Universal integrated temperature control device

Abstract

The utility model belongs to the technical field of semiconductor equipment cooling, and provides a universal integrated temperature control device which comprises a complete machine frame, and a middle partition plate is arranged in the complete machine frame. The water circulation unit comprises a water tank arranged at the bottom of the inner side of the complete machine frame, a water circulation power pump and a heating unit are arranged in the water tank, the water outlet end of the water circulation power pump communicates with a water outlet pipe, and the water inlet end of the water circulation power pump communicates with a water inlet pipe; the refrigeration unit is located at the bottom of the inner side of the complete machine frame, and the water inlet pipe and the refrigeration unit are correspondingly arranged; and the electrical unit is arranged at the top of the middle partition plate, and the electrical unit is electrically connected with the water circulation power pump, the heating unit and the refrigerating unit. The temperature control device is reasonable in layout, the overall size of the temperature control device can be compressed, and the temperature control device can be universally used on various semiconductor devices.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor equipment cooling, and in particular relates to a universal integrated temperature control device. Background Art

[0002] Temperature control devices are required in semiconductor equipment to provide high-precision constant temperature circulating cooling water for the heat source devices or internal environment in the equipment to absorb the heat generated by the heat source devices and achieve high-precision temperature control of the heat source devices or internal environment so that they can work stably, thereby ensuring the overall working performance of the semiconductor equipment.

[0003] The water circulation power in the existing temperature control device is mainly provided by a horizontal water pump, which is arranged on one layer with the refrigeration unit, on one layer with the water tank and heating components, and on one layer with the electrical components. The structural layout is unreasonable, the device is large in size, and the amount of raw materials used is large, resulting in high manufacturing costs. It will also cause the problem of large floor space required for on-site installation and use by customers, affecting the customer experience. In addition, the existing temperature control devices are mainly used for photolithography machines or certain types of specialized semiconductor equipment, and have poor versatility. Utility Model Content

[0004] The purpose of the utility model is to provide a universal integrated temperature control device to solve the above problems, achieve a reasonable layout, compress the overall size of the temperature control device, and be universally applicable to a variety of semiconductor devices.

[0005] To achieve the above purpose, the utility model provides the following solution: a universal integrated temperature control device, comprising:

[0006] A whole machine frame, wherein a middle partition is arranged in the whole machine frame;

[0007] A water circulation unit, the water circulation unit comprising a water tank arranged at the bottom of the inner side of the whole machine frame, a water circulation power pump and a heating unit are arranged in the water tank, a water outlet end of the water circulation power pump is connected to a water outlet pipe, and a water inlet end of the water circulation power pump is connected to a water inlet pipe;

[0008] A refrigeration unit, the refrigeration unit is located at the inner bottom of the whole machine frame, and the water inlet pipe is arranged corresponding to the refrigeration unit;

[0009] An electrical unit is arranged on the top of the middle partition and is electrically connected to the water circulation power pump, the heating unit and the refrigeration unit.

[0010] Preferably, the heating unit comprises an electric heating wire and a temperature control switch, the electric heating wire and the temperature control switch are respectively arranged in the water tank, and the temperature control switch is electrically connected to the electric heating wire.

[0011] Preferably, the water outlet pipe is connected to a temperature sensor.

[0012] Preferably, the water tank is also connected with a water supply pipe and a drainage pipe, and the water supply pipe and the drainage pipe are respectively connected with a solenoid valve and a manual valve.

[0013] Preferably, the water tank is always provided with a liquid level switch, and the liquid level switch is electrically connected to the solenoid valve.

[0014] Preferably, the refrigeration unit comprises a condenser and an evaporator, the water inlet pipe is connected to a coiled pipe, and the coiled pipe is arranged corresponding to the evaporator.

[0015] Compared with the prior art, the utility model has the following advantages and technical effects:

[0016] 1. The temperature control device of the utility model has a compact and reasonable structure and a small size, which reduces the cost of raw materials, reduces the space occupied by customers, reduces the comprehensive cost of equipment, and improves product competitiveness. At the same time, the reduced use of raw materials also makes this product more environmentally friendly.

[0017] 2. The temperature control device of the utility model has certain versatility and can be used by all semiconductor equipment with water circulation requirements within the parameter range. It has a wide range of applications and high promotion and application value. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 This is a schematic diagram of the structure of the temperature control device of the utility model;

[0020] Figure 2 This is the principle diagram of the temperature control device of the utility model;

[0021] Among them, 1. water circulation power pump; 2. heating unit; 3. water tank; 4. refrigeration unit; 5. water circulation interface; 6. electrical unit; 7. whole machine frame; 8. middle partition; 10. water outlet pipe; 11. water inlet pipe; 12. condenser; 13. evaporator; 14. electric heating wire; 15. temperature sensor; 16. water supply pipe; 17. drain pipe; 18. solenoid valve; 19. manual valve; 20. temperature control switch; 21. liquid level switch; 22. coiled pipe; 23. first branch pipe; 24. flow control valve; 25. second branch pipe; 26. ion filter; 27. one-way valve; 28. conductivity sensor. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0024] Reference Figure 1-Figure 2 The utility model provides a universal integrated temperature control device, comprising:

[0025] A whole machine frame 7, wherein a middle partition plate 8 is arranged inside the whole machine frame 7;

[0026] The water circulation unit includes a water tank 3 arranged at the bottom of the inner side of the whole machine frame 7, a water circulation power pump 1 and a heating unit 2 are arranged in the water tank 3, the water outlet end of the water circulation power pump 1 is connected to a water outlet pipe 10, and the water inlet end of the water circulation power pump 1 is connected to a water inlet pipe 11;

[0027] The refrigeration unit 4 is located at the inner bottom of the whole machine frame 7, and the water inlet pipe 11 is arranged corresponding to the refrigeration unit 4;

[0028] The electrical unit 6 is arranged on the top of the middle partition 8 , and the electrical unit 6 is electrically connected to the water circulation power pump 1 , the heating unit 2 and the refrigeration unit 4 .

[0029] The main function of the middle partition 8 is to isolate the upper electrical unit 6 from the lower water circulation unit and refrigeration unit 4; the main function of the water tank 3 is to contain water for circulating cooling; the main function of the water circulation power pump 1 is to provide power for water circulation; the main function of the heating unit 2 is to heat the water in the water tank 3 to the set temperature; by arranging the water circulation power pump 1 and the heating unit 2 in the water tank 3, the volume of the temperature control device can be effectively reduced compared with the traditional horizontal water pump and the independent circulating water heating zone; the water outlet pipe 10 and the water inlet pipe 11 are connected to the temperature control object in the semiconductor device; the main function of the refrigeration unit 4 is to reduce the water temperature entering the water tank 3; the main function of the electrical unit 6 is to control the operation of the water circulation power pump 1, the heating unit 2 and the refrigeration unit 4. On the whole, the utility model has a reasonable layout, which can effectively compress the overall size of the temperature control device, reduce the space occupied by the customer's site, and can be used on a variety of semiconductor devices, with a wide range of applications.

[0030] Further optimization scheme, such as Figure 1 and Figure 2 As shown, one end of the water inlet pipe 11 away from the water circulation power pump 1 and one end of the water outlet pipe 10 away from the water tank 3 extend out of the whole machine frame and form a water circulation interface 5, whose main function is to connect with the temperature control object in the semiconductor device.

[0031] According to a further optimized solution, the heating unit 2 includes an electric heating wire 14 and a temperature control switch 20 . The electric heating wire 14 and the temperature control switch 20 are respectively arranged in the water tank 3 , and the temperature control switch 20 is electrically connected to the electric heating wire 14 .

[0032] like Figure 2 As shown, the main function of the electric heating wire 14 is to directly heat the water in the water tank 3. The temperature control switch 20 is electrically connected to the electrical unit 6, and the water temperature to be maintained in the water tank 3 is set through the electrical unit 6. When the temperature control switch 20 detects that the water temperature in the water tank 3 fluctuates relative to the set value, the temperature control switch 20 can adjust the power of the electric heating wire 14 through the electrical unit 6 to adjust the water in the water tank 3.

[0033] The outer layer of the electric heating wire 14 is wrapped with a glass tube or a metal tube to avoid direct contact with water.

[0034] To further optimize the solution, the water outlet pipe 10 is connected to a temperature sensor 15 .

[0035] like Figure 2 As shown, the temperature sensor 15 can monitor the water temperature pumped out from the water circulation power pump 1. When the temperature sensor 15 detects that the water temperature in the water outlet pipe 10 fluctuates relative to the set value, the monitoring signal can also be transmitted to the electrical unit 6 to adjust the heating power of the electric heating wire 14, thereby further forming a closed-loop effect for regulating the water temperature in the water tank 3.

[0036] According to a further optimized solution, a first branch pipe 23 is connected between the water inlet pipe 11 and the water outlet pipe 10 , a flow control valve 24 is connected to the first branch pipe 23 , and the flow control valve 24 is electrically connected to the electrical unit 6 .

[0037] like Figure 2 As shown, the water outlet pipe 10 is also connected to a pressure sensor, which monitors the water pressure in the water outlet pipe 10. When the water pressure exceeds a threshold, the electrical unit 6 controls the flow control valve 24 to divert part of the water into the water inlet pipe 11, thereby regulating the water pressure.

[0038] As a further optimization scheme, a second branch pipe 25 is connected between the water inlet pipe 11 and the water outlet pipe 10 , an ion filter 26 and a one-way valve 27 are connected to the second branch pipe 25 , and a conductivity sensor 28 is connected to the side of the water outlet pipe 10 close to the semiconductor device.

[0039] like Figure 2As shown, in order to remove ions, microorganisms and other impurities in the circulating water and reduce the impact of cooling water quality on the operation of semiconductor equipment, before cooling, the connection between the outlet pipe 10 and the inlet pipe 11 and the semiconductor equipment is closed, and the water circulation power pump 1 is started to make the water in the water tank 3 flow between the outlet pipe 10, the second branch pipe 25, the ion filter 26 and the inlet pipe 11 to filter and remove impurities from the circulating water.

[0040] Further optimization scheme, such as Figure 2 As shown, the end of the water outlet pipe 10 away from the water circulation power pump 1 is connected to a flow sensor, a solenoid valve and a one-way valve in sequence along the water flow direction, and the end of the water inlet pipe 11 close to the semiconductor device is connected to a filter and a solenoid valve in sequence along the water flow direction.

[0041] To further optimize the solution, the water tank 3 is also connected with a water supply pipe 16 and a drainage pipe 17, and the water supply pipe 16 and the drainage pipe 17 are respectively connected with a solenoid valve 18 and a manual valve 19.

[0042] According to a further optimization scheme, the water tank 3 is always provided with a liquid level switch 21 , and the liquid level switch 21 is electrically connected to the solenoid valve 18 .

[0043] like Figure 2 As shown, when the liquid level switch 21 detects that the amount of water in the water tank 3 is too small, the monitoring signal can be transmitted to the electrical unit 6, and the electrical unit 6 controls the solenoid valve 18 to open, and water is replenished through the water replenishment pipe 16. The water replenishment pipe 16 is connected with a filter and a solenoid valve in sequence along the water flow direction.

[0044] When the water in the water tank 3 needs to be drained, the on-site personnel can manually open the manual valve 19 to drain the water in the water tank 3 through the drain pipe 17 .

[0045] According to a further optimized solution, the refrigeration unit 4 includes a condenser 12 and an evaporator 13 , and a coiled tube 22 is connected to the water inlet pipe 11 , and the coiled tube 22 is arranged corresponding to the evaporator 13 .

[0046] like Figure 2 As shown, the evaporator 13 cools the coiled tube 22 by absorbing heat from the internal refrigerant, thereby reducing the water temperature in the coiled tube 22, and thus low-temperature water enters the water tank 3. Afterwards, the electric heating wire 14 is used to heat and balance the cooling capacity, thereby reducing the curve amplitude of the temperature accuracy in the water tank 3, achieving a high-precision constant temperature state to meet the cooling requirements of semiconductor equipment.

[0047] like Figure 2 As shown, a compressor and an electronic expansion valve are provided between the condenser 12 and the evaporator 13, which can reduce the water temperature in the coiled tube 22 through the physical change of the refrigerant.

[0048] The condenser 12 is one of the important equipment in the refrigeration system. It transfers the heat of the superheated vapor of the refrigerant to the surrounding air or water through the heat release surface of the condenser, and is cooled into saturated vapor, and further cooled into high-pressure liquid, which is circulated in the system. Since the working process of the condenser 12 is a heat release process, the temperature of the condenser is relatively high. Figure 2 The left side of the middle condenser 12 uses water as the cooling medium, and the condensation heat is taken away by the temperature rise of the water, thereby ensuring the heat exchange effect of the system.

[0049] The working process of this embodiment is as follows: the water circulation power pump 1 transports the high-precision constant temperature water in the water tank 3 into the semiconductor device through the water outlet pipe 10, flows through the corresponding temperature control object, absorbs the heat it emits, and then the water flows back to the coiled tube 22 through the water inlet pipe 11, undergoes heat exchange and cooling through the evaporator 13, and then enters the water tank 3, and then balances the cold capacity through the electric heating wire 14, reducing the amplitude of the temperature accuracy curve in the water tank 3. Afterwards, the water in the water tank 3 continuously supplies constant temperature cooling water to the corresponding temperature control object in the semiconductor device through the water circulation power pump 1, thereby realizing the temperature control of the heat source device and the internal environment in the semiconductor device.

[0050] In the description of the present invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0051] The embodiments described above are only descriptions of the preferred methods of the present invention, and are not intended to limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary technicians in this field should fall within the protection scope determined by the claims of the present invention.

Claims

1. A universal integrated temperature control device, It is characterized in that include: A whole machine frame (7), wherein a middle partition plate (8) is arranged inside the whole machine frame (7); A water circulation unit, the water circulation unit comprising a water tank (3) arranged at the bottom of the inner side of the whole machine frame (7), a water circulation power pump (1) and a heating unit (2) being arranged in the water tank (3), a water outlet end of the water circulation power pump (1) being connected to a water outlet pipe (10), and a water inlet end of the water circulation power pump (1) being connected to a water inlet pipe (11); A refrigeration unit (4), the refrigeration unit (4) being located at the inner bottom of the whole machine frame (7), and the water inlet pipe (11) being arranged corresponding to the refrigeration unit (4); An electrical unit (6), wherein the electrical unit (6) is arranged on the top of the middle partition (8), and the electrical unit (6) is electrically connected to the water circulation power pump (1), the heating unit (2) and the refrigeration unit (4).

2. A universal integrated temperature control device according to claim 1, Features: The heating unit (2) comprises an electric heating wire (14) and a temperature control switch (20); the electric heating wire (14) and the temperature control switch (20) are respectively arranged in the water tank (3); and the temperature control switch (20) is electrically connected to the electric heating wire (14).

3. A universal integrated temperature control device according to claim 1, Features: The water outlet pipe (10) is connected to a temperature sensor (15).

4. A universal integrated temperature control device according to claim 1, Features: The water tank (3) is also connected to a water supply pipe (16) and a drainage pipe (17), and the water supply pipe (16) and the drainage pipe (17) are respectively connected to a solenoid valve (18) and a manual valve (19).

5. A universal integrated temperature control device according to claim 4, Features: The water tank (3) is always provided with a liquid level switch (21), and the liquid level switch (21) is electrically connected to the solenoid valve (18).

6. A universal integrated temperature control device according to claim 1, Features: The refrigeration unit (4) comprises a condenser (12) and an evaporator (13); the water inlet pipe (11) is connected to a coiled pipe (22); the coiled pipe (22) is arranged corresponding to the evaporator (13).

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