Developing box

Abstract

The utility model discloses a developing box which is detachably arranged on an electronic imaging device, the electronic imaging device comprises a chip contact head, the chip contact head is provided with a side surface, and the developing box comprises a box body and a developing box cover, the storage unit is arranged on the box body, the storage unit comprises a chip and a conductive connecting piece, and the conductive connecting piece is electrically connected with the chip; the force receiving part is movably arranged on the developing box, and at least part of the conductive connecting piece is located on the upper side of the force receiving part; when the force receiving part receives the force of the electronic imaging device to move, the conductive connecting piece can be driven to move upwards, so that the conductive connecting piece abuts against and is electrically connected with the side face of the chip contact head on the upper surface. When the developing box is installed on the electronic imaging device, the conductive connecting piece abuts against and is electrically connected with the side face of the chip contact head, so that the chip contact head on the electronic imaging device cannot retract, the problem that follow-up connection cannot be achieved due to elastic failure of the chip contact head can be effectively solved, and the requirement for long-term use of the electronic imaging device is met.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic imaging devices, in particular to a developing box. Background Art

[0002] The electrophotographic imaging device forms an image on a recording material by using an electrophotographic imaging type. Electrophotographic imaging devices include electrophotographic copiers, electrophotographic printers (LED printers, laser beam printers, etc.), fax machines, multi-function machines with multiple functions of these machines, word processors, etc. Usually, the electrophotographic imaging device has a detachable processing box, and such processing boxes can be divided into two types: an integrated box and a split box, wherein the split box is a box in which a developing box and a drum assembly with a photosensitive drum are separately arranged, and the developing box can be detachably installed in the drum assembly. Such a developing box usually includes: a box body containing a developer, a developing roller and a chip, etc. The chip includes a chip terminal, and the developing box is connected to the chip contact head on the electrophotographic imaging device through the chip terminal to realize data communication, such as recording the remaining toner amount of the developing box, whether the developing box is new, the remaining service life of the developing roller and the powder feeding roller, and other data.

[0003] There is a developing box that can be detachably installed in an electronic imaging device, wherein a chip terminal is arranged on the rear end face of the developing box to form an electrical connection with a chip contact head on the electronic imaging device, wherein the chip contact head has a predetermined elasticity to ensure effective contact with the chip terminal. Under this setting, the elasticity of the chip contact head may fail due to long-term use of the electronic imaging device, so when the user replaces the developing box with a new one, the chip terminal and the chip contact head may be unable to connect, thereby affecting the long-term use of the electronic imaging device.

[0004] Therefore, a solution to the above problems is needed. Utility Model Content

[0005] According to one aspect of the utility model, a developing box is provided, which is detachably mounted on an electronic imaging device, wherein the electronic imaging device comprises a chip contact head, wherein the chip contact head has a side surface, and the developing box comprises:

[0006] A box body having an upper surface;

[0007] A storage unit is arranged on the box body, the storage unit comprises a chip and a conductive connecting member, and the conductive connecting member is electrically connected to the chip;

[0008] A force receiving portion, movably disposed on the developing box, wherein at least a portion of the conductive connecting member is located on an upper side of the force receiving portion;

[0009] When the force receiving portion receives the force movement of the electronic imaging device, it can drive the conductive connecting member to move upward, so that the conductive connecting member abuts against and is electrically connected to the side surface of the chip contact head on the upper surface.

[0010] In some embodiments, the conductive connector has an electrical contact portion for contacting the chip contact head, and the electrical contact portion is at least partially exposed outside the upper surface.

[0011] In some embodiments, the electrical contact portion is at least partially located on an upper side of at least part of the force receiving portion;

[0012] When the force receiving portion receives the force movement of the electronic imaging device, it can drive the electrical contact portion to move upward, so that the conductive connecting member contacts the side surface of the chip contact head.

[0013] In some embodiments, the force receiving portion includes one or more force receiving portions for receiving the force of the electronic imaging device.

[0014] In some embodiments, the force receiving portion includes a supporting portion for supporting the electrical contact portion, and the number of the supporting portions matches the number of the conductive connectors and is arranged in a one-to-one correspondence.

[0015] In some embodiments, at least one of the supporting portions is connected to one of the force-bearing portions.

[0016] In some embodiments, the electrical contact portion is disposed close to the force receiving portion.

[0017] In some embodiments, the number of the conductive connecting members is plural, and the number of the force receiving portions is plural and are arranged in a one-to-one correspondence with the conductive connecting members.

[0018] In some embodiments, a plurality of the force-bearing portions are connected to form a rib structure.

[0019] In some embodiments, the box further includes a chip holder detachably mounted on the box body, wherein the chip and the conductive connector are mounted on the chip holder.

[0020] In some embodiments, the force receiving portion is movably disposed on the chip holder.

[0021] In some embodiments, the force receiving portion includes a connection end connected to the chip holder and an extension section connected to the connection end and extending upward and backward.

[0022] In some embodiments, the box body further includes a chip cover detachably mounted on the box body, the chip is mounted in the chip cover, and the conductive connector is mounted on the box body.

[0023] In some embodiments, a limiting portion is further included, and the limiting portion is at least partially located above the electrical contact portion to limit the upward movement range of the electrical contact portion.

[0024] In some embodiments, the limiting portion is disposed on the box body or the chip holder.

[0025] In some embodiments, the limiting portion is a limiting rib, and the limiting rib is provided with a guiding surface of an inclined surface or an arc surface, and the guiding surface can guide the chip contact head to abut against the conductive connecting member.

[0026] In some embodiments, the electrical contact portion is arranged to be inclined downward relative to the upper surface.

[0027] In some embodiments, the chip holder is mounted to the box body in a direction from back to front, from top to bottom, or from bottom to top.

[0028] In some embodiments, the box body has a rear surface;

[0029] The conductive connection member is not exposed outward from the rear surface of the box body.

[0030] The beneficial effects of the utility model are as follows: the utility model realizes electrical connection between the electronic imaging device and the chip in the developing box by arranging a conductive connector on the developing box, and the utility model arranges the conductive connector on the upper surface of the developing box to expose it outwardly from the upper surface. At the same time, when the developing box is installed in the electronic imaging device, the conductive connector abuts against and is electrically connected to the side of the chip contact head, so that the chip contact head is electrically connected to the chip. Under this contact connection mode, the chip contact head on the electronic imaging device will not retract, which can effectively avoid the problem of subsequent inability to connect due to elastic failure of the chip contact head, thereby meeting the needs of long-term use of the electronic imaging device. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a structural schematic diagram of an electronic imaging device in the prior art;

[0032] Figure 2 A diagram showing the matching relationship between a chip contact head, a compression spring and a circuit board in the prior art;

[0033] Figure 3 It is a three-dimensional structural schematic diagram of the developing box of the first embodiment at one angle;

[0034] Figure 4 It is a schematic diagram of the three-dimensional structure of the developing box of the first embodiment from another angle;

[0035] Figure 5 It is a schematic diagram of the exploded structure of the developing box and the storage unit of the first embodiment;

[0036] Figure 6 It is a schematic diagram of the combination of the storage unit and the chip tray of the first embodiment;

[0037] Figure 7 It is a schematic structural diagram of a chip, a conductive connecting member and a chip holder of the first embodiment;

[0038] Figure 8 is a side partial cross-sectional view of the developing cartridge of the first embodiment;

[0039] Fig. 9 It is a partial matching schematic diagram of the developing box and the chip contact head of the first embodiment;

[0040] Fig.10 It is a three-dimensional structural schematic diagram of a developing box of Embodiment 2 at one angle;

[0041] Fig.11 It is a schematic diagram of the three-dimensional structure of the developing box of the second embodiment from another angle;

[0042] Fig.12 It is a schematic diagram of the exploded structure of the developing box and the storage unit of the second embodiment;

[0043] Fig.13 A schematic diagram of the combination of a storage unit and a chip tray according to the second embodiment;

[0044] Fig.14 It is a schematic structural diagram of a chip, a conductive connecting member and a chip holder of the second embodiment;

[0045] Fig.15 is a side partial cross-sectional view of the developing cartridge of the second embodiment;

[0046] Fig.16 It is a schematic diagram of the cooperation between the developing box, the door cover and the chip contact head of the second embodiment;

[0047] Fig.17 for Fig.16 A partial enlarged schematic diagram of the H in the middle;

[0048] Fig.18 It is a partial structural schematic diagram of a developing box of Embodiment 3 at one angle;

[0049] Fig.19 It is a schematic diagram of the partial structure of the developing box of the third embodiment from another angle;

[0050] Fig. 20 It is a schematic diagram of the exploded structure of the developing box and the storage unit of the third embodiment;

[0051] Fig.21 This is a schematic diagram of the combination of the storage unit and the chip tray of the third embodiment;

[0052] Fig. 22 It is a partial structural schematic diagram of the developing box of the fourth embodiment;

[0053] Fig.23 It is a schematic diagram of the combination of the storage unit and the chip tray of the fourth embodiment;

[0054] Fig.24 It is a partial matching schematic diagram of the developing box and the chip contact head of the fourth embodiment;

[0055] Fig.25 It is a structural schematic diagram of a developing box of Embodiment 5 at one angle;

[0056] Fig.26 It is a structural schematic diagram of the developing box of Embodiment 5 from another angle;

[0057] Fig. 27 for Fig.26 A schematic diagram of the enlarged structure of the I position in the middle;

[0058] Fig.28 It is a schematic diagram of the exploded structure of the developing box of the fifth embodiment;

[0059] Fig.29 for Fig.28 A schematic diagram of the enlarged structure of the J position in the middle;

[0060] Fig.30 is a three-dimensional diagram of the conductive connecting member of the fifth embodiment;

[0061] Fig.31 A three-dimensional diagram of the chip of Embodiment 5 installed in the chip protection cover;

[0062] Fig.32 is a perspective view of the developing cartridge of Embodiment 6 as viewed from the rear side;

[0063] Fig.33 for Fig.32 Schematic diagram of the enlarged structure of the K position;

[0064] Fig.34 It is a schematic diagram of the exploded structure of the developing box of the sixth embodiment;

[0065] Fig.35 for Fig.34 Schematic diagram of the enlarged structure of the L position;

[0066] Fig.36 is a three-dimensional diagram of a storage unit of Embodiment 6 installed on a chip tray;

[0067] Fig.37 It is a schematic diagram of the exploded structure of the storage unit and the chip tray of the sixth embodiment;

[0068] Fig.38 is a perspective view of the developing cartridge of Embodiment 7 observed from the rear side;

[0069] Fig.39 for Fig.38 A schematic diagram of the enlarged structure of the M position;

[0070] Fig.40 This is a diagram of the installation structure of the conductive connecting member and the chip holder of the seventh embodiment. DETAILED DESCRIPTION

[0071] The utility model is further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0072] It should be noted that the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0073] In the present invention, unless otherwise clearly specified and limited, the terms "installation", "connection", "fixation" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0074] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0075] In the above description, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0076] Embodiment 1

[0077] like Figure 1 As shown, the electronic imaging device 1 forms an image on a recording material using, for example, an electronic photographic imaging process. The electronic imaging device 1 includes, for example, an electronic photographic copier, an electronic photographic printer (LED printer, laser printer, etc.), an electronic photographic printer-type fax machine, etc. A developing cartridge is detachably mounted in the electronic imaging device 1. The electronic imaging device 1 includes a drum assembly having a photosensitive member, and the developing cartridge has a developing member for developing an electrostatic latent image formed on the photosensitive member. The electronic imaging device 1 includes a driving head, and the driving head is used to transmit the driving force of the electronic imaging device 1 to the developing cartridge to make the developing cartridge work. The electronic imaging device 1 includes a main body 10 and a door cover 11. The main body 10 constitutes the appearance of the electronic imaging device 1 and supports various components installed therein. One or more developing cartridges can be accommodated in the main body 10, and multiple developing cartridges can accommodate developers of the same or different colors. The door cover 11 is pivotally connected to one side of the main body 10 to open and close the opening portion of the main body 10. The user can replace or repair the developing cartridge after opening the door cover 11.

[0078] like Figure 3 and Figure 4 As shown, the developing box 200 includes a box body 2, a developing roller 22, a powder feeding roller, a driving force receiving unit 23, a conductive unit 24, a storage unit and a handle. The box body 2 includes a cover body and a powder bin bracket 21, and the cover body and the powder bin bracket 21 together enclose a powder bin for accommodating the developer. The developing roller 22 and the powder feeding roller are rotatably supported on the box body 2, and the driving force receiving unit is arranged at one end of the box body 2 in the length direction, and is used to receive and transmit the driving force of the electronic imaging device 1, thereby driving the developing roller 22, the powder feeding roller and other components to rotate. The conductive unit 24 is arranged at the other end of the developing box 200 in the length direction, and is used to receive the voltage of the electronic imaging device 1 and transmit the voltage to the developing roller 22, the powder feeding roller and other components. The storage unit stores information related to the developing box 200 (lifespan, model, new and old, etc.).

[0079] In order to facilitate the detailed description of the structure of the developing box 200 of this embodiment, as shown in FIG. Figure 3 to Figure 4 As shown, the installation direction of the developing box 200 installed on the electronic imaging device 1 is set to the X-axis direction, the X-axis direction is also the width direction of the developing box 200, the length direction of the developing box 200 is the Y-axis direction, and the direction perpendicular to the X-axis direction and the Y-direction is the Z-axis direction, which is also the height direction of the developing box 200.

[0080] like Figure 3 and Figure 4 As shown, the developing box 200 is roughly in the shape of a rectangular parallelepiped, and has an upper surface A, a lower surface B, a right surface C, a left surface D, a front surface E and a rear surface F. In the direction in which the developing box 200 is installed to the electronic imaging device 1, the upper surface A is on the upper side of the installing direction of the developing box 200, the left surface D is on the left side of the installing direction of the developing box 200, and the front surface E is on the front side of the installing direction of the developing box 200. In the X direction, the direction from the rear surface F to the front surface E is the +X direction, that is, the installing direction of the developing box 200 is the +X direction. The developing roller 22 is arranged on the front side of the developing box 200, and the handle is arranged on the rear side of the developing box 200. The direction from the lower surface B to the upper surface A is the +Z direction, and the direction from the right surface C to the left surface D is the +Y direction. The driving force receiving unit 23 is located on the right surface C of the developing box 200, and the conductive unit 24 is located on the left surface D of the developing box 200.

[0081] like Figure 1 and Figure 2 As shown, the electronic imaging device 1 is provided with a chip contact head group 13, which includes a plurality of chip contact heads, each of which is provided with a chip contact head end face 131 and a chip contact head side face 132; the storage unit is installed on the box body 2, and is arranged closer to the conductive unit 24 of the developing box 200 than the driving force receiving unit 23 of the developing box 200, and the storage unit stores information such as the ink volume and model of the developing box 200. When the developing box 200 is installed in the electronic imaging device 1, the chip contact head on the electronic imaging device 1 can abut against the storage unit, so that the electronic imaging device 1 can be electrically connected to the storage unit, so that the electronic imaging device 1 can read the information on the developing box 200. Among them, the electronic imaging device 1 includes a main body 10 and a door cover 11, wherein the door cover 11 is arranged on the main body 10 in a manner of rotating around a horizontally arranged rotating shaft, and the door cover 11 is located at the rear side of the main body 10 relative to the direction in which the developing box 200 is installed to the electronic imaging device 1 +X axis direction, and the rotation of the door cover 11 can open or close the main body 10.

[0082] The chip contact head group 13 is arranged on the door cover 11, and there are multiple groups of chip contact head groups 13 on the door cover 11, each group of chip contact head groups 13 corresponds to a developer box 200, and the chip contacts in each group of chip contact head groups 13 are arranged along the length direction L of the developer box 200. The chip contact head protrudes from the surface on the inner side of the door cover 11, and is roughly cylindrical, including a chip contact head side surface 132 located on the circumference of the chip contact head and a chip contact head end surface 131 located at the end of the chip contact head. Inside the door cover 11, one end of the chip contact head contacts with the compression spring 14 and is electrically connected to the circuit board 111 located in the door cover 11 through the compression spring 14, so that the chip contact head can be elastically retracted. Optionally, the chip contact head can also be prism-shaped, also with side surfaces and end surfaces, and its specific structure is not strictly limited.

[0083] like Figures 3 to 9 As shown, the storage unit includes a chip 25 and a conductive connector 26, and the conductive connector 26 is electrically connected to the chip 25. After the developer box 200 is installed in the electronic imaging device 1, during the closing process of the door cover 11, the chip contact head approaches the storage unit from the back to the front (that is, the +X axis direction) as the door cover 11 rotates. After the door cover 11 is completely closed, the conductive connector 26 contacts and electrically connects to the side surface 132 of the chip contact head, thereby establishing communication between the chip 25 and the electronic imaging device 1, so that the electronic imaging device 1 can read information related to the developer box 200 from the chip 25.

[0084] like Figure 7 As shown, the chip 25 includes a substrate 251 and a plurality of terminals 252 disposed on the surface of the substrate 251 . In this embodiment, the number of the terminals 252 is four, and the plurality of terminals 252 are arranged at intervals, preferably along the length direction of the developing box 200 .

[0085] like Figure 3 , Figure 6 and Figure 7As shown, the number of conductive connectors 26 matches the number of terminals 252, and each terminal 252 is electrically connected to a conductive connector 26. The conductive connector 26 is at least partially located on the upper surface A of the developer box 200 and exposed outside the upper surface A, specifically exposed at a position of the upper surface A close to the rear surface F, and the rear end (one end in the -X axis direction) of the conductive connector 26 does not protrude from the rear surface F of the box body 2 (i.e., does not protrude from one end of the box body 2 in the -X axis direction). The conductive connector 26 has an electrical contact portion 261 for contacting the chip contact head on the electronic imaging device 1, and the electrical contact portion 261 can be the surface of the conductive connector 26, and the electrical contact portion 261 is exposed outside the upper surface A of the developer box 200. The conductive connector 26 may be a flexible and bendable metal sheet, so the chip 25 may be disposed at any position of the developing box 200, and the bendable conductive connector 26 extends to the position of the chip 25 to contact it, and the electrical contact portion 261 of the conductive connector 26 can be ensured to be exposed outside the upper surface A. The conductive connector 26 also includes an electrical connection portion 262 for contacting the terminal 252 of the chip 25, and the electrical connection portion 262 may be an arm portion extending from the conductive connector 26, and the electrical connection portion 262 is elastic, and when it abuts against the terminal 252, it will produce a certain deformation, so that the electrical connection portion 262 is close to the terminal 252, and the electrical connection between the conductive connector 26 and the terminal 252 can be more stable.

[0086] Further, such as Figures 5 to 7 As shown, the developing box 200 further includes a chip holder 27, which is detachably mounted on the developing box 200, and the chip 25 and the conductive connector 26 (storage unit) are mounted on the chip holder 27, and then mounted together on the developing box 200. The chip holder 27 is detachably mounted on the powder bin bracket 21 of the developing box 200, and the powder bin bracket 21 is provided with a mounting position for combining with the chip holder 27 at the intersection of the upper surface A and the rear surface F. Specifically, the mounting position is a hole or a groove formed on the powder bin bracket 21, and a part of the chip holder 27 is inserted from the hole or the groove and then fixed on the powder bin bracket 21, so that the chip 25 and the conductive connector 26 are mounted on the developing box 200.

[0087] like Figures 5 to 7As shown, the chip holder 27 has a body 271, and a first mounting portion 272, a second mounting portion 273 and a snap-fit ​​structure are provided on the body 271. The first mounting portion 272 is used to mount the conductive connector 26, the second mounting portion 273 is used to mount the chip 25, and the snap-fit ​​structure is used to snap-fit ​​with the powder bin bracket 21, so as to fix the chip holder 27 on the powder bin bracket 21. Specifically, the body 271 is roughly in the shape of a rectangular block, and the second mounting portion 273 is a groove formed on the body 271, the opening of the groove is located on the +X axis side of the body 271, and the chip 25 can be inserted into the second mounting portion 273 from the opening. The conductive connector 26 includes a fixing portion 264, which is fixed on the first mounting portion 272 and is located on the surface of the body 271 in the +Z axis direction. The electrical contact portion 261 of the conductive connector 26 is connected to one end of the fixing portion 264 in the -X axis direction, and the electrical contact portion 261 is also located on the surface of the body 271 in the +Z axis direction. The first mounting portion 272 is a sheet-like protrusion formed on the upper surface of the body 271 (that is, the surface in the +Z axis direction), and the first mounting portion 272 is arranged close to the +X axis end of the body 271. A portion of the conductive connector 26 extends backward and downward (that is, toward the -X and -Z directions) from one end of the fixing portion 264 in the -X axis direction, and extends to the -X axis side of the first mounting portion 272 and is not supported by the first mounting portion 272, that is, the electrical contact portion 261 of the conductive connector 26 is formed. In summary, the electrical contact portion 261 can be formed by oblique extension from the fixing portion 264. The conductive connector 26 can be fixed to the first mounting portion 272 by means of gluing, welding, etc. The other part of the conductive connector 26 is bent from one end of the fixing portion 264 in the +X axis direction and inserted into the second mounting portion 273. The electrical connection portion 262 of the conductive connector 26 is located in this part bent into the second mounting portion 273 and contacts the terminal 252 of the chip 25 in the second mounting portion 273.

[0088] Further, such as Figure 6 and Figure 7 As shown, a positioning portion 2721 is provided on the first mounting portion 272, and a positioned portion 263 cooperating with the positioning portion 2721 is provided on the fixing portion 264 of the conductive connector 26. The positioning portion 2721 is a protrusion, and the positioned portion 263 is a through hole. The protrusion and the through hole cooperate to quickly position the conductive connector 26 to the accurate position on the chip holder 27 when assembling, and the installation is faster.

[0089] like Figure 6 and Figure 7As shown, the clamping structure includes a first clamping portion 274 and a second clamping portion 275, and the first clamping portion 274 and the second clamping portion 275 are respectively arranged at two ends of the body 271 in the Y-axis direction. In some other embodiments, the first clamping portion 274 and the second clamping portion 275 can also be located at two ends of the body 271 in the Z-axis direction or the X-axis direction, and the arrangement positions of the first clamping portion 274 and the second clamping portion 275 can be adjusted according to the actual assembly direction of the chip tray 27.

[0090] Specifically, the first engaging portion 274 is disposed at one end of the body 271 in the Y-axis direction. The first engaging portion 274 may include an elastic arm, one end of which is connected to the body 271, and the other end (free end) extends in the direction opposite to the assembly direction of the chip holder 27, that is, when the assembly direction of the chip holder 27 is installed on the powder bin bracket 21 from bottom to top (along the +Z-axis direction), the free end of the elastic arm extends in the -Z-axis direction. A locking protrusion 2741 is provided on the side of the elastic arm away from the body 271, and the locking protrusion 2741 has a locking surface, which faces the direction opposite to the assembly direction of the chip holder 27 (-Z-axis direction). The locking protrusion 2741 also has a guide surface, which is located on the +Z-axis side of the locking surface, and the guide surface is a surface inclined in the +Z-axis and -Y-axis directions.

[0091] like Figure 6 As shown, a first protrusion 2742 can also be set at the end of the free end of the elastic arm. The first protrusion 2742 faces away from the main body 271. The first protrusion 2742 is located on the -Z axis side of the engaging protrusion 2741. When removing the chip holder 27, the first protrusion 2742 can be pressed to apply force to the elastic arm to deform the elastic arm out of the engaging position.

[0092] like Figure 6 and Figure 7 As shown, the second engaging portion 275 is disposed at one end of the body 271 in the −Y axis direction, and the second engaging portion 275 is a second protrusion formed on the body 271. Optionally, the second engaging portion 275 may also be the same structure as the first engaging portion 274.

[0093] like Figure 5 As shown, correspondingly, the powder bin bracket 21 is provided with a first combination portion 212 and a second combination portion 213, which are respectively used to engage with the first engaging portion 274 and the second engaging portion 275, and the first combination portion 212 and the second combination portion 213 are respectively provided at two ends of the installation position in the Y-axis direction. The first combination portion 212 is a slot that matches the engaging protrusion 2741, and the second combination portion 213 is a slot that matches the second protrusion.

[0094] like Figures 5 to 8As shown, during assembly, the chip 25 can be first installed in the second installation portion 273 of the chip holder 27, and then the conductive connector 26 can be installed on the first installation portion 272 to form a combination, and then the combination is installed on the powder bin bracket 21 from the lower side to the upper side (along the +Z axis direction) of the developer box 200, and the chip holder 27 is engaged and fixed with the powder bin bracket 21. After the assembly is completed, the electrical contact portion 261 of the conductive connector 26 is located on the upper surface A of the box body 2 and exposed outside the upper surface A. For the solution of using the chip holder 27 to install the combination on the developer box 200, the end surface of the chip holder 27 in the -X axis direction constitutes a part of the rear surface F of the box body 2. In this embodiment, the rear end (one end in the -X axis direction) of the conductive connector 26 does not protrude from the rear end of the chip holder 27, that is, it does not protrude from the rear surface F of the box body 2.

[0095] In some other embodiments, the assembly direction of the chip holder 27 may also be from top to bottom (i.e., along the -Z axis direction), then the free end of the elastic arm of the first locking portion 274 extends toward the +Z axis direction, and the locking surface on the locking protrusion 2741 faces the direction opposite to the assembly direction of the chip holder 27 (the +Z axis direction).

[0096] In some other embodiments, the assembly direction of the chip holder 27 may also be from back to front (i.e., along the +X axis direction), then the free end of the elastic arm of the first locking portion 274 extends toward the -X axis direction, and the locking surface on the locking protrusion 2741 faces the direction opposite to the assembly direction of the chip holder 27 (-X axis direction).

[0097] Further, such as Figures 3 to 8As shown, the developing box 200 also includes a force receiving portion 276, which is movably arranged on the developing box 200, and the electrical contact portion 261 of the conductive connecting member 26 is at least partially located on the upper side (+Z axis side) of at least part of the force receiving portion 276. Preferably, the force receiving portion 276 is movably arranged on the chip holder 27. The force receiving portion 276 includes a connecting end 2761, an extension section 2762, a support portion 2764 and a force receiving portion 2763 that are connected and arranged. The connecting end 2761 of the force receiving portion 276 is connected to the chip holder 27, the extension section 2762 extends upward and backward (i.e., toward the +Z and -X directions) from the connecting end 2761, the support portion 2764 is connected to one end of the extension section 2762 in the +Z axis direction, the support portion 2764 is a block-shaped component, and the electrical contact portion 261 at least partially abuts against the upper end (one end in the +Z axis direction) of the support portion 2764. The electrical contact portion 261 is arranged downwardly at an angle relative to the upper surface A. Specifically, the electrical contact portion 261 extends downwardly and backwardly (i.e., toward the -Z, -X direction) from one end of the -X axis of the fixing portion 264 to the upper end of the support portion 2764 and is supported by the support portion 2764. The purpose of the electrical contact portion 261 being arranged at an angle is to make it easier and more stable to contact the chip contact head. The number of the connecting terminals 2761, the extension sections 2762, and the support portion 2764 is adapted to the number of the conductive connectors 26 and is arranged one by one, that is, a plurality of connecting terminals 2761, the extension sections 2762, and the support portion 2764 are arranged at intervals in the Y-axis direction. The force-bearing portion 2763 is connected to the support portion 2764, so that when the force-bearing portion 2763 receives the force of the electronic imaging device 1 and moves, the support portion 2764 is driven to move, and then the support portion 2764 drives the electrical contact portion 261 abutting against its upper end to move to contact the chip contact head. In this embodiment, the number of force-bearing parts 2763 can be set to be less than that of supporting parts 2764, and two supporting parts 2764 are connected to the same force-bearing part 2763. The movement of the force-bearing part 2763 drives the two supporting parts 2764 to move simultaneously. Preferably, the number of force-bearing parts 2763 is two, and each force-bearing part 2763 is arranged between two adjacent supporting parts 2764 and connected to the supporting parts 2764. The force-bearing part 2763 is a block-shaped component, and at least part of the force-bearing part 2763 protrudes from the chip holder 27 in the -X axis direction, that is, at least part of it protrudes from the conductive connector 26 in the -X axis direction, and the force receiving part 2763 is at least partially higher than the conductive connector 26 in the +Z axis direction, so that the conductive connector 26 is not exposed outward from the rear surface F of the box body 2. When the force-bearing portion 2763 is subjected to external force, the entire force receiving portion 276 can swing around its connecting end 2761, so that the force-bearing portion 2763 moves upward and forward (that is, toward the +Z and +X directions), and drives the supporting portion 2764 connected thereto to move upward and forward (that is, toward the +Z and +X directions), thereby driving the electrical contact portion 261 abutting against the supporting portion 2764 to also move upward (that is, toward the +Z direction).

[0098] Optionally, the number of force-bearing parts 2763 can also be adapted to the number of conductive connectors 26, that is, each support part 2764 is individually connected to a force-bearing part 2763; the number of force-bearing parts 2763 can also be set to one, all support parts 2764 are connected to the same force-bearing part 2763, and when the force-bearing part 2763 is subjected to external force, all support parts 2764 are driven to move.

[0099] In the initial state (before the door cover 11 of the electronic imaging device 1 is closed), the force receiving portion 276 is not subjected to the force of the electronic imaging device 1 and has no relative movement. Therefore, the electrical contact portion 261 also remains stationary.

[0100] like Figures 1 to 9 As shown, when the developing box 200 is installed in the electronic imaging device 1 and the door cover 11 is closed, the chip contact head of the electronic imaging device 1 is initially located on the upper side (+Z axis side) of the electrical contact portion 261 of the conductive connector 26, but does not contact the electrical contact portion 261. As the door cover 11 continues to close, the door cover 11 will abut against the force-bearing portion 2763 and push the entire force receiving portion 276 to swing around the connecting end 2761 toward the developing box 200. At this time, the force-bearing portion 2763 moves forward and upward (i.e., toward the +X and +Z directions), driving the supporting portion 2764 to also move forward and upward (i.e., toward the +X and +Z directions), thereby driving the electrical contact portion 261 abutting against the upper side of the supporting portion 2764 to also move upward (i.e., toward the +Z direction), thereby making the electrical contact portion 261 contact and electrically connect with the side surface 132 of the chip contact head. In this contact mode, the problem of subsequent electrical connection failure due to elastic failure of the chip contact head can be effectively avoided, thereby meeting the demand for long-term use of the electronic imaging device 1.

[0101] Further, such as Figure 3 , Figure 4 , Figure 8 and Fig. 9As shown, the developer box 200 further includes a first limiting portion 215, which is at least partially located above the electrical contact portion 261 and is used to limit the upward movement range of the electrical contact portion 261. Preferably, the first limiting portion 215 is arranged on the powder bin bracket 21, and the first limiting portion 215 is a strip extending along the Y-axis direction on the powder bin bracket 21, fixedly connected to the powder bin bracket 21, and when the storage unit is installed on the powder bin bracket 21, the position of the first limiting portion 215 corresponds to the electrical contact portion 261, and the first limiting portion 215 is located on the upper side (+Z-axis side) of each conductive connector 26. In the initial state, there is a certain distance between the electrical contact portion 261 and the first limiting portion 215 in the Z-axis direction, and when the electrical contact portion 261 is driven by the force receiving portion 276 to be lifted upward to abut against the first limiting portion 215, it cannot continue to move upward. The electrical contact portion 261 is partially located at the −X axis side of the first limiting portion 215 , so that the electrical contact portion 261 can contact the side surface 132 of the chip contact head. Optionally, the first limiting portion 215 can also be disposed on the chip holder 27 .

[0102] Further, such as Figure 3 , Figure 4 and Fig. 9 As shown, the developer box 200 also includes a limiting portion 214, which is a part of the powder bin bracket 21. The limiting portion 214 can be a plate-shaped member, a sheet-shaped member, or a strip-shaped member. The position of the limiting portion 214 corresponds to the position of the chip holder 27, and when the assembly formed by the chip holder 27 and the storage unit is installed on the powder bin bracket 21, the limiting portion 214 is at least partially located on the upper side (+Z axis side) of each conductive connector 26. Specifically, the limiting portion 214 is pressed against the upper surface of the conductive connector 26 near the +X axis end, which can prevent the conductive connector 26 from warping upward before receiving the force of the electronic imaging device 1, thereby preventing the subsequent electrical connection from being unstable.

[0103] In some other embodiments, the first limiting portion 215 may not be provided, and the limiting portion 214 may be extended to the upper side of the electrical contact portion 261 in the −X axis direction, which can also play the role of limiting the upward movement range of the electrical contact portion 261 .

[0104] In some other implementations, the chip holder 27 may not be provided, the chip 25 and the conductive connector 26 are mounted on the box body 2, and the force receiving portion 276 is also directly and movably connected to the box body 2, which can also achieve the same function.

[0105] Embodiment 2

[0106] This embodiment provides another developing box, which is different from the first embodiment in that the structure of the force receiving portion 276 is different.

[0107] In this embodiment, Figures 10 to 14 As shown, the force receiving portion 276 is movably disposed on the developing box 200, and the electrical contact portion 261 of the conductive connecting member 26 is at least partially located on the upper side (+Z axis side) of at least part of the force receiving portion 276. Preferably, the force receiving portion 276 is movably disposed on the chip holder 27, and the number of the force receiving portions 276 matches the number of the conductive connecting members 26, and they are disposed one by one, that is, a plurality of force receiving portions 276 are disposed on the chip holder 27 at intervals along the Y axis direction. The force receiving portion 276 includes a connecting end 2761, an extension section 2762 and a force-bearing portion 2763 which are connected to each other. The connecting end 2761 of the force receiving portion 276 is connected to the chip holder 27, the extension section 2762 extends upward and backward from the connecting end 2761, and the force-bearing portion 2763 is arranged at the +Z-axis end of the extension section 2762. The force-bearing portion 2763 is a block-shaped component, and at least a portion of the force-bearing portion 2763 protrudes from the chip holder 27 in the -X-axis direction, that is, at least a portion of the force-bearing portion 2763 protrudes from the conductive connector 26 in the -X-axis direction. At least part of the electrical contact portion 261 abuts against one end of the force-bearing portion 2763 in the +Z-axis direction, that is, at least part of the force-bearing portion 2763 protrudes beyond the electrical contact portion 261 in the +Z-axis direction, so that the conductive connecting member 26 is not exposed outward from the rear surface F of the box body 2, and when the force-bearing portion 2763 is subjected to external force, the entire force receiving portion 276 can swing around its connecting end 2761, and the force-bearing portion 2763 moves upward and forward, driving the electrical contact portion 261 abutting against the force-bearing portion 2763 to move upward as well.

[0108] In the initial state (before the door cover 11 of the electronic imaging device 1 is closed), the force receiving portion 276 is not subjected to the force of the electronic imaging device 1, and the electrical contact portion 261 contacts the force receiving portion 2763 but has no interaction force, so the electrical contact portion 261 also remains stationary.

[0109] like Figure 1 , Figure 2 , Figures 10 to 17 As shown, when the developing box 200 is installed in the electronic imaging device 1, during the closing process of the door cover 11, the chip contact head of the electronic imaging device 1 is initially located on the upper side (+Z axis side) of the electrical contact portion 261 of the conductive connector 26, but does not contact the electrical contact portion 261. As the door cover 11 continues to close, the door cover 11 will abut against the rear lower end of the force-bearing portion 2763 and push the entire force receiving portion 276 to swing around the connecting end 2761 toward the developing box 200. At this time, the force-bearing portion 2763 moves forward and upward, driving the electrical contact portion 261 abutting against the upper side of the force-bearing portion 2763 to move upward as well, so that the electrical contact portion 261 contacts and electrically connects with the side surface 132 of the chip contact head. In this contact mode, the problem of subsequent electrical connection failure due to elastic failure of the chip contact head can be effectively avoided, meeting the needs of long-term use of the electronic imaging device 1.

[0110] Further, such as Fig.13 , Fig.14 and Fig.17 As shown, the developer box 200 also includes a second limiting portion 277, which is at least partially located above the electrical contact portion 261 and is used to limit the range of upward movement of the electrical contact portion 261. Preferably, the second limiting portion 277 is arranged on the chip holder 27, and the second limiting portion 277 is a hook structure extending from the upper surface of the chip holder 27, and the hook portion of the hook structure is located above the electrical contact portion 261. In the initial state, there is a certain distance between the hook portion and the electrical contact portion 261. When the electrical contact portion 261 is lifted upward to abut against the hook portion, it cannot continue to move upward. The number of the second limiting portions 277 can be multiple, and two second limiting portions 277 form a group to limit a conductive connection member 26, and the two second limiting portions 277 are respectively located on both sides of the conductive connection member 26 in the Y-axis direction. The second limiting portion 277 is located on the +X-axis side of the force-bearing portion 2763.

[0111] Further, such as Fig.10 and Fig.12 As shown, the developer box 200 further includes a pushing portion 211, which is arranged on the powder bin support 21 and located on the rear surface F of the box body 2. The pushing portion 211 is an elastic cantilever arranged on the rear surface F, one end of which is connected to the rear surface F, and the free end of which extends along the -Z and -X axis directions. There are two elastic cantilevers, which are respectively located on both sides of the installation position of the chip holder 27 in the Y axis direction. When the developer box 200 is installed in the electronic imaging device 1 and the door cover 11 is closed, the door cover 11 contacts the free end of the pushing portion 211 and applies a pushing force, so that the pushing portion 211 is deformed in the direction close to the developer box 200 (+X axis direction). The pushing force of the door cover 11 is applied to the entire developer box 200 through the pushing portion 211, pushing the developer box 200 to be installed in place and making the developing roller 22 in close contact with the photosensitive drum.

[0112] In some embodiments, an elastic member 12 is further provided on the door cover 11. When the electronic imaging device 1 closes the door cover 11, the elastic member 12 abuts against the developing box 200. The door cover 11 can push the developing box 200 to move through the elastic member 12. Moreover, on the developing box 200, the position where the elastic member 12 abuts against the developing box 200 is symmetrical to the position where the pushing portion 211 is located. In the Y direction, the elastic member 12 abuts against a position on the rear surface F of the powder hopper bracket 21 close to the right surface C, and the pushing portion 211 is arranged on a position on the rear surface F of the powder hopper bracket 21 close to the left surface D, so that when the electronic imaging device 1 closes the door cover 11, the rear surface F of the developing box 200 is respectively subjected to the force of the elastic member 12 pushing the powder hopper bracket 21 and the force of the door cover 11 pushing the pushing portion 211, and these two forces are symmetrical on the rear surface F of the powder hopper bracket 21, so that the developing box 200 is evenly stressed when installed in the electronic imaging device 1, and will not tilt, so that the developing box 200 can be smoothly installed in the electronic imaging device 1.

[0113] The other structures of the developing box of this embodiment are the same as those of the first embodiment and will not be described again.

[0114] Embodiment 3

[0115] This embodiment provides another developing box, which is different from the second embodiment in that the structure of the force receiving portion 276 is different.

[0116] like Figures 18 to 21 As shown, in this embodiment, the force receiving portion 276 is arranged on the chip holder 27, and the force receiving portions 2763 of the multiple force receiving portions 276 are connected to form a rib structure. The connecting end 2761 and the extension section 2762 of each force receiving portion 276 are still arranged at intervals on the Y axis, and only the force receiving portion 2763 of the force receiving portion 276 are connected to form a rib structure extending in the Y axis direction. The rib structure is located on the -X axis side of the chip holder 27 and protrudes from the rear surface F of the developing box. The electrical contact portion 261 of each conductive connecting member 26 abuts against the upper side of the position of the force receiving portion 276 close to the rib structure. Specifically, the rib structure at least partially protrudes from the conductive connecting member 26 in the -X axis direction and the +Z axis direction, so that the conductive connecting member 26 is not exposed outward from the rear surface F of the box body 2. In some embodiments, the connecting end 2761 and the extension section 2762 of each force receiving portion 276 can also be connected to form.

[0117] like Figures 18 to 21As shown, when the developing box is installed in the electronic imaging device 1 and the door cover 11 is closed, the chip contact head of the electronic imaging device 1 is initially located on the upper side (+Z axis side) of the electrical contact portion 261 of the conductive connector 26, but does not contact the electrical contact portion 261. As the door cover 11 continues to close, the door cover 11 will abut against the rear lower end of the rib structure (force-bearing portion 2763) and push the entire force receiving portion 276 to swing around the connecting end 2761 toward the developing box 200. At this time, the rib structure moves forward and upward, driving the electrical contact portion 261 abutting against the upper side of the rib structure to move upward as well, thereby making the electrical contact portion 261 contact and electrically connect with the side 132 of the chip contact head.

[0118] The other structures of the developing box of this embodiment are the same as those of the first embodiment and will not be described again.

[0119] Embodiment 4

[0120] This embodiment provides a developing box, which is different from the first to third embodiments in that the force receiving portion 276 is cancelled.

[0121] like Figure 22 to Figure 24 As shown, in this embodiment, the conductive connector 26 is disposed on the chip tray 27, and the length of the first mounting portion 272 on the chip tray 27 in the X-axis direction is longer than that of the first mounting portion 272 in the first embodiment, and the portion of the conductive connector 26 bent to the upper surface of the chip tray 27 is entirely supported by the first mounting portion 272. One end of the first mounting portion 272 in the +X-axis direction is connected to the body 271 of the chip tray 27, and a certain distance is provided between the lower surface of the first mounting portion 272 and the upper surface of the body 271.

[0122] like Figure 22 to Figure 24 As shown, the second limiting portion 277 is disposed on the first mounting portion 272 , and the second limiting portion 277 abuts against the upper surface of the conductive connector 26 . Therefore, the conductive connector 26 (including the electrical contact portion 261 ) of this embodiment cannot move relative to the chip holder 27 .

[0123] Furthermore, the developer box 200 also includes a limiting portion 214, which is a part of the powder bin bracket 21. The limiting portion 214 can be a plate-shaped member, a sheet-shaped member, or a strip-shaped member. The position of the limiting portion 214 corresponds to the position of the chip holder 27, and when the assembly formed by the chip holder 27 and the storage unit is installed on the powder bin bracket 21, the limiting portion 214 is at least partially located on the upper side (+Z axis side) of each conductive connector 26. Specifically, the limiting portion 214 is pressed against a position on the upper surface of the conductive connector 26 close to the +X axis end, that is, the limiting portion 214 is arranged closer to the +X axis than the second limiting portion 277. The limiting portion 214 can prevent the front end side (+X axis side) of the conductive connector 26 from warping up, so that the conductive connector 26 is in contact with the chip 25 more stably, and the second limiting portion 277 can prevent the rear end side (-X axis side) of the conductive connector 26 from warping up, so that the conductive connector 26 is in contact with the chip contact head more stably.

[0124] like Figure 22 to Figure 24 As shown, the developing box 200 further includes a first guide surface 2722, and the electrical contact portion 261 is located at least partially above the first guide surface 2722. When the developing box 200 is installed on the electronic imaging device 1, the first guide surface 2722 guides the chip contact head to contact the electrical contact portion 261. Preferably, the first guide surface 2722 is provided on the first mounting portion 272 of the chip holder 27, the first guide surface 2722 is located on the -X axis side of the first mounting portion 272, and protrudes from the -X axis end of the electrical contact portion 261, and the -X axis end of the first guide surface 2722 protrudes from the -X axis end of the chip holder 27. The first guide surface 2722 is a slope, and the first guide surface 2722 is inclined from the +Z, +X axis side to the -Z, -X axis side, that is, the end of the first guide surface 2722 close to the electrical contact portion 261 is the highest point in the +Z axis direction, and the highest point of the first guide surface 2722 is roughly flush with the surface of the electrical contact portion 261 in the +Z axis direction, that is, the end face of the conductive connector 26 at the -X axis end is covered by the first mounting portion 272 and is not exposed to the outside, that is, the conductive connector 26 is not exposed to the outside from the rear surface F of the box body 2.

[0125] like Figure 1 , Figure 2 , Figure 22 to Figure 24 As shown, when the developing box 200 is installed in the electronic imaging device 1 and the door cover 11 is closed, the chip contact head of the electronic imaging device 1 is initially located on the first guide surface 2722 and close to the -X axis end of the first guide surface 2722. As the door cover 11 continues to close, the chip contact head slides upward and forward along the first guide surface 2722 until it contacts the electrical contact portion 261, and finally the side surface 132 of the chip contact head contacts the electrical contact portion 261 and is electrically connected.

[0126] The other structures of the developing box of this embodiment are the same as those of the first embodiment and will not be described again.

[0127] Embodiment 5

[0128] This embodiment provides another developing box, which is different from the first to fourth embodiments in that the structure of the conductive connecting member 26 is different, and the chip holder 27 is eliminated.

[0129] In this embodiment, the chip 25 is fixedly mounted on the box body 2, and can be fixed on the powder bin bracket 21 by bonding (gluing) or welding. Fig.31 As shown, the chip 25 can also be installed on the box body 2 through the chip cover 28. The chip cover 28 is detachably installed on the box body 2, and the chip cover 28 can cover the outside of the chip 25 to protect the chip 25 from damage. Specifically, the chip 25 is installed in the chip cover 28 by gluing or welding, the powder bin bracket 21 is provided with a first snap-fit ​​groove 216, and the chip cover 28 is provided with a first snap-fit ​​structure 281. The chip cover 28 can be snap-fitted on the first snap-fit ​​groove 216 and installed on the powder bin bracket 21 through the first snap-fit ​​structure 281, so that the chip 25 is installed on the powder bin bracket 21, and the chip cover 28 is installed on the powder bin bracket 21 from bottom to top (i.e., installed along the +Z axis direction). When the chip cover 28 is installed on the powder bin bracket 21, the chip 25 is installed in the chip cover 28, so that the chip 25 is located between the chip cover 28 and the conductive connector 26 in the Z axis direction and is not exposed to the outside, so that the chip cover 28 can protect the chip 25. In some other embodiments, the chip cover 28 may also be mounted on the powder bin support 21 by gluing or welding, which is not limited here.

[0130] like Figures 25 to 30 As shown, the conductive connector 26 is installed on the powder bin bracket 21. Specifically, the conductive connector 26 is arranged on the upper surface A of the box body 2, the powder bin bracket 21 is provided with a first conductive connector installation position 217, the conductive connector 26 is provided with a second buckle structure 265, and the conductive connector 26 is detachably installed on the first conductive connector installation position 217 through the second buckle structure 265. Alternatively, in some other embodiments, the conductive connector 26 can also be installed on the first conductive connector installation position 217 by gluing or welding, which is not limited here.

[0131] Furthermore, if Fig.30As shown, an electrical connection portion 262 is also provided on the conductive connector 26. When the conductive connector 26 and the chip cover 28 are both installed on the powder bin bracket 21, the conductive connector 26 abuts against the terminal 252 on the chip 25 in the chip cover 28 through the electrical connection portion 262, so that the conductive connector 26 and the chip 25 are electrically connected. Specifically, in the +Z axis direction, when the chip cover 28 is installed on the powder bin bracket 21, the side of the chip 25 provided with the terminal 252 in the chip cover 28 is arranged upward, and the conductive connector 26 is located above the chip cover 28 when it is installed on the powder bin bracket 21; the conductive connector 26 is a conductive steel sheet, and the electrical connection part 262 is an elastic cantilever integrally provided with the conductive connector 26, and the electrical connection part 262 is located on the lower side of the conductive connector 26. When the conductive connector 26 is installed on the powder bin bracket 21, the chip cover 28 is arranged on the lower side of the conductive connector 26, that is, the chip 25 in the chip cover 28 is located on the lower side of the conductive connector 26, and the electrical connection part 262 on the lower side of the conductive connector 26 can pass through the powder bin bracket 21 and extend into the chip cover 28, so that the electrical connection part 262 on the conductive connector 26 can abut against the terminal 252 on the chip 25, thereby electrically connecting the conductive connector 26 to the chip 25.

[0132] Furthermore, if Fig.30 As shown, the conductive connector 26 is provided with an electrical contact portion 261 that contacts the chip contact head, the electrical contact portion 261 is oriented in the same direction as the upper surface A of the box body 2, and there is no covering object on the box body 2 to cover the electrical contact portion 261, that is, the electrical contact portion 261 of the conductive connector 26 is exposed to the upper surface A of the box body 2, and when the developing box 200 is installed in the electronic imaging device 1, the electrical contact portion 261 of the conductive connector 26 can abut and be electrically connected with the side surface 132 of the chip contact head, thereby achieving electrical connection between the conductive connector 26 and the chip contact head.

[0133] When the developing box 200 is installed in the electronic imaging device 1 and the door cover 11 is not closed, the electrical contact portion 261 of the conductive connection member 26 is exposed through the upper surface A of the developing box 200 . Specifically, the electrical contact portion 261 is arranged toward the +Z direction.

[0134] When the door cover 11 is closed, the chip contact head is flipped over to the top of the conductive connector 26 on the developer box 200 along the +Z direction. As the door cover 11 is gradually closed toward the +X axis direction, the distance between the chip contact head and the conductive connector 26 in the Z axis direction gradually decreases. When the door cover 11 is completely closed with the main body 10, the electrical contact portion 261 of the conductive connector 26 located above the chip 25 abuts against the side 132 of the chip contact head to form an electrical connection.

[0135] The other structures of the developing box of this embodiment are the same as those of the first embodiment and will not be described again.

[0136] Embodiment 6

[0137] like Figure 32 to Figure 37 As shown, another developing box 200 is provided in this embodiment. The difference between this embodiment and the first embodiment is that the installation direction of the chip holder 27 is different and the locking structure is different.

[0138] like Figure 32 to Figure 37 As shown, specifically, a second mounting portion 273 and a first mounting portion 272 are provided on the chip holder 27, the chip 25 is mounted on the second mounting portion 273 by snapping, gluing or welding, and the conductive connector 26 is snapped on the first mounting portion 272; and on the chip holder 27, along the +Z axis direction, the conductive connector 26 is located above the chip 25.

[0139] Furthermore, if Figure 32 to Figure 37 As shown, the chip holder 27 can be detachably mounted on the box body 2. A snap-fit ​​structure is provided on the chip holder 27, and the snap-fit ​​structure includes a first snap-fit ​​portion 274 and a second snap-fit ​​portion 275, and the first snap-fit ​​portion 274 and the second snap-fit ​​portion 275 are respectively arranged at both ends of the chip holder 27 in the Y-axis direction. The first snap-fit ​​portion 274 and the second snap-fit ​​portion 275 are both elastic arms, one end of which is connected to the body of the chip holder 27, and the other end (free end) extends in a direction opposite to the assembly direction of the chip holder 27. In this embodiment, the assembly direction of the chip holder 27 is to be installed on the powder bin bracket 21 along the +X-axis direction (i.e., installed from back to front), and the free end of the elastic arm extends in the -X-axis direction. An installation position 218 (specifically a groove) is provided on the powder bin bracket 21, and an opening is provided on the installation position 218 toward the -X axis direction. The installation position 218 is provided with a first combining portion 212 and a second combining portion 213 (both are card slots) at both ends in the Y axis direction, respectively, which are respectively engaged with the first engaging portion 274 and the second engaging portion 275, thereby fixing the chip holder 27.

[0140] The other structures of the developing box of this embodiment are the same as those of the first embodiment and will not be described again.

[0141] Embodiment 7

[0142] like Figures 38 to 40 As shown, another developing box 200 is provided in this embodiment. The difference between this embodiment and the previous embodiment is that the first limiting portion 215 is cancelled, and a third limiting portion 278 is provided. When the conductive connecting member 26 is installed in the chip holder 27, it is limited by the third limiting portion 278, and the third limiting portion 278 can guide the chip contact head to abut against the conductive connecting member 26 when the developing box 200 is installed in the electronic imaging device 1.

[0143] like Figures 38 to 40As shown, specifically, the third limiting portion 278 is a limiting rib arranged on the upper surface of the chip holder 27, the limiting rib and the chip holder 27 are an integral structure, and in some other embodiments, the limiting rib can also be glued or welded to the chip holder 27, which is not limited here; when the conductive connector 26 is installed on the chip holder 27, along the +Z axis direction, the limiting rib is arranged above the conductive connector 26, and the limiting rib is provided with a through hole, the conductive connector 26 passes through the through hole of the limiting rib and is installed on the chip holder 27, the limiting rib is used to clamp the conductive connector 26 to prevent the conductive connector 26 from warping up.

[0144] Furthermore, if Fig.40 As shown, the limiting rib is also provided with a second guide surface 2781. When the developing box 200 is installed in the electronic imaging device 1, the second guide surface 2781 can guide the chip contact head to abut against the conductive connection member 26. Specifically, the second guide surface 2781 is an arc surface or a slope structure that is recessed in the +X direction and is provided on the rear side of the limiting rib. The second guide surface 2871 is a surface that is low in the front and high in the back. When the limiting rib is provided above the conductive connection member 26, the limiting rib covers a part of the electrical contact portion 261 of the conductive connection member 26. When the developing box 200 is installed in the electronic imaging device 1, the chip contact head first contacts the second guide surface 2781. As the door cover 11 is closed, the chip contact head moves along the second guide surface 2781 in the -Z axis direction, and finally abuts against the electrical contact portion 261 of the conductive connection member 26 that is not covered by the limiting rib, so that the chip contact head is electrically connected to the conductive connection member 26.

[0145] The other structures of the developing box of this embodiment are the same as those of the first embodiment and will not be described again.

[0146] The above are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A developing box, detachably mounted on an electronic imaging device, wherein the electronic imaging device comprises a chip contact head, wherein the chip contact head has a side surface, wherein: The developing box comprises: A box body having an upper surface; A storage unit is arranged on the box body, the storage unit comprises a chip and a conductive connecting member, and the conductive connecting member is electrically connected to the chip; A force receiving portion, movably disposed on the developing box, wherein at least a portion of the conductive connecting member is located on an upper side of the force receiving portion; When the force receiving portion receives the force movement of the electronic imaging device, it can drive the conductive connecting member to move upward, so that the conductive connecting member abuts against and is electrically connected to the side surface of the chip contact head on the upper surface.

2. The developing cartridge according to claim 1, characterized in that: The conductive connection element has an electrical contact portion for contacting the chip contact head, and the electrical contact portion is at least partially exposed outside the upper surface.

3. The developing cartridge according to claim 2, characterized in that: The electrical contact portion is at least partially located on an upper side of at least part of the force receiving portion; When the force receiving portion receives the force movement of the electronic imaging device, it can drive the electrical contact portion to move upward, so that the conductive connecting member contacts the side surface of the chip contact head.

4. The developing cartridge according to claim 3, characterized in that: The force receiving portion includes one or more force receiving portions for receiving the force of the electronic imaging device.

5. The developing cartridge according to claim 4, characterized in that: The force receiving portion comprises a supporting portion for carrying the electrical contact portion, and the number of the supporting portions matches the number of the conductive connecting members and is arranged in a one-to-one correspondence.

6. The developing cartridge according to claim 5, characterized in that: At least one of the supporting parts is connected to one of the force-bearing parts.

7. The developing cartridge according to claim 4, characterized in that: The electrical contact portion is arranged close to the force-bearing portion.

8. The developing cartridge according to claim 5, characterized in that: There are multiple conductive connecting members, and there are multiple force receiving portions, which are arranged in a one-to-one correspondence with the conductive connecting members.

9. The developing cartridge according to claim 5, characterized in that: A plurality of the force-bearing parts are connected to form a rib structure.

10. The developing cartridge according to any one of claims 2 to 9, characterized in that: It also includes a chip holder which is detachably mounted on the box body, and the chip and the conductive connector are mounted on the chip holder.

11. The developing cartridge according to claim 10, characterized in that: The force receiving portion is movably disposed on the chip support.

12. The developing cartridge according to claim 11, characterized in that: The force receiving portion includes a connecting end connected to the chip holder and an extending section connected to the connecting end and extending upward and backward.

13. The developing cartridge according to any one of claims 1 to 9, characterized in that: It also includes a chip protection cover detachably mounted on the box body, the chip is mounted in the chip protection cover, and the conductive connecting member is mounted on the box body.

14. The developing cartridge according to any one of claims 2 to 9, 11 to 12, characterized in that: It also includes a limiting portion, which is at least partially located above the electrical contact portion and is used to limit the upward movement range of the electrical contact portion.

15. The developing cartridge according to claim 14, characterized in that: The limiting portion is arranged on the box body or the chip holder.

16. The developing cartridge according to claim 15, characterized in that: The limiting portion is a limiting rib, and the limiting rib is provided with a guiding surface of an inclined surface or an arc surface, and the guiding surface can guide the chip contact head to abut against the conductive connecting piece.

17. The developing cartridge according to claim 2, characterized in that: The electrical contact portion is disposed tilted downward relative to the upper surface.

18. The developing cartridge according to claim 10, characterized in that: The chip holder is mounted on the box body in a direction from back to front, from top to bottom, or from bottom to top.

19. The developing cartridge according to any one of claims 1 to 9, 11 to 12, and 15 to 18, characterized in that: The box body has a rear surface; The conductive connection member is not exposed outward from the rear surface of the box body.

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