A high-frequency circuit board mixed pressing process based on PTFE and FR-4 material and a pressing device thereof
Patent Information
- Application Number
- CN202611239601.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-08-17
- Publication Date
- 2026-11-03
AI Technical Summary
In existing mixing and pressing devices, the positioning structure is prone to causing tearing of the positioning holes of the sheet metal, warping of the sheet surface, and delamination between layers. Furthermore, the sheet metal is difficult to demold after pressing, which can easily cause deformation and scratches on the sheet metal.
The system employs a single cam and a fixed plate linkage structure to drive the limit pin to rise and fall synchronously. Combined with the dual air path structure of air blowing on the plate array and air blowing on the positioning hole slope, it achieves synchronous linkage between limit pin retraction and high-pressure air blowing, breaking resin adhesion and negative pressure adsorption. An electric push rod adjustment component is added to adapt to different plate thicknesses.
It improves the alignment accuracy of PTFE and FR-4 heterogeneous boards during mixed pressing, reduces misalignment of finished products, prevents board deformation and scratches, solves the problem of difficult demolding after pressing, and is suitable for the production of multi-specification high-frequency mixed-press circuit boards.
Smart Images
Figure CN123035627A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of circuit board mixing and pressing, specifically a high-frequency circuit board mixing and pressing process and its pressing device based on PTFE and FR-4 materials. Background Technology
[0002] High-frequency and high-speed circuit boards are the core substrates for 5G communication, radio frequency antennas, and high-speed server circuits. Among them, PTFE material has high-frequency characteristics such as stable dielectric constant, extremely low dielectric loss, and excellent temperature resistance, making it the preferred material for high-frequency signal transmission. FR-4 core board has high mechanical strength, good dimensional stability, and high cost performance, making it suitable as a structural support base layer. In industrial production, PTFE high-frequency sheet material and FR-4 core board are often mixed and laminated to balance high-frequency electrical performance and structural mechanical performance.
[0003] In existing mixing and pressing devices, the positioning structure mostly uses fixed pins for positioning. After pressing, the molten semi-cured resin easily adheres to the gap between the limiting pin and the positioning hole of the plate. After cooling and solidification, it forms a hard bond. When the limiting pin retracts, it easily drags the plate, causing the positioning hole to tear, the plate surface to warp, and the layers to delaminate. Secondly, after the plate is pressed and cooled at high temperature, a negative pressure adsorption is easily formed between the plate surface and the lower pressure plate, making it difficult to demold the plate. Manual removal of the plate can easily cause deformation and scratches to the plate. Summary of the Invention
[0004] The purpose of this invention is to provide a high-frequency circuit board mixing and pressing process and its pressing device based on PTFE and FR-4 materials, so as to solve the problems in the prior art.
[0005] The objective of this invention can be achieved through the following technical solutions: A high-frequency circuit board pressing device based on PTFE and FR-4 materials includes an operating table. An upper pressure plate is provided on the upper side of the middle part of the operating table, and a lower pressure plate is provided vertically below the upper pressure plate. The lower pressure plate is fixedly installed in the middle of the operating table. Through holes are opened at the four corners of the lower pressure plate. Limit pins are slidably provided inside the through holes, and lifting components are provided on the lower side of the limit pins. The lifting assembly includes a fixed plate with four limit pins fixedly connected to its lower ends. A spring is sleeved on the lower side of the limit pin. The top of the spring is fixedly connected to the lower pressure plate, and the bottom of the spring is fixedly connected to the fixed plate. A dust cover is provided on the outside of the spring. The upper and lower ends of the dust cover are fixedly connected to the lower pressure plate and the fixed plate, respectively. A sliding block is integrally provided on the front and rear sides of the middle of the fixed plate. A sliding groove is slidably connected to the outside of the sliding block. The sliding groove is opened inside the support plate. The support plate is L-shaped. A cam is slidably contacted on the lower side of the middle of the fixed plate. A connecting shaft is fixedly connected through the lower end of the cam. The front and rear ends of the connecting shaft are inserted through and rotatably connected to the support plate. A motor is fixedly connected to the rear end of the connecting shaft. The motor is fixedly installed on the rear side of the support plate. The fixed plate is symmetrically provided with baffles at the front and back, and rubber pads are provided at the upper end of the baffles. The baffles are fixedly installed on the front and back sides inside the support plate.
[0006] Preferably, the upper part of the upper pressure plate is fixedly connected to the output end of a hydraulic cylinder, and the side of the hydraulic cylinder away from the output end is fixedly connected to an L-shaped bracket fixedly installed at the rear of the middle of the operating table. The upper pressure plate has round holes at its four corners, and guide columns are slidably connected inside the round holes. The lower end of the guide column is fixedly connected to the operating table, and the guide column is located on the outer side of the four corners of the lower pressure plate.
[0007] Preferably, the upper end of the lower pressure plate is stacked with FR-4 core board and PTFE high-frequency board in sequence from bottom to top. The four corners of the FR-4 core board and PTFE high-frequency board are provided with positioning holes that are adapted to the limiting pins. The positioning holes are inserted and connected to the limiting pins.
[0008] Preferably, the support plate has symmetrically arranged adjustment components in the middle. The adjustment components include symmetrically opened sliding grooves inside the support plate. The sliding grooves are located outside the sliding grooves. A connecting column is slidably arranged through the sliding grooves. An adjustment block is fixedly installed at the inner end of the connecting column. The adjustment block is located above the sliding block. The lower outer end of the connecting column is fixedly connected to the output end of an electric push rod. The side of the electric push rod away from the output end is fixedly connected to the operating table.
[0009] Preferably, the lower pressure plate is provided with an air blowing assembly, which includes an array of air blowing ports inside the lower pressure plate. An air blowing chamber is fixedly provided on the lower side of the lower pressure plate, and the air blowing chamber is connected to the air blowing ports. The upper end of the support plate is fixedly connected to the lower end of the air blowing chamber.
[0010] Preferably, a filter screen is fixedly installed at the upper end of the air blowing chamber, the upper end of the filter screen is tightly attached to the bottom of the air blowing port, a connection hole is opened in the middle of the bottom side of the air blowing chamber, an air blowing pipe is fixedly connected to the bottom of the connection hole, and an air compressor is fixedly connected to the right side of the air blowing pipe.
[0011] Preferably, the through hole is provided with an anti-adhesion component. The anti-adhesion component includes an annular cavity in the middle of the through hole. Multiple sets of sloping air holes are equally spaced on the inner wall of the annular cavity. The air holes are arranged with the inner side higher than the outer side. A retaining ring edge is provided on the upper inner side of the air hole. The retaining ring edge is fixedly provided on the inner wall of the through hole.
[0012] Preferably, an air inlet pipe is fixedly connected to the inner side of each annular cavity, and the left side of the air inlet pipe is fixedly connected to the blowing cavity.
[0013] A high-frequency circuit board cross-lamination process based on PTFE and FR-4 materials includes the following steps: S1. Limit pin extension limit: The start motor drives the cam to rotate, the cam pushes the fixed plate to rise, and the fixed plate drives the four limit pins to rise synchronously and extend out of the bearing surface of the lower pressure plate. S2, Stacking and Loading: The FR-4 core board, adhesive sheet and PTFE high-frequency board are stacked from bottom to top to form a circuit board stack. The FR-4 core board with stable rigid dimensions is attached to the lower pressure plate, which has stronger deformation adaptability. The PTFE high-frequency board is arranged on the upper layer. The circuit board stack is placed on the bearing surface of the lower pressure plate. The positioning holes at the four corners of the circuit board stack are aligned with the limit pins at the four corners of the lower pressure plate. The limit pins are inserted into the positioning holes of the circuit board stack to complete the positioning. S3. High-temperature pressing and curing: Start the hydraulic cylinder to drive the upper pressure plate down along the guide column, apply pressure to the circuit board stack, so that the PTFE high-frequency board and FR-4 core board can be cured and bonded under the set temperature and pressure. S4. Mold opening, pressure relief and cooling: After the pressure holding is completed, the hydraulic cylinder drives the upper pressure plate to move upward along the guide column, so that the upper pressure plate is separated from the upper surface of the circuit board stack, allowing the circuit board to cool and form naturally. S5, Limit pin descent and reset: The motor drives the cam to rotate in reverse, the cam's protruding part rotates away from the fixed plate, the spring releases the elastic force to drive the fixed plate to descend, the fixed plate drives the four limit pins to descend synchronously and retract below the bearing surface of the lower pressure plate, and the limit pins disengage from the positioning holes of the circuit board stack. As the limit pin descends, the air compressor is activated. Compressed air enters the air blowing chamber through the air blowing pipe, and after being evenly distributed by the air blowing chamber, it is blown upward from multiple air blowing ports on the bearing surface of the lower pressure plate. The upward injection of compressed air, in conjunction with the descent of the limit pin, can lift the entire circuit board stack away from the bearing surface of the lower pressure plate, allowing the high-frequency circuit board that has been pressed to be removed. Next, the airflow fills the tiny gap between the limit pin and the positioning hole of the board, breaking the resin adhesion and negative pressure adsorption.
[0014] S6. Material Inspection: Remove the PTFE and FR-4 composite high-frequency circuit board after lamination, and inspect its appearance flatness, delamination, bubbles, and electrical performance to complete the lamination operation.
[0015] The beneficial effects of this invention are: 1. This invention adopts a single cam combined with a fixed plate linkage structure, which can drive four limit pins to rise and fall synchronously. With the vertical guidance constraint of the sliding block and the sliding groove, the verticality and synchronicity of the rise and fall of the limit pins are guaranteed, avoiding the offset of multi-layer plates, effectively improving the alignment accuracy of PTFE and FR-4 heterogeneous plates mixed pressing, and reducing the deviation of finished products.
[0016] 2. This invention features a dual-air-path structure with air blowing on the plate surface array and air blowing on the inclined slope of the positioning hole. It also adopts a synchronous linkage control method of limit pin retraction and high-pressure air blowing. Air blowing on the plate surface breaks the large-area negative pressure adsorption between the plate and the lower pressure plate to achieve air-floating support plate. The inclined airflow of the positioning hole accurately rushes into the gap to break the resin adhesion. It solves the problem of difficult demolding after pressing from both the plate surface and the positioning hole, and prevents the plate from deforming, scratching and tearing of the positioning hole when removing the plate.
[0017] 3. The present invention adds an adjustment component driven by an electric push rod, which can precisely adjust the extension height of the limit pin according to different board thicknesses and different stacking layers, adapting to the production of high-frequency mixed-voltage circuit boards of various specifications, and breaking through the limitations of fixed positioning dimensions and poor adaptability of traditional equipment. Attached Figure Description
[0018] The invention will now be further described with reference to the accompanying drawings.
[0019] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the disassembled structure of the PTFE high-frequency sheet, FR-4 core board, and lower pressure plate of the present invention; Figure 3 This is a cross-sectional view of the overall structure of the present invention; Figure 4 This is a schematic diagram of the lifting component structure of the present invention; Figure 5 This is a cross-sectional view of the lifting assembly of the present invention; Figure 6 This is the invention Figure 5 Enlarged view of point A in the middle; Figure 7 This is a schematic diagram of the air blowing assembly structure of the present invention; Figure 8 This is a schematic diagram of the anti-adhesion component structure of the present invention; Explanation of reference numerals in the attached drawings: 1. Operating platform; 2. Upper pressure plate; 3. Hydraulic cylinder; 4. Guide column; 5. Lower pressure plate; 6. Through hole; 7. Limit pin; 8. PTFE high-frequency sheet; 81. FR-4 core board; 9. Lifting assembly; 91. Fixed plate; 92. Spring; 93. Dust cover; 94. Sliding block; 95. Support plate; 96. Sliding groove; 97. Cam; 98. Connecting shaft; 99. Motor; 10. Adjusting assembly; 101. Adjusting block; 102. Connecting column; 103. Sliding groove; 104. Electric push rod; 11. Baffle; 12. Air blowing assembly; 121. Air blowing port; 122. Air blowing chamber; 123. Filter screen; 124. Air blowing pipe; 125. Air compressor; 13. Anti-sticking assembly; 131. Annular cavity; 132. Air blowing hole; 133. Air inlet pipe; 134. Retaining ring edge. Detailed Implementation
[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0021] A high-frequency circuit board lamination device based on PTFE and FR-4 materials, such as Figures 1-8 As shown, the system includes an operating platform 1. An upper pressure plate 2 is provided on the upper side of the middle part of the operating platform 1. A lower pressure plate 5 is provided vertically below the upper pressure plate 2. The lower pressure plate 5 is fixedly installed in the middle part of the operating platform 1. The output end of a hydraulic cylinder 3 (model HOB-125×250-FA) is fixedly connected to the upper side of the middle part of the upper pressure plate 2. The side of the hydraulic cylinder 3 away from the output end is fixedly connected to an L-shaped bracket fixedly provided on the rear side of the middle part of the operating platform 1. Circular holes are opened at the four corners of the upper pressure plate 2. Guide columns 4 are slidably fitted in the circular holes. The lower end of the guide columns 4 is fixedly connected to the operating platform 1. The hydraulic cylinder 3 drives the upper pressure plate 2 to slide up and down along the guide columns 4. The guide columns 4 ensure the horizontality and positional accuracy of the upper pressure plate 2 during the downward pressing process. The lower pressure plate 5 is a rectangular flat plate with vertical through holes 6 at its four corners. Each through hole 6 has a limit pin 7 that slides inside it. The bottom of the lower pressure plate 5 is equipped with a lifting assembly 9, which drives the four limit pins 7 to lift synchronously. The lifting assembly 9 includes a fixed plate 91 with the lower ends of four limit pins 7 fixedly connected. The fixed plate 91 is horizontally arranged below the lower pressure plate 5 and parallel to the lower pressure plate 5. A spring 92 is sleeved on the part of each limit pin 7 between the bottom surface of the lower pressure plate 5 and the upper surface of the fixed plate 91. The top of the spring 92 is fixedly connected to the bottom surface of the lower pressure plate 5 and the bottom is fixedly connected to the upper surface of the fixed plate 91. A retractable dust cover 93 is provided on the outside of the spring 92. The upper and lower ends of the dust cover 93 are fixedly connected to the bottom surface of the lower pressure plate 5 and the upper surface of the fixed plate 91, respectively, to prevent dust and resin debris from entering the spring 92 area. The fixed plate 91 has sliding blocks 94 integrally provided on the front and rear sides of the middle section. The support plate 95 has an L-shaped structure and a vertically extending sliding groove 96 is provided on its vertical part. The sliding blocks 94 are slidably disposed in the sliding groove 96, providing guidance and constraint for the lifting and lowering movement of the fixed plate 91, and ensuring the synchronicity and verticality of the lifting and lowering of the four limit pins 7. The lower middle part of the fixed plate 91 slides in contact with the outer peripheral surface of the cam 97. The cam 97 is fixedly mounted on the connecting shaft 98. The front and rear ends of the connecting shaft 98 are inserted and rotatably connected to the vertical part of the support plate 95 through bearings. The rear end of the connecting shaft 98 extends out of the support plate 95 and is fixedly connected to the output shaft of the motor 99 (model 4IK25GN-C+4GN30K). The motor 99 is fixedly mounted on the rear side of the support plate 95 through a bracket. A baffle 11 is symmetrically arranged at the bottom of the fixed plate 91. The baffle 11 is fixedly arranged on the front and rear sides inside the support plate 95. A rubber pad is provided on the upper surface of the baffle 11. When the fixed plate 91 descends, it prevents the fixed plate 91 from descending too far and hitting the bottom of the support plate 95. At the same time, the rubber pad can absorb the impact energy and reduce vibration and noise. In addition, the lower pressure plate 5 is provided with an air blowing assembly 12, including multiple air blowing ports 121 on the bearing surface (upper surface) of the lower pressure plate 5. The multiple air blowing ports 121 are evenly distributed in a rectangular array on the bearing surface, avoiding the through holes 6 at the four corners. An air blowing chamber 122 is fixedly installed at the bottom of the lower pressure plate 5. The air blowing chamber 122 is sealed to the bottom surface of the lower pressure plate 5. The lower ends of all the air blowing ports 121 on the lower pressure plate 5 are open to the bottom surface of the lower pressure plate 5, and the air blowing chamber 122 is connected to all the air blowing ports 121. The upper end of the support plate 95 is fixedly connected to the lower end of the air blowing chamber 122, forming a fixed connection chain of support plate 95, air blowing chamber 122 and lower pressure plate 5, so that the entire lower pressure plate assembly is fixedly connected to the operating table 1. A filter screen 123 is fixedly installed at the upper end of the air blowing chamber 122. The upper end surface of the filter screen 123 is tightly attached to the bottom surface of the lower pressure plate 5, covering the lower opening of all air blowing ports 121. The filter screen 123 is used to filter dust and impurities in compressed air, prevent the air blowing ports 121 from being blocked, and prevent resin debris that may be generated during the pressing process from entering the air blowing chamber 122. A connection hole is provided in the middle of the bottom side of the air blowing chamber 122. The bottom of the connection hole is fixedly connected to the air blowing pipe 124 through a pipe joint. The air outlet of the air compressor 125 (model OTS-750) is fixedly connected to the right side of the air blowing pipe 124. The through hole 6 is also provided with an anti-adhesion component 13, including an annular cavity 131 opened on the inner wall of the middle part of the through hole 6. The inner diameter of the annular cavity 131 is larger than the inner diameter of the through hole 6, forming an annular cavity inside the through hole 6. Multiple sets of air blowing holes 132 are evenly opened on the inner wall of the annular cavity 131. The air blowing holes 132 are arranged in a sloping manner, that is, the axis of the air blowing holes 132 is inclined from the lower outside to the upper inside, so that the direction of the blown gas is pointing to the upper axis of the through hole 6, which facilitates the airflow to the tiny gap between the limiting pin 7 and the positioning hole of the plate. A retaining ring edge 134 is provided on the upper inner side of the air blowing hole 132. The retaining ring edge 134 is fixedly set on the inner wall of the through hole 6 to prevent resin from flowing into the air blowing hole 132 and blocking it during the pressing process. Each annular cavity 131 is fixedly connected to an air inlet pipe 133 on its inner side. The left side of the air inlet pipe 133 is fixedly connected to the side wall of the air blowing cavity 122 and communicates with the inside of the air blowing cavity 122. When the air compressor 125 is working, part of the compressed air enters the annular cavity 131 through the air inlet pipe 133 and is blown out from the air blowing hole 132. Secondly, an adjustment component 10 is symmetrically arranged in the middle of the support plate 95. The adjustment component 10 includes a sliding groove 103 symmetrically opened in the middle of the support plate 95. The sliding groove 103 is located on the outer side of the sliding groove 96. A connecting column 102 is slidably arranged through the inside of the sliding groove 103. An adjustment block 101 is fixedly installed on the inner end of the connecting column 102 (the end facing the fixed plate 91). The adjustment block 101 is located above the sliding block 94. The lower outer end of the connecting column 102 is fixedly connected to the output end of the electric push rod 104 (model DTL-100-500). The cylinder of the electric push rod 104 is fixedly connected to the operating table 1. When the synchronous controller synchronously drives the electric push rod 104, its output end can push the connecting column 102 to drive the adjustment block 101 to move vertically and adjust, thereby limiting the rising height of the fixed plate 91. The position of the limit pin 7 can be adjusted according to the stacked plates of different thicknesses.
[0022] A high-frequency circuit board mixing process based on PTFE and FR-4 materials, the mixing process includes the following steps: S1. Limit pin 7 extends to the limit: Start motor 99, motor 99 drives connecting shaft 98 to rotate, connecting shaft 98 drives cam 97 to rotate synchronously, cam 97 rotates from the initial phase to the lift phase, its protruding part gradually contacts and pushes the fixed plate 91 upward. The fixed plate 91 rises vertically under the guidance of sliding block 94 and sliding groove 96, driving the four limit pins 7 to rise synchronously. The top of the limit pin 7 extends from the bearing surface of the lower pressure plate 5. The extension height is set according to the thickness of the plate to be pressed. At this time, spring 92 is compressed and stores elastic potential energy. S2, Stacking and loading: The FR-4 core board 81, adhesive sheet (precured sheet, PP sheet) and PTFE high-frequency board 8 are stacked from bottom to top to form a circuit board stack. The FR-4 core board 81 serves as the bottom layer and the bearing surface of the lower pressure plate 5. The rigidity and dimensional stability of the FR-4 material provide a flat base for the entire stack. The PTFE high-frequency board 8 serves as the upper layer. Taking advantage of its high-frequency performance, each layer has positioning holes at the four corners that are compatible with the diameter of the limiting pin 7. The entire circuit board stack is placed on the bearing surface of the lower pressure plate 5, so that the positioning holes at the four corners are aligned with the corresponding limit pins 7. The limit pins 7 pass through the positioning holes to complete the precise positioning of the stack in the horizontal direction. At this time, the PTFE high-frequency board 8 faces upward and the FR-4 core board 81 faces downward. S3. High-Temperature Pressing and Curing: Start hydraulic cylinder 3. Hydraulic cylinder 3 drives upper pressure plate 2 to descend vertically along guide column 4. Upper pressure plate 2 gradually contacts and presses against the upper surface of the circuit board stack (i.e., the upper surface of PTFE high-frequency sheet 8), applying a set pressing force. The magnitude of the pressing force is determined according to the thickness and number of layers of the sheet. Simultaneously, the circuit board stack is heated by the heating system inside upper pressure plate 2 and lower pressure plate 5 (not shown in the figure) to bring the pressing temperature to the curing temperature range of PTFE and FR-4. The temperature and pressure are maintained for a certain time (specifically determined according to the characteristics of the sheet and adhesive sheet), allowing the resin in the adhesive sheet to melt, flow, and fill the gaps between layers. Subsequently, the resin undergoes a cross-linking and curing reaction, firmly bonding the FR-4 core board 81 and the PTFE high-frequency sheet 8 into one unit. S4. Mold opening, pressure relief and cooling: After the pressure holding and curing time is reached, heating is stopped first. Then, the hydraulic cylinder 3 drives the upper pressure plate 2 to move upward along the guide column 4 in the reverse direction, so that the upper pressure plate 2 is separated from the upper surface of the circuit board stack. The circuit board stack is cooled to room temperature in the natural environment, or cooled with the help of a blower. During the cooling process, the PTFE layer and FR-4 layer undergo different degrees of thermal shrinkage. Due to the difference in their thermal expansion coefficients, a certain internal stress will be generated in the board. S5. Limit pin 7 descends and resets: After cooling, motor 99 drives connecting shaft 98 to continue rotating, cam 97 rotates from the lift phase to the return phase, the protruding part of cam 97 gradually moves away from the lower surface of fixed plate 91, spring 92 releases the elastic potential energy stored in compression, driving fixed plate 91 to descend vertically under the guidance of sliding block 94 and sliding groove 96. Fixed plate 91 drives four limit pins 7 to descend synchronously, the top of limit pin 7 retracts below the bearing surface of lower pressure plate 5, and limit pin 7 completely disengages from the positioning hole of circuit board stack; At this time, because the molten resin may penetrate into the tiny gap between the limiting pin 7 and the positioning hole during the high-temperature pressing process and solidify after cooling, forming a certain adhesive force, and at the same time, the PTFE sheet may generate a negative pressure adsorption effect between the bearing surface of the lower pressure plate 5 at high temperature, the circuit board stack may still be attached to the bearing surface of the lower pressure plate 5 and will not automatically detach. As the limit pin 7 descends, the air compressor 125 is activated. The high-pressure compressed air generated by the air compressor 125 enters the air blowing chamber 122 through the air blowing pipe 124. The air blowing chamber 122 serves as a uniform distribution chamber, distributing the compressed air evenly to all the air blowing ports 121 within its coverage area. The compressed air is blown upward from the air blowing ports 121, acting on the entire bottom surface of the circuit board stack, generating a uniform upward lifting force, and lifting the entire circuit board stack away from the bearing surface of the lower pressure plate 5. Meanwhile, some compressed air enters the annular cavity 131 inside each through hole 6 through the air inlet pipe 133 and is blown out from the inclined air blowing hole 132. Since the air blowing hole 132 is set with the inside higher than the outside, the airflow direction is directed above the axis of the through hole 6, which can accurately guide the compressed air into the tiny gap between the limiting pin 7 and the circuit board positioning hole. After the high-pressure airflow enters the tiny gap, it generates positive pressure on the one hand to push the circuit board upward away from the limiting pin 7, and on the other hand, blows out the residual cured resin debris in the gap to break the resin adhesion. At the same time, the compressed air enters the interface between the bottom of the board and the bearing surface, destroying the negative pressure adsorption state. S6. Unloading Inspection: Under the simultaneous action of the air flotation lifting and the limiting pin 7 descending, the entire circuit board stack is detached from the bearing surface of the lower pressure plate 5. The operator or robot can easily remove the pressed mixed circuit board and proceed to subsequent processing steps (such as appearance flatness, delamination, bubble and electrical performance testing).
[0023] Secondly, regarding the adjustment operation for different board thicknesses, when it is necessary to press circuit board layers of different thicknesses, the height of the limit pin 7 extending out of the bearing surface needs to be adjusted accordingly. This invention achieves rapid adjustment through the adjustment component 10. Specifically, the electric push rod 104 is started synchronously using the synchronous controller. The electric push rod 104 drives the connecting column 102 to slide along the slide groove 103. The connecting column 102 drives the adjustment block 101 to move vertically. When the adjustment block 101 is always above the sliding block 94, the rising height of the fixed plate 91 is limited, thereby limiting the extension height of the limit pin 7. By controlling the stroke of the electric push rod 104, the position of the adjustment block 101 can be precisely controlled, realizing stepless adjustment of the extension height of the limit pin 7.
[0024] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed invention.
Claims
1. A high-frequency circuit board lamination device based on PTFE and FR-4 materials, characterized in that, The system includes an operating table (1), an upper pressure plate (2) is provided on the upper side of the middle part of the operating table (1), a lower pressure plate (5) is provided vertically below the upper pressure plate (2), the lower pressure plate (5) is fixedly installed in the middle part of the operating table (1), and through holes (6) are provided at the four corners of the lower pressure plate (5). A limit pin (7) is slidably provided inside the through hole (6), and a lifting component (9) is provided on the lower side of the limit pin (7). The lifting assembly (9) includes a fixed plate (91) with four limiting pins (7) fixedly connected to the lower ends of each pin. A spring (92) is sleeved on the lower side of each limiting pin (7). The top of the spring (92) is fixedly connected to the lower pressure plate (5), and the bottom of the spring (92) is fixedly connected to the fixed plate (91). A dust cover (93) is provided on the outside of the spring (92). The upper and lower ends of the dust cover (93) are fixedly connected to the lower pressure plate (5) and the fixed plate (91) respectively. Sliding blocks (94) are integrally provided on the front and rear sides of the middle part of the fixed plate (91). The sliding block (94) is slidably connected to the outside of the sliding groove (96), which is opened inside the support plate (95). The support plate (95) is L-shaped. The lower middle part of the fixed plate (91) is slidably contacted by a cam (97). The lower end of the cam (97) is fixedly connected to a connecting shaft (98). The front and rear ends of the connecting shaft (98) are inserted and rotatably connected to the support plate (95). The rear end of the connecting shaft (98) is fixedly connected to a motor (99), which is fixedly installed on the rear side of the support plate (95). The fixed plate (91) is symmetrically provided with baffles (11) at the front and back. The upper end of the baffle (11) is provided with a rubber pad. The baffles (11) are fixedly provided on the front and back sides inside the support plate (95).
2. The high-frequency circuit board lamination device based on PTFE and FR-4 materials according to claim 1, characterized in that, The upper part of the upper pressure plate (2) is fixedly connected to the output end of the hydraulic cylinder (3). The side of the hydraulic cylinder (3) away from the output end is fixedly connected to the L-shaped bracket fixedly set at the rear of the middle of the operating table (1). The upper pressure plate (2) has round holes at its four corners. The guide column (4) is slidably connected inside the round hole. The lower end of the guide column (4) is fixedly connected to the operating table (1). The guide column (4) is set on the outer side of the four corners of the lower pressure plate (5).
3. The high-frequency circuit board lamination device based on PTFE and FR-4 materials according to claim 1, characterized in that, The upper end of the lower pressure plate (5) is stacked with FR-4 core board (81) and PTFE high-frequency board (8) from bottom to top. The four corners of the FR-4 core board (81) and PTFE high-frequency board (8) are provided with positioning holes that are compatible with the limiting pin (7). The positioning holes are connected to the limiting pin (7).
4. The high-frequency circuit board lamination device based on PTFE and FR-4 materials according to claim 1, characterized in that, The support plate (95) is symmetrically provided with an adjustment component (10) in the middle. The adjustment component (10) includes a sliding groove (103) symmetrically opened in the support plate (95). The sliding groove (103) is located outside the sliding groove (96). A connecting column (102) is slidably provided through the sliding groove (103). An adjustment block (101) is fixedly installed at the inner end of the connecting column (102). The adjustment block (101) is located on the upper side of the sliding block (94). The lower outer end of the connecting column (102) is fixedly connected to the output end of an electric push rod (104). The side of the electric push rod (104) away from the output end is fixedly connected to the operating table (1).
5. The high-frequency circuit board lamination device based on PTFE and FR-4 materials according to claim 1, characterized in that, The lower pressure plate (5) is provided with an air blowing assembly (12). The air blowing assembly (12) includes an array of air blowing ports (121) inside the lower pressure plate (5). An air blowing chamber (122) is fixedly provided on the lower side of the lower pressure plate (5). The air blowing chamber (122) is connected to the air blowing port (121). The upper end of the support plate (95) is fixedly connected to the lower end of the air blowing chamber (122).
6. The high-frequency circuit board lamination device based on PTFE and FR-4 materials according to claim 5, characterized in that, A filter screen (123) is fixedly installed at the upper end of the air blowing chamber (122). The upper end of the filter screen (123) is tightly attached to the bottom of the air blowing port (121). A connection hole is opened in the middle of the bottom side of the air blowing chamber (122). An air blowing pipe (124) is fixedly connected to the bottom of the connection hole. An air compressor (125) is fixedly connected to the right side of the air blowing pipe (124).
7. The high-frequency circuit board lamination device based on PTFE and FR-4 materials according to claim 1, characterized in that, An anti-adhesion component (13) is provided inside the through hole (6). The anti-adhesion component (13) includes an annular cavity (131) provided in the middle of the through hole (6). Multiple sets of sloping air holes (132) are opened at equal intervals on the inner wall of the annular cavity (131). The air holes (132) are arranged with the inner side higher than the outer side. A retaining ring edge (134) is provided on the upper inner side of the air hole (132). The retaining ring edge (134) is fixedly provided on the inner wall of the through hole (6).
8. The high-frequency circuit board lamination device based on PTFE and FR-4 materials according to claim 7, characterized in that, Each annular cavity (131) is fixedly connected to an air inlet pipe (133) on its inner side, and the left side of the air inlet pipe (133) is fixedly connected to the air blowing cavity (122).
9. A high-frequency circuit board mixed-pressing process based on PTFE and FR-4 materials according to any one of claims 1-8, characterized in that, Includes the following steps: S1, Limit pin (7) extends to the limit: Start motor (99) drives cam (97) to rotate, cam (97) pushes fixed plate (91) to rise, fixed plate (91) drives four limit pins (7) to rise synchronously and extend out of the bearing surface of lower pressure plate (5); S2, Stacking and loading: The FR-4 core board (81), adhesive sheet and PTFE high-frequency board (8) are stacked from bottom to top to form a circuit board stack, so that the rigid and dimensionally stable FR-4 core board (81) is attached to the lower pressure plate (5) and has stronger deformation adaptability. The PTFE high-frequency board (8) is located on the upper layer and the circuit board stack is placed on the bearing surface of the lower pressure plate (5). The positioning holes at the four corners of the circuit board stack are aligned with the limiting pins (7) at the four corners of the lower pressure plate (5). The limiting pins (7) are inserted into the positioning holes of the circuit board stack to complete the positioning. S3, High-temperature pressing and curing of mold: Start the hydraulic cylinder (3) to drive the upper pressure plate (2) to go down along the guide column (4) and apply pressing force to the circuit board stack, so that the PTFE high-frequency board (8) and the FR-4 core board (81) can be cured and bonded under the set temperature and set pressure. S4. Mold opening, pressure release and cooling: After the pressure holding is completed, the hydraulic cylinder (3) drives the upper pressure plate (2) to move upward along the guide column (4), so that the upper pressure plate (2) is separated from the upper surface of the circuit board stack, and the circuit board is naturally cooled and formed. S5, Limit pin (7) descends and resets: The motor (99) drives the cam (97) to rotate in reverse, the protruding part of the cam (97) rotates away from the fixed plate (91), the spring (92) releases the elastic force to drive the fixed plate (91) to descend, the fixed plate (91) drives the four limit pins (7) to descend synchronously and retract below the bearing surface of the lower pressure plate (5), and the limit pins (7) disengage from the positioning holes of the circuit board stack; As the limit pin (7) descends, the air compressor (125) is started. Compressed air enters the air blowing chamber (122) through the air blowing pipe (124). After being evenly distributed by the air blowing chamber (122), it is blown upward from multiple air blowing ports (121) on the bearing surface of the lower pressure plate (5). The upward spray of compressed air cooperates with the descent of the limit pin (7) to lift the entire circuit board stack away from the bearing surface of the lower pressure plate (5) and remove the high-frequency circuit board that has been pressed. Then, the airflow fills the tiny gap between the limit pin (7) and the positioning hole of the board to break the resin adhesion and negative pressure adsorption. 10.S6, Material Inspection: Remove the PTFE and FR-4 composite high-frequency circuit board after lamination, and inspect its appearance flatness, delamination, bubbles, and electrical performance to complete the lamination operation.