Circuit board electroplating device

Abstract

The utility model discloses a circuit board electroplating device which comprises a base and a clamping mechanism, the upper end of the base is provided with a pair of electroplating frames, and the base is further provided with an electroplating box; the clamping mechanism comprises a clamping base, a clamping sleeve is installed at the lower end of the clamping base, a pair of clamping plates are installed in the clamping sleeve in a sliding mode, clamping guide rods are further installed on the clamping sleeve in a sliding and inserted mode, the ends of the clamping guide rods are fixedly connected with the corresponding clamping plates, the clamping guide rods are further sleeved with clamping springs, and the clamping springs are connected with the clamping guide rods in a sliding mode. The two ends of the clamping spring are connected with the clamping plate and the inner wall of the clamping sleeve in an abutting mode respectively. The moving mechanism is mounted on the electroplating frame and is used for driving the clamping mechanism to move; the circuit board clamping device has the advantages that the structure is reasonable, the clamping of a circuit board can be more convenient, the processing efficiency is improved, and the use requirements can be better met.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating equipment, in particular to a circuit board electroplating device. Background Art

[0002] Electroplating is an important process in the production of circuit boards. It is a process of depositing a coating on a substrate by electrolysis. Usually, during electroplating, the coating metal acts as the anode and is oxidized into cations that enter the plating solution. The circuit board to be plated acts as the cathode. The cations of the coating metal are reduced on the surface of the circuit board to form a coating. When the circuit board is electroplated, the uniformity of the coating thickness needs to be ensured. However, during the current circuit electroplating production, electroplating treatment is usually required in batches, resulting in very low efficiency of the electroplating production process. On the other hand, when operators clamp the circuit board substrate, multiple people are required to cooperate in clamping and placing it in the electroplating tank, resulting in high labor costs and certain production risks.

[0003] In order to solve the above problems, authorization announcement number CN206624935U discloses a circuit board substrate electroplating device, which facilitates the loading and unloading of the circuit board substrate to be electroplated, has better efficiency and saves labor costs. However, during actual use, the staff needs to open the clamp with one hand and insert the circuit board substrate into the clamp with the other hand, and multiple operations are required, which increases the clamping time and reduces production efficiency. Utility Model Content

[0004] The purpose of the utility model is to provide a circuit board electroplating device to solve the problems raised in the above background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A circuit board electroplating device comprises: a base, a clamping mechanism, a pair of electroplating racks are installed on the upper end of the base, and an electroplating box is also installed on the base; the clamping mechanism comprises a clamping base, a clamping sleeve is installed on the lower end of the clamping base, a pair of clamping plates are slidably installed in the clamping sleeve, a clamping guide rod is also slidably inserted on the clamping sleeve, the end of the clamping guide rod is fixedly connected to the corresponding clamping plate, and a clamping spring is also mounted on the clamping guide rod, and the two ends of the clamping spring are respectively in contact with the clamping plate and the inner wall of the clamping sleeve; a moving mechanism is installed on the electroplating rack and is used to drive the clamping mechanism to move; a fixing mechanism is installed at the lower end of the moving mechanism and is used to fix the clamping mechanism.

[0007] As a preferred solution, an inclined guide portion extends from the lower end of the clamping plate.

[0008] As a preferred solution, the moving mechanism includes a moving screw rotatably mounted on the electroplating rack, a moving slide is threadedly mounted on the moving screw, a moving motor is also fixed to the end of the electroplating rack, the output end of the moving motor is drivingly connected to the shaft end of the moving screw, a moving electric push rod is also fixed to the upper end of the moving slide, and the telescopic end of the moving electric push rod passes through the moving slide and is fixed to a moving lifting seat.

[0009] As a preferred solution, the fixing mechanism includes fixing seats installed on both sides of the lower end of the movable lifting seat, each of the fixing seats is fixed with a fixed electric push rod, the telescopic end of the fixed electric push rod passes through the fixing seat and is installed with a fixed clamping plate, and the opposite side of the fixed clamping plate is also provided with a fixing groove for clamping the clamping base.

[0010] As a preferred solution, the electroplating box is also equipped with an anode seat, an anode plate is fixed on the anode seat, and the anode seat is electrically connected to the positive electrode of the power supply;

[0011] The electroplating box is also provided with a cathode seat, the upper end of which is provided with a limiting groove, and the cathode seat is electrically connected to the negative pole of the power supply.

[0012] As a preferred solution, a clamping groove is provided at the position of the lower end of the clamping base corresponding to the limiting groove.

[0013] As a preferred solution, both the clamping slot and the limiting slot are provided with chamfers.

[0014] Compared with the prior art, the beneficial effect of the utility model is: by adjusting the gap between the clamping plates corresponding to the upper end of the circuit board, and then pushing the circuit board upward, the clamping plates on both sides are separated from each other, so that the circuit board is inserted into the clamping sleeve, and the clamping spring is compressed, so as to push the clamping plates on both sides to clamp the circuit board, thereby completing the clamping work of the circuit board, the operation is simple, the clamping is convenient, and the clamping efficiency can be effectively improved, thereby improving the processing efficiency of the circuit board. The utility model has a reasonable structure, can be more convenient for the clamping of the circuit board, thereby improving the processing efficiency, so as to better meet the use requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall three-dimensional structure of a circuit board electroplating device;

[0016] Figure 2 A schematic diagram of the three-dimensional structure of the position of a movable slide seat of a circuit board electroplating device;

[0017] Figure 3 A schematic diagram of a three-dimensional structure of a clamping mechanism of a circuit board electroplating device from a first-view perspective;

[0018] Figure 4A schematic diagram of the stereoscopic structure of a clamping mechanism of a circuit board electroplating device from a second viewing angle;

[0019] Figure 5 The present invention is a schematic diagram of the three-dimensional structure of the electroplating box position of a circuit board electroplating device.

[0020] In the figure: 1-base, 11-electroplating rack, 2-electroplating box, 21-anode seat, 22-anode plate, 23-cathode seat, 231-limiting groove, 3-moving mechanism, 31-moving screw, 32-moving motor, 33-moving slide, 34-moving electric push rod, 35-moving lifting seat, 4-fixing mechanism, 41-fixing seat, 42-fixed electric push rod, 43-fixed splint, 44-fixing groove, 5-clamping mechanism, 51-clamping sleeve, 52-clamping plate, 53-clamping guide rod, 54-clamping spring, 55-clamping base, 551-slot. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] Example: See Figures 1 to 5 , a circuit board electroplating device, comprising: a base 1, a clamping mechanism 5, a pair of electroplating racks 11 are installed on the upper end of the base 1, and a plating box 2 is also installed on the base 1; the clamping mechanism 5 includes a clamping base 55, a clamping sleeve 51 is installed at the lower end of the clamping base 55, a pair of clamping plates 52 are slidably installed in the clamping sleeve 51, and a clamping guide rod 53 is also slidably inserted on the clamping sleeve 51, the end of the clamping guide rod 53 is fixedly connected with the corresponding clamping plate 52, and the clamping guide rod 53 is also covered with a clamping spring 54, and the two ends of the clamping spring 54 are respectively in contact with the inner wall of the clamping plate 52 and the clamping sleeve 51; a moving mechanism 3 is installed on the electroplating rack 11, and is used to drive the clamping mechanism 5 to move; a fixing mechanism 4 is installed at the lower end of the moving mechanism 3, and is used to fix the clamping mechanism 5. In order to facilitate the insertion of the circuit board between the clamping plates 52, the lower end of the clamping plate 52 extends with an inclined guide portion.

[0023] The working principle of the utility model is as follows: when clamping, the upper end of the circuit board is aligned with the gap between the clamping plates 52, and then the circuit board is pushed upward, at which time the clamping plates 52 on both sides are separated from each other, so that the circuit board is inserted into the clamping sleeve 51, and at this time the clamping spring 54 is compressed, thereby pushing the clamping plates 52 on both sides to clamp the circuit board, thereby completing the clamping work of the circuit board, the operation is simple, the clamping is convenient, and the clamping efficiency can be effectively improved, thereby improving the processing efficiency of the circuit board;

[0024] Subsequently, the fixing mechanism 4 is moved to the specified position by the moving mechanism 3, and then the clamping substrate 55 is fixed by the fixing mechanism 4. Subsequently, the circuit board is moved by the moving mechanism and inserted into the corresponding electroplating box 2, and then the electroplating work can be carried out.

[0025] As a further solution, the moving mechanism 3 includes a moving screw 31 rotatably mounted on the plating rack 11, and a moving slide 33 is threadedly mounted on the moving screw 31. A moving motor 32 is also fixed to the end of the plating rack 11. The output end of the moving motor 32 is drivingly connected to the shaft end of the moving screw 31. A moving electric push rod 34 is also fixed to the upper end of the moving slide 33. The telescopic end of the moving electric push rod 34 passes through the moving slide 33 and is fixed to a moving lifting seat 35.

[0026] The working principle of the moving mechanism 3 is: start the moving motor 32, and drive the moving screw 31 to rotate through the moving motor 32, thereby driving the moving slide 33 to move, and the moving slide 33 can be moved forward and backward by the forward and reverse rotation of the moving motor 32, and the moving lifting seat 35 can be driven up and down by the moving electric push rod 34, so as to facilitate the insertion of the circuit board into the electroplating box 2 (or lift the circuit board from the electroplating box 2).

[0027] As a further solution, the fixing mechanism 4 includes a fixing seat 41 installed on both sides of the lower end of the movable lifting seat 35, and a fixed electric push rod 42 is fixed on each of the fixing seats 41. The telescopic end of the fixed electric push rod 42 passes through the fixing seat 41 and is installed with a fixed clamping plate 43. The opposite side of the fixed clamping plate 43 is also provided with a fixing groove 44 for clamping the clamping base 55.

[0028] As a further solution, an anode seat 21 is also installed on the electroplating box 2, an anode plate 22 is fixed on the anode seat 21, and the anode seat 21 is electrically connected to the positive pole of the power supply; a cathode seat 23 is also installed on the electroplating box 2, a limiting groove 231 is provided at the upper end of the cathode seat 23, and the cathode seat 23 is electrically connected to the negative pole of the power supply, and a clamping groove 551 is provided at the lower end of the clamping base 55 corresponding to the position of the limiting groove 231, and both the clamping groove 551 and the limiting groove 231 are provided with chamfers.

[0029] The working principle of the fixing mechanism 4 is as follows: when fixing, the fixed electric push rods 42 on both sides extend to push the fixed clamping plates 43 on both sides closer to each other, so that the two ends of the clamping base 55 are respectively inserted into the corresponding fixing grooves 44, thereby completing the fixing work of the clamping mechanism 5;

[0030] When the movable mechanism 3 inserts the clamping base 55 into the limiting groove 231 on the cathode seat 23, the limiting groove 231 cooperates with the card slot 551 to prevent the clamping base 55 from falling off. Subsequently, the fixed electric push rod 42 contracts, driving the fixed clamping plates 43 on both sides to separate, thereby placing the clamping mechanism 5 equipped with the circuit board on the electroplating box 2 to facilitate the electroplating work.

[0031] In the present invention, terms such as "upper", "lower", "left", "right", "front", "back", "vertical", "horizontal", "side", "bottom" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings. They are relational words determined only for the convenience of describing the structural relationships of the various parts or elements of the present invention, and do not specifically refer to any part or element in the present invention and cannot be understood as limitations on the present invention.

Claims

1. A circuit board electroplating device, characterized in that: include: A base (1) and a clamping mechanism (5), wherein a pair of electroplating racks (11) are mounted on the upper end of the base (1), and an electroplating box (2) is also mounted on the base (1); The clamping mechanism (5) comprises a clamping base (55), a clamping sleeve (51) is installed at the lower end of the clamping base (55), a pair of clamping plates (52) are slidably installed in the clamping sleeve (51), a clamping guide rod (53) is also slidably inserted on the clamping sleeve (51), the end of the clamping guide rod (53) is fixedly connected to the corresponding clamping plate (52), and a clamping spring (54) is also sleeved on the clamping guide rod (53), and the two ends of the clamping spring (54) are respectively in contact with the clamping plate (52) and the inner wall of the clamping sleeve (51); A moving mechanism (3) is installed on the electroplating rack (11) and is used to drive the clamping mechanism (5) to move; The fixing mechanism (4) is installed at the lower end of the moving mechanism (3) and is used to fix the clamping mechanism (5).

2. A circuit board electroplating device according to claim 1, characterized in that: An inclined guide portion extends from the lower end of the clamping plate (52).

3. A circuit board electroplating device according to claim 2, characterized in that: The moving mechanism (3) comprises a moving lead screw (31) rotatably mounted on the electroplating rack (11); a moving slide (33) is threadedly mounted on the moving lead screw (31); a moving motor (32) is fixed to the end of the electroplating rack (11); the output end of the moving motor (32) is drivingly connected to the shaft end of the moving lead screw (31); a moving electric push rod (34) is fixed to the upper end of the moving slide (33); the telescopic end of the moving electric push rod (34) passes through the moving slide (33) and is fixed to a moving lifting seat (35).

4. A circuit board electroplating device according to claim 3, characterized in that: The fixing mechanism (4) comprises a fixing seat (41) installed at both sides of the lower end of the movable lifting seat (35), and each of the fixing seats (41) is fixed with a fixing electric push rod (42), and the telescopic end of the fixing electric push rod (42) passes through the fixing seat (41) and is installed with a fixing clamping plate (43), and the opposite side of the fixing clamping plate (43) is also provided with a fixing groove (44) for clamping the clamping base (55).

5. A circuit board electroplating device according to claim 4, characterized in that: The electroplating box (2) is also equipped with an anode seat (21), an anode plate (22) is fixed on the anode seat (21), and the anode seat (21) is electrically connected to the positive electrode of the power supply; The electroplating box (2) is also provided with a cathode seat (23), the upper end of the cathode seat (23) is provided with a limiting groove (231), and the cathode seat (23) is electrically connected to the negative electrode of the power supply.

6. A circuit board electroplating device according to claim 5, characterized in that: A clamping groove (551) is provided at a position of the lower end of the clamping base (55) corresponding to the limiting groove (231).

7. A circuit board electroplating device according to claim 6, characterized in that: The clamping slot (551) and the limiting slot (231) are both provided with chamfers.

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