Electric card heat exchange system and household appliance

Abstract

The utility model relates to the technical field of refrigeration, and discloses an electrocaloric heat exchange system which comprises an electrocaloric refrigeration device which alternately generates heat and cold and comprises a hot end and a cold end. The first working medium circulation flow path comprises a hot end heat exchanger and a first terminal heat exchanger which are communicated through a first magnetic fluid pipeline, and the hot end heat exchanger is attached to the hot end of the electrocaloric refrigeration device; the second working medium circulation flow path comprises a cold end heat exchanger and a second terminal heat exchanger which are communicated through a second magnetic fluid pipeline, the cold end heat exchanger is attached to the cold end of the electrocaloric refrigeration device, and the first magnetic fluid pipeline is provided with a first magnetic element used for driving magnetic fluid to flow; the second magnetic fluid pipeline is provided with a second magnetic element used for driving the magnetic fluid to flow. According to the electrocaloric heat exchange system, the magnetofluid is adopted as the heat and cold exchange working medium, and the heat and cold exchange effect of the electrocaloric refrigeration device is improved. The utility model further discloses the household appliance.

Description

Technical Field

[0001] The present application relates to the field of refrigeration technology, for example, to an electric card heat exchange system and household appliances. Background Art

[0002] Current refrigeration products are mainly based on the vapor compression principle and require fluorine-containing refrigerants as working fluids. They will produce a greenhouse effect during use, and there is a risk of refrigerant leakage causing environmental pollution.

[0003] When an electric field is applied or removed on the electrocaloric material, the electrocaloric material will absorb or release heat, which is the electrocaloric effect. The electrocaloric refrigeration device is a new refrigeration technology based on the electrocaloric effect of electrocaloric materials. It does not need to use the compressor and refrigerant required by the common refrigeration technology, delays the generation of the greenhouse effect, and avoids the environmental pollution caused by the leakage of refrigerants.

[0004] In the process of implementing the embodiments of the present disclosure, it is found that there are at least the following problems in the related art:

[0005] Electric card refrigeration devices can alternately generate heat and cold, including hot ends and cold ends. When using electric card refrigeration devices for cooling or heating, it is necessary to separate the heat generated by the hot end of the electric card refrigeration device, or to separate the cold generated by the cold end of the electric card refrigeration device, so that the heat or cold generated by it can be subsequently utilized. However, the existing electric card refrigeration devices have poor separation effects of heat and cold, which reduces the utilization effect of the heat and cold of the electric card refrigeration devices.

[0006] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present application, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Utility Model Content

[0007] In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. The summary is not an extensive review, nor is it intended to identify key / critical components or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.

[0008] An embodiment of the present disclosure provides an electric card heat exchange system, including: an electric card refrigeration device that alternately generates heat and cold, including a hot end and a cold end; a first working fluid circulation flow path, including a hot end heat exchanger and a first terminal heat exchanger connected by a first magnetic fluid pipeline, and the hot end heat exchanger is attached to the hot end of the electric card refrigeration device; and a second working fluid circulation flow path, including a cold end heat exchanger and a second terminal heat exchanger connected by a second magnetic fluid pipeline, and the cold end heat exchanger is attached to the cold end of the electric card refrigeration device, wherein the first magnetic fluid pipeline is provided with a first magnetic element for driving the flow of magnetic fluid, and the second magnetic fluid pipeline is provided with a second magnetic element for driving the flow of magnetic fluid.

[0009] In some optional embodiments, the hot end heat exchanger includes a first working fluid inlet and a first working fluid outlet, and the first terminal heat exchanger includes a second working fluid inlet and a second working fluid outlet, wherein the first magnetic fluid pipeline includes a first pipe section connected to the first working fluid outlet and the second working fluid inlet, and the first magnetic element is arranged on the first pipe section.

[0010] In some optional embodiments, the electric card heat exchange system further includes: a first liquid storage element, disposed in the first pipe section.

[0011] In some optional embodiments, the first magnetic fluid pipeline further includes a second pipe section connecting the second working fluid outlet and the first working fluid inlet, wherein the second pipe section is provided with a first pump body for driving the flow of the magnetic fluid.

[0012] In some optional embodiments, the cold end heat exchanger includes a third working fluid inlet and a third working fluid outlet, and the second terminal heat exchanger includes a fourth working fluid inlet and a fourth working fluid outlet, wherein the second magnetic fluid pipeline includes a third pipe section connected to the third working fluid outlet and the fourth working fluid inlet, and the second magnetic element is arranged in the third pipe section.

[0013] In some optional embodiments, the electric card heat exchange system further includes: a second liquid storage element, which is arranged in the third pipe section.

[0014] In some optional embodiments, the second magnetic fluid pipeline further includes a fourth pipe section connecting the fourth working fluid outlet and the third working fluid inlet, wherein the fourth pipe section is provided with a second pump body for driving the flow of the magnetic fluid.

[0015] In some optional embodiments, the hot-end heat exchanger or the cold-end heat exchanger is an internal flow heat exchanger.

[0016] In some optional embodiments, the electric card refrigeration device includes an electric card refrigeration chip, which includes: an electric card element, including a first electrode layer, a second electrode layer, and a piezoelectric functional film layer, the piezoelectric functional film layer is arranged between the first electrode layer and the second electrode layer, the piezoelectric functional film layer includes a piezoelectric refrigeration zone and a piezoelectric displacement zone formed by partitioning the piezoelectric film layer, the piezoelectric displacement zone is used to drive the piezoelectric refrigeration zone to generate displacement; a heat receiving end, used to receive heat from the electric card element; and, a cold receiving end, used to receive cold from the electric card element.

[0017] The disclosed embodiment further provides a household appliance, comprising the aforementioned electric card heat exchange system.

[0018] The electric card heat exchange system and household appliance provided by the embodiments of the present disclosure can achieve the following technical effects:

[0019] The electric card heat exchange system provided by the embodiment of the present disclosure includes an electric card refrigeration device and a first working fluid circulation flow path and a second working fluid circulation flow path for separating and utilizing the heat and cold generated by the electric card refrigeration device, respectively. Among them, in the first working fluid circulation flow path, a first magnetic fluid pipeline is used to form a closed internal circulation flow path between the hot end heat exchanger and the first terminal heat exchanger, and the first magnetic fluid pipeline is filled with a magnetic fluid for heat exchange with the hot end of the electric card refrigeration device. In the second working fluid circulation flow path, a second magnetic fluid pipeline is used to form a closed internal circulation pipeline between the cold end heat exchanger and the second terminal heat exchanger, and the second magnetic fluid pipeline is filled with a magnetic fluid for cold exchange with the electric card refrigeration device.

[0020] The electric card heat exchange system provided in the embodiment of the present disclosure adopts magnetic fluid as the transfer medium for heat or cold, thereby improving the separation effect of the heat and cold generated by the electric card refrigeration device, and thereby improving the utilization rate of the heat and cold generated by the electric card refrigeration device by the first terminal heat exchanger or the second terminal heat exchanger.

[0021] The above general description and the following description are exemplary and explanatory only and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] One or more embodiments are exemplarily described by corresponding drawings, which do not limit the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements, and the drawings do not constitute a scale limitation, and wherein:

[0023] Figure 1 is a schematic diagram of an electric card heat exchange system provided by an embodiment of the present disclosure;

[0024] Figure 2 is a schematic diagram of another electric card heat exchange system provided by an embodiment of the present disclosure;

[0025] Figure 3 is a schematic structural diagram of a piezoelectric functional film layer in an electric card element provided in an embodiment of the present disclosure;

[0026] Figure 4 is a schematic diagram of the structure of an electric card element provided by an embodiment of the present disclosure;

[0027] Figure 5 It is a schematic diagram of the structure of the electric card refrigeration chip provided in an embodiment of the present disclosure;

[0028] Figure 6 It is a schematic diagram of the electric card element in the electric card refrigeration chip provided by the embodiment of the present disclosure being attached to the heat receiving end;

[0029] Figure 7 It is a schematic diagram of the electric card element in the electric card refrigeration chip provided by the embodiment of the present disclosure being attached to the cold receiving end.

[0030] Reference numerals:

[0031] 1: first electrode layer; 11: electric card cooling electrode area; 12: piezoelectric drive electrode area; 13: electrode gap;

[0032] 2: second electrode layer;

[0033] 3: the third electrode layer;

[0034] 4: piezoelectric functional film layer; 41: piezoelectric displacement unit; 42: piezoelectric refrigeration unit; 431: first through-dividing gap; 432: first through-dividing piezoelectric displacement unit; 433: second through-dividing gap;

[0035] 5: basal layer;

[0036] 100: electric card components;

[0037] 201: first clamping frame; 202: second clamping frame; 203: first bending gap; 204: second bending gap; 205: supporting frame;

[0038] 300: heat receiving end;

[0039] 400: cold receiving end;

[0040] 500: Electric card refrigeration device;

[0041] 610: hot end heat exchanger; 611: first working fluid inlet; 612: first working fluid outlet; 620: first terminal heat exchanger; 621: second working fluid inlet; 622: second working fluid outlet; 630: first magnetic element; 640: first liquid storage element; 650: first pump body;

[0042] 710: cold end heat exchanger; 711: third working fluid inlet; 712: third working fluid outlet; 720: second terminal heat exchanger; 721: fourth working fluid inlet; 722: fourth working fluid outlet; 730: second magnetic element; 740: second liquid storage element; 750: second pump body. DETAILED DESCRIPTION

[0043] In order to be able to understand the features and technical contents of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. The attached drawings are for reference only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the convenience of explanation, a full understanding of the disclosed embodiments is provided through multiple details. However, one or more embodiments can still be implemented without these details. In other cases, to simplify the drawings, well-known structures and devices can be simplified for display.

[0044] The terms "first", "second", etc. in the specification and claims of the disclosed embodiments and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchanged where appropriate to describe the disclosed embodiments here. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0045] In the embodiments of the present disclosure, the terms "upper", "lower", "inside", "middle", "outside", "front", "back" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. These terms are mainly intended to better describe the embodiments of the present disclosure and their embodiments, and are not intended to limit the indicated devices, elements or components to have a specific direction, or to be constructed and operated in a specific direction. Moreover, in addition to being used to indicate directions or positional relationships, some of the above terms may also be used to indicate other meanings. For example, the term "upper" may also be used to indicate a certain dependency or connection relationship in certain circumstances. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0046] In addition, the terms "disposed", "connected", and "fixed" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0047] Unless otherwise stated, the term "plurality" means two or more.

[0048] The term "and / or" is a description of the association relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or, A and B.

[0049] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.

[0050] like Figure 1 and Figure 2 As shown, the embodiment of the present disclosure provides an electric card heat exchange system, including an electric card refrigeration device 500, a first working fluid circulation flow path and a second working fluid circulation flow path. The electric card refrigeration device 500 generates heat and cold alternately, and the electric card refrigeration device 500 includes a hot end and a cold end; the first working fluid circulation flow path includes a hot end heat exchanger 610 and a first terminal heat exchanger 620 connected by a first magnetic fluid pipeline, and the hot end heat exchanger 610 is attached to the hot end of the electric card refrigeration device 500; the second working fluid circulation flow path includes a cold end heat exchanger 710 and a second terminal heat exchanger 720 connected by a second magnetic fluid pipeline, and the cold end heat exchanger 710 is attached to the cold end of the electric card refrigeration device 500. Among them, the first magnetic fluid pipeline is provided with a first magnetic element 630 for driving the flow of magnetic fluid, and the second magnetic fluid pipeline is provided with a second magnetic element 730 for driving the flow of magnetic fluid.

[0051] The electrocaloric effect is a cooling and heating effect of an iron material under an electric field, which releases heat when an electric field is applied and absorbs heat when the electric field is removed. The electrocaloric cooling device 500 is a cooling device based on the electrocaloric effect.

[0052] Magnetic fluid has both the fluidity of liquid and the magnetism of solid magnetic material. It is a stable colloidal liquid mixed with magnetic solid particles with a diameter of nanometers, such as less than 10 nanometers, a base carrier liquid and a surfactant. Magnetic fluid has no magnetic attraction when static, and only shows magnetism when an external magnetic field is applied. Magnetic fluid has unique flow and energy transfer properties. The flow and energy transfer process of magnetic fluid can be controlled by applying an external magnetic field.

[0053] The thermal conductivity of magnetic nanoparticles is usually an order of magnitude higher than that of the base fluid, so the addition of nanoparticles significantly increases the thermal conductivity of the base fluid, which is manifested as an increase in thermal conductivity or convective heat transfer coefficient. When a magnetic field is applied, the heat transfer coefficient of the magnetic fluid is further enhanced.

[0054] In the electric card heat exchange system provided by the embodiment of the present disclosure, the first magnetic fluid pipeline of the first working fluid circulation flow circuit is filled with magnetic fluid, and the magnetic fluid is used as the heat transfer medium, thereby improving the heat transfer effect between the hot end of the electric card refrigeration device 500 and the hot end heat exchanger 610; similarly, the second magnetic fluid pipeline of the second working fluid circulation flow circuit is filled with magnetic fluid, and the magnetic fluid is used as the cold transfer medium, thereby improving the cold transfer effect between the cold end of the electric card refrigeration device 500 and the cold end heat exchanger 710.

[0055] It can be seen that the electric card heat exchange system provided in the embodiment of the present disclosure adopts magnetic fluid as the heat exchange medium, which improves the separation effect of the heat and cold generated by the electric card refrigeration device 500, thereby improving the subsequent utilization rate of the heat and cold generated by the electric card refrigeration device 500.

[0056] Optionally, when the electric card refrigeration device 500 releases heat in the power-on state, the first magnetic element 630 on the first magnetic fluid pipeline is controlled to open to drive the magnetic fluid in the first magnetic fluid pipeline to flow and transfer heat. Specifically, the hot end heat exchanger 610 receives the heat of the hot end of the electric card refrigeration device 500, and transfers the heat to the first terminal heat exchanger 620 through the flow of the magnetic fluid to utilize or dissipate the heat. When the electric card refrigeration device 500 releases cold energy when the power is off, the second magnetic element 730 on the second magnetic fluid pipeline is controlled to open to drive the magnetic fluid in the second magnetic fluid pipeline to flow and transfer cold energy. Specifically, the cold end heat exchanger 710 receives the cold energy of the cold end of the electric card refrigeration device 500, and transfers the cold energy to the second terminal heat exchanger 720 through the flow of the magnetic fluid to utilize or dissipate the cold energy.

[0057] Optionally, the hot end heat exchanger 610 is attached to the hot end of the electric card cooling device 500, and the cold end heat exchanger 710 is attached to the cold end of the electric card cooling device 500, so that the hot end heat exchanger 610, the electric card cooling device 500 and the cold end heat exchanger 710 form a sandwich structure, thereby improving the exchange effect of the hot end heat exchanger 610 and the cold end heat exchanger 710 on the heat and cold generated by the electric card cooling device 500. Figure 1 and Figure 2 shown.

[0058] It can be understood that the first terminal heat exchanger 620 is a terminal heat exchanger that utilizes the heat in the first magnetic fluid pipeline. For example, when the electric card heat exchange system provided by the embodiment of the present disclosure is used for heating, the first terminal heat exchanger 620 is used as an indoor heat exchanger to heat the user's indoor environment. At this time, the cold in the second terminal heat exchanger 720 can be dissipated. Similarly, the second terminal heat exchanger 720 is a terminal heat exchanger that utilizes the cold in the second magnetic fluid pipeline. For example, when the electric card heat exchange system provided by the embodiment of the present disclosure is used for cooling, the second terminal heat exchanger 720 is used as an indoor heat exchanger to cool the user's indoor environment. At this time, the heat in the first terminal heat exchanger 620 can be dissipated.

[0059] Optionally, the hot end heat exchanger 610 includes a first working fluid inlet 611 and a first working fluid outlet 612, and the first terminal heat exchanger 620 includes a second working fluid inlet 621 and a second working fluid outlet 622, wherein the first magnetic fluid pipeline includes a first pipe section connected to the first working fluid outlet 612 and the second working fluid inlet 621, and the first magnetic element 630 is arranged in the first pipe section.

[0060] The first magnetic element 630 is disposed in the first pipe section between the first working fluid outlet 612 and the second working fluid inlet 621, so that the first magnetic element 630 is conducive to driving the magnetic fluid in the hot end heat exchanger 610 in the first working fluid circulation flow path, thereby driving the magnetic fluid to circulate in the first magnetic fluid pipeline. Optionally, the first magnetic element 630 is disposed at the first working fluid outlet 612 of the first pipe section close to the hot end heat exchanger 610.

[0061] Optionally, the aforementioned electric card heat exchange system further includes a first liquid storage element 640, which is disposed in the first pipe section.

[0062] The first pipe section of the first magnetic fluid pipeline is also provided with a first liquid storage element 640 to prevent the magnetic fluid in the first magnetic fluid pipeline from being blocked during the flow process and promote the rapid flow of the magnetic fluid in the first magnetic fluid pipeline. Optionally, the first liquid storage element 640 is a liquid storage tank, and is provided at the second working fluid inlet 621 of the first pipe section close to the first terminal heat exchanger 620.

[0063] The first magnetic fluid pipeline further includes a second pipe section connecting the second working fluid outlet 622 and the first working fluid inlet 611 , wherein the second pipe section is provided with a first pump body 650 for driving the flow of the magnetic fluid.

[0064] The second pipe section of the first magnetic fluid pipeline is also provided with a first pump body 650, which is used to assist in driving the flow of the magnetic fluid in the first magnetic fluid pipeline. Optionally, the first pump body 650 is a micro pump. Optionally, the opening or closing of the first pump body can be controlled according to the flow speed of the magnetic fluid in the first magnetic fluid pipeline. For example, when the flow speed of the magnetic fluid in the first magnetic fluid pipeline is small, the first pump body is opened to assist in driving the flow speed of the magnetic fluid in the first magnetic fluid pipeline.

[0065] Optionally, the cold end heat exchanger 710 includes a third working fluid inlet 711 and a third working fluid outlet 712, and the second terminal heat exchanger 720 includes a fourth working fluid inlet 721 and a fourth working fluid outlet 722, wherein the second magnetic fluid pipeline includes a third pipe section connected to the third working fluid outlet 712 and the fourth working fluid inlet 721, and the second magnetic element 730 is arranged in the third pipe section.

[0066] The second magnetic element 730 is disposed in the third pipe section between the third working fluid outlet 712 and the fourth working fluid inlet 721, so that the second magnetic element 730 is conducive to driving the magnetic fluid in the cold end heat exchanger 710 in the second working fluid circulation flow path, thereby driving the magnetic fluid to circulate in the second magnetic fluid pipeline. Optionally, the second magnetic element 730 is disposed at the third working fluid outlet 712 of the third pipe section close to the cold end heat exchanger 710.

[0067] Optionally, the aforementioned electric card heat exchange system further includes a second liquid storage element 740, which is arranged in the third pipe section.

[0068] The third pipe section of the second magnetic fluid pipeline is also provided with a second liquid storage element 740 to prevent the magnetic fluid in the second magnetic fluid pipeline from being blocked during the flow process and promote the rapid flow of the magnetic fluid in the second magnetic fluid pipeline. Optionally, the second liquid storage element 740 is a liquid storage tank, and is provided at the fourth working fluid inlet 721 of the third pipe section near the second terminal heat exchanger 720.

[0069] Optionally, the second magnetic fluid pipeline further includes a fourth pipe section connecting the fourth working fluid outlet 722 and the third working fluid inlet 711 , wherein the fourth pipe section is provided with a second pump body 750 for driving the flow of the magnetic fluid.

[0070] The second pipe section of the second magnetic fluid pipeline is also provided with a second pump body 750, which is used to assist in driving the flow of the magnetic fluid in the second magnetic fluid pipeline. Optionally, the second pump body 750 is a micro pump. Optionally, the opening or closing of the second pump body can be controlled according to the flow speed of the magnetic fluid in the second magnetic fluid pipeline. For example, when the flow speed of the magnetic fluid in the second magnetic fluid pipeline is small, the second pump body is opened to assist in driving the flow speed of the magnetic fluid in the second magnetic fluid pipeline.

[0071] Optionally, the hot-end heat exchanger 610 or the cold-end heat exchanger 710 is an inner-channel heat exchanger.

[0072] An internal channel heat exchanger can be understood as a heat exchanger in which all or at least a part of the heat exchanger is provided with channels, microchannels, or microchannels, such as a plate heat exchanger, an inflation heat exchanger, a microchannel heat exchanger, and the like.

[0073] The disclosed embodiment of the present invention also discloses a household appliance, including the electric card heat exchange system as described above.

[0074] The disclosed embodiment also provides a household appliance including the aforementioned heat exchange system, and the household appliance may include an air conditioner to heat the room by using the heat emitted by the hot end heat exchanger 610 of the heat exchange system, or to cool the room by using the cold energy emitted by the cold end heat exchanger 710 of the heat exchange system. Optionally, the household appliance may also include refrigeration equipment such as a refrigerator, a freezer, and a display cabinet to cool the inside of the refrigeration equipment by using the cold energy emitted by the cold end heat exchanger 710 of the heat exchange system.

[0075] The disclosed embodiment also provides an electric card refrigeration device that can be applied to the aforementioned electric card heat exchange system or household electrical appliances.

[0076] The electric card refrigeration device includes an electric card refrigeration chip, and the electric card refrigeration chip includes an electric card element, a heat receiving end, and a cold receiving end. The electric card element includes a first electrode layer, a second electrode layer, and a piezoelectric functional film layer. The piezoelectric functional film layer is arranged between the first electrode layer and the second electrode layer. The piezoelectric functional film layer includes a piezoelectric refrigeration zone and a piezoelectric displacement zone formed by partitioning the piezoelectric film layer. The piezoelectric displacement zone is used to drive the piezoelectric refrigeration zone to generate displacement; the heat receiving end is used to receive the heat of the electric card element, and the cold receiving end is used to receive the cold of the electric card element. It can be understood that the hot end in the electric card heat exchange system is the same end as the heat receiving end of the electric card refrigeration chip, and the cold end in the electric card refrigeration system is the same end as the cold receiving end of the electric card refrigeration chip.

[0077] At present, the existing electric card refrigeration system needs to design a movable heat transfer structure to move between the cold end and the hot end in coordination with the application / release of the electric field, so as to achieve the separation of cold and heat. The heat transfer structure cannot be integrated with the electric card refrigeration medium, has a large thermal resistance, and has low heat exchange efficiency.

[0078] An embodiment of the present disclosure provides an electric card component.

[0079] The disclosed embodiment discloses an electric card element 100, in which a piezoelectric film layer of the electric card element 100 is directly partitioned to form a piezoelectric displacement zone, and the piezoelectric displacement zone drives the electric card element 100 to move for heat transfer. A thermal switch is integrated inside the electric card element 100, and the heat exchange efficiency is improved.

[0080] Combination Figure 3 and Figure 4 As shown, the embodiment of the present disclosure provides an electric card element 100, including a first electrode layer 1, a second electrode layer 2 and a piezoelectric functional film layer 4. The piezoelectric functional film layer 4 is arranged between the first electrode layer 1 and the second electrode layer 2. The piezoelectric functional film layer 4 includes a piezoelectric cooling area and a piezoelectric displacement area formed by partitioning the piezoelectric film layer, wherein the piezoelectric displacement area is used to drive the piezoelectric cooling area to generate displacement.

[0081] The electrocaloric element 100 includes a first electrode layer 1, a second electrode layer 2, and a piezoelectric functional film layer 4 disposed between the first electrode layer 1 and the second electrode layer 2. The piezoelectric functional film layer 4 includes a piezoelectric refrigeration zone and a piezoelectric displacement zone. By applying a voltage to the first electrode layer 1 and the second electrode layer 2, an electric field is formed between the first electrode layer 1 and the second electrode layer 2, and different functional zones of the piezoelectric functional film layer 4 correspondingly realize different functional effects. When a positive electric field is applied to the piezoelectric refrigeration zone and the piezoelectric displacement zone at the same time, the piezoelectric functional film layer 4 simultaneously excites the piezoelectric effect and the electrocaloric effect, and a positive displacement and heat release occur; when the piezoelectric refrigeration zone stops applying an electric field and the piezoelectric displacement zone applies a reverse electric field, the piezoelectric refrigeration zone absorbs heat due to the electrocaloric effect, and the piezoelectric displacement zone reversely displaces due to the piezoelectric effect, thereby driving the piezoelectric functional film layer 4 to reversely displace. Through the different functional partitions of the piezoelectric functional film layer 4, the electrocaloric effect releases heat and absorbs heat in opposite directions, effectively realizing the separation of heat and improving the heat exchange efficiency. The piezoelectric functional film layer 4 of the electric card element 100 includes a piezoelectric displacement zone, so that the electric card element 100 integrates a thermal switch form, avoiding a large resistance caused by a movable heat transfer structure of an external device.

[0082] Optionally, a square wave periodic electric field is applied to the piezoelectric displacement region.

[0083] Optionally, the first electrode layer 1 includes a platinum electrode, and / or the second electrode layer 2 includes a platinum electrode, and / or the third electrode layer 3 includes a platinum electrode.

[0084] Optionally, the piezoelectric refrigeration area includes one or more piezoelectric refrigeration units 42 ; and the piezoelectric displacement area includes one or more piezoelectric displacement units 41 .

[0085] When the piezoelectric refrigeration zone includes one piezoelectric refrigeration unit 42 and the piezoelectric displacement zone includes one piezoelectric displacement unit 41, the piezoelectric refrigeration unit 42 and the piezoelectric displacement unit 41 are arranged adjacent to each other, and when the piezoelectric refrigeration zone absorbs heat, the piezoelectric displacement zone drives the piezoelectric refrigeration zone to shift in the opposite direction. When the piezoelectric refrigeration zone includes multiple piezoelectric refrigeration units 42 and the piezoelectric displacement zone includes multiple piezoelectric displacement units 41, the piezoelectric displacement zone can better drive the piezoelectric functional film layer 4 to shift in the opposite direction when the piezoelectric refrigeration zone absorbs heat by setting the relative positions of the multiple piezoelectric refrigeration units 42 and the piezoelectric displacement units 41, thereby achieving the separation of the positions of heat release and heat absorption of the electric card element 100.

[0086] Optionally, the piezoelectric refrigeration area includes a plurality of piezoelectric refrigeration units 42, and the plurality of piezoelectric refrigeration units 42 are arranged in an array. And / or, the piezoelectric displacement area includes a plurality of piezoelectric displacement units 41, and the plurality of piezoelectric displacement units 41 are arranged in an array.

[0087] The multiple piezoelectric cooling units 42 are arranged in an array so that each part of the electric card element 100 can release or absorb heat in a balanced manner, which is convenient for heat to be dissipated during heat release or heat to be absorbed during heat absorption. The multiple piezoelectric displacement units 41 are arranged in an array so that when the electric card element 100 absorbs heat in the piezoelectric cooling area, the force of the piezoelectric displacement area driving the electric card element 100 to displace in the opposite direction is evenly applied to the electric card element 100, so that each part of the electric card element 100 is synchronously displaced in the opposite direction, which is convenient for the electric card element 100 to fit the heat transfer medium.

[0088] Optionally, the piezoelectric refrigeration area includes a plurality of piezoelectric refrigeration units 42, and two adjacent piezoelectric refrigeration units 42 are arranged at intervals. The piezoelectric displacement area includes a plurality of piezoelectric displacement units 41, and two adjacent piezoelectric displacement units 41 are arranged at intervals.

[0089] Two adjacent piezoelectric refrigeration units 42 among the multiple piezoelectric refrigeration units 42 are arranged at intervals, and other functional modules, such as piezoelectric displacement units 41, can be arranged between the two adjacent piezoelectric refrigeration units 42 on the basis of balanced heat release or heat absorption of various parts of the electric card element 100, which is convenient for heat dissipation during heat release or heat entry during heat absorption. Similarly, two adjacent piezoelectric displacement units 41 among the multiple piezoelectric displacement units 41 are arranged at intervals, and other functional modules, such as piezoelectric refrigeration units 42, can be arranged between the two adjacent piezoelectric displacement units 41 on the basis of balanced application of the force of the piezoelectric displacement zone to drive the electric card element 100 to reverse displacement when the electric card element 100 absorbs heat in the piezoelectric refrigeration zone.

[0090] Optionally, the piezoelectric refrigeration units 42 and the piezoelectric displacement units 41 are arranged alternately and spaced apart from each other.

[0091] Multiple piezoelectric refrigeration units 42 and multiple piezoelectric displacement units 41 are alternately arranged with each other. When the piezoelectric refrigeration zone absorbs heat due to the electrocaloric effect, the piezoelectric displacement unit 41 can reversely displace to drive the adjacent piezoelectric refrigeration unit 42 to reversely displace, thereby causing the electrocaloric element 100 to reversely displace and have a high degree of flatness after displacement, which facilitates the electrocaloric element 100 to fit with the heat transfer medium for heat transfer.

[0092] Optionally, the piezoelectric refrigeration area includes a first piezoelectric refrigeration unit 42, and the piezoelectric displacement area includes a first piezoelectric displacement unit 41 adjacent to the first piezoelectric refrigeration unit 42. The length of the first piezoelectric refrigeration unit 42 is greater than or equal to the length of the first piezoelectric displacement unit 41; or, the width of the first piezoelectric refrigeration unit 42 is greater than or equal to the width of the first piezoelectric displacement unit 41; or, the area of ​​the first piezoelectric refrigeration unit 42 is greater than or equal to the area of ​​the first piezoelectric displacement unit 41.

[0093] The piezoelectric functional film layer 4 is a thin film layer structure, and the length, width or area can be understood as size. Therefore, it can be understood that the adjacent first piezoelectric refrigeration unit 42 is larger than the first piezoelectric displacement unit 41, thereby increasing the heat release or heat absorption of the electric card element 100.

[0094] Optionally, the piezoelectric functional film layer 4 includes a first piezoelectric functional surface and a second piezoelectric functional surface opposite to the first piezoelectric functional surface, wherein the first piezoelectric functional surface includes a piezoelectric refrigeration area and a piezoelectric displacement area, and the second piezoelectric functional surface only includes a piezoelectric refrigeration area.

[0095] The piezoelectric functional film layer 4 is a thin film layer structure with a thickness, and the thin film layer includes a first sub-film layer and a second sub-film layer that are bonded to each other. The first piezoelectric functional surface corresponds to the first sub-film layer, including a piezoelectric refrigeration zone and a piezoelectric displacement zone; the second piezoelectric functional surface corresponds to the second sub-film layer, including only a piezoelectric refrigeration zone, without a piezoelectric displacement zone. The first sub-film layer and the second sub-film layer are understood as a whole, that is, the piezoelectric functional film layer 4 forms a piezoelectric displacement zone embedded structure. The piezoelectric displacement zone embedded structure increases the size of the piezoelectric refrigeration zone in the piezoelectric functional film layer 4, thereby increasing the heat release or heat absorption of the electric card element 100.

[0096] Optionally, a separation gap for separating the two functional unit areas is provided between adjacent piezoelectric cooling units 42 and piezoelectric displacement units 41. Providing the separation gap can partition the functional unit area so that the piezoelectric cooling unit 42 can excite the electrocaloric effect and the piezoelectric displacement unit 41 can excite the piezoelectric effect without affecting each other.

[0097] Optionally, the distinguishing gap is in a strip shape, a grid shape or an irregular shape. It can be understood that the shape of the distinguishing gap is not specifically limited, and the two functional units on both sides of the distinguishing gap can be separated to realize different functional unit partitions.

[0098] Optionally, the distinguishing gap is an air gap.

[0099] Optionally, the segmented gaps include a first segmented gap, a second segmented gap and a third segmented gap which are sequentially arranged, wherein a first piezoelectric refrigeration unit 42 is arranged between the first segmented gap and the second segmented gap, and a first piezoelectric displacement unit 41 is arranged between the second segmented gap and the third segmented gap.

[0100] It can be understood that the first dividing gap, the first piezoelectric refrigeration unit 42, the second dividing gap, the first piezoelectric displacement unit 41 and the third dividing gap are arranged in sequence, that is, dividing gaps are arranged between adjacent piezoelectric refrigeration units 42 and piezoelectric displacement units 41 to avoid mutual influence between different functional units.

[0101] Optionally, the partitioning gap includes an etched partitioning gap formed by etching. The partitioning gap is formed by etching, which has a simple process and enables the electrocaloric element 100 to simultaneously integrate different functional units of the electrocaloric effect and the piezoelectric effect.

[0102] Optionally, the piezoelectric displacement zone includes a through-type piezoelectric displacement unit 41, wherein the through-type piezoelectric displacement unit 41 includes a first through-type partition gap 431 and a second through-type partition gap 433, wherein the first through-type partition gap 431 and the second through-type partition gap 433 both penetrate the piezoelectric film layer; and, a first through-type piezoelectric displacement unit 432 is arranged between the first through-type partition gap 431 and the second through-type partition gap 433.

[0103] Figure 4 FIG. 1 shows an electric card element 100 including a through-type piezoelectric displacement unit 41. The through-type piezoelectric displacement unit 41 includes a first through-type partition gap 431, a first through-type piezoelectric displacement unit 432, and a second through-type partition gap 433, which are arranged in sequence. Figure 4 As shown in , the first through-division gap 431 and the second through-division gap 433 are at the same height as the first through-division gap 432, that is, the first through-division gap 431 and the second through-division gap 433 both penetrate the piezoelectric film layer. This arrangement can avoid the first through-division gap 432 from interfering with the piezoelectric refrigeration units 42 adjacent on both sides. In addition, by setting the piezoelectric displacement zone as the through-type piezoelectric displacement unit 41, the piezoelectric displacement zone and the piezoelectric refrigeration zone can share the second electrode layer 2. In the preparation method, the preparation of the electrode layer only requires etching the first electrode layer 1, and no secondary etching of the electrode layer is required.

[0104] Specifically, a forward voltage is applied to the first electrode layer 1 and the second electrode layer 2, and a forward electric field is formed between the first electrode layer 1 and the second electrode layer 2. At this time, the piezoelectric displacement zone and the piezoelectric refrigeration zone of the piezoelectric functional film layer 4 simultaneously stimulate the electrocaloric effect and the piezoelectric effect, and the electrocaloric element 100 displaces forward and releases heat. Afterwards, the electrocaloric refrigeration electrode zone 11 in the first electrode layer 1 is powered off, that is, the corresponding electric field of the piezoelectric refrigeration zone is removed, and the piezoelectric refrigeration zone stimulates the electrocaloric effect to absorb heat; a reverse voltage is applied to the piezoelectric driving electrode zone 12 in the first electrode layer 1 and the second electrode layer 2, and a reverse electric field is formed between the first electrode layer 1 and the second electrode layer 2, and the piezoelectric displacement zone stimulates the piezoelectric effect to reversely displace. The electrocaloric element 100 releases heat and displaces forward, and absorbs heat and displaces reversely, realizing heat separation.

[0105] Optionally, the electric card element 100 further includes a base layer 5 . The base layer 5 is disposed below the second electrode layer 2 .

[0106] The piezoelectric functional film layer 4, the first electrode layer 1 and the second electrode layer 2 are combined to form a thin film structure. A base layer 5 is provided under the second electrode layer 2 of the electric card element 100 to support the thin film structure and provide an operating platform during preparation. The provision of the base layer 5 can also maintain the flatness of the electric card element 100, so that the electric card element 100 can be close to the heat transfer medium when transferring heat.

[0107] Optionally, the first electrode layer 1 is provided with an electrode gap 13, and the electrode gap 13 divides the first electrode layer 1 into an electric card cooling electrode area 11 and a piezoelectric driving electrode area 12. Among them, the electric card cooling electrode area 11 corresponds to the piezoelectric cooling area, and the piezoelectric driving electrode area 12 corresponds to the piezoelectric displacement area. A positive electric field is applied to the electric card cooling electrode area 11 and the piezoelectric driving electrode area 12, so that the piezoelectric displacement area and the piezoelectric cooling area produce displacement in the first direction; or, the electric field of the electric card cooling motor area is removed, and the piezoelectric cooling area of ​​the piezoelectric functional film layer 4 absorbs heat. At the same time, a reverse electric field is applied to the piezoelectric driving electrode area 12, so that the piezoelectric displacement area drives the heat-absorbing piezoelectric cooling area to produce displacement in the second direction.

[0108] Corresponding to the two different functional units of the piezoelectric refrigeration area and the piezoelectric displacement area, different electric fields need to be applied to the electrodes to stimulate different functional effects. Therefore, the first electrode layer 1 is provided with an electrode gap 13, so that the first electrode layer 1 is separated to form an electric card refrigeration electrode area 11 corresponding to the piezoelectric refrigeration area and a piezoelectric driving electrode area 12 corresponding to the piezoelectric displacement area, and different electric fields are applied to the electric card refrigeration electrode area 11 and the second electrode layer 2 and the piezoelectric driving electrode area 12 and the second electrode layer 2 to achieve the stimulation of different functional effects.

[0109] Optionally, the electrode gap 13 is arranged corresponding to the partition gap.

[0110] Optionally, the electrode gap 13 is connected to the partition gap to form a through gap. The electrode gap 13 corresponds to the partition gap, and when different electric fields are applied to different areas of the first electrode layer 1, different functional effects can be stimulated in the functional areas corresponding to the electrode areas. Furthermore, the electrode gap 13 is connected to the partition gap so that adjacent different functional units do not affect each other.

[0111] In the electric card cooling chip disclosed in the embodiment of the present disclosure, the piezoelectric film layer of the electric card element 100 is directly partitioned to form a piezoelectric displacement zone, and the electric card element 100 is driven to move by the piezoelectric displacement zone. The clamping frame clamps the electric card element 100 so that the electric card element 100 releases heat and adheres to the heat receiving end 300, and absorbs heat and adheres to the cold receiving end 400. The electric card cooling chip has a self-integrated hot and cold separation structure, and its stability is enhanced.

[0112] Combination Figures 5 to 7 As shown, the embodiment of the present disclosure provides an electric card refrigeration chip, including an electric card element 100, a clamping frame, a heat receiving end 300 and a cold receiving end 400. The electric card element 100 includes a first electrode layer 1, a second electrode layer 2, and a piezoelectric functional film layer 4. The piezoelectric functional film layer 4 is arranged between the first electrode layer 1 and the second electrode layer 2. The piezoelectric functional film layer 4 includes a piezoelectric refrigeration zone and a piezoelectric displacement zone formed by partitioning the piezoelectric film layer, wherein the piezoelectric displacement zone is used to drive the piezoelectric refrigeration zone to generate displacement. The clamping frame includes a first clamping frame 201 clamped on the first side of the first end of the electric card element 100, and a second clamping frame 202 clamped on the second side of the first end of the electric card element 100. The heat receiving end 300 is arranged on the side of the first clamping frame 201, and is used to receive the heat of the electric card element 100. The cold receiving end 400 is arranged on the side of the second clamping frame 202, and is used to receive the cold of the electric card element 100.

[0113] The electric card refrigeration chip includes an electric card element 100. The piezoelectric film layer of the electric card element 100 is directly divided into piezoelectric displacement zones, and the piezoelectric displacement zones drive the electric card element 100 to move. At the same time, a heat receiving end 300 and a cold receiving end 400 are respectively arranged on both sides of the electric card element 100, and the first end of the electric card element 100 is clamped in a clamping frame. When a positive electric field is applied to the piezoelectric refrigeration zone and the piezoelectric displacement zone at the same time, the piezoelectric functional film layer 4 synchronously excites the piezoelectric effect and the electrocaloric effect, and a positive displacement and heat release occur. The clamping frame clamps the electric card element 100 so that the electric card element 100 fits the heat receiving end 300, as shown in FIG. Figure 6 When the piezoelectric cooling area stops applying the electric field and the piezoelectric displacement area applies the reverse electric field, the piezoelectric cooling area absorbs heat due to the electrocaloric effect, and the piezoelectric displacement area reversely displaces due to the piezoelectric effect, thereby driving the piezoelectric functional film layer 4 to reversely displace, and the clamping frame clamps the electrocaloric element 100 so that the electrocaloric element 100 fits the cold receiving end 400. Figure 7 The electric card refrigeration chip has a self-integrated hot and cold separation structure, which enhances stability.

[0114] It can be understood that the electric card component 100 in the electric card refrigeration chip is the electric card component 100 in the form of the aforementioned internal integrated thermal switch.

[0115] Optionally, the electric card element 100 further includes a base layer 5 disposed below the second electrode layer 2 . The first clamping frame 201 is disposed on the first electrode layer 1 of the electric card element 100 , and the second clamping frame 202 is disposed on the base layer 5 of the electric card element 100 .

[0116] The piezoelectric functional film layer 4, the first electrode layer 1 and the second electrode layer 2 are combined to form a thin film structure, and a base layer 5 is provided under the second electrode layer 2 of the electric card element 100 to support the thin film structure. The provision of the base layer 5 can also maintain the flatness of the electric card element 100, so that the electric card element 100 can be close to the heat transfer medium when transferring heat. Correspondingly, the first clamping frame 201 is provided above the first electrode layer 1 of the electric card element 100, and the second clamping frame 202 is provided below the base layer 5 of the electric card element 100.

[0117] Optionally, a first bending gap 203 is provided between the first side of the electric card element 100 and the heat receiving end 300. The first bending gap 203 is used to bend the first side of the electric card element 100 toward the heat receiving end 300 and fit the heat receiving end 300. And / or, a second bending gap 204 is provided between the second side of the electric card element 100 and the cold receiving end 400. The second bending gap 204 is used to bend the second side of the electric card element 100 toward the cold receiving end 400 and fit the cold receiving end 400.

[0118] The setting of the first bending gap 203 and the second bending gap 204 increases the volume of the electric card refrigeration chip. The thickness of the first bending gap 203, the thickness of the electric card element 100 and the thickness of the second bending gap 204 are the spacing between the heat receiving end 300 and the cold receiving end 400, which increases the cold and heat separation distance of the electric card element 100, making it easier for the electric card refrigeration chip to be actually used in household appliances.

[0119] Optionally, the first electrode layer 1 includes a first clamping portion disposed at the end and used to clamp the first clamping frame 201, and a first fitting portion extending along the first clamping portion. The first bending gap 203 is disposed between the first fitting portion and the heat receiving end 300. And / or, the base layer 5 includes a second clamping portion disposed at the end and used to clamp the second clamping frame 202, and a second fitting portion extending along the second clamping portion. The second bending gap 204 is disposed between the second fitting portion and the cold receiving end 400.

[0120] The first electrode layer 1 includes a first clamping portion and a first fitting portion extending along the first clamping portion, wherein the first clamping portion is located at the end of the first electrode layer 1. The first clamping portion is used to fit with the first clamping frame 201. The first clamping frame 201 is set between the first clamping portion and the heat receiving end 300. The first clamping frame 201 plays the role of clamping the first side of the end of the electric card element 100 and supporting the electric card element 100 to construct the first bending gap 203. Similarly, the base layer 5 includes a second clamping portion and a second fitting portion extending along the second clamping portion, wherein the second clamping portion is located at the end of the base layer 5. The second clamping portion is used to fit with the second clamping frame 202. The second clamping portion and the cold receiving end 400 are set at the second clamping frame 202. The second clamping frame 202 plays the role of clamping the second side of the end of the electric card element 100 and supporting the electric card element 100 to construct the second bending gap 204.

[0121] Optionally, the electric card refrigeration chip further includes a support frame 205. The support frame 205 is supported between the heat receiving end 300 and the cold receiving end 400, and the support frame 205 is disposed at the second end of the electric card element 100.

[0122] The first end of the electric card element 100 is clamped by the first clamping frame 201 and the second clamping frame 202, and the first clamping frame 201 and the second clamping frame 202 simultaneously support the first end of the electric card refrigeration chip. At the same time, the second end of the electric card refrigeration chip also needs to be provided with a supporting frame for support. One end of the supporting frame 205 abuts against the heat receiving end 300, and the other end abuts against the cold receiving end 400, thereby supporting the second end of the electric card refrigeration chip.

[0123] Optionally, the second end of the electric card element 100 abuts against the support frame 205 ; or, a gap is provided between the second end of the electric card element 100 and the support frame 205 .

[0124] The second end of the electric card element 100 may abut against the support frame 205, or a gap may be left. Figure 5 and Figure 7 As shown, the second end of the electric card element 100 in the electric card cooling chip is not fixed, and the electric card element 100 is displaced to fit with the heat receiving end 300 when releasing heat, and is displaced to fit with the cold receiving end 400 when absorbing heat, forming a cantilever beam structure. Compared with the arrangement of the electric card element 100 with both ends clamped, the cantilever beam structure has a larger area of ​​fit between the electric card element 100 and the heat receiving end 300 or the cold receiving end 400, and the heat transfer efficiency is improved.

[0125] Optionally, the heat receiving end 300 includes an insulating heat conductive layer, and / or the cold receiving end 400 includes an insulating heat conductive layer. The heat receiving end 300 and / or the cold receiving end 400 are insulated to prevent the current leakage of the first electrode layer 1 or the second electrode layer 2 from causing loss. The heat receiving end 300 and / or the cold receiving end 400 are heat conductive and can export the heat or cold of the electric card element 100.

[0126] Optionally, the insulating heat-conducting layer includes aluminum nitride / silicon carbide (AlN / SiC) composite ceramic.

[0127] Optionally, the first clamping frame 201, the second clamping frame 202, and / or the supporting frame 205 include an insulating frame. The insulation of each frame can allow energy to be extracted from the heat receiving end 300 or the cold receiving end 400, thereby improving the heat and cold separation efficiency of the electric card refrigeration chip.

[0128] Optionally, the insulating and heat-insulating skeleton comprises an alumina skeleton.

[0129] In some embodiments, the electric card cooling device 520 includes one or more of the aforementioned electric card cooling chips. Multiple electric card cooling chips can increase the heat or cold capacity of the electric card cooling device 520, making it easier for the electric card cooling device 520 to be used in large-scale equipment.

[0130] When the electric card cooling device 520 includes multiple electric card cooling chips, the multiple electric card cooling chips can be arranged in an array, so that each part of the electric card cooling device 520 can release or absorb heat evenly, and the electric card cooling device 520 forms a square structure, which is convenient for the electric card cooling device 520 to be used in large equipment.

[0131] Optionally, the first electrode layer 1 is provided with an electrode gap 13, and the electrode gap 13 divides the first electrode layer 1 into an electric card cooling electrode area 11 and a piezoelectric driving electrode area 12, wherein the electric card cooling electrode area 11 corresponds to the piezoelectric cooling area, and the piezoelectric driving electrode area 12 corresponds to the piezoelectric displacement area. The electric card cooling device 520 also includes an external power supply, wherein the external power supply is used to: apply a positive electric field to the electric card cooling electrode area 11 and the piezoelectric driving electrode area 12, so that the piezoelectric displacement area and the piezoelectric cooling area produce displacement in a first direction; or, remove the electric field of the electric card cooling motor area, and the piezoelectric cooling area of ​​the piezoelectric functional film layer 4 absorbs heat, and at the same time, apply a reverse electric field to the piezoelectric driving electrode area 12, so that the piezoelectric displacement area drives the heat-absorbing piezoelectric cooling area to produce displacement in a second direction.

[0132] Corresponding to the two different functional units of the piezoelectric cooling area and the piezoelectric displacement area, different electric fields need to be applied to the electrodes to stimulate different functional effects. Therefore, the first electrode layer 1 is provided with an electrode gap 13, so that the first electrode layer 1 is separated to form an electric card cooling electrode area 11 corresponding to the piezoelectric cooling area and a piezoelectric driving electrode area 12 corresponding to the piezoelectric displacement area, and different electric fields are applied to the electric card cooling electrode area 11 and the second electrode layer 2 and the piezoelectric driving electrode area 12 and the second electrode layer 2 to achieve the stimulation of different functional effects. Figures 5 to 7 As shown, a positive electric field is applied to the electric card cooling electrode area 11 and the piezoelectric driving electrode area 12, so that the piezoelectric displacement area and the piezoelectric cooling area generate displacement in a first direction, that is, Figure 6 The electric card element 100 releases heat and fits the heat receiving end 300; the electric field of the electric card refrigeration motor area is removed, and the piezoelectric refrigeration area of ​​the piezoelectric functional film layer 4 absorbs heat. At the same time, a reverse electric field is applied to the piezoelectric driving electrode area 12, so that the piezoelectric displacement area drives the heat-absorbing piezoelectric refrigeration area to generate a displacement in the second direction, that is, Figure 7 Moving downward, the electric card element 100 absorbs heat and fits the cold receiving end 400 .

[0133] The above description and the accompanying drawings sufficiently illustrate the embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Unless explicitly required, individual components and functions are optional, and the order of operations may vary. Portions and features of some embodiments may be included in or replace portions and features of other embodiments. The embodiments of the present disclosure are not limited to the structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. An electric card heat exchange system, characterized in that: include: Electric card refrigeration devices generate heat and cold alternately, including hot and cold ends; The first working fluid circulation flow path includes a hot end heat exchanger and a first terminal heat exchanger connected by a first magnetic fluid pipeline, and the hot end heat exchanger is attached to the hot end of the electric card refrigeration device; and, The second working medium circulation flow path includes a cold end heat exchanger and a second terminal heat exchanger connected by a second magnetic fluid pipeline, and the cold end heat exchanger is attached to the cold end of the electric card refrigeration device. The first magnetic fluid pipeline is provided with a first magnetic element for driving the flow of the magnetic fluid, and the second magnetic fluid pipeline is provided with a second magnetic element for driving the flow of the magnetic fluid.

2. The electric card heat exchange system according to claim 1, characterized in that: The hot end heat exchanger includes a first working fluid inlet and a first working fluid outlet, and the first terminal heat exchanger includes a second working fluid inlet and a second working fluid outlet. The first magnetic fluid pipeline includes a first pipe section connected to the first working fluid outlet and the second working fluid inlet, and the first magnetic element is arranged in the first pipe section.

3. The electric card heat exchange system according to claim 2, characterized in that: Also includes: The first liquid storage element is arranged in the first pipe section.

4. The electric card heat exchange system according to claim 2, characterized in that: The first magnetic fluid pipeline also includes a second pipe section connecting the second working fluid outlet and the first working fluid inlet. The second pipe section is provided with a first pump body for driving the flow of magnetic fluid.

5. The electric card heat exchange system according to claim 2, characterized in that: The cold end heat exchanger includes a third working fluid inlet and a third working fluid outlet, and the second terminal heat exchanger includes a fourth working fluid inlet and a fourth working fluid outlet. The second magnetic fluid pipeline includes a third pipe section connected to the third working fluid outlet and the fourth working fluid inlet, and the second magnetic element is arranged in the third pipe section.

6. The electric card heat exchange system according to claim 5, characterized in that: Also includes: The second liquid storage element is arranged in the third pipe section.

7. The electric card heat exchange system according to claim 5, characterized in that: The second magnetic fluid pipeline also includes a fourth pipe section connecting the fourth working fluid outlet and the third working fluid inlet. The fourth pipe section is provided with a second pump body for driving the flow of magnetic fluid.

8. The electric card heat exchange system according to claim 1, characterized in that: The hot end heat exchanger or the cold end heat exchanger is an internal flow channel heat exchanger.

9. The electric card heat exchange system according to any one of claims 1 to 8, characterized in that: The electric card refrigeration device includes an electric card refrigeration chip, and the electric card refrigeration chip includes: The electric card element comprises a first electrode layer, a second electrode layer, and a piezoelectric functional film layer, wherein the piezoelectric functional film layer is arranged between the first electrode layer and the second electrode layer, and the piezoelectric functional film layer comprises a piezoelectric refrigeration area and a piezoelectric displacement area formed by partitioning the piezoelectric film layer, and the piezoelectric displacement area is used to drive the piezoelectric refrigeration area to generate displacement; A heat receiving end, used to receive heat from the electric card component; and, The cold energy receiving end is used to receive the cold energy of the electric card component.

10. A household appliance, characterized in that: It comprises the electric card heat exchange system as described in any one of claims 1 to 9.

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