Fixing mechanism for semiconductor chip processing

Abstract

The utility model discloses a fixing mechanism for semiconductor chip processing, which belongs to the technical field of semiconductor chip processing, solves the problem that the existing device needs to manually lift handles one by one and is troublesome to use, and comprises a working table, an electromagnet opposite to a through groove in position is fixedly mounted on the top surface of the working table; the fixing mechanism comprises a transverse plate fixedly mounted on the side face of the supporting column, the bottom face of the transverse plate is fixedly connected with one end of a reset spring, the other end of the reset spring is fixedly connected with a metal plate, a mounting block is fixedly mounted in the middle of the top face of the metal plate, and an electric telescopic rod is fixedly mounted on the side face of the mounting block. After the electromagnet is powered off, the metal plate can be pulled back to the original position by the contraction pulling force of the reset spring, automatic pressing, fixing and loosening of the semiconductor chip can be achieved, the semiconductor chip on the top face of the workbench can be taken down conveniently, and manual operation steps are reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chip processing, in particular to a fixing mechanism for semiconductor chip processing. Background Art

[0002] During the semiconductor chip processing, the chip needs to be fixed on a workbench for processing. However, it is difficult to remove the chip after fixation and processing, and it cannot be automatically adjusted according to the chip size.

[0003] After searching, the application with patent number CN202022869011.7 discloses a fixing mechanism for semiconductor chip processing, including a bottom plate; two grooves are provided on the right side and the lower end of the bottom plate; the tops of the grooves are respectively slidably connected with clamping blocks 1 and 2; the clamping blocks 1 and 2 are provided with moving grooves and clamping ports; the front and left sides of the fixing frame are respectively slidably connected with two groups of sliders, and the tops of the sliders are fixedly connected with a clamping mechanism by bolts; the screw rod is threadedly connected with a fixing block, and the bottom of the fixing block is welded to the groove;

[0004] Although the fixing mechanism for semiconductor chip processing can select a suitable clamping position according to the chip structure and freely adjust the size of the fixing mechanism according to the chip size, the chip can be taken out by simply lifting the handle after production is completed. However, after the fixing mechanism for semiconductor chip processing completes chip processing, the handles need to be manually lifted one by one, which increases the operation steps and is more troublesome to use.

[0005] Therefore, we propose a fixing mechanism for semiconductor chip processing. Utility Model Content

[0006] In view of the deficiencies of the prior art, the utility model provides a fixing mechanism for semiconductor chip processing, which solves the problem that the prior device needs to manually lift the handles one by one, which is troublesome to use.

[0007] To achieve the above objectives, the utility model is implemented through the following technical solutions: A fixing mechanism for semiconductor chip processing, comprising a workbench, wherein four supporting columns in opposite positions are fixedly installed at four corners of the top surface of the workbench;

[0008] Four sets of oppositely positioned fixing mechanisms are arranged around the top surface of the workbench, four oppositely positioned and penetrating through slots are opened on the top surface of the workbench, and electromagnets opposite to the through slots are fixedly installed on the top surface of the workbench;

[0009] The fixing mechanism includes a horizontal plate fixedly installed on the side of the support column, one end of a return spring is fixedly connected to the bottom surface of the horizontal plate, the other end of the return spring is fixedly connected to a metal plate, a mounting block is fixedly installed in the middle of the top surface of the metal plate, an electric telescopic rod is fixedly installed on the side of the mounting block, and a clamping block is fixedly installed on the output end of the electric telescopic rod.

[0010] Preferably, one end of a telescopic rod is fixedly mounted on the bottom surface of the horizontal plate, the other end of the telescopic rod is fixedly mounted on the top surface of the metal plate, and the telescopic rod is located in the inner ring of the return spring, wherein when the metal plate is attracted by the electromagnet after power is turned on, or the metal plate is pulled upward by the return spring after the electromagnet is powered off, the telescopic rod can prevent the metal plate from shifting in position when it moves.

[0011] Preferably, the return spring is symmetrically arranged at both ends of the top surface of the metal plate, and the size of the metal plate matches the through slot, wherein the metal plate can pass through the through slot and abut against the top surface of the electromagnet, thereby pressing the clamping block against the edge of the semiconductor chip, thereby avoiding the deviation of the semiconductor chip.

[0012] Preferably, soft rubber is pasted on the bottom surface of the clamping block, and multiple groups of mounting blocks, electric telescopic rods and clamping blocks can be added. By pasting soft rubber on the bottom surface of the clamping block, the clamping block can be prevented from damaging the semiconductor chip. By setting multiple groups of mounting blocks, electric telescopic rods and clamping blocks, the fixing effect of the semiconductor chip on the top surface of the workbench can be improved.

[0013] Preferably, when the electromagnet is energized, the suction force on the metal plate is greater than the elastic force of the return spring, thereby preventing the metal plate from being pulled back by the tension of the return spring, resulting in a loose fixation of the semiconductor chip.

[0014] Preferably, the telescopic length of the electric telescopic rod matches the size of the workbench, wherein, through the extension and retraction of the electric telescopic rod, the pressing block can be located at the edge of semiconductor chips of different sizes and pressed and fixed.

[0015] The utility model provides a fixing mechanism for semiconductor chip processing, which has the following beneficial effects:

[0016] 1. The fixing mechanism for semiconductor chip processing can attract the metal plate downward after the electromagnet is energized, so that the pressing block can be pressed tightly against the edge of the top surface of the semiconductor chip, thereby achieving the effect of fixing the semiconductor chip. After the electromagnet is powered off, the metal plate will be pulled back to its original position by the tensile force of the return spring, thereby achieving the automatic pressing, fixing and loosening of the semiconductor chip, making it easy to remove the semiconductor chip processed on the top surface of the workbench, reducing the manual operation steps, and solving the problem that the existing device needs to manually lift the handles one by one, which is troublesome to use;

[0017] 2. The fixing mechanism for semiconductor chip processing drives the pressing block to move by means of an electric telescopic rod, so that the pressing block can be located at the edge of the top surface of semiconductor chips of different sizes, thereby achieving the purpose of pressing and fixing semiconductor chips of different sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the structure of the utility model;

[0019] Figure 2 It is a side view structural schematic diagram of the utility model;

[0020] Figure 3 This is a schematic diagram of the workbench structure of the utility model;

[0021] Figure 4 This is a schematic diagram of the fixing mechanism structure of the utility model;

[0022] Figure 5 For the utility model Figure 4 Schematic diagram of the structure at point A.

[0023] In the figure: 1. workbench; 2. through slot; 3. electromagnet; 4. support column; 5. fixing mechanism; 51. cross plate; 52. return spring; 53. metal plate; 54. mounting block; 55. electric telescopic rod; 56. clamping block; 57. telescopic rod. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] Embodiment 1:

[0026] like Figure 1-4As shown: it includes a workbench 1, four supporting columns 4 are fixedly installed at four corners of the top surface of the workbench 1, four sets of fixing mechanisms 5 are arranged around the top surface of the workbench 1, four through slots 2 are opened on the top surface of the workbench 1, and an electromagnet 3 is fixedly installed on the top surface of the workbench 1 at a position opposite to the through slot 2. The fixing mechanism 5 includes a horizontal plate 51 fixedly installed on the side of the supporting column 4, one end of a return spring 52 is fixedly connected to the bottom surface of the horizontal plate 51, and the other end of the return spring 52 is fixedly connected to a metal plate 53, and a mounting block 54 is fixedly installed in the middle of the top surface of the metal plate 53. An electric telescopic rod 55 is fixedly installed on the side of the mounting block 54, and a clamping block 56 is fixedly installed on the output end of the electric telescopic rod 55. When the electromagnet 3 is energized, the metal plate 53 can be attracted downward, and the clamping block 56 can be tightly pressed on the edge of the top surface of the semiconductor chip on the top surface of the workbench 1, thereby achieving the effect of fixing the semiconductor chip. When the electromagnet 3 is powered off, the metal plate 53 will be pulled back to its original position by the tensile force of the return spring 52, thereby achieving the automatic clamping, fixing and loosening of the semiconductor chip, making it easy to remove the semiconductor chip processed on the top surface of the workbench 1, reducing the number of manual operation steps;

[0027] Embodiment 2:

[0028] like Figure 4-5 As shown: one end of a telescopic rod 57 is fixedly mounted on the bottom surface of the horizontal plate 51, and the other end of the telescopic rod 57 is fixedly mounted on the top surface of the metal plate 53, and the telescopic rod 57 is located at the inner ring of the reset spring 52, and the reset spring 52 is symmetrically arranged at both ends of the top surface of the metal plate 53, and the size of the metal plate 53 matches the through slot 2. When the metal plate 53 is attracted by the electromagnet 3 after power is turned on, or the metal plate 53 is pulled upward by the reset spring 52 after the electromagnet 3 is powered off, the telescopic rod 57 can prevent the metal plate 53 from shifting when it moves, and the metal plate 53 can pass through the through slot 2 and abut against the top surface of the electromagnet 3, so that 56 presses the edge of the semiconductor chip on the workbench 1, thereby preventing the semiconductor chip from shifting.

[0029] Embodiment 3:

[0030] like Figure 2-5As shown: soft rubber is pasted on the bottom surface of the clamping block 56, and multiple groups of mounting blocks 54, electric telescopic rods 55 and clamping blocks 56 can be added. When the electromagnet 3 is energized, the suction force on the metal plate 53 is greater than the elastic force of the reset spring 52. The telescopic length of the electric telescopic rod 55 matches the size of the workbench 1. By pasting soft rubber on the bottom surface of the clamping block 56, the clamping block 56 can be prevented from damaging the semiconductor chip. By setting multiple groups of mounting blocks 54, electric telescopic rods 55 and clamping blocks 56, the fixing effect of the semiconductor chip on the top surface of the workbench 1 can be improved, and the metal plate 53 can be prevented from being pulled back by the pulling force of the reset spring 52, resulting in the occurrence of loose fixation of the semiconductor chip. By extending and retracting the electric telescopic rod 55, the clamping block 56 can be located at the edge of semiconductor chips of different sizes and pressed and fixed.

[0031] Working principle and use process of the utility model: the fixing mechanism for semiconductor chip processing is used, firstly, the semiconductor chip is placed in the middle of the top surface of the workbench 1, and then the electric telescopic rod 55 is started, and the pressing block 56 is pushed to the edge of the top surface of the semiconductor chip by the electric telescopic rod 55, and then the electromagnet 3 is started, and the metal plate 53 is passed through the through groove 2 and is tightly attached to the top surface of the electromagnet 3 through the attraction between the electromagnet 3 and the metal plate 53. At this time, the pressing block 56 is pressed tightly on the edge of the top surface of the semiconductor chip, and the semiconductor chip is fixed. When the semiconductor chip is processed, the power supply of the electromagnet 3 is disconnected, and the metal plate 53 is pulled upward by the contraction of the reset spring 52, and the pressing block 56 leaves the top surface of the semiconductor chip, and the processed semiconductor chip can be removed.

[0032] The above shows and describes the basic principles and main features of the utility model and the advantages of the utility model. For those skilled in the art, it is obvious that the utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic features of the utility model. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is limited by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims. Any figure mark in the claims should not be regarded as limiting the claims involved.

[0033] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A fixing mechanism for semiconductor chip processing, comprising a workbench (1), wherein four supporting columns (4) are fixedly mounted at four corners of the top surface of the workbench (1) and are located opposite to each other; Features: Four sets of fixing mechanisms (5) are arranged in opposite positions around the top surface of the workbench (1); four through slots (2) are arranged in opposite positions and penetrate the top surface of the workbench (1); and an electromagnet (3) is fixedly installed on the top surface of the workbench (1) in opposite positions to the through slots (2); The fixing mechanism (5) comprises a horizontal plate (51) fixedly mounted on the side of the support column (4); one end of a return spring (52) is fixedly connected to the bottom surface of the horizontal plate (51); the other end of the return spring (52) is fixedly connected to a metal plate (53); a mounting block (54) is fixedly mounted in the middle of the top surface of the metal plate (53); an electric telescopic rod (55) is fixedly mounted on the side of the mounting block (54); and a pressing block (56) is fixedly mounted on the output end of the electric telescopic rod (55).

2. A fixing mechanism for semiconductor chip processing according to claim 1, characterized in that: One end of a telescopic rod (57) is fixedly mounted on the bottom surface of the transverse plate (51), the other end of the telescopic rod (57) is fixedly mounted on the top surface of the metal plate (53), and the telescopic rod (57) is located in the inner circle of the return spring (52).

3. A fixing mechanism for semiconductor chip processing according to claim 1, characterized in that: The return springs (52) are symmetrically arranged at the two ends of the top surface of the metal plate (53), and the size of the metal plate (53) matches the through slot (2).

4. A fixing mechanism for semiconductor chip processing according to claim 1, characterized in that: The bottom surface of the pressing block (56) is pasted with soft rubber, and multiple groups of the mounting block (54), the electric telescopic rod (55) and the pressing block (56) can be added.

5. A fixing mechanism for semiconductor chip processing according to claim 1, characterized in that: When the electromagnet (3) is energized, the suction force exerted on the metal plate (53) is greater than the elastic force of the return spring (52).

6. A fixing mechanism for semiconductor chip processing according to claim 1, characterized in that: The telescopic length of the electric telescopic rod (55) matches the size of the workbench (1).

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