SFP aging test module
By introducing the guide part, sliding part and handle design into the SFP aging test module, the problem of low plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug-and-plug
Patent Information
- Application Number
- CN202420358482.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-26
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2034-02-26
AI Technical Summary
The existing SFP connector test modules have low plug-in and unplugging efficiency and lack structural coordination, resulting in stiff plug-in and unplugging operations.
A SFP aging test module is designed, including a base, multiple placement slots, SFP connector, guide, slide and handle. Through the coordination of guide and slide, faster insertion speed is achieved and handle is passed. Drive the base to improve operating efficiency.
Improve plug-in and unplug efficiency, cancel the plug-in and unplug-in connection method, making plug-in and unplug more convenient and fast.
Smart Images
Figure CN222212814U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of test modules, and in particular to an SFP aging test module. Background Art
[0002] In the related art, in the aging test of the switch, it is necessary to insert a specific connector into the switch for aging test, for example, an SFP connector, and the switch has many interfaces, so it is necessary to combine multiple SFP connectors into a test module. The current test module has the following problems: it is just a simple combination of SFP connectors, and the tester grabs the main part of the test module for plugging and unplugging. These operations are not coordinated with the relevant structure that is conducive to the test, and the plugging and unplugging are relatively stiff, resulting in low plugging and unplugging efficiency. Therefore, how to improve the efficiency of plugging and unplugging has become a technical problem that needs to be solved urgently. Utility Model Content
[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes an SFP aging test module, which can improve the efficiency of plugging and unplugging.
[0004] The SFP aging test module according to the embodiment of the present application includes:
[0005] A base, wherein a plurality of placement slots are provided on one side of the base;
[0006] A plurality of SFP connectors, wherein the plurality of SFP connectors are arranged in the placement slots, and the SFP connectors are provided with a guide portion and a sliding portion, wherein the guide portion is used to guide the movement trajectory of the SFP connector when the SFP connector is inserted into the interface of the switch, and the sliding portion is connected to the guide portion, and the sliding portion is used to slide toward the interface of the switch under the guidance of the guide portion and be sleeved with the interface of the switch;
[0007] A handle is disposed on the base, and the handle is used to drive the SFP connector to be plugged or unplugged through the base.
[0008] According to the SFP aging test module of the embodiment of the present application, at least the following beneficial effects are achieved: by setting a base, an SFP connector and a handle, and the base is provided with a plurality of placement slots, a plurality of SFP connectors are arranged in the placement slots, and the SFP connector is provided with a guide portion and a sliding portion; by setting a guide portion, the SFP connector can be inserted into the switch, and under the action of the guide portion, a faster insertion speed can be achieved; by setting a sliding portion, it is connected with the interface socket of the switch during insertion, and the card connection method is cancelled, making plugging and unplugging more convenient; by setting a handle, the base is driven by the operating handle, thereby driving all SFP connectors to move, making the operation more convenient, and the speed is faster than the previous operation method without a handle. Therefore, the SFP aging test module of the present application can improve the efficiency of plugging and unplugging.
[0009] According to some embodiments of the present application, the plurality of SFP connectors are assembled into a structure.
[0010] According to some embodiments of the present application, the assembly structure is that the two SFP connectors are combined into one SFP connection component.
[0011] According to some embodiments of the present application, each of the SFP connection components is provided with an adaptive structure, and the adaptive structure is used to be inserted into the interface of the switch by swinging within a specific range.
[0012] According to some embodiments of the present application, the SFP aging test module is also provided with a light guide column, one end of the light guide column is abutted against the light source of the SFP connector, the other end of the light guide column passes through the base, and the other end of the light guide column emits light on the other side of the base opposite to the SFP connector.
[0013] According to some embodiments of the present application, the guide portion is provided with a plurality of guide surfaces, and the plurality of guide surfaces are inclined toward the center of the SFP connector.
[0014] According to some embodiments of the present application, the SFP connector is provided with a flexible circuit board, a plurality of connecting pieces are provided on the flexible circuit board, and the connecting pieces are provided with a metal plating layer.
[0015] According to some embodiments of the present application, the two SFP connectors are located in the same placement slot, and the flexible circuit boards corresponding to the two SFP connectors are electrically connected via a single core wire.
[0016] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The present application is further described below with reference to the accompanying drawings and embodiments, wherein:
[0018] Figure 1 A schematic diagram of the structure of the SFP aging test module provided in an embodiment of the present application;
[0019] Figure 2 A schematic diagram of the structure of assembling multiple SFP connectors provided in an embodiment of the present application;
[0020] Figure 3 A schematic diagram of the structure of two SFP connectors assembled according to an embodiment of the present application;
[0021] Figure 4 A schematic diagram of the structure of the base provided in the embodiment of the present application;
[0022] Figure 5 A schematic structural diagram of the base provided in an embodiment of the present application from another perspective.
[0023] Reference numerals:
[0024] Base 100, placement slot 110, mounting hole 120;
[0025] SFP connector 200, guide portion 210, guide surface 211, sliding portion 220, light guide column 230, flexible circuit board 240, connecting piece 241;
[0026] Handle 300. DETAILED DESCRIPTION
[0027] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.
[0028] It should be noted that although the functional modules are divided in the system diagram and the logical order is shown in the flowchart, in some cases, the steps shown or described can be performed in a different order than the module division in the system or the order in the flowchart. The terms in the specification, claims and the above drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.
[0029] In the description of this application, "several" means more than one, "more" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.
[0030] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.
[0031] In the description of the present application, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.
[0032] Below, according to Figures 1 to 5 The SFP aging test module of the embodiment of the present application is described.
[0033] It is understandable that if Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, an SFP aging test module is provided, including:
[0034] A base 100, with a plurality of placement slots 110 disposed on one side of the base 100;
[0035] A plurality of SFP connectors 200 are arranged in the placement slot 110. The SFP connector 200 is provided with a guide portion 210 and a sliding portion 220. The guide portion 210 is used to guide the movement trajectory of the SFP connector 200 when the SFP connector 200 is inserted into the interface of the switch. The sliding portion 220 is connected to the guide portion 210. The sliding portion 220 is used to slide toward the interface of the switch under the guidance of the guide portion 210 and be sleeved with the interface of the switch.
[0036] The handle 300 is disposed on the base 100 , and the handle 300 is used to drive the SFP connector 200 to be plugged in and out through the base 100 .
[0037] By setting a base 100, an SFP connector 200 and a handle 300, and the base 100 is provided with a plurality of placement slots 110, a plurality of SFP connectors 200 are arranged in the placement slots 110, and the SFP connector 200 is provided with a guide portion 210 and a sliding portion 220; by setting the guide portion 210, the SFP connector 200 can be inserted into the SFP connector 200, and a faster insertion speed can be achieved under the action of the guide portion 210; by setting the sliding portion 220, it is connected with the interface of the switch during insertion, and the card connection method is cancelled, and plugging and unplugging are more convenient; by setting the handle 300, the base 100 is driven by operating the handle 300, thereby driving all the SFP connectors 200 to move, and the operation is more convenient, and the speed is faster than the previous operation method without the handle 300. Therefore, the SFP aging test module of the present application can improve the efficiency of plugging and unplugging.
[0038] It is understandable that if Figure 2 As shown, a plurality of SFP connectors 200 are assembled.
[0039] It is understandable that if Figure 3 As shown, the assembled structure is that two SFP connectors 200 are combined into one SFP connection component.
[0040] It can be understood that each SFP connection component is provided with an adaptive structure, and the adaptive structure is used to be inserted into the interface of the switch by swinging within a specific range.
[0041] It can be understood that the SFP aging test module is also provided with a light guide column 230, one end of the light guide column 230 is abutted against the light source of the SFP connector 200, the other end of the light guide column 230 passes through the base 100, and the other end of the light guide column 230 emits light on the other side of the base 100 opposite to the SFP connector 200.
[0042] It is understandable that if Figure 3 As shown, the guide portion 210 is provided with a plurality of guide surfaces 211 , and the plurality of guide surfaces 211 are inclined toward the center of the SFP connector 200 .
[0043] It should be noted that if Figure 5 As shown, the other end of the light guide column 230 passes through the mounting hole 120 of the base 100 .
[0044] It is understandable that if Figure 3 As shown, the SFP connector 200 is provided with a flexible circuit board 240, and a plurality of connecting pieces 241 are provided on the flexible circuit board 240, and the connecting pieces 241 are provided with a metal coating. By providing the metal coating, the service life can be increased.
[0045] Flexible Printed Circuit (FPC) is a highly reliable and extremely flexible printed circuit board made of polyimide or polyester film as the substrate.
[0046] It is understandable that if Figure 3 As shown, two SFP connectors 200 are located in the same placement slot 110, and the flexible circuit boards 240 corresponding to the two SFP connectors 200 are electrically connected via a single core wire.
[0047] The embodiments of the present application are described in detail above in conjunction with the accompanying drawings, but the present application is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the purpose of the present application. In addition, the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.
Claims
1. SFP aging test module, characterized in that: include: A base, wherein a plurality of placement slots are provided on one side of the base; A plurality of SFP connectors, wherein the plurality of SFP connectors are arranged in the placement slots, and the SFP connectors are provided with a guide portion and a sliding portion, wherein the guide portion is used to guide the movement trajectory of the SFP connector when the SFP connector is inserted into the interface of the switch, and the sliding portion is connected to the guide portion, and the sliding portion is used to slide toward the interface of the switch under the guidance of the guide portion and be sleeved with the interface of the switch; A handle is disposed on the base, and the handle is used to drive the SFP connector to be plugged or unplugged through the base.
2. The SFP aging test module according to claim 1, characterized in that: The plurality of SFP connectors are assembled.
3. The SFP aging test module according to claim 2, characterized in that: The assembly structure is that two SFP connectors are combined into one SFP connection component.
4. The SFP aging test module according to claim 3, characterized in that: Each of the SFP connection components is provided with an adaptive structure, and the adaptive structure is used to be inserted into the interface of the switch by swinging within a specific range.
5. The SFP aging test module according to claim 1, characterized in that: The SFP aging test module is also provided with a light guide column, one end of which is in contact with the light source of the SFP connector, and the other end of which passes through the base, and the other end of which emits light on the other side of the base opposite to the SFP connector.
6. The SFP aging test module according to claim 1, characterized in that: The guide portion is provided with a plurality of guide surfaces, and the plurality of guide surfaces are inclined toward the center of the SFP connector.
7. The SFP aging test module according to claim 1, characterized in that: The SFP connector is provided with a flexible circuit board, a plurality of connecting pieces are provided on the flexible circuit board, and the connecting pieces are provided with a metal plating layer.
8. The SFP aging test module according to claim 7, characterized in that: The two SFP connectors are located in the same placement slot, and the flexible circuit boards corresponding to the two SFP connectors are electrically connected via a single core wire.