Bearing table for bearing chip
By introducing positioning modules and adjustment modules on the chip test bearing table, the locking block and shaft mechanisms are used to achieve stable positioning and fixing of the chip, the problems of chip damage and unstable positioning under traditional vacuum adsorption methods are solved, and the problem of chip damage and unstable positioning is improved Test accuracy and efficiency.
Patent Information
- Application Number
- CN202420700562.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-07
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2034-04-07
AI Technical Summary
The traditional chip test carrier has problems of damage to fragile or ultra-thin chips through vacuum adsorption, which affects the testing accuracy and working efficiency.
A carrier table including positioning module and adjustment module is designed to achieve limiting and fixing of the chip through positioning blocks and pressure jaws. The adjustment module realizes adjustment of the pressure jaws through locking the pressure jaws, rotating shafts and spring mechanisms to ensure that The chip is stable in the test process.
Improves the positioning and fixing accuracy of the chip, reduces the risk of chip damage, improves processing efficiency, and reduces equipment costs and maintenance complexity.
Smart Images
Figure CN222190696U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip loading, in particular to a carrier platform for loading chips. Background Art
[0002] A chip is an integrated circuit or microcircuit, microchip, or wafer. In electronics, it is a way to miniaturize circuits and is often manufactured on the surface of semiconductor wafers. In engineering testing operations, it is usually necessary to place the chip on a carrier. Traditional chip test carriers mainly use vacuum adsorption to adsorb chip wafers to the surface of the carrier to achieve chip positioning testing. Since the surface of some specific chips is uneven and cannot be vacuum adsorbed, if the vacuum fails or the operation is improper, the wafer may be damaged. For extremely fragile or ultra-thin wafers, vacuum adsorption can easily cause the chip to fall off, be damaged, or be unable to be positioned, thereby affecting the test accuracy and reducing work efficiency. Utility Model Content
[0003] Based on this, it is necessary to provide a carrier for carrying chips, so as to position the chips during the testing process and improve the efficiency of processing the chips.
[0004] A carrier for carrying a chip, comprising:
[0005] A carrying platform, wherein the carrying platform is provided with a chip placement position and a slide rail;
[0006] A positioning module, the positioning module comprising a positioning block and a pressing claw, the positioning block is arranged on the peripheral side of the chip placement position, and the positioning block is used to limit the chip in the chip placement position;
[0007] An adjustment module, the adjustment module includes a locking pressure block, a support and a rotating shaft, the locking pressure block is arranged on the slide rail and can slide along the slide rail, the support is arranged on the supporting platform, the rotating shaft can be rotatably arranged on the support, the rotating shaft is located on the side of the chip placement position, the pressure claw is arranged on the rotating shaft, the pressure claw can rotate with the rotating shaft to resist or move away from the chip in the chip position, and the locking pressure block locks or releases the rotation of the rotating shaft by sliding.
[0008] In the carrier platform for carrying chips provided in the present application, it includes a carrier platform, a positioning module and an adjustment module. The carrier platform is provided with a chip placement position, which can place the chip. The positioning module includes a positioning block and a pressure claw. The positioning block is arranged on the peripheral side of the chip placement position. The positioning block can limit the chip in the chip placement position. The adjustment module includes a locking pressure block, a support and a rotating shaft. The locking pressure block is arranged on the slide rail of the carrier platform and can slide along the slide rail. The support is arranged on the carrier platform. The rotating shaft can be rotatably arranged on the support. The rotating shaft is located on the side of the chip placement position. The pressure claw is arranged on the rotating shaft. The pressure claw can rotate with the rotating shaft to resist or move away from the chip in the chip position. The locking pressure block can lock or release the rotation of the rotating shaft by sliding. By adjusting the locking pressure block, the rotating shaft can be rotated, and then the pressure claw is driven to resist or move away from the chip, so that the chip can be positioned and fixed during the test process, thereby improving the efficiency of processing the chip.
[0009] In one embodiment, the adjusting module comprises a crank, and the crank is arranged at the end of the rotating shaft.
[0010] In one embodiment, a spring is provided between the crank and the carrier platform, and the spring provides elastic force to pull the crank and drive the rotating shaft to rotate, so as to move the pressing claw away from the chip in the chip position.
[0011] In one embodiment, an eccentric shaft is provided on the side of the crank facing away from the rotating shaft, and the axis of the eccentric shaft is parallel to but not colinear with the axis of the rotating shaft; the locking pressure block forms a baffle and a notch along the sliding direction, and the baffle forms an inclined surface on the side facing the notch; the locking pressure block slides along the slide rail to achieve switching from loosening the rotating shaft to locking the rotating shaft, so that the eccentric shaft presses against the inclined surface from the notch and is finally pressed under the baffle.
[0012] In one embodiment, the adjustment module includes two rotating shafts, which are located on opposite sides of the chip placement position, and each rotating shaft is respectively matched with the support, the crank, the spring and the eccentric shaft, and the locking pressure block includes two groups of baffles and notches, and each eccentric shaft corresponds to a group of baffles and notches.
[0013] In one embodiment, the slide rail extends along a length direction perpendicular to the rotating shaft.
[0014] In one embodiment, the rotating shaft is located on the long side of the chip placement position.
[0015] In one embodiment, each of the rotating shafts is provided with at least two pressing claws spaced apart along the length direction.
[0016] In one embodiment, the pressure jaw is provided with an open circular hole, the rotating shaft passes through the open circular hole, and the pressure jaw is provided with a fastener to adjust the size of the open circular hole.
[0017] In one embodiment, the carrier platform is provided with a receiving groove, and the chip placement position is located in the receiving groove. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] The present invention is further described below with reference to the accompanying drawings and embodiments, wherein:
[0019] Figure 1 A schematic diagram of a carrier for carrying a chip provided in an embodiment of the present application;
[0020] Figure 2 An exploded view of a carrier for carrying a chip provided in one embodiment of the present application;
[0021] Figure 3 A schematic diagram of a locking pressure block of a carrier platform for carrying a chip provided in one embodiment of the present application.
[0022] A carrier 10 for carrying a chip; a chip 100; a carrier 20; a receiving groove 201; a slide rail 21; a positioning module 30; a positioning block 31; a pressure claw 32; an open circular hole 320; an adjustment module 40; a locking pressure block 41; a baffle 410; a notch 412; a slope 413; a support 42; a rotating shaft 43; a crank 45; a spring 46; an eccentric shaft 47; a chip placement position K1 DETAILED DESCRIPTION
[0023] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.
[0024] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0025] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. The terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral whole; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to the specific circumstances.
[0026] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.
[0027] The chip 100 is an integrated circuit or microcircuit, microchip, wafer. In electronics, it is a way to miniaturize a circuit, mainly including semiconductor devices, but also passive components, and is often manufactured on the surface of a semiconductor wafer. The complete process of making the chip 100 includes several links such as chip 100 design, wafer production, packaging production, and testing. In chip testing, it is often necessary to fix the chip 100 on the carrier 20 to achieve positioning and clamping of the chip 100 to test the chip 100. The existing chip test carrier mainly adsorbs the chip wafer on the surface of the carrier by vacuum adsorption or fixes the wafer on the carrier 20 by using an electrostatic suction cup to achieve positioning testing of the chip 100. The wafer vacuum suction cup is usually composed of a hard surface with many small holes or channels on the surface. Through these small holes, the suction cup can be connected to a vacuum pump to produce a vacuum effect. When the wafer is placed on the suction cup, the vacuum pump is turned on to extract air through the small holes, thereby generating a vacuum between the wafer and the suction cup. This vacuum effect generates suction, firmly adsorbing the wafer to the surface of the suction cup. Because the surface of some specific chip 100 products is uneven, vacuum adsorption is not possible or the adsorption is unstable. If the vacuum fails or the operation is improper, the wafer may be damaged. For extremely fragile or ultra-thin wafers, vacuum adsorption can easily cause the chip 100 to fall off, be damaged, or be unable to be positioned. The electrostatic chuck generates adsorption force by creating an electric field between the wafer and the machine. The electrostatic chuck is usually composed of an electrode and an insulating layer, and the adsorption force is activated by applying voltage. The equipment cost of the electrostatic chuck is relatively high. It is only suitable for wafers of specific sizes and types, and requires regular inspection and maintenance. It has low adaptability and high cost, which is not conducive to adapting to non-specific wafers, thereby affecting the test accuracy and reducing work efficiency.
[0028] See also Figure 1 and Figure 2 In order to solve the above problems, the embodiment of the present application provides a carrier 10 for carrying a chip, including a carrier 20, a positioning module 30 and an adjustment module 40. The carrier 20 is provided with a chip placement position K1, and the carrier 20 is provided with a slide rail 21; the positioning module 30 includes a positioning block 31 and a pressing claw 32, the positioning block 31 is arranged on the peripheral side of the chip placement position K1, and the positioning block 31 is used to limit the chip 100 in the chip placement position K1; the adjustment module 40 includes a locking The locking pressure block 41, the support 42 and the rotating shaft 43, the locking pressure block 41 is arranged on the slide rail 21 and can slide along the slide rail 21, the support 42 is arranged on the carrier 20, the rotating shaft 43 can be rotatably arranged on the support 42, the rotating shaft 43 is located on the side of the chip placement position K1, the pressure claw 32 is arranged on the rotating shaft 43, the pressure claw 32 can rotate with the rotating shaft 43 to resist or move away from the chip 100 in the chip position, and the locking pressure block 41 locks or releases the rotation of the rotating shaft 43 by sliding.
[0029] In the carrier 10 for carrying chips, the chip 100 can be set on the chip placement position K1 on the carrier 20, and the positioning module 30 includes a positioning block 31 and a pressure claw 32. The positioning module 30 is used to position the chip 100. The positioning block 31 is set on the peripheral side of the chip placement position K1. The positioning block 31 is set on the peripheral side of the chip placement position K1, which can realize the positioning and fixing of the peripheral side of the chip 100 placed on the chip placement position K1. In some embodiments, the positioning block 31 can be set as the long side positioning block 31 of the chip 100 to realize the positioning of the long side direction of the chip 100. In some embodiments, the positioning block 31 can also be set as the short side positioning block 31 of the chip 100 to realize the positioning of the short side direction of the chip 100, thereby realizing the position limitation of different directions of the chip 100. The pressure claw 32 can clamp or release the chip 100 by pressing against or away from the chip 100. In some embodiments, the adjustment module 40 includes a locking pressure block 41, a support 42, and a rotating shaft 43. The locking pressure block 41 is disposed on the slide rail 21 and can slide along the slide rail 21. The locking pressure block 41 slides on the slide rail 21 to realize the opening and closing of the locking pressure block 41. The adjustment module 40 can control the locking pressure block 41 to slide relative to the slide rail 21, thereby driving the rotating shaft 43 to rotate relative to the support 42. Since the pressure claw 32 is disposed on the rotating shaft 43, the locking or releasing of the rotating shaft 43 can control the pressure claw 32 to press against or away from the chip 100, so as to realize the positioning of the chip 100 during the chip testing process, thereby improving the efficiency of processing the chip 100.
[0030] In some embodiments, the adjustment module 40 includes a crank 45, which is disposed at the end of the rotating shaft 43. The crank 45 can transmit rotational motion and can transmit the rotational motion to another component. In some embodiments, a spring 46 is disposed between the crank 45 and the carrier 20. The spring 46 can provide elastic force to pull the crank 45. The crank 45 transmits the rotational motion to the rotating shaft 43 connected to the crank 45, thereby driving the rotating shaft 43 to rotate. Further, since the pressure claw 32 is disposed on the rotating shaft 43, the pressure claw 32 is moved closer to or away from the chip 100 in the chip position. Through the above process, the chip 100 can be clamped or released.
[0031] See also Figure 1 , Figure 2 and Figure 3In some embodiments, an eccentric shaft 47 is provided on the side of the crank 45 away from the rotating shaft 43. The axis of the eccentric shaft 47 is parallel to the axis of the rotating shaft 43 but not colinear. The eccentric shaft 47 is parallel to the axis of the outer circle of the part or the axis of the outer circle and the inner hole but not overlapped, and there is a certain distance between the two. Compared with a general shaft that can only drive the workpiece to rotate, the eccentric shaft 47 can not only transmit the rotation, but also transmit the revolution. The eccentric shaft 47 is provided on the side of the crank 45 away from the rotating shaft 43, and the eccentric shaft 47 can be used to drive the rotating shaft 43 to rotate through the crank 45. The rotation of the rotating shaft 43 can drive the pressure claw 32 provided on the rotating shaft 43 to resist or move away from the chip 100. In some embodiments, the locking pressure block 41 forms a baffle 410 and a notch 412 along the sliding direction, and the baffle 410 forms an inclined surface 413 on the side facing the notch 412. When the locking pressure block 41 slides along the slide rail 21, the locking pressure block 41 can adjust the eccentric shaft 47. When the rotating shaft 43 is released and switched to the locking rotating shaft 43, the eccentric shaft 47 moves from the notch 412 to the inclined surface 413 and is finally pressed under the baffle 410. Since the locking pressure block 41 can move left and right guided by the slide rail 21, when the locking pressure block 41 moves, the baffle 410 and the notch 412 of the locking pressure block 41 can contact the eccentric shaft 47 respectively, thereby applying force to the eccentric shaft 47, and the eccentric shaft 47 drives the rotating shaft 43 to rotate through the crank 45. Specifically, in some embodiments, when the locking pressure block 41 moves toward the closing direction indicated by the arrow, the baffle 410 of the locking pressure block 41 contacts the eccentric shaft 47 and applies force to the eccentric shaft 47. Correspondingly, when the locking pressure block 41 moves toward the opening direction indicated by the arrow, the eccentric shaft 47 is located at the notch 412 of the locking pressure block 41. Since the eccentric shaft 47 is connected to the crank 45, adjusting the eccentric shaft 47 can cause the rotating shaft 43 to rotate driven by the crank 45. Since the pressure claw 32 is provided on the rotating shaft 43, the rotation of the rotating shaft 43 can drive the pressure claw 32 to open and close, thereby realizing the placement and positioning of the chip 100 at the chip placement position K1.
[0032] In some embodiments, the adjustment module 40 includes two rotating shafts 43, which are located on opposite sides of the chip placement position K1. The rotating shafts 43 are rotatably arranged on the support 42. Each rotating shaft 43 is respectively matched with the support 42, the crank 45, the spring 46 and the eccentric shaft 47. The locking pressure block 41 includes two groups of baffles 410 and notches 412. Each eccentric shaft 47 corresponds to a group of baffles 410 and notches 412. Through the above arrangement, the two sides of the chip 100 can be taken, placed, positioned and pressed respectively, so as to realize the positioning of the left and right sides of the chip 100 at the chip placement position K1 during the test process, thereby improving the efficiency of processing the chip 100.
[0033] In some embodiments, the slide rail 21 extends along the length direction of the vertical shaft 43, and the slide rail 21 can guide the locking pressure block 41. The axis of the eccentric shaft 47 is parallel to but not colinear with the axis of the shaft 43. The slide rail 21 is configured to extend along the length direction of the vertical shaft 43. The slide rail 21 extends along the length direction of the vertical eccentric shaft 47, so that when the locking pressure block 41 moves along the slide rail 21, the eccentric shaft 47 can move between the baffle 410 and the notch 412. The locking pressure block 41 can move left and right guided by the slide rail 21. The locking pressure block 41 acts on the eccentric shaft 47, and the eccentric shaft 47 drives the shaft 43 to rotate through the crank 45. The slide rail 21 extends along the length direction of the vertical shaft 43, so as to better adjust the angle of the pressure claw 32 when it is opened and closed, and adjust the pressing force of the pressure claw 32 on the chip 100, thereby ensuring reliable pressing of the chip 100 and making the pressure uniform.
[0034] In some embodiments, the rotating shaft 43 is located on the long side of the chip placement position K1. Since the pressure claw 32 is connected to the rotating shaft 43, the rotating shaft 43 is set on the long side of the chip placement position K1. The pressure claw 32 can press or release the long side of the chip 100 at the chip placement position K1. Positioning the long side of the chip 100 at the chip placement position K1 by the pressure claw 32 can improve the stability of the positioning of the chip 100, thereby improving the stability of the positioning of the chip 100, thereby improving the efficiency of processing the chip 100.
[0035] In some embodiments, each rotating shaft 43 is provided with at least two pressure claws 32 at intervals along the length direction, and the pressure claws 32 can ensure that the position of the chip 100 at the chip placement position K1 relative to the carrier 20 remains unchanged during the test process. At least two pressure claws 32 are provided at intervals in the length direction of each rotating shaft 43, and the position of the chip 100 along the direction of the rotating shaft 43 can be compressed at intervals. The at least two pressure claws 32 provided at intervals can achieve positioning at different positions of the same direction of the chip 100, thereby improving the stability of chip positioning, and can ensure the certainty and uniqueness of the position of the chip 100 at the chip placement position K1 on the carrier 20, thereby better ensuring that the position of the chip 100 at the chip placement position K1 relative to the carrier 20 remains unchanged.
[0036] In some embodiments, the pressure jaw 32 is provided with an open circular hole 320, and the rotating shaft 43 passes through the open circular hole 320. The pressure jaw 32 is provided with a fastener to adjust the size of the open circular hole 320. The pressure jaw 32 can be used to fix the chip 100 so that it occupies the correct position on the carrier 20 to be tested, and has the characteristics of being quick, convenient and safe to use. The pressure jaw 32 is provided with an open circular hole 320, and the pressure jaw 32 is provided with a fastener to adjust the size of the open circular hole 320 so that the claw clamp can adapt to the rotating shaft 43 of different diameters, and can be tightly fixed on the rotating shaft 43, thereby reducing the error of positioning the chip 100, which is conducive to improving the accuracy and certainty of positioning the chip 100, thereby improving the efficiency of processing the chip 100.
[0037] In some embodiments, the carrier 20 is provided with a receiving groove 201, and the chip placement position K1 is located in the receiving groove 201. Placing the chip 100 in the receiving groove 201 of the chip placement position K1 can better define the position of the chip 100, which is beneficial to improving the accuracy and certainty of the positioning of the chip 100, thereby improving the efficiency of processing the chip 100.
[0038] See also Figure 1 , Figure 2 and Figure 3, the chip 100 is placed in the receiving groove 201 of the chip placement position K1 on the carrier 20. In some embodiments, the process of placing the chip 100 in the chip placement position K1 can be completed by a robot. Further, the sliding locking pressure block 41 moves the locking pressure block 41 to the closing direction indicated by the arrow. At this time, the eccentric shaft 47 is at the baffle 410 of the locking pressure block 41, and then the baffle 410 of the locking pressure block 41 applies a force to the eccentric shaft 47. Since the eccentric shaft 47 is connected to the crank 45, adjusting the eccentric shaft 47 can make the rotating shaft 43 rotate under the drive of the crank 45. Since the pressure claw 32 is arranged on the rotating shaft 43, the rotation of the rotating shaft 43 can drive the pressure claw 32 to abut against the chip 100 in the receiving groove 201 of the chip placement position K1, and realize a one-time closing process, that is, the chip 100 is limited on the carrier 20. Correspondingly, the sliding locking pressure block 41 moves the locking pressure block 41 to the opening direction indicated by the arrow. At this time, the eccentric shaft 47 is at the notch 412 of the locking pressure block 41, and then the baffle 410 of the locking pressure block 41 releases the force applied to the eccentric shaft 47. Since the eccentric shaft 47 is connected to the crank 45, adjusting the eccentric shaft 47 can make the rotating shaft 43 rotate under the drive of the crank 45. Since the pressure claw 32 is arranged on the rotating shaft 43, the pressure claw 32 is provided with an open circular hole 320. The pressure claw 32 is provided with a fastener to adjust the size of the open circular hole 320 so that the claw clamp can adapt to the rotating shaft 43 of different diameters and can be tightly fixed. On the rotating shaft 43, the error of positioning the chip 100 is reduced. At the same time, at least two pressing claws 32 are arranged at intervals in the length direction of each rotating shaft 43, which can press the position of the chip 100 along the rotating shaft 43 at intervals. Further, in some embodiments, the rotating shaft 43 is arranged on the long side of the chip placement position K1, and the rotation of the rotating shaft 43 drives the pressing claw 32 away from the chip 100 in the receiving groove 201 of the chip placement position K1, releases the limitation of the position of the chip 100, and realizes a one-time clamping process. The above steps realize the placement and positioning of the chip 100 in the chip placement position K1. Adjusting the locking pressure block 41 can make the rotating shaft 43 rotate, thereby driving the pressing claw 32 to resist or move away from the chip 100, so as to realize the positioning of the chip 100 during the chip testing process, thereby improving the efficiency of processing the chip 100.
[0039] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0040] The above embodiments only express several implementation methods of the utility model, and the descriptions are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. A carrier for carrying a chip, characterized in that: include: A carrying platform, wherein the carrying platform is provided with a chip placement position and a slide rail; A positioning module, the positioning module comprising a positioning block and a pressing claw, the positioning block is arranged on the peripheral side of the chip placement position, and the positioning block is used to limit the chip in the chip placement position; An adjustment module, the adjustment module includes a locking pressure block, a support and a rotating shaft, the locking pressure block is arranged on the slide rail and can slide along the slide rail, the support is arranged on the supporting platform, the rotating shaft can be rotatably arranged on the support, the rotating shaft is located on the side of the chip placement position, the pressure claw is arranged on the rotating shaft, the pressure claw can rotate with the rotating shaft to resist or move away from the chip in the chip position, and the locking pressure block locks or releases the rotation of the rotating shaft by sliding.
2. The chip carrier according to claim 1, characterized in that: The adjusting module comprises a crank, and the crank is arranged at the end of the rotating shaft.
3. The chip carrier according to claim 2, characterized in that: A spring is provided between the crank and the carrier platform, and the spring provides elastic force to pull the crank and drive the rotating shaft to rotate, so as to make the pressing claw stay away from the chip in the chip position.
4. The chip carrier according to claim 3, characterized in that: An eccentric shaft is provided on the side of the crank away from the rotating shaft, and the axis of the eccentric shaft is parallel to but not colinear with the axis of the rotating shaft; the locking pressure block forms a baffle and a notch along the sliding direction, and the baffle forms an inclined surface on the side facing the notch; the locking pressure block slides along the slide rail, so that when switching from loosening the rotating shaft to locking the rotating shaft, the eccentric shaft presses against the inclined surface from the notch and is finally pressed under the baffle.
5. The chip carrier according to claim 4, characterized in that: The adjustment module includes two rotating shafts, which are located on opposite sides of the chip placement position. Each rotating shaft is respectively matched with the support, the crank, the spring and the eccentric shaft. The locking pressure block includes two groups of baffles and the notches, and each eccentric shaft corresponds to a group of baffles and the notches.
6. The chip carrier according to claim 1, characterized in that: The slide rail extends along a length direction perpendicular to the rotating shaft.
7. The chip carrier according to claim 1, characterized in that: The rotating shaft is located at the long side of the chip placement position.
8. The chip carrier according to claim 1, characterized in that: Each of the rotating shafts is provided with at least two pressing claws at intervals along the length direction.
9. The chip carrier according to claim 1, characterized in that: The pressing claw is provided with an open circular hole, the rotating shaft passes through the open circular hole, and a fastener is provided on the pressing claw to adjust the size of the open circular hole.
10. The chip carrier according to claim 1, characterized in that: The carrier platform is provided with a receiving groove, and the chip placement position is located in the receiving groove.