Display panel and display device

Abstract

The application discloses a display panel and a display device. The display area of the display panel comprises a first sub-display area and a second sub-display area. In the same lighting period of the display panel, the cumulative lighting time length of the first sub-display area is greater than that of the second sub-display area. The display panel further comprises a first substrate and a display function layer arranged on one side of the first substrate. A heat dissipation channel is arranged on the first substrate, and a heat exchange medium is arranged in the heat dissipation channel. The first sub-display area is provided with the heat dissipation channel. The application sets the heat dissipation channel in the high-frequency lighting area of the display panel, so as to improve the problem that the high-temperature hot spots in the partial display area of the display panel due to long-time lighting affect the display effect of the display panel.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a display panel and display device. Background Technology

[0002] Automotive displays typically use high-brightness display panels; however, these panels suffer from high power consumption and significant heat generation. This is especially true in the fixed pattern display area, where prolonged illumination creates hot spots that affect the luminous efficiency of the light-emitting devices (such as LEDs and M-LEDs), leading to decreased brightness and ultimately impacting the display's overall performance.

[0003] Currently, the common way to improve the above-mentioned high temperature hotspot problem is to attach a metal heat dissipation material to the back of the glass substrate of the display panel; however, due to the low thermal conductivity of the glass substrate, there is a certain thermal resistance to downward heat transfer, resulting in poor heat dissipation effect. Summary of the Invention

[0004] This application provides a display panel and a display device to improve the technical problem of severe heat generation in the high-frequency lighting area of ​​the display panel, which affects the display effect.

[0005] This application provides a display panel, the display panel including a display area, the display area including a first sub-display area and a second sub-display area, wherein in the same lighting cycle of the display panel, the cumulative lighting duration of the first sub-display area is greater than the cumulative lighting duration of the second sub-display area; The display panel also includes: First substrate; The display functional layer is disposed on one side of the first substrate; The first substrate is provided with a heat dissipation channel, and a heat exchange medium is provided in the heat dissipation channel. The first sub-display area is provided with the heat dissipation channel.

[0006] In some embodiments, the display panel further includes: A heat dissipation layer is disposed on the side of the first substrate away from the display functional layer; The first substrate has a first groove on the side facing the heat dissipation layer, and the first groove and the surface of the heat dissipation layer facing the first substrate form the heat dissipation channel.

[0007] In some embodiments, the display panel further includes: The second substrate is disposed on the side of the first substrate away from the display functional layer; The first substrate has a first groove on the side facing the second substrate, and the second substrate has a second groove on the side facing the first substrate. The first groove and the second groove are connected and enclosed to form the heat dissipation channel.

[0008] In some embodiments, the first substrate is disposed on the light-emitting side of the display functional layer; The first substrate has a first groove on the side facing the display functional layer, and the first groove and the surface of the display functional layer facing the first substrate form the heat dissipation channel.

[0009] In some embodiments, the display functionality layer includes: Light-emitting device layer; An encapsulation layer is disposed on the light-emitting side of the light-emitting device layer; An isolation layer is disposed between the encapsulation layer and the first substrate; The heat dissipation channel is formed by the first groove and the surface of the isolation layer facing the first substrate.

[0010] In some embodiments, the display panel further includes a non-display area located on at least one side of the display area; The non-display area includes a circuit area, which includes metal traces and is provided with heat dissipation channels.

[0011] In some embodiments, the heat dissipation channel includes at least one main channel and at least one secondary channel; The main channel extends from one end of the display panel to the opposite end of the display panel; The secondary flow channel connects two adjacent main flow channels, or the secondary flow channel connects an adjacent main flow channel and the secondary flow channel.

[0012] In some embodiments, the extension path of the heat dissipation channel includes at least one of a straight line segment, a broken line segment, and a curved segment.

[0013] In some embodiments, at the corner of the first substrate, the heat dissipation channel is transitioned by the curved segment.

[0014] This application also provides a display device, which includes the display panel described above.

[0015] This application provides a display panel and a display device. The display panel includes a first sub-display area and a second sub-display area. During the same lighting cycle of the display panel, the cumulative lighting time of the first sub-display area is greater than that of the second sub-display area, meaning the first sub-display area is lit for a longer period, constituting a high-frequency lighting area. The display panel also includes a first substrate disposed on one side of the display functional layer. The first substrate has heat dissipation channels, and a heat exchange medium is disposed within these channels. The first sub-display area also has these heat dissipation channels. By creating heat dissipation channels on the first substrate and utilizing the circulation of the heat exchange medium within these channels, this application improves the heat dissipation effect and addresses the problem of poor heat dissipation due to the low thermal conductivity of the first substrate. Furthermore, by placing the heat dissipation channels in the first sub-display area, i.e., the high-frequency lighting area, this application solves the problem of high-temperature hotspots appearing in the high-frequency lighting area of ​​the display panel due to the long lighting time, thereby effectively improving the heat dissipation efficiency of the display panel and enhancing its display effect. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0018] Figure 1 This is a temperature distribution diagram of an existing vehicle instrument panel; Figure 2 This is a cross-sectional view of the first type of display panel provided in the embodiments of this application; Figure 3 This is a cross-sectional view of the second type of display panel provided in the embodiments of this application; Figure 4 This is a cross-sectional view of the third type of display panel provided in the embodiments of this application; Figure 5 This is a partially enlarged schematic diagram of a display panel provided in an embodiment of this application; Figure 6 This is a schematic diagram of the first heat dissipation channel distribution provided in the embodiments of this application; Figure 7 This is a schematic diagram of the second type of heat dissipation channel distribution provided in the embodiments of this application; Figure 8 This is a schematic diagram of the third type of heat dissipation channel distribution provided in the embodiments of this application; Figure 9aThis is a schematic diagram of a display panel model in the existing technology; Figure 9b yes Figure 9a Temperature distribution map on the display panel; Figure 10a This is a schematic diagram of a model of the first type of display panel provided in the embodiments of this application; Figure 10b yes Figure 10a Temperature distribution map on the display panel; Figure 11a This is a schematic diagram of a second type of display panel provided in an embodiment of this application; Figure 11b yes Figure 11a Temperature distribution map on the display panel; Figure 12a This is a schematic diagram of a third type of display panel provided in an embodiment of this application; Figure 12b yes Figure 12a The temperature distribution map on the display panel.

[0019] Explanation of reference numerals in the attached figures: 10. Display panel; 101. First end 101; 102. Second end 102; 110. First substrate; 111. First recess; 120. Display function layer; 121. Driving circuit layer; 122. Light-emitting device layer; 122a. Red light-emitting device; 122b. Green light-emitting device; 122c. Blue light-emitting device; 123. Encapsulation layer; 124. Isolation layer; 130. Heat dissipation channel; 131 (131 a, 131b, 131c) Main flow channel; 132 Secondary flow channel; 140 Heat exchange medium; 150 Heat dissipation layer; 160 Adhesive layer; 170 Cover plate; 180 Optical adhesive layer; 190 Second substrate; 191 Second groove; 200 Third substrate; 211 First corner; 212 Second corner; 213 Third corner; 214 Fourth corner; 221 Liquid inlet; 222 Liquid outlet.

[0020] AA, Display area; A1, First sub-display area; A11, Light-emitting area; A12, Light-transmitting area; A2, Second sub-display area; NA, Non-display area; N1, Circuit area; Detailed Implementation The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0021] Currently, in-vehicle displays typically use high-brightness display panels, such as in-vehicle instrument clusters. When the in-vehicle instrument cluster is in the display state (i.e., illuminated), its display panel includes fixed pattern display areas. These fixed pattern display areas maintain their illuminated state for extended periods, displaying information such as vehicle speed and engine speed. Please refer to [reference needed]. Figure 1 Because the patterns in these areas are lit for a long time, generate a lot of heat, and have a high temperature, it will affect the luminous efficiency of the light-emitting devices (such as LEDs, M-LEDs, etc.) in these areas, which will lead to a decrease in brightness and affect the display effect and lifespan of the display panel.

[0022] To solve the above problems, this application provides a display panel 10, please refer to... Figures 2-4 The display panel 10 includes a display area AA, which includes a first sub-display area A1 and a second sub-display area A2. During the same lighting cycle of the display panel 10, the cumulative lighting time of the first sub-display area A1 is greater than the cumulative lighting time of the second sub-display area A2.

[0023] It is understood that the same lighting cycle of the display panel 10 refers to a continuous period of time during which the display panel 10 is continuously lit, during which the display panel 10 is lit and displays a pattern; for example, the lighting cycle can be the continuous display period from the time the display panel 10 is turned on to the time it is turned off, but it is not limited to this. The cumulative lighting time of the first sub-display area A1 refers to the total lighting time of the pattern displayed in the first sub-display area A1 within the continuous period of time; the cumulative lighting time of the second sub-display area A2 refers to the total lighting time of the pattern displayed in the second sub-display area A2 within the same continuous period of time; for example, the first sub-display area A1 can be a high-frequency lighting area of ​​the display panel 10, such as the display area for information patterns such as vehicle speed and RPM, and the second sub-display area A2 can be a low-frequency lighting area of ​​the display panel 10, such as the display area for information patterns such as navigation and warning reminders.

[0024] The high-frequency lighting area can be understood as an area with a longer lighting time or a higher lighting frequency, meaning that the light-emitting device in this area has a longer light-emitting time, generates more heat, and has a higher temperature. The low-frequency lighting area, in contrast to the high-frequency lighting area, can be understood as an area with a shorter lighting time or a lower lighting frequency, meaning that the light-emitting device in this area has a relatively shorter light-emitting time, generates less heat, and has a relatively lower temperature.

[0025] Please refer to Figures 2-4 The display panel 10 also includes a first substrate 110 and a display functional layer 120, the display functional layer 120 being disposed on one side of the first substrate 110; wherein, a heat dissipation channel 130 is disposed on the first substrate 110, a heat exchange medium 140 is disposed in the heat dissipation channel 130, and at least the first sub-display area A1 is provided with a heat dissipation channel 130.

[0026] It is understandable that the heat source of the display panel 10 comes from the display functional layer 120. The conventional way to solve the heat dissipation problem of the display functional layer 120 is to set a heat dissipation layer 150 on the side of the first substrate 110 away from the display functional layer 120. However, the heat dissipation layer 150 and the display functional layer 120 are separated by the first substrate 110, which is usually a glass substrate. The low thermal conductivity of the glass substrate causes a certain thermal resistance in the process of heat from the display functional layer 120 being transferred to the heat dissipation layer 150, thus reducing the heat dissipation efficiency. This application improves the heat dissipation effect by opening a heat dissipation channel 130 on the first substrate 110 and using the circulation of the heat exchange medium 140 in the heat dissipation channel 130 to achieve heat exchange. This improves the heat dissipation effect and solves the problem of poor heat dissipation caused by the low thermal conductivity of the first substrate 110. At the same time, this application sets the heat dissipation channel 130 in the first sub-display area A1, i.e. the high-frequency lighting area, to solve the problem of high temperature hot spots in the high-frequency lighting area of ​​the display panel 10 due to the long lighting time. This effectively improves the heat dissipation efficiency of the display panel 10 and improves the display effect and lifespan of the display panel 10.

[0027] In some embodiments, the first substrate 110 may be a transparent substrate. The material of the first substrate 110 may be glass or an organic polymer material, such as acrylic, but is not limited thereto. The first substrate 110 may be a substrate for supporting the display functional layer 120 or a cover plate for protecting the display functional layer 120, and this application does not impose any limitations.

[0028] In some embodiments, please refer to Figure 2 The display functional layer 120 includes a driving circuit layer 121, a light-emitting device layer 122, and an encapsulation layer 123. The driving circuit layer 121 includes thin-film transistors and other metal traces, used to drive the light-emitting device layer 122 to emit light. The light-emitting device layer 122 is disposed on one side of the driving circuit layer 121 and includes multiple light-emitting devices, which can be light-emitting diodes (LEDs) or miniature light-emitting diodes (Mini LEDs or Micro LEDs). The encapsulation layer 123 is disposed on the side of the light-emitting device layer 122 away from the driving circuit layer 121, i.e., the light-emitting side of the light-emitting device layer 122, and covers the light-emitting devices to protect them.

[0029] In some embodiments, please refer to Figure 2 The display panel 10 also includes a heat dissipation layer 150, which is disposed on the side of the first substrate 110 away from the display functional layer 120. A first groove 111 is provided on the side of the first substrate 110 facing the heat dissipation layer 150, and the first groove 111 and the surface of the heat dissipation layer 150 facing the first substrate 110 form a heat dissipation channel 130.

[0030] It is understood that a continuous pattern of first grooves 111 can be formed on the surface of the first substrate 110 using processes such as micro-etching. The first grooves 111 are recessed towards the interior of the first substrate 110. By attaching the side of the first substrate 110 with the etched pattern of the first grooves 111 to the heat dissipation layer 150, an annular closed channel, i.e., a heat dissipation channel 130, is formed between the inner wall of the first grooves 111 and the surface of the heat dissipation layer 150. The heat exchange medium 140 is filled in the heat dissipation channel, and the heat dissipation effect is achieved through heat exchange.

[0031] In some embodiments, the material of the heat dissipation layer 150 can be a metal material with good thermal conductivity, such as aluminum or aluminum alloy, but is not limited thereto. Using a metal heat dissipation layer 150 can achieve both heat dissipation and good support.

[0032] In some embodiments, please refer to Figure 2 An adhesive layer 160 is further provided between the heat dissipation layer 150 and the first substrate 110 to bond the heat dissipation layer 150 and the first substrate 110, ensuring the connection stability between the heat dissipation layer 150 and the first substrate 110, and at the same time ensuring the sealing of the heat dissipation channel 130 between the heat dissipation layer 150 and the first substrate 110. The adhesive layer 160 has a corresponding opening at the position of the first groove 111, the opening being exposed on the surface of the heat dissipation layer 150, and the orthographic projection of the opening on the heat dissipation layer 150 coincides with the orthographic projection of the first groove 111 on the heat dissipation layer 150, so that the heat exchange medium 140 in the heat dissipation channel 130 can directly contact the heat dissipation layer 150, ensuring the heat dissipation effect.

[0033] In some embodiments, please refer to Figure 2 The display panel 10 also includes a cover plate 170, which protects the display functional layer 120 from damage. The cover plate 170 may be made of a transparent material, such as glass, but is not limited thereto.

[0034] For further details, please refer to Figure 2 An optical adhesive layer 180 is also provided between the cover plate 170 and the display functional layer 120. The optical adhesive layer 180 is used to bond the cover plate 170 and the display functional layer 120 to ensure the stability of the overall structure of the display panel 10. The material of the optical adhesive layer 180 can be optically clear adhesive (OCA), but is not limited to this.

[0035] In some embodiments, please refer to Figure 3The display panel 10 also includes a second substrate 190, which is disposed on the side of the first substrate 110 away from the display functional layer 120. The first substrate 110 has a first groove 111 on the side facing the second substrate 190, and the second substrate 190 has a second groove 191 on the side facing the first substrate 110. The first groove 111 and the second groove 191 are connected and enclosed to form a heat dissipation channel 130.

[0036] The material of the second substrate 190 can be the same as that of the first substrate 110, for example, both being transparent substrates, such as transparent glass substrates. The second substrate 190 and the first substrate 110 can be symmetrically arranged about their interface. The shape and size of the first groove 111 and the second groove 191 can be the same, except that the opening directions of the first groove 111 and the second groove 191 are opposite in the thickness direction of the display panel 10. The second groove 191 is recessed towards the interior of the second substrate 190; for example, the first groove 111 and the second groove 191 can be mirror images of each other. It is understood that by using a transparent second substrate 190 aligned and bonded to the first substrate 110, a transparent display module can be achieved while forming a closed heat dissipation channel 130, thus meeting the application requirements of transparent display scenarios. Furthermore, simultaneously etching a second groove 191 on the second substrate 190 with the same pattern as the first groove 111 on the first substrate 110 can increase the cross-sectional area of ​​the heat dissipation channel 130, increase the flow rate of the heat exchange medium 140, and further improve the heat dissipation effect.

[0037] In some embodiments, please refer to Figure 3 An adhesive layer 160 is further provided between the second substrate 190 and the first substrate 110 to bond the second substrate 190 and the first substrate 110, ensuring the connection stability between the second substrate 190 and the first substrate 110, and at the same time ensuring the sealing of the heat dissipation channel 130 between the second substrate 190 and the first substrate 110. The adhesive layer 160 has corresponding openings at the positions of the first groove 111 / second groove 191. The orthographic projection of the openings on the second substrate 190 coincides with the orthographic projection of the first groove 111 / second groove 191 on the second substrate 190, so that the heat exchange medium 140 in the heat dissipation channel 130 directly contacts the inner walls of the first groove 111 and the second groove 191, ensuring heat dissipation effect.

[0038] In this application, the first substrate 110 can be disposed on the back side (the side opposite to the light-emitting side) of the display functional layer 120, such as... Figure 2 and Figure 3 The structure is shown to reduce the impact on the light emission effect of the display panel 10. Of course, the first substrate 110 can also be disposed on the light emission side of the display functional layer 120, and this application does not impose any restrictions.

[0039] In some embodiments, please refer to Figure 4 A first substrate 110 is disposed on the light-emitting side of the display functional layer 120. A first groove 111 is provided on the side of the first substrate 110 facing the display functional layer 120, and the first groove 111 and the surface of the display functional layer 120 facing the first substrate 110 enclose a heat dissipation channel 130. When the first substrate 110 is disposed on the light-emitting side of the display functional layer 120, the first substrate 110 can serve as a cover plate for the display panel 10 to protect the display functional layer 120. It is understood that in this embodiment, the material of the first substrate 110 and the structure of the first groove 111 are the same as those in the above embodiments, and will not be described again.

[0040] In some embodiments, please refer to Figure 4 The display functional layer 120 also includes an isolation layer 124, which is disposed between the encapsulation layer 123 and the first substrate 110. A heat dissipation channel 130 is formed between the first groove 111 and the surface of the isolation layer 124 facing the first substrate 110. The isolation layer 124 prevents the heat exchange medium 140 within the heat dissipation channel from penetrating into the light-emitting device layer 122, thereby improving the protection of the light-emitting device layer 122. For example, the isolation layer 124 can be a waterproof coating, but is not limited thereto.

[0041] In some embodiments, please refer to Figure 4 An optical adhesive layer 180 is also included between the first substrate 110 and the isolation layer 124.

[0042] In some embodiments, please refer to Figure 4 The side of the display functional layer 120 away from the first substrate 110 also includes a third substrate 200, which is used to support the display functional layer 120. The material of the third substrate 200 can be a rigid material or a flexible material, such as glass, and a polyimide, but is not limited thereto.

[0043] In some embodiments, please refer to Figures 2-4 The cross-sectional shape of the first groove 111 and the second groove 191 can be rectangular or curved.

[0044] In some embodiments, please refer to Figures 2-4 The angle at the corner of the inner wall of the first groove 111 and the second groove 191 is greater than 90°, or the corner is made of curved surface transition, so as to reduce the flow resistance of the heat exchange medium 140 in the heat dissipation channel 130 and improve the heat dissipation efficiency.

[0045] In some embodiments, please refer to Figure 2 and Figure 4In the thickness direction of the display panel 10, the minimum thickness of the first substrate 110 at the corresponding first groove 111 is greater than 200um, so as to avoid insufficient strength of the first substrate 110 and affect the stability of the display panel 10.

[0046] Similarly, please refer to Figure 3 The minimum thickness of the second substrate 190 at the corresponding second groove 191 is greater than 200um, so as to avoid insufficient strength of the second substrate 190 and affect the overall stability of the display panel 10.

[0047] In some embodiments, please refer to Figures 2-4 The cross-sectional width of the heat dissipation channel 130 is less than or equal to 100µm to reduce its impact on the overall thickness of the display panel 10. The cross-sectional width refers to the width perpendicular to the thickness direction of the display panel 10, or it can be the inner diameter of the heat dissipation channel 130.

[0048] In some embodiments, please refer to Figure 5 The first sub-display area A1 includes a light-emitting area A11 and a light-transmitting area A12. The light-emitting area A11 is provided with light-emitting devices, and the light-transmitting area A12 is located between the light-emitting devices. The heat dissipation channel 130 is provided in the light-emitting area A11.

[0049] It is understood that the heat dissipation channel 130 can be disposed directly below the light-emitting device, that is, the orthogonal projection of the heat dissipation channel 130 on the first substrate 110 is located within the range of the orthogonal projection of the light-emitting device on the first substrate 110, so as to reduce the influence of the heat dissipation channel 130 on the transmittance of the light-transmitting area A12.

[0050] In some embodiments, please refer to Figure 5 The light-emitting device layer 122 includes multiple pixel units, each pixel unit including a red light-emitting device 122a, a green light-emitting device 122b, and a blue light-emitting device 122c. The red light-emitting device 122a emits red light, the green light-emitting device 122b emits green light, and the blue light-emitting device 122c emits blue light. The mixing of red, green, and blue light enables the display of various images on the display panel 10. In the thickness direction of the display panel 10, the cross-sectional width of the heat dissipation channel 130 corresponding to the red light-emitting device 122a can be greater than the cross-sectional width of the heat dissipation channel 130 corresponding to the green light-emitting device 122b, and the cross-sectional width of the heat dissipation channel 130 corresponding to the red light-emitting device 122a is greater than the cross-sectional width of the heat dissipation channel 130 corresponding to the blue light-emitting device 122c. Under conditions of high temperature in the high-frequency illumination area, the inconsistent luminous efficiency of the red light-emitting device 122a, green light-emitting device 122b, and blue light-emitting device 122c due to temperature variations can lead to severe color shift problems, such as… Figure 1As shown; in this embodiment, by setting the cross-sectional width of the heat dissipation channel 130 corresponding to the red light-emitting device 122a to be greater than the cross-sectional width of the heat dissipation channel 130 of the green light-emitting device 122b and the cross-sectional width of the heat dissipation channel 130 of the blue light-emitting device 122c, the uniformity of heat dissipation of different color light-emitting devices can be achieved, thereby improving the color deviation problem.

[0051] In some embodiments, please refer to Figure 2 and Figure 6 The display panel 10 also includes a non-display area NA, which is located on at least one side of the display area AA, for example, the non-display area NA may surround the display area AA. The non-display area NA includes a circuit area N1, located around the periphery of the display area AA. The circuit area N1 includes metal traces and may be provided with heat dissipation channels 130. The circuit area N1 may be a fan-out area or a bonding area, etc. Because the metal traces are relatively concentrated in this area, and the driving current of the high-brightness display panel 10 is large, these circuit areas N1 have hot spots and generate a large amount of heat. In this embodiment, by providing corresponding heat dissipation channels 130 in the circuit area N1, heat dissipation can be achieved simultaneously for the high-frequency illumination area (first sub-display area A1) of the display area AA and the circuit area N1 of the non-display area NA, thereby improving the overall reliability and lifespan of the display panel 10.

[0052] In some embodiments, please refer to Figures 6-8 The heat dissipation channel 130 includes at least one main channel 131 and at least one secondary channel 132; the main channel 131 extends from one end of the display panel 10 to the opposite end of the display panel 10; the secondary channel 132 connects two adjacent main channels 131, or the secondary channel 132 connects adjacent main channels 131 and secondary channels 132.

[0053] In some embodiments, the extension path of the heat dissipation channel 130 includes at least one of a straight line segment, a broken line segment, and a curved segment. For example, the extension path of the heat dissipation channel 130 may include only a straight line segment, or the extension path of the heat dissipation channel 130 may include only a broken line segment, or the extension path of the heat dissipation channel 130 may include only a curved segment, or the extension path of the heat dissipation channel 130 may be a combination of at least two of the straight line segment, broken line segment, and curved segment.

[0054] In some embodiments, the heat dissipation channel 130 may extend in a straight line or a zigzag shape. For details, please refer to... Figure 6The first substrate 110 includes a first end 101 and a second end 102. The heat dissipation channel 130 includes a main channel 131a, a main channel 131b, a main channel 131c, and a secondary channel 132. The main channels 131a, 131b, and 131c all extend from the first end 101 of the first substrate 110 to the second end 102. The main channel 131a can extend along the center line of the display area AA. The main channels 131b and 131c are symmetrically arranged about the main channel 131a and both extend along the non-display area NA. Both ends of the main channels 131b and 131c are connected to the main channel 131a. The secondary channel 132 is located between the main channels 131a and 131b, and between the main channels 131a and 131c. Both ends of the secondary channel 132 are connected to the main channel 131a. In this embodiment, the main flow channel 131a is straight (i.e., includes a straight segment), the main flow channels 131b and 131c are polygonal (i.e. include a polygonal segment), and the secondary flow channel 132 can be arranged perpendicularly or parallel to the main flow channel 131.

[0055] It is understandable that the main flow channel 131a and secondary flow channel 132 located in the display area AA can achieve heat dissipation for the first sub-display area A1, while the main flow channels 131b and 131c located in the non-display area NA can achieve heat dissipation for the circuit area N1. The main flow channels 131a, 131b, 131c and secondary flow channel 132 are interconnected, and the heat exchange medium 140 circulates in each heat dissipation channel 130, which can simultaneously achieve synchronous heat dissipation for the display area AA and the non-display area NA.

[0056] In some embodiments, the heat dissipation channel 130 may be arranged in a curved shape. For details, please refer to... Figure 7The first substrate 110 includes a first corner 211, a second corner 212, a third corner 213 and a fourth corner 214 distributed sequentially along its circumference. The first corner 211 and the third corner 213 are located on the first diagonal line of the first substrate 110, and the second corner 212 and the fourth corner 214 are located on the second diagonal line of the first substrate 110. The first diagonal line intersects with the second diagonal line. The heat dissipation channel 130 includes a main channel 131a, a main channel 131b, a main channel 131c, and a secondary channel 132; wherein, the main channels 131a, 131b, and 131c all extend from the first corner 211 of the first substrate 110 to the third corner 213; the main channel 131a extends in a curved shape (such as an S-shape) along the first diagonal of the first substrate 110; the main channels 131b and 131c are located on opposite sides of the main channel 131a, and the main channel 131b extends from the second corner 213. At corner 212, a curved section transitions to the main channel 131c, and at the fourth corner 214, a curved section transitions to the main channel 131b. Main channel 131b is at least partially located in the non-display area NA, and main channel 131c is at least partially located in the non-display area NA. Both ends of main channels 131b and 131c are connected to main channel 131a. Secondary channel 132 is located between main channels 131a and 131b, and between main channels 131a and 131c. Both ends of secondary channel 132 are connected to main channel 131. In this embodiment, main channels 131a, 131b, 131c, and secondary channel 132 are all arranged in a curved shape. Figure 7 As shown, the distribution of the heat dissipation channel 130 is similar to the shape of leaf veins. Through the leaf vein biomimetic design, the heat dissipation channel 130 can avoid sharp angles or right angles at the corners, thereby reducing the flow resistance of the heat exchange medium 140 at the corners. This is because the increase in flow resistance will affect the diversion of the heat exchange medium 140 to the circuit area N1, resulting in poor heat dissipation of the circuit area N1.

[0057] Please refer to Figure 8 Main channel 131a extends along the center line of display area AA; main channels 131b and 131c can be symmetrically arranged about main channel 131a, and main channel 131b has a curved transition at the second corner 212 and the third corner 213, while main channel 131c has a curved transition at the first corner 211 and the fourth corner 214, i.e., it has an elliptical leaf vein biomimetic design. Figure 7 Similar to the biomimetic design principle of leaf veins shown, the heat dissipation channel 130 layout can further improve the heat dissipation effect of circuit area N1.

[0058] In some embodiments, please refer to Figure 6The first substrate 110 has a liquid inlet 221 at its first end 101 and a liquid outlet 222 at its second end 102. One end of the main channel 131 is connected to the liquid inlet 221, and the other end of the main channel 131 is connected to the liquid outlet 222. The secondary channel 132 is connected to the main channel 131 to realize the liquid cooling circulation of the heat exchange medium 140 in the entire heat dissipation channel 130, so as to further improve the heat dissipation effect.

[0059] Furthermore, the display panel 10 also includes a micro pump, with an inlet 221 or an outlet 222 connected to the micro pump to provide power for the liquid cooling cycle.

[0060] In some embodiments, the heat exchange medium 140 may be water or other fluids with cooling functions.

[0061] The following simulation experiment will further illustrate the heat dissipation effect of the display panel 10 of this application.

[0062] Please refer to Figure 9a and Figure 9b , Figure 9a The existing display panel structure includes a first sub-display area A1 located in the display area AA, and a circuit area N1 located in the non-display area NA. For details, please refer to [reference needed]. Figure 2 However, the first substrate 110 of the display panel is a common glass substrate and does not have a heat dissipation channel 130. Figure 9b This is a temperature distribution diagram of the display panel.

[0063] Please refer to Figure 10a and Figure 10b , Figure 10a The display panel 10 structure of this application includes a first sub-display area A1 located in the display area AA, and a circuit area N1 located in the non-display area NA. For details, please refer to [reference needed]. Figure 2 and Figure 6 The heat dissipation channels 130 of the display panel 10 are arranged in a straight line and a zigzag shape. Figure 10b This is a temperature distribution diagram of the display panel 10.

[0064] Please refer to Figure 11a and Figure 11b , Figure 11a The display panel 10 structure of this application includes a first sub-display area A1 located in the display area AA, and a circuit area N1 located in the non-display area NA. For details, please refer to [reference needed]. Figure 2 and Figure 7 The heat dissipation channel 130 of the display panel 10 is extended in a curved shape (bionic design of leaf veins). Figure 11b This is a temperature distribution diagram of the display panel 10.

[0065] Please refer to Figure 12a and Figure 12b , Figure 12a The display panel 10 structure of this application includes a first sub-display area A1 located in the display area AA, and a circuit area N1 located in the non-display area NA. For details, please refer to [reference needed]. Figure 2 and Figure 8 The heat dissipation channel 130 of the display panel 10 is extended in a curved shape (bionic design of leaf veins). Figure 12b This is a temperature distribution diagram of the display panel 10.

[0066] Depend on Figures 9a-9b As can be seen, existing display panels dissipate heat by adding a metal heat dissipation layer 150 to the back of the first substrate 110. As brightness requirements increase, the power consumption of the display panel increases, and the current density carried by the circuit area N1 and the first sub-display area A1 increases, resulting in excessive temperature rise (24.2℃ in the figure). In actual application scenarios, the ambient temperature will be much higher than the simulated 25℃, and the actual maximum temperature will be even higher.

[0067] Depend on Figures 10a-10b It can be seen that the display panel 10 adopts a straight and zigzag heat dissipation channel design, resulting in a temperature decrease of approximately 4°C in the first sub-display area A1 and a temperature decrease of approximately 1°C to 2°C in the circuit area N1, compared to... Figure 9a The display panel without heat dissipation channel 130 experienced a significant temperature drop. However, the straight channel design had a 90° bend, which increased the flow resistance and affected the diversion of heat exchange medium 140 to circuit area N1, resulting in poor heat dissipation in circuit area N1.

[0068] Depend on Figures 11a-12b It can be seen that the heat dissipation channel 130 of the display panel 10 adopts a leaf vein biomimetic design, and the temperature of the circuit area N1 is lower than that of the display panel 10. Figure 10a The straight flow channel is used. Due to the curved flow channel design, sharp angles or right angles are avoided at the corners of the heat dissipation flow channel 130, reducing the flow resistance of the heat exchange medium 140 at the corners and significantly improving the heat dissipation effect of the circuit area N1.

[0069] This application also provides a display device, which includes the display panel 10 as described above. The display device can be a display product in fields such as vehicle display, terminal display, and smart display, but is not limited thereto.

[0070] This application provides a display panel and a display device. The display panel includes a first sub-display area and a second sub-display area. During the same lighting cycle of the display panel, the cumulative lighting time of the first sub-display area is greater than that of the second sub-display area, meaning the first sub-display area is lit for a longer period, constituting a high-frequency lighting area. The display panel also includes a first substrate disposed on one side of the display functional layer. The first substrate has heat dissipation channels, and a heat exchange medium is disposed within these channels. The first sub-display area also has these heat dissipation channels. By creating heat dissipation channels on the first substrate and utilizing the circulation of the heat exchange medium within these channels, this application improves the heat dissipation effect and addresses the problem of poor heat dissipation due to the low thermal conductivity of the first substrate. Furthermore, by placing the heat dissipation channels in the first sub-display area, i.e., the high-frequency lighting area, this application solves the problem of high-temperature hotspots appearing in the high-frequency lighting area of ​​the display panel due to the long lighting time, thereby effectively improving the heat dissipation efficiency of the display panel and enhancing its display effect.

[0071] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0072] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0073] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0074] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A display panel, characterized in that, The display area includes a first sub-display area and a second sub-display area. During the same lighting cycle of the display panel, the cumulative lighting duration of the first sub-display area is greater than the cumulative lighting duration of the second sub-display area. The display panel also includes: First substrate; The display functional layer is disposed on one side of the first substrate; The first substrate is provided with a heat dissipation channel, and a heat exchange medium is provided in the heat dissipation channel. The first sub-display area is provided with the heat dissipation channel.

2. The display panel according to claim 1, characterized in that, The display panel also includes: A heat dissipation layer is disposed on the side of the first substrate away from the display functional layer; The first substrate has a first groove on the side facing the heat dissipation layer, and the first groove and the surface of the heat dissipation layer facing the first substrate form the heat dissipation channel.

3. The display panel according to claim 1, characterized in that, The display panel also includes: The second substrate is disposed on the side of the first substrate away from the display functional layer; The first substrate has a first groove on the side facing the second substrate, and the second substrate has a second groove on the side facing the first substrate. The first groove and the second groove are connected and enclosed to form the heat dissipation channel.

4. The display panel according to claim 1, characterized in that, The first substrate is disposed on the light-emitting side of the display functional layer; The first substrate has a first groove on the side facing the display functional layer, and the first groove and the surface of the display functional layer facing the first substrate form the heat dissipation channel.

5. The display panel according to claim 4, characterized in that, The display function layer includes: Light-emitting device layer; An encapsulation layer is disposed on the light-emitting side of the light-emitting device layer; An isolation layer is disposed between the encapsulation layer and the first substrate; The heat dissipation channel is formed by the first groove and the surface of the isolation layer facing the first substrate.

6. The display panel according to any one of claims 1-5, characterized in that, The display panel further includes a non-display area, which is located on at least one side of the display area; The non-display area includes a circuit area, which includes metal traces and is provided with heat dissipation channels.

7. The display panel according to any one of claims 1-5, characterized in that, The heat dissipation channel includes at least one main channel and at least one secondary channel; The main channel extends from one end of the display panel to the opposite end of the display panel; The secondary flow channel connects two adjacent main flow channels, or the secondary flow channel connects an adjacent main flow channel and the secondary flow channel.

8. The display panel according to any one of claims 1-5, characterized in that, The extension path of the heat dissipation channel includes at least one of a straight line segment, a broken line segment, and a curved segment.

9. The display panel according to claim 8, characterized in that, At the corner of the first substrate, the heat dissipation channel is transitioned by the curved segment.

10. A display device, characterized in that, Includes the display panel as described in any one of claims 1-9.

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