Semiconductor heating disc

Abstract

The application discloses a kind of semiconductor heating disc, it is related to semiconductor manufacturing equipment technical field, including disc body, connecting sleeve and base, the inside of the disc body is provided with heating pipe and cooling mechanism, heat conduction mechanism is arranged between the heating pipe and the cooling mechanism;The cooling mechanism includes first cooling pipe and second cooling pipe, the first cooling pipe is equipped with first liquid inlet and first liquid outlet, the first liquid inlet is arranged below the disc body, the first liquid outlet is arranged in the lateral wall of the disc body, the second cooling pipe is equipped with second liquid inlet and second liquid outlet, the second liquid inlet and the second liquid outlet are all arranged in the lateral wall of the disc body, the circumferential inner wall of the first cooling pipe is provided with several lugs, the circumferential inner wall of the second cooling pipe is provided with several acceleration sleeves.The semiconductor heating disc disclosed in the application has the effects of high cooling efficiency, small thermal shock and long service life.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing equipment technology, and in particular to a semiconductor heating plate. Background Technology

[0002] Semiconductor heating plates are core functional components in semiconductor manufacturing processes that directly support and precisely heat wafers. They are key components of specialized equipment for semiconductor devices and typically consist of a plate body, heating elements, temperature sensors, and cooling structures.

[0003] Patent application number 202210241549.4 discloses a semiconductor heating plate, including: a base, and a cover with an open bottom. A worktable assembly is disposed inside one side of the base and a drive assembly is disposed inside the side away from the worktable assembly. A partition cover is disposed in the area below the cover. A first cavity is formed in the area between the cover and the partition cover, and a first connecting post is connected to the partition cover.

[0004] However, traditional semiconductor heating plates require frequent switching between heating and cooling states during use, and the rapid heating and cooling conditions can easily damage the plate body, seriously affecting its service life.

[0005] For example, if a large flow of coolant is directly introduced to rapidly cool the heating plate after it has been used and it is in a high-temperature state, the drastic temperature change will cause severe thermal shock to the plate, which may easily lead to deformation, warping or even cracking of the plate. Summary of the Invention

[0006] This invention discloses a semiconductor heating plate, which aims to solve the technical problem that the semiconductor heating plate is easily damaged by rapid heating and cooling conditions due to the need to frequently switch between heating and cooling states during use.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: A semiconductor heating plate includes a plate body, a connecting sleeve, and a base. The plate body is provided with a heating tube and a cooling mechanism, and a heat conduction mechanism is provided between the heating tube and the cooling mechanism. The cooling mechanism includes a first cooling pipe and a second cooling pipe. The first cooling pipe has a first liquid inlet and a first liquid outlet. The first liquid inlet is located below the disk body, and the first liquid outlet is located on the side wall of the disk body. The second cooling pipe has a second liquid inlet and a second liquid outlet. Both the second liquid inlet and the second liquid outlet are located on the side wall of the disk body. A plurality of protrusions are provided on the inner circumference of the first cooling pipe, and a plurality of acceleration sleeves are provided on the inner circumference of the second cooling pipe. The heat conduction mechanism includes a heat insulation sleeve, a heat conduction sleeve, and a heat conduction rod that is movably inserted through the heat insulation sleeve. The heat conduction rod is in contact with or separate from the heating tube.

[0008] In this case, the cooling rate is further controlled by setting up two independent cooling pipes and adding different structures to the two cooling pipes. The first cooling pipe has water entering from the bottom, with a relatively slow flow rate. Multiple arc-shaped protrusions are added to the first cooling pipe near the outer ring to disturb the coolant flow, increase turbulence, and prevent excessively slow flow at the edge of the first cooling pipe. This allows for gentle cooling of the plate at high temperatures, effectively avoiding the severe thermal shock caused by directly introducing a large flow of coolant, and preventing the plate from deforming, warping, or even cracking due to rapid cooling. The second cooling pipe... The cooling system employs an acceleration sleeve with a Venturi tube structure, allowing the coolant to be rapidly ejected for quick cooling of the plate. Two cooling pipes are independently controlled, allowing selection of the appropriate pipe to be opened based on the actual plate temperature. This achieves staged cooling—first slow cooling, then rapid cooling—solving the problem of thermal shock damage caused by the unadjustable cooling rate of a single cooling pipe. Combined with a heat conduction mechanism, it enables controllable switching of the heat transfer path between the heating pipe and the cooling system. This simultaneously reduces damage to the plate from rapid heating and cooling, extending the lifespan of the heating plate, by addressing both the cooling rate and the coolant temperature difference.

[0009] In a preferred embodiment, the heat insulation sleeve is disposed between the disc body and the base, the first cooling pipe passes through the heat insulation sleeve and the base, the heat-conducting sleeve is disposed on the outer circumferential wall of the first cooling pipe, a plurality of equally spaced connecting grooves are formed on the outer circumferential wall of the heat-conducting sleeve, the heat-conducting rod is disposed in the connecting groove through a bearing, a sliding slit is formed on the outer circumferential wall of the heat insulation sleeve, the heat-conducting rod passes through the sliding slit, and a driving assembly is disposed on the bottom outer wall of the heat-conducting sleeve.

[0010] By placing a heat insulation sleeve between the plate and the base to protect the first cooling pipe from the heating pipe, a heat-conducting sleeve is installed on the outer circumference of the first cooling pipe. A connecting groove is formed on the heat-conducting sleeve, and a sliding slot is formed on the heat insulation sleeve, creating a structure that allows for the opening and closing of a heat conduction path. The first cooling pipe extends to the outside through the heat insulation sleeve and the base, with the inlet of the first cooling pipe located below the plate for easy introduction of coolant from the bottom, and the outlet located on the side wall of the plate for easy circulation and discharge of coolant. The heat-conducting sleeve, located on the outer circumference of the first cooling pipe, forms a heat-conducting and heat-insulating relationship with the heat insulation sleeve. When... When preheating is required, the heat-conducting rod extends and contacts the heating tube. Heat is conducted through the heat-conducting rod to the heat-conducting sleeve, and then from the heat-conducting sleeve to the coolant in the first cooling tube, thus achieving preheating. When preheating is not required, the heat-conducting rod retracts and separates from the heating tube. The heat-insulating sleeve blocks the conduction of heat to the first cooling tube. The heat-conducting rod passes through the sliding joint and contacts or separates from the heating tube. The sliding joint guides and limits the movement of the heat-conducting rod, ensuring that the heat-conducting rod can accurately reach the surface of the heating tube each time it extends and completely disengages each time it retracts. A drive assembly is provided on the bottom outer wall of the heat-conducting sleeve to provide a power source for the extension and retraction of the heat-conducting rod. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the overall structure of a semiconductor heating plate proposed in this invention.

[0012] Figure 2 This is a schematic cross-sectional view of a semiconductor heating plate proposed in this invention.

[0013] Figure 3 This is a schematic diagram of the internal structure of a semiconductor heating plate proposed in this invention.

[0014] Figure 4 This is a schematic diagram of the first cooling tube structure of a semiconductor heating plate proposed in this invention.

[0015] Figure 5 This is a schematic diagram of the second cooling tube structure of a semiconductor heating plate proposed in this invention.

[0016] Figure 6 For the present invention in Figure 5 A magnified schematic diagram of the structure at point A in the middle.

[0017] Figure 7 This is a schematic diagram of the heat conduction mechanism of a semiconductor heating plate proposed in this invention.

[0018] Figure 8 This is a cross-sectional schematic diagram of the heat conduction mechanism of a semiconductor heating plate proposed in this invention.

[0019] Figure 9 For the present invention in Figure 8 A magnified schematic diagram of the structure at point B in the middle.

[0020] Figure 10 This is a schematic diagram of the internal structure of the connecting sleeve of a semiconductor heating plate proposed in this invention.

[0021] In the diagram: 1. Disc; 2. Connecting sleeve; 3. Base; 4. Thermocouple; 5. First cooling pipe; 501. First liquid inlet; 502. First liquid outlet; 6. Second cooling pipe; 601. Second liquid inlet; 602. Second liquid outlet; 7. Heating pipe; 8. Cavity; 9. Electric push rod; 10. Push plate; 11. Protrusion; 12. Acceleration sleeve; 13. Heat insulation sleeve; 14. Heat conducting sleeve; 15. Support sleeve; 16. Heat conducting rod; 17. Groove; 18. Sliding seam; 19. Connecting groove; 20. Fixing groove; 21. Heat insulation plate; 22. Storage groove. Detailed Implementation

[0022] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0023] Reference Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 and Figure 10 A semiconductor heating plate includes a plate body 1, a connecting sleeve 2, and a base 3. The plate body 1 has a heating tube 7 and a cooling mechanism inside, with a heat conduction mechanism between the heating tube 7 and the cooling mechanism. The cooling mechanism includes a first cooling tube 5 and a second cooling tube 6. The first cooling tube 5 has a first liquid inlet 501 and a first liquid outlet 502. The first liquid inlet 501 is located below the plate body 1, and the first liquid outlet 502 is located on the side wall of the plate body 1. The second cooling pipe 6 is provided with a second liquid inlet 601 and a second liquid outlet 602. The second liquid inlet 601 and the second liquid outlet 602 are both located on the side wall of the disc body 1. The inner circumferential wall of the first cooling pipe 5 is provided with a plurality of protrusions 11, and the inner circumferential wall of the second cooling pipe 6 is provided with a plurality of acceleration sleeves 12. The heat conduction mechanism includes a heat insulation sleeve 13, a heat conduction sleeve 14, and a heat conduction rod 16 that is movably inserted through the heat insulation sleeve 13. The heat conduction rod 16 abuts against or separates from the heating pipe 7.

[0024] The diameter of the first cooling pipe 5 is smaller than that of the second cooling pipe 6, and the path length of the first cooling pipe 5 is greater than that of the second cooling pipe 6. The heating pipe 7, the first cooling pipe 5, and the second cooling pipe 6 are sequentially embedded in the interior of the disc body 1 in a vertical direction.

[0025] The connecting sleeve 2 is disposed on the bottom outer wall of the disc body 1, the base 3 is disposed on the bottom outer wall of the connecting sleeve 2, the base 3 has a cavity 8 inside, the end of the heating tube 7 passes through the connecting sleeve 2 and the base 3, and the end of the heating tube 7 is electrically connected to a thermocouple 4.

[0026] Specifically, by setting a connecting sleeve 2 and a base 3 at the bottom of the plate 1, and opening a cavity 8 inside the base 3, the installation stability of the heating plate under high temperature and high pressure environment is ensured. The cavity 8 provides independent installation space for other components. The end of the heating tube 7 extends through the connecting sleeve 2 and the base 3 to the outside and is electrically connected to the thermocouple 4 to realize the detection and control of the temperature of the heating tube 7.

[0027] The heating tube 7 is located on the top layer, close to the wafer working surface, so that heat can be conducted to the wafer through the shortest path, reducing heat loss, improving heating efficiency and response speed, and reducing heating power consumption. The first cooling tube 5 is located in the middle layer as a slow cooling pipeline, which can effectively absorb the heat from the upper part of the disk 1. The second cooling tube 6 is located on the bottom layer as a fast cooling pipeline, which is activated after the disk 1 has cooled down as a whole. This helps the coolant to quickly remove residual heat from the bottom of the disk 1, while avoiding direct thermal shock to the upper heating tube 7 and the wafer working surface by a large flow of coolant.

[0028] The two cooling pipes adopt different coil layouts, and through the dual differentiation design of pipe diameter and path length, the flow rate of coolant can be further controlled. The difference in pipe diameter determines the flow cross-sectional area and flow rate, while the difference in path length determines the heat exchange stroke and coolant residence time. The two work together to make the performance difference between the slow cooling and fast cooling modes more significant. The staged cooling effect can be achieved by relying on the structural characteristics of the pipes themselves.

[0029] In the specific implementation process, the cooling rate is further controlled by setting up two independent cooling pipes and adding different structures to the two cooling pipes. The first cooling pipe 5 enters water from the bottom, and the flow rate is relatively slow. Multiple arc-shaped protrusions 11 are added to the first cooling pipe near the outer ring to disturb the flow of coolant, increase the degree of turbulence, and prevent the edge of the first cooling pipe 5 from being too slow. This allows for gentle cooling of the disc 1 at high temperatures, effectively avoiding the severe thermal shock caused by directly introducing a large flow of coolant, and preventing the disc 1 from deforming, warping, or even cracking due to rapid cooling. In the second cooling pipe 6... The addition of the acceleration sleeve 12, which adopts a venturi tube structure, allows the coolant to be rapidly ejected, quickly cooling the plate 1. The two cooling pipes are independently controlled, and the appropriate pipe can be opened according to the actual temperature of the plate 1, realizing staged cooling of slow cooling followed by fast cooling. This solves the problem of thermal shock damage caused by the unadjustable cooling rate of a single cooling pipe. In conjunction with the heat conduction mechanism, the heat conduction path between the heating pipe 7 and the cooling mechanism can be controlled to open and close. This reduces the damage to the plate 1 caused by rapid heating and cooling from both the cooling rate and the coolant temperature difference dimensions, extending the service life of the heating plate.

[0030] Reference Figure 7 , Figure 8 and Figure 9 In a preferred embodiment, the heat insulation sleeve 13 is disposed between the disc body 1 and the base 3, the first cooling pipe 5 passes through the heat insulation sleeve 13 and the base 3, the heat conducting sleeve 14 is disposed on the outer circumferential wall of the first cooling pipe 5, a plurality of equally spaced connecting grooves 19 are provided on the outer circumferential wall of the heat conducting sleeve 14, and the heat conducting rod 16 is disposed in the connecting grooves 19 through bearings, a sliding slit 18 is provided on the outer circumferential wall of the heat insulation sleeve 13, the heat conducting rod 16 passes through the sliding slit 18, and a driving assembly is disposed on the bottom outer wall of the heat conducting sleeve 14.

[0031] Specifically, by placing the heat insulation sleeve 13 between the plate body 1 and the base 3 to protect the first cooling pipe 5 from the heating pipe 7, a heat-conducting sleeve 14 is provided on the outer circumference of the first cooling pipe 5. A connecting groove 19 is formed on the heat-conducting sleeve 14, and a sliding slot 18 is formed on the heat insulation sleeve 13, forming a structure that allows for the opening and closing of a heat conduction path. The first cooling pipe 5 extends to the outside through the heat insulation sleeve 13 and the base 3, so that the inlet of the first cooling pipe 5 is located below the plate body 1, facilitating the introduction of coolant from the bottom, and the outlet is located on the side wall of the plate body 1, facilitating the circulation and discharge of coolant. The heat-conducting sleeve 14 is placed on the outer circumference of the first cooling pipe 5, forming a heat-conducting and heat-insulating relationship with the heat insulation sleeve 13. When preheating is required, the heat-conducting rod 16 extends and contacts the heating tube 7. Heat is conducted through the heat-conducting rod 16 to the heat-conducting sleeve 14, and then from the heat-conducting sleeve 14 to the coolant in the first cooling tube 5, thus achieving preheating. When preheating is not required, the heat-conducting rod 16 retracts and separates from the heating tube 7. The heat insulation sleeve 13 blocks the conduction of heat to the first cooling tube 5. The heat-conducting rod 16 passes through the sliding joint 18 and contacts or separates from the heating tube 7. The sliding joint 18 guides and limits the movement of the heat-conducting rod 16, ensuring that the heat-conducting rod 16 can accurately reach the surface of the heating tube 7 each time it extends and can completely disengage each time it retracts. A drive assembly is provided on the bottom outer wall of the heat-conducting sleeve 14 to provide a power source for the extension and retraction of the heat-conducting rod 16.

[0032] The heat-conducting rod 16 is made of copper or copper alloy, which has a high thermal conductivity and can quickly conduct the heat from the heating tube 7 to the heat-conducting sleeve 14. The heat insulation sleeve 13 is made of ceramic fiber high-temperature resistant heat insulation material, which is used to block the heat conduction between the heating tube 7 and the cooling mechanism.

[0033] Reference Figure 2 and Figure 7 In a preferred embodiment, the drive assembly includes a support sleeve 15, which is disposed on the bottom outer wall of the heat-conducting sleeve 14. An electric push rod 9 is disposed on the bottom inner wall of the cavity 8. A push plate 10 is disposed on the movable end of the electric push rod 9. One end of the push plate 10 passes through the top outer wall of the base 3, and one end of the push plate 10 is connected to the bottom outer wall of the support sleeve 15. The push plate 10 has an L-shaped structure.

[0034] By setting a support sleeve 15 at the bottom of the heat-conducting sleeve 14 and an electric push rod 9 at the bottom of the cavity 8, a complete heat-conducting rod 16 driving mechanism is formed, realizing the automated and precise control of the contact and separation between the heat-conducting rod 16 and the heating tube 7. The addition of the support sleeve 15 and the push plate 10 as a buffer structure can prevent damage caused by the electric push rod 9 directly contacting the heat-conducting sleeve 14.

[0035] Reference Figure 2 , Figure 7 , Figure 8 and Figure 9 In a preferred embodiment, a fixing groove 20 is provided on one outer wall of the heat-conducting rod 16, and a heat insulation plate 21 is provided in the fixing groove 20 through a bearing. A storage groove 22 is provided on the bottom inner wall of the fixing groove 20, and the heat insulation plate 21 is connected to the storage groove 22 through a spring.

[0036] The heat insulation plate 21 is used in conjunction with the sliding joint 18 to seal the sliding joint 18 when the heat-conducting rod 16 is separated from the heating tube 7. A plurality of equally spaced grooves 17 are provided on the outer circumferential wall of the heat-conducting sleeve 14.

[0037] The heat-conducting sleeve 14 features a differentiated heat-conducting structure design by creating several U-shaped grooves 17 arranged at equal intervals on its outer circumferential wall. The heat-conducting rod 16 is positioned on one side of the heat-conducting sleeve 14 for heat conduction. The side with multiple grooves 17 has a smaller material volume and a correspondingly lower heat capacity, resulting in a faster temperature response when heated. This effectively prevents local temperature differences caused by uneven heating of the coolant at the inlet.

[0038] It should be noted that the fixing groove 20 provides installation space and rotation fulcrum for the heat insulation plate 21. The storage groove 22 is set at the bottom of the fixing groove 20. The spring is set between the storage groove 22 and the heat insulation plate 21 to provide the reset driving force for the heat insulation plate 21. When the heat-conducting rod 16 passes through the sliding groove 18 and abuts against the heating tube 7, the heat insulation plate 21 slides out of the sliding groove 18 and automatically springs open under the action of the spring, making room for the heat-conducting rod 16 to directly contact the heating tube 7. When the heat-conducting rod 16 separates from the heating tube 7, the heat-conducting rod 16 moves along the sliding groove 18, the spring is compressed into the storage groove 22, the heat insulation plate 21 resets, and the sliding groove 18 is blocked for heat insulation.

[0039] Working principle: During use, the heating tube 7 is energized to heat the disk 1. The disk 1 transfers heat to the wafer, bringing it to the required process temperature. During heating, the heat-conducting rod 16 remains separated from the heating tube 7, and the heat insulation sleeve 13 prevents heat from the heating tube 7 from being conducted to the cooling mechanism. When cooling is required after the heating process, the external temperature control system issues a control command based on the real-time temperature of the disk 1. At the high-temperature stage, the electric push rod 9 pushes the support sleeve 15 and the heat-conducting sleeve 14 downwards via the push plate 10. The heat-conducting rod 16 passes through the sliding joint 18 and abuts against the heating tube 7. At the same time, the heat insulation plate 21 springs open under the action of the spring to create a passage. At this time, the first cooling pipe 5 is opened, and the coolant enters from the first liquid inlet 501 below the disk 1 and flows slowly along the first cooling pipe 5. The coolant in the first cooling pipe 5 is preheated by the heat-conducting rod 16 and the residual heat of the heating pipe 7 is conducted to the heat-conducting sleeve 14 via the heat-conducting rod 16. The preheated coolant then gradually cools the plate 1 at a relatively mild temperature. The protrusions 11 in the first cooling pipe 5 disturb the flow of the coolant, increase the degree of turbulence, and prevent excessively slow flow at the edges. When the temperature of the plate 1 drops to the preset safety threshold, the second cooling pipe 6 is opened, and a large flow of coolant enters the second cooling pipe 6 through the second inlet 601. The acceleration sleeve 12 accelerates the spraying of coolant through the Venturi effect, quickly removing the residual heat at the bottom of the plate 1. At the same time, the electric push rod 9 drives the heat-conducting rod 16 to separate from the heating pipe 7, the heat insulation plate 21 resets and seals the sliding joint 18, cutting off the heat conduction path, and the heat insulation sleeve 13 restores its heat insulation function.

[0040] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A semiconductor heating plate, comprising a plate body (1), a connecting sleeve (2), and a base (3), characterized in that, The interior of the plate (1) is provided with a heating tube (7) and a cooling mechanism, and a heat conduction mechanism is provided between the heating tube (7) and the cooling mechanism; The cooling mechanism includes a first cooling pipe (5) and a second cooling pipe (6). The first cooling pipe (5) is provided with a first liquid inlet (501) and a first liquid outlet (502). The first liquid inlet (501) is located below the disk body (1), and the first liquid outlet (502) is located on the side wall of the disk body (1). The second cooling pipe (6) is provided with a second liquid inlet (601) and a second liquid outlet (602). Both the second liquid inlet (601) and the second liquid outlet (602) are located on the side wall of the disk body (1). A plurality of protrusions (11) are provided on the inner circumference of the first cooling pipe (5), and a plurality of acceleration sleeves (12) are provided on the inner circumference of the second cooling pipe (6). The heat conduction mechanism includes a heat insulation sleeve (13), a heat conduction sleeve (14), and a heat conduction rod (16) that is movably inserted through the heat insulation sleeve (13). The heat conduction rod (16) abuts against or separates from the heating tube (7).

2. A semiconductor heating plate according to claim 1, characterized in that, The diameter of the first cooling pipe (5) is smaller than that of the second cooling pipe (6), and the length of the pipe path of the first cooling pipe (5) is greater than that of the second cooling pipe (6).

3. A semiconductor heating plate according to claim 2, characterized in that, The heating tube (7), the first cooling tube (5) and the second cooling tube (6) are sequentially embedded in the interior of the disc (1) in a vertical direction.

4. A semiconductor heating plate according to claim 3, characterized in that, The connecting sleeve (2) is disposed on the bottom outer wall of the disc body (1), the base (3) is disposed on the bottom outer wall of the connecting sleeve (2), the base (3) has a cavity (8) inside, the end of the heating tube (7) passes through the connecting sleeve (2) and the base (3), and the end of the heating tube (7) is electrically connected to a thermocouple (4).

5. A semiconductor heating plate according to claim 4, characterized in that, The heat insulation sleeve (13) is disposed between the plate (1) and the base (3). The first cooling pipe (5) passes through the heat insulation sleeve (13) and the base (3). The heat-conducting sleeve (14) is disposed on the outer circumferential wall of the first cooling pipe (5). A plurality of equally spaced connecting grooves (19) are provided on the outer circumferential wall of the heat-conducting sleeve (14). The heat-conducting rod (16) is disposed in the connecting groove (19) through a bearing. A sliding groove (18) is provided on the outer circumferential wall of the heat insulation sleeve (13). The heat-conducting rod (16) passes through the sliding groove (18). A driving assembly is disposed on the bottom outer wall of the heat-conducting sleeve (14).

6. A semiconductor heating plate according to claim 5, characterized in that, The drive assembly includes a support sleeve (15), which is disposed on the bottom outer wall of the heat-conducting sleeve (14). An electric push rod (9) is disposed on the bottom inner wall of the cavity (8). A push plate (10) is disposed on the movable end of the electric push rod (9). One end of the push plate (10) passes through the top outer wall of the base (3), and one end of the push plate (10) is connected to the bottom outer wall of the support sleeve (15).

7. A semiconductor heating plate according to claim 6, characterized in that, The push plate (10) has an L-shaped structure.

8. A semiconductor heating plate according to claim 6, characterized in that, A fixing groove (20) is provided on one side of the outer wall of the heat-conducting rod (16). A heat insulation plate (21) is provided in the fixing groove (20) through a bearing. A storage groove (22) is provided on the bottom inner wall of the fixing groove (20). The heat insulation plate (21) is connected to the storage groove (22) through a spring.

9. A semiconductor heating plate according to claim 8, characterized in that, The heat insulation plate (21) is used in conjunction with the sliding joint (18) to seal the sliding joint (18) when the heat-conducting rod (16) is separated from the heating tube (7).

10. A semiconductor heating plate according to claim 5, characterized in that, The outer circumferential wall of the heat-conducting sleeve (14) is provided with several grooves (17) arranged at equal intervals.

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