Packaging structure, forming method and electronic device

Abstract

The present disclosure provides a packaging structure, a forming method and an electronic device, and relates to the technical field of semiconductor packaging. The packaging structure comprises a first package body having a first surface; a second package body arranged on the first surface of the first package body; and a shielding layer comprising a circumferential sidewall and a cover plate, part of the circumferential sidewall covering a sidewall of the first package body, an end of the circumferential sidewall being connected to the cover plate, the circumferential sidewall and the cover plate and the first package body forming a cavity, and the second package body being arranged in the cavity. The present disclosure effectively reduces the overall thickness of the packaging structure by integrating the shielding layer in the stacked packaging structure.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor packaging technology, and more specifically, to a packaging structure, a method for forming the packaging structure, and an electronic device. Background Technology

[0002] With the continuous advancement of integrated circuit technology and the increasing complexity of microelectronic devices, the power density of chips has significantly increased. Especially in high-performance computing, communications, and artificial intelligence, the processing power of chips continues to improve, leading to a sharp rise in their power consumption. High-power-density chips generate a large amount of heat during operation. Therefore, providing a packaging structure with good heat dissipation and a small area has become an urgent technical problem to be solved. Summary of the Invention

[0003] This disclosure provides a packaging structure, a method for forming it, and an electronic device.

[0004] According to a first aspect of the present disclosure, a packaging structure is provided, comprising: a first packaging body having a first surface; a second packaging body disposed on the first surface of the first packaging body; a shielding layer including a circumferential sidewall and a cover plate, one end of the circumferential sidewall covering the sidewall of the first packaging body, the other end of the circumferential sidewall being connected to the cover plate, the circumferential sidewall, the cover plate, and the first packaging body forming a cavity, and the second packaging body being placed within the cavity.

[0005] In some embodiments of this disclosure, the package further includes: an adhesive layer disposed on the surface of the cover plate away from the first package; and a heat dissipation layer disposed on the surface of the adhesive layer away from the first package.

[0006] In some embodiments of this disclosure, the material of the shielding layer includes one or more conductive materials selected from copper, nickel, iron, titanium, silver, cobalt, and graphene.

[0007] In some embodiments of this disclosure, the projection area of ​​the second package on the first surface is located within the projection area of ​​the first package on the first surface, the projection area of ​​the second package on the first surface is smaller than the projection area of ​​the first package on the first surface, and the first surface of the first package includes an exposed area, which is the first surface of the first package that is not covered by the second package.

[0008] In some embodiments of this disclosure, the shielding layer conformally covers the sidewalls and exposed areas of the first package, as well as the sidewalls and surfaces of the second package away from the first package.

[0009] In some embodiments of this disclosure, it further includes: a first grounding structure disposed in the exposed area of ​​the first package, the first grounding structure being electrically connected to the shielding layer.

[0010] In some embodiments of this disclosure, the package further includes: a filler block located in the exposed area of ​​the first package and placed within the cavity, wherein the surface of the filler block away from the first package is flush with the surface of the second package away from the first package; and the shielding layer conformally covers the sidewall of the first package, the sidewall of the filler block and the surface away from the first package, and the surface of the second package away from the first package.

[0011] In some embodiments of this disclosure, the filler block includes a metal heat sink or thermally conductive filler.

[0012] In some embodiments of this disclosure, the first package includes a first wiring layer, a first chip, and a second wiring layer; it also includes a second grounding structure disposed on the first wiring layer and / or the second wiring layer, wherein the second grounding structure is electrically connected to the shielding layer.

[0013] In some embodiments of this disclosure, the second package includes a third wiring layer and a second chip; it also includes: a first metal wire bonding electrically connecting the second chip to the shielding layer; and / or, a third grounding structure disposed on the third wiring layer and electrically connected to the shielding layer.

[0014] In some embodiments of this disclosure, a bonding layer is further included, disposed between the first package and the second package. The bonding layer includes a first dielectric layer and a first conductive unit, wherein the first conductive unit is disposed within the first dielectric layer and electrically connected to the first package and the second package.

[0015] In some embodiments of this disclosure, the system further includes: a printed circuit board for carrying the first package and the second package stacked thereon; and a connection layer disposed between the first package and the printed circuit board, the connection layer including a second dielectric layer and a second conductive unit, the second conductive unit being disposed within the second dielectric layer and electrically connected to the first package and the printed circuit board.

[0016] According to a second aspect of the present disclosure, a method for forming a package structure is provided, comprising: providing an initial semiconductor structure, the initial semiconductor structure including a first package and a second package stacked thereon, the second package being disposed on a first surface of the first package; forming a shielding layer, the shielding layer including a circumferential sidewall and a cover plate, one end of the circumferential sidewall covering the sidewall of the first package, the other end of the circumferential sidewall being connected to the cover plate, the circumferential sidewall, the cover plate, and the first package forming a cavity, the second package being disposed within the cavity.

[0017] In some embodiments of this disclosure, prior to forming the shielding layer, the method further includes: forming a filler block located in an exposed area of ​​the first package, the surface of the filler block away from the first package being flush with the surface of the second package away from the first package, so that the shielding layer conformally covers the sidewall of the first package, the sidewall of the filler block and the surface away from the first package, and the surface of the second package away from the first package; wherein, the projection area of ​​the second package on the first surface is located within the projection area of ​​the first package on the first surface, the projection area of ​​the second package on the first surface is smaller than the projection area of ​​the first package on the first surface, and the first surface of the first package includes an exposed area, the exposed area being the first surface of the first package not covered by the second package.

[0018] According to a third aspect of the present disclosure, an electronic device is provided, including the packaging structure described above.

[0019] In this embodiment, the packaging structure includes a first package, a second package, and a shielding layer. The first package has a first surface, and the second package is disposed on the first surface of the first package. The shielding layer includes a circumferential sidewall and a cover plate. One end of the circumferential sidewall covers the sidewall of the first package, and the other end of the circumferential sidewall is connected to the cover plate. The circumferential sidewall, the cover plate, and the first package form a cavity, and the second package is placed inside the cavity. This disclosure achieves full electromagnetic shielding for the stacked first and second packages by integrating a shielding layer in the stacked first and second packages. The circumferential sidewall, the cover plate, and the first package form a closed shielding cavity, suppressing internal or external electromagnetic interference. The shielding layer also protects both the first and second packages, reducing the number of components and the package planar area, achieving device miniaturization, and effectively reducing the overall thickness of the packaging structure.

[0020] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0021] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0022] Figure 1 A schematic diagram of the packaging structure provided in Embodiment 1 of this disclosure is shown.

[0023] Figure 2 A schematic diagram of the packaging structure provided in Embodiment 2 of this disclosure is shown.

[0024] Figure 3 A schematic diagram of the packaging structure provided in Embodiment 3 of this disclosure is shown.

[0025] Figure 4 A schematic diagram of the packaging structure provided in Embodiment 4 of this disclosure is shown.

[0026] Figure 5 A schematic diagram of the packaging structure provided in Embodiment 5 of this disclosure is shown.

[0027] Figure 6 A schematic diagram of the packaging structure provided in Embodiment Six of this disclosure is shown.

[0028] Figure 7 A flowchart illustrating a method for forming an encapsulation structure according to an embodiment of this disclosure is shown.

[0029] Figure 8 This diagram illustrates a block diagram of an electronic device provided in an embodiment of the present disclosure.

[0030] The reference numerals in the attached figures are explained as follows: 110. First package; a. First surface; a'. Second surface; 111. First wiring layer; 112. Second wiring layer; 113. First chip; 114. First molding compound; 115. First grounding structure; 116. Second grounding structure; 120. Second package; 121. Third wiring layer; 122. Second chip; 123. First metal bonding wire; 124. Third grounding structure; 125. Second molding compound; 130. Shielding layer; 131. Circumferential sidewall; 1311. First circumferential sidewall; 1312. Second circumferential sidewall; 132. Cover plate; 1321. 1322. Second cover plate; 140. Bonding layer; 141. First dielectric layer; 142. First conductive unit; 150. Connecting layer; 151. Second dielectric layer; 152. Second conductive unit; 160. Printed circuit board; 170. Adhesive layer; 180. Heat dissipation layer; 190. Filler block; 800. Electronic device; 802. Processing component; 8021. Processor; 804. Memory; 806. Power supply component; 808. Multimedia component; 810. Audio component; 812. Input / output interface; 814. Sensor component; 816. Communication component. Detailed Implementation

[0031] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore detailed descriptions of them will be omitted. Furthermore, the drawings are merely illustrative of this disclosure and are not necessarily drawn to scale.

[0032] Unless otherwise specified or stated, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “a,” “an,” “the,” “the,” and “at least one” are used to indicate the presence of one or more elements / components / etc.; the terms “comprising” and “having” are used to indicate an open-ended inclusion and to mean that there may be other elements / components / etc. in addition to those listed; the terms “first” and “second” are used only as illustrative marks and are not intended to limit the number, importance, or order of the objects.

[0033] The specific implementation methods of the embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.

[0034] Figure 1 This diagram illustrates a packaging structure provided in Embodiment 1 of the present disclosure. Figure 2 This diagram illustrates a packaging structure according to Embodiment 2 of the present disclosure. Figure 1 and Figure 2 As shown, in some embodiments, the packaging structure includes: The first package 110 has a first surface a; The second package 120 is disposed on the first surface a of the first package 110; The shielding layer 130 includes a circumferential sidewall 131 and a cover plate 132. One end of the circumferential sidewall 131 covers the sidewall of the first package 110, and the other end of the circumferential sidewall 131 is connected to the cover plate 132. The circumferential sidewall 131, the cover plate 132 and the first package 110 enclose a cavity, and the second package 120 is placed in the cavity.

[0035] The first package 110 has a first surface a and a second surface a' disposed opposite to each other, wherein the first surface a of the first package 110 is the surface that supports the second package 120, and the second surface a' is the surface of the first package 110 that is away from the second package 120.

[0036] The cross-sectional shape of the first package 110 and the second package 120 can be a rectangle, a square, a triangle or a polygon, etc. The cross-sectional shape of the first package 110 and the second package 120 can be selected according to actual needs. In this embodiment of the present disclosure, the cross-sectional shape of the first package 110 and the second package 120 is illustrated by taking a rectangle as an example, but it is not limited thereto.

[0037] like Figure 1 As shown, when the first package 110 and the second package 120 are of the same type, their dimensions can be the same; for example... Figure 2 As shown, when the first package 110 and the second package 120 are different types of packages, their dimensions can be different. Here, the aforementioned dimensions refer to one or more of the package's thickness, length, width, and package area; different dimensions refer to one or more differences in the package's thickness, length, width, and package area.

[0038] The first package 110 and the second package 120 may include one of a logic chip, a memory chip, an analog / RF chip, or a sensor chip. The first package 110 and the second package 120 may include chips of the same type or different types. For example, both the first package 110 and the second package 120 may include memory chips. Alternatively, the first package 110 may include a logic chip, and the second package 120 may include a memory chip.

[0039] like Figure 1 and Figure 2As shown, in some embodiments, the packaging structure further includes a bonding layer 140, which is disposed in the cavity between the first package 110 and the second package 120. The bonding layer 140 includes a first dielectric layer 141 and a first conductive unit 142, which is disposed in the first dielectric layer 141 and electrically connected to the first package 110 and the second package 120.

[0040] The first conductive unit 142 can be a metal pad, metal bump, solder ball, conductive adhesive, etc. One end of the first conductive unit 142 abuts against the pad on the top layer of the first package 110, and the other end is attached to the pad on the bottom layer of the second package 120, so as to realize the electrical connection between the internal circuit of the chip in the second package 120 and the first package 110. The material of the first conductive unit 142 can be a tin-silver-copper alloy.

[0041] The material of the first dielectric layer 141 can be an underfill, insulating epoxy resin, silicon oxide, silicon nitride, silicon oxynitride, silicon carbonitride, etc., used to encapsulate the first conductive structure and fill the gap between the first package 110 and the second package 120. For example, the material of the first dielectric layer 141 is an underfill.

[0042] The first dielectric layer 141 can be formed by thin film deposition processes such as physical vapor deposition, chemical vapor deposition, and thermal oxidation. The formation process of the first dielectric layer 141 can be selected or adapted according to the choice of materials and actual process design requirements, reducing the risk of oxidation of the first conductive unit 142, improving the signal transmission performance of the package structure, and achieving electrical connection between the first package 110 and the second package 120 by setting the bonding layer 140, thereby improving the reliability of the package structure.

[0043] like Figure 4 As shown, in some embodiments, the packaging structure further includes a printed circuit board 160 and a connection layer 150. The printed circuit board 160 is used to carry the stacked first package 110 and second package 120. The connection layer 150 is disposed between the first package 110 and the printed circuit board 160. The connection layer 150 includes a second dielectric layer 151 and a second conductive unit 152. The second conductive unit 152 is disposed in the second dielectric layer 151 and electrically connects the first package 110 and the printed circuit board 160, thereby realizing the connection between the first package 110 and the external circuit.

[0044] like Figure 3As shown, inside the first package 110, the first package 110 may include a first wiring layer 111, a first chip 113, and a second wiring layer 112. The first chip 113 is a logic chip, and the first chip 113 is flip-chip packaged in the cavity between the first wiring layer 111 and the second wiring layer 112. A conductive structure (such as metal bumps) and a protective layer (not shown in the figure) covering the conductive structure are provided between the first chip 113 and the first wiring layer 111. The first wiring layer 111 and the second wiring layer 112 are provided by a packaging substrate, and a plurality of through-silicon vias are provided between the first wiring layer 111 and the second wiring layer 112.

[0045] like Figure 4 As shown, a connection layer 150 is provided on the side of the second wiring layer 112 away from the first chip 113. The connection layer 150 includes a second dielectric layer 151 and a second conductive unit 152. The second conductive unit 152 is disposed in the second dielectric layer 151 and electrically connected to the printed circuit board 160 and the first wiring layer 111. The cavity between the first wiring layer 111 and the second wiring layer 112 is also filled with a first molding compound 114. The first molding compound 114 is used to protect the first chip 113, thereby ensuring that the first chip 113 works efficiently and safely.

[0046] The protective layer or the first molding compound 114 can be made of a dielectric material with high thermal conductivity to improve the heat dissipation capability of the first chip 113. For example, the protective layer or the first molding compound 114 can be made of molding compound, underfill, epoxy resin molding compound, glass, etc., and the molding compound can be resin, polyimide, etc. In this disclosure, the packaging substrate can serve as the carrier of the first wiring layer 111 or the second wiring layer 112.

[0047] like Figure 3 As shown, when the second package 120 includes a memory chip, the second package 120 includes a third wiring layer 121 and a second chip 122. The second chip 122 is a bare chip, and the number of the second chips 122 can be determined according to actual needs to increase the storage capacity of the memory chip.

[0048] exist Figure 3 In the second package 120, four second chips 122 are included. The four second chips 122 are arranged in two groups of two, with each group of two chips 122 being staggered. The second chips 122 are electrically connected to connection points on the third wiring layer 121 via second metal wire bonding. The second package 120 also includes a second molding compound 125, which is used to encapsulate the second chips 122 and the second metal wire bonding to improve the reliability of the second chips 122.

[0049] In some embodiments, the encapsulation structure may include a plurality of second encapsulation bodies 120, which are stacked sequentially on the first surface a of the first encapsulation body 110 along the thickness direction. A bonding layer 140 is provided between adjacent second encapsulation bodies 120. The implementation of the bonding layer 140 is the same as that of the bonding layer 140 disposed between the first encapsulation body 110 and the second encapsulation body 120 in the foregoing embodiments, and will not be described again here.

[0050] In some embodiments, the material of the shielding layer 130 includes one or more conductive materials selected from copper, nickel, iron, titanium, silver, cobalt, and graphene. This disclosure does not specifically limit the material of the shielding layer 130, as long as it can shield electromagnetic radiation. For example, the material of the shielding layer 130 can be copper.

[0051] The thickness of the shielding layer 130 can range from tens of nanometers to tens of micrometers, effectively shielding high-frequency electromagnetic signals as well as low-frequency electric and magnetic field signals, thereby improving the stability of the packaging structure.

[0052] like Figure 1 and Figure 2 As shown, the shielding layer 130 includes a circumferential sidewall 131 and a cover plate 132. The cross-sectional shape of the circumferential sidewall 131 can be the same as the outline shape of the first package 110 and the second package 120 after stacking.

[0053] like Figure 1 As shown, when the packaging areas of the first package 110 and the second package 120 are the same, the cross-section of the circumferential sidewall 131 is a rectangular frame, that is, the circumferential sidewall 131 includes four sidewalls. The circumferential sidewall 131 covers the sidewalls of the first package 110 and the sidewalls of the second package 120. The top of the circumferential sidewall 131 is connected to the cover plate 132, and the cover plate 132 is attached to the surface of the second package 120 away from the first package 110.

[0054] When the projected areas of the first package 110 and the second package 120 are different, the shielding layer 130 can conformally cover the first package 110 and the second package 120.

[0055] In this embodiment of the disclosure, the encapsulation structure includes a first encapsulation body 110, a second encapsulation body 120, and a shielding layer 130. The first encapsulation body 110 has a first surface a, and the second encapsulation body 120 is disposed on the first surface a of the first encapsulation body 110. The shielding layer 130 includes a circumferential sidewall 131 and a cover plate 132. One end of the circumferential sidewall 131 covers the sidewall of the first encapsulation body 110, and the other end of the circumferential sidewall 131 is connected to the cover plate 132. The circumferential sidewall 131, the cover plate 132, and the first encapsulation body 110 enclose to form a cavity, and the second encapsulation body 120 is placed in the cavity. This disclosure integrates a shielding layer 130 into the stacked first package 110 and second package 120. The circumferential sidewall 131 and the cover plate 132 enclose the first package 110 to form a closed shielding cavity, thereby achieving full-enclosed electromagnetic shielding for the stacked first package 110 and second package 120 and suppressing internal or external electromagnetic interference. The shielding layer 130 also protects the first package 110 and the second package 120, reducing the number of components and the package planar area, realizing device miniaturization, and effectively reducing the overall thickness of the package structure.

[0056] Continue to refer to Figure 2 In one embodiment, the projection area of ​​the second package 120 on the first surface a is located within the projection area of ​​the first package 110 on the first surface a, the projection area of ​​the second package 120 on the first surface a is smaller than the projection area of ​​the first package 110 on the first surface a, and the first surface a of the first package 110 includes an exposed area, which is the first surface a of the first package 110 that is not covered by the second package 120.

[0057] The line connecting the center of the first package 110 and the center of the second package 120 is perpendicular to the first surface a of the first package 110.

[0058] The projection area of ​​the first package 110 on the first surface a refers to the projection area of ​​the outer contour of the first package 110 perpendicular to the thickness direction. The projection area of ​​the second package 120 on the first surface a refers to the projection area of ​​the outer contour of the second package 120 perpendicular to the thickness direction.

[0059] The projected area of ​​the second package 120 on the first surface a is smaller than that of the first package 110. The projected area on the first surface a means that the length of the second package 120 is smaller than the length of the first package 110, and / or the width of the second package 120 is smaller than the width of the first package 110. The exposed area can be an uncovered area along the length direction on both sides of the second package 120, an uncovered area along the width direction on both sides of the second package 120, or an uncovered area around the second package 120.

[0060] like Figure 2 and Figure 3 As shown, in one embodiment, the shielding layer 130 conformally covers the sidewalls and exposed areas of the first package 110, as well as the sidewalls and surfaces of the second package 120 away from the first package 110.

[0061] Continue to refer to Figure 2 The circumferential sidewall 131 includes a first circumferential sidewall 1311 and a second circumferential sidewall 1312. The cover plate 132 includes a first cover plate 1321 and a second cover plate 1322. The first cover plate 1321 connects the top end of the first circumferential sidewall 1311 and the bottom end of the second circumferential sidewall 1312. The top end of the second circumferential sidewall 1312 connects to the second cover plate 1322. The first circumferential sidewall 1311 has a rectangular cross-section and covers the sidewall of the first package 110. The first cover plate 1321 is an annular plate and covers the exposed area of ​​the first package 110. The second circumferential sidewall 1312 has a rectangular cross-section and covers the sidewall of the second package 120. The opening of the second circumferential sidewall 1312 is smaller than the opening of the first circumferential sidewall 1311. The second cover plate 1322 is attached to the surface of the second package 120 away from the first package 110. By conformally covering the stacked first package 110 and second package 120 with the shielding layer 130, the shielding effect of the package structure can be improved.

[0062] like Figure 3 As shown, in some embodiments, the packaging structure further includes: a first grounding structure 115 disposed in the exposed area of ​​the first package 110, the first grounding structure 115 being electrically connected to the shielding layer 130, thereby maintaining the shielding layer 130 as a whole at ground potential, quickly dissipating the induced charge and static electricity on the surface of the shielding layer 130, significantly improving the electromagnetic shielding effect, and improving the high-speed signal integrity of the first package 110 and the second package 120; the first grounding structure 115 can serve as a heat conduction path to assist in dissipating the heat of the stacked packages, thereby improving the electromagnetic reliability and heat dissipation capability of the packaging structure.

[0063] The first grounding structure 115 may be provided by the redistribution layer of the first package 110 or by the pads in the exposed area of ​​the first package 110. This disclosure does not limit the specific structure of the first grounding structure 115.

[0064] This disclosure utilizes a stepped shielding layer 130 to enhance support strength, improve the mechanical deformation resistance of the shielding layer 130, effectively reduce the number of components, shrink the cavity volume, and lower the packaging size of the packaging structure.

[0065] like Figure 5 As shown, in some embodiments, the packaging structure of this disclosure further includes: The filler block 190 is located in the exposed area of ​​the first package 110 and placed in the cavity. The surface of the filler block 190 away from the first package 110 is flush with the surface of the second package 120 away from the first package 110. The shielding layer 130 conformally covers the sidewalls of the first package 110, the sidewalls of the filler block 190 and the surface away from the first package 110, and the surface of the second package 120 away from the first package 110.

[0066] The exposed space around the second package 120 is filled by the filler block 190. The outer contours of the second package 120 and the filler block 190 are consistent with the outer contours of the first package 110. The surfaces of the second package 120 and the filler block 190 are flush, making the circumferential sidewalls 131 and the cover plate 132 of the shielding layer 130 flatter, improving the thickness uniformity of the shielding layer 130 and enhancing the shielding effect.

[0067] In some embodiments, the filler block 190 includes a metal heat sink or thermally conductive filler.

[0068] The shape of the metal heat sink is the same as that of the exposed area. There may be one or more metal heat sinks. The material of the metal heat sink can be one or a combination of silver, copper, gold, aluminum, and steel; for example, the metal heat sink may be made of aluminum. The metal heat sink improves the heat dissipation effect of the first package 110 and is electrically connected to the shielding layer 130 for grounding.

[0069] The metal heat sink can be fixed to the exposed area of ​​the first package 110 by adhesive bonding. For example, the metal heat sink can be fixedly connected to the exposed area of ​​the first package 110 or to the side wall of the second package 120 by adhesive bonding.

[0070] The thermally conductive filler can be made of one or more of high thermal conductivity molding compounds and silver paste, which can effectively improve the heat dissipation of the packaging structure and ensure the data transmission performance of the first package 110 and the second package 120.

[0071] like Figure 6 As shown, in some embodiments, the first dielectric layer 141 in the bonding layer 140 can also be prepared using thermally conductive fillers, thereby simplifying the process and reducing process costs.

[0072] Continue to refer to Figure 3 In some embodiments, the first package 110 includes a first wiring layer 111, a first chip 113, and a second wiring layer 112; the package structure further includes a second grounding structure 116 disposed on the first wiring layer 111 and / or the second wiring layer 112, and the second grounding structure 116 is electrically connected to the shielding layer 130.

[0073] The second grounding structure 116 is implemented in the same way as the first grounding structure 115 in the aforementioned embodiment, and will not be described again here.

[0074] Continue to refer to Figure 3 In some embodiments, the second package 120 includes a third wiring layer 121 and a second chip 122; the package structure further includes: a first metal bonding wire 123 electrically connecting the second chip 122 and the shielding layer 130; and / or, a third grounding structure 124 disposed on the third wiring layer 121 and electrically connected to the shielding layer 130.

[0075] The first metal bonding wire 123 is a metal bonding wire, and the material of the first metal bonding wire 123 can be one or more composite metal materials selected from gold, copper, aluminum, silver, and palladium. For example, the material of the first metal bonding wire 123 is gold.

[0076] The third grounding structure 124 can be implemented in the same way as the first grounding structure 115 or the second grounding structure 116, and will not be described in detail here.

[0077] The grounding method of the encapsulation structure disclosed herein can be one or more of the first grounding structure 115, the second grounding structure 116, the first metal bonding wire 123 and the third grounding structure 124, thereby realizing the grounding of the shielding layer 130.

[0078] like Figure 4 As shown, in some embodiments, the packaging structure further includes: An adhesive layer 170 is disposed on the surface of the cover plate 132 away from the first package 110; A heat dissipation layer 180 is disposed on the surface of the adhesive layer 170 away from the first package 110.

[0079] The adhesive layer 170 is made of thermal interface materials (TIM), which can be one or more of conductive gold paste, conductive copper paste, conductive silver paste, conductive palladium paste, solder paste, conductive epoxy resin, and conductive polymer. For example, the adhesive layer 170 is formed of conductive silver paste.

[0080] It should be noted that the adhesive layer 170 may also be composed of other materials with adhesive and thermal conductivity, and this disclosure does not specifically limit it.

[0081] In this embodiment of the present disclosure, the heat generated by the first package 110 and the second package 120 can be effectively conducted to the outside of the package structure through the heat dissipation layer 180, thereby achieving effective heat dissipation of the chip, improving the stability of overall performance, and extending the service life of the chip.

[0082] The heat dissipation layer 180 may include a metal layer. For example, the material of the heat dissipation layer 180 may be one or a combination of silver, copper, gold, aluminum, and steel. For instance, the material of the heat dissipation layer 180 may be copper. The heat dissipation layer 180 is used for heat dissipation or heat equalization. Regarding the material of the heat dissipation layer 180, this disclosure embodiment does not make specific limitations, as long as it is a material that can quickly conduct heat.

[0083] The heat dissipation layer 180 is one or more of a metal cover, metal sheet, wafer, or metal coating. For example, the heat dissipation layer 180 may be a solid copper plate made of copper. This disclosure does not specifically limit the material and shape of the heat dissipation layer 180.

[0084] In some embodiments, the heat dissipation layer 180 is fixedly connected to the shielding layer 130 by the adhesive layer 170, which can eliminate the shielding cover in the packaging structure, thereby reducing the overall thickness. Compared with the stacked packaging structure in the related technology, only one adhesive layer 170 is directly connected to the heat dissipation layer 180, which effectively improves the heat dissipation performance. Compared with the stacked packaging structure in the related technology, a shielding cover and a heat dissipation cover can be eliminated, which greatly saves the area of ​​the printed circuit board 160.

[0085] In this embodiment of the disclosure, the synergistic effect of the adhesive layer 170 and the heat dissipation layer 180 achieves effective heat dissipation of the packaging structure. By stacking and integrating the shielding layer 130, the structure of the adhesive layer 170 and the heat dissipation layer 180 can be effectively simplified, thereby improving the heat dissipation performance and shielding effect of the packaging structure.

[0086] Figure 7 This illustration shows a method for forming a packaging structure according to an embodiment of the present disclosure. For example... Figure 7 As shown, in some embodiments, the method of forming the packaging structure includes S702 and S704.

[0087] S702, providing an initial semiconductor structure, the initial semiconductor structure including a first package 110 and a second package 120 stacked together, the second package 120 being disposed on the first surface a of the first package 110; S704. A shielding layer 130 is formed. The shielding layer 130 includes a circumferential sidewall 131 and a cover plate 132. One end of the circumferential sidewall 131 covers the sidewall of the first package 110, and the other end of the circumferential sidewall 131 is connected to the cover plate 132. The circumferential sidewall 131, the cover plate 132 and the first package 110 enclose each other to form a cavity, and the second package 120 is placed in the cavity.

[0088] When the second package 120 includes a memory chip, the second package 120 includes a third wiring layer 121 and a second chip 122. The second chip 122 is a bare chip, and the number of the second chips 122 can be determined according to actual needs to increase the storage capacity of the memory chip.

[0089] The second package 120 includes four second chips 122, arranged in two groups of two. Each group of two chips 122 is staggered. The second chips 122 are electrically connected to connection points on the third wiring layer 121 via second metal wire bonding. The second package 120 also includes a second molding compound 125, which encapsulates the second chips 122 and the second metal wire bonding to improve the reliability of the second chips 122.

[0090] The packaging structure may include a plurality of second packages 120, which are stacked sequentially on the first surface a of the first package 110 along the thickness direction, and a bonding layer 140 is provided between adjacent second packages 120.

[0091] In some embodiments, the shielding layer 130 can be prepared by processes such as spraying, 3D printing, or physical vapor deposition (PVD).

[0092] The shielding layer 130 is made of one or more conductive materials selected from copper, nickel, iron, titanium, silver, cobalt, and graphene. The thickness of the shielding layer 130 can range from tens of nanometers to tens of micrometers, effectively shielding high-frequency electromagnetic signals, as well as low-frequency electric and magnetic field signals, thereby improving the stability of the packaging structure.

[0093] The shielding layer 130 includes a circumferential sidewall 131 and a cover plate 132. The cross-sectional shape of the circumferential sidewall 131 may be the same as the outline shape of the first package 110 and the second package 120 after stacking.

[0094] When the projected areas of the first package 110 and the second package 120 are different, the shielding layer 130 can conformally cover the first package 110 and the second package 120.

[0095] In this embodiment, by forming a shielding layer 130 with the stacked first package 110 and second package 120, the circumferential sidewall 131 and the cover plate 132 enclose the first package 110 to form a closed shielding cavity, achieving full-enclosed electromagnetic shielding for the stacked first package 110 and second package 120, suppressing internal or external electromagnetic interference; the shielding layer 130 also protects the first package 110 and second package 120, reducing the number of components and the package planar area, realizing device miniaturization, and effectively reducing the overall thickness of the package structure.

[0096] In some embodiments, prior to the formation of the shielding layer 130 in S704, the method further includes: A filler block 190 is formed, located in the exposed area of ​​the first package 110. The surface of the filler block 190 away from the first package 110 is flush with the surface of the second package 120 away from the first package 110, so that the shielding layer 130 conformally covers the sidewall of the first package 110, the sidewall of the filler block 190 and the surface away from the first package 110, and the surface of the second package 120 away from the first package 110. The projection area of ​​the second package 120 on the first surface a is located within the projection area of ​​the first package 110 on the first surface a. The projection area of ​​the second package 120 on the first surface a is smaller than the projection area of ​​the first package 110 on the first surface a. The first surface a of the first package 110 includes an exposed area, which is the first surface a of the first package 110 that is not covered by the second package 120.

[0097] The projected area of ​​the second package 120 on the first surface a is smaller than that of the first package 110. The projected area on the first surface a means that the length of the second package 120 is smaller than the length of the first package 110, and / or the width of the second package 120 is smaller than the width of the first package 110. The exposed area can be an uncovered area along the length direction on both sides of the second package 120, an uncovered area along the width direction on both sides of the second package 120, or an uncovered area around the second package 120.

[0098] The exposed space around the second package 120 is filled by the filler block 190. The outer contours of the second package 120 and the filler block 190 are consistent with the outer contours of the first package 110. The surfaces of the second package 120 and the filler block 190 are flush, making the circumferential sidewalls 131 and the cover plate 132 of the shielding layer 130 flatter, improving the thickness uniformity of the shielding layer 130 and enhancing the shielding effect.

[0099] The filler block 190 includes a metal heat sink or thermally conductive filler.

[0100] The shape of the metal heat sink is the same as the shape of the exposed area. There may be one or more metal heat sinks. The material of the metal heat sink can be one or a combination of silver, copper, gold, aluminum, and steel; for example, the material of the metal heat sink may be aluminum. The metal heat sink can be fixed to the exposed area of ​​the first package 110 by adhesive bonding.

[0101] Thermally conductive filler can be filled by injection molding or 3D printing. The material of the thermally conductive filler can be one or more of high thermal conductivity molding compound and silver paste, which can effectively improve the heat dissipation of the packaging structure and ensure the data transmission performance of the first package 110 and the second package 120.

[0102] In some embodiments, the method for forming the packaging structure disclosed herein further includes: An adhesive layer 170 is formed, wherein the adhesive layer 170 is disposed on the surface of the cover plate 132 away from the first package 110; A heat dissipation layer 180 is formed, wherein the heat dissipation layer 180 is disposed on the surface of the adhesive layer 170 away from the first package 110.

[0103] The adhesive layer 170 is made of thermal interface materials (TIM), which can be one or more of conductive gold paste, conductive copper paste, conductive silver paste, conductive palladium paste, solder paste, conductive epoxy resin, and conductive polymer.

[0104] The heat dissipation layer 180 may include a metal layer; for example, the material of the heat dissipation layer 180 may be one or a combination of silver, copper, gold, aluminum, and steel. The heat dissipation layer 180 may be one or more of a metal cover, a metal sheet, a wafer, or a metal coating. For example, the heat dissipation layer 180 may be a solid copper plate made of copper.

[0105] By fixing the heat dissipation layer 180 and the shielding layer 130 together with the adhesive layer 170, the shielding cover can be removed from the packaging structure, thereby reducing the overall thickness. Compared with the stacked packaging structure in related technologies, the heat dissipation layer 180 is directly connected by only one adhesive layer 170, which effectively improves the heat dissipation performance. Compared with the stacked packaging structure in related technologies, a shielding cover and a heat dissipation cover can be eliminated, which greatly saves the area of ​​the printed circuit board 160.

[0106] In some embodiments, S702 above provides an initial semiconductor structure, including: A first package 110 is provided, the first package 110 including a first wiring layer 111, a first chip 113 and a second wiring layer 112; A second package 120 is provided, the second package 120 including a third wiring layer 121 and a second chip 122; A bonding layer 140 is formed to bond the first package 110 and the second package 120. The bonding layer 140 includes a first dielectric layer 141 and a first conductive unit 142. The first conductive unit 142 is disposed in the first dielectric layer 141 and electrically connected to the second wiring layer 112 and the third wiring layer 121.

[0107] In some embodiments, the first package 110 further includes a first grounding structure 115 and / or a second grounding structure 116. The first grounding structure 115 is disposed in the exposed area of ​​the first package 110 and is electrically connected to the shielding layer 130; the second grounding structure 116 is disposed in the first wiring layer 111 and / or the second wiring layer 112 and is electrically connected to the shielding layer 130.

[0108] In some embodiments, the second package 120 further includes a first metal bonding wire 123 and / or a third grounding structure 124, wherein the first metal bonding wire 123 is electrically connected to the second chip 122 and the shielding layer 130; and the third grounding structure 124 is disposed on the third wiring layer 121 and is electrically connected to the shielding layer 130.

[0109] The grounding method of the encapsulation structure disclosed herein can be one or more of the first grounding structure 115, the second grounding structure 116, the first metal bonding wire 123 and the third grounding structure 124, thereby realizing the grounding of the shielding layer 130.

[0110] According to another aspect of this disclosure, Figure 8 This is a block diagram illustrating an electronic device according to an exemplary embodiment of the present disclosure. The electronic device 800 includes the packaging structure provided in the above embodiments. For example, the electronic device 800 may be a mobile phone, computer, digital broadcasting terminal, messaging device, game console, tablet device, medical device, fitness equipment, personal digital assistant, etc. The electronic device 800 may also be a mobile device such as a mobile phone, tablet, or smartwatch.

[0111] Reference Figure 8 The electronic device 800 may include one or more of the following components: a processing component 802, a memory 804, a power supply component 806, a multimedia component 808, an audio component 810, an input / output (I / O) interface 812, a sensor component 814, and a communication component 816.

[0112] Processing component 802 typically controls the overall operation of electronic device 800, such as operations associated with display, telephone calls, data communication, camera operation, and recording operations. Processing component 802 may include one or more processors 8021 to execute instructions, and processor 8021 may include the aforementioned packaging structure. Furthermore, processing component 802 may include one or more modules to facilitate interaction between processing component 802 and other components. For example, processing component 802 may include a multimedia module to facilitate interaction between multimedia component 808 and processing component 802.

[0113] Memory 804 is configured to store various types of data to support the operation of electronic device 800. Examples of such data include any application or instruction used to operate on electronic device 800, contact data, phonebook data, messages, pictures, videos, etc. Memory 804 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0114] Power supply component 806 provides power to various components of electronic device 800. Power supply component 806 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to electronic device 800.

[0115] Multimedia component 808 includes a screen that provides an output interface between electronic device 800 and user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touchscreen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensors may sense not only the boundaries of touch or swipe actions but also the duration and pressure associated with the touch or swipe operation. In some embodiments, multimedia component 808 includes a front-facing camera and / or a rear-facing camera. When electronic device 800 is in an operating mode, such as a shooting mode or video mode, the front-facing camera and / or rear-facing camera may receive external multimedia data. Each front-facing camera and rear-facing camera may be a fixed optical lens system or have focal length and optical zoom capabilities.

[0116] Audio component 810 is configured to output and / or input audio signals. For example, audio component 810 includes a microphone (MIC) configured to receive external audio signals when electronic device 800 is in an operating mode, such as call mode, recording mode, and voice recognition mode. The received audio signals may be further stored in memory 804 or transmitted via communication component 816. In some embodiments, audio component 810 also includes a speaker for outputting audio signals.

[0117] I / O interface 812 provides an interface between processing component 802 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to, home buttons, volume buttons, power buttons, and lock buttons.

[0118] Sensor assembly 814 includes one or more sensors for providing state assessments of various aspects of electronic device 800. For example, sensor assembly 814 may detect the on / off state of electronic device 800, the relative positioning of components such as the display and keypad of electronic device 800, changes in position of electronic device 800 or a component of electronic device 800, the presence or absence of user contact with electronic device 800, orientation or acceleration / deceleration of electronic device 800, and temperature changes of electronic device 800. Sensor assembly 814 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. Sensor assembly 814 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, sensor assembly 814 may also include an accelerometer, gyroscope, magnetometer, pressure sensor, or temperature sensor.

[0119] Communication component 816 is configured to facilitate wired or wireless communication between electronic device 800 and other devices. Electronic device 800 can access wireless networks based on communication standards, such as Wi-Fi, 3G, 4G, 8G, 6G, or combinations thereof. In some embodiments of this disclosure, communication component 816 receives broadcast signals or broadcast-related information from an external broadcast management system via a broadcast channel. In some embodiments of this disclosure, communication component 816 also includes a near-field communication (NFC) module to facilitate short-range communication. For example, the NFC module may be implemented based on radio frequency identification (RFID) technology, Infrared Data Association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

[0120] In some embodiments of this disclosure, the electronic device 800 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components for executing programs or instructions.

[0121] Of course, in practical applications, the position of the packaging structure can be flexibly adjusted according to factors such as the specific shape, size, internal structure and heat dissipation performance requirements of the electronic device. This disclosure does not limit this aspect.

[0122] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the appended claims.

[0123] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A packaging structure, characterized in that, include: A first package having a first surface; The second package is disposed on the first surface of the first package; The shielding layer includes a circumferential sidewall and a cover plate. One end of the circumferential sidewall covers the sidewall of the first package, and the other end of the circumferential sidewall is connected to the cover plate. The circumferential sidewall, the cover plate, and the first package form a cavity, and the second package is placed in the cavity.

2. The packaging structure according to claim 1, characterized in that, Also includes: An adhesive layer is disposed on the surface of the cover plate away from the first package body; A heat dissipation layer is disposed on the surface of the adhesive layer away from the first package.

3. The packaging structure according to claim 1, characterized in that, The shielding layer is made of one or more conductive materials selected from copper, nickel, iron, titanium, silver, cobalt, and graphene.

4. The packaging structure according to claim 3, characterized in that, The projection area of ​​the second package on the first surface is located within the projection area of ​​the first package on the first surface. The projection area of ​​the second package on the first surface is smaller than the projection area of ​​the first package on the first surface. The first surface of the first package includes an exposed area, which is the first surface of the first package that is not covered by the second package.

5. The packaging structure according to claim 4, characterized in that, The shielding layer conformally covers the sidewalls and exposed areas of the first package, as well as the sidewalls and surfaces of the second package away from the first package.

6. The packaging structure according to claim 5, characterized in that, Also includes: A first grounding structure is disposed in the exposed area of ​​the first package, and the first grounding structure is electrically connected to the shielding layer.

7. The packaging structure according to claim 4, characterized in that, Also includes: A filler block is located in the exposed area of ​​the first package and placed inside the cavity, with the surface of the filler block away from the first package being flush with the surface of the second package away from the first package. The shielding layer conformally covers the sidewall of the first package, the sidewall of the filler block and the surface away from the first package, and the surface of the second package away from the first package.

8. The packaging structure according to claim 7, characterized in that, The filler block includes a metal heat sink or a thermally conductive filler.

9. The packaging structure according to claim 1, characterized in that, The first package includes a first wiring layer, a first chip, and a second wiring layer; Also includes: A second grounding structure is disposed on the first wiring layer and / or the second wiring layer, and the second grounding structure is electrically connected to the shielding layer.

10. The packaging structure according to claim 1, wherein the second package includes a third wiring layer and a second chip; Also includes: The first metal wire is electrically connected to the second chip and the shielding layer; And / or, The third grounding structure is located on the third wiring layer and is electrically connected to the shielding layer.

11. The packaging structure according to claim 1, characterized in that, Also includes: A bonding layer is disposed in the cavity between the first package and the second package. The bonding layer includes a first dielectric layer and a first conductive unit. The first conductive unit is disposed in the first dielectric layer and electrically connected to the first package and the second package.

12. The packaging structure according to claim 1, characterized in that, Also includes: A printed circuit board for carrying the first package and the second package that are stacked together; A connection layer is disposed between the first package and the printed circuit board. The connection layer includes a second dielectric layer and a second conductive unit. The second conductive unit is disposed within the second dielectric layer and electrically connects the first package and the printed circuit board.

13. A method for forming an encapsulation structure, characterized in that, include: An initial semiconductor structure is provided, the initial semiconductor structure comprising a first package and a second package stacked together, the second package being disposed on a first surface of the first package; A shielding layer is formed, the shielding layer including a circumferential sidewall and a cover plate, one end of the circumferential sidewall covers the sidewall of the first package, the other end of the circumferential sidewall is connected to the cover plate, the circumferential sidewall, the cover plate and the first package form a cavity, and the second package is placed in the cavity.

14. The method according to claim 13, characterized in that, Prior to forming the shielding layer, the method further includes: A filler block is formed, the filler block being located in the exposed area of ​​the first package, the surface of the filler block away from the first package being flush with the surface of the second package away from the first package, so that the shielding layer conformally covers the sidewall of the first package, the sidewall and the surface of the filler block away from the first package, and the surface of the second package away from the first package; Wherein, the projection area of ​​the second package on the first surface is located within the projection area of ​​the first package on the first surface, the projection area of ​​the second package on the first surface is smaller than the projection area of ​​the first package on the first surface, and the first surface of the first package includes an exposed area, which is the first surface of the first package that is not covered by the second package.

15. An electronic device, characterized in that, Includes the packaging structure described in any one of claims 1-12.

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