Multi-directional heat dissipation server and enterprise value comprehensive evaluation and analysis service platform

Abstract

The utility model discloses a multidirectional heat dissipation server and an enterprise value comprehensive evaluation and analysis service platform, which relate to the technical field of server heat dissipation and comprise a server case and an auxiliary heat dissipation assembly. According to the multidirectional heat dissipation server and the enterprise value comprehensive evaluation and analysis service platform, when the multidirectional heat dissipation server is used, the docking station is additionally arranged on one side of the panel of the server case, and the data storage amount of the server can be effectively expanded by carrying the multiple storage hard disks; the docking station is used for storing mass data to be processed in the data processing process of executing value evaluation analysis and the like, side fins are arranged on the two sides of the docking station and used for conducting heat generated when a plurality of storage hard disks operate in the docking station to the side fins, and through the arrangement of a first fan, the heat dissipation requirements of components such as a power source and a mainboard in a machine room are met, and meanwhile the heat dissipation efficiency is improved. And through the structural design that the wind power output direction of the first fan corresponds to the side fins on the two sides of the docking station, air loss near the side fins is improved, and rapid heat dissipation is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of server heat dissipation, in particular to a multi-directional heat dissipation server and an enterprise value comprehensive evaluation and analysis service platform. Background Art

[0002] The high risk of power investment determines the importance of investment environment analysis in the development system. Its capital and technology intensive industry characteristics, the particularity of power products and system constraints determine its higher requirements for the investment environment. In view of this, it is a general trend to systematize data processing such as value assessment of power company mergers and acquisitions.

[0003] However, in the information age of massive data, the enterprise value assessment in the traditional power field is usually completed by using a C / S (client and server structure) data processing system in the process of performing value assessment analysis and other data processing. Faced with massive data, the current servers are insufficient in storage capacity. However, storage devices equipped with multiple disk slots will bring a greater burden to the server's heat dissipation. The single heat dissipation structure of existing servers can no longer meet the heat dissipation needs of multi-disk slot large-capacity servers.

[0004] Therefore, in view of this, the existing structural deficiencies are studied and improved, and a server with multi-directional heat dissipation and a comprehensive enterprise value evaluation and analysis service platform are proposed. Utility Model Content

[0005] The purpose of the utility model is to provide a server with multi-directional heat dissipation and a comprehensive enterprise value evaluation and analysis service platform to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a multi-directional heat dissipation server and enterprise value comprehensive evaluation and analysis service platform, including a server chassis and an auxiliary heat dissipation component, the server chassis has a top plate fixed with screws on the top, the auxiliary heat dissipation component is embedded in the front end of the top plate, the auxiliary heat dissipation component includes a semiconductor cooling sheet, a silicone grease sheet, a top fin and a second fan, the bottom cooling surface of the semiconductor cooling sheet is bonded with a silicone grease sheet, and the top heating surface of the semiconductor cooling sheet is bonded with the top fin, and the second fan is fixed with screws on the top of the top fin.

[0007] Furthermore, a panel is integrally fixed on the front of the server chassis, and a power button is provided on one side of the panel.

[0008] Furthermore, an expansion dock is embedded in the other side of the panel, and the top plane of the expansion dock is attached to the cooling surface of the semiconductor cooling plate through a silicone grease sheet, and air outlet holes are opened on both sides of the expansion dock.

[0009] Furthermore, the expansion dock has several storage hard disks plugged in, and side fins are provided on both sides of the expansion dock.

[0010] Furthermore, a machine compartment is provided inside the server chassis, and a mainboard is arranged on a side wall of the machine compartment, and a built-in SFF-8643 connector of the mainboard is connected to a storage hard disk through several hot-swappable SATA interfaces of an expansion dock.

[0011] Furthermore, a power supply is provided at the bottom of the cabin, and a fan 1 is fixed with screws above the power supply, and the wind output direction of the fan 1 corresponds to the side fins on both sides of the expansion dock.

[0012] Furthermore, a back panel is integrally fixed to the back of the server chassis, and an air inlet grille corresponding to fan 1 is arranged on one side of the back panel, and an interface board including a data interface and a network interface is arranged on the other side of the back panel.

[0013] A comprehensive enterprise value assessment and analysis service platform is provided, wherein the comprehensive enterprise value assessment and analysis service platform is equipped with a server with multi-directional heat dissipation.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] 1. When the utility model is in use, an expansion dock is installed on one side of the panel of the server chassis. By carrying multiple storage hard disks, the data storage capacity of the server of the application can be effectively expanded to store massive data to be processed in the process of executing value assessment analysis and other data processing. Side fins are arranged on both sides of the expansion dock to transfer the heat of the multiple storage hard disks in the expansion dock during operation to the side fins. Through the setting of fan 1, while meeting the heat dissipation requirements of components such as the power supply and motherboard in the computer compartment, the structural design of the wind output direction of fan 1 corresponding to the side fins on both sides of the expansion dock can improve the air loss near the side fins and achieve rapid heat dissipation.

[0016] 2. When the utility model is in use, an auxiliary heat dissipation component is installed at the front end of the top plate of the server chassis. When direct current passes through the thermocouple formed by two different semiconductor materials in series, heat can be absorbed and released at both ends of the thermocouple respectively, thereby achieving the purpose of cooling. The top plane of the expansion dock is fitted with the cooling surface of the semiconductor cooling plate through a silicone grease sheet to achieve the cooling of the metal expansion dock, and the heating surface of the semiconductor cooling plate is fitted with the top fin. Auxiliary heat dissipation is performed through fan 2. By improving the heat dissipation efficiency of the heating surface of the semiconductor cooling plate, the cooling efficiency of its cooling surface is improved, so that the expansion dock can obtain continuous low-temperature cooling. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the overall front view structure of the utility model;

[0018] Figure 2 This is a schematic diagram of the overall rear view structure of the utility model;

[0019] Figure 3 It is a schematic diagram of the explosion structure of the auxiliary heat dissipation component of the utility model.

[0020] In the figure: 1. Server chassis; 2. Panel; 3. Power button; 4. Docking station; 5. Air vent; 6. Storage hard disk; 7. Side fins; 8. Computer compartment; 9. Motherboard; 10. Power supply; 11. Fan 1; 12. Back panel; 13. Air inlet grille; 14. Interface board; 15. Top panel; 16. Auxiliary heat dissipation component; 1601. Semiconductor cooling sheet; 1602. Silicone grease sheet; 1603. Top fins; 1604. Fan 2. DETAILED DESCRIPTION

[0021] The following is a further detailed description of the implementation of the present utility model in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present utility model, but cannot be used to limit the scope of the present utility model.

[0022] like Figures 1 to 3 As shown, a multi-directional heat dissipation server and enterprise value comprehensive evaluation and analysis service platform includes a server chassis 1 and an auxiliary heat dissipation component 16. The top of the server chassis 1 is fixed with a top plate 15 by screws. The auxiliary heat dissipation component 16 is embedded in the front end of the top plate 15. The auxiliary heat dissipation component 16 includes a semiconductor cooling sheet 1601, a silicone grease sheet 1602, a top fin 1603 and a second fan 1604. The bottom cooling surface of the semiconductor cooling sheet 1601 is attached with the silicone grease sheet 1602, and the top heating surface of the semiconductor cooling sheet 1601 is attached with the top fin 1603, and the top of the top fin 1603 is fixed with a second fan 1604 by screws. The front end of the top plate 15 is equipped with an auxiliary heat dissipation component 16. When direct current passes through a couple formed by two different semiconductor materials in series, heat can be absorbed and released at both ends of the couple, respectively, to achieve the purpose of cooling. The top plane of the expansion dock 4 is attached to the cooling surface of the semiconductor cooling sheet 1601 through the silicone grease sheet 1602 to achieve the cooling of the metal expansion dock 4, and the heating surface of the semiconductor cooling sheet 1601 is attached to the top fin 1603. Auxiliary heat dissipation is performed through the second fan 1604. By improving the heat dissipation efficiency of the heating surface of the semiconductor cooling sheet 1601, the cooling efficiency of its cooling surface is improved, so that the expansion dock 4 can obtain continuous low-temperature cooling;

[0023] like Figure 1 to Figure 2As shown, a panel 2 is integrally fixed to the front of the server chassis 1, and a power button 3 is provided on one side of the panel 2, an expansion dock 4 is embedded on the other side of the panel 2, and the top plane of the expansion dock 4 is fitted with the cooling surface of the semiconductor cooling plate 1601 through a silicone grease sheet 1602, and air outlet holes 5 are provided on both sides of the expansion dock 4, several storage hard disks 6 are plugged into the expansion dock 4, and side fins 7 are provided on both sides of the expansion dock 4. An expansion dock 4 is installed on one side of the panel 2 of the server chassis 1, and the data storage capacity of the server of the present application can be effectively expanded by carrying multiple storage hard disks 6, which are used to store massive data to be processed in the process of executing value assessment analysis and other data processing. Side fins 7 are provided on both sides of the expansion dock 4 to conduct the heat of the multiple storage hard disks 6 in the expansion dock 4 when they are in operation to the side fins 7. Through the setting of a fan 11, while meeting the power supply 10 in the machine compartment 8, While meeting the heat dissipation requirements of components such as the motherboard 9, the structural design of the wind output direction of the fan 11 corresponding to the side fins 7 on both sides of the expansion dock 4 is used to increase the air loss near the side fins 7 and achieve rapid heat dissipation. A machine compartment 8 is provided inside the server chassis 1, and a motherboard 9 is provided on the side wall of the machine compartment 8, and the built-in SFF-8643 connector of the motherboard 9 is connected to the storage hard disk 6 through several hot-swappable SATA interfaces of the expansion dock 4. A power supply 10 is provided at the bottom of the machine compartment 8, and a fan 11 is fixed with screws above the power supply 10, and the wind output direction of the fan 11 corresponds to the side fins 7 on both sides of the expansion dock 4. A back panel 12 is integrally fixed to the back of the server chassis 1, and an air inlet grille 13 corresponding to the fan 11 is provided on one side of the back panel 12, and an interface board 14 including a data interface and a network interface is provided on the other side of the back panel 12;

[0024] A comprehensive enterprise value assessment and analysis service platform applies a server with multi-directional heat dissipation.

[0025] Working principle: When using this kind of multi-directional heat dissipation server and enterprise value comprehensive evaluation and analysis service platform, when in use, an expansion dock 4 is installed on one side of the panel 2 of the server chassis 1. By carrying multiple storage hard disks 6, the data storage capacity of the server of this application can be effectively expanded, which is used to store massive data to be processed in the process of executing value evaluation analysis and other data processing. Side fins 7 are set on both sides of the expansion dock 4 to transfer the heat of the multiple storage hard disks 6 in the expansion dock 4 during operation to the side fins 7. Through the setting of the fan 11, while meeting the heat dissipation requirements of components such as the power supply 10 and the motherboard 9 in the machine room 8, the side fins are improved through the structural design that the wind output direction of the fan 11 corresponds to the side fins 7 on both sides of the expansion dock 4. 7, to achieve rapid heat dissipation, by installing an auxiliary heat dissipation component 16 at the front end of the top plate 15 of the server chassis 1, when direct current passes through the thermocouple composed of two different semiconductor materials in series, heat can be absorbed and released at both ends of the thermocouple respectively, so as to achieve the purpose of cooling, and the top plane of the expansion dock 4 is fitted with the cooling surface of the semiconductor cooling plate 1601 through the silicone grease sheet 1602 to achieve the cooling of the metal expansion dock 4, and the heating surface of the semiconductor cooling plate 1601 is fitted with the top fin 1603, and auxiliary heat dissipation is performed by the fan 2 1604, and the cooling efficiency of the cooling surface of the semiconductor cooling plate 1601 is improved by improving the heat dissipation efficiency of the heating surface, so that the expansion dock 4 can obtain continuous low-temperature cooling.

[0026] The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

Claims

1. A multi-directional heat dissipation server, comprising a server chassis (1) and an auxiliary heat dissipation component (16), characterized in that: The server chassis (1) is fixed with a top plate (15) by screws on the top, and the auxiliary heat dissipation component (16) is embedded in the front end of the top plate (15). The auxiliary heat dissipation component (16) includes a semiconductor cooling plate (1601), a silicone grease sheet (1602), a top fin (1603) and a second fan (1604). The bottom cooling surface of the semiconductor cooling plate (1601) is bonded with the silicone grease sheet (1602), and the top heating surface of the semiconductor cooling plate (1601) is bonded with the top fin (1603), and the second fan (1604) is fixed with screws on the top of the top fin (1603).

2. A multi-directional heat dissipation server according to claim 1, characterized in that: A panel (2) is integrally fixed to the front of the server chassis (1), and a power button (3) is provided on one side of the panel (2).

3. A multi-directional heat dissipation server according to claim 2, characterized in that: An expansion dock (4) is embedded in the other side of the panel (2), and the top plane of the expansion dock (4) is in contact with the cooling surface of the semiconductor cooling sheet (1601) via a silicone grease sheet (1602), and air outlet holes (5) are provided on both sides of the expansion dock (4).

4. A multi-directional heat dissipation server according to claim 3, characterized in that: Several storage hard disks (6) are plugged into the expansion dock (4), and side fins (7) are provided on both sides of the expansion dock (4).

5. The multi-directional heat dissipation server according to claim 1, characterized in that: The server chassis (1) has a machine compartment (8) disposed inside, and a mainboard (9) is disposed on the side wall of the machine compartment (8), and a built-in SFF-8643 connector of the mainboard (9) is connected to a storage hard disk (6) via a plurality of hot-swappable SATA interfaces of an expansion dock (4).

6. The multi-directional heat dissipation server according to claim 5, characterized in that: A power supply (10) is provided at the bottom of the machine compartment (8), and a fan (11) is screwed above the power supply (10), and the wind output direction of the fan (11) corresponds to the side fins (7) on both sides of the expansion dock (4).

7. The multi-directional heat dissipation server according to claim 1, characterized in that: The back of the server chassis (1) is integrally fixed with a back panel (12), one side of the back panel (12) is provided with an air inlet grille (13) corresponding to the fan 1 (11), and the other side of the back panel (12) is provided with an interface board (14) including a data interface and a network interface.

8. An enterprise value comprehensive evaluation and analysis service platform, characterized in that: The enterprise value comprehensive evaluation and analysis service platform applies a multi-directional heat dissipation server as described in any one of claims 1 to 7.

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