Temperature control structure for semiconductor thermal test
By using components such as ring heating sheets, hollow shaft motors and fans in the semiconductor test device, uniform heating and fast temperature response of semiconductor devices are achieved, and the problems of uneven heating and slow temperature control in the prior art are solved, which improves the problem of Test accuracy and temperature control effects.
Patent Information
- Application Number
- CN202421018463.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-11
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2034-05-11
AI Technical Summary
During the use of existing semiconductor testing devices, there are problems such as uneven heat and slow temperature control of semiconductor devices, which affects the test accuracy and temperature control effect.
A temperature-controlled structure for semiconductor thermal testing is designed, including a thermal test chamber, annular heating plate, a rotatable tray, a hollow shaft motor, a fan and a temperature sensor. The uniform heat is provided through the annular heating plate, and the hollow shaft motor drives the tray to rotate. , the fan and air valve are combined with the temperature sensor to adjust the temperature in real time to achieve rapid temperature increase and cooling.
It ensures that the semiconductor devices are heated uniformly, improves the response speed and accuracy of temperature control, and significantly improves the temperature control effect.
Smart Images
Figure CN222213261U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a temperature control structure for semiconductor thermal testing, belonging to the technical field of semiconductor testing. Background Art
[0002] With the development of semiconductor technology and the research of semiconductor materials, microelectronics technology is developing towards high density and high reliability, and various new semiconductor materials have emerged. Nowadays, various products with semiconductor materials as chips have been widely used in people's lives and production. Semiconductor devices are generally used in the fields of electronics and electrical appliances. When such equipment and devices are in use, they will exceed normal temperature. Therefore, semiconductor devices need to have certain high temperature resistance.
[0003] Patent No. CN202122920286.3 discloses a temperature control device for semiconductor testing, including a test chamber, a mobile base is fixedly installed on the lower side of the test chamber, a chamber door is hingedly connected to the front side of the test chamber, and a transparent observation window is provided on the chamber door; a semiconductor loading mechanism, the semiconductor loading mechanism includes a partition and a clamping mechanism, the partitions are inserted in the test chamber equidistantly from top to bottom, and each group of partitions is equidistantly fixed with clamping mechanisms. However, the device has the following shortcomings during use:
[0004] 1. Semiconductor devices are fixed during the test process, which may result in uneven heating and affect the test accuracy;
[0005] 2. The heating and cooling process in the test chamber is slow, and it cannot quickly adapt to temperature changes, which may cause large temperature fluctuations and poor temperature control effects.
[0006] In summary, the prior art obviously has inconveniences and defects in practical use, so it is necessary to improve it. Utility Model Content
[0007] In view of the deficiencies in the background technology, the utility model provides a temperature control structure for semiconductor thermal testing, which can make the semiconductor device heated evenly and ensure the test accuracy; it can improve the response speed of the cooling and heating processes, so that the test temperature is continuously maintained within a certain range, ensuring a good temperature control effect.
[0008] In order to solve the above technical problems, the utility model adopts the following technical solutions:
[0009] A temperature control structure for semiconductor thermal testing, comprising a thermal testing chamber, the thermal testing chamber is installed in the inner cavity of a thermal insulation shell, a clamping chamber is provided between the outer wall of the thermal testing chamber and the inner wall of the thermal insulation shell, the thermal testing chamber and the top of the thermal insulation shell are fixedly connected by a connecting plate of an annular structure, and a flap is hinged on the top of the connecting plate;
[0010] An annular heating plate is fixedly installed on the inner wall of the thermal test chamber, a rotatable tray is installed in the inner cavity of the thermal test chamber, and a plurality of placement grooves distributed in a circumference are arranged on the upper surface of the tray; the bottom of the tray is connected to the hollow shaft motor, and the hollow shaft motor is fixedly installed at the bottom of the inner cavity of the thermal test chamber; a hollow shaft is arranged vertically inside the hollow shaft motor, and a plurality of air holes distributed in a circumference are opened around the top of the hollow shaft; a fan is installed at the bottom of the thermal test chamber.
[0011] Furthermore, the flip cover is a double-layer structure, and a sealed cavity is provided between the double-layer structure.
[0012] Furthermore, a temperature sensor is installed at the bottom of the flip cover.
[0013] Furthermore, the inner diameter of the connecting plate is the same as the inner diameter of the thermal testing chamber, and the outer diameter of the connecting plate is the same as the outer diameter of the thermal insulation shell.
[0014] Furthermore, the air holes are located below the tray.
[0015] Furthermore, the bottom end of the hollow rotating shaft is communicated with the clamping cavity between the thermal testing chamber and the heat-insulating shell.
[0016] Furthermore, the air inlet end of the fan is located in the cavity between the thermal test chamber and the insulation shell, and the air outlet end of the fan is located at the bottom of the hollow shaft motor.
[0017] Furthermore, an air inlet hole is provided around the bottom of the heat-insulating shell, and an air inlet valve is installed in the air inlet hole.
[0018] Furthermore, the tops of the thermal testing chamber and the heat-insulating shell are provided with exhaust holes, and exhaust valves are installed in the exhaust holes.
[0019] Compared with the prior art, the utility model has the following advantages after adopting the above technical solution:
[0020] The hollow shaft motor drives the tray and the semiconductor device to rotate. During the rotation, the annular heating plate is energized to generate heat, which provides heat for the thermal test of the semiconductor device. The semiconductor device is heated evenly to ensure the test accuracy.
[0021] When the temperature sensor detects that the temperature is higher than the set temperature, the fan, intake valve and exhaust valve are opened synchronously, and the air flows into the thermal test chamber through the air hole at the top of the hollow shaft, and the heat in the thermal test chamber is discharged through the exhaust hole; when the temperature sensor detects that the temperature is lower than the set temperature, the fan, intake valve and exhaust valve are closed synchronously to maintain the temperature in the thermal test chamber within a certain range, which significantly improves the response speed of the cooling and heating processes and ensures a good temperature control effect.
[0022] The utility model is described in detail below with reference to the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1 It is a structural schematic diagram of the utility model;
[0024] Figure 2 It is a structural sectional view of the utility model;
[0025] Figure 3 It is a schematic diagram of the utility model in working state.
[0026] In the figure, 1-thermal test chamber, 2-insulation shell, 3-connecting plate, 4-flip cover, 5-annular heating plate, 6-tray, 7-placing slot, 8-hollow shaft motor, 9-air hole, 10-fan, 11-air inlet, 12-air inlet valve, 13-exhaust hole, 14-exhaust valve, 15-temperature sensor. DETAILED DESCRIPTION
[0027] In order to have a clearer understanding of the technical features, purposes and effects of the utility model, the specific implementation methods of the utility model are now described with reference to the accompanying drawings.
[0028] like Figure 1-Figure 3 As shown together, the utility model provides a temperature control structure for semiconductor thermal testing, including a thermal testing chamber 1, which is installed in the inner cavity of an insulation shell 2, and a clamping cavity is provided between the outer wall of the thermal testing chamber 1 and the inner wall of the insulation shell 2, and the top ends of the thermal testing chamber 1 and the insulation shell 2 are fixedly connected by a connecting plate 3 of an annular structure, and a flip cover 4 is hinged on the top of the connecting plate 3.
[0029] The flip cover 4 is a double-layer structure with a sealed cavity between the double-layer structure, which can play a role in heat preservation and reduce the loss of heat to the surrounding environment.
[0030] A temperature sensor 15 is installed at the bottom of the flip cover 4 , and the temperature sensor 15 is used to detect the temperature in the thermal test chamber 1 in real time.
[0031] The inner diameter of the connecting plate 3 is the same as the inner diameter of the thermal testing chamber 1 , and the outer diameter of the connecting plate 3 is the same as the outer diameter of the thermal insulation shell 2 .
[0032] An annular heating plate 5 is fixedly mounted on the inner wall of the thermal testing chamber 1 . The annular heating plate 5 generates heat when powered on, thereby providing heat for the thermal testing.
[0033] A rotatable tray 6 is installed in the inner cavity of the thermal test chamber 1 , and a plurality of placement grooves 7 distributed in a circumference are arranged on the upper surface of the tray 6 , and the placement grooves 7 are used to place semiconductor devices.
[0034] The bottom of the tray 6 is connected to the hollow shaft motor 8 , and the hollow shaft motor 8 is fixedly mounted on the bottom of the inner cavity of the thermal testing chamber 1 .
[0035] The hollow shaft motor 8 has a hollow rotating shaft arranged in the vertical direction inside, the bottom end of the hollow rotating shaft is connected to the clamping cavity between the thermal testing chamber 1 and the insulation shell 2, and a plurality of circumferentially distributed air holes 9 are opened around the top end of the hollow rotating shaft, and the air holes 9 are located below the tray 6.
[0036] A fan 10 is installed at the bottom of the thermal test chamber 1 , an air inlet end of the fan 10 is located in the cavity between the thermal test chamber 1 and the insulation shell 2 , and an air outlet end of the fan 10 is located at the bottom of the hollow shaft motor 8 .
[0037] An air inlet hole 11 is provided around the bottom of the heat-insulating shell 2, and an air inlet valve 12 is installed in the air inlet hole 11. After the air inlet valve 12 is opened, air flow can enter the interior of the heat-insulating shell 2 from the outside.
[0038] An exhaust hole 13 is provided on the top of the thermal testing chamber 1 and the insulation shell 2 , and an exhaust valve 14 is installed in the exhaust hole 13 . After the exhaust valve 14 is opened, the hot air flow in the inner cavity of the thermal testing chamber 1 can be discharged to the outside of the insulation shell 2 .
[0039] The specific working principle of this utility model:
[0040] The semiconductor device is placed in the placement slot 7 of the tray 6. The hollow shaft motor 8 drives the tray 6 and the semiconductor device to rotate. During the rotation, the annular heating plate 5 is energized to generate heat, which provides heat for the thermal test of the semiconductor device. The semiconductor device is heated evenly to ensure the test accuracy.
[0041] The temperature sensor 15 detects the temperature in the thermal test chamber 1 in real time. When the temperature sensor 15 detects that the temperature is higher than the set temperature, the fan 10, the air inlet valve 12 and the exhaust valve 14 are opened synchronously, and the air flow flows into the cavity between the thermal test chamber 1 and the insulation shell 2 from the air inlet hole 11, and then enters the thermal test chamber 1 through the air hole 9 at the top of the hollow rotating shaft, and the heat in the thermal test chamber 1 is discharged from the exhaust hole 13; when the temperature sensor 15 detects that the temperature is lower than the set temperature, the fan 10, the air inlet valve 12 and the exhaust valve 14 are closed synchronously, so that the temperature in the thermal test chamber 1 is maintained within a certain range.
[0042] The above is an example of the best implementation of the utility model, and the parts not described in detail are common knowledge of ordinary technicians in this field. The protection scope of the utility model is based on the content of the claims, and any equivalent transformation based on the technical inspiration of the utility model is also within the protection scope of the utility model.
Claims
1. A temperature control structure for semiconductor thermal testing, characterized in that: The thermal test chamber (1) comprises a thermal test chamber (1), the thermal test chamber (1) being installed in the inner cavity of a thermal insulation shell (2), a clamping cavity being provided between the outer wall of the thermal test chamber (1) and the inner wall of the thermal insulation shell (2), the top ends of the thermal test chamber (1) and the thermal insulation shell (2) being fixedly connected via a connecting plate (3) of an annular structure, and a flap (4) being hingedly connected above the connecting plate (3); An annular heating plate (5) is fixedly mounted on the inner wall of the thermal test chamber (1); a rotatable tray (6) is mounted in the inner cavity of the thermal test chamber (1); a plurality of placement grooves (7) distributed in a circumferential manner are arranged on the upper surface of the tray (6); the bottom of the tray (6) is connected to a hollow shaft motor (8); the hollow shaft motor (8) is fixedly mounted on the bottom of the inner cavity of the thermal test chamber (1); a hollow shaft is arranged vertically inside the hollow shaft motor (8); a plurality of air holes (9) distributed in a circumferential manner are opened around the top of the hollow shaft; and a fan (10) is mounted at the bottom of the thermal test chamber (1).
2. A temperature control structure for semiconductor thermal testing as claimed in claim 1, characterized in that: The flip cover (4) is a double-layer structure, with a sealed cavity between the double-layer structures.
3. A temperature control structure for semiconductor thermal testing as claimed in claim 2, characterized in that: A temperature sensor (15) is installed at the bottom of the flip cover (4).
4. A temperature control structure for semiconductor thermal testing as claimed in claim 1, characterized in that: The inner diameter of the connecting plate (3) is the same as the inner diameter of the thermal test chamber (1), and the outer diameter of the connecting plate (3) is the same as the outer diameter of the thermal insulation shell (2).
5. A temperature control structure for semiconductor thermal testing as claimed in claim 1, characterized in that: The air hole (9) is located below the tray (6).
6. A temperature control structure for semiconductor thermal testing as claimed in claim 1, characterized in that: The bottom end of the hollow rotating shaft is communicated with the clamping cavity between the thermal testing chamber (1) and the thermal insulation shell (2).
7. A temperature control structure for semiconductor thermal testing as claimed in claim 6, characterized in that: The air inlet end of the fan (10) is located in the cavity between the thermal test chamber (1) and the thermal insulation shell (2), and the air outlet end of the fan (10) is located at the bottom of the hollow shaft motor (8).
8. A temperature control structure for semiconductor thermal testing as claimed in claim 1, characterized in that: An air inlet hole (11) is provided around the bottom of the heat-insulating shell (2), and an air inlet valve (12) is installed in the air inlet hole (11).
9. A temperature control structure for semiconductor thermal testing as claimed in claim 8, characterized in that: An exhaust hole (13) is provided on the top of the thermal testing chamber (1) and the heat-insulating shell (2), and an exhaust valve (14) is installed in the exhaust hole (13).