Semiconductor circuit breaker and electrical cabinet using semiconductor circuit breaker

Abstract

An electrical cabinet (100) using a semiconductor circuit breaker is obtained, which is capable of cooling a conductor element and is configured to save space compared to the past. The electrical cabinet (100) using a semiconductor circuit breaker (3) has the semiconductor circuit breaker (3) that switches on and off a current flowing in a circuit between a first terminal and a second terminal, and a bus bar (22) that is connected to the first terminal of a semiconductor element through which the semiconductor circuit breaker (3) flows a current, and has a heat dissipation function.

Description

Technical Field

[0001] This invention relates to semiconductor circuit breakers and electrical cabinets using semiconductor circuit breakers, wherein the semiconductor circuit breaker uses semiconductor elements as switches. Background Technology

[0002] Conventionally, distribution panels using semiconductor circuit breakers that distribute power to multiple loads are known. Patent Document 1 discloses a distribution panel comprising: multiple semiconductor circuit breakers having power supply side terminals and load side terminals, semiconductor elements disposed between the power supply side terminals and load side terminals, and a thermally conductive heat diffuser configured to transfer heat from the semiconductor elements; a heat sink in thermal contact with the thermally conductive heat diffuser; and a stacked busbar connected to the power supply side terminals of the semiconductor circuit breakers.

[0003] Patent Document 1: U.S. Patent Application Publication No. 2020 / 0395739 Summary of the Invention

[0004] However, in the technology described in Patent Document 1, since a semiconductor circuit breaker is used, the on-resistance of the semiconductor element used in the semiconductor circuit breaker is higher than that of the contacts in a mechanical contact circuit breaker. Therefore, in addition to the busbar used to connect to the power supply side terminals of the semiconductor circuit breaker, a heat sink is also required for cooling the semiconductor element, which presents a problem of needing additional space for cooling.

[0005] The present invention was made in view of the above circumstances, and its object is to provide an electrical cabinet that uses a semiconductor circuit breaker, which can cool the semiconductor components and can be constructed in a space-saving manner compared to the past.

[0006] To address the aforementioned issues and achieve the objectives, the electrical cabinet using a semiconductor circuit breaker according to the present invention comprises: a semiconductor circuit breaker that switches the connection and disconnection of current flowing in the circuit between a first terminal and a second terminal; and a busbar connected to the first terminal of the semiconductor element supplying current to the semiconductor circuit breaker, and having a heat dissipation function.

[0007] The effects of the invention

[0008] The electrical cabinet using a semiconductor circuit breaker according to the present invention has the following effects: it can cool semiconductor components and can be constructed in a space-saving manner compared to the past. Attached Figure Description

[0009] Figure 1 This is a front view showing an example of an electrical cabinet using a semiconductor circuit breaker according to Embodiment 1.

[0010] Figure 2 This is a side view showing an example of an electrical cabinet using a semiconductor circuit breaker according to Embodiment 1.

[0011] Figure 3 It means Figure 1 The diagram shows a single-wire wiring diagram of an example of the electrical connections of the electrical cabinet.

[0012] Figure 4 It means Figure 1 An oblique view of an example of the structure of the base unit shown.

[0013] Figure 5 It means Figure 4 The front view shows an example of the structure of the base.

[0014] Figure 6 It means Figure 4 A side view of an example of the structure of the base shown.

[0015] Figure 7 It means Figure 4 The rear view shows an example of the structure of the base.

[0016] Figure 8 An example illustrating the mounting of a semiconductor circuit breaker on a base is a partially enlarged oblique view.

[0017] Figure 9 It means Figure 1 An angle view of an example of the back structure of a semiconductor circuit breaker unit.

[0018] Figure 10 It is Figure 9 An enlarged oblique view of the main part of the back of the semiconductor circuit breaker shown.

[0019] Figure 11 This is a perspective view showing an example of the construction of the power supply side terminals of a semiconductor circuit breaker and the power supply side terminal access terminals of the base.

[0020] Figure 12 It means Figure 9 A cross-sectional view of an example of the internal structure of a semiconductor circuit breaker is shown.

[0021] Figure 13 It means Figure 9 The circuit diagram shows an example of the circuit structure of a semiconductor circuit breaker.

[0022] Figure 14 It means Figure 13 A diagram showing an example of the structure of a semiconductor element in a semiconductor module.

[0023] Figure 15 It means Figure 13 A diagram showing an example of the structure of a semiconductor element in a semiconductor module.

[0024] Figure 16 It means Figure 13 A diagram showing an example of the structure of a semiconductor element in a semiconductor module.

[0025] Figure 17 This is a cross-sectional view schematically illustrating an example of the structure of a semiconductor circuit breaker and its base when the semiconductor circuit breaker is mounted on a base.

[0026] Figure 18 This is a perspective view showing an example of a semiconductor circuit breaker being mounted on a base.

[0027] Figure 19 It is a different perspective. Figure 18 A perspective view of the state.

[0028] Figure 20 This is a single-wire wiring diagram showing an example of the electrical connection of an electrical cabinet using a semiconductor circuit breaker according to Embodiment 2.

[0029] Figure 21 It means Figure 20 An angle view of an example of the back structure of a semiconductor circuit breaker unit.

[0030] Figure 22 It means Figure 20 The circuit diagram shows an example of the circuit structure of a semiconductor circuit breaker.

[0031] Figure 23 It means Figure 20 A cross-sectional view of an example of the internal structure of a semiconductor circuit breaker is shown.

[0032] Figure 24 This is a cross-sectional view schematically illustrating an example of the structure of a semiconductor circuit breaker and its base when the semiconductor circuit breaker is mounted on a base.

[0033] Figure 25 This is a circuit diagram illustrating an example of the circuit structure of the semiconductor circuit breaker involved in Embodiment 3.

[0034] Figure 26 This is a cross-sectional view showing an example of the structure of the semiconductor element on the power supply side inside the semiconductor circuit breaker according to Embodiment 3.

[0035] Figure 27This is a cross-sectional view showing an example of the structure of the semiconductor element on the power supply side inside the semiconductor circuit breaker according to Embodiment 3. Detailed Implementation

[0036] The semiconductor circuit breaker and the electrical cabinet using the semiconductor circuit breaker according to embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0037] Implementation Method 1

[0038] Figure 1 This is a front view showing an example of an electrical cabinet using a semiconductor circuit breaker according to Embodiment 1. Figure 2 This is a side view illustrating an example of an electrical cabinet using a semiconductor circuit breaker according to Embodiment 1. (As shown) Figure 1 and Figure 2 As shown, the electrical cabinet 100 using the semiconductor circuit breaker 3 according to Embodiment 1 has a panel 4, which serves as a base for fixing the equipment constituting the electrical cabinet 100. In one example, the panel 4 is a plate-shaped component. The electrical cabinet 100 has on the panel 4: a main circuit breaker 1 having a power supply side terminal 11 and a load side terminal 12; a base 2 relative to which the semiconductor circuit breaker 3 can be mounted and dismounted; and wiring 5 connecting the poles of the load side terminal 12 of the main circuit breaker 1 to the poles of the base 2.

[0039] The power supply side terminal 11 of the main circuit breaker 1 is connected to an AC power source (not shown), and the load side terminal 12 is connected to the base 2. The base 2 is a substrate capable of mounting a semiconductor circuit breaker 3. The base 2 has multiple semiconductor circuit breaker mounting areas 200 for mounting and dismounting the semiconductor circuit breaker 3. In this example, an example is shown where the base 2 has eight semiconductor circuit breaker mounting areas 200, and semiconductor circuit breakers 3 are mounted in six of these areas. The semiconductor circuit breaker 3 is mounted on the base 2 via the semiconductor circuit breaker mounting areas 200 of the base 2.

[0040] Figure 3 It means Figure 1 The diagram shows a single-wire wiring diagram as an example of the electrical connections of the electrical cabinet. The electrical connections of the equipment constituting the electrical cabinet 100 are as follows: Figure 3 As shown, the main circuit breaker 1 is connected to the AC power supply 7. Furthermore, the main circuit breaker 1 is connected to each semiconductor circuit breaker 3 via a busbar 22 mounted on the base 2 through wiring 5. That is, power is supplied from the AC power supply 7 to each semiconductor circuit breaker 3 via the main circuit breaker 1, wiring 5, and busbar 22. Loads 6 are connected to the respective load 6 side of each semiconductor circuit breaker 3, and power is supplied from the semiconductor circuit breaker 3 to the load 6.

[0041] Next, the construction of base 2 will be explained. Figure 4 It means Figure 1 An oblique view of an example of the structure of the base unit shown. Figure 5 It means Figure 4 The front view shows an example of the structure of the base. Figure 6 It means Figure 4 A side view of an example of the structure of the base shown. Figure 7 It means Figure 4 The rear view shows an example of the structure of the base. Figure 8 An example illustrating the mounting of a semiconductor circuit breaker on a base is a partially enlarged oblique view.

[0042] The base 2 has: a base frame 21, which is mounted on the panel 4; and a first busbar 22a, a second busbar 22b and a third busbar 22c, which are disposed on the back of the base frame 21 and can be connected to the load side terminal 12 of the main circuit breaker 1 via wiring 5 respectively.

[0043] The base frame 21 includes: a plate portion 25, relative to which the semiconductor circuit breaker 3 can be mounted and dismounted; and a foot portion 26, which supports the plate portion 25 on the panel 4. The plate portion 25 is the part for mounting the semiconductor circuit breaker 3 and is composed of a plate-shaped member with a flat surface. Here, an example of a rectangular plate-shaped member is shown. The foot portion 26 is configured such that the plate portion 25 is separated from the upper surface of the panel 4 by a predetermined distance. Here, the foot portion 26 is provided along a pair of long sides of the rectangular plate portion 25. The space formed by the plate portion 25 and the foot portion 26 of the base frame 21 and the panel 4 becomes a space where the first busbar 22a, the second busbar 22b, and the third busbar 22c can be installed. Hereinafter, without distinguishing between the first busbar 22a, the second busbar 22b, and the third busbar 22c, they will also be referred to as busbar 22.

[0044] Furthermore, the base frame 21 has multiple heat transfer windows 211 as openings in each semiconductor circuit breaker mounting area 200 of the plate portion 25. In this example, an example is shown where three rectangular heat transfer windows 211 are provided in one semiconductor circuit breaker mounting area 200. The heat transfer windows 211 are openings for transferring heat from the semiconductor circuit breaker 3 to the busbar 22, allowing components of the semiconductor circuit breaker 3 to contact the busbar 22. The base frame 21 also has: a power supply side terminal access terminal 212, which is located near each heat transfer window 211 and is used to access the power supply side terminal of the semiconductor circuit breaker 3 (described later); and multiple base frame insertion slots 213, which are located on both sides of each heat transfer window 211 for insertion into the base frame insertion portion of the semiconductor circuit breaker 3 (described later). In this example, one power supply side terminal access terminal 212 and three base frame insertion slots 213 are provided relative to one heat transfer window 211.

[0045] The busbar 22 is provided on the back side of the plate portion 25 of the base frame 21, corresponding to the heat transfer window 211, in a manner that covers the heat transfer window 211. In this example, three busbars, namely the first busbar 22a, the second busbar 22b, and the third busbar 22c, are provided at intervals along the width direction of the plate portion 25 to completely cover one row of heat transfer windows 211 arranged along the length direction of the plate portion 25. Specifically, the busbar 22 is fixed to the plate portion 25 in a manner that covers the heat transfer window 211 from the back side of the plate portion 25.

[0046] Busbar 22 has: a flat contact portion 221 that contacts the component of the semiconductor circuit breaker 3 that is inserted into the heat transfer window 211; and a heat dissipation fin 222 connected to the contact portion 221. The contact portion 221 is configured to cover the heat transfer window 211. An opening 223 is provided on the contact portion 221 corresponding to the power supply side terminal access terminal 212 and the base frame insertion port 213 provided on the plate portion 25. In this example, the heat dissipation fin 222 is erected vertically relative to the contact portion 221 along its long side. Busbar 22 functions to diffuse heat from the semiconductor circuit breaker 3 to the outside by contacting the component of the semiconductor circuit breaker 3 through the heat transfer window 211. In addition, busbar 22 functions to allow current from the main circuit breaker 1 to flow to the semiconductor circuit breaker 3 by contacting the power supply side terminal of the semiconductor circuit breaker 3 through the opening 223 corresponding to the power supply side terminal access terminal 212. Therefore, in one example, the busbar 22 is made of metals with low thermal conductivity and electrical resistance, such as aluminum or copper.

[0047] Next, the semiconductor circuit breaker 3 that can be installed on the base 2 will be described. Figure 9 It means Figure 1 An angle view of an example of the back structure of a semiconductor circuit breaker unit. Figure 10 It is Figure 9 The diagram shows an enlarged perspective view of the main portion of the back of the semiconductor circuit breaker. The semiconductor circuit breaker 3 switches the connection and disconnection of the current flowing in the circuit between the first power supply side terminal 32a, the second power supply side terminal 32b, and the third power supply side terminal 32c and the load side terminal. In this example, the first power supply side terminal 32a, the second power supply side terminal 32b, and the third power supply side terminal 32c correspond to the first terminal, and the load side terminal corresponds to the second terminal. The semiconductor circuit breaker 3 has a frame 31. The frame 31 is a hollow cuboid. Hereinafter, the surface of the frame 31 that faces the base 2 when mounted on the base 2 will be referred to as the bottom surface 31a. The semiconductor circuit breaker 3 has, on the back side of the bottom surface 31a of the frame 31, conductive first power supply side terminal 32a, second power supply side terminal 32b, and third power supply side terminal 32c, a base frame insertion portion 33, and first heat transfer portion 34a, second heat transfer portion 34b, and third heat transfer portion 34c. Hereinafter, without distinguishing between the first power supply side terminal 32a, second power supply side terminal 32b, and third power supply side terminal 32c, they will also be referred to as power supply side terminal 32, and without distinguishing between the first heat transfer portion 34a, second heat transfer portion 34b, and third heat transfer portion 34c, they will also be referred to as heat transfer portion 34.

[0048] The first power-side terminal 32a, the second power-side terminal 32b, and the third power-side terminal 32c are respectively connected to the first busbar 22a, the second busbar 22b, and the third busbar 22c of the base 2. The first power-side terminal 32a, the second power-side terminal 32b, and the third power-side terminal 32c are terminals connected to the main circuit breaker 1 via wiring 5. The power-side terminal 32 is constructed only to allow for mechanical and electrical connection to the power-side terminal access terminal 212 of the base 2. Figure 10 In the example shown, the power supply side terminal 32 is made of a conductive leaf spring. In this case, the power supply side terminal 32 engages with the power supply side terminal access terminal 212 of the base 2. Figure 11 This is a perspective view illustrating an example of the construction of the power supply side terminals of a semiconductor circuit breaker and the power supply side terminal connection terminals of the base. (Example) Figure 11 As shown, when the power supply side terminal access terminal 212 of the base 2 is a known clip-on terminal, the power supply side terminal 32 becomes a conductive flat plate. Furthermore, an electrical connection can be established between the power supply side terminal 32 of the semiconductor circuit breaker 3 and the power supply side terminal access terminal 212 of the base 2 by inserting the power supply side terminal 32 so that the power supply side terminal 32 is clamped by the power supply side terminal access terminal 212, i.e., the clip-on terminal.

[0049] return Figure 9 and Figure 10The base frame insertion part 33 is provided corresponding to the base frame insertion port 213 of the base 2, and is inserted into the base frame insertion port 213.

[0050] The first heat transfer section 34a, the second heat transfer section 34b, and the third heat transfer section 34c are respectively disposed on the bottom surface 31a of the frame 31 of the semiconductor circuit breaker 3, corresponding to the heat transfer window 211 of the base frame 21. The first heat transfer section 34a transfers the heat generated by the semiconductor module 36 (described later) to the first busbar 22a, the second heat transfer section 34b transfers the heat generated by the semiconductor module 36 (described later) to the second busbar 22b, and the third heat transfer section 34c transfers the heat generated by the semiconductor module 36 (described later) to the third busbar 22c. The first heat transfer section 34a, the second heat transfer section 34b, and the third heat transfer section 34c are disposed at the openings on the bottom surface 31a of the frame 31, which are disposed corresponding to the heat transfer window 211 of the base frame 21, in a manner that penetrates the bottom surface 31a. The first heat transfer section 34a, the second heat transfer section 34b, and the third heat transfer section 34c are made of a material with better thermal conductivity than the frame 31.

[0051] The semiconductor circuit breaker 3, having the structure described above, is fixed to the base 2 by inserting the base frame insertion part 33 of the bottom surface 31a of the frame 31 into the base frame insertion port 213 of the base 2. Additionally, the power supply side terminal 32 is inserted into the power supply side terminal access terminal 212 of the base 2. At this time, the semiconductor circuit breaker 3 can be fixed to the base 2 by inserting the base frame insertion part 33 into the base frame insertion port 213 of the base 2, or the insertion of the base frame insertion part 33 into the base frame insertion port 213 can be used as a positioning method to further fix the semiconductor circuit breaker 3 to the base 2 using screws or other fixing components.

[0052] Figure 12 It means Figure 9 A cross-sectional view of an example of the internal structure of a semiconductor circuit breaker is shown. Figure 12 As shown, the frame 31 of the semiconductor circuit breaker 3 has a printed circuit board 35, a first semiconductor module 36a, a second semiconductor module 36b and a third semiconductor module 36c, a first insulating sheet 37a, a second insulating sheet 37b and a third insulating sheet 37c, and a load-side terminal 38 inside.

[0053] The printed circuit board 35 is a substrate on which electronic components, including a first semiconductor module 36a, a second semiconductor module 36b, and a third semiconductor module 36c, are mounted. In this case, it is a substrate on which semiconductor elements constituting the first semiconductor module 36a, the second semiconductor module 36b, and the third semiconductor module 36c are mounted and wires are arranged. The printed circuit board 35 is fixed inside the frame 31 by a fixing member (not shown).

[0054] Semiconductor modules 36a, 36b, and 36c are mounted on a printed circuit board 35 to switch the connection and disconnection of the current flowing between the first power supply side terminals 32a, 32b, and 32c of the semiconductor circuit breaker 3 and the load side terminal 38. Semiconductor modules 36a, 36b, and 36c are respectively positioned corresponding to the first heat transfer portion 34a, 34b, and 34c of the bottom surface 31a of the frame 31. In one example, semiconductor modules 36a, 36b, and 36c have field-effect transistors (FETs) as semiconductor elements, each FET having a gate, source, and drain. The terminals of semiconductor modules 36a, 36b, and 36c are fixed to through-holes or the like formed at predetermined positions on the printed circuit board 35 using solder.

[0055] A first insulating sheet 37a is disposed between the first semiconductor module 36a and the first heat transfer section 34a to provide insulation between them. A second insulating sheet 37b is disposed between the second semiconductor module 36b and the second heat transfer section 34b to provide insulation between them. A third insulating sheet 37c is disposed between the third semiconductor module 36c and the third heat transfer section 34c to provide insulation between them. The first insulating sheet 37a, the second insulating sheet 37b, and the third insulating sheet 37c are made of a material with good thermal conductivity. The first semiconductor module 36a, the second semiconductor module 36b, and the third semiconductor module 36c are each insulated from the first heat transfer section 34a, the second heat transfer section 34b, and the third heat transfer section 34c by the first insulating sheet 37a, the second insulating sheet 37b, and the third insulating sheet 37c, but are thermally connected. That is, the first insulating sheet 37a, the second insulating sheet 37b, and the third insulating sheet 37c have the function of transferring the heat generated by the first semiconductor module 36a, the second semiconductor module 36b, and the third semiconductor module 36c to the first heat transfer section 34a, the second heat transfer section 34b, and the third heat transfer section 34c. Hereinafter, without distinguishing between the first insulating sheet 37a, the second insulating sheet 37b, and the third insulating sheet 37c, they are also referred to as insulating sheet 37.

[0056] The load-side terminal 38 supplies power to the load 6 connected to the semiconductor circuit breaker 3. The load-side terminal 38 is connected via wiring 39 to the drains (not shown) of the first semiconductor module 36a, the second semiconductor module 36b, and the third semiconductor module 36c. Additionally, the load-side terminal 38 is connected via wiring to the load 6 (not shown).

[0057] Figure 13 It means Figure 9 The circuit diagram shows an example of the circuit structure of the semiconductor circuit breaker 3. The circuit structure of the semiconductor circuit breaker 3 includes a first power supply side terminal 32a, a second power supply side terminal 32b, and a third power supply side terminal 32c respectively connected to the first power supply side terminal 22a, the second power supply side terminal 22b, and the third power supply side terminal 32c; a first semiconductor module 36a, a second semiconductor module 36b, and a third semiconductor module 36c respectively connected to the first power supply side terminal 32a, the second power supply side terminal 32b, and the third power supply side terminal 32c; and a load side terminal 38 respectively connected to the first semiconductor module 36a, the second semiconductor module 36b, and the third semiconductor module 36c. In this example, each of the first semiconductor module 36a, the second semiconductor module 36b, and the third semiconductor module 36c has a first semiconductor element 361a, 361b, 361c and a second semiconductor element 362a, 362b, 362c. Hereinafter, without distinguishing between the first semiconductor module 36a, the second semiconductor module 36b, and the third semiconductor module 36c, they will also be referred to as semiconductor module 36. Furthermore, without distinguishing between the first semiconductor elements 361a, 361b, and 361c, they will also be referred to as first semiconductor element 361, and without distinguishing between the second semiconductor elements 362a, 362b, and 362c, they will also be referred to as second semiconductor element 362.

[0058] Figures 14 to 16 It means Figure 13 A diagram illustrating an example of the structure of a semiconductor element in a semiconductor module. (See diagram for example.) Figure 14 and Figure 15 As shown, the semiconductor module 36 has a structure in which two semiconductor elements, namely the first semiconductor element 361 and the second semiconductor element 362, are connected in reverse series as a group, or as shown in the diagram. Figure 16 As shown, the semiconductor module 36 has a structure in which two semiconductor elements, namely the first semiconductor element 361 and the second semiconductor element 362, are connected in reverse parallel as a group.

[0059] exist Figure 14 In the semiconductor module 36, there is a series connection that connects the source of the first semiconductor element 361 and the source of the second semiconductor element 362. Figure 13 The circuit diagram shows the first semiconductor module 36a, the second semiconductor module 36b, and the third semiconductor module 36c. Figure 14The diagram shows a series connection where the sources of the first semiconductor element 361 and the second semiconductor element 362 are connected together. Specifically, in the first semiconductor module 36a, the sources of the first semiconductor element 361a and the second semiconductor element 362a are connected in series; in the second semiconductor module 36b, the sources of the first semiconductor element 361b and the second semiconductor element 362b are connected in series; and in the third semiconductor module 36c, the sources of the first semiconductor element 361c and the second semiconductor element 362c are connected in series.

[0060] exist Figure 15 In this configuration, semiconductor module 36 has a series connection connecting the drain of the first semiconductor element 361 and the drain of the second semiconductor element 362. Figure 16 In the semiconductor module 36, the source and drain of the first semiconductor element 361 and the second semiconductor element 362 are connected in reverse parallel.

[0061] Typically, in the packages of the first semiconductor element 361 and the second semiconductor element 362, the metal tab, thermally connected to the heat sink fins, serves as the drain. The metal tab corresponds to the cooling section used for heat dissipation. Therefore, in Figure 15 In a configuration in which the drains of two first semiconductor elements 361 and second semiconductor elements 362 are connected in series, the heat transfer section 34 may also be electrically connected to the drains of a pair of first semiconductor elements 361 and second semiconductor elements 362, and an insulating sheet 37 may be provided between the heat transfer section 34 and the busbar 22.

[0062] Next, the heat dissipation of the semiconductor module 36 in the electrical cabinet 100 using the semiconductor circuit breaker 3 will be explained. Figure 17 This is a cross-sectional view schematically illustrating an example of the structure of a semiconductor circuit breaker and its base when the semiconductor circuit breaker is mounted on a base. Here, the connection between the first semiconductor module 36a and the first busbar 22a is shown in enlarged form. Figure 17 As shown, the first semiconductor element 361a of the first semiconductor module 36a is mounted on the printed circuit board 35. The first semiconductor element 361a has a metal electrode, i.e., a drain 361ad, on its upper surface opposite to the surface facing the printed circuit board 35. As described above, heat sink fins are usually mounted on the drain 361ad, but in the semiconductor circuit breaker 3 according to Embodiment 1, the drain 361ad is connected to the first heat transfer portion 34a via the first insulating sheet 37a instead of the heat sink fins 222. The first heat transfer portion 34a is configured to penetrate the bottom surface 31a of the frame 31 and protrude from the bottom surface 31a toward the interior and exterior of the frame 31. Furthermore, although not shown, the second semiconductor module 36b and the third semiconductor module 36c also have the same structure.

[0063] On the other hand, a heat transfer window 211 is provided at the base 2 for the insertion of the semiconductor circuit breaker 3. Furthermore, a first busbar 22a is provided at the location where the heat transfer window 211 is formed on the back of the base 2, covering the heat transfer window 211. Therefore, when the heat transfer window 211 is viewed from the front of the base 2, the first busbar 22a is exposed. Additionally, although not shown, the second busbar 22b and the third busbar 22c also have the same structure.

[0064] Figure 18 This is a perspective view showing an example of a semiconductor circuit breaker being mounted on a base. Figure 19 It is a different perspective. Figure 18 A perspective view of the state. For example... Figure 8 , Figure 18 and Figure 19 As shown, if the semiconductor circuit breaker 3 is installed on the base 2, the first heat transfer part 34a, the second heat transfer part 34b and the third heat transfer part 34c provided on the back side of the bottom surface 31a of the semiconductor circuit breaker 3 will penetrate the multiple heat transfer windows 211 of the base 2 and contact the first bus bar 22a, the second bus bar 22b and the third bus bar 22c respectively.

[0065] Through the contact between the first heat transfer section 34a, the second heat transfer section 34b, and the third heat transfer section 34c and the first busbar 22a, the second busbar 22b, and the third busbar 22c, the heat generated by the first semiconductor module 36a, the second semiconductor module 36b, and the third semiconductor module 36c is transferred to the first busbar 22a, the second busbar 22b, and the third busbar 22c via the first heat transfer section 34a, the second heat transfer section 34b, and the third heat transfer section 34c. Additionally, the heat generated by the first power supply side terminal 32a, the second power supply side terminal 32b, and the third power supply side terminal 32c connected to the main circuit breaker 1 is also transferred to the first busbar 22a, the second busbar 22b, and the third busbar 22c.

[0066] In addition, heat dissipation fins 222 are provided on the first busbar 22a, the second busbar 22b and the third busbar 22c respectively, so that the heat transferred to the first busbar 22a, the second busbar 22b and the third busbar 22c can be efficiently dissipated into the air.

[0067] Alternatively, a fan (not shown) can be installed in the electrical cabinet 100 to provide forced air cooling for the heat sink 222. This further suppresses the temperature rise of the semiconductor module 36.

[0068] Alternatively, in the structure of the semiconductor circuit breaker 3 described above, the first power supply side terminal 32a, the second power supply side terminal 32b, and the third power supply side terminal 32c can be interchanged with the load side terminal 38. That is, the first power supply side terminal 32a, the second power supply side terminal 32b, and the third power supply side terminal 32c can be the second terminal, and the load side terminal 38 can be the first terminal.

[0069] The electrical cabinet 100 using a semiconductor circuit breaker 3 according to Embodiment 1 includes: a semiconductor circuit breaker 3 that switches the connection and disconnection of current flowing in the circuit between a first terminal and a second terminal; and a busbar 22 that is connected to the first terminal of the semiconductor circuit breaker 3 to which current flows and has a heat dissipation function. Thus, the busbar 22 can be thermally connected to the first terminal of the semiconductor circuit breaker 3, dissipating the heat generated by the semiconductor circuit breaker 3 via the busbar 22.

[0070] Specifically, the semiconductor circuit breaker 3 includes: a first semiconductor element 361 and a second semiconductor element 362, each having a first terminal for switching current on and off; a cooling section, i.e., a metal electrode, disposed at the first terminal of the first semiconductor element 361 and the second semiconductor element 362; a heat transfer section 34, one end of which is connected to the busbar 22 and the other end of which is connected to the metal electrode, for transferring heat from the metal electrode to the busbar 22; and an insulating sheet 37 disposed between the cooling section and the heat transfer section 34. Thus, the heat sink used for cooling the first semiconductor element 361 and the second semiconductor element 362 included in the semiconductor module 36 and the busbar 22 used for connecting to the power supply side terminal 32 of the semiconductor circuit breaker 3 can be shared, reducing the space required when using the semiconductor circuit breaker 3 compared to the past. That is, it has the following effects: it can cool the first semiconductor element 361 and the second semiconductor element 362, and it can save space by constructing an electrical cabinet 100 using a semiconductor circuit breaker 3.

[0071] Furthermore, the busbar 22 is positioned on the back of the base frame 21, so that the space for the busbar 22 in the electrical cabinet 100 is the space between the panel 4 and the base frame 21 of the base 2. Therefore, compared to arranging the busbar 22 in positions on the panel 4 other than the location of the base 2, the space of the panel 4 can be used more efficiently.

[0072] Implementation Method 2

[0073] In Embodiment 2, when the power supply is a DC power supply and the metal electrode with heat sink fins at the semiconductor element's package is the drain electrode, the power supply side terminals 32 of the semiconductor circuit breaker 3 are eliminated, and the heat transfer section 34 also functions as the power supply side terminals 32. Furthermore, structural elements identical to those in Embodiment 1 are labeled with the same reference numerals, and their descriptions are omitted.

[0074] Figure 20 This is a single-wire wiring diagram illustrating an example of the electrical connections of an electrical cabinet using a semiconductor circuit breaker according to Embodiment 2. The electrical cabinet 100A using a semiconductor circuit breaker 3A according to Embodiment 2 has on its panel 4: a main circuit breaker 1A having a power supply side terminal 11A and a load side terminal 12A; a base 2A relative to which the semiconductor circuit breaker 3A can be mounted and dismounted; and wiring 5 connecting the P and N terminals of the load side terminal 12A of the main circuit breaker 1A to the terminals of the base 2A. The power supply side terminal 11A of the main circuit breaker 1A is connected to a DC power supply (not shown), and the load side terminal 12A is connected to the base 2A. Multiple semiconductor circuit breakers 3A can be mounted on the base 2A. Furthermore, the base 2A has a structure in which the second busbar 22b, the heat transfer window 211 corresponding to the second busbar 22b, the power supply side terminal access terminal 212 and the base frame insertion port 213 are deleted from the base 2 of embodiment 1, but otherwise has the same structure as the base 2 of embodiment 1.

[0075] Figure 21 It means Figure 20 The diagram shows an example of the rear structure of a semiconductor circuit breaker unit. The semiconductor circuit breaker 3A has a frame 31. The semiconductor circuit breaker 3A has a base frame insertion portion 33, a first heat transfer portion 34a, and a third heat transfer portion 34c on the rear side of the bottom surface 31a of the frame 31.

[0076] The first heat transfer section 34a and the third heat transfer section 34c are respectively provided on the bottom surface 31a of the semiconductor circuit breaker 3A corresponding to the heat transfer window 211 of the base frame 21. The first heat transfer section 34a transfers the heat generated by the semiconductor module 36 to the first busbar 22a, and the third heat transfer section 34c transfers the heat generated by the semiconductor module 36 to the third busbar 22c. The first heat transfer section 34a and the third heat transfer section 34c are provided in a manner that penetrates the bottom surface 31a at the openings of the bottom surface 31a of the frame 31, which are provided corresponding to the heat transfer window 211 of the base 2A. The first heat transfer section 34a and the third heat transfer section 34c are made of a material with better thermal conductivity than the frame 31. Furthermore, in Embodiment 2, the second heat transfer section 34b and the power supply side terminal 32 are not provided on the bottom surface 31a.

[0077] Figure 22 It means Figure 20The circuit diagram shows an example of the circuit structure of a semiconductor circuit breaker. The circuit structure of the semiconductor circuit breaker 3A determines the direction of the current flowing in each pole, so the first heat transfer section 34a and the third heat transfer section 34c are electrically connected to the first busbar 22a and the third busbar 22c, respectively.

[0078] The first semiconductor module 36a and the third semiconductor module 36c have first semiconductor elements 361a and 361c. The drain 361ad of the first semiconductor element 361a is connected to the first heat transfer section 34a and is connected to the P-terminal of the main circuit breaker 1A via the first busbar 22a. The source 361as of the first semiconductor element 361a is connected to the P-terminal of the load-side terminal 38.

[0079] Additionally, the source 361cs of the first semiconductor element 361c is connected to the third heat transfer section 34c and is connected to the N-terminal of the main circuit breaker 1A via the third busbar 22c. The drain 361cd of the first semiconductor element 361c is connected to the N-terminal of the load-side terminal 38.

[0080] Figure 23 It means Figure 20 This is a cross-sectional view of an example of the internal structure of a semiconductor circuit breaker. The frame 31 of the semiconductor circuit breaker 3A internally includes a printed circuit board 35, first semiconductor elements 361a and 361c, a third insulating sheet 37c, and a load-side terminal 38. The first semiconductor elements 361a and 361c are mounted on the printed circuit board 35 to connect or disconnect the current flowing between the heat transfer section 34, which functions as the power supply-side terminal 32, and the load-side terminal 38.

[0081] like Figure 22 As shown, in this example, the first semiconductor element 361a is a semiconductor element with a metal electrode 361ad as its drain, and therefore the drain 361ad is directly connected to the first heat transfer section 34a. That is, the drain 361ad is connected to the first heat transfer section 34a without passing through the insulating sheet 37.

[0082] On the other hand, in the first semiconductor element 361c, since the source electrode 361cs needs to be connected to the third busbar 22c, the metal electrode, i.e., the drain electrode 361cd, is thermally connected to the third heat transfer section 34c via the third insulating sheet 37c and is insulated from the third heat transfer section 34c. Furthermore, the source electrode 361cs of the first semiconductor element 361c is electrically connected to the third heat transfer section 34c.

[0083] The source 361as of the first semiconductor element 361a is in Figure 23At a location not shown, it is connected via wiring 39 to load-side terminal 38, which supplies power to load 6 connected to semiconductor circuit breaker 3A. Additionally, the drain 361cd of the first semiconductor element 361c is also... Figure 23 At a location not shown, it is connected via wiring 39 to a load-side terminal 38, which supplies power to the load 6 connected to the semiconductor circuit breaker 3A.

[0084] Figure 24 This is a cross-sectional view schematically illustrating an example of the structure of a semiconductor circuit breaker and its base when the semiconductor circuit breaker is mounted on a base. Here, the connection portion between the first semiconductor element 361a and the first busbar 22a is shown in enlarged form. Figure 24 As shown, if the semiconductor circuit breaker 3A is mounted on the base 2, the first heat transfer section 34a is connected to the first busbar 22a. Thus, the first heat transfer section 34a is both thermally and electrically connected to the first busbar 22a. That is, the first heat transfer section 34a also functions as the first power supply side terminal 32a. The first semiconductor element 361c (not shown) and the third busbar 22c are similarly connected. However, in the first semiconductor element 361a, the drain 361ad is thermally and electrically connected to the first busbar 22a via the first heat transfer section 34a. In contrast, in the first semiconductor element 361c, the drain 361cd is thermally connected to the third busbar 22c via the third insulating sheet 37c and the third heat transfer section 34c, and the source 361cs is electrically connected to the third busbar 22c via the third heat transfer section 34c. Therefore, the first power supply side terminal 32a and the third power supply side terminal 32c can be omitted at the base 2.

[0085] Furthermore, in the structure of the semiconductor circuit breaker 3A described above, the first power supply side terminal 32a and the third power supply side terminal 32c can be interchanged with the load side terminal 38. That is, the first power supply side terminal 32a and the third power supply side terminal 32c can be the second terminal, and the load side terminal 38 can be the first terminal.

[0086] The electrical cabinet 100A using a semiconductor circuit breaker 3A according to Embodiment 2 includes: a semiconductor circuit breaker 3A that connects or disconnects the current flowing in the circuit; and a busbar 22 electrically connected to the current-supplying terminals of the semiconductor circuit breaker 3A. The busbar 22 has heat dissipation fins 222 and is thermally connected to the first semiconductor element 361a and the first semiconductor element 361c of the semiconductor circuit breaker 3A. Thus, similar to Embodiment 1, the electrical cabinet 100A using the semiconductor circuit breaker 3A can be configured in a space-saving manner. Furthermore, since the heat transfer section 34 is used as the power supply side terminal 32 in the semiconductor circuit breaker 3A, the number of components can be reduced compared to the case where a separate power supply side terminal 32 is provided as in Embodiment 1, and cost reduction can be achieved.

[0087] Implementation Method 3

[0088] In Embodiment 3, the power supply side terminal 32 of the semiconductor circuit breaker 3 provided in Embodiment 1 is removed, and similarly to Embodiment 2, the heat transfer section 34 is made to have the function of the power supply side terminal 32. In addition, structural elements that are the same as those in Embodiments 1 and 2 are labeled with the same reference numerals, and their descriptions are omitted.

[0089] Figure 25 This is a circuit diagram illustrating an example of the circuit structure of the semiconductor circuit breaker according to Embodiment 3. For example... Figure 25 As shown, in the semiconductor circuit breaker 3B according to Embodiment 3, the semiconductor module 36 has a structure in which the source of the first semiconductor element 361 and the source of the second semiconductor element 362 are connected in series.

[0090] In addition, the first heat transfer section 34a, the second heat transfer section 34b and the third heat transfer section 34c are electrically connected to the first busbar 22a, the second busbar 22b and the third busbar 22c of the base 2.

[0091] The drain 361ad of the first semiconductor element 361a of the first semiconductor module 36a is connected to the first heat transfer section 34a and is connected to the terminal of the main circuit breaker 1 via the first busbar 22a. The drain 361bd of the first semiconductor element 361b of the second semiconductor module 36b is connected to the second heat transfer section 34b and is connected to the terminal of the main circuit breaker 1 via the second busbar 22b. The drain 361cd of the first semiconductor element 361c of the third semiconductor module 36c is connected to the third heat transfer section 34c and is connected to the terminal of the main circuit breaker 1 via the third busbar 22c.

[0092] The drain 362ad of the second semiconductor element 362a of the first semiconductor module 36a is connected to the terminal of the load-side terminal 38. The drain 362bd of the second semiconductor element 362b of the second semiconductor module 36b is connected to the terminal of the load-side terminal 38. The drain 362cd of the second semiconductor element 362c of the third semiconductor module 36c is connected to the terminal of the load-side terminal 38.

[0093] Figure 26 This is a cross-sectional view showing an example of the structure of the semiconductor element on the power supply side inside the semiconductor circuit breaker according to Embodiment 3. Figure 27 This is a cross-sectional view showing an example of the structure of the semiconductor element on the power supply side inside the semiconductor circuit breaker according to Embodiment 3. The internal structure of the semiconductor circuit breaker 3B according to Embodiment 3 is similar to that of Embodiment 1. Figure 12 The structure is basically the same as described above. However, in the case of semiconductor devices using packages with metal drain electrodes, such as... Figure 26 As shown, the drains 361ad, 361bd, and 361cd of the first semiconductor elements 361a, 361b, and 361c on the power supply side of the first semiconductor module 36a, the second semiconductor module 36b, and the third semiconductor module 36c are directly connected to the first heat transfer section 34a, the second heat transfer section 34b, and the third heat transfer section 34c. That is, the drains 361ad, 361bd, and 361cd of the first semiconductor elements 361a, 361b, and 361c on the power supply side are connected to the first heat transfer section 34a, the second heat transfer section 34b, and the third heat transfer section 34c without passing through the insulating sheet 37. Thus, the first semiconductor elements 361a, 361b, and 361c on the power supply side are thermally and electrically connected to the first heat transfer section 34a, the second heat transfer section 34b, and the third heat transfer section 34c, respectively. The sources 361as, 361bs, and 361cs of the first semiconductor elements 361a, 361b, and 361c are connected to preset positions on the printed circuit board 35 to be electrically connected to the source of the second semiconductor element.

[0094] In addition, the structure of semiconductor module 36 is as follows: Figure 15 or Figure 16 In the structure shown, the first semiconductor elements 361a, 361b, and 361c are thermally connected to the first heat transfer section 34a, the second heat transfer section 34b, and the third heat transfer section 34c, respectively, through the insulating sheet 37. Furthermore, the drains 361ad, 361bd, and 361cd of the first semiconductor elements 361a, 361b, and 361c are electrically connected to the first heat transfer section 34a, the second heat transfer section 34b, and the third heat transfer section 34c, respectively.

[0095] On the other hand, such as Figure 27As shown, the drains 362ad, 362bd, and 362cd of the second semiconductor elements 362a, 362b, and 362c on the load side are connected to the load-side terminal 38 via wiring 39. Furthermore, the metal electrodes, i.e., the drains 362ad, 362bd, and 362cd, are thermally connected to the first heat transfer section 34a, the second heat transfer section 34b, and the third heat transfer section 34c, respectively, through the first insulating sheet 37a, the second insulating sheet 37b, and the third insulating sheet 37c.

[0096] Furthermore, depending on the structure of the semiconductor module 36, the drain or source of the semiconductor element that should be connected to the busbar 22 is connected to the heat transfer section 34. Therefore, if the semiconductor circuit breaker 3B is mounted on the base 2, the first heat transfer section 34a, the second heat transfer section 34b, and the third heat transfer section 34c are connected to the first busbar 22a, the second busbar 22b, and the third busbar 22c, respectively. Moreover, the first heat transfer section 34a, the second heat transfer section 34b, and the third heat transfer section 34c are thermally connected to the first busbar 22a, the second busbar 22b, and the third busbar 22c, respectively, and are also electrically connected, thus also functioning as the power supply side terminal 32.

[0097] Furthermore, in the structure of the semiconductor circuit breaker 3B described above, the first power supply side terminal 32a, the second power supply side terminal 32b, and the third power supply side terminal 32c can be interchanged with the load side terminal 38. That is, the first power supply side terminal 32a, the second power supply side terminal 32b, and the third power supply side terminal 32c can be the second terminal, and the load side terminal 38 can be the first terminal.

[0098] According to Embodiment 3, the electrical cabinet 100 using a semiconductor circuit breaker 3B includes: a semiconductor circuit breaker 3B that connects or disconnects current flowing in the circuit; and a busbar 22 electrically connected to the current-supplying terminals of the semiconductor circuit breaker 3B. The busbar 22 has heat dissipation fins 222 and is thermally connected to the first semiconductor element 361 and the second semiconductor element 362 of the semiconductor circuit breaker 3B. Therefore, similar to Embodiment 1, the first semiconductor element 361 and the second semiconductor element 362 can be cooled, and the electrical cabinet 100 using the semiconductor circuit breaker 3B can be constructed in a space-saving manner.

[0099] In addition, the heat transfer section 34, which is thermally connected to the cooling section of the semiconductor module 36 (i.e., the metal) and the busbar 22, is electrically connected to the busbar 22. Therefore, no dedicated power supply terminal is required, and the semiconductor circuit breaker 3B can be constructed at low cost.

[0100] The structure shown in the above embodiments is an example and can be combined with other known technologies. The embodiments can also be combined with each other, and parts of the structure can be omitted or changed without departing from the spirit of the subject.

[0101] Explanation of the label

[0102] 1. 1A Main circuit breaker; 2. 2A Base; 3. 3A, 3B Semiconductor circuit breakers; 4. Panel; 5. Wiring; 6. Load; 7. AC power supply; 11. 11A Power supply side terminal; 12. 12A Load side terminal; 21. Base frame; 22. Busbar; 22a First busbar; 22b Second busbar; 22c Third busbar; 25. Board; 26. Foot; 31. Frame; 31a Bottom surface; 32. Power supply side terminal; 32a First power supply side terminal; 32b Second power supply side terminal; 32c Third power supply side terminal; 33. Base frame insertion part; 34. Heat transfer part; 34a First heat transfer part; 34b Second heat transfer part; 34c Third heat transfer part; 35. Printed circuit board; 36. Semiconductor module; 36a First semiconductor module; 36b... Semiconductor module 2, 36c Semiconductor module 3, 37 Insulating sheet, 37a Insulating sheet 1, 37b Insulating sheet 2, 37c Insulating sheet 3, 38 Load side terminal, 39 Wiring, 100, 100A Electrical cabinet, 200 Semiconductor circuit breaker mounting area, 211 Heat transfer window, 212 Power side terminal access terminal, 213 Base frame insertion port, 221 Contact part, 222 Heat sink fins, 223 Opening, 361, 361a, 361b, 361c First semiconductor element, 361ad, 361bd, 361cd, 362ad, 362bd, 362cd Drain, 361as, 361bs, 361cs Source, 362, 362a, 362b, 362c Second semiconductor element.

Claims

1. An electrical cabinet using a semiconductor circuit breaker, characterized in that, have: A semiconductor circuit breaker that switches the connection and disconnection of current flowing in a circuit between terminals 1 and 2; as well as The busbar, which is connected to the first terminal of the semiconductor element of the semiconductor circuit breaker that supplies the current, has a heat dissipation function.

2. The electrical cabinet using a semiconductor circuit breaker according to claim 1, characterized in that, The semiconductor circuit breaker has: The semiconductor element has the first terminal, and the semiconductor element switches the connection and disconnection of the current. A cooling section for heat dissipation is disposed at the first terminal of the semiconductor element; and A heat transfer section, one end of which is connected to the busbar and the other end of which is connected to the cooling section, transfers heat from the cooling section to the busbar.

3. The electrical cabinet using a semiconductor circuit breaker according to claim 2, characterized in that, It also includes a base having: a heat transfer window, which is an opening provided in an area of ​​the plate-shaped plate portion allowing for the assembly and disassembly of the semiconductor circuit breaker; and the busbar, which is provided on the back side of the plate portion to cover the heat transfer window. The semiconductor circuit breaker has: Frame; The semiconductor element is mounted on a printed circuit board disposed inside the housing; and The heat transfer section extends through the bottom surface of the frame on the mounting side towards the base and is connected to the cooling section of the semiconductor element. If the semiconductor circuit breaker is mounted on the base, the heat transfer section is connected to the busbar via the heat transfer window.

4. The electrical cabinet using a semiconductor circuit breaker according to claim 1, characterized in that, The busbar is connected to the first terminal via an insulating sheet.

5. The electrical cabinet using a semiconductor circuit breaker according to claim 2 or 3, characterized in that, The semiconductor circuit breaker also has an insulating sheet disposed between the cooling section and the heat transfer section.

6. The electrical cabinet using a semiconductor circuit breaker according to claim 2 or 3, characterized in that, The semiconductor circuit breaker also has an insulating sheet disposed between the heat transfer section and the busbar.

7. The electrical cabinet using a semiconductor circuit breaker according to claim 2 or 3, characterized in that, The heat transfer section is directly connected to the busbar, and the heat transfer section also serves as the first terminal.

8. The electrical cabinet using a semiconductor circuit breaker according to any one of claims 1 to 7, characterized in that, The first terminal is a power supply side terminal. The second terminal is the load-side terminal.

9. The electrical cabinet using a semiconductor circuit breaker according to any one of claims 1 to 7, characterized in that, The first terminal is the load-side terminal. The second terminal is the power supply side terminal.

10. A semiconductor circuit breaker for use in an electrical cabinet, the electrical cabinet having: the semiconductor circuit breaker, which switches the connection and disconnection of current flowing in a circuit between a first terminal and a second terminal; And a busbar, which is connected to the first terminal of the semiconductor element of the semiconductor circuit breaker that supplies the current, and has a heat dissipation function. The semiconductor circuit breaker is characterized by having: The semiconductor element has the first terminal, and the semiconductor element switches the connection and disconnection of the current. A cooling section for heat dissipation is disposed at the first terminal of the semiconductor element; and A heat transfer section, one end of which is connected to the busbar and the other end of which is connected to the cooling section, transfers heat from the cooling section to the busbar.

11. The semiconductor circuit breaker according to claim 10, characterized in that, It also has an insulating sheet disposed between the cooling section and the heat transfer section.

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