Multi-laminated industrial board card easy to develop

Abstract

The utility model relates to the technical field of board cards, and discloses a multi-laminated industrial-grade board card easy to develop. Comprising a mother board, a secondary interface board and a final-stage interface board. The mother board is used for providing power supply, data transmission and control functions; the secondary interface board is connected with the mother board; the final-stage interface board is connected with the secondary-stage interface board; wherein different interfaces are arranged on the secondary-stage interface board and the final-stage interface board so as to adapt to different joints. By combining the mother board, the secondary interface board and the final-stage interface board together, the multi-laminated industrial-grade board card can meet the requirements of different joints and interfaces.

Description

Technical Field

[0001] The utility model relates to the technical field of boards and cards, in particular to a multi-layer industrial-grade board and card that is easy to develop. Background Art

[0002] With the development of society, people have higher and higher requirements for R&D and production efficiency. In today's society where technology is developing rapidly, how to shorten the development cycle and increase production efficiency has become the focus of people's attention. In the field of industrial control, the interface structure requirements of different industrial control industries are inconsistent, the development cycle of industrial boards is long, and the interfaces of industrial control industry boards are not unified, with few options. Utility Model Content

[0003] The embodiment of the utility model aims to provide an easy-to-develop multi-layer industrial-grade board card to solve the technical problems in the prior art that different industrial control industries have inconsistent interface structure requirements, industrial board card development cycle is long, and industrial control industry board card interfaces are not unified and there are few options.

[0004] The utility model embodiment solves its technical problems by adopting the following technical solutions:

[0005] Provides an easy-to-develop multi-layer industrial-grade board including:

[0006] A motherboard, which is used to provide power supply, data transmission and control functions;

[0007] A secondary interface board, the secondary interface board is connected to the motherboard;

[0008] A final interface board, the final interface board is connected to the secondary interface board;

[0009] Wherein, the secondary interface board and the final interface board are provided with different interfaces to adapt to different connectors.

[0010] In some embodiments, the secondary interface board includes a first connection board and a second connection board, the first connection board is interconnected with the motherboard, and the second connection board is interconnected with the final interface board.

[0011] In some embodiments, a BTB female socket is provided on the motherboard, and a BTB male socket is provided on the first connecting board;

[0012] The BTB male socket and the BTB female socket are plugged into each other.

[0013] In some embodiments, a first positioning hole is provided on the motherboard, and a first positioning copper column is provided on the first connecting plate;

[0014] The first positioning copper column is inserted into the first positioning hole.

[0015] In some embodiments, a second positioning hole is formed on the second connection board, and a second positioning copper column is provided on the final interface board, and the second positioning copper column passes through the second positioning hole.

[0016] In some embodiments, a female signal pin header is disposed on the second connection board, and a male signal pin header is disposed on the final interface board. The male signal pin header can be plugged into the female signal pin header.

[0017] In some embodiments, a power pin header female socket is disposed on the second connection board, and a power pin header male socket is disposed on the final-stage interface board, and the power pin header male socket can be plugged into the power pin header female socket.

[0018] Compared with the prior art, in the multi-layer industrial-grade board card that is easy to develop provided by the embodiment of the utility model, the motherboard is used to provide power supply, data transmission and control functions. The motherboard is the core component of the entire system, responsible for coordinating and managing the work of various hardware components. The secondary interface board is connected to the motherboard and provides specific interface functions. The secondary interface board can be added or replaced as needed to meet the needs of specific applications. It can expand additional interfaces or functions and work in conjunction with the motherboard. The final interface board is connected to the secondary interface board and provides different interfaces to adapt to different connectors. The final interface board usually provides more specific and specific interface types to adapt to various external devices or interface requirements. By combining the motherboard, the secondary interface board and the final interface board together, the multi-layer industrial-grade board card can meet the needs of different connectors and interfaces. Through such a setting, the multi-layer industrial-grade board card has flexibility and scalability, and can adapt to specific requirements in various industrial applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0020] Figure 1 It is a structural schematic diagram of a motherboard provided by one embodiment of the utility model;

[0021] Figure 2 It is a structural schematic diagram of a secondary interface board provided by one embodiment of the utility model;

[0022] Figure 3 It is a structural schematic diagram of a final-stage interface board provided in one embodiment of the utility model.

[0023] Reference numerals:

[0024] 10. Motherboard; 11. BTB female socket; 12. First positioning hole; 20. Secondary interface board; 21. First connecting board; 211. BTB male socket; 212. First positioning copper pillar; 22. Second connecting board; 221. Signal pin header female socket; 222. Power pin header female socket; 30. Final interface board; 31. Signal pin header male socket; 32. Power pin header male socket. DETAILED DESCRIPTION

[0025] In order to facilitate the understanding of the utility model, the utility model is described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as "connecting" another element, it can be directly on another element, or there can be one or more centered elements therebetween. The orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "upper end", "lower end", "top" and "bottom" used in this specification is based on the orientation or positional relationship shown in the accompanying drawings, only for the convenience of describing the utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the utility model. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0026] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0027] In the embodiment of the utility model, the multi-layer industrial-grade board card that is easy to develop can be used to transport liquid medicine.

[0028] Combine the following Figures 1 to 3 , the easy-to-develop multi-layer industrial-grade board provided in the embodiments of the present application is described in detail through specific examples.

[0029] Please also read Figures 1 to 3 , Figure 1 It is a structural schematic diagram of a motherboard provided by one embodiment of the utility model; Figure 2 It is a structural schematic diagram of a secondary interface board provided by one embodiment of the utility model; Figure 3It is a structural schematic diagram of the final interface board provided by one embodiment of the utility model. The multi-layer industrial-grade board card that is easy to develop provided by one embodiment of the utility model includes a motherboard 10, a secondary interface board 20 and a final interface board 30. The motherboard 10 is used to provide power supply, data transmission and control functions; the secondary interface board 20 is connected to the motherboard 10; the final interface board 30 is connected to the secondary interface board 20; wherein, different interfaces are provided on the secondary interface board 20 and the final interface board 30 to adapt to different connectors.

[0030] The motherboard 10 is used to provide power supply, data transmission and control functions. The motherboard 10 is the core component of the entire system and is responsible for coordinating and managing the work of various hardware components. The secondary interface board 20 is connected to the motherboard 10 and provides specific interface functions. The secondary interface board 20 can be added or replaced as needed to meet the needs of specific applications. It can expand additional interfaces or functions and work in conjunction with the motherboard 10. The final interface board 30 is connected to the secondary interface board 20 and provides different interfaces to adapt to different connectors. The final interface board 30 generally provides more specific and specific interface types to adapt to various external devices or interface requirements. By combining the motherboard 10, the secondary interface board 20 and the final interface board 30 together, the multi-layer industrial-grade board can meet the needs of different connectors and interfaces. Through such a setting, the multi-layer industrial-grade board has flexibility and scalability, and can adapt to specific requirements in various industrial applications.

[0031] In some embodiments, the secondary interface board 20 includes a first connection board 21 and a second connection board 22 . The first connection board 21 is connected to the motherboard 10 , and the second connection board 22 is connected to the final interface board 30 .

[0032] The motherboard 10 is used to provide power supply, data transmission and control functions. The secondary interface board 20 is composed of a first connecting board 21 and a second connecting board 22. The first connecting board 21 is interconnected with the motherboard 10 and is responsible for connecting and expanding specific interfaces or functions. The final interface board 30 is interconnected with the second connecting board 22 and is responsible for providing different interface types to adapt to different connectors or external device requirements. By connecting the motherboard 10 with the first connecting board 21, the second connecting board 22 and the final interface board 30, the multi-layer industrial-grade board can provide more interface expansion and flexibility. The first connecting board 21 and the second connecting board 22 provide the connection function of the middle layer, making the interface connection between the motherboard 10 and the final interface board 30 more flexible and customizable. Through such a setting, the multi-layer industrial-grade board can better adapt to different industrial application scenarios and meet specific interface requirements.

[0033] In some embodiments, a BTB female socket 11 is disposed on the motherboard 10 , and a BTB male socket 211 is disposed on the first connecting board 21 ; the BTB male socket 211 and the BTB female socket 11 are plugged into each other.

[0034] The BTB female socket 11 and the BTB male socket 211 are two parts of the BTB connector, which can be connected to each other by plugging. In a multi-layer industrial-grade board, the BTB female socket 11 on the motherboard 10 provides a plug-in interface, and the BTB male socket 211 on the first connecting board 21 is inserted into the BTB female socket 11 to complete the connection between them. Through the use of the BTB connector, reliable electrical connection and mechanical fixation can be achieved, so that the circuit signal between the motherboard 10 and the first connecting board 21 can be transmitted, and the stability and reliability of the connection can be ensured. Thus, the motherboard 10 and the secondary interface board 20 can be connected by signal.

[0035] In some embodiments, a first positioning hole 12 is provided on the motherboard 10, and a first positioning copper column 212 is provided on the first connecting plate 21; the first positioning copper column 212 is inserted into the first positioning hole 12. This can provide positioning and connection functions. By providing the first positioning hole 12 on the motherboard 10 and providing the first positioning copper column 212 on the first connecting plate 21, it can be ensured that the first connecting plate 21 and the motherboard 10 are aligned and fixed in the correct position. Through such a setting, the first connecting plate 21 and the motherboard 10 can be fixedly connected, and the first positioning hole 12 and the first positioning copper column are connected, which can make the assembly process simpler and more efficient.

[0036] In some embodiments, a second positioning hole is provided on the second connection board 22, and a second positioning copper column is provided on the final interface board 30, and the second positioning copper column is passed through the second positioning hole. A second positioning hole is provided on the second connection board 22, and a second positioning copper column is provided on the final interface board 30. The second positioning copper column passes through the second positioning hole to play a role in positioning and connection. Such a setting can ensure that the second connection board 22 and the final interface board 30 are aligned and fixed in the correct position, so as to achieve reliable connection and assembly.

[0037] In some embodiments, a female signal pin header 221 is disposed on the second connection board 22 , and a male signal pin header 31 is disposed on the final interface board 30 . The male signal pin header 31 can be plugged into the female signal pin header 221 .

[0038] The second connection board 22 is provided with a signal pin header 221, and the final interface board 30 is provided with a signal pin header 31. The signal pin header 31 can be plugged into the signal pin header 221, so that the transmission and connection of signals on the secondary interface board 20 and the final interface board 30 can be realized.

[0039] In some embodiments, a power pin header female socket 222 is provided on the second connection board 22, and a power pin header male socket 32 ​​is provided on the final interface board 30, and the power pin header male socket 32 ​​can be plugged into the power pin header female socket 222. The power pin header male socket 32 ​​can be plugged into the power pin header female socket 222 to achieve power transmission and connection. By plugging the power pin header male socket 32 ​​and the power pin header female socket 222, the power can be transferred to the final interface board 30 to supply power to the corresponding electronic components. This can ensure the normal operation of the electronic equipment and meet its power requirements.

[0040] It should be particularly noted that the easy-to-develop multi-layer industrial-grade board card provided in the embodiment of the utility model only shows the part related to the technical problem to be solved by the embodiment of the utility model. It can be understood that the easy-to-develop multi-layer industrial-grade board card provided in the embodiment of the utility model also includes other structures for realizing the functions of the easy-to-develop multi-layer industrial-grade board card, which will not be repeated one by one again.

[0041] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Under the idea of ​​the present invention, the technical features in the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other changes in different aspects of the present invention as described above, which are not provided in detail for the sake of simplicity. Although the present invention is described in detail with reference to the aforementioned embodiments, a person of ordinary skill in the art should understand that the technical solutions described in the aforementioned embodiments can still be modified, or some of the technical features can be replaced by equivalents. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An easy-to-develop multi-layer industrial-grade board, characterized in that: include: A motherboard, which is used to provide power supply, data transmission and control functions; A secondary interface board, the secondary interface board is connected to the motherboard; A final interface board, the final interface board is connected to the secondary interface board; Wherein, different interfaces are arranged on the secondary interface board and the final interface board to adapt to different connectors.

2. The easy-to-develop multi-layer industrial-grade board according to claim 1, characterized in that: The secondary interface board includes a first connection board and a second connection board, wherein the first connection board is connected to the motherboard, and the second connection board is connected to the final interface board.

3. The easy-to-develop multi-layer industrial-grade board according to claim 2, characterized in that: The motherboard is provided with a BTB female socket, and the first connecting board is provided with a BTB male socket; The BTB male socket and the BTB female socket are plugged into each other.

4. The easy-to-develop multi-layer industrial-grade board according to claim 3, characterized in that: A first positioning hole is provided on the motherboard, and a first positioning copper column is provided on the first connecting plate; The first positioning copper column is inserted into the first positioning hole.

5. The easy-to-develop multi-layer industrial-grade board according to claim 2, characterized in that: A second positioning hole is formed on the second connection board, and a second positioning copper column is provided on the final interface board. The second positioning copper column passes through the second positioning hole.

6. The easy-to-develop multi-layer industrial-grade board according to claim 5, characterized in that: The second connection board is provided with a female signal pin header, and the final interface board is provided with a male signal pin header, and the male signal pin header can be plugged into the female signal pin header.

7. The easy-to-develop multi-layer industrial-grade board according to claim 5, characterized in that: The second connection board is provided with a power pin header female socket, and the final interface board is provided with a power pin header male socket, and the power pin header male socket can be plugged into the power pin header female socket.

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