Silicon wafer limiting hanger

Abstract

The utility model relates to the technical field of silicon wafer hangers, and discloses a silicon wafer limiting hanger which comprises a limiting device and a moving device, the limiting device comprises a plurality of lower limiting plates and a plurality of upper limiting plates, and the upper limiting plates and the lower limiting plates are arranged in cavities of a plurality of silicon wafer placing grooves respectively. The moving device is arranged on the rear sides of the multiple lower limiting plates and the multiple upper limiting plates, the moving device comprises multiple first fixing plates, multiple connecting plates and a side plate, the multiple connecting plates and the multiple first fixing plates are all arranged on the front side wall face of the side plate, and the top wall face of the side plate is fixedly connected with the bottom wall face of the sliding part. In conclusion, by arranging the limiting device, the moving device, the lower limiting plate, the upper limiting plate, the connecting plate and the first fixing plate, the silicon wafer can be limited through the lower limiting plate and the upper limiting plate, a worker can conveniently take and place the silicon wafer through the connecting plate and the first fixing plate, and compared with the prior art, the silicon wafer storage device has the advantages of being convenient to use and simple in structure.

Description

Technical Field

[0001] The utility model belongs to the technical field of silicon wafer hangers, and in particular relates to a silicon wafer limiting hanger. Background Art

[0002] During the production and processing of silicon wafers, there is a copper electroplating process. To ensure the copper plating efficiency of silicon wafers, a loading device is required to load multiple silicon wafers at a time. In the prior art, copper plating of silicon wafers is performed using horizontal continuous electroplating technology and vertical continuous electroplating technology. However, the inventors have discovered the following disadvantages in the prior art:

[0003] The prior art discloses a silicon wafer limiting hanger and a silicon wafer loading and unloading device (202410313830.3). Multiple silicon wafer loading spaces are arranged on a hanger, so that the silicon wafer unit suction cups on the loading and unloading mechanism correspond one to one with the distribution positions of the silicon wafer loading spaces. Multiple silicon wafers can be loaded or unloaded at the same time, ensuring the processing efficiency of silicon wafer copper plating; the silicon wafer loading action is performed by the loading and unloading mechanism at the left end, and the process edges on the upper and lower sides of the silicon wafer are pressed and limited.

[0004] The existing technology processes silicon wafers by placing them in silicon wafer placement slots. Since the silicon wafer placement slots are fixed, placing larger silicon wafers requires certain skills and time. Multiple silicon wafer placement slots will increase the placement time of the workers. Some silicon wafers of the same size as the silicon wafer placement slots are difficult to place, and smaller silicon wafers cannot be well limited, which has certain disadvantages in use.

[0005] In view of this, the present utility model is proposed. Utility Model Content

[0006] In order to solve the above-mentioned technical problems of placement trouble and inability to properly limit the silicon wafer, the basic concept of the technical solution adopted by the present invention is:

[0007] A silicon wafer limiting rack, comprising:

[0008] A frame, a supporting frame is provided above the frame, a sliding portion is fixedly installed above the frame, the sliding portion and the supporting frame are movably connected, and a plurality of silicon wafer placement slots are opened at equal intervals on the front side wall of the frame;

[0009] A limiting device, the limiting device includes a plurality of lower limiting plates and a plurality of upper limiting plates, and the plurality of upper limiting plates and the plurality of upper limiting plates are respectively arranged in the cavities of the plurality of silicon wafer placement slots;

[0010] A moving device is arranged on the rear side of multiple lower limit plates and multiple upper limit plates. The moving device includes multiple first fixed plates, multiple connecting plates and side plates. The multiple connecting plates and multiple first fixed plates are all arranged on the front side wall surface of the side plate. The top wall surface of the side plate is fixedly connected to the bottom wall surface of the sliding part.

[0011] As a preferred embodiment of the present invention, the lower limit plate is arranged at the lower position in the silicon wafer placement groove cavity, and is in contact with the bottom wall surface of the silicon wafer placement groove cavity; the upper limit plate is arranged at the upper position in the silicon wafer placement groove cavity, and is in contact with the top wall surface of the silicon wafer placement groove cavity.

[0012] As a preferred embodiment of the present invention, the side wall surfaces where the lower limit plate and the upper limit plate are connected to each other are hollowed out, the silicon wafer is inserted into the cavity of the lower limit plate and the upper limit plate, and a first through hole is opened on the top wall surfaces of the multiple silicon wafer placement grooves.

[0013] As a preferred embodiment of the present invention, a first motor is fixedly mounted on the rear side wall of the frame, and a first bolt is fixedly mounted on the output end of the first motor. The first bolt passes through the side panel and is threadedly connected to the penetration point of the side panel.

[0014] As a preferred embodiment of the present invention, multiple first fixed plates are fixedly installed between the side plates and multiple lower limit plates, multiple movable plates are arranged at equal intervals on the front side wall surface of the side plates, and multiple connecting plates are fixedly installed between the movable plates and multiple upper limit plates.

[0015] As a preferred embodiment of the present invention, three second through-holes are provided on the front side wall surface of the side panel, and a third fixed plate is fixedly installed on the rear side wall surface of each of the multiple movable panels. The third fixed plate passes through the corresponding second through-holes, and a threaded hole is provided on the top wall surface of each of the multiple third fixed plates located on the rear side of the side panel.

[0016] As a preferred embodiment of the present invention, a second fixing plate is fixedly installed on the rear wall of the side panel, a second motor is fixedly installed on the bottom wall of the second fixing plate, a second bolt is fixedly installed on the output end of the second motor, and the second bolt is threadedly connected to a plurality of threaded holes.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. In summary, by setting a limit device, a moving device, a lower limit plate, an upper limit plate, a connecting plate and a first fixed plate, the silicon wafer can be limited by the lower limit plate and the upper limit plate, and the connecting plate and the first fixed plate make it convenient for staff to take and place the silicon wafer. Compared with the existing technology, it has the characteristics of easy use and simple structure.

[0019] 2. In summary, by setting the frame, the silicon wafer placement groove, the first perforation, the lower limit plate and the upper limit plate, the silicon wafer can be clamped into the cavity of the lower limit plate by moving the upper limit plate upward, and then the upper limit plate can be moved downward to limit the silicon wafer. The first perforation is set to assist the movement of the upper limit plate, which is easy to use and has a simple structure.

[0020] 3. In summary, by setting a movable plate, a first fixed plate, a first motor, a first bolt, a second fixed plate, a second motor, a second bolt, a connecting plate, a third fixed plate, a side plate, a second through-hole and a threaded hole, the lower limit plate and the upper limit plate can be driven to move by the rotation of the output end of the first motor, and then the upper limit plate can be moved upward by the rotation of the output end of the second motor to make it convenient for the staff to take and place the silicon wafers, and silicon wafers of different sizes can also be limited.

[0021] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In the attached figure:

[0023] Figure 1 It is a three-dimensional diagram of the utility model;

[0024] Figure 2 It is a three-dimensional diagram of the frame 12 of the present utility model;

[0025] Figure 3 This is a perspective view of one side of the side panel 27 of the present invention;

[0026] Figure 4 This is a perspective view of the other side of the side panel 27 of the present invention;

[0027] Figure 5 This is a three-dimensional diagram of the connecting plate 25 of the present invention;

[0028] Figure 6 This is a connection diagram of the limiting device and the moving device of the utility model.

[0029] In the figure: 10, sliding part; 11, supporting frame; 12, frame; 13, silicon wafer placement groove; 14, first through-hole; 15, lower limit plate; 16, upper limit plate; 17, movable plate; 18, first fixed plate; 19, first motor; 20, first bolt; 22, second fixed plate; 23, second motor; 24, second bolt; 25, connecting plate; 26, third fixed plate; 27, side plate; 28, second through-hole; 29, threaded hole. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. The following embodiments are used to illustrate the present invention.

[0031] like Figure 1 As shown, a silicon wafer limiting rack includes:

[0032] A frame 12 is provided with a supporting frame 11 above the frame 12. A sliding portion 10 is fixedly mounted above the frame 12. The sliding portion 10 and the supporting frame 11 are movably connected. A plurality of silicon wafer placement slots 13 are provided on the front side wall of the frame 12 at equal intervals.

[0033] A limiting device, the limiting device includes a plurality of lower limiting plates 15 and a plurality of upper limiting plates 16, and the plurality of upper limiting plates 16 and the plurality of upper limiting plates 16 are respectively arranged in the cavities of the plurality of silicon wafer placement slots 13;

[0034] The moving device is arranged on the rear side of multiple lower limit plates 15 and multiple upper limit plates 16. The moving device includes multiple first fixed plates 18, multiple connecting plates 25 and side plates 27. The multiple connecting plates 25 and multiple first fixed plates 18 are all arranged on the front side wall surface of the side plate 27. The top wall surface of the side plate 27 is fixedly connected to the bottom wall surface of the sliding part 10.

[0035] It is worth noting that the frame 12, the supporting frame 11, the sliding part 10 and the placement groove 13 have all been disclosed in a silicon wafer limiting hanger and a silicon wafer loading and unloading device (202410313830.3), and will not be repeated here.

[0036] During specific use, the limiting device can limit the silicon wafer through multiple lower limiting plates 15 and multiple upper limiting plates 16, making it convenient for the staff to process the silicon wafer. The moving device can move the lower limiting plate 15 and the upper limiting plate 16 through the connecting plate 25 and the first fixed plate 18 to facilitate the staff to take and place the silicon wafer.

[0037] To sum up, by setting up a limiting device, a moving device, a lower limiting plate 15, an upper limiting plate 16, a connecting plate 25 and a first fixed plate 18, the silicon wafer can be limited by the lower limiting plate 15 and the upper limiting plate 16, and the connecting plate 25 and the first fixed plate 18 make it convenient for staff to take and place the silicon wafer. Compared with the existing technology, it has the characteristics of easy use and simple structure.

[0038] like Figure 1 and Figure 2As shown, the lower limit plate 15 is set at the lower position in the cavity of the silicon wafer placement groove 13, and is in contact with the bottom wall of the cavity of the silicon wafer placement groove 13. The upper limit plate 16 is set at the upper position in the cavity of the silicon wafer placement groove 13 and is in contact with the top wall of the cavity of the silicon wafer placement groove 13.

[0039] The wall surface on one side where the lower limit plate 15 and the upper limit plate 16 are connected to each other is hollowed out, and the silicon wafer is inserted into the cavity of the lower limit plate 15 and the upper limit plate 16. A first through hole 14 is opened on the top wall surface of each of the multiple silicon wafer placement grooves 13.

[0040] During specific use, the upper limit plate 16 can move up and down, and the specific movement method will be discussed below. When the upper limit plate 16 moves upward, the staff can place the silicon wafer in the cavity of the lower limit plate 15, and then move the upper limit plate 16 downward. The top of the silicon wafer is stuck in the cavity of the upper limit plate 16 to limit the silicon wafer. The first perforation 14 can assist the movement of the upper limit plate 16, and fit the lower limit plate 15 and the upper limit plate 16 with the inner wall of the silicon wafer placement groove 13.

[0041] To sum up, by setting the frame 12, the silicon wafer placement groove 13, the first perforation 14, the lower limit plate 15 and the upper limit plate 16, the silicon wafer can be clamped into the cavity of the lower limit plate 15 by moving the upper limit plate 16 upward, and then the upper limit plate 16 can be moved downward to limit the silicon wafer. The first perforation 14 is set to assist the upper limit plate 16 in moving, which is easy to use and has a simple structure.

[0042] like Figure 3 、 Figure 4 、 Figure 5 and Figure 6 As shown, a first motor 19 is fixedly mounted on the rear side wall of the frame 12 , and a first bolt 20 is fixedly mounted on the output end of the first motor 19 . The first bolt 20 passes through the side plate 27 and is threadedly connected to the penetration portion of the side plate 27 .

[0043] The multiple first fixed plates 18 are fixedly installed between the side plate 27 and the multiple lower limit plates 15. The front side wall surface of the side plate 27 is provided with multiple movable plates 17 at equal intervals. The multiple connecting plates 25 are fixedly installed between the movable plate 17 and the multiple upper limit plates 16.

[0044] Three second through-holes 28 are provided on the front side wall of the side panel 27, and a third fixed plate 26 is fixedly installed on the rear side wall of each of the movable panels 17. The third fixed plate 26 passes through the corresponding second through-holes 28, and a threaded hole 29 is provided on the top wall of the rear side of each of the third fixed plates 26.

[0045] A second fixing plate 22 is fixedly mounted on the rear wall of the side panel 27. A second motor 23 is fixedly mounted on the bottom wall of the second fixing plate 22. A second bolt 24 is fixedly mounted on the output end of the second motor 23. The second bolt 24 is threadedly connected to a plurality of threaded holes 29. Both the first motor 19 and the second motor 23 are electrically connected to a power supply and a switch.

[0046] During specific use, when the output end of the first motor 19 rotates, the first bolt 20 can be driven to rotate, and the rotation of the first bolt 20 can drive the side plate 27 to move through the threaded connection with the side plate 27. The movement of the side plate 27 can drive multiple lower limit plates 15 to move through the first fixed plate 18, and drive multiple upper limit plates 16 to move through the movable plate 17 and the connecting plate 25. The connecting plate 25 will move into the cavity of the first through-hole 14, and the second through-hole 28 can limit the movable plate 17 through the third fixed plate 26. After the lower limit plate 15 and the upper limit plate 16 move forward, the output end of the second motor 23 can be rotated, and the rotation of the output end of the second motor 23 It can drive the second bolt 24 to rotate, and the rotation of the second bolt 24 can drive the third fixed plate 26 to move up and down through the threaded hole 29. The movement of the third fixed plate 26 can drive multiple connecting plates 25 to move up and down through the movable plate 17. The movement of multiple connecting plates 25 can drive multiple upper limit plates 16 to move up and down. When the upper limit plate 16 moves upward, the staff can clamp the silicon wafer into the cavity of the lower limit plate 15. When the upper limit plate 16 moves downward, the upper limit plate 16 and the lower limit plate 15 can limit the silicon wafer. When the staff needs to take out the silicon wafer, they can move the upper limit plate 16 upward by rotating the output end of the second motor 23.

[0047] To sum up, by setting the movable plate 17, the first fixed plate 18, the first motor 19, the first bolt 20, the second fixed plate 22, the second motor 23, the second bolt 24, the connecting plate 25, the third fixed plate 26, the side plate 27, the second through-hole 28 and the threaded hole 29, the lower limit plate 15 and the upper limit plate 16 can be driven to move by the rotation of the output end of the first motor 19, and then the upper limit plate 16 can be moved upward by the rotation of the output end of the second motor 23 to make it convenient for the staff to take and place the silicon wafers, and silicon wafers of different sizes can also be limited.

[0048] It is understood that the present invention is described by way of certain embodiments, and those skilled in the art will appreciate that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present invention. Furthermore, under the guidance of the present invention, these features and embodiments may be modified to suit specific circumstances and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are intended to be protected by the present invention.

Claims

1. A silicon wafer limiting rack, characterized in that: include: A frame (12), a supporting frame (11) is arranged above the frame (12), a sliding part (10) is fixedly installed above the frame (12), the sliding part (10) and the supporting frame (11) are movably sleeved, and a plurality of silicon wafer placement grooves (13) are provided at equal intervals on the front side wall surface of the frame (12); A limiting device, the limiting device comprising a plurality of lower limiting plates (15) and a plurality of upper limiting plates (16), the plurality of upper limiting plates (16) and the plurality of upper limiting plates (16) being respectively arranged in the cavities of the plurality of silicon wafer placement grooves (13); A moving device, the moving device is arranged on the rear side of multiple lower limit plates (15) and multiple upper limit plates (16), the moving device comprises multiple first fixed plates (18), multiple connecting plates (25) and side plates (27), the multiple connecting plates (25) and multiple first fixed plates (18) are all arranged on the front side wall surface of the side plate (27), and the top wall surface of the side plate (27) is fixedly connected to the bottom wall surface of the sliding part (10).

2. The silicon wafer limiting rack according to claim 1, characterized in that: The lower limit plate (15) is arranged at a lower position in the cavity of the silicon wafer placement groove (13) and is in contact with the bottom wall surface of the cavity of the silicon wafer placement groove (13); the upper limit plate (16) is arranged at an upper position in the cavity of the silicon wafer placement groove (13) and is in contact with the top wall surface of the cavity of the silicon wafer placement groove (13).

3. The silicon wafer limiting rack according to claim 2, characterized in that: The wall surface on one side where the lower limit plate (15) and the upper limit plate (16) are connected to each other is in a hollow state, the silicon wafer is inserted into the cavity of the lower limit plate (15) and the upper limit plate (16), and a first through hole (14) is opened on the top wall surface of the plurality of silicon wafer placement grooves (13).

4. The silicon wafer limiting rack according to claim 3, characterized in that: A first motor (19) is fixedly mounted on the rear side wall of the frame (12), and a first bolt (20) is fixedly mounted on the output end of the first motor (19). The first bolt (20) penetrates the side plate (27) and is threadedly connected to the penetration point of the side plate (27).

5. The silicon wafer limiting rack according to claim 1, characterized in that: The plurality of first fixed plates (18) are fixedly mounted between the side plates (27) and the plurality of lower limit plates (15); a plurality of movable plates (17) are arranged at equal intervals on the front side wall surface of the side plates (27); and the plurality of connecting plates (25) are fixedly mounted between the movable plates (17) and the plurality of upper limit plates (16).

6. The silicon wafer limiting rack according to claim 5, characterized in that: The front side wall surface of the side plate (27) is provided with three second through holes (28); the rear side wall surfaces of the plurality of movable plates (17) are each fixedly mounted with a third fixed plate (26); the third fixed plate (26) passes through the corresponding second through holes (28); and the top wall surfaces of the plurality of third fixed plates (26) located on the rear side of the side plate (27) are each provided with a threaded hole (29).

7. The silicon wafer limiting rack according to claim 6, characterized in that: A second fixing plate (22) is fixedly mounted on the rear wall surface of the side plate (27), a second motor (23) is fixedly mounted on the bottom wall surface of the second fixing plate (22), a second bolt (24) is fixedly mounted on the output end of the second motor (23), and the second bolt (24) is threadedly connected to a plurality of threaded holes (29).

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