LED device and LED display module

Abstract

The utility model discloses an LED device and an LED display module, the LED device comprises a bearing support, the bearing support is provided with a first metal bonding pad and a second metal bonding pad, an insulation channel is arranged between the first metal bonding pad and the second metal bonding pad, and the first metal bonding pad bears an LED chip; a cup-shaped structure is arranged on the bearing support, the cup-shaped structure surrounds the LED chip, a packaging colloid is arranged in the cup-shaped structure, and the packaging colloid wraps the LED chip; a support step is arranged at the contact position of the bottom of the cup-shaped structure and the bearing support. According to the utility model, through the arrangement of the cup-shaped structure in which the cup is deeper and the inclination angle of the cup side wall is closer to be vertical, and the arrangement of the support step, the light path distance and the light-emitting spot area of the LED chip are enlarged, the light-emitting fullness of the LED device is enhanced, and the display effect of the LED device is optimized.

Description

Technical Field

[0001] The utility model relates to the technical field of LED device display, in particular to an LED device and an LED display module. Background Art

[0002] With the rapid development of science and technology, the intelligence of various smart devices is constantly improving. As a new track, smart interactive LED display devices are becoming more and more widely used and become an important information communication medium for the interaction between different objects. However, the existing LED devices are equipped with a relatively low height LED bracket structure, resulting in a distance of less than 0.4mm from the LED chip to the light-emitting surface of the LED device, a short optical path distance, and poor astigmatism. If a higher LED bracket is used, the LED bracket is prone to deformation when subjected to force, and it is difficult to reverse the mold in the preparation process, which increases the difficulty of the process. In addition, the upper surface of the encapsulation colloid commonly used in existing LED devices is flat or concave. Under the condition of a relatively small working current, the light-emitting area of ​​the light-emitting surface of the LED device accounts for a relatively small proportion, and the light spot area is relatively small, resulting in incomplete image display of the LED display module made therefrom and poor display effect. Utility Model Content

[0003] The purpose of the utility model is to overcome the deficiencies of the prior art. The utility model provides an LED device and an LED display module. By setting a cup-shaped structure with a deeper cup depth and a cup side wall inclination angle closer to vertical and providing a bracket step, the optical path distance and light spot area of ​​the LED chip are expanded, the light-emitting area on the surface of the LED device is increased, the light-emitting fullness of the LED device is enhanced, and the display effect of the LED device is optimized.

[0004] The utility model provides an LED device, the LED device comprises a bearing bracket, a first metal pad and a second metal pad are arranged on the bearing bracket, an insulating channel is arranged between the first metal pad and the second metal pad, and an LED chip is carried on the first metal pad;

[0005] The supporting bracket is provided with a cup-shaped structure, the cup-shaped structure surrounds the LED chip, and a packaging colloid is provided in the cup-shaped structure, and the packaging colloid covers the LED chip;

[0006] A support step is provided at the contact point between the bottom of the cup-shaped structure and the bearing support.

[0007] Furthermore, the height from the highest point of the cup-shaped structure to the upper surface of the supporting bracket is greater than the diameter of the cup-shaped structure*0.2.

[0008] Furthermore, the LED chip is a red LED chip, a green LED chip, a blue LED chip, or a purple LED chip.

[0009] Furthermore, the height from the highest point of the cup-shaped structure to the upper surface of the LED chip is greater than 0.5 mm.

[0010] Furthermore, the upper surface of the encapsulation colloid is a convex surface or a non-convex surface.

[0011] Furthermore, when the upper surface of the encapsulating colloid is a convex surface, the height from the highest point of the convex surface of the upper surface of the encapsulating colloid to the upper surface of the supporting bracket is greater than the diameter of the cup-shaped structure*0.4.

[0012] Furthermore, the inclination angle of the cup side wall of the cup-shaped structure is any value between 60° and 90°.

[0013] Furthermore, the height of the support step is greater than 0.1 mm.

[0014] Furthermore, a silver-plated layer is provided on the contact surface between the supporting bracket and the packaging colloid.

[0015] The utility model provides an LED device and an LED display module. By setting a cup-shaped structure with a deeper cup depth and a cup side wall inclination angle closer to the vertical, the optical path distance and the light spot area of ​​the LED chip are expanded; and a bracket step is provided to avoid the risk of deformation of the cup-shaped structure when subjected to force, and at the same time, the area of ​​the silver-plated layer on the upper surface of the supporting bracket can be reduced, and the loss of light emitted from the side of the LED chip is reduced; the upper surface of the encapsulating colloid is set to be a convex surface, and the optical characteristics of the lens are used to increase the light-emitting area of ​​the LED device surface, and increase the weight of the encapsulating colloid, thereby improving the anti-sulfurization, anti-oxidation and moisture-proof properties, enhancing the air tightness, and overall enhancing the luminous fullness of the LED device, and optimizing the display effect of the LED display module made thereof. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 It is a schematic cross-sectional view of the structure of the LED device in the embodiment of the utility model;

[0018] Figure 2 It is a schematic top view of the structure of the LED device in the embodiment of the utility model. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] Embodiment 1

[0021] The utility model embodiment provides an LED device, such as Figure 1 and Figure 2 As shown, Figure 1 The schematic cross-sectional view of the structure of the LED device in the embodiment of the utility model is shown. Figure 2 A schematic top view of the structure of the LED device in the embodiment of the utility model is shown.

[0022] In an optional implementation of the present embodiment, the LED device comprises a supporting bracket 1 , on which a first metal pad 21 and a second metal pad 22 are provided, and on which the first metal pad 21 carries an LED chip 3 .

[0023] Specifically, the first metal pad 21 and the second metal pad 22 are not symmetrically arranged on the supporting bracket 1 .

[0024] In an optional implementation of this embodiment, an insulating channel 23 is provided between the first metal pad 21 and the second metal pad 22 .

[0025] In an optional implementation of this embodiment, the LED chip is a red LED chip, a green LED chip, a blue LED chip, or a purple LED chip.

[0026] In an optional implementation of this embodiment, a cup-shaped structure 4 is provided on the supporting bracket 1 , and the cup-shaped structure 4 surrounds the LED chip 3 .

[0027] In an optional implementation of this embodiment, the non-metallic portion of the supporting bracket 1 and the cup-shaped structure 4 are integrally formed.

[0028] In an optional implementation of this embodiment, a packaging colloid 5 is disposed in the cup-shaped structure 4 , and the packaging colloid 5 covers the LED chip 3 .

[0029] In an optional implementation of this embodiment, a height h1 from the highest point of the cup-shaped structure 4 to the upper surface of the LED chip 3 is greater than 0.5 mm.

[0030] Preferably, a height h1 from the highest point of the cup-shaped structure 4 to the upper surface of the LED chip 3 is 0.65 mm.

[0031] In an optional implementation of this embodiment, the upper surface of the encapsulating colloid 5 is a convex surface or a non-convex surface.

[0032] Specifically, in this embodiment, if Figure 1 As shown, the upper surface of the encapsulating colloid 5 is a convex surface.

[0033] It should be noted that the packaging colloid on the existing LED device usually has a flat or concave upper surface, and the light spot area of ​​the LED device is small, so that the light spot formed on the upper surface of the packaging colloid is small. In this embodiment, a packaging colloid with a convex upper surface is used, and the optical characteristics of the lens are utilized to increase the light emitting area of ​​the LED device surface, expand the light spot area of ​​the LED device surface, expand the formed light spot, and make the display effect better.

[0034] In an optional implementation of this embodiment, the height h2 from the highest point of the cup-shaped structure 4 to the upper surface of the supporting bracket 1 is greater than the diameter d*0.2 of the cup-shaped structure 4, and the height h2 from the highest point of the cup-shaped structure 4 to the upper surface of the supporting bracket 1 is greater than 0.7 mm.

[0035] Preferably, a height h2 from the highest point of the cup-shaped structure 4 to the upper surface of the supporting bracket 1 is 0.8 mm.

[0036] In an optional implementation of this embodiment, a height h3 from the highest point of the cup-shaped structure 4 to the lower surface of the supporting bracket 1 is any value between 1 mm and 1.5 mm.

[0037] Preferably, a height h3 from the highest point of the cup-shaped structure 4 to the lower surface of the supporting bracket 1 is 1.05 mm.

[0038] In an optional implementation of this embodiment, a height h4 from the highest point of the convex surface of the upper surface of the encapsulation colloid 5 to the lower surface of the supporting bracket 1 is any value between 1.4 mm and 2.0 mm.

[0039] Preferably, a height h4 from the highest point of the convex surface of the upper surface of the encapsulating colloid 5 to the lower surface of the supporting bracket 1 is 1.5 mm.

[0040] In an optional implementation of this embodiment, a height h5 from the highest point of the convex surface of the upper surface of the encapsulation colloid 5 to the upper surface of the supporting bracket 1 is greater than a diameter d*0.4 of the cup-shaped structure 4 .

[0041] It should be noted that the LED bracket structure carried by the existing LED device is relatively low in height and the optical path distance is relatively short. The distance from the LED chip to the light-emitting surface of the LED device is only less than 0.4 mm. In the present embodiment, the height h1 from the highest point of the cup-shaped structure to the upper surface of the LED chip, that is, the distance from the LED chip to the light-emitting surface of the LED device is set to be greater than 0.5 mm, which expands the optical path distance of the LED chip, expands the light-emitting spot area, and expands the formed light spot, so that the display effect is better.

[0042] In an optional implementation of this embodiment, the inclination angle θ of the cup side wall of the cup-shaped structure 4 is any value between 60° and 90°.

[0043] It should be noted that after increasing the cup depth of the cup-shaped structure, if the inclination angle of the cup side wall is not modified, the risk of deformation and fracture of the bracket when subjected to external force will increase, which is not conducive to the stability of the overall device. In this embodiment, while increasing the cup depth of the cup-shaped structure, the inclination angle θ of the cup side wall of the cup-shaped structure is approached to a direction perpendicular to the bottom of the cup-shaped structure, that is, the inclination angle θ of the cup side wall is closer to 90°, so that the cup side wall is as steep as possible, making the cup-shaped structure more stable, enhancing the force stability, and avoiding the risk of fracture.

[0044] In an optional implementation of this embodiment, a support step is provided at the contact point between the bottom of the cup-shaped structure 4 and the supporting support 1 .

[0045] Specifically, the support step includes a first support step 61 and a second support step 62 , the first support step 61 is located in the left half of the upper surface of the load-bearing support 1 , and the second support step 62 is located in the right half of the upper surface of the load-bearing support 1 .

[0046] Furthermore, since the positions of the first metal pad 21 and the second metal pad 22 on the supporting bracket 1 are generally biased to the left, the cross-sectional area of ​​the first bracket step 61 is smaller, and the cross-sectional area of ​​the second bracket step 62 is larger.

[0047] Furthermore, the height h6 of the support step is greater than 0.1 mm, that is, the heights of the first support step 61 and the second support step 62 are both greater than 0.1 mm.

[0048] Preferably, the height h6 of the support step is 0.15 mm.

[0049] It should be noted that when the inclination angle θ of the cup side wall of the cup-shaped structure is closer to 90°, it will cause the reflection cup model to be difficult to perform the reverse molding operation in the bracket preparation process, which increases the difficulty of the preparation process, and because the inclination angle θ of the cup side wall of the cup-shaped structure is closer to 90°, the contact area between the cup-shaped structure and the load-bearing bracket is reduced, and the metal part at the connection between the cup-shaped structure and the load-bearing bracket will be lifted up, and its stability is affected. In this embodiment, a bracket step is provided to reduce the difficulty of the reverse molding operation in the preparation process, increase the contact area between the cup-shaped structure and the load-bearing bracket, and improve reliability.

[0050] In an optional implementation of this embodiment, a silver-plated layer 7 is provided on the contact surface between the supporting bracket 1 and the packaging colloid 5 .

[0051] It should be noted that, since the bracket step is set, the area of ​​the silver-plated layer can be reduced, and the loss of light from the side of the LED chip can be reduced; at the same time, since the upper surface of the encapsulation colloid is changed from a concave or flat surface to a convex surface, the weight of the encapsulation colloid is increased, thus blocking the path of external sulfur, hydrogen sulfide, sulfur dioxide, water vapor, oxygen, etc. to invade the interior of the LED device to a greater extent, reducing the light decay caused by the generation of black silver sulfide or silver oxide and blackening of the silver-plated layer due to sulfidation or oxidation, improving the anti-sulfurization, anti-oxidation, and moisture-proof properties, enhancing the air tightness, and improving the reliability of the LED device.

[0052] In summary, the first embodiment of the utility model provides an LED device, which expands the optical path distance and light spot area of ​​the LED chip by setting a cup-shaped structure with a deeper cup depth and a cup side wall inclination angle closer to vertical; and is provided with a bracket step to avoid the risk of deformation of the cup-shaped structure when subjected to force, while reducing the area of ​​the silver-plated layer on the upper surface of the supporting bracket, and reducing the loss of light from the side of the LED chip; the upper surface of the encapsulating colloid is set to a convex surface, and the optical characteristics of the lens are utilized to increase the light-emitting area on the surface of the LED device, and increase the weight of the encapsulating colloid, thereby improving the anti-sulfurization, anti-oxidation, and moisture-proof properties, enhancing the air tightness, and overall enhancing the luminous fullness of the LED device, and optimizing the display effect of the LED display module made therefrom.

[0053] Embodiment 2

[0054] The second embodiment of the present invention provides an LED display module, and the LED display module includes a plurality of LED devices in the first embodiment.

[0055] In summary, the second embodiment of the utility model provides an LED display module, including several LED devices in the first embodiment. By setting a cup-shaped structure with a deeper cup depth and a cup side wall inclination angle closer to vertical, the optical path distance and light spot area of ​​the LED chip are expanded; and a bracket step is provided to avoid the risk of deformation of the cup-shaped structure when subjected to force, and at the same time, the area of ​​the silver-plated layer on the upper surface of the supporting bracket can be reduced, thereby reducing the loss of light from the side of the LED chip; the upper surface of the encapsulating colloid is set to a convex surface, and the optical characteristics of the lens are utilized to increase the light-emitting area on the surface of the LED device, and increase the weight of the encapsulating colloid, thereby improving the anti-sulfurization, anti-oxidation and moisture-proof properties, enhancing the air tightness, and enhancing the overall luminous fullness of the LED device, thereby optimizing the display effect of the LED display module manufactured therefrom.

[0056] The above is a detailed introduction to an LED device and an LED display module provided by an embodiment of the utility model. Specific examples are used in this article to illustrate the principle and implementation method of the utility model. The description of the above embodiments is only used to help understand the method and core idea of ​​the utility model; at the same time, for general technical personnel in this field, according to the idea of ​​the utility model, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the utility model.

Claims

1. An LED device, characterized in that: The LED device comprises a supporting bracket, a first metal pad and a second metal pad are arranged on the supporting bracket, an insulating channel is arranged between the first metal pad and the second metal pad, and an LED chip is carried on the first metal pad; The supporting bracket is provided with a cup-shaped structure, the cup-shaped structure surrounds the LED chip, and a packaging colloid is provided in the cup-shaped structure, and the packaging colloid covers the LED chip; A support step is provided at the contact point between the bottom of the cup-shaped structure and the bearing support.

2. The LED device according to claim 1, characterized in that The height from the highest point of the cup-shaped structure to the upper surface of the supporting bracket is greater than the diameter of the cup-shaped structure*0.

2.

3. The LED device according to claim 1, characterized in that The LED chip is a red LED chip, a green LED chip, a blue LED chip, or a purple LED chip.

4. The LED device according to claim 1, characterized in that: The height from the highest point of the cup-shaped structure to the upper surface of the LED chip is greater than 0.5 mm.

5. The LED device according to claim 1, characterized in that The upper surface of the encapsulating colloid is a convex surface or a non-convex surface.

6. The LED device according to claim 5, characterized in that When the upper surface of the encapsulating colloid is a convex surface, the height from the highest point of the convex surface of the upper surface of the encapsulating colloid to the upper surface of the supporting bracket is greater than the diameter of the cup-shaped structure*0.

4.

7. The LED device according to claim 1, characterized in that The inclination angle of the cup side wall of the cup-shaped structure is any value between 60° and 90°.

8. The LED device according to claim 1, characterized in that The height of the support step is greater than 0.1 mm.

9. The LED device according to claim 1, characterized in that A silver-plated layer is arranged on the contact surface between the supporting bracket and the packaging colloid.

10. An LED display module, characterized in that: The LED display module comprises the LED device according to any one of claims 1-9.

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