High-frequency relay with grounding shield at bottom

Abstract

The high-frequency relay comprises a metal shielding cover and a relay body, one surface opposite to a PCD plate is defined as a bottom surface, an opening of the metal shielding cover is arranged at the bottom, and the relay body is arranged in a cavity in the metal shielding cover from the position of the opening. A metal shielding bottom plate used for grounding is arranged at the opening position of the metal shielding cover, at least part of the metal shielding bottom plate is opposite to the bottom face of the relay body, and the leading-out terminals of the relay body are configured to be electrically insulated from the metal shielding cover and the metal shielding bottom plate, so that the bottom of the relay is provided with grounding shielding. The shielding effect of the high-frequency relay body is prevented from being damaged by tightly arranged signal transmission lines on the PCB, and the high-frequency characteristic of the relay is ensured.

Description

Technical Field

[0001] The utility model relates to the field of relays, in particular to a high-frequency relay with a grounding shield at the bottom. Background Art

[0002] A high-frequency relay is generally composed of a relay body and a shielding component. The relay body includes a housing and a magnetic circuit component and a contact component located in the inner cavity of the housing. The relay body is provided with multiple lead terminals. The shielding component is usually a metal shielding cover formed by bending or a non-metallic shielding cover with a metal shielding film. The entire relay body is placed in the inner cavity of the shielding cover, and only the lead terminals extend out of the shielding cover.

[0003] Traditional high-frequency relays do not have a grounded shielding layer at the bottom (such as Figure 1 ), the ground shielding layer of the PCB board is needed to achieve the best performance of the high-frequency relay. Figure 2 A part of the ground shielding layer of the high frequency relay 300 is formed on the PCB (Printed Circuit Board) 100 , that is, a large ground shielding layer is arranged on the PCB 100 .

[0004] However, with the development of miniaturization of the whole machine, more and more PCB boards need to closely arrange the signal transmission line 200 passing through the bottom of the high-frequency relay, destroying the characteristic impedance matching formed between the ground shielding layer on the PCB board and the signal transmission line inside the relay, that is, the incomplete ground shielding layer on the PCB board of the high-frequency relay base causes the high-frequency characteristics of the high-frequency relay to deteriorate and cannot meet application requirements. Utility Model Content

[0005] In view of the deficiencies in the prior art, the utility model provides a high-frequency relay with a grounding shield at the bottom, which solves the problems of the existing high-frequency relays having imperfect grounding shielding function, poor high-frequency characteristics, and being unable to meet application requirements.

[0006] In order to achieve the above object, the utility model is realized by the following technical solutions:

[0007] A high-frequency relay with a grounding shield at the bottom comprises a metal shielding cover and a relay body, wherein the side opposite to a PCB board is defined as the bottom surface, an opening of the metal shielding cover is arranged at the bottom, the relay body is placed in a cavity inside the metal shielding cover from the opening position, a metal shielding bottom plate for grounding is arranged at the opening position of the metal shielding cover, the metal shielding bottom plate is at least partially opposite to the bottom surface of the relay body, and a lead-out terminal of the relay body is configured to be electrically insulated from the metal shielding cover and the metal shielding bottom plate.

[0008] Furthermore, the relay body includes a shell and a magnetic circuit component and a contact component located in the inner cavity of the shell, the contact component of the relay body is located at the top of the relay body, and the metal shielding cover includes a top plate and side plates surrounding the relay body, and the side plates are extended and bent from the top plate.

[0009] Furthermore, the metal shielding bottom plate is fixed to and electrically connected to the metal shielding cover.

[0010] Furthermore, the side panels of the metal shielding cover include two opposite short side panels and two opposite long side panels, and both ends of the metal shielding bottom panel are respectively connected to the two short side panels, or both ends of the metal shielding bottom panel are respectively connected to the two long side panels.

[0011] Furthermore, the lead terminals of the relay body are distributed in two rows along the length direction of the relay body, the two ends of the metal shielding base plate are respectively connected to the two short side plates, there is a gap between the metal shielding base plate and the two long side plates, and the lead terminals of the relay body extend out of the metal shielding cover from the gap between the metal shielding base plate and the long side plates.

[0012] Furthermore, the metal shielding bottom plate and the metal shielding cover are formed by bending and molding a sheet metal part in one piece, and the width of the metal shielding bottom plate is smaller than the spacing between two rows of lead terminals.

[0013] Furthermore, the two ends of the metal shielding bottom plate are respectively connected to the two short side plates, a gap is provided between the metal shielding bottom plate and the two long side plates, and the lead-out terminal of the relay body extends out of the metal shielding cover from the gap between the metal shielding bottom plate and the long side plates.

[0014] Furthermore, the metal shielding bottom plate includes a bottom grounding plate and a fixed plate, which are integrally formed and perpendicular to each other to form an L shape, one end of the bottom grounding plate in the length direction is integrally formed with one of the short side plates, and the fixed plate is fixedly connected to the outer side of the other short side plate.

[0015] Furthermore, the bottom grounding plate is connected to one of the short side plates through two bending parts set at intervals, and the space between the two bending parts is hollow; the bottom grounding plate is connected to the fixed plate through two bending parts set at intervals, and the space between the two bending parts is hollow.

[0016] Furthermore, the bottom grounding plate is parallel to the bottom surface of the relay body.

[0017] Furthermore, the top plate of the metal shielding cover is a square structure, the long side plates and the short side plates are perpendicular to the top plate, the two long side plates and the two short side plates are extended and bent from the four edges of the top plate, and the bottom edges of the two long side plates are extended and bent to form a number of grounding terminals.

[0018] The utility model has the following beneficial effects:

[0019] 1. The relay body is placed in the inner cavity of the metal shielding cover. A metal shielding bottom plate for grounding is provided at the bottom of the metal shielding cover, so that the bottom of the high-frequency relay has its own grounding shielding, which prevents the closely arranged signal transmission lines on the PCB board from destroying the shielding effect of the high-frequency relay body and ensures the high-frequency characteristics of the relay.

[0020] 2. The metal shielding cover includes a top plate, a metal shielding bottom plate and side plates surrounding the relay body. This enclosed grounding shielding structure enables the high-frequency relay to have a complete and independent grounding shielding function, with stable high-frequency performance, which is not affected by the grounding layer of the PCB board, reducing the client's whole machine debugging work, and can effectively avoid the problem of degradation of the relay's high-frequency performance due to PCB board mismatch.

[0021] 3. The opening of the metal shielding cover is set at the bottom. Therefore, when the relay body is installed into the metal shielding cover from the bottom opening, no matter whether the straight lead-out terminals or the bent lead-out terminals are set on the relay body, they will not interfere with the metal shielding cover, and the relay body can be smoothly installed in the metal shielding cover.

[0022] 4. The contact part of the relay body is arranged at the top thereof. Compared with the arrangement of the opening of the metal shielding cover at the top, the opening of the metal shielding cover is arranged at the bottom, so that there is no gap at the top of the metal shielding cover, and the shielding effect is better.

[0023] 5. The metal shielding cover is an integrated stamping structure with simple processing technology. It can be formed by stamping and bending. It has high dimensional accuracy. After being assembled with the internal relay body, it has high position accuracy and high product performance consistency.

[0024] 6. The hexahedral enclosed shielding cover structure design can avoid the problem of the internal relay body falling off from the metal shielding cover under extreme conditions after completion, and can improve the relay's ability to prevent external electromagnetic interference or signal interference.

[0025] 7. The hollow structure design at the bending position of the metal shielding bottom plate of the metal shielding cover improves the stability of the bending size.

[0026] 8. The metal shielding bottom plate is connected to the two opposite side plates of the metal shielding cover to enhance the structural strength of the metal shielding cover. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a structural schematic diagram of a high-frequency relay without a grounding shielding layer at the bottom of the background technology;

[0028] Figure 2It is a schematic diagram of assembling a PCB board with a ground shielding layer and a high-frequency relay without a ground shielding layer at the bottom of the background technology;

[0029] Figure 3 This is a schematic diagram of the structure of a high-frequency relay with a grounding shield at the bottom of an embodiment of the utility model;

[0030] Figure 4 yes Figure 3 Another angle diagram of a high frequency relay with a ground shield at the bottom;

[0031] Figure 5 yes Figure 3 Schematic diagram of the processing of a high-frequency relay with a ground shield at the bottom;

[0032] Figure 6 It is an exploded view of a high-frequency relay with a grounding shield at the bottom according to an embodiment of the utility model.

[0033] Explanation of reference numerals: 1. Metal shielding cover; 2. Relay body; 3. Top plate; 4. Metal shielding bottom plate; 5. Long side plate; 6. Short side plate; 7. Lead terminal; 8. Grounding terminal; 9. Bending part; 201. Shell; 202. Contact part; 41. Bottom grounding plate; 42. Fixing plate. DETAILED DESCRIPTION

[0034] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0035] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0036] like Figures 3 to 6As shown, a high-frequency relay with a grounding shield at the bottom includes a metal shielding cover 1 and a relay body 2, and the side through which the lead-out terminal 7 passes is defined as the bottom surface of the relay body 2 (that is, the side through which the lead-out terminal 7 extends from the relay body), the opening of the metal shielding cover 1 is set at the bottom, and the relay body 2 is placed in the cavity inside the metal shielding cover 1 from the opening position, and a metal shielding bottom plate 4 for grounding is provided at the opening position of the metal shielding cover 1, and the metal shielding bottom plate 4 is at least partially opposite to the bottom surface of the relay body 2, and the lead-out terminal 7 of the relay body 2 is configured to be electrically insulated from the metal shielding cover 1 and the metal shielding bottom plate 4. A metal shielding bottom plate 4 for grounding is provided at the bottom of the metal shielding cover 1 (the metal shielding bottom plate 4 covers the bottom surface of the relay body 2 as much as possible, and keeps a certain distance from the lead-out terminal 7 of the relay body 2), so that the bottom of the high-frequency relay has a grounding shield, and the PCB board below the bottom of the high-frequency relay can be arranged with a high-frequency signal line. The high-frequency relay has a complete and independent grounding shielding function, and the high-frequency performance is stable. There is no need to provide a grounding shielding layer through the client PCB board, which reduces the client's whole machine debugging work.

[0037] The metal shielding bottom plate 4 is fixed and electrically connected to the metal shielding cover 1. In this embodiment, the opening of the metal shielding cover 1 is set at the bottom. Compared with setting the opening of the metal shielding cover 1 at the top, when the relay body 2 is installed into the metal shielding cover 1 from the bottom opening, the lead terminal 7 of the relay body 2 will not interfere with the metal shielding cover 1. Therefore, no matter whether the lead terminal 7 of the relay body 2 is arranged in a straight line or a bent shape, the relay body 2 can be smoothly installed into the metal shielding cover 1. If the opening is arranged at the top or side of the metal shielding cover 1, and the lead terminal 7 of the relay body 2 is bent, it is difficult to install in the metal shielding cover 1 (or an avoidance hole or groove needs to be arranged).

[0038] The relay body 2 includes a housing 201 and a magnetic circuit component and a contact component 202 located in the inner cavity of the housing 201. The contact component 202 of the relay body 2 is located at the top of the relay body 2. The metal shielding cover 1 includes a top plate 3 and side plates enclosed around the relay body 2 (the shape of the metal shielding cover 1 includes but is not limited to a cube, a cuboid, a cylinder, etc.), and the side plates are integrally extended and bent from the top plate 3 (that is, there is no gap at the top of the metal shielding cover). The contact component 202 of the relay body 2 is arranged at the top thereof, and there is no gap at the top of the metal shielding cover 1. The opening of the metal shielding cover 1 is arranged at the bottom away from the contact component 202. Compared with the opening being arranged at the top of the metal shielding cover 1, the metal shielding cover 1 provided in this embodiment has better shielding performance. The metal shielding cover 1 is at a large distance from the internal signal transmission path of the relay (there is a plastic shell between the shielding cover and the internal signal transmission path), and the dielectric withstand voltage level is high.

[0039] The side panels of the metal shielding cover 1 include two opposite long side panels 5 and two opposite short side panels 6, and the two ends of the metal shielding bottom plate 4 are respectively connected to the two short side panels 6, or the two ends of the metal shielding bottom plate 4 are respectively connected to the two long side panels 5. The metal shielding bottom plate 4 is connected to the two opposite side panels to enhance the structural strength of the metal shielding cover 1.

[0040] The lead-out terminals 7 of the relay body 2 are distributed in two rows along the length direction of the relay body 2. There is a gap between the metal shielding bottom plate 4 and the two long side plates 5. The lead-out terminals 7 of the relay body 2 extend out of the metal shielding cover 1 from the gap between the metal shielding bottom plate 4 and the long side plates 5. There is a gap between the metal shielding bottom plate 4 and the two long side plates 5 to avoid the lead-out terminals 7 of the relay body 2. Regardless of whether the lead-out terminals 7 are bent or straight, after the relay body 2 is installed in the metal shielding cover 1 and the metal shielding bottom plate 4 is bent to the opening position, the lead-out terminals 7 of the relay body 2 can avoid the metal shielding bottom plate 4, without affecting the bending of the metal shielding bottom plate 4, and convenient processing.

[0041] The metal shielding bottom plate 4 and the metal shielding cover 1 are formed by bending a sheet metal part, and the lead terminals 7 of the relay body 2 are distributed in two rows along the length direction of the relay body 2, and the width of the metal shielding bottom plate 4 is less than the spacing between the two rows of lead terminals 7. The metal shielding bottom plate 4 is bent to cover the bottom surface of the relay body 2 as much as possible. During processing, the relay body 2 is installed in the inner cavity of the metal shielding cover 1 and then the metal shielding bottom plate 4 is bent to the opening position of the metal shielding cover 1. The width of the metal shielding bottom plate 4 of the metal shielding cover 1 is less than the width of the bottom surface of the housing 201 of the relay body 2, so that the metal shielding bottom plate 4 can avoid the lead terminals 7 of the relay body 2 when bending, and avoid the lead terminals 7 from interfering with the bending process of the metal shielding bottom plate 4.

[0042] One end of the metal shielding bottom plate 4 in the length direction is integrally formed with one of the short side plates 6, and the other end is fixedly connected to the other short side plate 6, so that the metal shielding bottom plate 4 is connected to the two short side plates 6. Of course, in other implementations, the metal shielding bottom plate 4 can also be integrally formed with one of the long side plates 5 and fixedly connected to the other long side plate 5 (for example, welded). In this case, a plurality of slots need to be provided on the metal shielding bottom plate 4 to avoid the lead-out terminals 7 of the relay body 2, which is inconvenient during assembly.

[0043] The metal shielding cover 1 of this embodiment is a cubic structure. The metal shielding cover 1 and the metal shielding bottom plate 4 are formed by bending as a whole from sheet metal. The processing technology is simple and only requires stamping and bending to form. The dimensional accuracy is high. There is almost no gap between the long side plate 5 and the short side plate 6, which improves the ability to resist electromagnetic interference and signal interference. After assembly with the relay body 2, the positioning accuracy is high.

[0044] The metal shielding bottom plate 4 includes a bottom grounding plate 41 and a fixing plate 42. The bottom grounding plate 41 and the fixing plate 42 are integrally formed and perpendicular to each other to form an L shape. One end of the bottom grounding plate 41 in the length direction is integrally formed with one of the short side plates 6, and the fixing plate 42 is connected to the outside of the other short side plate 6. One end of the metal shielding bottom plate 4 is integrally formed with one of the short side plates 6, and the other end is connected to the other short side plate 6 through the fixing plate 42, which enhances the connection strength between the metal shielding bottom plate 4 and the two short side plates 6. The metal shielding bottom plate 4 of this L-shaped structure forms a pulling force on the two short side plates 6, effectively reducing the rebound and warping of each side plate of the metal shielding cover 1. The metal shielding bottom plate 4 and the metal shielding cover 1 may not be integrally formed. The metal shielding bottom plate 4 may also adopt other shapes, for example, a U-shape. The two ends of the metal shielding bottom plate 4 are respectively welded to the two short side plates 6, which can also avoid the rebound and warping of the side plates of the metal shielding cover 1 and avoid the formation of gaps between adjacent side plates. Preferably, the bottom grounding plate 41 is parallel to the bottom surface of the relay body 2, and the shielding effect is better.

[0045] The bottom grounding sheet 41 is connected to the short side plate 6 through two spaced-apart bending portions 9, and the space between the two bending portions 9 is hollowed out to improve the stability of the bending size. Similarly, the bottom grounding sheet 41 is connected to the fixing plate 42 through two spaced-apart bending portions 9, and the space between the two bending portions 9 is hollowed out.

[0046] The top plate 3 is a quadrilateral structure, the two long side plates 5 are respectively connected to the two long sides of the top plate 3, the two short side plates 6 are respectively connected to the two short sides of the top plate 3, the long side plates 5 and the short side plates 6 are both perpendicular to the top plate 3, the two long side plates 5 and the two short side plates 6 are extended and bent from the four edges of the top plate 3, and the bottom edges of the two long side plates 5 are extended and bent to form a plurality of grounding terminals 8. The metal shielding cover 1 forms a hexahedral enclosure structure, forming an enclosure shielding structure outside the relay body 2, thereby improving the relay's ability to prevent external electromagnetic interference or signal interference.

[0047] One of the processing processes of this high frequency relay is shown in Figure 5 : Bend the two long side plates 5 and the two short side plates 6 of the metal shielding cover 1 to be perpendicular to the top plate 3 to form a cubic cavity, place the relay body 2 in the cavity of the metal shielding cover 1, and then bend the fixing plate 42 to be perpendicular to the bottom grounding plate 41 to make the metal shielding bottom plate 4 L-shaped, then bend the bottom grounding plate 41 to be perpendicular to the top plate 3, and finally bend the bottom grounding plate 41 to be parallel to the bottom surface of the relay body and try to cover the middle area of ​​the bottom surface of the relay body.

[0048] As described above, the embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in the field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents. These modifications or replacements do not make the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the utility model. Therefore, all other embodiments obtained by ordinary technicians in the field without making creative work belong to the protection scope of the utility model.

Claims

1. A high frequency relay with a ground shield at the bottom. Features: It includes a metal shielding cover and a relay body, wherein the side opposite to the PCB board is defined as the bottom surface, the opening of the metal shielding cover is arranged at the bottom, the relay body is placed in the cavity inside the metal shielding cover from the opening position, a metal shielding bottom plate for grounding is arranged at the opening position of the metal shielding cover, the metal shielding bottom plate is at least partially opposite to the bottom surface of the relay body, and the lead-out terminal of the relay body is configured to be electrically insulated from the metal shielding cover and the metal shielding bottom plate.

2. The high frequency relay with bottom grounding shield according to claim 1, Features: The relay body includes a shell and a magnetic circuit component and a contact component located in the inner cavity of the shell. The contact component of the relay body is located on the top of the relay body. The metal shielding cover includes a top plate and side plates surrounding the relay body. The side plates are integrally extended and bent from the top plate.

3. The high frequency relay with bottom grounding shield according to claim 1 or 2, Features: The metal shielding bottom plate is fixed to and electrically connected to the metal shielding cover.

4. The high frequency relay with bottom grounding shield according to claim 3, Features: The side plates of the metal shielding cover include two opposite short side plates and two opposite long side plates, and the two ends of the metal shielding bottom plate are respectively connected to the two short side plates, or the two ends of the metal shielding bottom plate are respectively connected to the two long side plates.

5. The high frequency relay with bottom grounding shield according to claim 4, Features: The lead terminals of the relay body are distributed in two rows along the length direction of the relay body, the two ends of the metal shielding bottom plate are respectively connected to the two short side plates, there is a gap between the metal shielding bottom plate and the two long side plates, and the lead terminals of the relay body extend out of the metal shielding cover from the gap between the metal shielding bottom plate and the long side plates.

6. The high frequency relay with bottom grounding shield according to claim 5, Features: The metal shielding bottom plate and the metal shielding cover are formed by bending and molding a sheet metal part in one piece, and the width of the metal shielding bottom plate is smaller than the spacing between the two rows of lead terminals of the relay body.

7. The high frequency relay with bottom grounding shield according to claim 5, Features: The metal shielding bottom plate includes a bottom grounding plate and a fixing plate, which are integrally formed and perpendicular to each other to form an L shape. One end of the bottom grounding plate in the length direction is integrally formed with one of the short side plates, and the fixing plate is fixedly connected to the outer side of the other short side plate.

8. The high frequency relay with bottom grounding shield according to claim 7, Features: The bottom grounding plate is connected to one of the short side plates through two bending parts set at intervals, and the space between the two bending parts is hollowed out; the bottom grounding plate is connected to the fixed plate through two bending parts set at intervals, and the space between the two bending parts is hollowed out.

9. The high frequency relay with bottom grounding shield according to claim 7, Features: The bottom grounding plate is parallel to the bottom surface of the relay body.

10. The high frequency relay with bottom grounding shield according to claim 4, Features: The top plate of the metal shielding cover is a square structure, the long side plates and the short side plates are perpendicular to the top plate, the two long side plates and the two short side plates are extended and bent from the four edges of the top plate, and the bottom edges of the two long side plates are extended and bent to form a plurality of grounding terminals.

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