Semiconductor sintering mold

Abstract

The utility model discloses a semiconductor sintering die which comprises a lower die and an upper die, the upper die is installed on the lower die, a locking bolt is installed in a hole formed in an operation board in a penetrating mode, a driving gear is fixed on a horizontal shaft, the driving gear is connected with a driven gear in a meshed mode, and the driven gear is connected with the lower die. The driven gear is fixedly installed at the top end of a vertical sleeve, the inner wall of the vertical sleeve is connected with the top of a vertical threaded rod, a vertical square rod is fixed to the bottom end of the vertical threaded rod and installed in a limiting square hole, the limiting square hole is formed in the center of the top face of a containing groove, and the containing groove is formed in the bottom face of the upper mold. And an extrusion plate is fixed at the bottom end of the vertical square rod. According to the semiconductor sintering mold, the novel structural design is adopted, the multiple sets of positioning mechanisms can be driven to vertically move through single rotation operation, multiple chips can be rapidly extruded and positioned, the positioning mechanisms can be stably locked, and the stability of the chips in the sintering process is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor sintering, in particular to a semiconductor sintering mold. Background Art

[0002] Semiconductor sintering molds are usually made of materials such as graphite and ceramics, and have the characteristics of high heat resistance, high strength, and high precision. During the sintering process, the semiconductor material is placed in the sintering mold and sintered at high temperature. The shape and size of the sintering mold have a direct impact on the performance and quality of semiconductor devices.

[0003] Existing semiconductor sintering molds, such as the authorized Chinese utility model patent with publication number CN219106073U, entitled "a semiconductor sintering mold", can stably position the chip, but the positioning structure design is unreasonable, and the positioning of each chip needs to be operated independently, and the same batch of chips cannot be batch operated, resulting in low production efficiency. In view of the above problems, it is urgent to innovate the design based on the original semiconductor sintering mold. Utility Model Content

[0004] The utility model aims to provide a semiconductor sintering mold to solve the problems raised in the above background technology that the positioning structure design of the existing semiconductor sintering mold is unreasonable, the positioning of each chip needs to be operated independently, the same batch of chips cannot be batch operated, and the production efficiency is low.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor sintering mold, comprising a lower mold and an upper mold, the upper mold is installed on the lower mold, the top surface of the lower mold is provided with a bottom sintering groove, a horizontal shaft is rotatably installed on the top of the upper mold, an operating disk is fixed at the end of the horizontal shaft, a locking bolt is installed through the hole provided on the operating disk, a driving gear is fixed on the horizontal shaft, the driving gear is meshed and connected with a driven gear, the driven gear is fixedly installed on the top of a vertical sleeve, the inner wall of the vertical sleeve is connected to the top of a vertical threaded rod, a vertical square rod is fixed at the bottom end of the vertical threaded rod, the vertical square rod is installed in a limiting square hole, the limiting square hole is provided at the center of the top surface of the receiving groove, the receiving groove is provided on the bottom surface of the upper mold, and an extrusion plate is fixed at the bottom end of the vertical square rod.

[0006] Preferably, a positioning rod is provided on the top surface of the lower mold, and the positioning rod passes through a hole opened on the upper mold, and a locking nut is threadedly installed on the top end of the positioning rod.

[0007] Preferably, the top edge of the bottom sintering tank is aligned and fitted with the bottom edge of the receiving tank, the receiving tanks are densely distributed at equal intervals, and the inner wall of the receiving tank is tightly fitted with the side surface of the extrusion plate.

[0008] Preferably, the end of the locking bolt is threadedly connected to the locking hole, the locking hole is opened on the side wall of the upper mold, and the locking holes are distributed at equal angles about the center of the horizontal axis.

[0009] Preferably, the driving gears are distributed at equal intervals, the driving gear and the driven gear are both bevel gears, and the diameter of the driving gear is smaller than the diameter of the driven gear.

[0010] Preferably, the vertical sleeve is threadedly connected to the vertical threaded rod, the center of the vertical threaded rod and the center of the vertical square rod are on the same vertical line, and the vertical square rod is slidably connected to the limiting square hole.

[0011] Compared with the prior art, the utility model has the following beneficial effects: the semiconductor sintering mold adopts a new structural design, which can not only drive multiple groups of positioning mechanisms to move vertically through a single rotation operation to quickly extrude and position multiple chips, but also can stably lock the positioning mechanisms to ensure the stability of the chips during the sintering process;

[0012] 1. By rotating the operating disk, the driving gears evenly spaced on the horizontal axis are driven to rotate, and the driving gears drive the driven gears and the vertical sleeve to rotate stably. The vertical sleeve uses the threaded connection relationship to drive the vertical threaded rod to move vertically along the limiting square hole with the vertical square rod, so as to stably drive the extrusion plate;

[0013] 2. Enter the bottom sintering tank through the extrusion plate, extrude and position the chip stably, and connect it with the locking hole through the locking bolt to lock the operating panel, horizontal axis, driving gear, driven gear, vertical sleeve, vertical threaded rod, vertical square rod and extrusion plate to ensure that the extrusion plate locks the chip during the sintering process. At the same time, the locking bolt can be easily disassembled to facilitate the rapid batch removal of the sintered chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the front view structure of the utility model;

[0015] Figure 2 This is a schematic diagram of the front cross-sectional structure of the utility model;

[0016] Figure 3 This is a side view structural diagram of the locking hole of the utility model;

[0017] Figure 4 It is a schematic diagram of the vertical square rod and the limiting square hole structure when viewed from above of the utility model.

[0018] In the figure: 1. lower mold; 2. positioning rod; 3. upper mold; 4. locking nut; 5. bottom sintering tank; 6. horizontal axis; 7. operating panel; 8. locking bolt; 9. locking hole; 10. driving gear; 11. driven gear; 12. vertical sleeve; 13. vertical threaded rod; 14. vertical square rod; 15. limiting square hole; 16. storage slot; 17. extrusion plate. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] See also Figure 1-4 The utility model provides a technical solution: a semiconductor sintering mold, including a lower mold 1, a positioning rod 2, an upper mold 3, a locking nut 4, a bottom sintering groove 5, a horizontal axis 6, an operating panel 7, a locking bolt 8, a locking hole 9, a driving gear 10, a driven gear 11, a vertical sleeve 12, a vertical threaded rod 13, a vertical square rod 14, a limiting square hole 15, a receiving groove 16 and an extrusion plate 17. The upper mold 3 is arranged on the lower mold 1, and a positioning rod 2 is fixed on the top surface of the lower mold 1. The positioning rod 2 passes through the hole opened on the upper mold 3, and the locking nut 4 is threadedly installed on the top of the positioning rod 2. The above structural design can quickly connect and lock the lower mold 1 and the upper mold 3, and the bottom sintering groove 5 is opened on the top surface of the lower mold 1;

[0021] When using this device, first place the semiconductor chip to be sintered Figure 2 In the bottom sintering tank 5, align the holes in the corners of the upper mold 3 with the positioning rod 2 vertically and install it to Figure 2 The state shown is shown, and the locking nut 4 is installed on the top of the positioning rod 2 and tightened;

[0022] A horizontal shaft 6 is rotatably mounted on the top of the upper mold 3, and an operating disk 7 is fixedly mounted on the end of the horizontal shaft 6. A locking bolt 8 is installed through the hole opened on the operating disk 7, and the end of the locking bolt 8 is threadedly connected with a locking hole 9. The locking hole 9 is opened on the side wall of the upper mold 3, and the locking holes 9 are distributed at equal angles with respect to the center of the horizontal shaft 6. The above structural design enables the locking bolt 8 to be conveniently connected with the locking hole 9 to lock the horizontal shaft 6 and the operating disk 7;

[0023] The rotating locking bolt 8 is completely disengaged from the locking hole 9, and the operating disk 7 is rotated. The operating disk 7 drives the horizontal shaft 6 and the driving gear 10 to rotate stably. The driving gear 10 drives the driven gear 11 and the vertical sleeve 12 to rotate stably and slowly. The vertical sleeve 12 rotates to push the vertical threaded rod 13 downward. The vertical threaded rod 13 slides vertically down along the limiting square hole 15 with the vertical square rod 14 and the extrusion plate 17 until the bottom surface of the extrusion plate 17 is stably fitted with the semiconductor chip in the bottom sintering groove 5, and the semiconductor chip is stably extruded and fixed. The rotating locking bolt 8 is connected with the corresponding locking hole 9 to lock the horizontal shaft 6 and the operating disk 7, so that the driving gear 10 uses the meshing connection relationship to lock the driven gear 11 and the vertical sleeve 12. The vertical sleeve 12 uses the thread self-locking to lock the vertical threaded rod 13, the vertical square rod 14 and the extrusion plate 17, and the existing heating device can be started to sinter the semiconductor chips in the lower mold 1 and the upper mold 3;

[0024] A driving gear 10 is installed on the horizontal shaft 6, and the driving gear 10 is meshed with the driven gear 11. The driving gears 10 are distributed at equal intervals. The driving gears 10 and the driven gears 11 are both bevel gears. The diameter of the driving gear 10 is smaller than the diameter of the driven gear 11. The above structural design enables the driving gear 10 to increase the torque when driving the driven gear 11 to rotate, so that the vertical sleeve 12 can stably rotate and drive the vertical threaded rod 13. The driven gear 11 is fixedly installed on the top of the vertical sleeve 12, and the inner wall of the vertical sleeve 12 is connected to the top of the vertical threaded rod 13. A vertical square rod 14 is fixed to the bottom end of the straight threaded rod 13, and the vertical square rod 14 is installed in the limiting square hole 15. The limiting square hole 15 is opened at the center of the top surface of the storage groove 16. The vertical sleeve 12 is threadedly connected to the vertical threaded rod 13. The center of the vertical threaded rod 13 and the center of the vertical square rod 14 are on the same vertical line. The vertical square rod 14 and the limiting square hole 15 are slidably connected. The above structural design enables the vertical sleeve 12 to utilize the threaded connection relationship when rotating to stably drive the vertical threaded rod 13 to carry the vertical square rod 14 to slide vertically along the limiting square hole 15;

[0025] The receiving groove 16 is provided on the bottom surface of the upper mold 3, the top edge of the bottom sintering groove 5 is aligned with the bottom edge of the receiving groove 16, the receiving grooves 16 are densely distributed at equal intervals, and the inner wall of the receiving groove 16 is closely fitted with the side of the extrusion plate 17. The above structural design ensures that the extrusion plate 17 can move smoothly along the inner wall of the bottom sintering groove 5 and the inner wall of the receiving groove 16, and the extrusion plate 17 is fixed to the bottom end of the vertical square rod 14;

[0026] After sintering is completed, wait for the lower mold 1 and the upper mold 3 to cool completely, directly unscrew all the locking nuts 4, move the upper mold 3 upward and separate it from the lower mold 1, expose the semiconductor chip in the bottom sintering groove 5, take out the semiconductor chip, and then rotate the locking bolt 8 to completely disengage it from the locking hole 9, rotate the operating disk 7 in the opposite direction, so that the vertical sleeve 12 rotates the vertical threaded rod 13 and drives the vertical square rod 14 and the extrusion plate 17 to move upward and reset, and then the next sintering operation can be carried out.

[0027] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor sintering mold, comprising a lower mold (1) and an upper mold (3), characterized in that: An upper mold (3) is mounted on the lower mold (1), a bottom sintering groove (5) is provided on the top surface of the lower mold (1), a horizontal shaft (6) is rotatably mounted on the top of the upper mold (3), an operating disk (7) is fixed at the end of the horizontal shaft (6), a locking bolt (8) is installed through a hole provided on the operating disk (7), a driving gear (10) is fixed on the horizontal shaft (6), the driving gear (10) is meshedly connected with a driven gear (11), and the driven gear (11) is engaged with the driven gear (11). 11) is fixedly installed on the top of a vertical sleeve (12), the inner wall of the vertical sleeve (12) is connected to the top of a vertical threaded rod (13), a vertical square rod (14) is fixed to the bottom of the vertical threaded rod (13), the vertical square rod (14) is installed in a limiting square hole (15), the limiting square hole (15) is arranged at the center of the top surface of a receiving groove (16), the receiving groove (16) is arranged on the bottom surface of the upper mold (3), and an extrusion plate (17) is fixed to the bottom of the vertical square rod (14).

2. A semiconductor sintering mold according to claim 1, characterized in that: The top surface of the lower mold (1) is provided with a positioning rod (2), the positioning rod (2) passes through a hole opened on the upper mold (3), and a locking nut (4) is threadedly installed on the top end of the positioning rod (2).

3. A semiconductor sintering mold according to claim 1, characterized in that: The top edge of the bottom sintering groove (5) is aligned and fitted with the bottom edge of the receiving groove (16), the receiving grooves (16) are densely distributed at equal intervals, and the inner wall of the receiving groove (16) is tightly fitted with the side of the extrusion plate (17).

4. A semiconductor sintering mold according to claim 1, characterized in that: The end of the locking bolt (8) is threadedly connected to the locking hole (9), and the locking hole (9) is opened on the side wall of the upper mold (3). The locking holes (9) are distributed at equal angles with respect to the center of the horizontal axis (6).

5. A semiconductor sintering mold according to claim 1, characterized in that: The driving gears (10) are distributed at equal intervals, the driving gear (10) and the driven gear (11) are both bevel gears, and the diameter of the driving gear (10) is smaller than the diameter of the driven gear (11).

6. A semiconductor sintering mold according to claim 1, characterized in that: The vertical sleeve (12) is threadedly connected to the vertical threaded rod (13); the center of the vertical threaded rod (13) and the center of the vertical square rod (14) are on the same vertical line; and the vertical square rod (14) is slidably connected to the limiting square hole (15).

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