Projection chip assembly, vehicle lamp module, vehicle-mounted lamp and vehicle

Abstract

The embodiment of the utility model provides a projection chip assembly, a vehicle lamp module, a vehicle-mounted lamp and a vehicle, and relates to the technical field of vehicle lamps. The projection chip assembly comprises a support frame, a circuit board, a connector, a projection chip and a flexible part. The circuit board is arranged on the supporting frame. The connector is arranged on the circuit board and electrically connected with the circuit board, and the connector is located between the supporting frame and the circuit board. The projection chip is installed on the connector and electrically connected with the connector, and the projection chip is located between the connector and the supporting frame. In the stacking direction of the connector and the circuit board, the flexible part is connected between the supporting frame and the projection chip. The flexible component can be elastically deformed, and when the circuit board presses the projection chip to the support frame, the flexible component applies an elastic force to the circuit board to reduce the stress and bending borne by the circuit board, thereby reducing the possibility of weld leg cracking and damage of the circuit board and / or devices on the circuit board due to bending of the circuit board, and improving the reliability of the projection chip. And the use reliability of the automobile lamp module is improved.

Description

Technical Field

[0001] The present application relates to the technical field of vehicle lamps, and in particular to a projection chip assembly, a vehicle lamp module, a vehicle lamp and a vehicle. Background Art

[0002] The projection chip is an important component of the smart car light module. In a common car light module, the projection chip is plugged into a connector (socket) that has been soldered on a circuit board, the circuit board is assembled to a structural part, and the projection chip is directly pressed onto the structural part through the circuit board. During the assembly process of the circuit board and the structural part, the circuit board will bend and deform under stress to absorb the assembly tolerance. With the demand for miniaturization of car light modules, the area of ​​the circuit board needs to be reduced and the density of the devices arranged on the circuit board needs to be increased. Since the area of ​​the circuit board is small and the density of the devices arranged on the circuit board is increased, in the process of the circuit board pressing the projection chip to the structural part, the circuit board is prone to excessive bending due to the stress exceeding the threshold of the circuit board. In this way, the circuit board and / or the devices on the circuit board are easily damaged. For example, the solder feet of the devices soldered on the circuit board are cracked, affecting the reliability of the car light module. Utility Model Content

[0003] The embodiments of the present application provide a projection chip assembly, a vehicle light module, a vehicle light and a vehicle, so as to improve the reliability of use.

[0004] In a first aspect, an embodiment of the present application provides a projection chip assembly, the projection chip assembly comprising a support frame, a circuit board, a connector, a projection chip and a flexible component. The circuit board is mounted on the support frame. The connector is mounted on the circuit board and is electrically connected to the circuit board. The projection chip is mounted on the connector and is electrically connected to the connector, the projection chip is located between the connector and the support frame, and the connector is located between the projection chip and the circuit board. In the stacking direction of the connector and the circuit board, the flexible component is connected between the support frame and the projection chip.

[0005] In the projection chip assembly of the present application, in the stacking direction of the connector and the circuit board, the flexible component is connected between the support frame and the projection chip. Since the flexible component can deform elastically, in the process of the circuit board pressing the projection chip to the support frame, the flexible component exerts an elastic force on the circuit board, reducing the stress and bending moment borne by the circuit board, thereby reducing the possibility of cracking and damage to the solder joints of the circuit board and / or devices on the circuit board due to bending of the circuit board, which is beneficial to improving the reliability of the use of the car light module.

[0006] In addition, the flexible component is located between the projection chip and the support frame, rather than between the projection chip and the circuit board. Since the flexible component does not occupy the board surface of the circuit board, while reducing the stress on the circuit board, it will not reduce the board surface of the circuit board for arranging components, which is conducive to the compact structure and miniaturization of the projection chip assembly.

[0007] According to the first aspect, in a possible implementation manner of the present application, a first flexible convex hull is formed on a side of the flexible component facing the projection chip, and the first flexible convex hull is connected to the projection chip.

[0008] In this possible implementation, the first flexible convex bump is connected to the projection chip, so that the flexible component can closely cooperate with the projection chip, thereby improving the flexible supporting effect of the flexible component on the projection chip and the circuit board.

[0009] According to the first aspect, in a possible implementation of the present application, the first flexible convex hull is provided with a cavity.

[0010] In this possible implementation, the cavity can increase the elastic deformation of the first flexible convex hull.

[0011] According to the first aspect, in a possible implementation of the present application, the flexible component is further provided with a first slot, and at least a portion of the first slot is located on the first flexible convex hull.

[0012] In this possible implementation, the first groove increases the elastic deformation of the first flexible convex hull.

[0013] According to the first aspect, in a possible implementation of the present application, the flexible component further includes a light-through hole and a second flexible convex hull, the light-through hole penetrates the flexible component in the stacking direction, and the second flexible convex hull is arranged on a side of the flexible component facing the projection chip. In a lateral direction perpendicular to the stacking direction, the light-through hole is located between the second flexible convex hull and the first flexible convex hull.

[0014] In this possible implementation, in the lateral direction perpendicular to the stacking direction, the light hole is located between the second flexible convex hull and the first flexible convex hull, which is beneficial to improve the force balance of the projection chip in the lateral direction and improve the flatness between the flexible component and the projection chip.

[0015] According to the first aspect, in a possible implementation of the present application, the flexible component includes a rigid part and a first flexible part fixed on the rigid part. In the stacking direction, the rigid part is located between the first flexible part and the support frame, the first flexible part is located between the rigid part and the projection chip, and the first flexible part is in contact with the projection chip.

[0016] In this possible implementation, since the first flexible component is fixed on the rigid component, when the first flexible component is subjected to pressure from the projection chip, the possibility of warping of the first flexible component is reduced, which is beneficial to improving the stability of the rebound force of the first flexible component and improving the flexible support effect of the flexible component on the circuit board.

[0017] According to the first aspect, in a possible implementation of the present application, the first flexible component is laid on a side of the rigid component facing the projection chip, and the flexible component further includes a light-through hole penetrating the first flexible component and the rigid component in the stacking direction.

[0018] In this possible implementation, the first flexible component is laid on the rigid component, that is, the flexible component is in a stacked structure, which is beneficial to increase the contact area between the flexible component and the projection chip and improve the flatness between the flexible component and the projection chip.

[0019] According to the first aspect, in a possible implementation of the present application, the flexible component further includes a second flexible component separately provided from the first flexible component, the second flexible component is fixed to a side of the rigid component facing the projection chip, and the second flexible component is in contact with the projection chip.

[0020] In this possible implementation, the first flexible component and the second flexible component are separately arranged on the rigid component, and the flexible component is only arranged in a partial area of ​​the rigid component, which helps to reduce the use of flexible materials while achieving flexible support of the projection chip by the flexible component.

[0021] According to the first aspect, in a possible implementation of the present application, the projection chip is fixed to the flexible component, one of the flexible component and the projection chip is provided with a positioning column, and the other of the flexible component and the projection chip is provided with a positioning hole, and the positioning column is passed through the positioning hole.

[0022] In this possible implementation, the positioning post and the positioning hole cooperate with each other to position the projection chip and the flexible component when they are assembled together, which is conducive to improving the assembly efficiency of the projection chip and the flexible component. In addition, the positioning hole can limit the positioning post, which is conducive to reducing the possibility of relative position movement between the projection chip and the flexible component.

[0023] According to the first aspect, in a possible implementation of the present application, the circuit board is provided with a through hole penetrating the circuit board along the stacking direction, and a side of the projection chip facing away from the flexible component can be fitted with the heat conductive boss passing through the through hole.

[0024] The heat-conducting boss is used to conduct the heat generated by the projection chip to the heat sink for heat dissipation, so as to dissipate the heat of the projection chip. The heat-conducting boss can be a part of the heat sink, or the projection chip is connected to the heat sink through the heat-conducting boss. Since the flexible component is located between the projection chip and the support frame, rather than between the projection chip and the circuit board, the flexible component will not increase the thermal resistance between the projection chip and the circuit board, which is conducive to improving the heat conduction efficiency between the projection chip and the heat-conducting boss.

[0025] According to the first aspect, in a possible implementation of the present application, the support frame includes a support plate and a support column protruding from the support plate, the connector, the projection chip and the flexible component are all located between the circuit board and the support plate, the support column is located between the circuit board and the support plate, and the circuit board and the support column are attached and fixed.

[0026] In this possible implementation, the present application directly adheres and fixes the circuit board to the support column. Since there is no need to set up a pressure plate to press the circuit board to the support frame through the pressure plate, it is beneficial to reduce the number of components of the projection chip assembly. The circuit board and the support column are stacked to simplify the structure of the projection chip assembly, thereby further improving the structural compactness of the projection chip assembly.

[0027] According to the first aspect, in a possible implementation of the present application, the projection chip assembly also includes a fastening screw, a first fixing hole is provided on the end surface of the support column away from the support plate, a second fixing hole is provided on the circuit board, and the fastening screw is fixedly passed through the second fixing hole of the circuit board and the first fixing hole of the support column.

[0028] In this possible implementation, the fixed connection between the circuit board and the support column is achieved by fastening the screws, thereby improving the connection stability between the circuit board and the support column.

[0029] According to the first aspect, in a possible implementation of the present application, the flexible component includes at least one of an elastic gasket, an elastic strip, an elastic column, a spring structure, and a spring.

[0030] In a second aspect, an embodiment of the present application further provides a vehicle light module, comprising a light source, a projection lens, and a projection chip assembly according to any possible implementation of the first aspect, wherein the light source is used to output light to the projection chip, and the projection chip is used to modulate the light input to the projection chip to output image light to the projection lens.

[0031] In a third aspect, an embodiment of the present application further provides a vehicle lamp, which includes a lamp housing and a vehicle lamp module according to the second aspect, wherein the vehicle lamp module is arranged on the lamp housing.

[0032] In a fourth aspect, an embodiment of the present application further provides a vehicle, the vehicle comprising a vehicle body and a headlight module according to the second aspect, wherein the headlight module is disposed on the vehicle body. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 A schematic diagram of a vehicle provided in one embodiment of the present application;

[0034] Figure 2 A schematic diagram of the structure of a vehicle-mounted lamp provided in one embodiment of the present application;

[0035] Figure 3A schematic diagram of the structure of a vehicle light module provided in one embodiment of the present application;

[0036] Figure 4 A cross-sectional schematic diagram of a projection chip assembly provided in one embodiment of the present application;

[0037] Figure 5 A schematic diagram of a heat-conducting boss passing through a through hole of a circuit board and fitting with a projection chip;

[0038] Figure 6 A three-dimensional schematic diagram of a flexible component provided in another embodiment of the present application;

[0039] Figure 7 For along Figure 6 A schematic cross-sectional view of line II;

[0040] Figure 8 An embodiment of the present application provides Figure 6 A cross-sectional schematic diagram of a projection chip assembly of a flexible component shown;

[0041] Fig. 9 A top view of a flexible component provided in yet another embodiment of the present application;

[0042] Fig.10 A schematic diagram of a flexible component provided in yet another embodiment of the present application.

[0043] Reference numerals:

[0044] 100. Vehicle; 1. Vehicle body; 2. Vehicle lamp; 201. Lamp housing; 203. Vehicle lamp module; 10. Light source; 30. Projection chip assembly; 31. Support frame; 310. Hollow area; 311. Support plate; 313. Support column; 3131. First fixing hole; 33. Circuit board; 331. Through hole; 333. Second fixing hole; 35. Connector; 37. Projection chip; 371. Positioning column; 38. Flexible component; 380. Light through hole; 381. Positioning hole; 383. Rigid component; 385. First flexible component; 3851. First flexible convex bulge; 3852. Second flexible convex bulge; 3853. Cavity; 3855. First slot; 3856. Second slot; 386. Second flexible component; 39. Fastening screw; 50. Projection lens; 70. Thermal boss; 3. Radiator. DETAILED DESCRIPTION

[0045] Figure 1The schematic diagram of a vehicle 100 provided in one embodiment of the present application, the vehicle 100 may be a car, a truck, a motorcycle, a bus, an entertainment vehicle, an amusement park vehicle, a tram, a golf cart, a cart, etc., and the present embodiment of the application does not specifically limit the type of the vehicle 100. The vehicle 100 may be an electric vehicle or a non-electric vehicle.

[0046] The vehicle 100 includes a vehicle body 1 and a vehicle lamp 2, and the vehicle lamp 2 is arranged on the vehicle body 1. The vehicle lamp 2 can be used to provide lighting and project images. In the present embodiment, the vehicle lamp 2 can be used to form an adaptive driving beam (ADB) system. The ADB system can be used to determine the position and distance of the vehicle in front through the input of the video camera signal, and adjust the lighting area accordingly, turn off or dim the lighting of the opposite vehicle area to avoid glare to the oncoming vehicle, and at the same time maximize the driver's field of vision. In addition to realizing ADB, the vehicle lamp 2 can also be used to project images on the projection surface to improve driving safety and realize rich intelligent car light interaction scenes. Images include symbol icons, video images, etc., and the projection surface may include the ground, wall, etc.

[0047] It is understood that the vehicle 100 may also include a sensor system, a control system, one or more peripheral devices, a power supply, a computer system, a display system, etc. Optionally, the vehicle 100 may also include other functional systems, such as a power system that provides power for the vehicle 100, etc. The present application does not limit the structure of the vehicle 100.

[0048] Figure 2 This is a schematic diagram of the structure of a vehicle lamp 2 provided in one embodiment of the present application, wherein the vehicle lamp 2 includes a lamp housing 201 and a lamp module 203, and the lamp module 203 is mounted on the lamp housing 201. The lamp housing 201 is used to support and protect the lamp module 203. The lamp module 203 is used to project an image on a projection surface. The present application does not limit the structure of the vehicle lamp 2. The vehicle lamp 2 can be a low beam lamp or a high beam lamp of the vehicle 100, etc., and the vehicle lamp 2 can also be set on the bumper of the vehicle body 1 or other structures of the vehicle body 1. It can be understood that the lamp module 203 can also be directly set on the vehicle body 1, and the lamp module 203 can be used to provide lighting and project images.

[0049] See also Figure 3 , Figure 3The schematic diagram of the structure of a vehicle light module 203 provided in one embodiment of the present application, the vehicle light module 203 includes a light source 10, a projection chip assembly 30 and a projection lens 50, and the light source 10 is used to output light to the projection chip assembly 30. The light source 10 can be an illumination light source for providing illumination to the vehicle light 2. The light output by the light source 10 can be monochromatic light, or the light source 10 can output light of two or more colors. The projection chip assembly 30 is used to modulate the light input to the projection chip assembly 30 and output image light to the projection lens 50. The projection lens 50 is used to project the image light outside the vehicle light 2. The projection lens 50 can be a lens or a combination of more than one lens.

[0050] The projection chip is an important component of the intelligent headlight module. In a common headlight module, the projection chip is plugged into the connector on the circuit board, the circuit board is assembled to the structural part, and the projection chip is directly pressed on the structural part through the circuit board. During the assembly process of the circuit board and the structural part, the circuit board will bend and deform under stress to absorb the assembly tolerance. With the demand for miniaturization of headlight modules, the area of ​​the circuit board needs to be reduced, for example, reduced to half the area of ​​the circuit board of the existing headlight module. As the area of ​​the circuit board is reduced, the density of the components on the circuit board will increase. In the process of the circuit board pressing the projection chip to the structural part, the circuit board is prone to bend too much due to the stress exceeding the threshold of the circuit board. In this way, the circuit board and / or the components on the circuit board are easily damaged. For example, the solder feet of the components soldered on the circuit board are cracked, affecting the reliability of the headlight module.

[0051] Based on this, see Figure 4 , Figure 4 The cross-sectional schematic diagram of a projection chip assembly 30 provided in one embodiment of the present application includes a support frame 31, a circuit board 33, a connector 35, a projection chip 37 and a flexible component 38. The support frame 31 is used to support the circuit board 33, the connector 35, the projection chip 37 and the flexible component 38. The circuit board 33 is mounted on the support frame 31. The connector 35 is mounted on the circuit board 33 and is electrically connected to the circuit board 33. The projection chip 37 is installed on the connector 35 and is electrically connected to the connector 35, and the projection chip 37 is located between the connector 35 and the support frame 31. The connector 35 is located between the projection chip 37 and the circuit board 33. The connector 35 is used to realize the electrical connection between the circuit board 33 and the projection chip 37. The projection chip 37 is used to modulate the light input to the projection chip 37 to output image light to the projection lens 50. In the stacking direction of the connector 35 and the circuit board 33, the flexible component 38 is connected between the support frame 31 and the projection chip 37. The flexible component 38 can be elastically deformed to flexibly support the projection chip 37.

[0052] In the projection chip assembly 30 of the present application, in the stacking direction of the connector 35 and the circuit board 33, the flexible component 38 is connected between the support frame 31 and the projection chip 37. Since the flexible component 38 can be elastically deformed, in the process of the circuit board 33 pressing the projection chip 37 to the support frame 31, the flexible component 38 applies an elastic force to the circuit board 33, reducing the stress and bending moment borne by the circuit board 33, thereby reducing the possibility of the circuit board 33 and / or the devices on the circuit board 33 being damaged by cracking of the solder joints due to the bending of the circuit board 33, which is beneficial to improving the reliability of the vehicle light module 203.

[0053] In addition, the flexible component 38 is located between the projection chip 37 and the support frame 31, rather than between the projection chip 37 and the circuit board 33. Since the flexible component 38 does not occupy the board surface of the circuit board 33, while reducing the stress on the circuit board 33, it does not reduce the board surface of the circuit board 33 for arranging other devices, which is conducive to the compact structure and miniaturization of the projection chip assembly 30. The present application does not limit the projection chip assembly 30 to be used in the vehicle light module 203. The projection chip assembly 30 can also be used in other fields, such as electronic equipment and the like.

[0054] The circuit board 33 of the projection chip assembly 30 can also be called an image source board. It can be understood that the connector 35 can be electrically connected to the circuit board 33 by welding, but not limited to welding, and the projection chip 37 can be electrically connected to the connector 35 by plugging, but not limited to plugging.

[0055] The circuit board 33 is provided with a through hole 331 penetrating the circuit board 33 along the stacking direction. Figure 4 and Figure 5 , Figure 5 The schematic diagram shows that the heat-conducting boss 70 passes through the through hole 331 of the circuit board 33 and fits with the projection chip 37. The side of the projection chip 37 facing away from the flexible component 38 can fit with the heat-conducting boss 70 passing through the through hole 331. The heat-conducting boss 70 is used to conduct the heat generated by the projection chip 37 to the heat sink 3 for heat dissipation, so as to dissipate the heat of the projection chip 37. The heat-conducting boss 70 can be a part of the heat sink 3, or the projection chip 37 is connected to the heat sink 3 through the heat-conducting boss 70. The heat sink 3 can include a metal heat sink. The metal heat sink can be air-cooled. The heat sink 3 can also include a liquid cooling module. The liquid cooling module is used to circulate a liquid cooling medium for liquid cooling and heat dissipation. Since the flexible component 38 is located between the projection chip 37 and the support frame 31, rather than between the projection chip 37 and the circuit board 33, the flexible component 38 will not increase the thermal resistance between the projection chip 37 and the circuit board 33, which is conducive to improving the heat conduction efficiency between the projection chip 37 and the heat-conducting boss 70.

[0056] The support frame 31 includes a support plate 311 and a support column 313 protruding from the support plate 311. The support column 313 is used to support the circuit board 33. The support frame 31 can be a lamp housing 201 (such as Figure 2 as shown) or body 1 (as shown Figure 1 The support frame 31 can also be separately provided with the lamp housing 201. The connector 35, the projection chip 37 and the flexible component 38 are all located between the circuit board 33 and the support plate 311, and the support column 313 is located between the circuit board 33 and the support plate 311. The circuit board 33 and the support column 313 are attached and fixed. The circuit board 33 and the support column 313 are stacked along the stacking direction.

[0057] The present application directly adheres and fixes the circuit board 33 to the support column 313. The circuit board 33 is not sleeved on the support column 313. Since there is no need to set up an additional pressure plate to press the circuit board 33 to the support frame 31, it is beneficial to reduce the number of components of the projection chip assembly 30, simplify the structure of the projection chip assembly 30, and further improve the structural compactness of the projection chip assembly 30.

[0058] It can be understood that the present application does not limit the structure of the support frame 31, and the circuit board 33 can be installed on the support frame 31. For example, the support frame 31 may include a bottom wall and a side wall, and the bottom wall and the side wall form a receiving space. The circuit board 33 is fixed to the side wall, and the connector 35, the projection chip 37 and the flexible component 38 are all located between the circuit board 33 and the bottom wall.

[0059] In some embodiments of the present application, the projection chip assembly 30 further includes a fastening screw 39, a first fixing hole 3131 is provided on the end surface of the support column 313 away from the support plate 311, and a second fixing hole 333 is provided on the circuit board 33. The first fixing hole 3131 and the second fixing hole 333 are used to penetrate the fastening screw 39 to achieve a fixed connection between the support column 313 and the circuit board 33. The fastening screw 39 fixes the second fixing hole 333 penetrated through the circuit board 33 and the first fixing hole 3131 of the support column 313. The circuit board 33 and the support column 313 are directly rigidly connected together by the fastening screw 39, which is conducive to improving the connection stability between the circuit board 33 and the support frame 31.

[0060] It is understandable that the present application does not limit the fastener and the support column 313 to be connected together by the fastening screw 39. For example, the circuit board 33 and the support column 313 can be connected by means of clamping, bonding, etc.

[0061] The projection chip 37 may be a liquid crystal on silicon (LCoS) modulator, which is a reflective spatial light modulator having the function of changing the polarization direction of incident linear polarized light. Alternatively, the projection chip 37 may be a reflective spatial light modulator that does not have the function of changing the polarization direction of incident linear polarized light, such as a micro-electro-mechanical system (MEMS) or a digital micro mirror device (DMD). In addition, the projection chip 37 may also be a transmissive spatial light modulator, such as a liquid crystal display (LCD). In this embodiment, the projection chip 37 is a DMD chip.

[0062] In some embodiments of the present application, the projection chip 37 is fixed to the flexible component 38, a positioning column 371 is provided on the side of the projection chip 37 facing the flexible component 38, a positioning hole 381 is provided on the side of the flexible component 38 facing the projection chip 37, and the positioning column 371 is penetrated through the positioning hole 381. The positioning column 371 and the positioning hole 381 cooperate with each other to position the projection chip 37 and the flexible component 38 when they are assembled together, which is conducive to improving the assembly efficiency of the projection chip 37 and the flexible component 38. In addition, the positioning hole 381 can limit the positioning column 371, which is conducive to reducing the possibility of relative position movement between the projection chip 37 and the flexible component 38. In addition, in some possible implementations, the projection chip 37 and the flexible component 38 that are pre-assembled into a whole can be assembled to the connector 35 welded to the circuit board 33, and then the circuit board 33, the connector 35, the projection chip 37 and the flexible component 38 are assembled to the support frame 31.

[0063] It can be understood that a positioning hole 381 is provided on the side of the projection chip 37 facing the flexible component 38, and a positioning column 371 is provided on the side of the flexible component 38 facing the projection chip 37. In other words, one of the flexible component 38 and the projection chip 37 is provided with a positioning column 371, and the other of the flexible component 38 and the projection chip 37 is provided with a positioning hole 381, and the positioning column 371 is passed through the positioning hole 381.

[0064] It is understandable that the flexible component 38 may not be fixed together with the projection chip 37 , and the flexible component 38 may be directly sandwiched between the projection chip 37 and the support plate 311 , or the flexible component 38 may be set on the support frame 31 by bonding or other methods.

[0065] See also Figure 6 , Figure 7 and Figure 8 , Figure 6A three-dimensional schematic diagram of a flexible component 38 provided in another embodiment of the present application, Figure 7 For along Figure 6 The flexible component 38 includes a rigid component 383 and a first flexible component 385 fixed on the rigid component 383. Figure 6 , Figure 7 and Figure 8 , Figure 8 An embodiment of the present application provides Figure 6 The cross-sectional schematic diagram of the projection chip assembly 30 of the flexible component 38 shown in the figure, when the flexible component 38, the circuit board 33, the projection chip 37 and the support frame 31 are assembled together, in the stacking direction, the rigid component 383 is located between the first flexible component 385 and the support frame 31, the first flexible component 385 is located between the rigid component 383 and the projection chip 37, and the first flexible component 385 is in contact with the projection chip 37. The first flexible component 385 can be elastically deformed. Since the first flexible component 385 is fixed on the rigid component 383, when the first flexible component 385 is subjected to the pressure of the projection chip 37, the possibility of the first flexible component 385 being warped is reduced, which is conducive to improving the stability of the rebound force of the first flexible component 385 and improving the flexible support effect of the flexible component 38 on the circuit board 33.

[0066] The rigidity of the rigid part 383 is greater than the rigidity of the first flexible part 385. When the flexible part 38, the circuit board 33, the projection chip 37 and the support frame 31 are assembled together, if the first flexible part 385 is elastically deformed by force, the rigid part 383 does not elastically deform or the elastic deformation of the rigid part 383 can be ignored. The material of the rigid part 383 can be metal, for example, the material of the rigid part 383 can be steel, aluminum alloy, etc. The material of the rigid part 383 can also include non-metal. The material of the first flexible part 385 can include flexible materials such as rubber and silicone. The flexible part 38 can be prepared by a vulcanization process but is not limited to it.

[0067] The flexible component 38 is provided with a light hole 380 that penetrates the first flexible component 385 and the rigid component 383 along the stacking direction, and the support frame 31 is provided with a hollow area 310 corresponding to the light hole 380 of the flexible component 38, and the light from the light source 10 can be projected into the projection chip 37 through the hollow area of ​​the support frame 31 and the light hole 380 of the flexible component 38. The image light modulated by the projection chip 37 is then output through the light hole 380 of the flexible component 38 and the hollow area 310 of the support frame 31.

[0068] In some embodiments of the present application, the first flexible member 385 is laid on the side of the rigid member 383 facing the projection chip 37, and the flexible member 38 also includes a light hole 380 that penetrates the first flexible member 385 and the rigid member 383 in the stacking direction. The first flexible member 385 is laid on the rigid member 383, that is, the flexible member 38 is in a stacking structure, which is conducive to increasing the contact area between the flexible member 38 and the projection chip 37 and improving the flatness between the flexible member 38 and the projection chip 37. The light from the light source 10 is transmitted to the projection chip 37 through the light hole 380, and the projection chip 37 modulates the light from the light source 10 to form image light, and the image light is transmitted to the projection lens 50 through the light hole 380.

[0069] A first flexible convex bump 3851 and a second flexible convex bump 3852 are formed on one side of the first flexible member 385 facing the projection chip 37. The first flexible convex bump 3851 and the second flexible convex bump 3852 are connected to the projection chip 37 so that the flexible member 38 can be closely matched with the projection chip 37. Figure 8 It is exemplarily shown that the first flexible convex hull 3851 and the second flexible convex hull 3852 are squeezed and deformed by the projection chip 37. It can be understood that the number of flexible convex hulls on the first flexible member 385 is not limited. For example, the second flexible convex hull 3852 can be omitted, or the first flexible member 385 can also include a third flexible convex hull or a larger number of flexible convex hulls.

[0070] In the lateral direction perpendicular to the stacking direction, the light hole 380 is located between the second flexible convex bump 3852 and the first flexible convex bump 3851 , which is beneficial to improving the force balance of the projection chip 37 in the lateral direction and improving the flatness between the flexible component 38 and the projection chip 37 .

[0071] The first flexible convex hull 3851 and the second flexible convex hull 3852 are both provided with a cavity 3853, and the cavity 3853 can increase the elastic deformation of the first flexible convex hull 3851 and the second flexible convex hull 3852. It can be understood that the first flexible convex hull 3851 and the second flexible convex hull 3852 can also be a solid structure. In some possible implementations, the flexible component 38 can provide a rebound force of approximately [10N, 50N] within a compression range of an installation tolerance of ±0.4mm.

[0072] The flexible member 38 further includes a first slot 3855 and a second slot 3856. At least a portion of the first slot 3855 is located at the first flexible convex hull 3851, and the first slot 3855 is used to increase the elastic deformation of the first flexible convex hull 3851. At least a portion of the second slot 3856 is located at the second flexible convex hull 3852, and the second slot 3856 is used to increase the elastic deformation of the second flexible convex hull 3852. The first slot 3855 can extend from the first flexible convex hull 3851 to the light-through hole 380 of the first flexible member 385 to further increase the elastic deformation of the first flexible convex hull 3851. The second slot 3856 can extend from the second flexible convex hull 3852 to the light-through hole 380 of the first flexible member 385 to further increase the elastic deformation of the second flexible convex hull 3852. It can be understood that the first slot 3855 and the second slot 3856 of the flexible component 38 can be omitted, or the first slot 3855 on the first flexible convex bump 3851 can be omitted, and / or the second slot 3856 on the second flexible convex bump 3852 can be omitted.

[0073] See also Fig. 9 , Fig. 9 A top view of a flexible component 38 provided for another embodiment of the present application, wherein the flexible component 38 further includes a second flexible component 386 separately provided from the first flexible component 385, the second flexible component 386 being fixed to the side of the rigid component 383 facing the projection chip 37, and the second flexible component 386 being in contact with the projection chip 37. The first flexible component 385 and the second flexible component 386 are separately provided on the rigid component 383, and the flexible component is provided only in a part of the rigid component 383, which is conducive to reducing the use of flexible materials while realizing the flexible support of the projection chip 37 by the flexible component 38. The first flexible component 385 and the second flexible component 386 are roughly strip-shaped. In the lateral direction perpendicular to the stacking direction, the light-through hole 380 is located between the second flexible component 386 and the first flexible component 385. The positioning hole 381 is provided on the rigid component 383. In some embodiments, at least one of the first flexible component 385 and the second flexible component 386 may be provided with a flexible convex hull. It is understood that a positioning post may also be provided on the rigid component 383.

[0074] See also Fig.10 , Fig.10A schematic diagram of a flexible component 38 provided for another embodiment of the present application, wherein the rigid component 383 can be omitted from the flexible component 38, and the flexible component 38 can be a spring structure capable of elastic deformation. Before elastic deformation, the spring structure is roughly a curved structure, and the two opposite end faces of the spring structure in the height direction of the spring structure are curved structures. The projection of the spring structure on the projection chip is roughly a planar structure. In some embodiments, the flexible component 38 may include at least one of an elastic gasket, a spring structure, an elastic column, an elastic strip, and a spring. Before elastic deformation, the elastic gasket is roughly a flat plate structure, and the two opposite end faces of the elastic gasket in the height direction of the elastic gasket are roughly planes. The positive projection of the elastic gasket on the projection chip is a planar structure. The elastic column extends along the stacking direction, and the elastic column is roughly cylindrical. Compared with the elastic gasket and the spring structure, the positive projection of the elastic column on the projection chip is roughly a point-shaped structure. The positive projection of the elastic strip on the projection chip is generally a strip structure or a linear structure.

[0075] The present application does not limit the shape and structure of the flexible component 38. The material of the flexible component 38 may include metal and / or non-metal, and the flexible component 38 can be elastically deformed. The present application does not limit the material of the flexible component 38.

[0076] In the absence of conflict or contradiction, the various implementation modes of the present application can be combined with each other.

[0077] It should be understood that expressions such as "including" and "may include" that may be used in the present application indicate the existence of the disclosed functions, operations, or constituent elements, and do not limit one or more additional functions, operations, and constituent elements. In the present application, terms such as "including" and / or "having" may be interpreted as indicating specific characteristics, numbers, operations, constituent elements, components, or combinations thereof, but may not be interpreted as excluding the existence or possibility of adding one or more other characteristics, numbers, operations, constituent elements, components, or combinations thereof.

[0078] In addition, in the present application, the expression "and / or" includes any and all combinations of the associated listed words. For example, the expression "A and / or B" may include A, may include B, or may include both A and B.

[0079] In the present application, expressions including ordinal numbers such as "first" and "second" may modify various elements. However, such elements are not limited by the above expressions. For example, the above expressions do not limit the order and / or importance of the elements. The above expressions are only used to distinguish one element from other elements. For example, a first user device and a second user device indicate different user devices, although the first user device and the second user device are both user devices. Similarly, without departing from the scope of the present application, a first element may be referred to as a second element, and similarly, a second element may also be referred to as a first element.

[0080] When a component is referred to as being "connected" or "accessed" to another component, it should be understood that the component is not only directly connected to or accessed to the other component, but also another component may exist between the component and the other component. On the other hand, when a component is referred to as being "directly connected" or "directly accessed" to another component, it should be understood that there is no component between them.

[0081] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A projection chip assembly (30), characterized in that: The projection chip assembly (30) comprises a support frame (31), a circuit board (33), a connector (35), a projection chip (37) and a flexible component (38); The circuit board (33) is mounted on the support frame (31); The connector (35) is mounted on the circuit board (33) and is electrically connected to the circuit board (33); The projection chip (37) is installed on the connector (35) and is electrically connected to the connector (35); the projection chip (37) is located between the connector (35) and the support frame (31); and the connector (35) is located between the projection chip (37) and the circuit board (33); In the stacking direction of the connector (35) and the circuit board (33), the flexible component (38) is connected between the support frame (31) and the projection chip (37).

2. The projection chip assembly (30) according to claim 1, characterized in that: A first flexible convex bump (3851) is formed on a side of the flexible component (38) facing the projection chip (37), and the first flexible convex bump (3851) is connected to the projection chip (37).

3. The projection chip assembly (30) according to claim 2, characterized in that: The first flexible convex bulge (3851) is provided with a cavity (3853).

4. The projection chip assembly (30) according to claim 2, characterized in that: The flexible component (38) is also provided with a first slot (3855), and at least a portion of the first slot (3855) is located on the first flexible convex bump (3851).

5. The projection chip assembly (30) according to claim 2, characterized in that: The flexible component (38) further comprises a light-through hole (380) and a second flexible convex hull (3852), wherein the light-through hole (380) penetrates the flexible component (38) in the stacking direction, and the second flexible convex hull (3852) is arranged on a side of the flexible component (38) facing the projection chip (37); In the lateral direction perpendicular to the stacking direction, the light-through hole (380) is located between the second flexible convex hull (3852) and the first flexible convex hull (3851).

6. The projection chip assembly (30) according to claim 1, characterized in that: The flexible component (38) comprises a rigid component (383) and a first flexible component (385) fixed on the rigid component (383); in the stacking direction, the rigid component (383) is located between the first flexible component (385) and the support frame (31); the first flexible component (385) is located between the rigid component (383) and the projection chip (37); and the first flexible component (385) is in contact with the projection chip (37).

7. The projection chip assembly (30) according to claim 6, characterized in that: The first flexible member (385) is laid on a side of the rigid member (383) facing the projection chip (37), and the flexible component (38) further comprises a light-through hole (380) penetrating the first flexible member (385) and the rigid member (383) in the stacking direction.

8. The projection chip assembly (30) according to claim 6, characterized in that: The flexible component (38) further comprises a second flexible component (386) which is arranged separately from the first flexible component (385); the second flexible component (386) is fixed on a side of the rigid component (383) facing the projection chip (37); the second flexible component (386) is in contact with the projection chip (37).

9. The projection chip assembly (30) according to claim 1, characterized in that: The projection chip (37) is fixed to the flexible component (38); one of the flexible component (38) and the projection chip (37) is provided with a positioning column (371); the other of the flexible component (38) and the projection chip (37) is provided with a positioning hole (381); the positioning column (371) is inserted into the positioning hole (381).

10. The projection chip assembly (30) according to claim 1, characterized in that: The circuit board (33) is provided with a through hole (331) penetrating the circuit board (33) along the stacking direction, and a surface of the projection chip (37) facing away from the flexible component (38) can be fitted with a heat-conducting boss (70) passing through the through hole (331).

11. The projection chip assembly (30) according to claim 1, characterized in that: The support frame (31) comprises a support plate (311) and a support column (313) protruding from the support plate (311); the connector (35), the projection chip (37) and the flexible component (38) are all located between the circuit board (33) and the support plate (311); the support column (313) is located between the circuit board (33) and the support plate (311); and the circuit board (33) and the support column (313) are fitted and fixed.

12. The projection chip assembly (30) according to claim 11, characterized in that: The projection chip assembly (30) further comprises a fastening screw (39); an end surface of the support column (313) away from the support plate (311) is provided with a first fixing hole (3131); the circuit board (33) is provided with a second fixing hole (333); the fastening screw (39) is fixedly inserted through the second fixing hole (333) of the circuit board (33) and the first fixing hole (3131) of the support column (313).

13. The projection chip assembly (30) according to claim 1, characterized in that: The flexible component (38) comprises at least one of an elastic gasket, an elastic strip, an elastic column, a spring structure, and a spring.

14. A vehicle light module (203), characterized in that: The vehicle light module (203) comprises a light source (10), a projection lens (50) and a projection chip assembly (30) according to any one of claims 1 to 13, wherein the light source (10) is used to output light to the projection chip (37), and the projection chip (37) is used to modulate the light input to the projection chip (37) to output image light to the projection lens (50).

15. A vehicle-mounted lamp (2), characterized in that: The vehicle lamp (2) comprises a lamp housing (201) and a vehicle lamp module (203) according to claim 14, wherein the vehicle lamp module (203) is mounted on the lamp housing (201).

16. A vehicle (100), characterized in that: The vehicle (100) comprises a vehicle body (1) and a vehicle light module (203) according to claim 14, wherein the vehicle light module (203) is arranged on the vehicle body (1).

Images