A display panel, a preparation method of the display panel, and a display device

Abstract

The application discloses a display panel, a preparation method of the display panel and a display device. The display panel comprises a substrate, a display function layer, an encapsulation layer, and a color resistance layer. The display function layer is located on one side of the substrate. The encapsulation layer is located on a side of the display function layer away from the substrate. A light-emitting viewing angle adjusting layer is located in the encapsulation layer. The encapsulation layer comprises a first surface and a second surface arranged oppositely, and the second surface is adjacent to the display function layer. The light-emitting viewing angle adjusting layer is located on the first surface, or on the second surface, or between the first surface and the second surface. The color resistance layer is located on a side of the encapsulation layer away from the substrate. Higher light extraction efficiency is achieved without sacrificing the integrated black effect.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a display panel, a method for manufacturing the display panel, and a display device. Background Technology

[0002] With the increasing outdoor applications of mobile terminals, polarizer-free technology is gradually becoming more widespread. Existing absorption solutions fabricate multi-color color resists on the touch layer, but due to thickness limitations, the space for the black matrix design is cramped, making it difficult to balance light extraction efficiency and a seamless black effect. Furthermore, the complex film pattern of the touch layer leads to poor flatness, making it difficult to control the thickness uniformity of the black matrix, which in turn affects display uniformity and color consistency. Summary of the Invention

[0003] This invention provides a display panel, a method for manufacturing the display panel, and a display device, achieving higher light extraction efficiency without sacrificing the seamless black effect.

[0004] In a first aspect, embodiments of the present invention provide a display panel, comprising: a substrate, a display functional layer, an encapsulation layer, and a color resist layer. The display functional layer is located on one side of the substrate; the encapsulation layer is located on the side of the display functional layer away from the substrate; a light emission viewing angle adjustment layer is located within the encapsulation layer; the encapsulation layer includes a first surface and a second surface disposed opposite to each other, the second surface being adjacent to the display functional layer; wherein the light emission viewing angle adjustment layer is located on the first surface, or on the second surface, or between the first surface and the second surface; the color resist layer is located on the side of the encapsulation layer away from the substrate.

[0005] Optionally, the display function layer includes a pixel definition layer, the pixel definition layer includes a pixel opening; the light emission angle adjustment layer includes an angle adjustment opening; the vertical projection of the angle adjustment opening on the substrate at least covers the vertical projection of the pixel opening on the substrate.

[0006] Optionally, the encapsulation layer includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer stacked together; the first inorganic encapsulation layer is adjacent to the display function layer; The light emission angle adjustment layer is located between the first inorganic encapsulation layer and the organic encapsulation layer, between the second inorganic encapsulation layer and the organic encapsulation layer, or within the organic encapsulation layer.

[0007] Optionally, the materials of the first inorganic encapsulation layer and the second inorganic encapsulation layer include at least one of silicon oxide, silicon nitride, and silicon oxynitride.

[0008] Optionally, the thickness of the first inorganic encapsulation layer ranges from 0.3 μm to 1.5 μm; the thickness of the second inorganic encapsulation layer ranges from 0.3 μm to 1.2 μm.

[0009] Optionally, the total thickness of the light emission angle adjustment layer and the organic encapsulation layer is 5µm to 20µm.

[0010] Optionally, the thickness of the color resist layer ranges from 1µm to 5µm.

[0011] Optionally, the display panel further includes a touch layer located between the encapsulation layer and the color resist layer.

[0012] Secondly, embodiments of the present invention provide a method for manufacturing a display panel, comprising: Provide substrate; A display functional layer is formed on the substrate; An encapsulation layer and a light emission viewing angle adjustment layer are formed on the side of the display functional layer away from the substrate; wherein the encapsulation layer is located within the light emission viewing angle adjustment layer; the encapsulation layer includes a first surface and a second surface disposed opposite to each other, the second surface being adjacent to the display functional layer; wherein the light emission viewing angle adjustment layer is located between the first surface, the second surface, or between the first surface and the second surface; A color resist layer is formed on the side of the encapsulation layer away from the substrate; Optionally, an encapsulation layer and a light emission angle adjustment layer are formed on the side of the display functional layer away from the substrate, including: A first inorganic encapsulation layer is formed on the side of the display functional layer away from the substrate; the light emission viewing angle adjustment layer is formed on the first inorganic encapsulation layer; an organic encapsulation layer is formed on the light emission viewing angle adjustment layer, the organic encapsulation layer at least covering the light emission viewing angle adjustment layer; and a second inorganic encapsulation layer is formed on the organic encapsulation layer. Optionally, an encapsulation layer and a light emission angle adjustment layer are formed on the side of the display functional layer away from the substrate, including: A first inorganic encapsulation layer is formed on the side of the display functional layer away from the substrate; a partial organic encapsulation layer is formed on the first inorganic encapsulation layer; the light emission viewing angle adjustment layer is formed on the partial organic encapsulation layer; the remaining organic encapsulation layer is formed on the light emission viewing angle adjustment layer; and a second inorganic encapsulation layer is formed on the organic encapsulation layer. Optionally, an encapsulation layer and a light emission angle adjustment layer are formed on the side of the display functional layer away from the substrate, including: A first inorganic encapsulation layer is formed on the side of the display functional layer away from the substrate; an organic encapsulation layer is formed on the first inorganic encapsulation layer; a light emission viewing angle adjustment layer is formed on the organic encapsulation layer; and a second inorganic encapsulation layer is formed on the light emission viewing angle adjustment layer.

[0013] Thirdly, embodiments of the present invention provide a display device, including the display panel described in any embodiment of the present invention.

[0014] In the display panel provided by this invention, the light emission angle adjustment layer is placed in the encapsulation layer. By pre-concentrating the light emission angle within the encapsulation layer, the light entering the color resist layer is more concentrated, reducing Fresnel reflection loss and lateral light leakage at the color resist interface for large-angle light, and significantly improving brightness and contrast at the front viewing angle. Since the light emission angle adjustment layer is set independently of the color resist layer, the color resist layer does not need to set a black matrix, thereby achieving higher light extraction efficiency without sacrificing the overall black effect. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of a display panel provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of another display panel provided in an embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of another display panel provided in an embodiment of the present invention; Figure 4 This is a schematic diagram of a light-emitting structure provided in an embodiment of the present invention; Figure 5 This is a schematic diagram of the structure of another display panel provided in an embodiment of the present invention; Figure 6 This is a schematic flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present invention. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0017] Figure 1 This is a schematic diagram of the structure of a display panel provided in an embodiment of the present invention. See also: Figure 1The system includes: a substrate 110, a display functional layer 120, an encapsulation layer 130, a light emission viewing angle adjustment layer 140, and a color resist layer 150. The display functional layer 120 is located on one side of the substrate 110. The encapsulation layer 130 is located on the side of the display functional layer 120 away from the substrate 110. The light emission viewing angle adjustment layer 140 is located within the encapsulation layer 130. The encapsulation layer 130 includes a first surface and a second surface disposed opposite to each other, the second surface being adjacent to the display functional layer 120. The light emission viewing angle adjustment layer 140 is located on the first surface. The color resist layer 150 is located on the side of the encapsulation layer 130 away from the substrate 110.

[0018] Specifically, substrate 110 is used to support display functional layer 120. Substrate 110 can be a rigid glass substrate 110 or a flexible substrate 110, such as a single-layer or double-layer PI. To balance flexible bending performance and mechanical support strength, the film thickness is 10um to 20um, for example, film thickness is 10um, 12um, 14um, 16um, 18um or 20um, etc., and more preferably 12um to 18um, so that no cracks are found during bending tests, while avoiding warping deformation caused by excessive thinness.

[0019] The display functional layer 120 may include a pixel circuit layer 121, such as an LTPS or LTPO TFT array, an anode layer 122, a light-emitting layer 123, and a cathode layer 124. The light-emitting layer 123 has multiple light-emitting units, each light-emitting unit including at least a first-color light-emitting sub-unit, a second-color light-emitting sub-unit, and a third-color light-emitting sub-unit. For example, the first color, second color, and third color may be red, green, and blue, respectively. The positions of each light-emitting sub-unit can be defined by the pixel definition layer 125, and they can be patterned by vapor deposition or inkjet printing. The cathode layer 124 serves as a common electrode covering each light-emitting sub-unit, forming a complete light-emitting unit structure.

[0020] The encapsulation layer 130 is located on the side of the display functional layer 120 away from the substrate 110, and is used to prevent water and oxygen from entering to protect the light-emitting units in the display functional layer 120. The color resist layer 150 is located on the side of the encapsulation layer 130 away from the substrate 110, and is used to achieve full-color display. In this embodiment of the invention, the light emission viewing angle adjustment layer 140 is integrated inside the encapsulation layer 130, and the light emission viewing angle adjustment layer 140 absorbs colored light to achieve a seamless black effect. Figure 1In the specific embodiment shown, the light emission viewing angle adjustment layer 140 is located on the first surface of the encapsulation layer 130. Light emitted from the display function layer 120 is transmitted through the encapsulation layer 130 and its angle is modulated by the light emission viewing angle adjustment layer 140 before entering the color resist layer 150 for color filtering. Because the light emission viewing angle adjustment layer 140 is encapsulated by the encapsulation layer 130, the light has already completed its viewing angle convergence before entering the color resist layer 150, allowing more light energy to be concentrated in the positive viewing angle direction. Therefore, there is no need to set a traditional black matrix on the color resist layer 150 to block lateral light leakage. By eliminating the black matrix, the area originally occupied by the black matrix can be entirely converted into an effective light-transmitting area for the color resist, significantly increasing the area of ​​each color resist. This improves the light emission efficiency and front brightness of the display panel without sacrificing the overall black effect.

[0021] In other alternative embodiments, Figure 2 This is a schematic diagram of another display panel provided in an embodiment of the present invention. See also... Figure 2 The light emission angle adjustment layer 140 can be located on the second surface. Figure 3 This is a schematic diagram of another display panel provided in an embodiment of the present invention. See also... Figure 3 The light emission viewing angle adjustment layer 140 can be located between the first surface and the second surface. By configuring different distances between the light emission viewing angle adjustment layer 140 and each light-emitting sub-unit, different viewing angle requirements can be dynamically adjusted. For example, Figure 4 A schematic diagram of a light-emitting structure provided in an embodiment of the present invention is shown below. Figure 4Let 'a' be the distance between the light-emitting sub-unit and the light-emitting angle adjustment layer 140 in the horizontal direction X, 'b' be the distance between the light-emitting sub-unit and the light-emitting angle adjustment layer 140 in the vertical direction Y, and 'θ1' be the light-emitting angle. These three satisfy the following formula relationship: Tanθ1 = a / b. Here, 'a' controls the effective coverage area of ​​the light-absorbing structure in the light-emitting angle adjustment layer 140. The light-absorbing structure can be a black matrix, thus affecting the screen's light output efficiency. The larger the area of ​​the black matrix, the better the overall black effect. The distance 'b' can be set by the specific position of the light-emitting angle adjustment layer 140 within the encapsulation layer 130, without changing the size or arrangement of the light-emitting sub-unit itself. On the same display function layer 120 and encapsulation layer 130 process platform, by simply adjusting the setting position of the light-emitting angle adjustment layer 140, the differentiated requirements of different customers or application scenarios for the light-emitting angle θ1 can be dynamically adapted, significantly reducing the development cost and mass production complexity of multi-specification products. It should be noted that in the figure, the horizontal distance *a* between the edge of the light-emitting sub-unit and the edge of the light-emitting angle adjustment layer 140, and the vertical distance *b* between the top layer of the light-emitting sub-unit and the top layer of the light-emitting angle adjustment layer 140, are defined as follows. In other embodiments, parameters *a* and *b* can also be defined as the distance between the center of the light-emitting sub-unit and the center of the black matrix in the light-emitting angle adjustment layer 140 in the horizontal direction *X* and vertical direction *Y*, respectively, or other geometric features that can characterize the relative position of the two, such as the boundary of the effective light-emitting area, the geometric centroid, or the interface of the functional layer, can be used as the measurement reference. Since the technical essence of distances *a* and *b* is to limit the spatial positional relationship between the light-emitting sub-unit and the light-emitting angle adjustment layer to achieve specific viewing angle modulation and crosstalk suppression effects, rather than limiting a specific geometric reference point, the specific measurement reference is not specifically limited here.

[0022] In this embodiment of the invention, the light emission angle adjustment layer 140 is placed in the encapsulation layer 130. By pre-concentrating the light emission angle within the encapsulation layer 130, the light entering the color resist layer 150 is more concentrated, reducing Fresnel reflection loss and lateral light leakage at the color resist interface for large-angle light, and significantly improving the brightness and contrast at the front viewing angle. Since the light emission angle adjustment layer 140 is set independently of the color resist layer 150, the color resist layer 150 does not need to have a black matrix, thereby achieving higher light extraction efficiency without sacrificing the overall black effect.

[0023] Optionally, the display function layer 120 includes a pixel definition layer 125, which includes a pixel aperture D1. The light emission angle adjustment layer 140 includes an angle adjustment aperture D2. The vertical projection of the angle adjustment aperture D2 onto the substrate 110 at least covers the vertical projection of the pixel aperture D1 onto the substrate 110.

[0024] Specifically, the pixel definition layer 125 is used to define the effective light-emitting area of ​​each sub-pixel. The pixel opening D1 can expose the light-emitting layer 123 of the light-emitting sub-unit. The shape of the pixel opening D1 can be circular, elliptical, polygonal, or other irregular shapes. This determines the actual light-emitting area and initial light emission angle distribution of the light-emitting sub-unit. The light emission angle adjustment layer 140 can include a black matrix, and the spacing between the black matrices forms the angle adjustment opening to D2. The angle adjustment opening to D2 directionally modulates the light emitted from the pixel opening D1. The black matrix itself acts as a light absorber, absorbing large-angle stray light and ambient reflected light.

[0025] Light emitted from the organic light-emitting material in the display functional layer 120 exits through pixel opening D1, enters the encapsulation layer 130, and reaches the light emission viewing angle adjustment layer 140. Since the projection of the viewing angle adjustment opening onto D2 in the direction perpendicular to the substrate 110 at least covers the projection of pixel opening D1, all light emitted from pixel opening D1 can be completely received and adjusted by the viewing angle adjustment opening onto D2 area. This allows the light to be guided towards the positive viewing angle, achieving higher front brightness under the same driving current, meeting the requirements of strong outdoor light. Simultaneously, it suppresses lateral stray light, reduces ambient light reflection interference, and further enhances the all-black effect when the screen is off and the contrast ratio in bright states. Because the viewing angle adjustment opening onto D2 area completely covers pixel opening D1, after the corresponding encapsulation layer 130 fills each opening, the surface morphology of the encapsulation layer 130 is more continuous and flat, providing a uniform substrate for the subsequent coating of the color resist layer 150.

[0026] Figure 5 This is a schematic diagram of another display panel provided in an embodiment of the present invention. See also... Figure 5To further enhance the flexibility of viewing angle adjustment, at least two light-emitting viewing angle adjustment layers 140 can be disposed within the encapsulation layer 130. Each light-emitting viewing angle adjustment layer 140 includes a viewing angle adjustment opening to D2, and the size of the viewing angle adjustment opening to D2 of each layer varies in a gradient direction perpendicular to the thickness of the substrate 110, i.e., it gradually increases or gradually decreases. For example, the bottom viewing angle adjustment opening to D2 near the display functional layer 120 is smaller and is used for initial collimation. The top viewing angle adjustment opening to D2 far from the display functional layer 120 is larger and is used for beam expansion or secondary shaping. Different light-emitting viewing angle requirements can be achieved by dynamically adjusting the position of the multiple light-emitting viewing angle adjustment layers 140 in the encapsulation layer 130. The multiple light-emitting viewing angle adjustment layers 140 can be arranged adjacently or spaced apart in the thickness direction. At this point, the size of the viewing angle adjustment opening to D2 can be larger or smaller than the pixel opening D1. For example, when the size of the viewing angle adjustment opening to D2 is smaller than the pixel opening D1, the corresponding light-emitting viewing angle adjustment layer 140 is used for beam compression, physically blocking and cutting off large-angle divergent light to forcibly narrow the emission angle. Even if the viewing angle adjustment opening to D2 is smaller than the pixel opening D1, as long as the vertical projection on the substrate 110 can still cover the core of the effective light-emitting area of ​​the pixel opening D1, the brightness at the positive viewing angle will not be significantly lost. When the size of the viewing angle adjustment opening to D2 is larger than the pixel opening D1, the light-emitting viewing angle adjustment layer 140 is used for beam expansion, allowing more light from the previous stage to pass through, avoiding brightness attenuation at the positive viewing angle due to excessive blocking. Simultaneously, it works with microlenses or refractive index matching materials to redistribute edge light, improving viewing angle uniformity. Each light-emitting viewing angle adjustment layer 140 can adopt a combination of a small lower opening and a large upper opening to achieve two-stage control: collimation followed by uniform light emission. Each light emission angle adjustment layer 140 can also adopt a combination of a large opening in the lower layer and a small opening in the upper layer to achieve local sharpening under a wide viewing angle. This allows the same packaging platform to adapt to the different viewing angle characteristics of different terminals such as mobile phones and automotive devices by adjusting the number of layers, opening size, and layer spacing.

[0027] Optionally, the encapsulation layer 130 includes a first inorganic encapsulation layer 130, an organic encapsulation layer 130, and a second inorganic encapsulation layer 130 stacked together. The first inorganic encapsulation layer 130 covers the surface of the display functional layer 120 away from the substrate 110. The light emission viewing angle adjustment layer 140 is located between the first inorganic encapsulation layer 130 and the organic encapsulation layer 130. Specifically, the first inorganic encapsulation layer 130 and the second inorganic encapsulation layer 130 can be dense inorganic thin films formed by processes such as chemical vapor deposition or atomic layer deposition to block the penetration of water and oxygen molecules and protect the light-emitting units in the display functional layer 120 from environmental corrosion. The materials of the first inorganic encapsulation layer 130 and the second inorganic encapsulation layer 130 can include at least one of silicon oxide, silicon nitride, and silicon oxynitride. These materials have high water and oxygen barrier properties and good optical transmittance, ensuring that reliable encapsulation is provided without sacrificing light emission efficiency. The organic encapsulation layer 130 can be formed by inkjet printing or coating processes. The organic encapsulation layer 130 can cover particle defects and step differences on the surface of the first inorganic encapsulation layer 130 and the display functional layer 120 to form a relatively flat film layer. The use of the organic encapsulation layer 130 to form a flat surface reduces the impact on the flatness of the color resist layer 150. The light emission angle adjustment layer 140 can be disposed between the first inorganic encapsulation layer 130 and the organic encapsulation layer 130. The light emission angle adjustment layer 140 itself may have a certain surface morphology, such as patterned openings. Placing the light emission angle adjustment layer 140 below the organic encapsulation layer 130 allows the subsequently deposited organic encapsulation layer 130 to completely fill and cover the surface undulations, forming a flat upper surface and avoiding the problem of uneven color resist thickness caused by uneven substrate.

[0028] Optionally, the thickness of the first inorganic encapsulation layer 130 ranges from 0.3 μm to 1.5 μm, and the thickness ranges from 0.3 μm to 1.2 μm, ensuring sufficient water and oxygen barrier capabilities while avoiding the risk of brittle cracking due to excessive thickness. Preferably, the thickness of the first inorganic encapsulation layer 130 is between 0.5 μm and 0.9 μm, and the thickness of the second inorganic encapsulation layer 130 is between 0.5 μm and 0.8 μm, reducing the rate of film peeling and cracking during flexible bending tests.

[0029] In other embodiments, the light emission angle adjustment layer 140 may be disposed between the second inorganic encapsulation layer 130 and the organic encapsulation layer 130. Utilizing the substrate provided by the organic encapsulation layer 130, the patterning accuracy of the light emission angle adjustment layer 140 can be improved, but an additional protective layer may be added above the light emission angle adjustment layer 140 or sufficient thickness of the second inorganic encapsulation layer 130 may be relied upon to maintain surface flatness.

[0030] In other embodiments, the light emission angle adjustment layer 140 can also be disposed within the organic encapsulation layer 130. Since both the light emission angle adjustment layer 140 and the organic encapsulation layer 130 are organic materials, they can be formed sequentially in the same inkjet printing or coating equipment by adjusting the ink formulation. For example, a layer of ink containing light-absorbing material can be printed first to form the light emission angle adjustment layer 140, and then a pure transparent ink can be printed to form the main body of the organic encapsulation layer 130. This integrated molding process significantly simplifies the manufacturing process, reduces the number of interfaces, and improves light transmittance and mass production yield.

[0031] Optionally, the total thickness of the light emission angle adjustment layer 140 and the organic encapsulation layer 130 is 5 μm to 20 μm. If the total thickness is less than 5 μm, the planarization capability of the organic encapsulation layer 130 will be significantly insufficient, failing to effectively cover the particle defects and step differences on the surface of the first inorganic encapsulation layer 130, resulting in uneven film formation of the subsequent color resist layer 150. Simultaneously, if the black matrix in the light emission angle adjustment layer 140 is too thin, it will be difficult to achieve a sufficient viewing angle convergence effect. If the total thickness exceeds 20 μm, the excessively thick organic dielectric will exacerbate the risk of optical crosstalk between adjacent light-emitting subunits, reducing color purity and contrast. The preferred total thickness is 8 μm to 15 μm, ensuring sufficient planarization of the organic layer and effective modulation of the light emission angle adjustment layer 140 while avoiding bending failure and optical crosstalk risks caused by excessive thickness.

[0032] Optionally, the color resist layer 150 includes red, green, and blue color resists, with an overall thickness of 1μm to 5μm. If the color resist is too thin, its light absorption capacity is insufficient, leading to a decrease in color gamut and increased light leakage. Especially in a structure without a black matrix, lateral stray light can more easily penetrate the color resist interface, disrupting the unified black effect. Conversely, if the color resist is too thick, it will increase absorption loss in the light transmission path. The overall thickness of the color resist layer 150 is preferably 2µm to 4µm to ensure sufficient light-blocking density and color saturation, adapting to the high light transmittance structure of the color resist layer 150 without a black matrix, and improving light extraction efficiency.

[0033] Optionally, the display panel also includes a touch layer 160, located between the encapsulation layer 130 and the color filter layer 150. Specifically, the touch layer 160 can be a capacitive or resistive structure, typically composed of materials such as a metal mesh, indium tin oxide (ITO), or silver nanowires. In this embodiment, the touch layer 160 is disposed between the encapsulation layer 130 and the color filter layer 150, making the touch function independent of the encapsulation and color filter structures. Light emitted from the display function layer 120 passes sequentially through the encapsulation layer 130, the light emission angle adjustment layer 140, and the touch layer 160 before entering the color filter layer 150. The light undergoes initial angle convergence before reaching the touch layer 160, reducing the illumination of the touch metal lines by large-angle light, thereby reducing the reflected light caused by the touch layer 160.

[0034] Figure 6This is a schematic flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present invention. (See attached diagram.) Figure 6 ,include: S110. A substrate 110 is provided. The substrate 110 is used to support the display functional layer 120. The substrate 110 can be a rigid glass substrate 110 or a flexible substrate 110, such as a single-layer or double-layer PI. To balance flexible bending performance and mechanical support strength, the film thickness is 10µm to 20µm, for example, 10µm, 12µm, 14µm, 16µm, 18µm, or 20µm, and more preferably 12µm to 18µm, maintaining no cracks during bending tests while avoiding warping deformation due to excessive thinness.

[0035] S120, A display functional layer 120 is formed on the substrate 110.

[0036] Specifically, the display functional layer 120 may include a pixel circuit layer, such as an LTPS or LTPO TFT array, an anode layer, a light-emitting layer 123, and a cathode layer 124. The light-emitting layer 123 has multiple light-emitting units, each including at least a first-color light-emitting sub-unit, a second-color light-emitting sub-unit, and a third-color light-emitting sub-unit. For example, the first color, second color, and third color may be red, green, and blue, respectively. The position of each light-emitting sub-unit can be defined by the pixel definition layer 125, and patterned by vapor deposition or inkjet printing. The cathode layer 124 serves as a common electrode covering each light-emitting sub-unit, forming a complete light-emitting unit structure.

[0037] S130: An encapsulation layer 130 and a light emission viewing angle adjustment layer 140 are formed on the side of the display functional layer 120 away from the substrate 110. The encapsulation layer 130 is located within the light emission viewing angle adjustment layer 140. The encapsulation layer 130 includes a first surface and a second surface disposed opposite to each other, with the second surface adjacent to the display functional layer 120. The light emission viewing angle adjustment layer 140 is located between the first surface, the second surface, or between the first and second surfaces.

[0038] Specifically, the encapsulation layer 130 is located on the side of the display functional layer 120 away from the substrate 110, and is used to block water and oxygen intrusion to protect the light-emitting units in the display functional layer 120. The color resist layer 150 is located on the side of the encapsulation layer 130 away from the substrate 110, and is used to achieve full-color display. In this embodiment of the invention, the light emission viewing angle adjustment layer 140 is integrated inside the encapsulation layer 130, and the light emission viewing angle adjustment layer 140 absorbs colored light to achieve a seamless black effect. Figure 1In the specific embodiment shown, the light emission viewing angle adjustment layer 140 is located on the first surface of the encapsulation layer 130. Light emitted from the display function layer 120 is transmitted through the encapsulation layer 130 and its angle is modulated by the light emission viewing angle adjustment layer 140 before entering the color resist layer 150 for color filtering. Because the light emission viewing angle adjustment layer 140 is encapsulated by the encapsulation layer 130, the light has already completed its viewing angle convergence before entering the color resist layer 150, allowing more light energy to be concentrated in the positive viewing angle direction. Therefore, there is no need to set a traditional black matrix on the color resist layer 150 to block lateral light leakage. By eliminating the black matrix, the area originally occupied by the black matrix can be entirely converted into an effective light-transmitting area for the color resist, significantly increasing the area of ​​each color resist. This improves the light emission efficiency and front brightness of the display panel without sacrificing the overall black effect.

[0039] In other alternative embodiments, see Figure 2 The light emission angle adjustment layer 140 can be located on the second surface. See also Figure 3 The light emission angle adjustment layer 140 can be located between the first surface and the second surface. By configuring different distances between the light emission angle adjustment layer 140 and each light-emitting sub-unit, different viewing angle requirements can be dynamically adjusted.

[0040] S140, A color resist layer 150 is formed on the side of the encapsulation layer 130 away from the substrate 110.

[0041] Optionally, an encapsulation layer 130 and a light emission angle adjustment layer 140 are formed on the side of the display functional layer 120 away from the substrate 110, including: A first inorganic encapsulation layer 130 is formed on the side of the display functional layer 120 away from the substrate 110. A light emission viewing angle adjustment layer 140 is formed on the first inorganic encapsulation layer 130. An organic encapsulation layer 130 is formed on the light emission viewing angle adjustment layer 140, and the organic encapsulation layer 130 at least covers the light emission viewing angle adjustment layer 140. A second inorganic encapsulation layer 130 is formed on the organic encapsulation layer 130.

[0042] Specifically, a first inorganic encapsulation layer 130 is deposited on the side of the display functional layer 120 away from the substrate 110. The first inorganic encapsulation layer 130 covers the display functional layer 120 and can be prepared by chemical vapor deposition or atomic layer deposition processes, and the material is selected from at least one of silicon oxide, silicon nitride, or silicon oxynitride.

[0043] A light emission angle adjustment layer 140 is formed on the first inorganic encapsulation layer 130. The light emission angle adjustment layer 140 has a light-directed modulation function and includes a light-absorbing material, such as a viewing angle adjustment opening formed by black matrix spacing to D2. The light emission angle adjustment layer 140 is formed on the surface of the first inorganic encapsulation layer 130 using patterning processes such as photolithography, imprinting, or inkjet printing. Because the entire cathode layer 124 and the first inorganic encapsulation layer 130 provide a flat substrate, the pattern accuracy and adhesion of the light emission angle adjustment layer 140 are ensured, and the use of the first inorganic encapsulation layer 130 avoids damage to the cathode layer 124 caused by direct processing on the cathode layer 124.

[0044] An organic encapsulation layer 130 is formed on the light emission angle adjustment layer 140, and the organic encapsulation layer 130 at least completely covers the light emission angle adjustment layer 140. The organic encapsulation layer 130 is typically formed by inkjet printing or coating processes, and the organic encapsulation layer 130 fully fills the structural differences on the surface of the light emission angle adjustment layer 140, forming a flat surface after curing.

[0045] A second inorganic encapsulation layer 130 is formed on the organic encapsulation layer 130. The second inorganic encapsulation layer 130 serves as an outer water and oxygen barrier, and together with the first inorganic encapsulation layer 130, constitutes an inorganic, organic, and inorganic sandwich encapsulation structure.

[0046] Optionally, an encapsulation layer 130 and a light emission angle adjustment layer 140 are formed on the side of the display functional layer 120 away from the substrate 110, including: A first inorganic encapsulation layer 130 is formed on the side of the display functional layer 120 away from the substrate 110. A partial organic encapsulation layer 130 is formed on the first inorganic encapsulation layer 130. A light emission viewing angle adjustment layer 140 is formed on the partial organic encapsulation layer 130. A remaining organic encapsulation layer 130 is formed on the light emission viewing angle adjustment layer 140. A second inorganic encapsulation layer 130 is formed on the organic encapsulation layer 130.

[0047] Specifically, a first inorganic encapsulation layer 130 is deposited on the side of the display functional layer 120 away from the substrate 110. The first inorganic encapsulation layer 130 covers the display functional layer 120 and can be prepared by chemical vapor deposition or atomic layer deposition processes, and the material is selected from at least one of silicon oxide, silicon nitride, or silicon oxynitride.

[0048] A partial organic encapsulation layer 130 is formed on the first inorganic encapsulation layer 130. This partial organic encapsulation layer 130 does not refer to a localized area coverage, but rather to a lower sub-layer in the thickness direction, serving as a support layer for the light emission angle adjustment layer 140. Since both the light emission angle adjustment layer 140 and the organic encapsulation layer 130 are organic materials, they can be formed sequentially in the same inkjet printing or coating equipment by adjusting the ink formulation. First, a layer of pure transparent ink is printed to form the partial organic encapsulation layer 130. Then, a layer of ink containing light-absorbing material is printed to form the light emission angle adjustment layer 140. Finally, pure transparent ink is printed on the light emission angle adjustment layer 140 to form the remaining organic encapsulation layer 130. The remaining organic encapsulation layer 130 fills the structural gaps on the surface of the light emission angle adjustment layer 140. This integrated molding process significantly simplifies the manufacturing process, reduces the number of interfaces, and improves light transmittance and mass production yield.

[0049] A second inorganic encapsulation layer 130 is formed on the organic encapsulation layer 130.

[0050] Optionally, an encapsulation layer 130 and a light emission angle adjustment layer 140 are formed on the side of the display functional layer 120 away from the substrate 110, including: A first inorganic encapsulation layer 130 is formed on the side of the display functional layer 120 away from the substrate 110. An organic encapsulation layer 130 is formed on the first inorganic encapsulation layer 130. A light-viewing angle adjustment layer 140 is formed on the organic encapsulation layer 130. A second inorganic encapsulation layer 130 is formed on the light-viewing angle adjustment layer 140.

[0051] Specifically, a first inorganic encapsulation layer 130 is deposited on the side of the display functional layer 120 away from the substrate 110. The first inorganic encapsulation layer 130 covers the display functional layer 120 and can be prepared by chemical vapor deposition or atomic layer deposition processes, and the material is selected from at least one of silicon oxide, silicon nitride, or silicon oxynitride.

[0052] An organic encapsulation layer 130 is formed on the first inorganic encapsulation layer 130. The organic encapsulation layer 130 is formed by inkjet printing or coating processes, filling the structural gaps on the surface of the first inorganic encapsulation layer 130, and forming a flat surface after curing. Since the light emission angle adjustment layer 140 has not yet been formed, the leveling process of the organic encapsulation layer 130 is not affected by any underlying pattern, and a flat surface can be obtained.

[0053] An emission angle adjustment layer 140 is formed on the organic encapsulation layer 130. The emission angle adjustment layer 140 includes angle adjustment openings D2 formed by light-absorbing materials, such as black matrix spacing, for modulating the angular distribution of emitted light. Because the organic encapsulation layer 130 is flat, it facilitates alignment of the patterning process and avoids problems such as pattern distortion, broken lines, or uneven thickness caused by uneven substrate.

[0054] A second inorganic encapsulation layer 130 is formed on the light emission angle adjustment layer 140. The second inorganic encapsulation layer 130 not only serves as an outer water and oxygen barrier but also covers the light emission angle adjustment layer 140, preventing it from being damaged during subsequent color resist layer 150 or touch layer 160 fabrication processes. The surface morphology can also be further smoothed by depositing and filling the opening areas of the light emission angle adjustment layer 140.

[0055] This invention also provides a display device, including a display panel according to any embodiment of the invention, thereby having the same beneficial effects, which will not be described again here. The display device can be applied to display scenarios such as smartphones, foldable tablets, automotive displays, and smart wearable devices.

[0056] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A display panel, characterized in that, include: substrate; The display functional layer is located on one side of the substrate; The encapsulation layer is located on the side of the display functional layer away from the substrate; A light emission viewing angle adjustment layer is located within the encapsulation layer; the encapsulation layer includes a first surface and a second surface disposed opposite to each other, the second surface being adjacent to the display functional layer; wherein, the light emission viewing angle adjustment layer is located on the first surface, or on the second surface, or between the first surface and the second surface; A color resist layer is located on the side of the encapsulation layer away from the substrate.

2. The display panel according to claim 1, characterized in that, The display function layer includes a pixel definition layer, which includes a pixel opening; the light emission angle adjustment layer includes an angle adjustment opening; the vertical projection of the angle adjustment opening on the substrate at least covers the vertical projection of the pixel opening on the substrate.

3. The display panel according to claim 2, characterized in that, The encapsulation layer includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer stacked together; the first inorganic encapsulation layer is adjacent to the display function layer; The light emission angle adjustment layer is located between the first inorganic encapsulation layer and the organic encapsulation layer, between the second inorganic encapsulation layer and the organic encapsulation layer, or within the organic encapsulation layer.

4. The display panel according to claim 3, characterized in that, The materials of the first inorganic encapsulation layer and the second inorganic encapsulation layer include at least one of silicon oxide, silicon nitride, and silicon oxynitride.

5. The display panel according to claim 4, characterized in that, The thickness of the first inorganic encapsulation layer ranges from 0.3 μm to 1.5 μm; the thickness of the second inorganic encapsulation layer ranges from 0.3 μm to 1.2 μm.

6. The display panel according to claim 3, characterized in that, The total thickness of the light emission angle adjustment layer and the organic encapsulation layer is 5µm to 20µm.

7. The display panel according to claim 1, characterized in that, The thickness of the color resist layer ranges from 1µm to 5µm.

8. The display panel according to claim 1, characterized in that, It also includes a touch layer, located between the encapsulation layer and the color resist layer.

9. A method for manufacturing a display panel, characterized in that, include: Provide substrate; A display functional layer is formed on the substrate; An encapsulation layer and a light emission viewing angle adjustment layer are formed on the side of the display functional layer away from the substrate; wherein the encapsulation layer is located within the light emission viewing angle adjustment layer; the encapsulation layer includes a first surface and a second surface disposed opposite to each other, the second surface being adjacent to the display functional layer; wherein the light emission viewing angle adjustment layer is located between the first surface, the second surface, or between the first surface and the second surface; A color resist layer is formed on the side of the encapsulation layer away from the substrate; Wherein, an encapsulation layer and a light emission angle adjustment layer are formed on the side of the display functional layer away from the substrate, including: A first inorganic encapsulation layer is formed on the side of the display functional layer away from the substrate; the light emission viewing angle adjustment layer is formed on the first inorganic encapsulation layer; an organic encapsulation layer is formed on the light emission viewing angle adjustment layer, the organic encapsulation layer at least covering the light emission viewing angle adjustment layer; and a second inorganic encapsulation layer is formed on the organic encapsulation layer. Alternatively, a first inorganic encapsulation layer may be formed on the side of the display functional layer away from the substrate; a partial organic encapsulation layer may be formed on the first inorganic encapsulation layer; the light emission angle adjustment layer may be formed on the partial organic encapsulation layer; the remaining organic encapsulation layer may be formed on the light emission angle adjustment layer; and a second inorganic encapsulation layer may be formed on the organic encapsulation layer. Alternatively, a first inorganic encapsulation layer may be formed on the side of the display functional layer away from the substrate; an organic encapsulation layer may be formed on the first inorganic encapsulation layer; a light-emitting viewing angle adjustment layer may be formed on the organic encapsulation layer; and a second inorganic encapsulation layer may be formed on the light-emitting viewing angle adjustment layer.

10. A display device, characterized in that, Includes the display panel as described in any one of claims 1-8.

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