Fixing tool for packaging semiconductor

Abstract

The utility model discloses a fixing tool for packaging a semiconductor, which comprises a placing plate and a fixed cabinet, one side of the placing plate is provided with a moving cabinet through a first moving mechanism, one side of the moving cabinet and one side of the fixed cabinet are respectively provided with an L-shaped plate through a second moving mechanism, the number of the L-shaped plates is two, and the L-shaped plates are symmetrically arranged. Pressing mechanisms are arranged at the tops of the movable cabinet and the fixed cabinet, limiting mechanisms are arranged on one sides of the inner walls of the movable cabinet and the fixed cabinet, and a mounting mechanism is arranged on one side of the placing plate. A first threaded rod is rotated to drive a movable cabinet to move, semiconductors with different lengths can be fixed through the movable cabinet and a fixed cabinet, a bidirectional threaded rod on one side of the movable cabinet is rotated to drive two groups of L-shaped plates to move in opposite directions, and the semiconductors are further fixed through the L-shaped plates. And the second threaded rod is rotated to drive the pressing plate to descend, so that the pressing plate compresses semiconductors with different thicknesses.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor fixing tooling, in particular to a fixing tooling for packaging semiconductors. Background Art

[0002] Semiconductor refers to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. Common semiconductor materials include silicon, germanium, gallium arsenide, etc. Silicon is the most influential of all semiconductor materials. Fixed tooling is required when packaging its semiconductors.

[0003] When using fixed tooling to package semiconductors, existing fixed tooling can only package semiconductors of fixed sizes. Some adjustable fixed tooling can only package semiconductors of different lengths, but cannot package semiconductors of different lengths, widths and thicknesses. It has poor flexibility and is not conducive to packaging semiconductors of different sizes. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides a fixing tool for packaging semiconductors, which solves the problems in the above-mentioned background technology.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A fixed tool for packaging semiconductors, comprising a placement plate and a fixed cabinet, wherein a movable cabinet is installed on one side of the placement plate via a first movable mechanism, and L-shaped plates are installed on one side of the movable cabinet and the fixed cabinet via a second movable mechanism, wherein the number of the L-shaped plates is two groups and they are symmetrically arranged, a clamping mechanism is arranged on the top of the movable cabinet and the fixed cabinet, a limiting mechanism is arranged on one side of the inner wall of the movable cabinet and the fixed cabinet, and a mounting mechanism is arranged on one side of the placement plate.

[0007] Preferably, the first moving mechanism comprises a first threaded rod rotatably mounted on one side of the placement plate, a first moving block is threadedly sleeved on the surface of the first threaded rod, and the top of the first moving block and the bottom of the moving cabinet are fixedly mounted.

[0008] Preferably, the second moving mechanism includes a bidirectional threaded rod rotatably mounted on one side of the mobile cabinet and the fixed cabinet, and a second moving block is provided on the surface thread sleeve of the bidirectional threaded rod. The bottom of the second moving block and the top of the L-shaped plate are fixedly mounted, and the number of the second moving blocks is two groups and they are symmetrically arranged.

[0009] Preferably, the clamping mechanism comprises a second threaded rod threadedly mounted on the top of the mobile cabinet and the fixed cabinet, and a pressing plate is rotatably mounted on one end of the second threaded rod.

[0010] Preferably, the limiting mechanism comprises a limiting groove opened on one side of the inner wall of the movable cabinet and the fixed cabinet, a limiting block is slidably installed on the inner wall of the limiting groove, and one side of the limiting block and one side of the pressure plate are fixedly installed.

[0011] Preferably, the mounting mechanism comprises a mounting plate fixedly mounted on one side of the placement plate, and a mounting hole is formed through the top of the mounting plate.

[0012] Preferably, a first slide groove is provided on the top of the placement plate, and the inner wall of the first slide groove is in contact with the surface of the first movable block. A second slide groove is provided on the inner walls of the movable cabinet and the fixed cabinet, and the inner wall of the second slide groove is in contact with the surface of the second movable block.

[0013] Compared with the prior art, the beneficial effects of the utility model are as follows: the fixing tool for packaging semiconductors drives two groups of L-shaped plates to move toward each other by rotating the bidirectional threaded rod on one side of the fixed cabinet, so that the L-shaped plates clamp the semiconductors, so that semiconductors of different widths can be fixed, and the movable cabinet is driven to move by rotating the first threaded rod, so that semiconductors of different lengths can be fixed by the movable cabinet and the fixed cabinet, and the two groups of L-shaped plates are driven to move toward each other by rotating the bidirectional threaded rod on one side of the movable cabinet, so that the semiconductors are further fixed by the L-shaped plates, and the pressure plate is driven to descend by rotating the second threaded rod, so that the pressure plate presses the semiconductors of different thicknesses, thereby achieving the purpose of facilitating the fixation of semiconductors of different lengths, widths and thicknesses, and the structure is simple and easy to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a structural schematic diagram of the positive equalization diagram of the utility model;

[0015] Figure 2 It is a schematic diagram of the structure of the side sectional view of the utility model;

[0016] Figure 3 It is a structural schematic diagram of a partial cross-sectional top view of the utility model;

[0017] Figure 4 It is a structural schematic diagram of the enlarged view of point A of the utility model.

[0018] In the figure: 1. placement plate; 2. first threaded rod; 3. first moving block; 4. moving cabinet; 5. bidirectional threaded rod; 6. second moving block; 7. L-shaped plate; 8. second threaded rod; 9. pressure plate; 10. limit groove; 11. limit block; 12. first slide groove; 13. second slide groove; 14. mounting plate; 15. mounting hole; 16. fixed cabinet. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] Example: Refer to Figure 1-4 The utility model provides a technical solution, a fixed tooling for packaging semiconductors, including a placement plate 1 and a fixed cabinet 16, a mobile cabinet 4 is installed on one side of the placement plate 1 through a first moving mechanism, the first moving mechanism includes a first threaded rod 2 rotatably installed on one side of the placement plate 1, a first moving block 3 is threadedly sleeved on the surface of the first threaded rod 2, the top of the first moving block 3 and the bottom of the mobile cabinet 4 are fixedly installed, so as to drive the mobile cabinet 4 to move.

[0021] Specifically, one side of the movable cabinet 4 and the fixed cabinet 16 are both installed with an L-shaped plate 7 through a second movable mechanism, and the second movable mechanism includes a bidirectional threaded rod 5 rotatably installed on one side of the movable cabinet 4 and the fixed cabinet 16, and a second movable block 6 is provided on the surface of the bidirectional threaded rod 5. The bottom of the second movable block 6 and the top of the L-shaped plate 7 are fixedly installed, and the number of the second movable block 6 is two groups and they are symmetrically arranged. The number of the L-shaped plates 7 is two groups and they are symmetrically arranged, which is convenient for driving the L-shaped plates 7 to move toward or oppositely. A first slide groove 12 is provided on the top of the placement plate 1, and the inner wall of the first slide groove 12 is in contact with the surface of the first movable block 3 to limit the first movable block 3, so that the movement of the first movable block 3 is more stable. The inner walls of the movable cabinet 4 and the fixed cabinet 16 are both provided with a second slide groove 13, and the inner wall of the second slide groove 13 is in contact with the surface of the second movable block 6 to limit the second movable block 6, so that the movement of the second movable block 6 is more stable.

[0022] Specifically, a clamping mechanism is provided on the top of the mobile cabinet 4 and the fixed cabinet 16, and the clamping mechanism includes a second threaded rod 8 threadedly installed on the top of the mobile cabinet 4 and the fixed cabinet 16. A pressure plate 9 is rotatably installed on one end of the second threaded rod 8, which can drive the pressure plate 9 to descend for clamping.

[0023] Specifically, a limiting mechanism is provided on one side of the inner wall of the movable cabinet 4 and the fixed cabinet 16, and the limiting mechanism includes a limiting groove 10 opened on one side of the inner wall of the movable cabinet 4 and the fixed cabinet 16, and a limiting block 11 is slidably installed on the inner wall of the limiting groove 10. One side of the limiting block 11 and one side of the pressing plate 9 are fixedly installed to limit the pressing plate 9, so that the movement of the pressing plate 9 is more stable. A mounting mechanism is provided on one side of the placement plate 1, and the mounting mechanism includes a mounting plate 14 fixedly installed on one side of the placement plate 1, and a mounting hole 15 is opened on the top of the mounting plate 14. By rotating the bidirectional threaded rod 5 on one side of the fixed cabinet 16, the two groups of L-shaped plates 7 are driven to move toward each other, so that The L-shaped plate 7 clamps the semiconductor so that semiconductors of different widths can be fixed. The movable cabinet 4 is driven to move by rotating the first threaded rod 2, so that semiconductors of different lengths can be fixed by the movable cabinet 4 and the fixed cabinet 16. The two-way threaded rod 5 on one side of the movable cabinet 4 is driven to move the two groups of L-shaped plates 7 toward each other, so that the semiconductors can be further fixed by the L-shaped plate 7. The pressing plate 9 is driven to descend by rotating the second threaded rod 8, so that the pressing plate 9 can press and set the semiconductors of different thicknesses, thereby achieving the purpose of facilitating the fixation of semiconductors of different lengths, widths and thicknesses. The structure is simple and easy to use.

[0024] When in use: When using the fixing tool for packaging semiconductors, the placement plate 1 can be installed to the specified position through the mounting plate 14 and the mounting hole 15, and the semiconductor is placed on the top of the placement plate 1, and the semiconductor is against the inner wall of the fixing cabinet 16, and the bidirectional threaded rod 5 on one side of the fixing cabinet 16 is rotated, and the bidirectional threaded rod 5 drives the two groups of second moving blocks 6 to move toward each other, and the second moving blocks 6 drive the two groups of L-shaped plates 7 to move toward each other, so that the L-shaped plates 7 clamp the semiconductor, so that semiconductors of different widths can be fixed, and the first threaded rod 2 is rotated, and the first threaded rod 2 drives the first moving block 6 to move toward each other. The movable block 3 moves, and the first movable block 3 drives the movable cabinet 4 to move, so that the semiconductors of different lengths can be fixed by the movable cabinet 4 and the fixed cabinet 16. By rotating the bidirectional threaded rod 5 on one side of the movable cabinet 4, the bidirectional threaded rod 5 drives the two groups of L-shaped plates 7 to move toward each other, so that the semiconductors can be further fixed by the L-shaped plates 7. By rotating the second threaded rod 8, the second threaded rod 8 drives the pressing plate 9 to descend, so that the pressing plate 9 can press and set the semiconductors of different thicknesses, thereby achieving the purpose of facilitating the fixation of semiconductors of different lengths, widths and thicknesses. The structure is simple and easy to use.

[0025] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0026] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A fixing tool for packaging semiconductors, comprising a placement plate (1) and a fixing cabinet (16), characterized in that: A movable cabinet (4) is installed on one side of the placement plate (1) via a first movable mechanism, and L-shaped plates (7) are installed on one side of the movable cabinet (4) and the fixed cabinet (16) via a second movable mechanism. The number of the L-shaped plates (7) is two groups and they are symmetrically arranged. A clamping mechanism is arranged on the top of the movable cabinet (4) and the fixed cabinet (16), and a limiting mechanism is arranged on one side of the inner wall of the movable cabinet (4) and the fixed cabinet (16). A mounting mechanism is arranged on one side of the placement plate (1).

2. A fixing tool for packaging semiconductors according to claim 1, characterized in that: The first moving mechanism comprises a first threaded rod (2) rotatably mounted on one side of the placement plate (1); a first moving block (3) is threadedly sleeved on the surface of the first threaded rod (2); and the top of the first moving block (3) and the bottom of the moving cabinet (4) are fixedly mounted.

3. A semiconductor packaging fixture according to claim 2, characterized in that: The second moving mechanism comprises a bidirectional threaded rod (5) rotatably mounted on one side of the moving cabinet (4) and the fixed cabinet (16); a second moving block (6) is threadedly sleeved on the surface of the bidirectional threaded rod (5); the bottom of the second moving block (6) and the top of the L-shaped plate (7) are fixedly mounted; the number of the second moving blocks (6) is two groups and they are symmetrically arranged.

4. A fixing tool for packaging semiconductors according to claim 1, characterized in that: The clamping mechanism comprises a second threaded rod (8) threadedly mounted on the top of the mobile cabinet (4) and the fixed cabinet (16), and a pressing plate (9) is rotatably mounted on one end of the second threaded rod (8).

5. A fixing tool for packaging semiconductors according to claim 4, characterized in that: The limiting mechanism comprises a limiting groove (10) provided on one side of the inner wall of the movable cabinet (4) and the fixed cabinet (16); a limiting block (11) is slidably mounted on the inner wall of the limiting groove (10); one side of the limiting block (11) and one side of the pressure plate (9) are fixedly mounted.

6. The fixing device for packaging semiconductors according to claim 1, characterized in that: The mounting mechanism comprises a mounting plate (14) fixedly mounted on one side of the placement plate (1), and a mounting hole (15) is formed through the top of the mounting plate (14).

7. The fixing tool for packaging semiconductors according to claim 3, characterized in that: A first slide groove (12) is provided on the top of the placement plate (1), and the inner wall of the first slide groove (12) is in contact with the surface of the first movable block (3); a second slide groove (13) is provided on the inner walls of the movable cabinet (4) and the fixed cabinet (16), and the inner wall of the second slide groove (13) is in contact with the surface of the second movable block (6).

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