Array substrate, sound production device and display device

Abstract

The utility model belongs to the technical field of display sounding. The utility model discloses an array substrate. The array substrate comprises a first base material layer, a first conductive layer, a supporting layer, a second conductive layer and a second base material layer, the first conductive layer is arranged on at least one side of the first base material layer; the supporting layer is arranged on one side, far away from the first base material layer, of the first conductive layer, comprises a patterned supporting part and is a cured material of a photosensitive resin composition; the second conductive layer is arranged on the side, away from the first conductive layer, of the supporting layer; the second substrate layer is arranged on the side, away from the supporting layer, of the second conductive layer. The utility model discloses a sound production device. The utility model further discloses a display device. The array substrate is high in flatness, high in light transmittance, good in mechanical property and stable in structure.

Description

Technical Field

[0001] The present application belongs to the field of display sound technology, and in particular, relates to an array substrate, a sound device and a display device. Background Art

[0002] The array substrate can realize functions such as display and sound generation by utilizing the voltage difference of the internal conductive layer, and is often used in the fields of liquid crystal display panels, integrated circuits, and sound generation devices.

[0003] With the development trend of miniaturization and high integration, the requirements for array substrates are becoming increasingly stringent. Array substrates need to have fine patterns, and at the same time have properties such as high light transmittance, high surface hardness, high flatness, and low thermal expansion. Especially when the array substrate is used in a directional sound device or a display device, the requirements for the array substrate's light transmittance and flatness are higher.

[0004] However, in the process of implementing the technical solution in the embodiments of the present application, the applicant found that the above technology has at least the following technical problems:

[0005] It is difficult for the array substrate in the prior art to have fine patterns while also having good mechanical properties and transparency. Utility Model Content

[0006] The embodiment of the present application provides an array substrate, which has high light transmittance, good mechanical properties and high reliability.

[0007] An embodiment of the present application provides an array substrate, which includes a first substrate layer, a first conductive layer, a support layer, a second conductive layer, and a second substrate layer; the first conductive layer is arranged on at least one side of the first substrate layer; the support layer is arranged on a side of the first conductive layer away from the first substrate layer, the support layer includes a patterned support portion, and the support portion is a cured product of a photosensitive resin composition; the second conductive layer is arranged on a side of the support layer away from the first conductive layer; and the second substrate layer is arranged on a side of the second conductive layer away from the support layer.

[0008] Furthermore, the height of the support portion is less than or equal to 30 μm.

[0009] Furthermore, a difference between a maximum height and a minimum height of the support portion is less than or equal to 2 μm.

[0010] Furthermore, along the thickness direction of the array substrate, the support part has a first projection on the second substrate layer, the second conductive layer has a second projection on the second substrate layer, and the ratio of the area of ​​the first projection to the area of ​​the second projection is less than or equal to 1%; the support part includes a support column, and the support column includes at least one of a cylindrical support column or a prismatic support column.

[0011] Furthermore, the support column is a cylindrical support column, and the diameter of the cylindrical support column is less than or equal to 100 μm; the ratio of the distance between adjacent support columns to the diameter is (10-35):1.

[0012] Further, the first conductive layer is one of an ITO layer, a SCOT film, an IWO film, an IMO film or an ICO film, and the second conductive layer is one of an ITO layer, a SCOT film, an IWO film, an IMO film or an ICO film.

[0013] Furthermore, the array substrate further comprises an adhesive layer, which is disposed on at least one side of the support layer, and the adhesive layer is a cured product of the photosensitive resin composition.

[0014] Furthermore, the support layer further includes a functional portion, which is filled in a gap between adjacent support portions; and the light transmittance of the support portion is greater than or equal to 90%.

[0015] The present application also provides a sound-generating device, which includes any of the above-mentioned array substrates.

[0016] The present application also provides a display device, which includes any of the above array substrates, wherein the first substrate layer, the second substrate layer, the first conductive layer, and the second conductive layer are all configured as transparent layers.

[0017] The array substrate in the present application is provided with a patterned support portion, which has good supporting capacity, light transmittance and flatness, so that the structure of the array substrate is more stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the cross-sectional structure of an array substrate in one embodiment of the present application;

[0019] Figure 2 is a schematic cross-sectional structure diagram of an array substrate in another embodiment of the present application;

[0020] Figure 3 This is a schematic diagram of the cross-sectional structure of a support portion in one embodiment of the present application;

[0021] Figure 4 This is a schematic diagram of the cross-sectional structure of a support portion in another embodiment of the present application;

[0022] Figure 5 is a schematic cross-sectional structure diagram of an array substrate in another embodiment of the present application;

[0023] Figure 6 is a schematic cross-sectional structure diagram of an array substrate in another embodiment of the present application;

[0024] Figure 7 is a schematic cross-sectional structure diagram of an array substrate in another embodiment of the present application;

[0025] Figure 8 Schematic diagram of the cross-sectional structure of the array substrate in comparative example 1.

[0026] In the figure: an array substrate 100 , a first base material layer 11 , a first conductive layer 12 , a support layer 13 , a support portion 131 , a support column 1311 , a functional portion 132 , a second conductive layer 14 , a second base material layer 15 , and an adhesive layer 16 . DETAILED DESCRIPTION

[0027] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the specific implementation manner of the present application will be clearly and completely described below in conjunction with the drawings in the implementation manner of the present application.

[0028] The present application embodiment provides a Figure 1 An array substrate 100 is shown, and the array substrate 100 includes a first substrate layer 11, a first conductive layer 12, a support layer 13, a second conductive layer 14 and a second substrate layer 15 in sequence. The first substrate layer 11 and the second substrate layer 12 are arranged on the outside of the array substrate 100, and can provide basic mechanical protection to protect the inside of the array substrate 100. When the array substrate 100 is applied to a display device, the first substrate layer 11 and the second substrate layer 12 also have a high light transmittance, can pass light, and make the array substrate 100 have a high transparency. The first conductive layer 12 and the second conductive layer 14 can enable the array substrate 100 to have functions such as sound generation or display. The support layer 13 can separate the first conductive layer 12 from the second conductive layer 14. As shown Figure 2 As shown, the support layer 13 includes a patterned support portion 131, which can be designed into different patterns or shapes and provide support and protection, and the support portion 131 is a cured product of a photosensitive resin composition. The photosensitive resin composition has high light sensitivity, which can improve the dimensional accuracy of the support portion 131 and improve the visual effect of the array substrate 100. The photosensitive resin composition may include 40-60 parts by mass of an alkali-soluble photosensitive acrylate resin and / or an alkali-soluble photosensitive methacrylate resin, 10-20 parts by mass of a photocurable polyurethane methacrylate and / or a photocurable polyurethane methacrylate, 15-25 parts by mass of a multifunctional epoxy resin, 15-30 parts by mass of a photoreactive acrylate monomer and / or a photoreactive methacrylate monomer, and 1-10 parts by mass of a photopolymerization initiator.

[0029] The alkali-soluble photosensitive acrylate resin and the alkali-soluble photosensitive methacrylate resin are not particularly limited, and may be, for example, a polyacid-modified acrylic epoxy resin or a polyacid-modified methacrylic epoxy resin, which is obtained by reacting a free radical polymerizable unsaturated monocarboxylic acid such as acrylic acid or methacrylic acid with at least a portion of the epoxy groups of a multifunctional epoxy resin having two or more epoxy groups in the molecule, and then reacting the product with a polyacid or its anhydride.

[0030] The photocurable polyurethane acrylate and the photocurable polyurethane methacrylate can be at least one of the commercially available "Ziguang UV-7510B", "UV-7605B", "EBECRYL210", "UXE-3000", "Z-250", "Z-254", "EBECRYL220", "EBECRYL284", "EBECRYL8210", "EBECRYL8402" or "M-313".

[0031] The multifunctional epoxy resin refers to an epoxy resin having two or more functions. The epoxy equivalent is not particularly limited, but a multifunctional epoxy resin having an epoxy equivalent of 100 to 500 g / mol is preferred. The multifunctional epoxy resin may include biphenyl epoxy resin, naphthalene epoxy resin, dicyclopentadiene epoxy resin, rubber modified epoxy resin such as silicone modified epoxy resin, ε-caprolactone modified epoxy resin, bisphenol A type, bisphenol F type, bisphenol AD ​​type and other novolac epoxy resins, ortho-cresol novolac type and other cresol novolac type epoxy resins, cyclic aliphatic multifunctional epoxy resins, glycidyl ester type multifunctional epoxy resins, glycidyl amine type multifunctional epoxy resins, heterocyclic multifunctional epoxy resins, bisphenol modified novolac type epoxy resins, multifunctional modified novolac type epoxy resins or condensation type epoxy resins of phenols and aromatic aldehydes having phenolic hydroxyl groups, etc. The above epoxy resins may be used alone or in combination of two or more.

[0032] The photoreactive acrylate monomers and photoreactive methacrylate monomers may include, but are not limited to, 1,4-butanediol diacrylate, 1,4-butanediol dimethacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, neopentyl glycol diacrylate, neopentyl glycol dimethacrylate, polyethylene glycol diacrylate, polyethylene glycol dimethacrylate, neopentyl glycol adipic acid diacrylate, neopentyl glycol adipic acid dimethacrylate, hydroxyglutarate neopentyl glycol diacrylate, hydroxyglutarate neopentyl glycol dimethacrylate, dicyclopentadienyl diacrylate, dicyclopentadienyl dimethacrylate, caprolactone-modified dicyclopentadienyl diacrylate, caprolactone-modified dicyclopentadienyl dimethacrylate, ethylene oxide-modified phosphoric acid diacrylate, ethylene oxide-modified phosphoric acid dimethacrylate, allylated cyclohexyl diacrylate, Acrylate, allylated cyclohexyl dimethacrylate, isocyanurate diacrylate, isocyanurate dimethacrylate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, dipentaerythritol triacrylate, dipentaerythritol trimethacrylate, propionic acid-modified dipentaerythritol triacrylate, propionic acid-modified dipentaerythritol trimethacrylate, pentaerythritol triacrylate, pentaerythritol trimethacrylate, propylene oxide-modified trimethylolpropane triacrylate, propylene oxide-modified trimethylolpropane trimethacrylate, tri(acryloyloxyethyl) isocyanurate, propionic acid-modified dipentaerythritol pentaacrylate, propionic acid-modified dipentaerythritol pentamethacrylate, dipentaerythritol hexaacrylate, dipentaerythritol hexamethacrylate, caprolactone-modified dipentaerythritol hexaacrylate or caprolactone-modified dipentaerythritol hexamethacrylate, etc. The above compounds may be used alone or in combination of two or more.

[0033] The photopolymerization initiator used in the photosensitive resin composition of the present invention is not particularly limited, and a photoinitiator that can initiate a free radical polymerization reaction after absorbing light energy can be used. The photoinitiator may include, but is not limited to, benzoin and its alkyl ether photoinitiators, α-hydroxyketone photoinitiators, acetophenone photoinitiators, aminoacetophenone photoinitiators, anthraquinone photoinitiators, thioxanthone and xanthone photoinitiators, ketal photoinitiators, triphenylphosphine photoinitiators, phosphine oxides, 1-aminophenylketone photoinitiators, 1-hydroxyphenylketone photoinitiators, or at least one of various peroxides and combinations thereof.

[0034] As an optional implementation, Figure 2As shown, the support portion 131 includes a support column 1311. The support portion 131 can be formed into a specific pattern by a plurality of support columns 1311. The support column 1311 can support the first conductive layer 12 and the second conductive layer 14 while occupying a small space, so that the array substrate 100 can ensure visual transparency and have good reliability. The support column 1311 can be designed into different shapes according to requirements. The support column 1311 can include a cylindrical support column 1311 (such as Figure 3 ) or prismatic support column 1311 (as shown Figure 4 The support column 1311 may have various shapes, and the bottom area of ​​the support column 1311 should be small. When used in a display device, the small bottom area of ​​the support column 1311 can make it visually close to "invisible", so that the array substrate 100 has high visual transparency and uniformity, and improves the user experience. Or, when used in a sound-emitting device, the small bottom area of ​​the support column 1311 avoids obstruction to the vibration of the first conductive layer 12, the second conductive layer 14, or the air filled in the support portion 131, and ensures that the basic function of the sound-emitting device is not affected. The bottom area of ​​the support column 1311 should not be too small, and the support column 1311 should have sufficient mechanical properties and weather resistance to support and separate the first conductive layer 12 and the second conductive layer 14, ensure the consistency of the thickness of the array substrate 100, and prevent collapse. The support column 1311 in the present application can be implemented using patterning technology in the prior art, such as forming the support column 1311 by etching a photosensitive film. If the bottom area of ​​the support column 1311 is too small, the precision requirements of the preparation process of the support column 1311 will become higher, and the preparation cost will also become higher, causing great difficulties in production.

[0035] As an optional embodiment, along the thickness direction of the array substrate 100, the support portion 131 has a first projection on the second substrate layer 15, the second conductive layer 14 has a second projection on the second substrate layer 15, and the ratio of the area of ​​the first projection to the area of ​​the second projection is less than or equal to 1%. When the array substrate 100 is used for a display device, by reducing the area proportion of the support portion 131, the support layer 13 can have enough space to fill the liquid crystal, improve the visual transparency and uniformity, and improve the display effect of the array substrate. When the array substrate 100 is used for a sound-generating device, the small proportion of the support portion 131 in the sound-generating device can provide sufficient vibration sound space, avoid obstruction to the vibration of the first conductive layer 12, the second conductive layer 14 or the air filled in the support portion 1311, and ensure that the basic function of the sound-generating device is not affected.

[0036] As an optional embodiment, the support column 1311 is a cylindrical support column. Compared with the prismatic support column, the cylindrical support column has no edges and corners, is more difficult to observe visually, and has a better visual effect. The preparation of the cylindrical support column is more convenient. There is no need to consider the direction problem when preparing and installing the cylindrical support column, which is more convenient. The diameter of the cylindrical support column is less than or equal to 100μm. When the array substrate 100 is used for a display device, the diameter of the cylindrical support column is less than or equal to 100μm, which can make the support column 1311 have a better visual effect and improve the transparency of the array substrate 100. When the array substrate 100 is used for a sound-generating device, the diameter of the cylindrical support column is less than or equal to 100μm, which can reduce the obstruction of the support column 1311 to the air vibration, ensuring that the basic function of the sound-generating device is not affected. Preferably, the diameter of the cylindrical support column is less than or equal to 35μm, and within this radius range, the transparency of the array substrate 100 is higher.

[0037] As an optional embodiment, the ratio of the distance between adjacent support columns 1311 to the diameter is (10-35):1. If the distance between adjacent support columns 1311 is too large, the mechanical properties of the support portion 131 will decrease, which is not conducive to support and affects the thickness consistency and reliability of the array substrate 100. If the distance between adjacent support columns 1311 is too small, the support columns 1311 will be arranged more densely. Although the increase in the density of the support columns 1311 will improve the mechanical properties of the support portion 131, it will reduce the transparency of the array substrate 100, affect the appearance, or hinder vibration and sound. The ratio of the distance between adjacent support columns 1311 to the diameter is (10-35):1, which can take into account transparency, visual uniformity, sound effect and reliability. The uniformly arranged support columns 1311 can make the force on the first conductive layer 12 and the second conductive layer 14 more uniform, making the structure of the array substrate 100 more stable.

[0038] As an optional implementation, the support columns 1311 can be arranged in different ways according to requirements. Preferably, the support columns 1311 are arranged in a dot matrix. The dot matrix arrangement can enable the support portion 131 to maintain good mechanical properties and improve the transparency of the support layer 13.

[0039] As an optional embodiment, the height of the support portion 131 is less than or equal to 30 μm. The support portion 131 should not be too high. On the one hand, an increase in the height of the support portion 131 will make the array substrate 100 thicker as a whole. On the other hand, an increase in the height of the support portion 131 will reduce the transparency of the support portion 131, thereby affecting the display effect of the array substrate 100. The height of the support portion 131 is less than or equal to 30 μm, which can make the array substrate 100 more reliable and thinner.

[0040] As an optional implementation, the difference between the maximum height and the minimum height of the support portion 131 is less than or equal to 2 μm. The support portion 131 is composed of a plurality of support columns 1311, and the heights of different support columns 1311 should be uniform. If the difference between the maximum height and the minimum height of the support portion 131 is less than or equal to 2 μm, the height of the support portion 131 is more uniform. The more uniform the height of the support portion 131, the more uniform the force provided during support, the flatter the array substrate 100, and the better the mechanical and optical properties of the array substrate 100.

[0041] As an optional embodiment, the first conductive layer 12 may include at least one of an ITO layer (indium tin oxide film), a SCOT layer (indium zirconium titanium gallium oxide film), an IWO layer (indium tungsten oxide film), an IMO layer (indium molybdenum oxide film) or an ICO layer (indium cerium oxide film). The second conductive layer 14 may include at least one of an ITO layer, a SCOT layer, an IWO layer, an IMO layer or an ICO layer. These thin films have high transparency and low resistivity, so that the first conductive layer 12 and the second conductive layer 14 can conduct electricity and have high light transmittance.

[0042] As an optional embodiment, the support layer 13 also includes a functional portion 132, which is filled in the gap between adjacent support portions 131. When applied to the field of display technology, the functional portion 132 may include liquid crystal. If the support portion 131 between the first conductive layer 12 and the second conductive layer 14 is directly filled with liquid crystal, the thickness of the liquid crystal will be uneven. When the size is small. The unevenness of the liquid crystal thickness is small and can be ignored, but as the size of the display device increases, the size of the array substrate 100 also increases, and the uneven thickness of the liquid crystal becomes more prominent, greatly affecting the display effect. By using the support portion 131 with good thickness uniformity as a support, the gap between adjacent support portions 131 is filled with liquid crystal, so that the thickness of the support layer 13 is more uniform, so that the array substrate 100 has a better display effect. The light transmittance of the support layer 13 is greater than or equal to 90%, and the light transmittance is high, which can ensure that the array substrate 100 has a high transparency as a whole. The performance of the array substrate 100 can be improved by filling the gap between adjacent support portions 131 with functional materials.

[0043] As an optional implementation, Figure 6As shown, the array substrate 100 also includes an adhesive layer 16, which is disposed on at least one side of the support layer 13, and the adhesive layer 16 is a cured product of a photosensitive resin composition. As the size of the bottom surface of the support column 1311 decreases, the bonding force between the support column 1311 and the first conductive layer 12 or the second conductive layer 14 decreases. In order to improve the structural strength of the array substrate 100, an adhesive layer 16 may be provided between the support layer 13 and the first conductive layer 12 or between the support layer 13 and the second conductive layer 14. The adhesive layer 16 may be made of a photosensitive resin composition that is the same as or similar to that of the support portion 131. The adhesive layer 16 and the support portion 131 are made of the same or similar materials, which can improve the bonding strength between the adhesive layer 16 and the support portion 131, and can improve the structural stability of the array substrate 100. As shown in FIG. Figure 7 As shown, adhesive layers 16 may also be provided on both sides of the support layer 13 to further improve the structural stability of the array substrate 100. Specifically, the adhesive layer 16 may be made of the same or similar material as the support layer 13 to enhance the bonding strength between the adhesive layer 16 and the support layer 13, thereby enhancing the connection strength between the support layer 13 and the first conductive layer 12 or the second conductive layer 14.

[0044] An embodiment of the present application provides a sound-generating device, which includes any one of the above-mentioned array substrates 100 .

[0045] The embodiment of the present application provides a display device, which includes any of the above array substrates 100. The first substrate layer 11, the second substrate layer 15, the first conductive layer 12, and the second conductive layer 14 are all set as transparent layers to improve the transparency of the array substrate 100. The above array substrate 100 has good mechanical properties, high transparency, and good display effect.

[0046] In order to improve the visual effect and experience effect of the sound-emitting device, the array substrate 100 may be partially or completely transparent. In particular, when the sound-emitting device is used in combination with a display device, the display effect of the array substrate 100 is required to be higher. The support layer 13 in the above array substrate 100 has a controllable pattern and good light transmission effect, and the array substrate 100 has good mechanical properties and weather resistance, high reliability, and meets the use requirements of the directional sound-emitting device and the display device.

[0047] The present application is further described below in conjunction with embodiments, but the protection scope of the present application is not limited to the embodiments.

[0048] Example 1

[0049] like Figure 1As shown, an array substrate 100 includes a first substrate layer 11, a first conductive layer 12, a support layer 13, a second conductive layer 14 and a second substrate layer 15. The support layer 13 includes a support portion 131, and the support portion 131 includes cylindrical support columns 1311 arranged in a dot matrix.

[0050] Specifically, the first conductive layer 12 is an ITO layer. The second conductive layer 14 is an ITO layer. The height of the support portion 131 is 25 μm, the diameter of the support column 1311 is 35 μm, the distance between adjacent support columns 1311 is 350 μm, and along the thickness direction of the array substrate 100, the support portion 131 has a first projection on the second substrate layer 15, and the second conductive layer 14 has a second projection on the second substrate layer 15, and the ratio of the area of ​​the first projection to the area of ​​the second projection is 0.8%.

[0051] The supporting part is a cured product of a photosensitive resin composition, and the formula of the photosensitive resin composition is: 40 parts by mass of alkali-soluble photosensitive acrylate resin and alkali-soluble photosensitive methacrylate resin, 15 parts by mass of photocurable polyurethane acrylate and photocurable polyurethane methacrylate, 20 parts by mass of a multifunctional epoxy resin, 23 parts by mass of photoreactive acrylate monomers and photoreactive methacrylate monomers, and 2 parts by mass of a photopolymerization initiator.

[0052] Example 2

[0053] Except for the following technical features, the rest is the same as Example 1.

[0054] The diameter of the support column 1311 was adjusted to 100 μm.

[0055] Example 3

[0056] Except for the following technical features, the rest is the same as Example 1.

[0057] like Figure 6 As shown, a bonding layer 16 is further provided between the support layer 13 and the first conductive layer 12, and the diameter of the support column 1311 is adjusted to 25 μm.

[0058] Example 4

[0059] Except for the following technical features, the rest is the same as Example 1.

[0060] The height of the support portion 131 was adjusted to 30 μm.

[0061] Example 5

[0062] Except for the following technical features, the rest is the same as Example 1.

[0063] The distance between adjacent support pillars 1311 is adjusted to 1200 μm.

[0064] Example 6

[0065] Except for the following technical features, the rest is the same as Example 1.

[0066] The distance between adjacent support pillars 1311 is adjusted to 300 μm.

[0067] Example 7

[0068] like Figure 5 As shown, an array substrate 100 includes a first substrate layer 11, a first conductive layer 12, a support layer 13, a second conductive layer 14 and a second substrate layer 15. The support layer 13 includes a support portion 131 and a functional portion 132, and the support portion 131 includes cylindrical support columns 1311 arranged in a dot matrix.

[0069] Specifically, the first conductive layer 12 is an ITO layer. The second conductive layer 14 is an ITO layer. The height of the support portion 131 is 25 μm, the diameter of the support column 1311 is 35 μm, the distance between adjacent support columns 1311 is 1000 μm, along the thickness direction of the array substrate 100, the support portion 131 has a first projection on the second substrate layer 15, the second conductive layer 14 has a second projection on the second substrate layer 15, the ratio of the area of ​​the first projection to the area of ​​the second projection is 0.1%, and the functional portion 132 is a liquid crystal.

[0070] Example 8

[0071] Except for the following technical features, the rest is the same as Example 1.

[0072] The shape of the support column 1311 is adjusted to a cube, and the diagonal length of the bottom square is 35 μm.

[0073] Example 9

[0074] Except for the following technical features, the rest is the same as Example 1.

[0075] The shape of the support column 1311 is adjusted to a regular hexagonal prism, and the diagonal length of the bottom hexagon is 35 μm.

[0076] Example 10

[0077] Except for the following technical features, the rest is the same as Example 1.

[0078] The formula of the photosensitive resin composition is: 50 parts by weight of alkali-soluble photosensitive acrylate resin and alkali-soluble photosensitive methacrylate resin, 10 parts by weight of photocurable polyurethane acrylate and photocurable polyurethane methacrylate, 20 parts by weight of multifunctional epoxy resin, 15 parts by weight of photoreactive acrylate monomers and photoreactive methacrylate monomers, and 5 parts by weight of photopolymerization initiator.

[0079] Embodiment 11

[0080] Except for the following technical features, the rest is the same as Example 1.

[0081] The formula of the photosensitive resin composition is: 40 parts by mass of alkali-soluble photosensitive acrylate resin and alkali-soluble photosensitive methacrylate resin, 10 parts by mass of photocurable polyurethane acrylate and photocurable polyurethane methacrylate, 15 parts by mass of multifunctional epoxy resin, 30 parts by mass of photoreactive acrylate monomers and photoreactive methacrylate monomers, and 5 parts by mass of photopolymerization initiator.

[0082] Example 12

[0083] Except for the following technical features, the rest is the same as Example 1.

[0084] The ratio of the area of ​​the first projection to the area of ​​the second projection is 1%.

[0085] Example 13

[0086] Except for the following technical features, the rest is the same as Example 1.

[0087] The ratio of the area of ​​the first projection to the area of ​​the second projection is 0.5%.

[0088] Embodiment 14

[0089] Except for the following technical features, everything else is the same as Example 7.

[0090] The ratio of the area of ​​the first projection to the area of ​​the second projection is 0.05%.

[0091] Embodiment 15

[0092] Except for the following technical features, the rest is the same as Example 1.

[0093] The ratio of the area of ​​the first projection to the area of ​​the second projection is 2%.

[0094] Example 16

[0095] Except for the following technical features, the rest is the same as Example 1.

[0096] The height of the support portion 131 is 20 μm.

[0097] Embodiment 17

[0098] Except for the following technical features, the rest is the same as Example 1.

[0099] The height of the support portion 131 is 10 μm.

[0100] Embodiment 18

[0101] Except for the following technical features, the rest is the same as Example 1.

[0102] The height of the support portion 131 is 8 μm.

[0103] Embodiment 19

[0104] Except for the following technical features, the rest is the same as Example 1.

[0105] The height of the support portion 131 is 40 μm.

[0106] Embodiment 20

[0107] Except for the following technical features, the rest is the same as Example 1.

[0108] The diameter of the support column 1311 is 70 μm.

[0109] Embodiment 21

[0110] Except for the following technical features, the rest is the same as Example 1.

[0111] The diameter of the support column 1311 is 50 μm.

[0112] Embodiment 22

[0113] Except for the following technical features, the rest is the same as Example 1.

[0114] The diameter of the support column 1311 is 15 μm.

[0115] Embodiment 23

[0116] Except for the following technical features, the rest is the same as Example 1.

[0117] The diameter of the support column 1311 is 150 μm.

[0118] Embodiment 24

[0119] Except for the following technical features, the rest is the same as Example 1.

[0120] The diameter of the support column 1311 is 25 μm.

[0121] Comparative Example 1

[0122] like Figure 8 As shown, an array substrate 100 includes a first base material layer 11 , a first conductive layer 12 , a functional portion 132 , a second conductive layer 14 and a second base material layer 15 in sequence.

[0123] Specifically, the first conductive layer 12 is an ITO layer. The second conductive layer 14 is an ITO layer. The height of the functional part 132 is 25 μm, and the functional part is liquid crystal.

[0124] Comparative Example 2

[0125] The sound is produced by a conventional vibrator (vibration sound) and a paper eardrum speaker.

[0126] Comparative Example 3

[0127] Except for the following technical features, the rest is the same as Example 1.

[0128] The support part is a cured product of a conventional non-photosensitive resin composition, and the formula of the non-photosensitive resin composition is: 40 parts by mass of acrylate resin, 15 parts by mass of polyurethane acrylate, 20 parts by mass of multifunctional epoxy resin, and 5 parts by mass of diluent acrylate monomer. The support part 1311 is obtained by screen printing and thermal curing.

[0129] 1. Performance test:

[0130] The array substrates in the above embodiments and comparative examples were subjected to performance tests. An area of ​​10 cm*10 cm was randomly selected on the array substrate, and 20 points were randomly selected within the area of ​​10 cm*10 cm for testing.

[0131] Light transmittance: A haze meter (CS-700) from Hangzhou Caipu Technology Co., Ltd. was used to record the average light transmittance at 20 points.

[0132] Flatness: Use the shape measurement laser microscope system (VK-X3000) produced by Keyence Corporation to calculate the difference between the highest point and the lowest point, and record the flatness grade (A: height difference <1.5, B: 1.5≤height difference <2, C: 2≤height difference <2.5).

[0133] Adhesion: 100 grid method, use 3M tape for tensile test and record the number of grids that fall off; 100 / 100 means the support column is completely retained.

[0134] 2. Performance test results:

[0135] The performance test results of the array substrate 100 in the above embodiments and comparative examples are shown in Table 1.

[0136] Table 1: Test results

[0137]

[0138] Among them, in comparative example 1, no supporting part is provided, the liquid crystal will have uneven thickness and collapse, and the interlayer spacing between the two conductive layers will be inconsistent; comparative example 2 cannot be made into a transparent sound-generating device and cannot be applied to a directional generating device; comparative example 3 cannot provide an accurate lattice structure, and the shape, size and spacing of the support columns cannot be accurately controlled and the uniformity cannot be guaranteed.

[0139] From the comparison between comparative example 1 and embodiment 7, it can be seen that in comparative example 1, there is no support part, the liquid crystal will have uneven thickness and collapse, resulting in extremely poor flatness of the functional part and inconsistent interlayer spacing between the two conductive layers; while in embodiment 7, a support part is provided, and the flatness of the array substrate is good after filling the liquid crystal. Compared with embodiments 1 to 6, comparative example 2 cannot be made into a transparent sound-generating device and cannot be applied to a directional generating device; while embodiments 1 to 6 have a higher transmittance and better transmittance uniformity. In comparative example 3 and embodiment 1, the cured product of the photosensitive material or the cured product of the photosensitive resin composition is not used, and the dot structure, shape and size in the array substrate are difficult to control, resulting in a low flatness of the array substrate and uneven light transmission performance; embodiment 1 uses a cured product of the photosensitive resin composition, and the array substrate has a higher flatness and better stability. As can be seen from the table, the array substrates in embodiments 1 to 24 have high transmittance, small transmittance differences at different positions, high flatness and good adhesion of the support layer, taking into account good transparency, visual uniformity, sound effect and reliability.

[0140] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to this application.

Claims

1. An array substrate, characterized in that: include: a first substrate layer; a first conductive layer, the first conductive layer being disposed on at least one side of the first substrate layer; A support layer, the support layer is disposed on a side of the first conductive layer away from the first substrate layer, the support layer comprises a patterned support portion, and the support portion is a cured product of a photosensitive resin composition; a second conductive layer, the second conductive layer being disposed on a side of the support layer away from the first conductive layer; The second substrate layer is disposed on a side of the second conductive layer away from the support layer.

2. The array substrate according to claim 1, characterized in that: The height of the support portion is less than or equal to 30 μm.

3. The array substrate according to claim 1, characterized in that: The difference between the maximum height and the minimum height of the support portion is less than or equal to 2 μm.

4. The array substrate according to claim 1, characterized in that: Along the thickness direction of the array substrate, the support portion has a first projection on the second substrate layer, the second conductive layer has a second projection on the second substrate layer, and the ratio of the area of ​​the first projection to the area of ​​the second projection is less than or equal to 1%; The support portion includes a support column, and the support column includes at least one of a cylindrical support column and a prismatic support column.

5. The array substrate according to claim 4, characterized in that: The support column is a cylindrical support column, and the diameter of the cylindrical support column is less than or equal to 100 μm; the ratio of the distance between adjacent support columns to the diameter is (10-35):

1.

6. The array substrate according to claim 1, characterized in that: The first conductive layer is one of an ITO layer, a SCOT film, an IWO film, an IMO film or an ICO film, and the second conductive layer is one of an ITO layer, a SCOT film, an IWO film, an IMO film or an ICO film.

7. The array substrate according to claim 1, characterized in that: The array substrate further includes an adhesive layer, which is disposed on at least one side of the support layer and is a cured product of a photosensitive resin composition.

8. The array substrate according to claim 1, characterized in that: The support layer further comprises a functional portion, wherein the functional portion is filled in a gap between adjacent support portions; The light transmittance of the support portion is greater than or equal to 90%.

9. A sound-generating device, characterized in that: The sound-generating device comprises the array substrate according to any one of claims 1 to 7.

10. A display device, characterized in that: The display device comprises the array substrate according to any one of claims 1 to 8, and the first base material layer, the second base material layer, the first conductive layer and the second conductive layer are all configured as transparent layers.

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