the cabinet to flow through the cold end for heat absorption and heat exchange, and dissipates the heat inside the cabinet to the outside of the switch cabinet body 1 through the exposed hot end, thereby achieving internal cooling of the switch cabinet body 1.
[0022] A method for preventing condensation in a high-voltage switchgear includes the following steps: S1 Dehumidification Mode: The electric push rod 14 drives the moving frame 2 to retract, and the semiconductor cooling chip 3 is stored in the cabinet. The split second U-shaped plate 9 is closed and formed by the through groove 15. The air duct assembly 5 forms a series air duct, and the air in the cabinet flows through the cold end and hot end of the cooling chip in sequence. Water vapor condenses at the cold end and is discharged through the drain pipe 22. The low-temperature airflow is reheated at the hot end and then flows back to the main body of the switch cabinet 1 to achieve dehumidification and prevent condensation. S2, Heat dissipation mode: The electric push rod 14 pushes the moving frame 2 to move outward, the hot end of the cooling chip extends outward from the outside of the switch cabinet body 1, and the two L-shaped plates 17 of the second U-shaped plate 9 open to dissipate heat under the action of the torsion spring 19; the air duct switches the passage and blocks the hot end side passage, the air in the cabinet only flows through the cold end to absorb heat, and the heat in the cabinet is dissipated to the outside of the cabinet through the external hot end, so as to achieve the cooling and heat dissipation of the switch cabinet body 1.
[0023] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.
[0024] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention.
Claims
1. A high-voltage switchgear with anti-condensation features, comprising a switchgear body (1), characterized in that, Also includes: The movable frame (2) is slidably set on the inner wall of the switch cabinet body (1), and a semiconductor cooling chip (3) is installed inside the movable frame (2). A circulating fan (4) is mounted on the movable frame (2) and located at the cold end of the semiconductor cooling chip (3); The air duct assembly (5) is installed on the main body (1) of the switch cabinet; The drive unit (6) is installed on the inner wall of the switch cabinet body (1). The drive unit (6) works in conjunction with the moving frame (2) and the air duct assembly (5). The drive unit (6) can drive the moving frame (2) to slide so that the hot end of the semiconductor cooling chip (3) can switch between the storage position inside the cabinet and the heat dissipation position outside the cabinet. The air duct assembly (5) has two airflow modes: Dehumidification mode: The hot end is stored in the cabinet, the air duct assembly (5) forms a series air duct, and the circulating fan (4) drives the air in the cabinet to flow through the cold end and the hot end in turn. Water vapor condenses and precipitates at the cold end, and the airflow returns to the main body of the switch cabinet (1) after being reheated at the hot end. Heat dissipation mode: The hot end extends out of the switch cabinet body (1), the air duct assembly (5) cuts off the airflow channel to the hot end, and the circulating fan (4) drives the air in the cabinet to flow only through the cold end to absorb heat and dissipate heat.
2. The anti-condensation high-voltage switchgear according to claim 1, characterized in that: The air duct assembly (5) includes a first U-shaped plate (7) fixedly connected to one side of the movable frame (2), an installation ring (8) is conductively connected to the first U-shaped plate (7), the circulating fan (4) is assembled in the installation ring (8), a second U-shaped plate (9) is fixedly connected to the other side of the movable frame (2), and a water collection air duct shell (10) is fixedly connected to the inner wall of the switch cabinet body (1), and an L-shaped exhaust pipe (11) is fixedly connected to the inner wall of the switch cabinet body (1). In dehumidification mode, one end of the L-shaped exhaust pipe (11) is connected to the top of the second U-shaped plate (9) for airflow, and the water collection duct housing (10) is connected to the bottom of the first U-shaped plate (7) and the bottom of the second U-shaped plate (9) for airflow, so that the air inside the cabinet can flow through the cold end and the hot end of the semiconductor cooling chip (3) in sequence and then flow back to the inside of the switch cabinet body (1).
3. The anti-condensation high-voltage switchgear according to claim 2, characterized in that: The driving component (6) includes a guide rod (12), a sliding sleeve (13), and an electric push rod (14). The guide rod (12) is fixedly connected to the inner wall of the switch cabinet body (1), the sliding sleeve (13) is fixedly connected to the first U-shaped plate (7), and the guide rod (12) and the sliding sleeve (13) are slidably connected to realize the movement guidance and limit of the moving frame (2). The electric push rod (14) is fixedly connected to the inner wall of the switch cabinet body (1), and the extended end of the electric push rod (14) is fixedly connected to the mounting ring (8). The main body (1) of the switch cabinet is provided with a through groove (15), and the second U-shaped plate (9) slides in cooperation with the through groove (15); when the electric push rod (14) drives the moving frame (2) to move, it can drive the second U-shaped plate (9) to pass through the through groove (15) and extend to the outside of the main body (1) of the switch cabinet. In the heat dissipation mode, the second U-shaped plate (9) is located outside the main body (1) of the switch cabinet. One end of the L-shaped exhaust pipe (11) is connected to the top of the first U-shaped plate (7) for airflow. The water collection duct housing (10) is only connected to the bottom of the first U-shaped plate (7) for airflow. The air inside the cabinet flows only through the cold end of the semiconductor cooling chip (3) and then flows back to the inside of the main body (1) of the switch cabinet.
4. The anti-condensation high-voltage switchgear according to claim 3, characterized in that: The semiconductor cooling chip (3) is equipped with heat dissipation fins (16) at both the cold end and the hot end. The second U-shaped plate (9) is a split structure, including two L-shaped plates (17). One end of the L-shaped plate (17) is rotatably connected to a first rotating shaft (18). The first rotating shaft (18) is fixed on the moving frame (2). A torsion spring (19) is sleeved on the first rotating shaft (18). The two ends of the torsion spring (19) are fixedly connected to the first rotating shaft (18) and the L-shaped plate (17) respectively. In the heat dissipation mode, the two L-shaped plates (17) extend to the outside of the switch cabinet body (1) and remain open. When the electric push rod (14) drives the moving frame (2) to retract the two L-shaped plates (17) inward, the two L-shaped plates (17) are deflected and aligned with each other by the limit blocking of the side wall of the through groove (15) of the switch cabinet body (1), splicing together to form a complete second U-shaped plate (9). At the same time, the torsion spring (19) is subjected to torsion to store energy.
5. The anti-condensation high-voltage switchgear according to claim 4, characterized in that: One end of the L-shaped exhaust pipe (11) is fixedly connected to a first sealing plate (20). In dehumidification mode, the first sealing plate (20) closes the top opening of the first U-shaped plate (7). The bottom end of the first U-shaped plate (7) is fixedly connected to a second sealing plate (21). In the heat dissipation mode, the second sealing plate (21) seals the passage between the water collection duct housing (10) and the switch cabinet body (1).
6. The anti-condensation high-voltage switchgear according to claim 5, characterized in that: The bottom of the water collection duct housing (10) is connected to a drain pipe (22) for discharging the condensate collected inside the housing to the outside.
7. A method for preventing condensation in a high-voltage switchgear, utilizing the high-voltage switchgear for preventing condensation as described in any one of claims 1-6, characterized in that: Includes the following steps: S1, Dehumidification mode: The electric push rod (14) drives the moving frame (2) to retract, and the semiconductor cooling chip (3) is stored in the cabinet. The split second U-shaped plate (9) is closed and formed by the through groove (15). The air duct assembly (5) forms a series air duct, and the air in the cabinet flows through the cold end and hot end of the cooling chip in sequence. Water vapor condenses at the cold end and is discharged through the drain pipe (22). The low temperature airflow is reheated at the hot end and flows back to the main body of the switch cabinet (1) to achieve dehumidification and prevent condensation. S2, Heat dissipation mode: The electric push rod (14) pushes the moving frame (2) to move outward, the hot end of the cooling chip extends outward from the outside of the switch cabinet body (1), and the two L-shaped plates (17) of the second U-shaped plate (9) open to dissipate heat under the action of the torsion spring (19); the air duct switches the passage and blocks the hot end side passage, the air in the cabinet only flows through the cold end to absorb heat, and the heat in the cabinet is dissipated to the outside of the cabinet through the external hot end, so as to achieve the cooling and heat dissipation of the switch cabinet body (1).