Electronic circuit and method for manufacturing an electronic circuit

Abstract

The invention relates to an electronic circuit (100) having a first circuit board (105), a second circuit board (110) and a connecting device (115). The first circuit board (105) has an outer side (118) and an inner side (120) opposite the outer side (118). The first circuit board (105) has at least one first printed conductor (130) and / or at least one through-opening. The second circuit board (110) has an outer side (122) and an inner side (128) opposite the outer side (122). The second circuit board (110) has a second printed conductor (135), the inner side (128) of the second circuit board (110) facing the inner side (118) of the first circuit board (105). The connecting device (115) is arranged in an intermediate space (125) between the first circuit board (105) and the second circuit board (110). The connecting device (115) is configured with at least one connecting element having a base and a side wall adjoining the base. A lower side of the base is arranged on the inner side (128) of the second circuit board (110) of the electronic circuit (100). The side wall at least partially passes through the through-opening of the first circuit board (105) of the electronic circuit (100).

Description

Technical Field

[0001] This invention relates to an electronic circuit and a method for manufacturing the electronic circuit. Background Technology

[0002] Parasitic stray inductance may occur in power electronic devices.

[0003] Document DE 10 2019 125 108 A1 discloses a power electronic device including a circuit board and a power module, a method for manufacturing the power electronic device, and a motor vehicle including the power electronic device.

[0004] Document DE 10 2014 208 226 A1 discloses a contact element for electrical connection and a copper strip for manufacturing multiple contact elements.

[0005] Document US 2008 / 0142571 A1 discloses an electronic device.

[0006] Document DE 691 16 711 T2 discloses a multi-pin electrical connector with connecting pins.

[0007] Document DE 10 2004 041 173 A1 discloses a welding structure between a bus strip and a printed circuit board.

[0008] Document DE 44 22 787 A1 discloses pins fixed on the surface of printed circuit boards.

[0009] Document US 5,931,705 A discloses a surface-mountable wire connector. Summary of the Invention

[0010] Against this backdrop, the present invention provides an improved electronic circuit according to the independent claims and an improved method for manufacturing the electronic circuit. Advantageous designs are derived from the dependent claims and the following description.

[0011] The advantages that can be achieved by utilizing the scheme proposed herein are particularly evident in providing an electronic circuit that can reduce stray inductance, especially parasitic stray inductance.

[0012] An electronic circuit includes a first circuit board, a second circuit board, and a connecting device. The first circuit board has an outer side and an inner side opposite to the outer side. The first circuit board has a first printed conductor and / or at least one through-hole. The second circuit board has an outer side and an inner side opposite to the outer side. The second circuit board has a second printed conductor, and the inner side of the second circuit board faces the inner side of the first circuit board. The connecting device is disposed in an intermediate space between the first and second circuit boards. The connecting device is configured with at least one connecting element having a bottom and a sidewall adjacent to the bottom. The lower side of the bottom is disposed on the inner side of the second circuit board of the electronic circuit. The sidewall at least partially passes through the through-hole of the first circuit board of the electronic circuit.

[0013] The circuit board can be manufactured in low cost and in large quantities. The connection device can also be called a board-to-board connection, and due to this construction, the height in the intermediate space can be reduced to a level that minimizes stray inductance. The bottom can be soldered to the second circuit board, and the sidewalls can be soldered to the first circuit board. This electronic circuit achieves a smaller overall component size through better space utilization.

[0014] The proposed solution enables an optimized, low-interference layout using a connection device, also known as a pitch-optimized signal board-to-board connector, and includes a solution for this connection device. Therefore, the proposed solution can also be understood as an optimized, low-parasitic layout using pitch-optimized signal board-to-board connectors and a solution for these connectors.

[0015] The proposed solutions can be used for other substrate combinations, such as DBC (direct bonded copper), a bonding technology that enables tight electrical / thermal connections via copper, and / or AMB (active metal brazed), a bonding technology or form of brazing in which metal and ceramic can be connected without metallization.

[0016] Furthermore, the individual soldering steps can be combined partially or completely. For example, all three soldering processes (IMS board, PCB board, and pitch-optimized signal board-to-board connector) can be performed simultaneously, for example, during a vapor phase soldering process.

[0017] The connecting device may include a metallic material. In particular, the metallic material may be constructed as a conductive plate. The metallic material may, for example, be a coated or uncoated copper plate.

[0018] The connecting element can be constructed in an L-shape or a J-shape. The connecting element can be simply bent into the desired shape and / or, for example, etched into the desired shape.

[0019] The connecting element can be constructed as a single piece. In particular, a curved edge can be constructed between the bottom and the sidewall. The connecting element can be etched into the desired shape, for example, and has a single-sided etched curved edge to reduce the bending radius and improve accuracy.

[0020] The bottom of the connecting element can be configured to be wider than the sidewalls of the connecting element. Alternatively, the sidewalls of the connecting element can be configured to be wider than the bottom of the connecting element. Alternatively, the bottom and sidewalls of the connecting element can have the same width. Thus, for example, the height in the intermediate space can be reliably reduced and / or a low parasitic layout of the electronic circuit can be achieved.

[0021] The sidewalls of the connecting element can be constructed in a pin shape. In particular, the pin-shaped sidewalls can be centrally located on the bottom. This allows for various implementations of the first circuit board and / or the second circuit board.

[0022] The bottom of the connecting element can be constructed as a triangle. This reduces the required structural space and / or the height of the intermediate space, resulting in a low parasitic layout.

[0023] The connecting device may be configured with another connecting element having another bottom and another sidewall adjacent to the other bottom. The other lower side of the other bottom may be disposed on the inner side of the second circuit board of the electronic circuit. The other sidewall may at least partially pass through a through-opening in the first circuit board of the electronic circuit or another through-opening. The other connecting element and the aforementioned connecting element may be constructed identically and / or mass-produced at low cost.

[0024] The back face of the sidewall and the other back face of the other sidewall can be arranged adjacent to each other or can be arranged adjacent to each other. Alternatively, the bottom and the other bottom can be arranged adjacent to each other or can be arranged adjacent to each other.

[0025] The electronic circuit can have a connection unit that can be arranged between the back of one sidewall and the back of another sidewall. This connection unit can also be arranged on the bottom and another bottom to connect connecting elements to each other. This allows for a low-parasitic layout of the electronic circuit.

[0026] The connection unit can be made of an electrically insulating material. This electrically insulating material can be, for example, Kapton and / or insulating plastic film, such as polypropylene or polycarbonate, or similar electrically insulating materials.

[0027] One embodiment of a method for manufacturing the electronic circuit described herein includes a providing step and an arrangement step. In the providing step, a first circuit board, a second circuit board, and connecting devices are provided. In the arrangement step, the connecting devices are arranged between the circuit boards. Here, the bottom of the connecting element is arranged on the second circuit board, wherein the sidewall of the connecting element at least partially passes through a through-opening in the first circuit board to manufacture the electronic circuit. In the arrangement step, the bottom may be arranged on the second circuit board using a surface mount technology.

[0028] The proposed solution also provides an apparatus designed to perform, control, and / or implement a variation of the method proposed herein within a corresponding device. This apparatus-based embodiment of the invention also allows for a rapid and efficient solution to the task on which the invention is based.

[0029] The device can be an electrical apparatus that processes electrical signals, such as sensor signals, and outputs control signals accordingly. The device may have one or more suitable interfaces, which can be designed in hardware and / or software. In a hardware design, these interfaces may be, for example, part of an integrated circuit in which the device's functions are implemented. These interfaces may also be their own independent integrated circuit or at least partially composed of discrete components. In a software design, these interfaces may be software modules, which, for example, exist on a microcontroller along with other software modules.

[0030] Also advantageous are computer program products having program code that can be stored on a machine-readable medium, such as semiconductor memory, hard disk memory, or optical memory, and which, when executed on a computer or device, are used to implement the method according to one of the above embodiments. Attached Figure Description

[0031] The invention is illustrated in more detail by way of example with the aid of the accompanying drawings. In the drawings: Figure 1 A diagram illustrating one embodiment of an electronic circuit; Figure 2 A diagram illustrating a stray inductance for explaining one embodiment of an electronic circuit is shown; Figure 3 A diagram illustrating a connection arrangement for demonstrating one embodiment of an electronic circuit is shown. Figure 4 A diagram illustrating a connection arrangement for demonstrating one embodiment of an electronic circuit is shown. Figure 5 A diagram illustrating a connection arrangement for demonstrating one embodiment of an electronic circuit is shown. Figure 6 A diagram illustrating one embodiment of an electronic circuit; Figure 7 A diagram illustrating one embodiment of an electronic circuit; Figure 8 A diagram illustrating a connection arrangement for demonstrating one embodiment of an electronic circuit is shown. Figure 9 A diagram illustrating a connection arrangement for demonstrating one embodiment of an electronic circuit is shown. Figure 10 A diagram illustrating a connection arrangement for demonstrating one embodiment of an electronic circuit is shown. Figure 11 A diagram illustrating a connection arrangement for demonstrating one embodiment of an electronic circuit is shown. Figure 12 A diagram illustrating a connection arrangement for demonstrating one embodiment of an electronic circuit is shown. Figure 13 A diagram illustrating a connection arrangement for demonstrating one embodiment of an electronic circuit is shown. Figure 14 A diagram illustrating one embodiment of an electronic circuit; Figure 15 A diagram illustrating one embodiment of an electronic circuit; Figure 16 A diagram illustrating a connection arrangement for demonstrating one embodiment of an electronic circuit is shown. Figure 17 A diagram illustrating a connection arrangement for demonstrating one embodiment of an electronic circuit is shown. Figure 18 A diagram illustrating a connection arrangement for demonstrating one embodiment of an electronic circuit is shown. Figure 19 A diagram illustrating one embodiment of an electronic circuit; Figure 20 A diagram illustrating a connection arrangement for demonstrating one embodiment of an electronic circuit is shown. Figure 21 A flowchart illustrating one embodiment of a method for manufacturing electronic circuits; Figure 22 A block diagram illustrating one embodiment of a control device for manufacturing electronic circuits; Figure 23 A circuit diagram illustrating one embodiment of an electronic circuit; Figure 24 A diagram illustrating one embodiment of an electronic circuit; Figure 25 A diagram illustrating a connection arrangement for demonstrating one embodiment of an electronic circuit is shown. Figure 26 A diagram illustrating a connection arrangement for demonstrating one embodiment of an electronic circuit is shown. Figure 27A diagram illustrating a connection arrangement for demonstrating one embodiment of an electronic circuit is shown. Figure 28 A diagram illustrating one embodiment of an electronic circuit; and Figure 29 A diagram illustrating one embodiment of an electronic circuit is shown. Detailed Implementation

[0032] In the following description of preferred embodiments of the invention, the same or similar reference numerals are used for elements shown in different figures that have similar functions, and repeated descriptions of these elements are omitted.

[0033] Figure 1 A diagram showing one embodiment of electronic circuit 100 is provided. More specifically, a longitudinal section of electronic circuit 100 is shown.

[0034] The electronic circuit 100 has a first circuit board 105, a second circuit board 110, and a connecting device 115.

[0035] The first circuit board 105 has an outer side 118 and an inner side 120 opposite to the outer side 118. The second circuit board 110 has an outer side 122 and an inner side 128 opposite to the outer side 122. The inner side 128 of the second circuit board 110 faces the inner side 120 of the first circuit board 105, wherein an intermediate space 125 is formed between the first circuit board 105 and the second circuit board 110. A connecting device 115 is arranged in the intermediate space 125, which enables the electronic circuit 100 to achieve a smaller height hcc.

[0036] The first circuit board 105 may be referred to as a PCB, for example, having a first printed conductor 130, and the second circuit board 110 may be referred to as an IMS, for example, having a second printed conductor 135. According to one embodiment, the second printed conductor 135 is disposed on the inner side 128 of the second circuit board 110, and the first printed conductor 130 is disposed on the inner side 120 of the first circuit board 105.

[0037] The first printed conductor 130 extends continuously through the first circuit board 105, for example. The second printed conductor 135 has, for example, multiple through openings to enable reliable function and / or contact of components 138, 140, 150, for example.

[0038] A component 138, for example, is arranged in the intermediate space 125 between circuit boards 105 and 110. This component is designed as a buffer, which may also be referred to as a Csnubb, only by way of example. The component 138 makes an electrical contact on the second printed conductor 135.

[0039] According to another embodiment, another component 140 is arranged in the intermediate space 125. The other component 140, for example, has a greater height than component 138. The other component 140 is exemplarily designed as a transistor, more precisely as a semiconductor transistor and / or a high-side transistor, which may also be referred to as an HS transistor, wherein the other component 140 is in electrical contact with the second printed conductor 135. A thermally conductive material 155 is arranged, for example, between the other component 140 and the second printed conductor 135. According to another embodiment, a third component 150 is arranged in the intermediate space 125 between the first circuit board 105 and the second circuit board 110. The third component 150 is exemplarily designed as a transistor and has the same height as the other component 140. The third component 150 is arranged adjacent to the other component 140, wherein the other component 140 is exemplarily arranged between component 138 and the third component 150.

[0040] The third component 150 is designed, for example, as a low-side transistor, and may be referred to as an LS transistor. Another thermally conductive material 160 is disposed, for example, between the third component 150 and the second printed conductor 135.

[0041] According to one embodiment, the connecting device 115 is configured with a plurality of connecting elements 180, 182, 184, 186, 188, 190, having bottoms 165, 166 and sidewalls 170, 172, 173, 174, 175, 176, exemplarily six connecting elements 180, 182, 184, 186, 188, 190. Here, for example, a support element 181, 183, 185, 187 is arranged on each connecting element 180, 182, 184, 186, 188, 190.

[0042] A connecting element 180 is arranged adjacent to member 138 in intermediate space 125, wherein sidewall 170 at least partially extends through through opening 171. A support element 181 is received by sidewall 170 and abuts against bottom 165 of connecting element 180. The lower side of bottom 165 is arranged on the inner side 128 of second circuit board 110 of electronic circuit 100, and is exemplaryly arranged on second printed conductor 135 only. For example, bottom 165 is soldered to second circuit board 110. Sidewall 170 is soldered and / or electrically contacted, or capable of electrically contacting, first circuit board 105, for example, from above.

[0043] Another connecting element 182 and a third connecting element 184 are arranged adjacent to each other, wherein the connecting elements 182 and 184 are arranged only exemplarily on or in another member 140 such that the bottom of the connecting elements 182 and 184 is not visible. Another sidewall 172 of the other connecting element 182 at least partially passes through another through opening 192 of the first circuit board 105. A third sidewall 173 of the third connecting element 184 at least partially passes through a third through opening 193 of the first circuit board 105. Another support element 183 is, for example, accommodated by sidewalls 172 and 173.

[0044] The fourth connecting element 186 and the fifth connecting element 188 are implemented in the same manner as connecting elements 182 and 184, and are arranged on or in the third member 150 such that the bottoms of connecting elements 186 and 188 are not visible. The fourth sidewall 174 of the fourth connecting element 186 at least partially passes through the fourth through opening 194 of the first circuit board 105. The fifth sidewall 175 of the fifth connecting element 186 at least partially passes through the fifth through opening 195 of the first circuit board 105. The third support element 185 is, for example, accommodated by sidewalls 174 and 175.

[0045] The sixth connecting element 190 is constructed in the same manner as connecting element 180, and is arranged adjacent to the third member 150 in the intermediate space 125. Here, the bottom 166 of the sixth connecting element 190 contacts the second circuit board 110, and the sixth sidewall 176 of the sixth connecting element 190 at least partially passes through the sixth through opening 196 of the first circuit board 105. The fourth support element 187 is received, for example, by the sidewall 176.

[0046] The connecting device 115 is shown and depicted in more detail in the following figures.

[0047] With the electronic circuit 100 in a ready-to-operate state, current path 198 passes through circuit boards 105, 110, as illustrated only by way of arrows. More precisely, current path 198 passes through printed conductors 135, 135, and extends counterclockwise according to the embodiment shown here. Here, current path 198 passes through connecting element 180 and through sixth connecting element 190.

[0048] By arranging the connecting device 115 in the electronic circuit 100, the height hcc in the intermediate space 125 is reduced, where the smaller height hcc results in a favorable geometry for the current path 198, thereby enabling a smaller stray inductance.

[0049] In other words, proper layout design is a crucial aspect to consider when designing power electronics for fast-switching applications, such as gallium nitride transistors. Because Figure 1The layout geometry of the current path 198 shown reduces or prevents parasitic stray inductance, thereby ensuring that the switching behavior of fast-switching power electronics is unaffected.

[0050] Figure 1 The diagram illustrates the construction of a vertical commutation loop with underside-cooled components 140, 150 (which may also be referred to as transistors), featuring a connection device 115 (which may also be referred to as a board-to-board connector), and utilizing a first circuit board 105 (which may also be referred to as a PCB) and a second circuit board 110 (which may also be referred to as an IMS (Insulated Metal Substrate)), as well as board-to-board signal connectors required for the gate and source (and optionally Miller clamps). Therefore, the height hcc of this design is limited by the height of the tallest component (signal board-to-board connector) soldered to the second circuit board 110, and the minimum Lcc of this design is determined. Dynamic switching tests of this design show that the stray inductance (which may also be referred to as L...) is... cc It has little impact on the switching behavior of power electronic devices, which greatly improves their fast switching capability.

[0051] The connector 115 is optimized for a low-parasitic layout with a vertical commutation loop. The height hcc is advantageous for this design, and the spacing between the two circuit boards 105, 110 can be less than three millimeters, less than two millimeters, and / or less than one millimeter to reduce the height hcc, which is necessary for a low-parasitic layout. Not only is the height reduced, but the space requirements are also relatively small, which positively impacts layout and signal quality due to the shorter signal path.

[0052] The proposed solution shows that the connection device 115 has sufficiently small connecting elements 180, 182, 184, 186, 188, 190, which meet the requirements for connecting the second circuit board 110 and the first circuit board 105 in high-power applications.

[0053] Connecting elements 182, 184, 186, and 188 (which may also be referred to as board-to-board connectors) are mounted on the second circuit board 110 (which may also be referred to as an IMS circuit board) using SMT technology, i.e., surface mount technology, or non-conductive connectors passing through the second circuit board 110, because otherwise the upper and lower sides of the second circuit board 110 would be electrically connected, which is to be avoided. Connecting elements 180 and 190 (which may also be referred to as board-to-board connectors) are self-positioned on the pads and will not drift during soldering.

[0054] Figure 1A novel solution for an optimized, low-parasitic layout is shown, utilizing interconnecting elements 182, 184, 186, and 188 with optimized spacing, which can also be referred to as board-to-board signal plug-in connectors. Therefore, the first board 105 can be positioned closer to the second board 110, thereby optimizing the parasitic layout and improving the following aspects of the design: By reducing the height hcc, the parasitic stray inductance Lcc is significantly reduced. The reduced Lcc decreases the parasitic effects on the fast switching behavior of power electronics. This leads to increased achievable switching speeds, reduced switching losses in power electronics, and improved electrical system efficiency. Shorter and more direct signal paths enable improved gate and source signal quality, as well as optional Miller clamping and noise immunity.

[0055] In addition, the new connecting elements 182, 184, 186, and 188 have been spatially optimized, which enables better layout options and further improves the design.

[0056] Figure 2 A diagram illustrating a stray inductance for explaining one embodiment of an electronic circuit is shown. An optimized spacing 200 for the connection device is shown, wherein the spacing is exemplary only 1.4 mm and has a stray inductance of approximately 6.4 nH.

[0057] An improvement in drain-source voltage oscillation during shutdown is shown. By reducing the spacing between the two boards by 200, stray inductance is reduced by more than half. If this spacing was previously only 3.6 mm (old signal board to board connector), then in Figure 2 The spacing is reduced from 200 to, for example, 1.4 mm.

[0058] Figure 3 A diagram showing a connection device 115 for illustrating one embodiment of an electronic circuit is provided. Here, the connection device 115 is connected to... Figure 1 The connecting devices in them are similar or the same.

[0059] The connecting device 115 is configured with a connecting element 300, which has a bottom 305 and a sidewall 310. The connecting element 300 is configured in an L-shape only by way of example and is designed for insertion into the intermediate space of an electronic circuit, such as only by way of example in Figure 6 As shown and described in more detail.

[0060] Figure 4 A diagram showing a connection device 115 for illustrating one embodiment of an electronic circuit is provided. Here, the connection device 115 is connected to... Figure 3 The connecting devices are similar or identical, except that connecting device 115 is shown in a side view.

[0061] Figure 5A diagram showing a connection device 115 for illustrating one embodiment of an electronic circuit is provided. Here, the connection device 115 is connected to... Figure 3 and / or Figure 4 The connecting devices are similar or identical, except that connecting device 115 is shown in a later view. More specifically, the sidewall 310 of the connecting element is shown in a later view.

[0062] Figure 6 A diagram illustrating one embodiment of electronic circuit 100 is shown. More specifically, a partial longitudinal cross-section of electronic circuit 100 is shown. Electronic circuit 100 and Figure 1 The electronic circuits in them are similar or identical, except that the connecting device 115 is implemented differently.

[0063] The connecting device 115 is configured with a connecting element 300 and another connecting element 600. Here, the connecting elements 300 and 600 are configured identically only by way of example, and more precisely, they are configured as L-shaped.

[0064] The bottom 305 of the connecting element 300 contacts, for example, the second printed conductor 135 of the second circuit board 110. The sidewall 310 of the connecting element 300 passes at least partially through a through opening 605 in the first circuit board 105. Another connecting element 600 is arranged adjacent to the connecting element 300, wherein another bottom 610 of the other connecting element 600 contacts the second printed conductor 135 of the second circuit board 110. Another sidewall 615 of the other connecting element 600 passes at least partially through another through opening 620 in the first circuit board 105.

[0065] Here, the connecting elements 300 and 600 are arranged mirror images of each other, for example, in an axisymmetric manner.

[0066] Due to the construction of connecting elements 300 and 600, the height hcc is correspondingly reduced. The through openings 605 and 620 are, for example, electrically insulated.

[0067] in other words, Figures 3 to 6 The connecting device 115, also known as an L-shaped bent plate connector, is shown to describe a scheme for spacing-optimized connecting elements 300 and 600, which may also be referred to as board-to-board signal connections.

[0068] The connecting device 115 is made of a conductive plate, such as a coated or uncoated copper plate, and is bent into a desired L-shape, for example. The connecting device 115 is etched into the desired shape, for example, and has a bent edge etched on one side therein to reduce the bending radius and improve accuracy, see, for example... Figure 8The connecting device 115 is soldered on one side, i.e., with its bottom 305, 610 resting flat on the second circuit board 110, for example, by soldering it together with other components in a vapor phase soldering method, and on the other side, i.e., the sidewalls 310, 615, the connecting device 115 can pass through the through openings 605, 620 in the first circuit board 105 (which may also be referred to as elongated holes, see also) Figure 7 (Contact and weld from above.)

[0069] Figure 7 A diagram illustrating one embodiment of electronic circuit 100 is shown. Here, electronic circuit 100 is compared with... Figure 6 The electronic circuitry is similar or identical to that shown, except that a top view of the first circuit board 105 is shown. More specifically, through openings 605 and 620 are shown, through which the sidewalls of the connecting device can pass.

[0070] Figure 8 A diagram is shown illustrating a connection device 115 for illustrating one embodiment of an electronic circuit. Here, the connection device 115 is similar to or the same as the connection device in one of the above figures.

[0071] The connecting device 115 is configured with a connecting element 300 having a bottom 305 and a sidewall 310, wherein the sidewall 310 is configured as a pin only by way of example. Here, the sidewall 310 extends, for example, from the middle of the bottom 305. The connecting element 300 is configured as a single piece, wherein a curved edge 800 is formed between the sidewall 310 and the bottom 305.

[0072] In other words, the connecting device 115 is etched into the desired shape, for example, and has a curved edge 800 etched on one side to reduce the bending radius and improve accuracy.

[0073] The sidewall 310 (which may also be referred to as the contact side) can be reduced in size for the circuit board, for example, in the form of a single pin or a shorter segment, to increase the possibilities of circuit board design, such as... Figures 8 to 10 As shown. The connecting device 115 can also be referred to as a reduced L-shaped bend plate connector.

[0074] Figure 9 A diagram showing a connection device 115 for illustrating one embodiment of an electronic circuit is provided. Here, the connection device 115 is connected to... Figure 8 The connecting devices are similar or identical, except that connecting device 115 is shown in a side view.

[0075] Figure 10 A diagram showing a connection device 115 for illustrating one embodiment of an electronic circuit is provided. Here, the connection device 115 is connected to... Figure 8 and / or Figure 9The connecting devices are similar or identical, except that connecting device 115 is shown in a later view. More precisely, the later view shows sidewall 310.

[0076] Here, the bottom 305 is constructed to be wider than the sidewall 310.

[0077] Figure 11 A diagram showing a connection device 115 for illustrating one embodiment of an electronic circuit is provided. Here, the connection device 115 is similar to or the same as the connection device in one of the above figures, except that the connection unit 1100 is shown.

[0078] The connecting device 115 is configured with connecting elements 300 and 600, wherein the connecting elements 300 and 600 are configured identically and in an L-shape, only by way of example. Here, the sidewalls 310 and 615 of the connecting elements 300 and 600 are arranged adjacent to or parallel to each other. The connecting elements 300 and 600 are arranged in a horizontally mirrored manner.

[0079] The electronic circuit, for example, has a connection unit 1100 arranged between the sidewalls 310 and 615 of the connecting elements 300 and 600 to connect the connecting elements 300 and 600 to each other. Here, the connection unit 1100 is constructed, for example, as a rectangle, and extends at least partially from the sidewalls 310 and 615 in the assembled state, wherein the connection unit 1100 is constructed, for example, as thinner than the sidewalls 310 and 615.

[0080] Figure 12 A diagram showing a connection device 115 for illustrating one embodiment of an electronic circuit is provided. Here, the connection device 115 is connected to... Figure 11 The connecting devices are similar or identical, except that connecting device 115 is shown in a side view.

[0081] The connecting unit 1100 is only exemplarily flush with the lower side of the bottom 305, 610 and extends at least partially from the upper side of the sidewalls 310, 615.

[0082] Figure 13 A diagram showing a connection device 115 for illustrating one embodiment of an electronic circuit is provided. Here, the connection device 115 is connected to... Figure 11 and / or Figure 12 The connecting devices are similar or identical, except that connecting device 115 is shown in a later view. More precisely, the later view shows sidewall 310 or another sidewall 615.

[0083] Figure 14 A diagram illustrating one embodiment of electronic circuit 100 is shown. More specifically, a partial longitudinal cross-section of electronic circuit 100 is shown. Electronic circuit 100 and Figure 6The electronic circuits in them are similar or identical, except that the connecting device 115 is arranged differently. The connecting device 115 and... Figures 11 to 13 The connecting devices in them are similar or the same.

[0084] Connecting elements 300 and 600 are arranged in the intermediate space 125 of the electronic circuit 100 such that sidewalls 310 and 615 extend at least partially from a through opening 605 in the first circuit board 105. A connecting unit 1100 is arranged between the sidewalls 310 and 615 of the connecting elements 300 and 600, wherein the connecting unit 1100 extends at least partially from the through opening 605 in the first circuit board 105, and further from the through opening 605 than the connecting elements 300 and 600. Thus, the sidewalls 310 and 615 and the connecting unit 1100 at least partially pass through one through opening 605 in the first circuit board 105. The connecting unit 1100 is only exemplary configured to be thicker than the sidewalls 310 and 615, and only exemplary flush with the lower sides of the bottoms 305 and 610, wherein only the bottoms 305 and 610 contact the second printed conductor 135 of the second circuit board 110.

[0085] in other words, Figures 11 to 14 The connecting device 115 is shown, which can also be called... |L-shaped bent plate dual connectors are used to describe the scheme of connection elements 300 and 600 with optimized spacing, which can also be referred to as board-to-board signal connections.

[0086] The connecting device 115 is made of a conductive plate, such as a coated or uncoated copper plate, and is bent into a desired L-shape, for example. The connecting device 115 is etched into the desired shape, for example, and has a bent edge etched on one side therein to reduce the bending radius and improve accuracy, see, for example... Figure 8 Connecting elements 300 and 600 (which can also be called L-shaped bend plate connectors or...) The L-shaped bend plate dual connector is provided with a connection unit 1100 and is connected back to back. The connection unit 1100 may also be referred to as an electrical insulating material, and may include, for example, Kapton, insulating plastic films such as polypropylene or polycarbonate, or similar electrical insulating materials.

[0087] Connecting elements 300 and 600 are soldered flat on one side, i.e., with their bottoms 305 and 610 resting on the second circuit board 110, for example, by being soldered together with other components in a vapor phase soldering method, and on the other side, i.e., the sidewalls 310 and 615, contacting and soldering from above through a through-hole 605 (which may also be referred to as an elongated hole) in the first circuit board 105. The through-hole 605 in the first circuit board 105 has two electrically insulated contacts for the two connecting elements 300 and 600, see [reference needed]. Figure 15 .

[0088] According to one embodiment, an additional connecting element (which may also be referred to as an L-shaped bend plate plug connector) can be connected back-to-back with the connecting unit 1100 to transmit additional signals, such as Miller clamping.

[0089] Sidewalls 310 and 615 may be constructed in a pin shape, for example, to increase the possibilities of circuit board design.

[0090] Figure 15 A diagram illustrating one embodiment of electronic circuit 100 is shown. Here, electronic circuit 100 is compared with... Figure 14 The electronic circuits are similar or identical, except that a top view of the first circuit board 105 is shown.

[0091] More specifically, a top view of a through opening 605 in the first circuit board 105 is shown, the through opening being designed to at least partially accommodate the sidewalls and connecting units. The through opening 605 is, for example, electrically insulated.

[0092] Figure 16 A diagram showing a connection device 115 for illustrating one embodiment of an electronic circuit is provided. Here, the connection device 115 is connected to... Figure 11 The connecting devices are similar or identical, except that the connecting unit 1100 is arranged differently.

[0093] Connecting elements 300 and 600 are arranged adjacent to each other, with bottom elements 305 and 610 facing each other. Connecting unit 1100 is arranged above bottom elements 305 and 610 to connect connecting elements 300 and 600 to each other. Here, a gap 1600 is formed between bottom elements 305 and 610.

[0094] Figure 17 A diagram showing a connection device 115 for illustrating one embodiment of an electronic circuit is provided. Here, the connection device 115 is connected to... Figure 16 The connecting devices are similar or identical, except that connecting device 115 is shown in a side view.

[0095] Figure 18 A diagram showing a connection device 115 for illustrating one embodiment of an electronic circuit is provided. Here, the connection device 115 is connected to... Figure 16 and / or Figure 17 The connecting devices are similar or identical, except that connecting device 115 is shown in a later view. More precisely, the later view shows sidewall 310 or another sidewall 615.

[0096] Figure 19 A diagram illustrating one embodiment of electronic circuit 100 is shown. More specifically, a partial longitudinal cross-section of electronic circuit 100 is shown. Electronic circuit 100 and Figure 6The electronic circuits in them are similar or identical, except that the connecting device 115 is implemented differently. The connecting device 115 and... Figures 16 to 18 The connecting device 115 in the middle is similar or the same.

[0097] A connecting device 115 is arranged in the intermediate space 125 of the electronic circuit 100. Here, the sidewall 310 of the connecting element 300 extends at least partially from the through opening 605 of the first circuit board 105, and the other sidewall 615 of the other connecting element 600 extends at least partially from another through opening 620 of the first circuit board 105. The bottoms 305 and 610 contact the second printed conductor 135 of the second circuit board 110, and the bottoms 305 and 610 are covered by the connecting unit 1100. The connecting unit 1100 and the bottoms 305 and 610 are only exemplary to have the same thickness.

[0098] in other words, Figures 16 to 19 The connecting device 115 is shown, which can also be referred to as L. A bent-plate dual connector is used to describe the scheme for connecting elements 300 and 600, which can also be referred to as a pitch-optimized board-to-board signal connection or L-shaped connector. L-shaped bend plate double connector or L-shaped bend plate plug connector.

[0099] The connector 115 is made of a conductive plate, such as a coated or uncoated copper plate, and is bent into a desired L-shape, for example. The connector 115 is etched into the desired shape, for example, and has a bent edge etched on one side to reduce the bending radius and improve accuracy. The connector 115 is soldered on one side, i.e., with its bottom 305, 610 flat on the second circuit board 110, for example, by soldering it together with other components in a vapor phase soldering method, and on the other side, i.e., the sidewalls 310, 615, can pass through through openings 605, 620 (which may also be referred to as elongated holes, see also) in the first circuit board 105. Figure 7 (Contact and weld from above.)

[0100] Sidewalls 310, 615 (which may also be referred to as contact sides) can be reduced in size for circuit boards 105, 110, for example, as a single pin or a shorter segment, to increase the versatility of circuit board design. According to one embodiment, connecting elements 300, 600 can be frontally connected to connecting unit 1100 to transmit additional signals, such as Miller clamping. Furthermore, by “subdividing” the surfaces flat-soldered onto the second circuit board 110, the required structural space can be reduced, for example... Figure 20 As shown.

[0101] Figure 20A diagram is shown illustrating a connection device 115 for illustrating one embodiment of an electronic circuit. Here, the connection device 115 is similar to or the same as the connection device in one of the above figures, except that the bottoms 305 and 610 of the connecting elements 300 and 600 are triangular in shape.

[0102] Figure 21 A flowchart illustrating one embodiment of a method 2100 for manufacturing an electronic circuit is shown. Here, the electronic circuit is similar to or the same as the electronic circuit in one of the above figures.

[0103] Method 2100 includes a providing step 2105 and an arrangement step 2110. In the providing step 2105, a first circuit board, a second circuit board, and a connecting device are provided. In the arrangement step 2110, the connecting device is arranged between the circuit boards. Here, the bottom of the connecting element is arranged on the second circuit board, wherein the sidewall of the connecting element at least partially passes through a through opening in the first circuit board to fabricate an electronic circuit.

[0104] Figure 22 A block diagram illustrating one embodiment of a control device 2200 for manufacturing electronic circuits is shown. The control device 2200 is designed for controlling and / or performing... Figure 21 The method or similar method.

[0105] For this purpose, the control device 2200 has a providing unit 2205 and an arrangement unit 2210. The providing unit 2205 is designed to provide a first circuit board, a second circuit board, and connecting devices. The arrangement unit 2210 is designed to arrange the connecting devices between the circuit boards. Here, the bottom of the connecting element is arranged on the second circuit board, wherein the sidewall of the connecting element at least partially passes through a through opening in the first circuit board to fabricate electronic circuitry.

[0106] Figure 23 A circuit diagram illustrating one embodiment of electronic circuit 100 is shown. Here, the electronic design structure of electronic circuit 100 is similar to or identical to one of the figures above.

[0107] The electronic circuit 100 has a first power supply voltage connector 2302 and a second power supply voltage connector 2304, wherein a capacitor 2306 is connected between the power supply voltage connectors 2302 and 2304.

[0108] Electronic circuit 100, for example, has a bridge circuit unit 2300, which has a first half-bridge 2305 and a second half-bridge 2310. The first half-bridge 2310 has a first switch 2315 and a second switch 2320, wherein switches 2315 and 2320 are interconnected via a tap 2325. The first switch 2315 represents a high-side switch, and the second switch 2320 represents a low-side switch, wherein switches 2315 and 2320 are designed as transistors.

[0109] The first switch 2315 represents the additional component 140, and the second switch 2320 represents the third component 150. The electronic circuit 100 includes, for example, a first comparator 2330 and a second comparator 2335. The first comparator 2330 is connected, for example, to the first switch 2315, wherein a first inductor 2340 is connected between the first switch 2315 and the first comparator 2330. The second comparator 2335 is connected, for example, to the second switch 2320, wherein a second inductor 2345 is connected between the second switch 2320 and the second comparator 2335.

[0110] The second switch 2320, together with the second inductor 2345 and the second comparator 2335, forms, for example, a gate loop 2350, which may also be referred to as a gate loop.

[0111] The second half-bridge 2310 has a component 138, wherein component 138 represents a series circuit of capacitor 2355 and resistor 2360.

[0112] A third inductor 2365, which may also be referred to as a stray inductor and / or Lcc, is connected between the first half-bridge 2305 and the second half-bridge 2310. In the ready-to-operate state, the current path 198 (e.g., in...) Figure 1 As described in the text, it passes through the bridge circuit unit 2300 and forms the commutation loop 2370.

[0113] in other words, Figure 23 The most common parasitic stray inductances are shown. In fast-switching applications, the stray inductance LCC of current path 198 has the greatest impact on switching behavior and can be reduced through proper layout, such as, for example, in... Figure 1 As shown and described.

[0114] Figure 24 A diagram illustrating one embodiment of the electronic circuit 100 is shown. Here, the electronic circuit 100 is similar to or identical to the electronic circuit in one of the above figures. In other words, Figure 24 This diagram illustrates a simplified vertical converter circuit and its geometric parameters.

[0115] The current path 198 extending along the first circuit board 105 and the second circuit board 110 is shown. All four parameters, lcc, hcc (i.e., height hcc), wcc, and tcc, have a direct impact on the total stray inductance LCC. The height hcc (which can also be called the pitch hcc) between the current paths 198 of the vertical commutation loop is significantly reduced in order to also reduce the corresponding stray inductance LCC.

[0116] The parameter lcc represents, for example, the length of electronic circuit 100, hcc represents, for example, the height of electronic circuit 100, wcc represents the width, and tcc represents the thickness.

[0117] Figure 25 A diagram showing a connection device 115 for illustrating one embodiment of an electronic circuit is provided.

[0118] The connecting device 115 is configured with connecting elements 300 and 600, wherein the connecting elements 300 and 600 are configured identically and in a J-shape, for example only. Here, the sidewalls 310 and 615 of the connecting elements 300 and 600 are arranged adjacent to or parallel to each other, wherein a gap 2500 is formed between the sidewalls 310 and 615. The connecting elements 300 and 600 are arranged relative to each other, for example, in a horizontally mirror manner.

[0119] The bottoms 305 and 610 of the connecting elements 300 and 600, for example, have a bottom surface that is at least partially constructed in an L-shape.

[0120] Figure 26 A diagram showing a connection device 115 for illustrating one embodiment of an electronic circuit is provided. Here, the connection device 115 is connected to... Figure 25 The connecting devices are similar or identical, except that connecting device 115 is shown in a side view.

[0121] A gap of 2500 is formed between the sidewalls 310 and 615.

[0122] Figure 27 A diagram showing a connection device 115 for illustrating one embodiment of an electronic circuit is provided. Here, the connection device 115 is connected to... Figure 25 and / or Figure 26 The connecting devices are similar or identical, except that connecting device 115 is shown in a bottom view. More precisely, bottom parts 305 and 610 are shown in a bottom view.

[0123] Figure 28 A diagram illustrating one embodiment of electronic circuit 100 is shown. More specifically, a partial longitudinal cross-section of electronic circuit 100 is shown. Electronic circuit 100 and Figure 14 The electronic circuits in them are similar or identical, except that the connecting device 115 is arranged differently. The connecting device 115 and... Figures 25 to 27 The connecting devices in them are similar or the same.

[0124] Connecting elements 300 and 600 are arranged in the intermediate space 125 of electronic circuit 100 such that sidewalls 310 and 615 extend at least partially from the through opening 605 of the first circuit board 105. Bottom surfaces 305 and 610 are at least partially in contact with the second printed conductor 135 of the second circuit board 110.

[0125] Figure 29 A diagram illustrating one embodiment of electronic circuit 100 is shown. More specifically, a partial longitudinal cross-section of electronic circuit 100 is shown. Electronic circuit 100 and Figure 28The electronic circuits are similar or identical, except that electronic circuit 100 has a through opening 605 and another through opening 620. The sidewall 310 of the connecting element 300 passes through the through opening 605 at least partially, for example, and the other sidewall 615 of the other connecting element 615 passes through the other through opening 620 at least partially.

[0126] in other words, Figures 25 to 29 The connecting device 115 is shown, which may also be referred to as a J|J-shaped bent plate double plug connector, to describe a scheme for spacing-optimized connecting elements 300, 600, which may also be referred to as signal board to board plug connectors.

[0127] The connector 115 is made of a conductive plate, such as a coated or uncoated copper plate, and is bent into a desired J-shape, for example. The connector 115 is etched into the desired shape, for example, and has a bent edge etched on one side to reduce the bending radius and improve accuracy. Two connector elements 300, 600 (which may also be referred to as J-shaped bent plate connectors) are mounted back-to-back with a gap of 2500 (which may also be referred to as an isolation gap).

[0128] The connecting device 115 is soldered on one side, i.e., with its bottom 305, 610 flat on the second circuit board 110, for example, by soldering it together with other components in a vapor phase soldering method, and on the other side, i.e., the sidewalls 310, 615 can contact and be soldered from above through through openings 605, 620 (which may also be referred to as elongated holes) in the first circuit board 105. The through openings 605, 620 have, for example, two electrically insulated contacts for the two connecting elements 300, 600.

[0129] Sidewalls 310 and 615 (which may also be referred to as contact sides) can be reduced in size for circuit boards 105 and 110, for example, as a single pin or a shorter segment, to increase the design possibilities of circuit boards 105 and 110. Figure 29 As shown, two separate through openings 605 and 620 can be used, with one through opening used for each connecting element 300 and 600.

[0130] The embodiments described and shown in the accompanying drawings are merely exemplary selections. Different embodiments may be combined with each other entirely or in respect of a single feature. One embodiment may also be supplemented by features of another embodiment.

[0131] Furthermore, the method steps of the present invention can be repeated and performed in an order different from that described.

[0132] If an embodiment includes an "and / or" connection between a first feature and a second feature, it can be understood that the embodiment has both the first feature and the second feature according to one implementation, and has only the first feature or only the second feature according to another implementation.

[0133] List of reference numerals in the attached diagram: 100 Electronic Circuits 105 First Circuit Board 110 Second Circuit Board 115 Connecting device 118 The outer side of the first circuit board 120 The inner side of the first circuit board 122 The outer side of the second circuit board 125 Intermediate Space 128 The inner side of the second circuit board 130 First Printed Conductor 135 Second Printed Conductor 138 components 140 Another component 150 Third component 155 Thermal conductive material 160 Another thermally conductive material 165 Bottom of connecting element 166 Bottom of the sixth connecting element 170 Sidewall of the connecting element 171 Through-opening of the first circuit board 172 The other sidewall of another connecting element 173 The third sidewall of the third connecting element 174 The fourth sidewall of the fourth connecting element 175 The fifth sidewall of the fifth connecting element 176 The sixth sidewall of the sixth connecting element 180 connecting element 181 Support element 182 Another connecting element 183 Another supporting element 184 Third connecting element 185 Third support element 186 Fourth connecting element 187 Fourth Support Element 188 Fifth connecting element 190 Sixth connecting element 192 Another through opening on the first circuit board 193 The third through opening of the first circuit board 194 The fourth through opening of the first circuit board 195 The fifth through opening of the first circuit board 196 The sixth through opening of the first circuit board 198 Current Path 200 spacing 300 Connecting Components 305 bottom 310 sidewall 600 Another connecting element 605 Through-opening 610 Another bottom of another connecting element 615 The other sidewall of another connecting element 620 Another through opening 800 curved edge 1100 Connection Unit 1600 gap 2100 Methods for manufacturing electronic circuits 2105 provides steps 2110 Layout Steps 2200 Control equipment for manufacturing electronic circuits 2205 Providing Unit 2210 Layout Unit 2300 Bridge Circuit Unit 2302 First power supply voltage connector 2304 Second Power Supply Voltage Connector 2305 First Half Bridge 2306 capacitor 2310 Second Half Bridge 2315 First Switch 2320 Second Switch 2325 tap point 2330 First Comparator 2335 Second Comparator 2340 First Inductor 2345 Second Inductor 2350 gate circuit 2355 capacitor 2360 resistor 2365 Third Inductor 2370 converter circuit 2500 gap Lcc stray inductance lcc length wcc width hcc height tcc thickness.

Claims

1. An electronic circuit (100), said electronic circuit having the following characteristics: A first circuit board (105) has an outer side (118) and an inner side (120) opposite to the outer side (118), wherein, The first circuit board (105) has at least one first printed conductor (130), and the first circuit board (105) has at least one through opening (605) designed as an elongated hole. A second circuit board (110) has an outer side (122) and an inner side (128) opposite to the outer side (122), wherein the second circuit board (110) has a second printed conductor (135), and the inner side (128) of the second circuit board (110) faces the inner side (120) of the first circuit board (105); and A connecting device (115) is disposed in an intermediate space (125) between a first circuit board (105) and a second circuit board (110). The connecting device (115) is configured with at least one connecting element (300) having a bottom (305) and a sidewall (310) adjacent to the bottom (305). The lower side of the bottom (305) is disposed on the inner side (128) of the second circuit board (110) of the electronic circuit (100). The sidewall (310) passes at least partially through a through opening (605) in the first circuit board (105) of the electronic circuit (100). Its features are, The connecting device (115) is configured with another connecting element (600) having another bottom (610) and another sidewall (615) adjacent to the other bottom (610), wherein the other lower side of the other bottom (610) is arranged on the inner side (128) of the second circuit board (110) of the electronic circuit (100), and the other sidewall (615) passes at least partially through the through opening (605) or another through opening (620) designed as an elongated hole in the first circuit board (105) of the electronic circuit (100).

2. The electronic circuit (100) according to claim 1, wherein, The connecting device (115) includes a metallic material, particularly the metallic material being constructed as a conductive plate.

3. The electronic circuit (100) according to any one of the preceding claims, wherein, The connecting element (300) is configured in an L-shape or a J-shape.

4. The electronic circuit (100) according to any one of the preceding claims, wherein, The connecting element (300) is a one-piece construction, especially with a curved edge (800) constructed between the bottom (305) and the side wall (310).

5. The electronic circuit (100) according to any one of the preceding claims, wherein, The bottom (305) of the connecting element (300) is configured to be wider than the sidewall (310) of the connecting element (300), or the sidewall (310) of the connecting element (300) is configured to be wider than the bottom (305) of the connecting element (300), or the bottom (305) of the connecting element (300) and the sidewall (310) of the connecting element (300) have the same width.

6. The electronic circuit (100) according to any one of the preceding claims, wherein, The sidewall (310) of the connecting element (300) is constructed in the shape of a pin, and in particular, the sidewall (310) of the pin shape is centrally arranged on the bottom (305).

7. The electronic circuit (100) according to any one of the preceding claims, wherein, The bottom (305) of the connecting element (310) is triangular.

8. The electronic circuit (100) according to any one of the preceding claims, wherein, The back of the sidewall (310) and the other back of the other sidewall (615) are arranged adjacent to each other or can be arranged adjacent to each other, or the bottom (305) and the other bottom (610) are arranged adjacent to each other or can be arranged adjacent to each other.

9. The electronic circuit (100) according to any one of the preceding claims, the electronic circuit having a connection unit (1100) disposed between the back side of the side wall (310) and the other back side of the other side wall (615), or the connection unit (1100) disposed on the bottom (305) and the other bottom (610) to connect the connection element (300) and the other connection element (600) to each other.

10. The electronic circuit (100) according to claim 9, wherein, The connection unit (1100) is made of an electrically insulating material.

11. A method (2100) for manufacturing an electronic circuit (100) according to any one of claims 1 to 10, wherein, The method (2100) includes the following steps: Provided (2105) a first circuit board (105), a second circuit board (110), and a connecting device (115); and Connecting devices (115) are arranged (2110) between the circuit boards (105, 110), wherein the bottom (305) of the connecting element (300) is arranged on the second circuit board (110), and the sidewall (310) of the connecting element (300) passes at least partially through a through opening (605) of the first circuit board (105) designed as an elongated hole for fabricating electronic circuits (100). In addition, another connecting element (600) is arranged for the connecting device (115). The other connecting element has another bottom (610) and another sidewall (615) adjacent to the other bottom (610), wherein the other lower side of the other bottom (610) is disposed on the inner side (128) of the second circuit board (110) of the electronic circuit (100), and the other sidewall (615) passes at least partially through a through opening (605) of the first circuit board (105) of the electronic circuit (100) or another through opening (620) designed as an elongated hole.

12. A control device (2200) designed to perform and / or control the steps of the method (2100) according to claim 11 in a corresponding unit.

13. A computer program product having program code for carrying out the method of claim 11 when the computer program product is executed on a control device.

14. A machine-readable storage medium on which the computer program according to claim 13 is stored.

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