Electric card heat exchange device and heat exchange system

Abstract

The utility model relates to the technical field of refrigeration, and discloses an electrocaloric heat exchange device which comprises a first electrocaloric heat exchange unit, and the first electrocaloric heat exchange unit comprises a first electrocaloric device and a second electrocaloric device. The first hot end heat conduction film layer receives heat generated by the first electric card device; the first cold end heat conduction film layer receives cold energy generated by the first electrocaloric device; and a driving assembly. When the first electric card device generates heat, the driving assembly drives the first hot end heat conduction film layer to be attached to the first electric card device, and when the first electric card device generates cold energy, the driving assembly drives the first cold end heat conduction film layer to be attached to the first electric card device. According to the electrocaloric heat exchange device provided by the embodiment of the utility model, the heat and cold separation effect of the first electrocaloric device is improved. The invention further provides a heat exchange system comprising the electric card heat exchange device.

Description

Technical Field

[0001] The present application relates to the field of refrigeration technology, for example, to an electric card heat exchange device and a heat exchange system. Background Art

[0002] Current refrigerators and other refrigeration equipment are mainly based on the vapor compression principle and require fluorine-containing refrigerants for heat transfer. During use, the refrigerant is prone to leak and pollute the environment.

[0003] With the development of science and technology, some new solid-state refrigeration technologies have gradually emerged, which are expected to replace traditional steam compressor refrigeration. Solid-state refrigeration technologies include electrocaloric refrigeration, thermoelectric refrigeration, magnetic refrigeration, elastic caloric refrigeration, etc. When an electric field is applied or removed on an electrocaloric material, the electrocaloric material will absorb or release heat, which is the electrocaloric effect. Electrocaloric refrigeration devices are new refrigeration technologies based on the electrocaloric effect of electrocaloric materials. Electrocaloric refrigeration devices can be used for cooling or heating, and can be applied to household appliances such as refrigerators, freezers or air conditioners.

[0004] Electric card refrigeration devices do not need to use the compressors and fluorine-containing refrigerants required by common refrigeration technology, which delays the occurrence of the greenhouse effect and avoids environmental pollution caused by leakage of fluorine-containing refrigerants.

[0005] In the process of implementing the embodiments of the present disclosure, it is found that there are at least the following problems in the related art:

[0006] The electric card device generates heat and cold alternately, and the heat and cold generated by the electric card device need to be separated so that the cold generated by the electric card device can be utilized, thereby enabling the electric card device to achieve a cooling effect. However, the existing electric card device has a poor effect of separating cold and heat.

[0007] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present application, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Utility Model Content

[0008] In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. The summary is not an extensive review, nor is it intended to identify key / critical components or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.

[0009] An embodiment of the present disclosure provides an electric card heat exchange device.

[0010] In some embodiments, the electric card heat exchange device includes a first electric card heat exchange unit, wherein the first electric card heat exchange unit includes: a first electric card device that can alternately generate heat and cold; a first hot-end thermal conductive film layer that can be attached to the first electric card device to receive the heat generated by the first electric card device; a first cold-end thermal conductive film layer that can be attached to the first electric card device to receive the cold generated by the first electric card device; and a driving component that is drivingly connected to the first electric card device, or drivingly connected to the first hot-end thermal conductive film layer and the first cold-end thermal conductive film layer, wherein when the first electric card device generates heat, the driving component drives the first hot-end thermal conductive film layer to fit with the first electric card device, and when the first electric card device generates cold, the driving component drives the first cold-end thermal conductive film layer to fit with the first electric card device.

[0011] In some optional embodiments, the first electric card heat exchange unit further includes: a first chip fixing partition, which is provided with one or more first mounting positions, wherein the first electric card device is arranged at the first mounting position.

[0012] In some optional embodiments, the first hot-end thermally conductive film layer, the first cold-end thermally conductive film layer and the first electric card device are arranged in parallel; and / or, the first hot-end thermally conductive film layer, the first electric card device and the first cold-end thermally conductive film layer are arranged in sequence.

[0013] In some optional embodiments, the first chip fixing partition includes a first hot end fixing surface and a first cold end fixing surface, and the first electric card device includes a first electric card surface located on the first hot end fixing surface side and a second electric card surface located on the first cold end fixing surface side, wherein the first electric card surface protrudes from the first hot end fixing surface and the second electric card surface protrudes from the first cold end fixing surface.

[0014] In some optional embodiments, the first hot-end thermally conductive film layer includes a first hot-end thermally conductive surface that is in contact with the first electric card surface, wherein the area of ​​the first hot-end thermally conductive surface is greater than or equal to the area of ​​the first electric card surface; and / or, the first cold-end thermally conductive film layer includes a first cold-end thermally conductive surface that is in contact with the second electric card surface, wherein the area of ​​the first cold-end thermally conductive surface is greater than or equal to the area of ​​the second electric card surface.

[0015] In some optional embodiments, the electric card heat exchange device also includes: a second electric card heat exchange unit, including a second hot end heat conductive film layer, a second chip fixing partition and a second cold end heat conductive film layer, wherein an insulating partition is arranged between the first electric card heat exchange unit and the second electric card heat exchange unit.

[0016] In some optional embodiments, the driving component includes a first driving element and a second driving element, wherein the first driving element includes a first connecting end, and the first connecting end is drivingly connected to the first hot end thermal conductive film layer and the second hot end thermal conductive film layer, and the second driving element includes a second connecting end, and the second connecting end is drivingly connected to the first cold end thermal conductive film layer and the second cold end thermal conductive film layer.

[0017] In some optional embodiments, the first hot-end heat-conductive film layer includes a first frame arranged at the outer edge of the first hot-end heat-conductive surface, and the second hot-end heat-conductive film layer includes a second frame arranged at the outer edge of the second hot-end heat-conductive surface, wherein the first connecting end is connected to the first frame and the second frame; the first cold-end heat-conductive film layer includes a third frame arranged at the outer edge of the first cold-end heat-conductive surface, and the second cold-end heat-conductive film layer includes a fourth frame arranged at the outer edge of the second cold-end heat-conductive surface, wherein the second connecting end is connected to the third frame and the fourth frame.

[0018] In some optional embodiments, the first hot-end thermally conductive film layer includes a carbon film layer, a graphite film layer or a graphene film layer; and / or the first cold-end thermally conductive film layer includes a carbon film layer, a graphite film layer or a graphene film layer.

[0019] The disclosed embodiment also provides a heat exchange system.

[0020] In some embodiments, the heat exchange system includes the electric card heat exchange device as described above.

[0021] The electric card heat exchange device and heat exchange system provided by the embodiments of the present disclosure can achieve the following technical effects:

[0022] The electric card heat exchange device provided in the embodiment of the present disclosure includes a first electric card heat exchange unit, and the first electric card heat exchange unit includes a first electric card device, a first hot end heat conductive film layer, a first cold end heat conductive film layer, and a driving component that plays a driving motion role. Among them, the first electric card device can alternately generate heat and cold, and the driving component is used to drive the first electric card device to move, or to drive the first hot end heat conductive film layer and the first cold end heat conductive film layer to move. When the first electric card device generates heat, the driving component drives the first electric card device to fit with the first hot end heat conductive film layer, so that the first hot end heat conductive film layer can receive the heat generated by the first electric card device, thereby realizing the separation of the heat generated by the first electric card device; when the first electric card device generates cold, the driving component drives the first electric card device to fit with the first cold end heat conductive film layer, so that the first cold end heat conductive film layer can receive the cold generated by the first electric card device, thereby realizing the separation of the cold generated by the first electric card device.

[0023] It can be seen that in the electric card heat exchange device provided by the embodiment of the present disclosure, when the first electric card device alternately generates heat and cold, the driving component correspondingly drives the first electric card device to fit with the first hot-end heat-conductive film layer, or drives the first electric card device to fit with the first cold-end heat-conductive film layer, so that the first hot-end heat-conductive film layer and the first cold-end heat-conductive film layer respectively receive the heat and cold generated by the first electric card device, thereby realizing the separation of the heat and cold generated by the first electric card device, and improving the separation effect of the heat and cold generated by the first electric card device.

[0024] The above general description and the following description are exemplary and explanatory only and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] One or more embodiments are exemplarily described by corresponding drawings, which do not limit the embodiments. Devices with the same reference numerals in the drawings are shown as similar devices, and the drawings do not constitute a scale limitation, and wherein:

[0026] Figure 1 is a schematic diagram of an electric card heat exchange device provided by an embodiment of the present disclosure;

[0027] Figure 2 is a schematic diagram of another electric card heat exchange device provided by an embodiment of the present disclosure;

[0028] Figure 3 is a schematic diagram of a first electric card heat exchange unit provided in an embodiment of the present disclosure;

[0029] Figure 4 is a schematic diagram of another first electric card heat exchange unit provided in an embodiment of the present disclosure;

[0030] Figure 5 is a schematic diagram of a first hot end heat conductive film layer provided by an embodiment of the present disclosure;

[0031] Figure 6 is a schematic diagram of another electric card heat exchange device provided by an embodiment of the present disclosure;

[0032] Figure 7 yes Figure 6 A magnified view of a selected portion;

[0033] Figure 8 is a schematic diagram of another electric card heat exchange device provided by an embodiment of the present disclosure;

[0034] Fig. 9 is a schematic diagram of a hot end heat conductive film layer provided in an embodiment of the present disclosure;

[0035] Fig.10 is a schematic diagram of a first chip fixing partition provided in an embodiment of the present disclosure;

[0036] Fig.11 is a schematic diagram of a heat insulation partition provided by an embodiment of the present disclosure;

[0037] Fig.12 is a schematic diagram of another electric card heat exchange device provided by an embodiment of the present disclosure;

[0038] Fig.13 It is a schematic diagram of another electric card heat exchange device provided in an embodiment of the present disclosure.

[0039] Reference numerals:

[0040] 100: first electric card heat exchange unit; 200: second electric card heat exchange unit;

[0041] 101: box;

[0042] 11: first electric card device; 12: second electric card device;

[0043] 21: first hot end heat conductive film layer; 2101: first hot end heat conductive surface; 2102: first frame; 2103: first hot end connecting portion; 211: first hot end extending portion; 212: first hot end bonding portion; 22: second hot end heat conductive film layer;

[0044] 31: first cold end heat conductive film layer; 311: first cold end bonding portion; 312: first cold end extension portion; 32: second cold end heat conductive film layer;

[0045] 4: first driving element; 41: first connecting end;

[0046] 5: second driving element; 51: second connecting end;

[0047] 61: first chip fixing partition; 611: first avoidance groove; 612: second avoidance groove;

[0048] 62: second chip fixing partition;

[0049] 711: first evaporation end; 712: first condensation end; 713: first insulation section; 701: first confluence section; 721: third evaporation end; 723: third insulation section;

[0050] 811: second condensation end; 812: second evaporation end; 813: second insulation section; 821: fourth condensation end; 823: fourth insulation section; 801: second confluence section;

[0051] 91: heat insulation baffle; 911: third avoidance groove; 912: fourth avoidance groove. DETAILED DESCRIPTION

[0052] In order to be able to understand the features and technical contents of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. The attached drawings are for reference only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the convenience of explanation, a full understanding of the disclosed embodiments is provided through multiple details. However, one or more embodiments can still be implemented without these details. In other cases, to simplify the drawings, well-known structures and devices can be simplified for display.

[0053] The terms "first", "second", etc. in the specification and claims of the disclosed embodiments and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchanged where appropriate to describe the disclosed embodiments here. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0054] In the embodiments of the present disclosure, the terms "upper", "lower", "inside", "middle", "outside", "front", "back" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. These terms are mainly intended to better describe the embodiments of the present disclosure and their embodiments, and are not intended to limit the indicated devices, components or components to have a specific direction, or to be constructed and operated in a specific direction. Moreover, in addition to being used to indicate directions or positional relationships, some of the above terms may also be used to indicate other meanings. For example, the term "upper" may also be used to indicate a certain dependency or connection relationship in certain circumstances. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0055] In addition, the terms "disposed", "connected", and "fixed" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, components, or components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to the specific circumstances.

[0056] Unless otherwise stated, the term "plurality" means two or more.

[0057] The term "and / or" is a description of the association relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or, A and B.

[0058] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.

[0059] The electrocaloric effect is a kind of hot and cold effect of ferroelectric materials under electric field, which releases heat when electric field is applied and absorbs heat when electric field is removed. Ferroelectric thin film applies high electric field through electrodes on both sides to stimulate periodic electrocaloric effect. Electrocaloric cooling device, also referred to as electrocaloric device, is a device based on electrocaloric effect, which releases heat and generates heat when electric field is applied and absorbs heat and generates cold when electric field is removed.

[0060] The present disclosure provides an electric card heat exchange device, such as Figures 1 to 13 shown.

[0061] The electric card heat exchange device provided in the embodiment of the present disclosure includes a first electric card heat exchange unit 100. The first electric card heat exchange unit 100 includes a first electric card device 11, a first hot end heat conductive film layer 21, a first cold end heat conductive film layer 31 and a driving component. The first electric card device 11 can generate heat and cold alternately; the first hot end heat conductive film layer 21 can be attached to the first electric card device 11 to receive the heat generated by the first electric card device 11; the first cold end heat conductive film layer 31 can be attached to the first electric card device 11 to receive the cold generated by the first electric card device 11; and, the driving component is drivingly connected to the first electric card device 11, or the driving component is drivingly connected to the first hot end heat conductive film layer 21 and the first cold end heat conductive film layer 31. When the first electric card device 11 generates heat, the driving component drives the first hot end thermal conductive film layer 21 to fit with the first electric card device 11 ; when the first electric card device 11 generates cold, the driving component drives the first cold end thermal conductive film layer 31 to fit with the first electric card device 11 .

[0062] In the electric card heat exchange device provided in the embodiment of the present disclosure, the first electric card device 11 is driven to move by the driving component, or the driving component drives the first hot-end thermal conductive film layer 21 and the first cold-end thermal conductive film layer 31 to move, so that the first hot-end thermal conductive film layer 21 and the first cold-end thermal conductive film layer 31 respectively receive the heat and cold generated by the first electric card device 11, thereby realizing the separation of the heat and cold generated by the first electric card device 11.

[0063] In the electric card heat exchange device provided by the embodiment of the present disclosure, the driving component can drive the first electric card device 11 to move. When an electric field is applied to the first electric card device 11, the first electric card device 11 generates heat. At this time, the driving component drives the first electric card device 11 to move, and the movement direction of the first electric card device 11 is toward the first hot end thermal conductive film layer 21, and the first hot end thermal conductive film layer 21 is in contact with the first electric card device 11, so that the first hot end thermal conductive film layer 21 can receive the heat generated by the first electric card device 11; when the electric field is removed from the first electric card device 11, the first electric card device 11 generates cold energy. At this time, the driving component drives the first electric card device 11 to move, and the movement direction of the first electric card device 11 is toward the first cold end thermal conductive film layer 31, and the first cold end thermal conductive film layer 31 is in contact with the first electric card device 11, so that the first cold end thermal conductive film layer 31 can receive the cold energy generated by the first electric card device 11.

[0064] In the electric card heat exchange device provided by the embodiment of the present disclosure, the driving component can also be used to drive the first hot end heat conductive film layer 21 and the first cold end heat conductive film layer 31 to move. When an electric field is applied to the first electric card device 11, the first electric card device 11 generates heat. At this time, the first hot end heat conductive film layer 21 is driven to move, and the movement direction of the first hot end heat conductive film layer 21 is toward the first electric card device 11, and the first hot end heat conductive film layer 21 is attached to the first electric card device 11, so that the first hot end heat conductive film layer 21 can receive the heat generated by the first electric card device 11; when the electric field is removed from the first electric card device 11, the first electric card device 11 generates cold energy. At this time, the driving component drives the first cold end heat conductive film layer 31 to move, and the movement direction of the first cold end heat conductive film layer 31 is toward the first electric card device 11, and the first cold end heat conductive film layer 31 is attached to the first electric card device 11, so that the first cold end heat conductive film layer 31 can receive the cold energy generated by the first electric card device 11.

[0065] Optionally, when the first hot-end heat-conducting film layer 21 is attached to the first electric card device 11, the first hot-end heat-conducting film layer 21 and the first electric card device 11 are interference-fitted and tightly attached, thereby improving the heat exchange effect between the two. Similarly, when the first cold-end heat-conducting film layer 31 and the first electric card device 11 are attached, the first cold-end heat-conducting film layer 31 and the first electric card device 11 are interference-fitted and tightly attached, thereby improving the cold exchange effect between the two.

[0066] It can be seen that in the electric card heat exchange device provided in the embodiment of the present disclosure, according to the alternating or periodic generation of heat or cold by the first electric card device 11, the first hot-end thermal conductive film layer 21 is correspondingly driven to fit with the first electric card device 11, or the first cold-end thermal conductive film layer 31 is driven to fit with the first electric card device 11, thereby realizing the separation of the heat and cold generated by the first electric card device 11.

[0067] It can be understood that when the electric field applied to the first electric card device 11 ends, the first hot end thermal conductive film layer 21 is driven away from the first electric card device 11 to prepare for the subsequent first cold end thermal conductive film layer 31 to fit with the first electric card device 11; similarly, when the electric field is removed from the first electric card device 11, the first cold end thermal conductive film layer 31 is driven away from the first electric card device 11 to prepare for the subsequent first hot end thermal conductive film layer 21 to fit with the first electric card device 11. In this way, the receiving effect of the first hot end thermal conductive film layer 21 and the first cold end thermal conductive film layer 31 on heat and cold is improved, and the heat and cold are not mixed.

[0068] Optionally, in the first electric card heat exchange unit 100, the first hot end heat conductive film layer 21, the first electric card device 11 and the first cold end heat conductive film layer 31 are arranged in sequence, such as Figure 3 and Figure 4Optionally, the distance between the first hot-end heat-conducting film layer 21 and the first electric card device 11 is equal to the distance between the first cold-end heat-conducting film layer 31 and the first electric card device 11 .

[0069] Optionally, the first electric card heat exchange unit 100 further includes a first chip fixing partition 61. The first chip fixing partition 61 is provided with one or more first mounting positions, wherein the first electric card device 11 is provided at the first mounting position.

[0070] The first chip fixing partition 61 is used to fix and install the first electric card device 11, thereby improving the installation stability of the first electric card device 11 in the electric card heat exchange device. Optionally, the first installation position is provided in the first chip fixing partition 61 in a hollowed-out form, that is, the first installation position penetrates the first chip fixing partition 61, so that both surfaces of the first electric card device 11 can protrude from the first chip fixing partition 61, so that the first hot end heat conductive film layer 21 and the first cold end heat conductive film layer 31 can better fit and exchange heat with the first electric card device 11.

[0071] Optionally, the first chip fixing partition 61 is provided with a plurality of first mounting positions, and a first electric card device 11 is respectively installed on the plurality of first mounting positions, so that the sum of heat and cold that can be generated by the electric card device on a single first chip fixing partition 61 is increased, and the total cooling capacity of the electric card heat exchange device is increased. Optionally, the plurality of first mounting positions are arranged in an array on the first chip fixing partition 61, and correspondingly, the plurality of first electric card devices 11 are arranged in an array on the first chip fixing partition 61.

[0072] Optionally, the first hot end heat conductive film layer 21, the first cold end heat conductive film layer 31 and the first electric card device 11 are arranged in parallel; and / or, the first hot end heat conductive film layer 21, the first electric card device 11 and the first cold end heat conductive film layer 31 are arranged in sequence. Figure 3 and Figure 4 shown.

[0073] In the first electric card heat exchange unit 100, the first hot-end heat-conductive film layer 21, the first cold-end heat-conductive film layer 31 and the first electric card device 11 are arranged in parallel in pairs, thereby increasing the contact area between the first hot-end heat-conductive film layer 21 and the first cold-end heat-conductive film layer 31 and the first electric card device 11, and increasing the receiving and separation effect of the first hot-end heat-conductive film layer 21 and the first cold-end heat-conductive film layer 31 on heat and cold.

[0074] Optionally, the first hot end heat conductive film layer 21, the first electric card device 11 and the first cold end heat conductive film layer 31 are arranged in sequence. When the first electric card device 11 is arranged on the first chip fixing partition 61, it can also be understood that the first hot end heat conductive film layer 21, the first chip fixing partition 61 and the first cold end heat conductive film layer 31 are arranged in sequence. The first hot end heat conductive film layer 21 is arranged on one side of the first electric card device 11, and the first cold end heat conductive film layer 31 is arranged on the other side of the first electric card device 11. In this way, the first hot end heat conductive film layer 21 and the first cold end heat conductive film layer 31 will not mix heat and cold when receiving heat and cold, thereby improving the receiving and separation effect of heat and cold of the first electric card device 11.

[0075] Optionally, the surface area of ​​the first hot-end thermally conductive film layer 21 is equal to the surface area of ​​the first cold-end thermally conductive film layer 31; the surface area of ​​the first electric card device 11 is smaller than the surface area of ​​the first hot-end thermally conductive film layer 21 or the surface area of ​​the first cold-end thermally conductive film layer 31; the surface area of ​​the first chip fixing partition 61 is greater than or equal to the surface area of ​​the first hot-end thermally conductive film layer 21, and the surface area of ​​the first chip fixing partition 61 is greater than or equal to the surface area of ​​the first cold-end thermally conductive film layer 31.

[0076] The first chip fixing partition 61 includes a first hot end fixing surface and a first cold end fixing surface, and the first electric card device 11 includes a first electric card surface located on the first hot end fixing surface side and a second electric card surface located on the first cold end fixing surface side, wherein the first electric card surface protrudes from the first hot end fixing surface, and the second electric card surface protrudes from the first cold end fixing surface.

[0077] The two surfaces of the first electric card device 11 protrude from the two surfaces of the first chip fixing partition 61 respectively, and it can also be understood that the thickness of the first electric card device 11 is greater than the thickness of the first chip fixing partition 61. For example, the first hot end thermal conductive film layer 21 is in contact with the first electric card surface of the first electric card device 11, and the first cold end thermal conductive film layer 31 is in contact with the second electric card surface of the first electric card device 11, thus improving the heat and cold exchange effect between the first hot end thermal conductive film layer 21 and the first cold end thermal conductive film layer 31 and the first electric card device 11.

[0078] like Figure 5 As shown, the first hot end heat conductive film layer 21 includes a first hot end heat conductive surface 2101 attached to the surface of the first electric card, wherein the area of ​​the first hot end heat conductive surface 2101 is greater than or equal to the area of ​​the first electric card surface. In this way, the first hot end heat conductive film layer 21 improves the receiving effect of the heat generated by the first electric card device 11. Similarly, the first cold end heat conductive film layer 31 includes a first cold end heat conductive surface attached to the surface of the second electric card, wherein the area of ​​the first cold end heat conductive surface is greater than or equal to the area of ​​the second electric card surface. In this way, the first cold end heat conductive film layer 31 improves the receiving effect of the cold generated by the first electric card device 11.

[0079] Optionally, the electric card heat exchange device further includes a second electric card heat exchange unit 200, such as Figure 1 and Figure 2 shown.

[0080] The second electric card heat exchange unit 200 includes a second hot end heat conductive film layer 22, a second chip fixing partition 62 and a second cold end heat conductive film layer 32, wherein a heat insulating partition 91 is arranged between the first electric card heat exchange unit 100 and the second electric card heat exchange unit 200. Figure 7 shown.

[0081] In the electric card heat exchange device, the first electric card heat exchange unit 100 and the second electric card heat exchange unit 200 are arranged side by side. That is, in the electric card heat exchange device, the first hot end heat conductive film layer 21, the first chip fixing partition 61, the first cold end heat conductive film layer 31, the second hot end heat conductive film layer 22, the second chip fixing partition 62 and the second cold end heat conductive film layer 32 are arranged side by side in sequence. The thermal insulation baffle 91 is arranged between the first electric card heat exchange unit 100 and the second electric card heat exchange unit 200. Optionally, the thermal insulation baffle 91 is arranged between the first cold-end heat-conductive film layer 31 and the second hot-end heat-conductive film layer 22. In this way, heat cross-over between the first cold-end heat-conductive film layer 31 and the second hot-end heat-conductive film layer 22 is prevented. At the same time, the thermal insulation baffle 91 can also play a motion stop role for the first cold-end heat-conductive film layer 31 and the second hot-end heat-conductive film layer 22, thereby improving the movement accuracy of the first cold-end heat-conductive film layer 31 and the second hot-end heat-conductive film layer 22 under the drive of the driving component.

[0082] It is understandable that the electric card heat exchange device may also include a third electric card heat exchange unit, a fourth electric card heat exchange unit, and a greater number of electric card heat exchange units. Optionally, multiple electric card heat exchange units are arranged side by side, and a heat insulation partition 91 is provided between two adjacent electric card heat exchange units. The embodiment of the present disclosure does not impose too many restrictions on the number of electric card heat exchange units in the electric card heat exchange device.

[0083] Optionally, the driving component includes a first driving element 4 and a second driving element 5, wherein the first driving element 4 includes a first connecting end 41, and the first connecting end 41 is drivingly connected to the first hot end thermal conductive film layer 21 and the second hot end thermal conductive film layer 22, and the second driving element 5 includes a second connecting end 51, and the second connecting end 51 is drivingly connected to the first cold end thermal conductive film layer 31 and the second cold end thermal conductive film layer 32.

[0084] The first connection end 41 is used to simultaneously connect the first hot end heat conductive film layer 21 and the second hot end heat conductive film layer 22, so that the first hot end heat conductive film layer 21 and the second hot end heat conductive film layer 22 can be driven simultaneously. Optionally, when the electric card heat exchange device further includes a third electric card heat exchange unit, a fourth electric card heat exchange unit and a larger number of electric card heat exchange units, the first connection end 41 is simultaneously connected to multiple hot end heat conductive film layers, such as Fig. 9 As shown. Optionally, the first connection end 41 is fixedly connected to the first hot end thermal conductive film layer 21 and the second hot end thermal conductive film layer 22. Optionally, multiple first connection ends 41 can be used to connect the first hot end thermal conductive film layer 21 and the second hot end thermal conductive film layer 22, thereby improving the driving stability of the first driving element 4 and the hot end thermal conductive film layer. Optionally, the first driving element 4 also includes a first motor connected to the first connection end 41.

[0085] Similarly, the second connection end 51 is used to simultaneously connect the first cold end heat conductive film layer 31 and the second cold end heat conductive film layer 32, so that the first cold end heat conductive film layer 31 and the second cold end heat conductive film layer 32 can be driven simultaneously. Optionally, when the electric card heat exchange device further includes a third electric card heat exchange unit, a fourth electric card heat exchange unit and a larger number of electric card heat exchange units, the second connection end 51 is simultaneously connected to multiple cold end heat conductive film layers, and Fig. 9 The connection structure is similar to that in . Optionally, the second connection end 51 is fixedly connected to the first cold end heat conductive film layer 31 and the second cold end heat conductive film layer 32. Optionally, multiple second connection ends 51 can be used to connect the first cold end heat conductive film layer 31 and the second cold end heat conductive film layer 32, thereby improving the driving stability of the second driving element 5 and the cold end heat conductive film layer. Optionally, the second driving element 5 also includes a second motor connected to the second connection end 51.

[0086] Optionally, when the driving element drives the hot end thermal conductive film layer or the cold end thermal conductive film layer to fit the electric card device respectively, the movement direction of the hot end thermal conductive film layer driven by the first driving element 4 is opposite to the movement direction of the cold end thermal conductive film layer driven by the second driving element 5.

[0087] Optionally, the first hot end heat conductive film layer 21 includes a first frame 2102 disposed on the outer edge of the first hot end heat conductive surface 2101, such as Figure 5 As shown, the second hot end heat conductive film layer 22 includes a second frame arranged at the outer edge of the second hot end heat conductive surface, wherein the first connecting end 41 is connected to the first frame 2102 and the second frame.

[0088] The first frame 2102 and the second frame are made of low thermal conductivity materials to prevent heat from being transferred to the first driving element 4 through the first frame 2102 and the second frame and being consumed. The first frame 2102 and the second frame are strong, which improves the support effect on the heat conduction surface of the hot end.

[0089] Optionally, the first cold end thermal conductive film layer 31 includes a third frame arranged at the outer edge of the first cold end thermal conductive surface, and the second cold end thermal conductive film layer 32 includes a fourth frame arranged at the outer edge of the second cold end thermal conductive surface, wherein the second connecting end 51 is connected to the third frame and the fourth frame.

[0090] Similarly, the third frame and the fourth frame are made of low thermal conductivity materials to prevent the cold energy from being consumed by being transferred to the second driving element 5 through the third frame and the fourth frame. The third frame and the fourth frame are strong, which improves the support effect on the cold end heat conduction surface.

[0091] Optionally, the first hot end thermal conductive film layer 21 includes a film layer structure with high thermal conductivity such as a carbon film layer, a graphite film layer or a graphene film layer. Similarly, the first cold end thermal conductive film layer 31 includes a film layer structure with high thermal conductivity such as a carbon film layer, a graphite film layer or a graphene film layer.

[0092] The disclosed embodiment also provides an electric card heat exchange device.

[0093] The electric card heat exchange device includes a first electric card heat exchange unit 100, and the first electric card heat exchange unit 100 includes a first electric card device 11, a first hot end heat conductive film layer 21, and a first cold end heat conductive film layer 31. The first electric card device 11 can alternately generate heat and cold; the first hot end heat conductive film layer 21 can be attached to the first electric card device 11 to receive the heat generated by the first electric card device 11; the first cold end heat conductive film layer 31 can be attached to the first electric card device 11 to receive the cold generated by the first electric card device 11. The electric card heat exchange device also includes a first driving element 4 and a second driving element 5. The first driving element 4 is used to drive the first hot end heat conductive film layer 21 to move. The first driving element 4 includes a first connecting end 41. The first connecting end 41 is drivingly connected to the first hot end connecting portion 2103 of the first hot end heat conductive film layer 21. The second driving element 5 is used to drive the first cold end heat conductive film layer 31 to move. The second driving element 5 includes a second connecting end 51. The second connecting end 51 is drivingly connected to the first cold end connecting portion of the first cold end heat conductive film layer 31. When the first electric card device 11 generates heat, the first driving element 4 drives the first hot end heat conductive film layer 21 to move and fit with the first electric card device 11. When the first electric card device 11 generates cold, the second driving element 5 drives the first cold end heat conductive film layer 31 to move and fit with the first electric card device 11.

[0094] In the electric card heat exchange device provided by the embodiment of the present disclosure, the first driving element 4 is used to drive the first hot end heat conductive film layer 21 to move, and the second driving element 5 is used to drive the first cold end heat conductive film layer 31 to move. Specifically, when the first electric card device 11 generates heat, the first driving element 4 drives the first hot end heat conductive film layer 21 to move, so that the first hot end heat conductive film layer 21 is attached to the first electric card device 11, so that the first hot end heat conductive film layer 21 receives the heat generated by the first electric card device 11; when the heat generated by the first electric card device 11 ends and the first electric card device 11 starts to generate cold, the first driving element 4 drives the first hot end heat conductive film layer 21 away from the first electric card device 11, and at the same time, the second driving element 5 drives the first cold end heat conductive film layer 31 to move, so that the first cold end heat conductive film layer 31 is attached to the first electric card device 11, so that the first cold end heat conductive film layer 31 receives the cold generated by the first electric card device 11, that is, the reception and separation of the heat and cold generated by the first electric card device 11 are completed.

[0095] In the electric card heat exchange device provided in the embodiment of the present disclosure, the first driving element 4 and the second driving element 5 are respectively used to drive the first hot-end thermal conductive film layer 21 and the first cold-end thermal conductive film layer 31 to move. According to the time when the heat and cold energy generated by the first electric card device 11, the first hot-end thermal conductive film layer 21 and the first cold-end thermal conductive film layer 31 are periodically driven to approach or move away from the first electric card device 11, thereby improving the receiving and separation effects of the heat and cold energy of the first electric card device 11.

[0096] Optionally, the first driving element 4 further includes a first motor for driving the first connection end 41 to move, and when the first motor rotates in one direction, the first connection end 41 drives the first hot end thermal conductive film layer 21 to approach the first electric card device 11, and when the first motor rotates in the other direction, the first connection end 41 drives the first hot end thermal conductive film layer 21 away from the first electric card device 11. Similarly, the second driving element 5 further includes a second motor for driving the second connection end 51 to move, and when the second motor rotates in one direction, the second connection end 51 drives the first cold end thermal conductive film layer 31 to approach the first electric card device 11, and when the second motor rotates in the other direction, the second connection end 51 drives the first cold end thermal conductive film layer 31 away from the first electric card device 11.

[0097] Optionally, the first hot-end thermally conductive film layer 21 includes a first hot-end bonding portion 212 directly bonded to the first electric card device 11 and a first hot-end extension portion 211 extending from the first hot-end bonding portion 212, and the first cold-end thermally conductive film layer 31 includes a first cold-end bonding portion 311 directly bonded to the first electric card device 11 and a first cold-end extension portion 312 extending from the first cold-end bonding portion 311, wherein the extension directions of the first hot-end extension portion 211 and the first cold-end extension portion 312 are different.

[0098] like Figure 6 , Figure 7 and Fig.12 As shown, the first hot end extension portion 211 extends upward, the first cold end extension portion 312 extends downward, the first hot end connection portion 2103 is arranged on the first hot end extension portion 211, or another first hot end connection portion is arranged on the first hot end bonding portion 212, the first cold end connection portion is arranged on the first cold end extension portion 312, or another first cold end connection portion is arranged on the first cold end bonding portion 311. In this way, the first hot end connection portion 2103 and the first cold end connection portion can be respectively arranged at different positions of the electric card heat exchange device, that is, the first hot end heat conductive film layer 21 and the first cold end heat conductive film layer 31 can be driven at different positions, respectively, thereby improving the accuracy of the driving movement of the first hot end heat conductive film layer 21 and the first cold end heat conductive film layer 31, and preventing mutual interference when driving the two. At the same time, the space utilization efficiency of the electric card heat exchange device is also improved.

[0099] Optionally, the first electric card heat exchange unit 100 further includes a first chip fixing partition 61. The first chip fixing partition 61 is provided with a first mounting position, and the first electric card device 11 is provided at the first mounting position, wherein the first chip fixing partition 61 is provided with a first avoidance groove 611 for avoiding the first connection end 41 and a second avoidance groove 612 for avoiding the second connection end 51, as shown in FIG. Fig.10 shown.

[0100] The first chip fixing partition 61 is used to fix and install the first electric card device 11, thereby improving the installation stability of the first electric card device 11. Optionally, multiple edges of the first chip fixing partition 61 are fixed to the inner wall of the box body 101 of the electric card heat exchange device, and the first avoidance groove 611 and the second avoidance groove 612 are provided so that the first connection end 41 and the second connection end 51 can move through the first chip fixing partition 61. Optionally, the first connection end 41 moves in the left-right direction, and similarly, the second connection end 51 moves in the left-right direction.

[0101] Optionally, the first driving element 4 includes a plurality of first connection ends 41 to improve the stability of the first driving element 4 in driving the first hot-end heat-conducting film layer 21 to move. Similarly, the number of first avoidance grooves 611 on the first chip fixing partition 61 is equal to the number of first connection ends 41, so that the plurality of first connection ends 41 can smoothly pass through the first chip fixing partition 61 to move left and right. Optionally, the second driving element 5 includes a plurality of second connection ends 51 to improve the stability of the second driving element 5 in driving the first cold-end heat-conducting film layer 31 to move. Similarly, the number of second avoidance grooves 612 on the first chip fixing partition 61 is equal to the number of second connection ends 51, so that the plurality of second connection ends 51 can smoothly pass through the first chip fixing partition 61 to move left and right.

[0102] Optionally, the electric card heat exchange device further includes a second electric card heat exchange unit 200. The second electric card heat exchange unit 200 includes a second hot end heat conductive film layer 22, a second chip fixing partition 62, and a second cold end heat conductive film layer 32 in sequence, wherein a heat insulating partition 91 is provided between the first electric card heat exchange unit 100 and the second electric card heat exchange unit 200, and the heat insulating partition 91 is provided with a third avoidance groove 911 for avoiding the first connection end 41 and a fourth avoidance groove 912 for avoiding the second connection end 51, as shown in FIG. Fig.11 shown.

[0103] Similar to the first chip fixing partition 61, the second chip fixing partition 62 is also provided with a first avoidance groove for avoiding the movement of the first connection end 41 and a second avoidance groove for avoiding the movement of the second connection end 51. At the same time, the heat insulation partition 91 is also provided with a third avoidance groove 911 for avoiding the movement of the first connection end 41 and a fourth avoidance groove 912 for avoiding the movement of the second connection end 51. In this way, the first connection end 41 can pass through the first chip fixing partition 61, the heat insulation partition 91 and the second chip fixing partition 62, and move left and right smoothly, and the second connection end 51 can pass through the first chip fixing partition 61, the heat insulation partition 91 and the second chip fixing partition 62, and move left and right smoothly.

[0104] The first connection end 41 of the first driving element 4 is drivingly connected to the first hot end thermal conductive film layer 21 and the second hot end thermal conductive film layer 22 ; the second connection end 51 of the second driving element 5 is drivingly connected to the first cold end thermal conductive film layer 31 and the second cold end thermal conductive film layer 32 .

[0105] The first hot end heat conductive film layer 21 and the second hot end heat conductive film layer 22 are both connected to the first connection end 41, so that the first driving element 4 can simultaneously drive multiple hot end heat conductive film layers to perform synchronous driving motion. Similarly, the first cold end heat conductive film layer 31 and the second cold end heat conductive film layer 32 are both connected to the second connection end 51, so that the second driving element 5 can simultaneously drive multiple cold end heat conductive film layers to perform synchronous driving motion.

[0106] Optionally, the electric card heat exchange device further includes a box 101, such as Fig.13 The first hot end heat conductive film layer 21, the first cold end heat conductive film layer 31, the first chip fixing partition 61, the second hot end heat conductive film layer 22, the second cold end heat conductive film layer 32, the second chip fixing partition 62 and the heat insulating partition 91 are all arranged in the box body 101, wherein the first chip fixing partition 61, the second chip fixing partition 62 and the heat insulating partition 91 are fixedly arranged in the box body 101.

[0107] Optionally, multiple edges of the first chip fixing partition 61, the thermal insulation partition 91 and the second chip fixing partition 62 are fixed to the inner wall of the box body 101, thereby improving the setting stability of the first chip fixing partition 61, the thermal insulation partition 91 and the second chip fixing partition 62 in the box body 101.

[0108] Optionally, the first hot end connection portion 2103, the first avoidance groove 611 and the third avoidance groove 911 are arranged on a first preset straight line; and the first cold end connection portion, the second avoidance groove 612 and the fourth avoidance groove 912 are arranged on a second preset straight line.

[0109] The first preset straight line can be a horizontal straight line, and similarly, the second preset straight line can also be a horizontal straight line. Optionally, the first connection end 41 of the first driving element 4 is arranged at the first preset straight line position, the first connection end 41 is also linear, and the width of the first connection end 41 is smaller than the width of the first preset straight line, so that the first connection end 41 can move left and right at the first preset straight line position; similarly, the second connection end 51 of the second driving element 5 is arranged at the second preset straight line position, the second connection end 51 is also linear, and the width of the second connection end 51 is smaller than the width of the second preset straight line, so that the second connection end 51 can move left and right at the second preset straight line position.

[0110] The disclosed embodiment also provides an electric card heat exchange device.

[0111] An electric card heat exchange device includes a first electric card heat exchange unit 100, wherein the first electric card heat exchange unit 100 includes a first electric card device 11, a first hot-end heat-conducting film layer 21, a first cold-end heat-conducting film layer 31 and a driving component. The first electric card device 11 can generate heat and cold alternately; the first hot end thermal conductive film layer 21 can be attached to the first electric card device 11 to receive the heat generated by the first electric card device 11; the first cold end thermal conductive film layer 31 can be attached to the first electric card device 11 to receive the cold generated by the first electric card device 11; and the driving component is connected to the first electric card device 11, or is connected to the first hot end thermal conductive film layer 21 and the first cold end thermal conductive film layer 31. When the first electric card device 11 generates heat, the driving component drives the first hot end thermal conductive film layer 21 to attach to the first electric card device 11, and when the first electric card device 11 generates cold, the driving component drives the first cold end thermal conductive film layer 31 to attach to the first electric card device 11. Among them, the first hot end thermal conductive film layer 21 is provided with a first hot end heat transfer element, and the first cold end thermal conductive film layer 31 is provided with a first cold end heat transfer element.

[0112] The first hot end heat transfer element is used to transfer the heat received by the first hot end heat conductive film layer 21, so as to facilitate the subsequent collection and utilization of the heat; similarly, the first cold end heat transfer element is used to transfer the cold received by the first cold end heat conductive film layer 31, so as to facilitate the subsequent collection and utilization of the cold. Fig.12 shown.

[0113] Optionally, the first hot end thermal conductive film layer 21 includes a first hot end bonding portion 212 directly bonded to the first electric card device 11 and a first hot end extension portion 211 extending from the first hot end bonding portion 212, wherein the first hot end heat transfer element is disposed at the first hot end extension portion 211. The first hot end bonding portion 212 of the first hot end thermal conductive film layer 21 is used to receive heat from the first electric card device 11, and the received heat is transmitted along the first hot end thermal conductive film layer 21 to the first hot end extension portion 211, and the first hot end heat transfer element is disposed at the first hot end extension portion 211.

[0114] Optionally, the first cold end thermal conductive film layer 31 includes a first cold end bonding portion 311 directly bonded to the first electric card device 11 and a first cold end extension portion 312 extending from the first cold end bonding portion 311, wherein the first cold end heat transfer component is disposed at the first cold end extension portion 312. The first cold end bonding portion 311 of the first cold end thermal conductive film layer 31 is used to receive the cold energy of the first electric card device 11, and the received cold energy is transmitted to the first cold end extension portion 312 along the first cold end thermal conductive film layer 31, and the first cold end heat transfer component is disposed at the first cold end extension portion 312.

[0115] It is understandable that the aforementioned first hot end heat conducting surface 2101 includes a first hot end fitting portion 212 and a first hot end extending portion 211 ; similarly, the aforementioned first cold end heat conducting surface includes a first cold end fitting portion 311 and a first cold end extending portion 312 .

[0116] Optionally, the first hot-end heat transfer element is disposed at the upper part of the electric card heat exchange device to collect heat from the upper part of the electric card heat exchange device, and the first cold-end heat transfer element is disposed at the lower part of the electric card heat exchange device to collect cold from the lower part of the electric card heat exchange device. In the disclosed embodiment, heat and cold are collected from the upper and lower ends of the electric card heat exchange device, respectively, avoiding mutual influence between cold and heat in the process of collecting heat and cold.

[0117] Optionally, the first hot end heat transfer element includes a first heat pipe, and the first heat pipe includes a first evaporation end 711 and a first condensation end 712 , wherein the first evaporation end 711 is disposed at the first hot end extension portion 211 .

[0118] The first heat pipe includes a first evaporation end 711 and a first condensation end 712 for heat transfer, and the first evaporation end 711 is arranged in contact with the first hot end extension 211. The first evaporation end 711 receives the heat of the first hot end extension 211 and transfers it to the first condensation end 712 away from the first hot end thermal conductive film layer 21, and the heat can be used at the first condensation end 712 of the first heat pipe.

[0119] Optionally, the first heat pipe further includes a first insulation section 713, and the first insulation section 713 is disposed between the first evaporation end 711 and the first condensation end 712. The first heat end thermal conductive film layer 21 may perform periodic motions, and optionally, the first insulation section 713 includes a flexible connection portion, and the setting of the flexible connection portion may cause the first heat pipe to bend and deform during heat transfer, thereby causing the first heat pipe to move along with the movement of the first heat end thermal conductive film layer 21.

[0120] Optionally, the first cold-end heat transfer element includes a second heat pipe, and the second heat pipe includes a second evaporation end 812 and a second condensation end 811 , wherein the second condensation end 811 is disposed at the first cold-end extension portion 312 .

[0121] The second heat pipe includes a second evaporation end 812 and a second condensation end 811 for heat transfer, and the second condensation end 811 is arranged in contact with the first cold end extension 312. The second condensation end 811 receives the cold energy of the first cold end extension 312 and transfers it to the second evaporation end 812 away from the first cold end thermal conductive film layer 31, and the cold energy can be used at the second evaporation end 812 of the second heat pipe.

[0122] Optionally, the second heat pipe further includes a second insulation section 813, and the second insulation section 813 is disposed between the second evaporation end 812 and the second condensation end 811. The first cold end heat conductive film layer 31 will perform periodic movements, and optionally, the second insulation section 813 includes a flexible connection portion, and the setting of the flexible connection portion can make the second heat pipe bend and deform during the heat transfer process, thereby making the second heat pipe move with the movement of the first cold end heat conductive film layer 31.

[0123] Optionally, the electric card heat exchange device further includes a second electric card heat exchange unit 200. The second electric card heat exchange unit 200 includes a second hot end heat conductive film layer 22, a second chip fixing partition 62 and a second cold end heat conductive film layer 32, wherein the second hot end heat conductive film layer 22 is provided with a second hot end heat transfer element, and the second cold end heat conductive film layer 32 is provided with a second cold end heat transfer element.

[0124] Similar to the first electric card heat exchange unit 100, the second electric card heat exchange unit 200 is also provided with a second hot end heat transfer element and a second cold end heat transfer element to transfer heat and cold respectively. Optionally, the second hot end heat transfer element includes a third heat pipe, the third heat pipe includes a third evaporation end 721 and a third insulation section 723, the third evaporation end 721 is arranged on the second hot end heat conductive film layer 22, wherein the electric card heat exchange device also includes a first confluence section 701, one end of the first confluence section 701 is connected to the first insulation section 713 and the third insulation section 723, and the other end of the first confluence section 701 is connected to the first condensation end 712. The first confluence section 701 is used to collect the heat received by the first evaporation end 711 and the third evaporation end 721, and then transmit it to the first condensation end 712, which simplifies the installation and arrangement of the heat pipe inside the electric card heat exchange device.

[0125] Optionally, the second cold end heat transfer element includes a fourth heat pipe, the fourth heat pipe includes a fourth condensation end 821 and a fourth insulation section 823, the fourth condensation end 821 is arranged on the second cold end heat conductive film layer 32, wherein the electric card heat exchange device also includes a second confluence section 801, one end of the second confluence section 801 is connected to the second insulation section 813 and the fourth insulation section 823, and the other end of the second confluence section 801 is connected to the second evaporation end 812. The second confluence section 801 is used to collect the cold received by the second condensation end 811 and the fourth condensation end 821, and then transmit it to the second evaporation end 812, which simplifies the installation and arrangement of the heat pipe inside the electric card heat exchange device.

[0126] The disclosed embodiment further provides a heat exchange system including the aforementioned electric card heat exchange device.

[0127] The heat exchange system provided in the embodiment of the present disclosure can utilize the heat and cold of the electric card heat exchange device, for example, utilize the heat of the electric card heat exchange device to heat the room, or utilize the cold of the electric card heat exchange device to cool the indoor environment or the box environment. The household appliance including the heat exchange system provided in the embodiment of the present disclosure can be an air conditioner, as well as refrigeration equipment such as a refrigerator, a freezer, and a display cabinet.

[0128] The above description and the accompanying drawings sufficiently illustrate the embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Unless explicitly required, individual components and functions are optional, and the order of operations may vary. Portions and features of some embodiments may be included in or replace portions and features of other embodiments. The embodiments of the present disclosure are not limited to the structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. An electric card heat exchange device, characterized in that: The invention comprises a first electric card heat exchange unit, wherein the first electric card heat exchange unit comprises: The first electric card device can generate heat and cold alternately; The first hot end heat conductive film layer can be attached to the first electric card device to receive the heat generated by the first electric card device; The first cold-end heat-conducting film layer can be attached to the first electric card device to receive the cold energy generated by the first electric card device; and, A driving component is connected to the first electric card device, or is connected to the first hot end heat conductive film layer and the first cold end heat conductive film layer. When the first electric card device generates heat, the driving component drives the first hot end thermal conductive film layer to fit with the first electric card device; when the first electric card device generates cold, the driving component drives the first cold end thermal conductive film layer to fit with the first electric card device.

2. The electric card heat exchange device according to claim 1, characterized in that: The first electric card heat exchange unit also includes: The first chip fixing partition is provided with one or more first mounting positions, Wherein, the first electric card component is arranged at the first installation position.

3. The electric card heat exchange device according to claim 2, characterized in that: The first hot-end heat-conducting film layer, the first cold-end heat-conducting film layer and the first electric card device are arranged in parallel; and / or, The first hot-end heat-conducting film layer, the first electric card device and the first cold-end heat-conducting film layer are arranged in sequence.

4. The electric card heat exchange device according to claim 2, characterized in that: The first chip fixing partition includes a first hot end fixing surface and a first cold end fixing surface, the first electric card device includes a first electric card surface located on the first hot end fixing surface side and a second electric card surface located on the first cold end fixing surface side, The surface of the first electric card protrudes from the first hot end fixing surface, and the surface of the second electric card protrudes from the first cold end fixing surface.

5. The electric card heat exchange device according to claim 4, characterized in that: The first hot end heat conductive film layer comprises a first hot end heat conductive surface in contact with the first electric card surface, wherein the area of ​​the first hot end heat conductive surface is greater than or equal to the area of ​​the first electric card surface; and / or, The first cold end heat conductive film layer includes a first cold end heat conductive surface in contact with the second electric card surface, wherein the area of ​​the first cold end heat conductive surface is greater than or equal to the area of ​​the second electric card surface.

6. The electric card heat exchange device according to claim 5, characterized in that: Also includes: The second electric card heat exchange unit includes a second hot end heat conductive film layer, a second chip fixing partition plate, and a second cold end heat conductive film layer. Wherein, a heat insulating partition is arranged between the first electric card heat exchange unit and the second electric card heat exchange unit.

7. The electric card heat exchange device according to claim 6, characterized in that: The drive assembly includes a first drive element and a second drive element, Among them, the first driving element includes a first connecting end, and the first connecting end is drivingly connected to the first hot end thermal conductive film layer and the second hot end thermal conductive film layer, and the second driving element includes a second connecting end, and the second connecting end is drivingly connected to the first cold end thermal conductive film layer and the second cold end thermal conductive film layer.

8. The electric card heat exchange device according to claim 7, characterized in that: The first hot end heat conductive film layer comprises a first frame arranged at the outer edge of the first hot end heat conductive surface, and the second hot end heat conductive film layer comprises a second frame arranged at the outer edge of the second hot end heat conductive surface, wherein the first connecting end is connected to the first frame and the second frame; The first cold end heat conductive film layer includes a third frame arranged at the outer edge of the first cold end heat conductive surface, and the second cold end heat conductive film layer includes a fourth frame arranged at the outer edge of the second cold end heat conductive surface, wherein the second connecting end is connected to the third frame and the fourth frame.

9. The electric card heat exchange device according to claim 1, characterized in that: The first hot end heat conductive film layer includes a carbon film layer, a graphite film layer or a graphene film layer; and / or, The first cold-end heat-conducting film layer includes a carbon film layer, a graphite film layer or a graphene film layer.

10. A heat exchange system, characterized in that: It comprises the electric card heat exchange device as described in any one of claims 1 to 9.

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